CN118213363A

CN118213363A - Light emitting device, lamp panel and display device

Info

Publication number: CN118213363A
Application number: CN202410638378.8A
Authority: CN
Inventors: 李坤; 陈文婧; 刘芳; 孙雷蒙
Original assignee: Huayinxin Zhangjiagang Semiconductor Co ltd; Huayinxin Wuhan Technology Co ltd
Current assignee: Huayinxin Zhangjiagang Semiconductor Co ltd; Huayinxin Wuhan Technology Co ltd
Priority date: 2024-05-22
Filing date: 2024-05-22
Publication date: 2024-06-18

Abstract

The disclosure relates to the field of display technologies, and in particular, to a light emitting device, a lamp panel and a display device. The light emitting device includes: the packaging carrier plate comprises a packaging carrier plate body, a first bonding pad and a second bonding pad, wherein the first bonding pad is arranged on the first surface of the packaging carrier plate body, the second bonding pad is arranged on the second surface of the packaging carrier plate body, and the first surface and the second surface are respectively positioned on two opposite sides of the packaging carrier plate body; the driving chip is positioned on the packaging loading plate and is electrically connected with the second bonding pad; and the light source chip is positioned on the driving chip, is stacked with the driving chip, is electrically connected with the driving chip and is used for driving the light source chip to emit light. The first light emitting structure surrounds the light source chip; the second light-emitting structure surrounds the driving chip, is connected with the first light-emitting structure and covers the packaging carrier plate, and the first light-emitting structure and the second light-emitting structure are used for emitting light emitted by the light source chip.

Description

Light emitting device, lamp panel and display device

Technical Field

The disclosure relates to the field of display technologies, and in particular, to a light emitting device, a lamp panel and a display device.

Background

With the increasing maturity of flat panel display technology, the display device industry is moving towards high resolution, curved surface, ultra-thin, high dynamic range imaging, high contrast and wide color gamut. Taking the liquid crystal display technology in flat panel display as an example, the direct type backlight module is widely applied to large-sized liquid crystal display devices, wherein the lamp panel is a core component of the direct type backlight module. At present, a light panel of a Mini LED is matched with a Local Dimming technology, so that each area can be independently switched or adjusted in brightness, the brightness state of each light emitting area of a backlight module can be controlled more finely, the brightness level of a picture is more clear, the visual experience advantage of a user is improved, and the LED backlight module is widely applied to the technical field of display.

In the related art, a lamp panel using a Mini LED includes a driving chip and a plurality of light source chips which are horizontally arranged, and the driving chip and the light source chips need to be respectively attached to a driving substrate (such as a printed circuit board), which results in the problems of low production efficiency, high production cost and low space utilization rate. And the drive chip controls a plurality of light source chips which are numerous and distributed in an array through a plurality of drive wires on the drive substrate, the wiring distances of a plurality of drive wires between a plurality of light source chips and the drive chip are different based on different position distribution of the plurality of light source chips on the drive substrate, and especially in a large-size display panel, the control signal intensity and response time of the plurality of light source chips received by the drive chip are inconsistent easily due to the fact that the wiring distances between the plurality of light source chips and the drive chip are large, resistance-capacitance delay is generated, the overall light emitting quality of the lamp panel is reduced, and further the problem that the display device applying the lamp panel is uneven in brightness when displaying pictures is caused, and user experience is affected. On the other hand, as the regional dimming partition number of the Mini LED increases, the plane wiring difficulty of a plurality of driving wires for connecting the driving chip and a plurality of light source chips is also greatly improved, and the problem of yield reduction is caused.

Therefore, how to effectively improve the problems of low production efficiency, high production cost, low space utilization, low yield, reduced overall light emitting quality of the lamp panel, and uneven display (mura) of the display device in the related art is needed to be solved by those skilled in the art.

Disclosure of Invention

Based on this, it is necessary to provide a light emitting device, a lamp panel and a display device for solving the problems of low production efficiency, high production cost, low space utilization, low yield, reduced overall light emitting quality of the lamp panel, and mura display of the display device in the related art.

In order to achieve the above object, in one aspect, there is provided a light emitting device comprising:

The packaging carrier plate comprises a packaging carrier plate body, a first bonding pad and a second bonding pad, wherein the first bonding pad is arranged on the first surface of the packaging carrier plate body, the second bonding pad is arranged on the second surface of the packaging carrier plate body, and the first surface and the second surface are respectively positioned on two opposite sides of the packaging carrier plate body;

The driving chip is positioned on the packaging carrier plate and is electrically connected with the second bonding pad;

the light source chip is positioned on the driving chip and is stacked with the driving chip, the light source chip is electrically connected with the driving chip, and the driving chip is used for driving the light source chip to emit light;

The first light emitting structure surrounds the light source chip;

The second light-emitting structure surrounds the driving chip, the second light-emitting structure is connected with the first light-emitting structure and covers the packaging carrier plate, and the first light-emitting structure and the second light-emitting structure are used for emitting light emitted by the light source chip.

In one embodiment, the distance between the second bonding pad and the edge of the package carrier body is smaller than the distance between the first bonding pad and the edge of the package carrier body, wherein the driving chip is positively connected to the package carrier, and the light source chip is positively connected to the driving chip.

In one embodiment, the distance between the second bonding pad and the edge of the package carrier body is smaller than the distance between the first bonding pad and the edge of the package carrier body, wherein the driving chip is connected to the package carrier in a positive mounting manner, and the light source chip is connected to the driving chip in a flip-chip manner.

In one embodiment, the light emitting device includes:

The middle carrier plate is positioned between the driving chip and the light source chip and used for supporting and fixing the light source chip, the light source chip is connected to the middle carrier plate in a flip-chip mode, and the middle carrier plate is connected to the driving chip in a normal mode.

In one embodiment, the distance between the second bonding pad and the edge of the package carrier body is greater than the distance between the first bonding pad and the edge of the package carrier body, the driving chip is flip-chip connected to the package carrier, and the light source chip is flip-chip connected to the driving chip.

In one embodiment, the driving chip includes a conductive post extending in a thickness direction of the driving chip, the conductive post being for electrically connecting the light source chip and the driving chip.

In one embodiment, the light emitting device includes:

the solder structure is positioned between the light source chip and the packaging carrier plate, the orthographic projection area of the light source chip is larger than the orthographic projection area of the driving chip, and the solder structure is electrically connected with the light source chip and the packaging carrier plate.

In one embodiment, the second light emitting structure further surrounds the light source chip, and the first light emitting structure is located between the light source chip and the second light emitting structure.

In one embodiment, the light emitting device includes:

The fluorescent conversion layer covers the surface, away from the driving chip, of the light source chip and the first light-emitting structure, the fluorescent conversion layer is used for converting the color of light emitted by the light source chip, the first light-emitting structure comprises a light-transmitting layer, and the longitudinal section of the first light-emitting structure is in an inverted trapezoid shape.

In one embodiment, the first light extraction structure comprises a cavity structure.

In one embodiment, the light emitting device includes:

the fluorescent conversion layer is used for converting the color of light emitted by the light source chip, and the first light emitting structure surrounds the fluorescent conversion layer.

In one embodiment, the shape of the first light emitting structure includes a hemispherical shape.

In one embodiment, a concave point structure is disposed on a surface of the first light emitting structure away from the light source chip, and the concave point structure is concave toward the light source chip.

In one aspect, a lamp panel is provided, including: the light emitting device array is arranged on the driving carrier plate to form a plurality of partitions, and the driving carrier plate drives a plurality of light source chips in at least one partition.

In one aspect, there is provided a display device including: the cover plate and the lamp panel are arranged on one side, far away from the driving carrier plate, of the lamp panel.

The light emitting device, the lamp panel and the display device provided by the disclosure have the following beneficial effects: the light source chip and the driving chip are not required to be independently attached when the subsequent light emitting devices are attached, so that the production efficiency is improved, and the production cost is reduced; in addition, when the light emitting device comprising the light source chip and the driving chip is integrated on the driving carrier plate, the light source chip and the driving chip are stacked, so that the driving chip does not occupy the area of the driving carrier plate, but utilizes the space in the stacking direction, thereby being beneficial to miniaturization of the lamp panel, improving the integration level of the lamp panel and improving the space utilization rate. Meanwhile, the light source chips and the driving chips are stacked, so that the problem of yield reduction caused by complex horizontal wiring can be avoided, the distance between each light source chip and the corresponding driving chip is approximately the same, and the distance difference between different light source chips and the driving chips is reduced. In the electrified state, the resistance of the circuit between each light source chip and the corresponding driving chip is small, the circuit voltage drop is reduced, the response time of each light source chip tends to be consistent, the problem of resistance-capacitance delay (IRDrop) is solved, the overall light emitting quality of the lamp panel is improved, the display mura is improved, and the display uniformity of the display device is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present disclosure, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to the drawings without inventive effort to those of ordinary skill in the art.

Fig. 1 is a schematic view of a light emitting structure provided in a first embodiment;

Fig. 2 is a schematic view of a light emitting structure provided in a second embodiment;

fig. 3 is a schematic view of a light emitting structure provided in a third embodiment;

fig. 4 is a schematic view of a light emitting structure provided in a fourth embodiment;

Fig. 5 is a schematic view of a light emitting structure provided in a fifth embodiment;

fig. 6 is a schematic view of a light emitting structure provided in a sixth embodiment;

Fig. 7 is a schematic view of a light emitting structure provided in a seventh embodiment;

fig. 8 is a schematic view of a light emitting structure provided in an eighth embodiment;

Fig. 9 is a schematic view of a light emitting structure provided in a ninth embodiment;

fig. 10 is a schematic view of a light emitting structure provided in a tenth embodiment;

FIG. 11 is a schematic view of a cavity structure provided in one embodiment;

FIG. 12 is a schematic diagram of a driving chip according to an embodiment;

FIG. 13 is a schematic diagram of forming a driving chip according to one embodiment;

FIG. 14 is a schematic diagram of forming an intermediate carrier in one embodiment;

FIG. 15 is a schematic diagram of forming a light source chip according to one embodiment;

FIG. 16 is a schematic illustration of a gold wire connection provided in one embodiment;

FIG. 17 is a schematic view of a gold wire connection provided in another embodiment;

FIG. 18 is a schematic diagram of a light emitting structure according to an embodiment;

FIG. 19 is a schematic view of a light extraction structure with portions removed according to one embodiment;

FIG. 20 is a schematic illustration of the formation of a transparent resin provided in one embodiment;

FIG. 21 is a schematic view of forming an outer resin shell provided in one embodiment;

FIG. 22 is a schematic illustration of dicing provided in one embodiment;

FIG. 23 is a schematic top view of a lamp panel according to an embodiment;

FIG. 24 is a schematic cross-sectional view of a lamp panel according to an embodiment;

FIG. 25 is a schematic diagram of a driving chip connection in an embodiment;

FIG. 26 is a schematic diagram of another embodiment of providing a driving chip connection;

FIG. 27 is a schematic diagram of a driving chip connection in accordance with another embodiment;

FIG. 28 is a schematic view of a hemispherical first light emitting structure according to an embodiment;

FIG. 29 is a schematic view of a pit structure provided in one embodiment.

Reference numerals illustrate: a light emitting device-100; packaging the carrier plate-110; packaging the carrier plate body-111; a first pad-112; a second pad-113; a driving chip-120; a second light-emitting structure-121; a light source chip-130; a first light exit structure-131; cavity structure-1310; pit structure-1311; gold thread-140; a heat conducting layer-150; middle carrier plate-160; a fluorescent conversion layer-170; a reflective layer-180; conductive pillars-190; solder-191; transparent resin-192; an outer resin shell-193; an integrated light extraction structure-194; a lamp panel-200; driving the carrier plate-210; and a master controller-300.

For a better description and illustration of embodiments and/or examples of those inventions disclosed herein, reference may be made to one or more of the accompanying drawings. Additional details or examples used to describe the drawings should not be construed as limiting the scope of the disclosed invention, the presently described embodiments and/or examples, and any of the presently understood modes of carrying out the invention.

Detailed Description

In order that the disclosure may be understood, a more complete description of the disclosure will be rendered by reference to the appended drawings. Preferred embodiments of the present disclosure are shown in the drawings. This disclosure may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

In various embodiments, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in the embodiments may be understood by those of ordinary skill in the art according to the specific circumstances.

It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to" another element or layer, it can be directly on, adjacent to, connected to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present embodiment.

Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Also, as used herein, the term "and/or" includes any and all combinations of the associated listed items.

Embodiments of the embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the present specification, such that variations of the illustrated shapes due to, for example, manufacturing techniques and/or tolerances are to be expected. Thus, embodiments of the present embodiments should not be limited to the particular shapes of regions illustrated herein, but rather include deviations in shapes that result, for example, from manufacturing techniques. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present embodiments.

Referring to fig. 1 to 10, various embodiments of the present disclosure respectively show various light emitting devices 100 of different structures, and the light emitting device 100 includes a package carrier 110, a driving chip 120, and a light source chip 130.

The package carrier 110 may be a carrier carrying the driving chips 120. The package carrier 110 may include a flame retardant type 4 (FLAME RETARDANT TYPE, fr 4) substrate, a bismaleimide triazine (Bismaleimide Triazine, BT) substrate, an aluminum nitride (AlN) substrate, a printed wiring board (Printed Circuit Board, PCB), etc.

The opposite sides of the package carrier 110 may have a plurality of pads. For example, the package carrier 110 may include first and second pads 112 and 113, and a package carrier body 111 provided with the first and second pads 112 and 113. The first bonding pads 112 are disposed on a first surface of the package carrier body 111, the second bonding pads 113 are disposed on a second surface of the package carrier body 111, and the first surface and the second surface are respectively located at two opposite sides of the package carrier body 111.

Further, the first pad 112 and the second pad 133 may be electrically connected. Specifically, in one example, when the first pad 112 and the second pad 113 are disposed to overlap in a vertical direction (i.e., a thickness direction of the package carrier 110), the package carrier body 111 may further include conductive holes through which the first pad 112 and the second pad 113 are electrically connected. In another example, when the first and second pads 112 and 113 do not overlap in the vertical direction (i.e., the thickness direction of the package carrier 110), the package carrier body 111 may further include connection lines in addition to the conductive vias, which are disposed on the surface of the package carrier body 111, and at this time, the first pads 112 are electrically connected with the second pads 133 through the connection lines, the conductive vias.

The driver chip 120 is located on the package carrier 110. Also, the driving chip 120 may be soldered with the second pad 113. In addition, the driving chip 120 may be further fixed on the package carrier 110 through a heat conductive layer 150 formed of a high heat conductive material such as sintered silver, silver paste, silicone, or the like.

The driving chip 120 is used for driving the light source chip 130 to emit light. The driving chip 120 may be a packaged chip. The driver chip 120 includes one or more of a driver circuit, a data latch circuit, a shaping circuit, a data forwarding circuit, and a pulse width modulation circuit.

The driving chip 120 is externally provided with a driving housing. The driving housing may be provided with a pin or the like connected to the internal circuit structure. The leads and the like are used for connection with the light source chip 130 and the like. Referring to fig. 10, the pin distribution of the driver chip 120 is exemplarily shown. When the plurality of driving chips 120 are connected, the 2 pin (Out terminal) of the previous chip may be connected to the 1 pin (Di terminal) of the next chip. The 3 pin (Pwr end) is connected to the power supply end of the overall controller 300, the 4 pin (GND end) is grounded, the 5 pin (VLED end) may be connected to the positive electrode of the light source chip 130, and the 6 pin (VSS end) may be connected to the common ground.

The light source chip 130 is a chip that can emit light. As an example, the type of the Light source chip 130 may include a Light-emitting Diode (LED) chip, wherein the present disclosure does not limit the size of the Light source chip 130, which may be a Mini LED chip having a chip size of between 50 μm and 200 μm or a Micro LED chip having a chip size of 50 μm or less, and may be a conventional LED chip having a chip size of 200 μm or more.

The light source chip 130 may include an inner light emitting film layer and an outer light source housing. The surface of the light source housing may also be provided with structures such as pads or bumps. As an example, the light source chip 130 may be a front-mounted chip, a flip-chip, or a chip-scale package (CHIP SCALE PACKAGE, CSP) chip, or the like.

The light emitting device 100 may include a plurality of light source chips 130. Each light source chip 130 is electrically connected with the driving chip 120. As an example, the light source chip 130 and the driving chip 120 may be electrically connected through a Wire Bond (Wire Bond). The metal wires electrically conduct each layer of structures such as the driving circuit and the data latch circuit inside the light source chip 130 and the driving chip 120. The metal wire may include gold wire 140.

Further, the light source chip 130 is stacked with the driving chip 120. Of course, the light source chip 130 and the driving chip 120 may have a plurality of stacked modes. In one example, referring to fig. 2, the light source chip 130 is connected to pads on the surface of the driving housing through gold wires 140. In another example, referring to fig. 3, the bump of the light source chip 130 may be directly soldered with the pad of the driving chip 120. Meanwhile, the light source chip 130 may be fixed to the center of the driving chip 120 by a high heat conductive resin or a silver paste, etc. Of course, at this time, the light source chip 130 does not shield the pads of the driving housing surface.

Further, the present embodiment does not limit the connection form of the light source chip 130, the driving chip 120, and the package carrier 110. Fig. 1 to 10 exemplarily show a plurality of connection forms of the light source chip 130, the driving chip 120, and the package carrier 110. It is understood that the light source chip 130 and the driving chip 120 may be electrically connected in a flip-chip manner. Or the light source chip 130 and the driving chip 120 may be electrically connected in a positive-fitting manner. Alternatively, the light source chip 130 and the driving chip 120 may be mounted in a flip-chip manner, and the other may be electrically connected.

The following exemplifies the connection forms of the light source chip 130, the driving chip 120, and the package carrier 110. Referring to fig. 1, 3, 5 and 6, the light source chip 130 is flip-chip connected to the driving chip 120. The driving chip 120 is flip-chip connected to the package carrier 110. At this time, the surfaces of the light source chip 130 and the driving chip 120 facing each other are provided with a pad structure. The light source chip 130 is electrically connected with the driving chip 120 by soldering the oppositely disposed pad structures. Meanwhile, the driving chip 120 is flip-chip connected to the second pad 113. In the structures shown in fig. 1, 3, 5 and 6, the surface of the light source chip 130 far from the package carrier 110 is not provided with a pad or the like, so that the light source chip 130 in the drawing has a larger light emitting surface, and the effective light emitting area in the unit area of the light source chip 130 can be increased, so that more light is emitted. In addition, referring to fig. 1, the distance between the second bonding pad 113 and the edge of the package carrier 111 is greater than the distance between the first bonding pad 112 and the edge of the package carrier 111, so as to reduce the package size and improve the package reliability.

The light source chip 130 is connected to the driving chip 120 in a flip-chip manner, that is, a pad structure is disposed on a side of the light source chip 130 facing the driving chip 120, and the light source chip 130 is electrically connected to the driving chip 120 through the pad structure, and correspondingly, the light source chip 130 is a flip-chip.

The driving chip 120 is connected to the package carrier 110 in a flip-chip manner, that is, a pad structure is disposed on a side of the driving chip 120 facing the package carrier 110, and the driving chip 120 is electrically connected to the package carrier 110 through the pad structure, and the driving chip 120 is a flip-chip.

The light source chip 130 is connected to the driving chip 120 in a forward-mounted manner, that is, a pad structure is disposed on a side of the light source chip 130 facing away from the driving chip 120, the light source chip 130 is electrically connected to the driving chip 120 through the pad structure, and the light source chip 130 is a forward-mounted chip.

The driving chip 120 is connected to the package carrier 110 in a forward-loading manner, that is, a pad structure is disposed on a side of the driving chip 120 facing away from the package carrier 110, and the driving chip 120 is electrically connected to the package carrier 110 through the pad structure, and the driving chip 120 is a forward-loading chip.

Further, referring to fig. 8, when the light source chip 130 and the driving chip 120 are flip chips, electrical connection may be achieved through a through silicon via (Through Silicon Via, TSV) technology. For example, a via structure may be formed inside the driving chip 120 through the TSV, and then a conductive material is filled in the via structure, thereby forming the conductive post 190. The conductive pillars 190 conduct circuits that drive the upper and lower surfaces of the chip 120.

Referring to fig. 2, the light source chip 130 is mounted on the driving chip 120, and the driving chip 120 is mounted on the package carrier 110. The positive and negative electrodes of the light source chip 130 may be electrically connected to the upper surface of the driving chip 120 by gold wires 140, for example. Further, a circuit on the upper surface of the driving chip 120 may be connected to the second pad 113 through a gold wire 140. In addition, considering that when the light source chip 130 and the driving chip 120 are both connected in a positive manner, the light emitting device 100 may be unstable, and therefore, referring to fig. 10, the distance between the second bonding pad 113 and the edge of the package carrier body 111 may be smaller than the distance between the first bonding pad 112 and the edge of the package carrier body 111, so that the second bonding pad 113 and the driving chip 120 may not overlap in the vertical direction, and the driving chip 120 does not need to be provided with a patterning structure towards one side of the package carrier body 111, thereby improving stability and levelness of the driving chip 120 and the light source chip 130.

Referring to fig. 4 and 10, the light source chip 130 is flip-chip connected to the upper surface circuit of the driving chip 120. Meanwhile, the driving chip 120 is being connected to the second pad 113. At this time, the light emitting surface of the light source chip 130 has no electrode, so as to increase the effective light emitting area of the light source chip 130 in unit area and increase the light emitting efficiency of the light source chip 130. In addition, the distance between the second pad 113 and the edge of the package carrier body 111 may be set to be smaller than the distance between the first pad 112 and the edge of the package carrier to improve the stability and levelness of the driving chip 120 and the light source chip 130.

Referring to fig. 7 and 10, the light emitting device 100 may further include an intermediate carrier 160 for supporting and fixing the light source chip 130, and may further extend the anode and cathode of the light source chip 130. The light source chip 130 is flip-chip mounted to the intermediate carrier 160, and the intermediate carrier 160 may be connected to the upper surface circuit of the driving chip 120 through gold wires 140. The driving chip 120 is either positively mounted (fig. 10) or flip-chip mounted (fig. 7) to the second pad 113. The intermediate carrier 130 is bonded to the light source chip 130, which may be integrally formed in the process of manufacturing the light emitting device 100, so that the structural stability and levelness of the light emitting device 100 may be further improved.

The material of the intermediate carrier 160 includes silicon wafer, sapphire, aluminum nitride, or the like. The surface of the intermediate carrier 160 near the light source chip 130 may include a circuit made of nickel-plated palladium-gold, and the surface of the intermediate carrier 160 far from the light source chip 130 may be fixed to the center of the driving chip 120 by solder paste, flux, high thermal conductive resin, or silver paste. Of course, the intermediate carrier 160 may not mask the surface pads of the driver chip 120.

Accordingly, referring to fig. 4 and 6, when the light emitting device 100 is not provided with the intermediate carrier 160, an upper surface circuit is disposed on a surface of a side of the driving chip 120 facing the light source chip 130, the upper surface circuit includes a surface pad, and the light source chip 130 is fixed and electrically connected to the driving chip 120 through the upper surface circuit. Referring to fig. 4, the driving chip 120 does not need to pass through the positive and negative electrode currents of the light source chip 130, but turns on the circuit through the gold wire 140. Referring to fig. 6, at this time, the driving chip 120 needs to have a positive and negative current passing through the light source chip 130, and a through hole may be formed in the driving chip 120, and a conductive pillar 190 shown in fig. 8 may be formed in the through hole, so as to realize circuit conduction.

Referring to fig. 9, when the driving chip 120 is flip-chip connected to the package carrier 110, the positive and negative electrodes of the light source chip 130 can be directly and electrically connected to the package carrier 110 through the solder structure 191. At this time, the solder structure 191 is located between the light source chip 130 and the package carrier 120, which allows the size of the light source chip 130 to be larger than the size of the driving chip 120 (i.e., the area of the orthographic projection of the light source chip 130 is larger than the area of the orthographic projection of the driving chip 120), thereby obtaining a larger light emitting area and improving the light emitting rate of the light source chip 130.

In addition, the connection form of the light source chip 130, the driving chip 120, and the package carrier 110 may further include that the light source chip 130 is being connected to the upper surface circuit of the driving chip 120, and at the same time, the driving chip 120 is flip-chip connected to the package carrier 110, etc.

The present embodiment does not limit the number of light source chips 130. It is understood that a plurality of light source chips 130 arranged in an array may be stacked on each driving chip 120. Illustratively, at this time, the distance of each light source chip 130 from the driving chip 120 may be the same. Of course, only one array of light source chips 130 may be stacked on each driving chip 120, and the light source chips 130 may be located at the center of the driving chip 120.

In the present embodiment, by stacking the light source chip 130 and the driving chip 120, when the light source chip 130 is integrated on the driving carrier 210 in the subsequent process (see fig. 23 and 24), the light source chip and the driving chip do not need to be individually attached, thereby improving the production efficiency and reducing the production cost. Moreover, the driving chip 120 does not occupy an area of the driving carrier 210, but uses a space in a stacking direction, which is advantageous for miniaturization of the lamp panel 200, thereby improving the integration of the lamp panel 200.

Meanwhile, the light source chips 130 and the driving chips 120 are stacked, so that the problem of reduced yield caused by complex horizontal wiring can be avoided, the distance between each light source chip 130 and the corresponding driving chip 120 is approximately the same, and the distance difference between different light source chips 130 and the driving chips 120 is reduced. In the energized state, the resistance of the circuit between each light source chip 130 and the corresponding driving chip 120 is smaller, so that the voltage Drop of the circuit is reduced, the response time of each light source chip 130 tends to be consistent, the problem of resistance-capacitance delay (IR Drop) of the circuit is solved, the overall light emitting quality of the lamp panel is improved, the display mura is improved, and the display uniformity of the display device is improved.

In one embodiment, each light emitting device 100 includes only one light source chip 130, one driving chip 120 and one package carrier 100, each light emitting device 100 is an independent package body capable of being independently disposed on the driving carrier 210 in the lamp board 200, and in each light emitting device 100, the projection area ratio of the light source chip 130, the driving chip 120 and the package carrier 100 on the driving carrier 210 is 1:0.8-1.2:1.2-1.5, and the overlap area of the light source chip 130 and the package carrier 100, the overlap area of the driving chip 120 and the package carrier 100 and the projection area ratio of the package carrier 100 on the driving carrier 210 is 1:0.8-1.2:1.2-1.5.

The application can ensure the packaging performance, the yield and the reliability of the light emitting device 100, the projection area ratio of the light source chip 130, the driving chip 120 and the packaging carrier plate 100 on the driving carrier plate 210 is 1:0.8-1.2:1.2-1.5, the overlapping area of the light source chip 130 and the packaging carrier plate 100, the overlapping area of the driving chip 120 and the packaging carrier plate 100 and the projection area ratio of the packaging carrier plate 100 on the driving carrier plate 210 are 1:0.8-1.2:1.2-1.5, thereby greatly improving the integration degree and the space utilization rate of the lamp panel 200, further improving the overall brightness and the display effect of the display device.

In one embodiment, the light emitting device 100 may include a first light emitting structure 131 and a second light emitting structure 121. The first light emitting structure 131 and the second light emitting structure 121 are both used for emitting light emitted by the light source chip 130.

The first light emitting structure 131 surrounds the light source chip 130. As an example, the first light emitting structure 131 may surround the light source chip 130 (e.g., fig. 1). Or the first light emitting structure 131 surrounds the light source chip 130, and the first light emitting structure 131 may also cover a surface of the light source chip 130 away from the driving chip 120 (for example, fig. 3).

The second light emitting structure 121 surrounds the driving chip 120. As an example, the second light emitting structure 121 may surround the periphery of the driving chip 120 (e.g., fig. 7). Or the second light emitting structure 121 surrounds the periphery of the driving chip 120, and the second light emitting structure 121 may also cover the rest of the surface of the driving chip 120 (for example, fig. 6).

The material of the second light emitting structure 121 may include silica gel. Illustratively, the surface of the light source chip 130 away from the driving chip 120 is a light-emitting surface. The first light emitting structure 131 may emit light emitted from the periphery of the light source chip 130 to the light emitting surface. The second light emitting structure 121 may emit light emitted from a surface of the light source chip 130 facing the driving chip 120 toward the light emitting surface.

In one case, referring to fig. 1, the second light emitting structure 121 surrounds the driving chip 120 and also surrounds the light source chip 130. At this time, the first light emitting structure 131 is located between the light source chip 130 and the second light emitting structure 121. At this time, the longitudinal section of the first light emitting structure 131 may have an inverted trapezoid shape. Illustratively, the longitudinal section of the first light emitting structure 131 may be a section along the thickness direction of the light emitting device 100. At this time, a side of the first light emitting structure 131 away from the light source chip 130 may be an inclined surface. Accordingly, the side of the second light emitting structure 121 near the light source chip 130 may be considered as an inclined surface.

It will be appreciated that light from the light source chip 130 may be emitted at the inclined surface to be emitted toward the light-emitting surface. Moreover, by providing the first light emitting structure 131 with an inverted trapezoid longitudinal section, a larger inclined plane can be obtained, so that more light is reflected to the light emitting surface, and the light emitting efficiency of the light source chip 130 is enhanced.

As an example, the first light emitting structure 131 includes a light transmitting layer. At this time, after the separator structure is removed, the cavity structure may be filled with a light-transmitting layer. As an example, the material of the light-transmitting layer may include a silicone layer. Since the light-transmitting layer is close to the light source chip 130, the light-transmitting layer can emit more light to the light-emitting surface, so as to enhance the light-emitting efficiency of the light source chip 130. At this time, referring to fig. 1, a fluorescent conversion layer 170 may be further disposed to cover the first light emitting structure 131 and the light source chip 130. The fluorescent conversion layer 170 is used to convert the color of the light emitted from the light source chip 130. For example, the fluorescent conversion layer 170 may convert blue emitted from the light source chip 130 into white. In the longitudinal section, the inverted trapezoid long side of the first light emitting structure 131 is connected to the fluorescent conversion layer 170, so that more light can be converted into color by the fluorescent conversion layer 170, thereby improving the fluorescent conversion rate.

In another example, referring to fig. 11, the first light emitting structure 131 includes a cavity structure 1310. At this time, when forming the first light-emitting structure 131 and the second light-emitting structure 121, the bottom second light-emitting structure 121 surrounding the driving chip 120 may be formed first, and then the partition structure surrounding the light source chip 130 may be formed on the bottom second light-emitting structure 121. Thereafter, a top layer second light emitting structure 121 may be formed at a side of the spacer structure remote from the light source chip 130. After removal of the spacer structure, a cavity structure may be formed. The light emitted from the light source chip 130 may be reflected multiple times within the cavity structure, thereby enhancing the light-emitting efficiency of the light source chip 130. Of course, thereafter, a cover plate covering the cavity structure 1310 and the light source chip 130 may be formed, thereby forming a display device.

In one embodiment, referring to fig. 3, while the fluorescent conversion layer 170 covers the surface of the light source chip 130 remote from the driving chip 120, the fluorescent conversion layer 170 also surrounds the outer peripheral surface of the light source chip 130, and the first light emitting structure 131 surrounds the fluorescent conversion layer 170. Alternatively, referring to fig. 6, the fluorescent conversion layer 170 may surround the light source chip 130, so that the light source chip 130 emits light from five sides, and the light emitting rate of the light source chip 130 is increased.

In one embodiment, the first light emitting structure 131 includes a shape including a hemispherical shape.

Referring to fig. 28, in the preparation of the first light emitting structure 131, a liquid or colloidal silica gel material may be formed on the surface of the light source chip 130. When the silica gel material is cured, the liquid or colloidal silica gel material may form the hemispherical first light emitting structure 131 under the action of the surface tension. The hemispherical first light emitting structure 131 may increase the light emitting angle of the light source chip 130 to 180 °.

Further, referring to fig. 29, a concave structure 1311 is disposed on a surface of the hemispherical first light emitting structure 131 away from the light source chip 130. The pit structure 1311 is recessed toward the light source chip 130.

As an example, in forming the first light emitting structure 131 having the pit structure 1311, a ring-shaped liquid or colloidal silica gel material may be formed on the surface of the light source chip 130. When the silica gel material is cured, under the action of surface tension, the silica gel material near the center can form the pit structure 1311, and the silica gel material far from the center can form a hemispherical layer.

In this embodiment, the concave point structure 1311 is formed on the surface of the hemispherical first light emitting structure 131, so that the light converging on the surface of the hemispherical layer can be avoided, the occurrence of bright spots on the surface of the spherical first light emitting structure 131 is reduced, and the service life of the light emitting device 100 is prolonged.

In addition, the present embodiment does not limit the number and distribution of pit structures 1311. As an example, one pit structure 1311 may be disposed on each first light emitting structure 131, and the pit structure may be located at the center of the surface of the first light emitting structure 131. Alternatively, a plurality of pit structures 1311 may be disposed on each first light emitting structure 131, and the plurality of pit structures 1311 may surround the center of the surface of the first light emitting structure 131. By changing the number and distribution of the pit structures 1311, the emission position and angle of the light emitting device 100 may be changed, thereby enhancing the light emitting efficiency of the light emitting device 100.

Of course, referring to fig. 28 and 19, in this embodiment, the fluorescent conversion layer 170 may be further disposed to surround the light source chip 130, and the hemispherical first light emitting structure 131 surrounds the fluorescent conversion layer 170, so as to increase the light emitting angle of the converted light to 180 ° and increase the fluorescent conversion efficiency.

In addition, the shape included in the first light emitting structure 131 may also include a planar type (fig. 1), a concave type, and the like.

In one embodiment, referring to fig. 10, the light emitting device 100 may have an integrated light extraction structure 194. The material of the integrated light emitting structure 194 may be silica gel.

Fig. 13 to 22 exemplarily illustrate a process of manufacturing the light emitting device 100 of fig. 10. In fig. 13, first, a plurality of driving chips 120 are connected to a package carrier 110, then an intermediate carrier 160 is formed on the driving chips 120 (fig. 14), and a light source chip 130 is formed on the intermediate carrier 160 (fig. 15). The driving chip 120, the intermediate carrier 160, and the light source chip 130 may be electrically connected by gold wires 140 (fig. 16 and 17). Thereafter, an integrated light emitting structure 194 (fig. 18) is formed to cover the driving chip 120, the intermediate carrier 160, the light source chip 130 and the package carrier 110. A portion of the integrated light extraction structure 194 is removed, forming a channel (fig. 19). Thereafter, a transparent resin 192 surrounding the aforementioned structure and an outer resin case 193 are sequentially formed as shown in fig. 20 and 21. Illustratively, the transparent resin 192 may further enhance light extraction efficiency, and the outer resin casing 193 may protect the internal structure from damage. Finally, as shown in fig. 22, dicing may be performed to form a plurality of individual light emitting devices 100.

The light emitting device 100 is provided with an integrated light emitting structure in this embodiment, so that the manufacturing process is simplified and the manufacturing efficiency is improved. In this embodiment, a plurality of light emitting structures are simultaneously formed in the structure of the light emitting device 100, so that the use of subsequent optical films can be reduced, and the manufacturing cost of the overall display device is reduced.

In addition, the light emitting device 100 may further include a reflective layer 180. Referring to fig. 2, a reflective layer 180 may be further disposed on a side of the luminescence conversion layer 170 away from the light source chip 130. The reflective layer 180 may include a white wall structure. The white wall structure is used for reflecting the light emitted by the light source chip 130 to the side surface, so that the light is emitted from the periphery of the fluorescent conversion layer 170, and the light emitting angle of the light emitting device 100 is increased. For example, the material of the reflective layer 180 may be consistent with the material of the second light emitting structure 121.

In one embodiment, referring to fig. 23 and 24, the present disclosure provides a light panel 200. The lamp panel 200 includes the light emitting device 100 and the driving carrier 210 provided in any one or more of the foregoing embodiments, and a plurality of light emitting devices 100 are arranged in an array on the driving carrier 210 to form a plurality of partitions, where the driving carrier 210 drives a plurality of light source chips 130 in at least one partition.

The driving carrier 210 is provided with a circuit structure. The plurality of light emitting devices 100 are arrayed on the driving carrier 210. For example, the light emitting device 100 is connected to a circuit structure driving the carrier board 210 through the package carrier 110.

Mini LED Local Dimming (Local Dimming) partition is a partition light control technology of direct type backlight of a television. In the related art, the master controller, the plurality of driving chips and the plurality of light source chips are horizontally arranged on the driving carrier plate, the master controller needs to be electrically connected with the plurality of driving chips through the planar circuit wiring on the driving carrier plate, the master controller also needs to be electrically connected with the plurality of light source chips through the planar circuit wiring on the driving carrier plate, each driving chip also needs to be electrically connected with the plurality of light source chips through the planar circuit wiring on the driving carrier plate, and along with the increase of Mini LED Local Dimming partitions, the manufacturing complexity of the planar circuit wiring on the driving carrier plate can be doubled, so that the driving carrier plate is difficult to manufacture, and the cost is too high. In this embodiment, only the planar circuit wiring connecting the overall controller 300 and each light emitting device 100 needs to be provided on the driving carrier board 210, specifically, only the planar circuit wiring connecting the overall controller 300 and each package carrier board 110 needs to be provided on the driving carrier board 210, so that the wiring difficulty and the manufacturing cost of the driving carrier board can be greatly reduced.

For example, referring to fig. 25 to 27, the lamp panel 200 includes a general controller 300, and the drive carrier 210 is connected to the general controller 300. The connection manner shown in fig. 25 may be such that one driving chip 120 controls a single-partitioned light source chip 130. The connection manner shown in fig. 26 may control the four partitioned light source chips 130 for one driving chip 120. The connection manner shown in fig. 27 may control eight partitioned light source chips 130 for one driving chip 120.

Illustratively, in fig. 25, each row driver chip 120 is 1 set of signals. The 1 pin (Di terminal) is the addressing input of the driver chip 120. The 2 pin (Out terminal) is a multifunctional pin of the driving chip 120 for the light source chip 130 driver and device ID addressing, and is connected to the Di terminal of the next driving chip 120 in the same set of signals. The 3 pin (Pwr terminal) is the power and control interface of the driver chip 120, and is connected in parallel in a set of driver chip 120 signals. The 4-pin (VLED terminal) is the positive input terminal of the light source chip 130, and provides the driving voltage for the light source chip 130. The 5-pin (GND terminal) is the ground terminal.

As an example, in fig. 26, each row driving chip 120 is 1 set of signals. Pins 1 and 7 (DIP terminals) are data inputs of the driver chip 120. The 2, 3, 5 and 6 pins (CH 1-4 ends) are driving channels of the light source chips 130 of the driving chip 120, and are respectively connected with the cathodes of the light source chips 130. The 4 pin (SCK terminal) is the clock signal port of the driver chip 120. The 8 pin (DOS terminal) is a serial output terminal of the driving chip 120, and is connected to the DIS terminal of the next driving chip 120 in the same set of signals. Pins 9 and 11 (VCC 1-2) are power interfaces of the driver chip 120 for powering the driver chip 120. The 10 pin (GND terminal) is the ground terminal. The 12 pin (DIS terminal) is the serial input terminal of the driving chip 120. The 13 pin (VLED terminal) is the positive input terminal of the light source chip 130, and provides the driving voltage for the light source chip 130.

As an example, in fig. 27, each row driving chip 120 is 1 set of signals. The 1 pin (DOS end) is the serial output end of the driving chip 120, and is connected with the DIS end of the next driving chip 120 in the same group of signals. Pins 2 and 4 (VCC 1-2) are power interfaces of the driver chip 120 for powering the driver chip 120. The 3-pin (GND terminal) is the ground terminal. The 5 pin (DIS terminal) is the serial input terminal of the driving chip 120. Pins 6 and 12 (DIP terminals) are data inputs of the driver chip 120. The 7-pin, 8-pin, 10-pin and 11-pin (CH 1-4 ends) are driving channels of the light source chips 130 of the driving chip 120, and are respectively connected with the cathodes of the light source chips 130. The 9 pin (SCK terminal) is the clock signal port of the driver chip 120. The 13 pin (VLED terminal) is the positive input terminal of the light source chip 130, and provides the driving voltage for the light source chip 130.

The light panel 200 in this embodiment, because the driving chip 120 and the light source chip 130 are stacked, so that the light source chip 130 and the driving chip 120 thereof are packaged into a device, when the light source chip 130 and the driving chip 120 thereof are subsequently packaged into a display device in an integrated manner, the light source chip and the driving chip do not need to be individually attached, so that the production efficiency is improved, the production cost is reduced, the planar arrangement position space of different devices can be saved, the planar space design of the backlight panel is optimized, the integration level of the light panel 200 is increased, the space utilization rate is improved, and the miniaturization and the light and thin reduction of the whole backlight display light panel 200 are facilitated.

Because the light source chip 130 is already electrically connected with the driving chip 120, the wiring design of the driving carrier 210 can be reduced and optimized, and the manufacturing difficulty and the corresponding manufacturing cost of the whole driving carrier 210 are reduced, thereby avoiding the reduction of the yield rate caused by the complexity of horizontal wiring. Specifically, when the glass substrate of the carrier 210 is driven, the embodiment is suitable for a glass substrate with a complex circuit which is difficult to manufacture.

In one embodiment, the present disclosure provides a display device. The display device includes a cover plate and a light panel 200 provided in any one or a combination of the foregoing embodiments.

The cover plate may be located on a side of the lamp panel 200 away from the drive carrier 210, i.e., the cover plate is located on the light emitting side of the lamp panel 200. The cover plate is a light-transmitting cover plate, and the cover plate is made of glass, polyethylene terephthalate, polyimide and the like.

In the display device of the present embodiment, by setting the distance between each light source chip 130 and the corresponding driving chip 120 to be substantially the same, the difference in distance between different light source chips 130 and the driving chips 120 is reduced. In the energized state, the resistance of the circuit between each light source chip 130 and the corresponding driving chip 120 is small, so that the circuit voltage Drop is reduced, the response time of each light source chip 130 tends to be consistent, the problem of resistance-capacitance delay (IR Drop) is solved, the overall light emitting quality of the lamp panel is improved, the display mura is improved, and the display uniformity of the display device is improved.

In some embodiments of the present application, the display device is a liquid crystal display device, and the lamp panel 200 may be used as a backlight module in the liquid crystal display device, in which case the display device further includes a display panel disposed between the lamp panel 200 and the cover plate. Of course, in other embodiments of the present application, the display device may also be a direct display device, in which case, the light panel 200 may be directly used as a display panel capable of displaying multiple colors, and the light panel 200 includes the light source chips 130 of multiple light emitting colors.

The technical features of the above embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.

Claims

1. A light emitting device, comprising:

The first light emitting structure surrounds the light source chip;

2. The light emitting device of claim 1, wherein the second bond pad is a smaller distance from the package carrier body edge than the first bond pad is from the package carrier body edge, wherein the driver chip is positively connected to the package carrier and the light source chip is positively connected to the driver chip.

3. The light emitting device of claim 1, wherein the second bond pad is a smaller distance from the package carrier body edge than the first bond pad, wherein the driver chip is positively connected to the package carrier and the light source chip is flip-chip connected to the driver chip.

4. A light emitting device according to claim 3 wherein the light emitting device comprises:

The middle carrier plate is positioned between the driving chip and the light source chip and is used for supporting and fixing the light source chip, the light source chip is connected to the middle carrier plate in a flip-chip mode, and the middle carrier plate is positively connected to the driving chip.

5. The light emitting device of claim 1, wherein the second bonding pad is spaced from the package carrier body edge a greater distance than the first bonding pad is spaced from the package carrier body edge, the driver chip is flip-chip connected to the package carrier, and the light source chip is flip-chip connected to the driver chip.

6. The light-emitting device according to claim 5, wherein the driving chip includes a conductive post extending in a thickness direction of the driving chip, the conductive post being for electrically connecting the light source chip and the driving chip.

7. The light-emitting device according to claim 5, wherein the light-emitting device comprises:

8. The light emitting device of claim 1, wherein the second light extraction structure further encloses the light source chip and the first light extraction structure is located between the light source chip and the second light extraction structure.

9. The light-emitting device according to claim 8, wherein the light-emitting device comprises:

10. The light emitting device of claim 8, wherein the first light extraction structure comprises a cavity structure.

11. The light-emitting device according to claim 1, wherein the light-emitting device comprises:

12. The light emitting device of claim 1, wherein the shape of the first light extraction structure comprises a hemispherical shape.

13. The light emitting device of claim 12, wherein a surface of the first light extraction structure remote from the light source chip is provided with a pit structure, the pit structure being recessed toward the light source chip.

14. A lamp panel, comprising: a drive carrier plate and a plurality of light emitting devices according to any one of claims 1-13, wherein a plurality of light emitting devices are arranged on the drive carrier plate in an array manner to form a plurality of subareas, and the drive carrier plate drives a plurality of light source chips in at least one subarea.

15. A display device, comprising: the lamp panel of claim 14 and a cover plate, wherein the cover plate is located at a side of the lamp panel away from the driving carrier plate.