CN118355266A - 基片检查方法、基片检查程序和基片检查装置 - Google Patents

基片检查方法、基片检查程序和基片检查装置 Download PDF

Info

Publication number
CN118355266A
CN118355266A CN202280080156.8A CN202280080156A CN118355266A CN 118355266 A CN118355266 A CN 118355266A CN 202280080156 A CN202280080156 A CN 202280080156A CN 118355266 A CN118355266 A CN 118355266A
Authority
CN
China
Prior art keywords
inspection
image
substrate
feature image
input image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280080156.8A
Other languages
English (en)
Chinese (zh)
Inventor
德丸达弥
西山直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN118355266A publication Critical patent/CN118355266A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/129—Using chemometrical methods
    • G01N2201/1296—Using chemometrical methods using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20072—Graph-based image processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
CN202280080156.8A 2021-12-10 2022-11-28 基片检查方法、基片检查程序和基片检查装置 Pending CN118355266A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-200806 2021-12-10
JP2021200806 2021-12-10
PCT/JP2022/043802 WO2023106157A1 (ja) 2021-12-10 2022-11-28 基板検査方法、基板検査プログラム、及び基板検査装置

Publications (1)

Publication Number Publication Date
CN118355266A true CN118355266A (zh) 2024-07-16

Family

ID=86730246

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280080156.8A Pending CN118355266A (zh) 2021-12-10 2022-11-28 基片检查方法、基片检查程序和基片检查装置

Country Status (6)

Country Link
US (1) US20250037267A1 (https=)
JP (2) JP7678896B2 (https=)
KR (1) KR20240117592A (https=)
CN (1) CN118355266A (https=)
TW (1) TW202338746A (https=)
WO (1) WO2023106157A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021024624A1 (ja) 2019-08-08 2021-02-11 三菱瓦斯化学株式会社 難燃性ポリイミド成形材料及び成形体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019131742A1 (ja) * 2017-12-27 2020-12-10 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ 検査処理装置、検査処理方法、およびプログラム
JP7087397B2 (ja) * 2018-01-17 2022-06-21 東京エレクトロン株式会社 基板の欠陥検査装置、基板の欠陥検査方法及び記憶媒体
TWI845690B (zh) * 2019-06-06 2024-06-21 日商東京威力科創股份有限公司 基板檢查裝置、基板檢查系統、基板檢查方法及電腦程式產品
JP7289427B2 (ja) * 2020-02-28 2023-06-12 株式会社Pros Cons プログラム、情報処理方法及び情報処理装置

Also Published As

Publication number Publication date
JP7678896B2 (ja) 2025-05-16
JP2025105959A (ja) 2025-07-10
WO2023106157A1 (ja) 2023-06-15
TW202338746A (zh) 2023-10-01
KR20240117592A (ko) 2024-08-01
US20250037267A1 (en) 2025-01-30
JPWO2023106157A1 (https=) 2023-06-15

Similar Documents

Publication Publication Date Title
KR101829979B1 (ko) 검사 장치 및 기판 처리 장치
CN111583170B (zh) 图像生成装置和图像生成方法
CN113994255B (zh) 基片检查装置、基片检查系统和基片检查方法
TWI826632B (zh) 用於半導體缺陷檢測及檢視之方法、系統及非暫時性電腦可讀儲存媒體
CN118401898A (zh) 基于机器学习模型的检查样品的缺陷检测的方法和系统
JP7089906B2 (ja) 基板検査装置、基板処理装置および基板検査方法
JP2004354250A (ja) 欠陥検査装置
JP2004354251A (ja) 欠陥検査装置
JP7157580B2 (ja) 基板検査方法及び基板検査装置
JP2025105959A (ja) 基板検査方法、基板検査プログラム、及び基板検査装置
CN117015850B (zh) 以经呈现设计图像进行的设计注意区域的分段
JP2001209798A (ja) 外観検査方法及び検査装置
CN116934752A (zh) 一种基于人工智能的玻璃检测方法及系统
CN117581093B (zh) 激光退火图案抑制
CN118864346A (zh) 粗糙表面图像处理方法及包含其的自动光学检测系统
CN117611568A (zh) 一种蚀刻线路视觉检测方法、装置及存储介质
WO2024101186A1 (ja) 基板検査方法、基板検査装置、及び基板検査プログラム
JP7854299B2 (ja) 基板分析システム、基板分析方法及び記憶媒体
TWI918585B (zh) 檢查裝置、檢查方法以及電腦可讀取的程式
TWI902049B (zh) 檢查裝置、檢查方法以及電腦可讀取的程式
CN120088179A (zh) 缺陷检测方法及系统、存储介质
Kinney Simplify Deep Learning Systems with Optimized Machine Vision Lighting
JPH0915161A (ja) 欠陥検査方法および装置
TW202335082A (zh) 基板分析系統、基板分析方法及記憶媒體
TW202605346A (zh) 檢查裝置、檢查方法以及電腦可讀取的程式

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination