CN118173694A - Light-emitting chip, preparation method thereof, light-emitting substrate and display device - Google Patents
Light-emitting chip, preparation method thereof, light-emitting substrate and display device Download PDFInfo
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- CN118173694A CN118173694A CN202211542806.4A CN202211542806A CN118173694A CN 118173694 A CN118173694 A CN 118173694A CN 202211542806 A CN202211542806 A CN 202211542806A CN 118173694 A CN118173694 A CN 118173694A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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Abstract
The application provides a light emitting chip, a preparation method thereof, a light emitting substrate and a display device. The light emitting chip comprises a substrate, at least two light emitting units positioned on the substrate, a plurality of connecting wires positioned on the substrate and a plurality of conductive pads. The light emitting unit includes at least two light emitting elements having different light emitting colors. In the at least two light emitting units, light emitting elements with the same light emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad. The light emitting substrate includes a plurality of the light emitting chips. The display device includes the light emitting substrate.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a light emitting chip, a manufacturing method thereof, a light emitting substrate, and a display device.
Background
The Micro light emitting diode, including Mini LED and Micro LED, has a size smaller than about 500 μm, and has a significantly increased trend in display field due to its advantages of smaller size, ultra-high brightness, long lifetime, etc.
The existing miniature light-emitting diode display device has the problem of higher power consumption.
Disclosure of Invention
The application provides a light-emitting chip, a preparation method thereof, a light-emitting substrate and a display device.
According to a first aspect of an embodiment of the present application, there is provided a light emitting chip. The light emitting chip includes:
A substrate;
at least two light emitting units on the substrate, the light emitting units including at least two light emitting elements having different light emitting colors;
A plurality of connection traces and a plurality of conductive pads on the substrate; in the at least two light emitting units, light emitting elements with the same light emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad.
In one embodiment, the at least two light emitting units are arranged at intervals in the row direction; the light emitting elements with the same light emitting color are positioned in the same row in the at least two light emitting units; the light emitting elements of the same light emitting unit are located in the same column.
In one embodiment, the light emitting element includes a first electrode and a second electrode, and the first electrode of one of the light emitting elements and the second electrode of the other light emitting element are located on the same side in two adjacent light emitting elements located on the same row.
In one embodiment, the connection trace includes a first connection portion, a second connection portion, and a third connection portion; in two adjacent light emitting elements positioned in the same row, a first electrode of one light emitting element and a second electrode of the other light emitting element are electrically connected through the first connecting part; one end of the second connecting part is connected to one conductive pad, and the other end is connected to a first electrode of one light-emitting element; one end of the third connecting part is connected to one conductive pad, and the other end is connected to a second electrode of one light-emitting element;
the third connecting portions of at least two of the connecting traces are connected to the same conductive pad.
In one embodiment, the light emitting unit includes light emitting elements of N light emitting colors, and the number of the conductive pads is greater than or equal to n+1.
In one embodiment, the third connection portion of each of the connection traces is connected to the same conductive pad.
In one embodiment, the plurality of conductive pads are arranged in two columns, and the two columns of conductive pads are positioned on two opposite sides of the at least two light emitting units;
Or the plurality of conductive pads are arranged in two rows, and the two rows of conductive pads are positioned on two opposite sides of the at least two light-emitting units.
In one embodiment, the conductive pad is located at a side of the connection trace away from the light emitting element, and the light emitting chip further includes a plurality of conductive portions disposed on the same layer as the connection trace, and a width of the conductive portion is greater than a width of the connection trace; one conductive pad is connected with one conductive part, and two ends of the connecting wire are respectively connected to one conductive part; an orthographic projection of one of the conductive pads on the substrate at least partially coincides with an orthographic projection of one of the conductive portions on the substrate.
In one embodiment, the connection trace is located on a side of the light emitting element facing away from the substrate; the light-emitting chip further comprises a planarization layer, wherein the planarization layer is positioned between the connecting wire and the substrate, and the light-emitting element comprises a body part, and a first electrode and a second electrode which are arranged on one side of the body part, which is away from the substrate; the surface of the body portion facing away from the substrate is substantially the same distance from the substrate as the surface of the planarizing layer facing away from the substrate.
In one embodiment, the planarization layer is a transparent film layer or the planarization layer is a light-adjusting film layer.
In one embodiment, the connection trace is located on a side of the light emitting element facing the substrate; the substrate is provided with a plurality of through holes, a conductive structure is arranged in each through hole, the conductive pad is positioned on one side of the substrate, which is away from the light-emitting element, and the conductive pad is electrically connected with the connecting wiring through the conductive structure.
In one embodiment, the light emitting element is a Mini LED or a Micro LED.
According to a second aspect of the embodiment of the present application, there is provided a light emitting substrate, where the light emitting substrate includes a plurality of light emitting chips as described above and signal traces connected to the light emitting chips, and a plurality of light emitting chips are arranged in an array.
According to a third aspect of embodiments of the present application, there is provided a display device including the above-described light-emitting substrate.
According to a fourth aspect of the embodiment of the present application, there is provided a method for manufacturing a light emitting chip, the method comprising:
Providing a substrate;
Transferring a plurality of light emitting elements onto the substrate, and forming a plurality of connection traces and a plurality of conductive pads on the substrate; the plurality of light emitting elements are divided into a plurality of light emitting unit groups including at least two light emitting units including at least two light emitting elements having different light emitting colors; in the same light-emitting unit group, light-emitting elements with the same light-emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad.
In one embodiment, the transferring the plurality of light emitting elements onto the substrate and forming a plurality of connection traces and a plurality of conductive pads on the substrate includes:
transferring a plurality of light emitting elements onto the substrate;
Forming a plurality of connecting wires and a plurality of conductive parts which are positioned on the same layer on one side of the light-emitting element, which is away from the substrate, wherein two ends of the connecting wires are respectively connected to one conductive part;
And forming a plurality of conductive pads on one side of the conductive part, which is away from the substrate, wherein the orthographic projection of one conductive pad on the substrate is at least partially overlapped with the orthographic projection of one conductive part on the substrate.
In one embodiment, the light-emitting element comprises a body portion, and a first electrode and a second electrode arranged on one side of the body portion away from the substrate; before the plurality of connection wirings and the plurality of conductive parts are formed on the same layer on the side, away from the substrate, of the light-emitting element, the preparation method further comprises:
A planarization layer is formed on the substrate, the planarization layer facing away from the surface of the substrate and being substantially the same distance from the surface of the body portion facing toward the substrate.
In one embodiment, the light-emitting element comprises a body portion, and a first electrode and a second electrode arranged on one side of the body portion away from the substrate; the transferring the plurality of light emitting elements onto the substrate and forming a plurality of connection traces and a plurality of conductive pads on the substrate includes:
Forming a plurality of connecting wires and a plurality of conductive parts on the same layer on the substrate; two ends of the connecting wire are respectively connected to one conductive part;
transferring a plurality of light emitting elements to one side of the connecting wire away from the substrate, wherein the first electrode and the second electrode are respectively and electrically connected with the connecting wire;
forming a plurality of through holes penetrating through the substrate, wherein the orthographic projection of one through hole on the substrate is at least partially overlapped with the orthographic projection of one conductive part on the substrate;
And forming a conductive structure in the through hole and a plurality of conductive pads on one side of the conductive structure away from the light-emitting element, wherein the conductive pads are electrically connected with the conductive part through the conductive structure.
According to the light-emitting chip, the preparation method thereof, the light-emitting substrate and the display device provided by the embodiment of the application, the light-emitting elements with the same light-emitting color in at least two light-emitting units are connected in series through the connecting wires, and on the premise that the brightness of the light-emitting chip is unchanged, compared with the scheme that the number of the light-emitting elements with one light-emitting color in the light-emitting units is only one, the working voltage of the light-emitting chip is increased, the working current is reduced, so that the power consumption of a driving circuit of the light-emitting substrate where the light-emitting chip is located can be reduced, and the power consumption and the temperature rise of the light-emitting substrate are further reduced.
Drawings
Fig. 1 is a schematic diagram of a light emitting chip according to an exemplary embodiment of the present application;
FIG. 2 is a partial cross-sectional view of the structure shown in FIG. 1 taken along AA;
Fig. 3 is a schematic structural view of a light emitting chip according to another exemplary embodiment of the present application;
FIG. 4 is a partial cross-sectional view of the structure shown in FIG. 3 taken along BB;
Fig. 5 is a flowchart of a method for manufacturing a light emitting chip according to an exemplary embodiment of the present application;
fig. 6 is a schematic structural view of a light emitting element according to an exemplary embodiment of the present application;
Fig. 7 is a schematic view of a structure in which a plurality of light emitting elements are formed on a substrate according to an exemplary embodiment of the present application;
FIG. 8 is a schematic diagram of a first intermediate structure provided in an exemplary embodiment of the present application;
FIG. 9 is a schematic diagram of a second intermediate structure provided in an exemplary embodiment of the present application;
FIG. 10 is a partial cross-sectional view of the structure shown in FIG. 9 taken along AA;
FIG. 11 is a schematic structural view of a third intermediate structure provided in an exemplary embodiment of the present application;
FIG. 12 is a partial cross-sectional view of the structure of FIG. 11 taken along AA;
FIG. 13 is a schematic structural view of a fifth intermediate structure provided by an exemplary embodiment of the present application;
FIG. 14 is a partial cross-sectional view of the structure shown in FIG. 13 taken along BB;
Fig. 15 is a schematic structural view of a sixth intermediate structure provided in an exemplary embodiment of the present application;
Fig. 16 is a partial cross-sectional view of the structure shown in fig. 15 taken along BB.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "in response to a determination" depending on the context.
The embodiment of the application provides a light-emitting chip, a preparation method thereof, a light-emitting substrate and a display device. The following describes a light emitting chip, a method for manufacturing the same, a light emitting substrate, and a display device in the embodiments of the present application in detail. The features of the embodiments described below can be supplemented or combined with one another without conflict.
The embodiment of the application provides a light-emitting chip. As shown in fig. 1 to 4, the light emitting chip includes a substrate 10, at least two light emitting units 20, a plurality of connection traces 30, and a plurality of conductive pads 40. The at least two light emitting units 20, the plurality of connection traces 30, and the plurality of conductive pads 40 are all located on the substrate 10.
The light emitting unit 20 includes at least two light emitting elements 21 having different light emitting colors. In the at least two light emitting units 20, the light emitting elements 21 with the same light emitting color are connected in series through the connection trace 30, and one end of the connection trace 30 is connected to one of the conductive pads 40, and the other end of the connection trace 30 is connected to one of the conductive pads 40. The light emitting elements may have light emitting colors corresponding to the connection traces 30 one by one, and the connection traces 30 connect the light emitting elements of the corresponding light emitting colors in series.
According to the light-emitting chip provided by the embodiment of the application, the light-emitting elements with the same light-emitting color in at least two light-emitting units are connected in series through the connecting wires, and on the premise that the brightness of the light-emitting chip is unchanged, compared with the scheme that the number of the light-emitting elements with one light-emitting color in the light-emitting units is only one, the working voltage of the light-emitting chip is increased, the working current is reduced, so that the power consumption of a driving circuit of a light-emitting substrate where the light-emitting chip is located can be reduced, and the power consumption and the temperature rise of the light-emitting substrate where the light-emitting chip is located are further reduced. In one embodiment, the substrate 10 may be a flexible substrate or a rigid substrate. The material of the flexible substrate may include one or more of polyimide, polyethylene terephthalate, polycarbonate, an organic resin material, which may include epoxy, triazine, silicone, polyimide, or the like. The rigid substrate includes any one of a glass substrate, a quartz substrate, a sapphire substrate, and the like.
In the embodiment shown in fig. 1 and 3, the light emitting chip includes three light emitting units 20, and the light emitting units 20 include three light emitting elements 21 having different light emitting colors. In other implementations, the light emitting chip may include two light emitting units, and may also include four or more light emitting units 20.
In one embodiment, the light emitting unit 20 includes three light emitting elements with light emitting colors, namely, a light emitting element 21 with light emitting color red, a light emitting element 21 with light emitting color green, and a light emitting element 21 with light emitting color blue.
In one embodiment, the size of the light emitting element 21 ranges from 20 μm to 200 μm. So set up, the size of the luminescent element 21 is great, the size of edge defect that produces in the preparation technology of the luminescent element 21 is smaller in the size of the luminescent element 21, it is less to the luminous efficiency influence of luminescent element 21, its working current is smaller when the luminescent element 21 reaches the identical luminance, help reducing the consumption in the luminescent substrate where the luminescent chip is located, promote the highest luminance that the luminescent chip can reach and display effect of the display substrate where the luminescent chip is located. In some implementations, the light emitting element 21 may be a Mini LED having a size of about 100 μm to 500 μm or a Micro LED having a size of less than 100 μm.
In one embodiment, as shown in fig. 1 and 3, the at least two light emitting units 20 are arranged at intervals in the row direction; in the at least two light emitting units 20, the light emitting elements 21 having the same light emitting color are located in the same row; the light emitting elements 21 of the same light emitting unit 20 are located in the same column. So set up, the luminous colour is the same and the distance between the adjacent light emitting component is less, and the length of connecting wire 30 can be set to less, can save the space that connecting wire occupied, and then help reducing the volume of light emitting chip.
Further, as shown in fig. 1 to 4, the light emitting element 21 includes a main body 211, and a first electrode 212 and a second electrode 213 provided on one side of the main body 211. One of the first electrode 212 and the second electrode 213 is an anode, and the other is a cathode. In two light emitting elements 21 located in the same row and adjacent, the first electrode 212 of one of the light emitting elements 21 and the second electrode 213 of the other light emitting element 21 are located on the same side. When the connection wiring 30 connects the light emitting elements 21 having the same emission color in series, the first electrode 212 of one light emitting element 21 of the adjacent two light emitting elements 21 is electrically connected to the second electrode 213 of the other light emitting element 21 through the connection wiring. By arranging the first electrode 212 of one light emitting element 21 and the second electrode 213 of the other light emitting element 21 in the same row and adjacent two light emitting elements 21 on the same side, the length of the portion of the connecting trace 30 for connecting the first electrode 212 and the second electrode 213 is shorter, so that the complexity of the connecting trace 30 in the light emitting chip can be simplified, the space occupied by the connecting trace 30 can be saved, and the volume of the light emitting chip can be further reduced.
In one embodiment, as shown in fig. 1 and 3, the connection trace 30 includes a first connection portion 31, a second connection portion 32, and a third connection portion 33; in two light emitting elements 21 located in the same row and adjacent to each other, a first electrode 212 of one of the light emitting elements 21 and a second electrode 213 of the other light emitting element 21 are electrically connected by the first connection portion 31; one end of the second connection portion 32 is connected to one of the conductive pads 40, and the other end is connected to the first electrode 212 of one of the light emitting elements 21; one end of the third connection portion 33 is connected to one of the conductive pads 40, and the other end is connected to the second electrode 213 of one of the light emitting elements 21.
In one embodiment, the third connection portions 33 of at least two of the connection traces 30 are connected to the same conductive pad 40. That is, the light emitting elements 21 of at least two light emitting colors share the second electrode. By the arrangement, the number of the conductive pads 40 can be reduced, the space occupied by the conductive pads 40 is reduced, and the size of the light emitting chip is reduced.
In one embodiment, the light emitting unit 20 includes light emitting elements 21 of N light emitting colors, and the number of the conductive pads 40 is greater than or equal to n+1. For example, when the light emitting unit 20 includes the light emitting elements 21 of three light emitting colors, that is, n=3, the number of the conductive pads 40 is greater than or equal to 4.
In one embodiment, the third connection portion 33 of each connection trace 30 is connected to the same conductive pad 40. That is, in each light emitting unit 20, the light emitting elements 21 of each light emitting color share the second electrode, and the number of the conductive pads 40 is equal to n+1. This minimizes the number of conductive pads 40, which is more conducive to reducing the volume of the light emitting chip. As shown in fig. 1 to 3, the plurality of conductive pads 40 of the light emitting chip includes one conductive pad 41 and N conductive pads 42, where n=3. Each third connection portion 33 is connected to the conductive pad 41. The conductive pads 42 are in one-to-one correspondence with the second connection portions 32, and the second connection portion 32 corresponding to the light emitting element 21 of one light emitting color is connected to one conductive pad 42.
In one embodiment, the plurality of conductive pads 40 are arranged in two columns, with the two columns of conductive pads being located on opposite sides of the at least two light emitting units 20. Or the plurality of conductive pads 40 are arranged in two rows, and the two rows of conductive pads are located at opposite sides of the at least two light emitting units 20. This arrangement helps to avoid crossing of the connection traces connected to the conductive pads 40. In the embodiment shown in fig. 1 and 3, the plurality of conductive pads 40 are arranged in two rows, and the two rows of conductive pads 40 are located on opposite sides of the at least two light emitting units 20.
Further, the light emitting chip includes four conductive pads 40, and orthographic projections of the four conductive pads 40 on the substrate are respectively located at four corners of the substrate 10. By the arrangement, the conductive pad 40 can be arranged larger on the premise of not influencing the arrangement of the light-emitting elements, so that the subsequent conductive pad 40 is electrically connected with the circuit of the array substrate.
In one embodiment, as shown in fig. 1 to 4, the conductive pad 40 is located on a side of the connection trace 30 facing away from the light emitting element 21, and the light emitting chip further includes a plurality of conductive portions 50 disposed on the same layer as the connection trace 30, and a width of the conductive portions 50 is greater than a width of the connection trace 30. One of the conductive pads 40 is connected to one of the conductive portions 50, and both ends of the connection trace 30 are respectively connected to one of the conductive portions 50; the orthographic projection of one of the conductive pads 40 onto the substrate 10 at least partially coincides with the orthographic projection of one of the conductive portions 50 onto the substrate 10. The conductive portions 50 and the conductive pads 40 may be in one-to-one correspondence, and an orthographic projection of the conductive pad 40 on the substrate at least partially coincides with an orthographic projection of the corresponding conductive portion 50 on the substrate. Wherein the width of the conductive part 50 refers to the dimension of the conductive part 50 in the extending direction of the first connection part 31 or the third connection part 33 connected thereto. By setting the width of the conductive portion 50 to be larger than the width of the connection trace 30, the conductive pad 40 is conveniently connected with the conductive portion 50; since the width of the connection trace 30 does not affect the electrical connection with the conductive pad 40, the width of the connection trace 30 can be set smaller, which contributes to the reduction of the volume of the light emitting chip. By arranging the conductive portion 50 and the connection trace 30 in the same layer, the conductive portion 50 and the connection trace 30 can be formed in the same process step, which helps to simplify the manufacturing process.
Further, the edge of the orthographic projection of the conductive portion 50 on the substrate 10 is located outside the edge of the orthographic projection of the corresponding conductive pad 40 on the substrate 10. So configured, even if misalignment occurs during the preparation of the conductive pad 40, it is ensured that all or most of the conductive pad 40 is in direct contact with the corresponding conductive portion 50.
In one embodiment, as shown in fig. 1 and 3, the light emitting substrate further includes fourth connection portions 70, and the third connection portions 33 of the connection traces 30 are respectively connected to the fourth connection portions 70, and the fourth connection portions 70 are connected to the conductive pads 41. One end of the fourth connection portion 70 is connected to each of the third connection portions 33, and the other end is connected to the conductive portion 50. So arranged, the complexity of the circuit is simplified relative to the solution in which each third connection portion 33 is directly connected to the conductive pad 41.
In one embodiment, when the plurality of conductive pads 40 are arranged in two columns, the fourth connection portion 70 is located outside the at least two light emitting units 20 and extends along the column direction, and is located substantially in the same column as one of the columns of conductive pads. In this way, the arrangement of the fourth connection portion 70 has less influence on the layout space of the conductive pad 40 and the light emitting element 21, and the conductive pad 40 can be arranged larger when the size of the light emitting chip is constant.
In one embodiment, the fourth connection portion 70 is disposed in the same layer as each connection trace 30. Thus, the fourth connection portion 70 and the connection trace 30 can be formed simultaneously in the same process step, which is helpful for simplifying the manufacturing process of the light emitting chip.
In one embodiment, as shown in fig. 1 and 2, the connection trace 30 is located on a side of the light emitting element 21 facing away from the substrate 10. In this embodiment, the material of the substrate 10 is a light-transmitting material, for example, the material of the substrate 10 includes glass, sapphire, and the like. The surface of the light emitting element 21 facing the substrate 10 is a light emitting surface, and the material of the substrate 10 is a light transmitting material, so that most of the light emitted from the light emitting element 21 can be emitted through the substrate 10.
In one embodiment, as shown in fig. 1 and 2, the light emitting chip further includes a planarization layer 60, the planarization layer 60 is located between the connection trace 30 and the substrate 10, and a distance from a surface of the body 211 facing away from the substrate 10 to the substrate is substantially the same as a distance from a surface of the planarization layer 60 facing away from the substrate 10 to the substrate 10. In this way, the planarization layer 60 can avoid the connection trace 30 from breaking due to too large difference between the top of the first electrode 212 and the second electrode 213 of the light emitting device 21 and other parts, thereby improving the yield of the light emitting chip. Wherein the distance from the surface of the body 211 facing away from the substrate 10 to the substrate 10 is substantially the same as the distance from the surface of the planarization layer 60 facing away from the substrate 10 to the substrate 10, meaning that the distance from the surface of the body 211 facing away from the substrate 10 to the substrate 10 is the same as the distance from the surface of the planarization layer 60 facing away from the substrate 10 to the substrate 10, or the difference therebetween is small.
In one embodiment, the planarization layer 60 is a transparent film layer. When the planarizing layer 60 is a transparent film layer, the planarizing layer 60 does not affect the side surface light emission of the generating element 21, and the planarizing layer 60 is made of, for example, an organic resin, titanium dioxide, or the like.
In another embodiment, the planarization layer 60 is a light-adjusting film layer. The planarization layer 60 may be a black film layer, for example, the planarization layer 60 may be coated with a resin material having a low transmittance. Thus, the planarization layer 60 can effectively reduce the reflectivity of the ambient light incident to the light emitting chip, and enhance the user experience.
In one embodiment, as shown in fig. 1 and 2, the conductive pad 40 is in direct contact with the conductive portion 50, and there is no overlap between the front projection of the conductive pad 40 on the substrate 10 and the front projection of the light emitting element 21 on the substrate 10.
In other embodiments, a conductive layer may be disposed between the conductive pad 40 and the conductive portion 50, and the conductive pad 40 is electrically connected to the conductive portion 50 through the conductive layer, and there may be overlap between the front projection of the conductive pad 40 on the substrate 10 and the front projection of the conductive portion 50 on the substrate 10. This helps to reduce the size of the light emitting chip and to increase the density of the light emitting elements 21 in the light emitting chip.
In one embodiment, as shown in fig. 3 and 4, the connection trace 30 is located on a side of the light emitting element 21 facing the substrate 10; the substrate 10 is provided with a plurality of through holes 11, a conductive structure 90 is arranged in the through holes 11, the conductive pad 40 is positioned on one side of the substrate 10 away from the light emitting element 21, and the conductive pad 40 is electrically connected with the connecting trace 30 through the conductive structure 90. In this embodiment, the body portion 211 of the light emitting element 21 is located on a side of the first electrode 212 facing away from the substrate 10, and a surface of the light emitting element 21 facing away from the substrate 10 is a light emitting surface. The substrate 10 may be a light-transmitting substrate or a light-impermeable substrate.
In one embodiment, as shown in fig. 4, the conductive pads 40 are in one-to-one correspondence with the through holes 11, and the conductive pads 40 are in direct contact with the conductive structures 90 disposed in the corresponding through holes 11. The orthographic projection of the conductive pad 40 on the substrate 10 covers the corresponding via 11.
In another embodiment, the side of the substrate 10 is provided with conductive connection portions, and the conductive pads 40 are electrically connected to the corresponding conductive portions 50 through the conductive connection portions.
In one embodiment, as shown in fig. 3 and 4, there is no overlap between the front projection of the conductive pad 40 on the substrate 10 and the front projection of the light emitting element 21 on the substrate 10.
In other embodiments, there may be overlap between the front projection of the conductive pad 40 on the substrate 10 and the front projection of the light emitting element 21 on the substrate 10. Thus, the conductive pad 40 has a larger size, so that the conductive pad 40 is convenient to electrically connect with the circuit of the array substrate.
In one embodiment, the material of the conductive pad 40 may include at least one of tin and gold. When the material of the conductive pad 40 is tin, the thickness of the conductive pad 40 may be in the range of 4 μm to 10 μm; when the material of the conductive pad 40 is gold, the thickness of the conductive pad 40 may be in the range of 0.5 μm to 3 μm.
In one embodiment, as shown in fig. 2 and 4, the light emitting chip further includes an insulating protection layer 80, where the insulating protection layer 80 is located on a side of the light emitting element 21 facing away from the substrate 10, and covers the light emitting element 21. The insulating protection layer 80 can protect the light emitting element 21 and the connection trace 30. In the embodiment shown in fig. 2, the insulating protection layer 80 is located on the side of the connection trace 30 facing away from the substrate, the insulating protection layer 80 is provided with an opening, and the conductive pad 40 is electrically connected to the conductive portion 50 through the opening of the insulating protection layer 80. Note that, in fig. 1 and 3, the insulating protective layer 80 is not shown.
The embodiment of the application also provides a preparation method of the light-emitting chip. As shown in fig. 5, the preparation method includes the following steps 110 to 120. The steps will be described in detail below.
In step 110, a substrate is provided.
Transferring a plurality of light emitting elements onto the substrate and forming a plurality of connection traces and a plurality of conductive pads on the substrate in step 120; the plurality of light emitting elements are divided into a plurality of light emitting unit groups including at least two light emitting units including at least two light emitting elements having different light emitting colors; in the same light-emitting unit group, light-emitting elements with the same light-emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad.
In one embodiment, the light emitting unit includes three light emitting elements of light emitting colors, which are a light emitting element of light emitting color red, a light emitting element of light emitting color green, and a light emitting element of light emitting color blue, respectively.
In one embodiment, as shown in fig. 6, the light emitting element 21 is formed on the substrate base 201. The light emitting element 21 includes a first electrode 212, a second electrode 213, a first semiconductor layer 202 formed on the substrate 201, a quantum well layer 203 formed on a side of the first semiconductor layer 202 facing away from the substrate 201, and a second semiconductor layer 204 formed on a side of the quantum well layer 203 facing the substrate 201, the first electrode 212 being located on a side of the second semiconductor layer 204 facing away from the substrate 201, and the second electrode 213 being located on a side of the first semiconductor layer 202 facing away from the substrate 201. The light emitting element 21 may be formed on the substrate base 201 using an epitaxial process. As shown in fig. 7, a plurality of light emitting elements 21 are formed on a substrate 201.
In one embodiment, a light emitting element having a red light emitting color may be formed on a GaAs substrate, and a material of a quantum well layer of the red light emitting element may be AlGaInP. The light emitting element having a blue emission color and the light emitting element having a green emission color may be formed on a sapphire substrate, and the quantum well layer may be made of InGaN.
In one embodiment, the step 120 of transferring the plurality of light emitting elements onto the substrate and forming the plurality of connection traces and the plurality of conductive pads on the substrate may comprise the following process.
First, a plurality of light emitting elements are transferred onto the substrate.
In one embodiment, a bulk transfer process may be used to sequentially transfer light emitting elements 21 of different colors onto a substrate. Before transferring the plurality of light emitting elements having a light emission color of red to the substrate, the plurality of light emitting elements having a light emission color of red may be first transferred from the GaAs substrate to the sapphire substrate by bonding. The plurality of light emitting elements having a red emission color may be transferred onto the sapphire substrate by silicon dioxide bonding or by glue bonding. When a plurality of light emitting elements having a red emission color, a plurality of light emitting elements having a green emission color, and a plurality of light emitting elements having a blue emission color are transferred onto the substrate 10 by a mass transfer process, the light emitting elements are bonded to the substrate 10, and then the sapphire substrate is peeled off, and then the plurality of light emitting elements are arranged, and so on.
By this step a first intermediate structure as shown in fig. 8 is obtained. As shown in fig. 8, the plurality of light emitting elements 21 on the substrate 10 are divided into a plurality of light emitting cell groups 205, the light emitting cell groups 205 including at least two light emitting cells 20, the light emitting cells 20 including at least two light emitting elements 21 having different emission colors. In the embodiment shown in fig. 8, the light emitting unit 20 includes three light emitting elements 21 that emit light of different colors.
As shown in fig. 8, in the same light emitting cell group 205, the light emitting cells 20 are arranged at intervals in the row direction. In the same light-emitting unit group 205, the light-emitting elements 21 having the same emission color are located in the same row; the light emitting elements 21 of the same light emitting unit 20 are located in the same column.
In one embodiment, in the same light emitting unit group 205, two light emitting elements 21 located in the same row and adjacent to each other, the first electrode 212 of one of the light emitting elements 21 and the second electrode 213 of the other light emitting element 21 are located on the same side.
In one embodiment, to ensure a yield of the subsequent dicing, a gap between adjacent light emitting cell groups 205 is greater than 10 μm.
And then, forming a plurality of connecting wires and a plurality of conductive parts which are positioned on the same layer on one side of the light-emitting element away from the substrate, wherein two ends of the connecting wires are respectively connected to one conductive part.
In one embodiment, the light emitting element includes a body portion, and a first electrode and a second electrode disposed on a side of the body portion facing away from the substrate. Before the plurality of connection wirings and the plurality of conductive parts are formed on the same layer on the side, away from the substrate, of the light-emitting element, the preparation method further comprises: a planarization layer is formed on the substrate, the planarization layer facing away from the surface of the substrate and being substantially the same distance from the surface of the body portion facing toward the substrate.
By this step a second intermediate structure as shown in fig. 9 and 10 can be obtained. As shown in fig. 9, the surface of the planarization layer 60 facing away from the substrate 10 is substantially flush with the surface of the body portion 211 facing away from the substrate 10.
After forming a plurality of connection traces and a plurality of conductive portions on the same layer on a side of the light emitting element facing away from the substrate, a third intermediate structure as shown in fig. 11 and 12 is obtained. As shown in fig. 11 and 12, the connection trace 30 includes a first connection portion 31, a second connection portion 32, and a third connection portion 33. In two light emitting elements 21 located in the same row and adjacent to each other, a first electrode 212 of one of the light emitting elements 21 and a second electrode 213 of the other light emitting element 21 are electrically connected by the first connection portion 31; one end of the second connection portion 32 is connected to one of the conductive portions 50, and the other end is connected to the first electrode 212 of one of the light emitting elements 21; one end of the third connection portion 33 is connected to one conductive portion 50, and the other end is connected to the second electrode 213 of one of the light emitting elements 21. The width of the conductive portion 50 is greater than the width of the connection trace 30.
In one embodiment, as shown in fig. 11, the light emitting substrate further includes a fourth connection portion 70, and the fourth connection portion 70 is formed simultaneously with the connection trace 30. The third connection portion 33 of the connection trace 30 is connected to one end of the fourth connection portion 70, and the other end of the fourth connection portion 70 is connected to one conductive portion 50.
In one embodiment, the third connection portions 33 of at least two of the connection traces 30 are connected to the same conductive portion 50.
In one embodiment, the third connection portion 33 of each connection trace 30 is connected to the same conductive portion 50.
Subsequently, a plurality of conductive pads are formed on a side of the conductive portion facing away from the substrate, and an orthographic projection of one of the conductive pads on the substrate at least partially coincides with an orthographic projection of one of the conductive portions on the substrate.
In one embodiment, before the step of forming a plurality of conductive pads on a side of the conductive portion facing away from the substrate, the method further comprises: an insulating protective layer is formed on the side of the connection trace facing away from the substrate, the insulating protective layer being provided with a plurality of openings, one opening exposing at least a portion of one conductive portion 50.
Forming a plurality of conductive pads on one side of the conductive portion away from the substrate can obtain a fourth intermediate structure, and cutting the fourth intermediate structure can obtain light emitting chips as shown in fig. 1 and 2, wherein each light emitting chip comprises a light emitting unit group.
As shown in fig. 1 and 2, one of the conductive pads 40 is connected to one of the conductive portions 50, and two ends of the connection trace 30 are respectively connected to one of the conductive portions 50; the orthographic projection of one of the conductive pads 40 onto the substrate 10 at least partially coincides with the orthographic projection of one of the conductive portions 50 onto the substrate 10. The conductive portions 50 and the conductive pads 40 may be in one-to-one correspondence, and an orthographic projection of the conductive pad 40 on the substrate at least partially coincides with an orthographic projection of the corresponding conductive portion 50 on the substrate.
In one embodiment, the plurality of conductive pads 40 are arranged in two columns, with the two columns of conductive pads being located on opposite sides of the at least two light emitting units 20. Or the plurality of conductive pads 40 are arranged in two rows, and the two rows of conductive pads are located at opposite sides of the at least two light emitting units 20.
In another embodiment, the step 120 of transferring the plurality of light emitting elements onto the substrate and forming the plurality of connection traces and the plurality of conductive pads on the substrate includes the following process.
Firstly, forming a plurality of connecting wires and a plurality of conductive parts which are positioned on the same layer on the substrate; two ends of the connecting wire are respectively connected to one conductive part.
By this step, a fifth intermediate structure as shown in fig. 13 and 14 can be obtained. As shown in fig. 13 and 14, the connection trace 30 includes a first connection portion 31, a second connection portion 32, and a third connection portion 33; one end of the second connection portion 32 is connected to one conductive portion 50; the width of the conductive portion 50 is greater than the width of the connection trace 30. The light emitting substrate further includes a fourth connection portion 70, and the fourth connection portion 70 is formed simultaneously with the connection trace 30. The third connection portion 33 of the connection trace 30 is connected to the fourth connection portion 70.
Subsequently, a plurality of light emitting elements are transferred to a side of the connection trace facing away from the substrate, the first electrode and the second electrode being electrically connected with the connection trace, respectively.
By this step, a sixth intermediate structure as shown in fig. 15 and 16 can be obtained. As shown in fig. 15 and 16, the first electrode 212 and the second electrode 213 of the light emitting element 21 face the connection trace 30 and are electrically connected to the connection trace 30. In two adjacent light emitting elements 21 located in the same row, a first electrode 212 of one of the light emitting elements 21 and a second electrode 213 of the other light emitting element 21 are electrically connected by the first connection portion 31.
In this step, a bulk transfer process may be used to transfer the plurality of light emitting elements 21 to the side of the connection trace 30 facing away from the substrate 10, and the first electrode 212 and the second electrode 213 of the light emitting element 21 may be electrically connected to the connection trace 30 by metal bonding and/or ACF bonding.
Subsequently, a plurality of through holes penetrating the substrate are formed, and the orthographic projection of one through hole on the substrate is at least partially overlapped with the orthographic projection of one conductive part on the substrate.
And then, forming a conductive structure in the through hole and a plurality of conductive pads on one side of the conductive structure away from the light-emitting element, wherein the conductive pads are electrically connected with the conductive part through the conductive structure.
In one embodiment, the method of preparing further comprises: an insulating protective layer is formed on the side of the light-emitting element 21 facing away from the substrate 10, the insulating protective layer covering the light-emitting element 21.
The step of forming the insulating protection layer may be performed before the step of forming the conductive structure in the through hole and the plurality of conductive pads on the side of the conductive structure facing away from the light emitting element, or may be performed after the step of forming the conductive structure in the through hole and the plurality of conductive pads on the side of the conductive structure facing away from the light emitting element.
In one embodiment, before the forming of the plurality of through holes through the substrate, the preparing method may further include: and thinning and polishing the side of the substrate away from the light-emitting element. Thinning may be performed using a grinding process.
After the insulating protection layer, the conductive pad and the conductive structure are formed, a seventh intermediate structure is obtained, and the seventh intermediate structure is cut, so that the light emitting chips shown in fig. 3 and fig. 4 can be obtained, wherein each light emitting chip comprises a light emitting unit group.
As shown in fig. 3 and 4, the through holes 11 on the substrate 10 and the conductive portions 50 may be in one-to-one correspondence, and the orthographic projections of the through holes 11 on the conductive portions 50 all fall on the corresponding conductive portions 50; the conductive pads 40 are in one-to-one correspondence with the through holes 11, the orthographic projection of the conductive pads 40 on the substrate covers the corresponding through holes 11, and the conductive pads 40 are connected with the conductive structures 90 in the corresponding through holes 11.
The light emitting chip and the preparation method of the light emitting chip provided by the embodiment of the application belong to the same inventive concept, and descriptions of related details and beneficial effects can be referred to each other, and are not repeated.
The embodiment of the application also provides a light-emitting substrate, which comprises a light-emitting layer, wherein the light-emitting layer comprises a plurality of the light-emitting chips in any one of the embodiments, and the light-emitting chips are arranged in an array.
The light-emitting substrate further comprises a driving backboard, the driving backboard is located at one side of the light-emitting chip, and the driving backboard is located at one side of the substrate 10 far away from the light-emitting surface of the light-emitting element 21. The driving backboard comprises a plurality of pixel circuits and signal wires, and the pixel circuits and the signal wires are electrically connected with the conductive pads of the light-emitting chip.
In the present application, several light-emitting substrates were tested, and the results obtained on the premise that the brightness of the light-emitting substrates was uniform are shown in table 1 below. Wherein, the chip 1 is a conventional light-emitting chip (only comprising one light-emitting element), the chip 2 is a light-emitting chip comprising a plurality of Micro LEDs, and the chip 3 is a light-emitting chip provided by the embodiment of the application; the red current means an operating current of a light emitting element whose light emission color is red, the green current means an operating current of a light emitting element whose light emission color is green, and the blue current means an operating current of a light emitting element whose light emission color is blue; the power consumption refers to the power consumption of the light-emitting substrate, and the driving back plate power consumption ratio refers to the ratio of the power consumption of the driving back plate in the light-emitting substrate in the total power consumption of the light-emitting substrate.
TABLE 1
As can be seen from table 1, compared with the other two light-emitting substrates, the power consumption of the light-emitting chip provided by the embodiment of the application is lower, and the power consumption ratio of the driving backboard of the light-emitting substrate where the light-emitting chip is located is significantly reduced.
The embodiment of the application also provides a display device which comprises the light-emitting substrate.
In some embodiments, the display device may be a liquid crystal display device, which includes a liquid crystal panel and a backlight disposed on a non-display side of the liquid crystal panel, the backlight including the light-emitting substrate described above.
In another embodiment, the light emitting substrate in the display device is used as a display substrate. When the light-emitting substrate is used as a display substrate, each light-emitting chip is used as one sub-pixel.
The display device may be any suitable display device including, but not limited to, a cell phone, tablet, television, display, notebook, digital photo frame, navigator, electronic book, and any product or component having a display function.
It is noted that in the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Moreover, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may be present. In addition, it will be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intervening layer or element may also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (18)
1. A light emitting chip, the light emitting chip comprising:
A substrate;
at least two light emitting units on the substrate, the light emitting units including at least two light emitting elements having different light emitting colors;
A plurality of connection traces and a plurality of conductive pads on the substrate; in the at least two light emitting units, light emitting elements with the same light emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad.
2. The light-emitting chip according to claim 1, wherein the at least two light-emitting units are arranged at intervals in a row direction; the light emitting elements with the same light emitting color are positioned in the same row in the at least two light emitting units; the light emitting elements of the same light emitting unit are located in the same column.
3. The light-emitting chip according to claim 2, wherein the light-emitting element includes a first electrode and a second electrode, and wherein the first electrode of one of the light-emitting elements and the second electrode of the other light-emitting element are located on the same side in two adjacent light-emitting elements which are located on the same row.
4. The light emitting chip of claim 2, wherein the connection trace comprises a first connection portion, a second connection portion, and a third connection portion; in two adjacent light emitting elements positioned in the same row, a first electrode of one light emitting element and a second electrode of the other light emitting element are electrically connected through the first connecting part; one end of the second connecting part is connected to one conductive pad, and the other end is connected to a first electrode of one light-emitting element; one end of the third connecting part is connected to one conductive pad, and the other end is connected to a second electrode of one light-emitting element;
the third connecting portions of at least two of the connecting traces are connected to the same conductive pad.
5. The light-emitting chip according to claim 4, wherein the light-emitting unit includes light-emitting elements of N light-emitting colors, and the number of the conductive pads is greater than or equal to n+1.
6. The light emitting chip of claim 4, wherein the third connection portion of each of the connection traces is connected to the same conductive pad.
7. The light emitting chip of claim 1, wherein the plurality of conductive pads are arranged in two columns, the two columns of conductive pads being located on opposite sides of the at least two light emitting cells;
Or the plurality of conductive pads are arranged in two rows, and the two rows of conductive pads are positioned on two opposite sides of the at least two light-emitting units.
8. The light emitting chip of claim 1, wherein the conductive pad is located on a side of the connection trace facing away from the light emitting element, the light emitting chip further comprising a plurality of conductive portions disposed on a same layer as the connection trace, the conductive portions having a width greater than a width of the connection trace; one conductive pad is connected with one conductive part, and two ends of the connecting wire are respectively connected to one conductive part; an orthographic projection of one of the conductive pads on the substrate at least partially coincides with an orthographic projection of one of the conductive portions on the substrate.
9. The light emitting chip of claim 1, wherein the connection trace is located on a side of the light emitting element facing away from the substrate; the light-emitting chip further comprises a planarization layer, wherein the planarization layer is positioned between the connecting wire and the substrate, and the light-emitting element comprises a body part, and a first electrode and a second electrode which are arranged on one side of the body part, which is away from the substrate; the surface of the body portion facing away from the substrate is substantially the same distance from the substrate as the surface of the planarizing layer facing away from the substrate.
10. The light-emitting chip according to claim 9, wherein the planarizing layer is a transparent film layer or a light-adjusting film layer.
11. The light-emitting chip according to claim 1, wherein the connection wiring is located on a side of the light-emitting element facing the substrate; the substrate is provided with a plurality of through holes, a conductive structure is arranged in each through hole, the conductive pad is positioned on one side of the substrate, which is away from the light-emitting element, and the conductive pad is electrically connected with the connecting wiring through the conductive structure.
12. The light emitting chip of claim 1, wherein the light emitting element is a Mini LED or a Micro LED.
13. A light-emitting substrate, characterized in that the light-emitting substrate comprises a plurality of light-emitting chips according to any one of claims 1 to 12 and signal wirings connected to the light-emitting chips, and the plurality of light-emitting chips are arranged in an array.
14. A display device comprising the light-emitting substrate according to claim 13.
15. A method of manufacturing a light emitting chip, the method comprising:
Providing a substrate;
Transferring a plurality of light emitting elements onto the substrate, and forming a plurality of connection traces and a plurality of conductive pads on the substrate; the plurality of light emitting elements are divided into a plurality of light emitting unit groups including at least two light emitting units including at least two light emitting elements having different light emitting colors; in the same light-emitting unit group, light-emitting elements with the same light-emitting color are connected in series through the connecting wires, one end of each connecting wire is connected to one conductive pad, and the other end of each connecting wire is connected to one conductive pad.
16. The method of manufacturing a light emitting chip as set forth in claim 15, wherein transferring the plurality of light emitting elements onto the substrate and forming a plurality of connection traces and a plurality of conductive pads on the substrate includes:
transferring a plurality of light emitting elements onto the substrate;
Forming a plurality of connecting wires and a plurality of conductive parts which are positioned on the same layer on one side of the light-emitting element, which is away from the substrate, wherein two ends of the connecting wires are respectively connected to one conductive part;
And forming a plurality of conductive pads on one side of the conductive part, which is away from the substrate, wherein the orthographic projection of one conductive pad on the substrate is at least partially overlapped with the orthographic projection of one conductive part on the substrate.
17. The method of manufacturing a light-emitting chip according to claim 15, wherein the light-emitting element includes a body portion, and a first electrode and a second electrode provided on a side of the body portion facing away from the substrate; before the plurality of connection wirings and the plurality of conductive parts are formed on the same layer on the side, away from the substrate, of the light-emitting element, the preparation method further comprises:
A planarization layer is formed on the substrate, the planarization layer facing away from the surface of the substrate and being substantially the same distance from the surface of the body portion facing toward the substrate.
18. The method of manufacturing a light-emitting chip according to claim 15, wherein the light-emitting element includes a body portion, and a first electrode and a second electrode provided on a side of the body portion facing away from the substrate; the transferring the plurality of light emitting elements onto the substrate and forming a plurality of connection traces and a plurality of conductive pads on the substrate includes:
Forming a plurality of connecting wires and a plurality of conductive parts on the same layer on the substrate; two ends of the connecting wire are respectively connected to one conductive part;
transferring a plurality of light emitting elements to one side of the connecting wire away from the substrate, wherein the first electrode and the second electrode are respectively and electrically connected with the connecting wire;
forming a plurality of through holes penetrating through the substrate, wherein the orthographic projection of one through hole on the substrate is at least partially overlapped with the orthographic projection of one conductive part on the substrate;
And forming a conductive structure in the through hole and a plurality of conductive pads on one side of the conductive structure away from the light-emitting element, wherein the conductive pads are electrically connected with the conductive part through the conductive structure.
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| CN202211542806.4A CN118173694A (en) | 2022-12-02 | 2022-12-02 | Light-emitting chip, preparation method thereof, light-emitting substrate and display device |
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| CN202211542806.4A CN118173694A (en) | 2022-12-02 | 2022-12-02 | Light-emitting chip, preparation method thereof, light-emitting substrate and display device |
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