CN118197971A - Automatic packaging equipment and automatic packaging method for bar overlapping array - Google Patents

Abstract

The invention provides an automatic packaging device and an automatic packaging method for a bar laminated array, wherein the automatic packaging device for the bar laminated array comprises: the equipment comprises pre-assembly equipment, packaging equipment, a sintering platform and transfer equipment, wherein the pre-assembly equipment at least comprises two groups of pre-assembly stations, and the pre-assembly stations comprise: the pre-assembly device can complete the pre-assembly of the bar stacking array; the packaging equipment at least comprises two groups of packaging stations, and the packaging stations comprise: the packaging equipment can complete packaging of the bar stacking array; the sintering platform bears and fixes the pre-assembled component and the packaging component of the bar array; the transfer equipment at least comprises three groups of transfer devices, the pre-assembled components and the packaging components are transferred between the pre-assembled equipment and the packaging equipment along with the sintering platform, so that the production efficiency and the productivity are improved, and the consistency of products is improved.

Description

Automatic packaging equipment and automatic packaging method for bar overlapping array

Technical Field

The invention relates to the technical field of semiconductor devices, in particular to automatic packaging equipment and an automatic packaging method for a bar stacked array.

Background

The bar chip packaging needs to be packaged twice to form a bar stacked array, at present, the first packaging is carried out by manually assembling the bar and related components of the first packaging, the bar stacked array is placed in a reflow device for sintering, the second packaging needs to combine a semi-finished product obtained by the first packaging with related components of the second packaging, the second welding packaging is carried out by manually welding or manually placing the semi-finished product into the reflow device, and the two packaging needs manual operation. The existing improved technology of the bar stacked array packaging is mainly to change the process flow, parameters or optimize the tooling jig, manual operation is still reserved, however, the manual operation efficiency is low, the productivity is low, and the consistency of products is poor.

Disclosure of Invention

The invention aims to provide automatic packaging equipment and an automatic packaging method for a bar laminated array, which are used for solving the problems that manual operation is needed for packaging the bar laminated array, the efficiency is low, the productivity is low and the consistency of products is poor.

In a first aspect, the present invention provides an automated packaging apparatus for a bar code array, comprising: pre-assembly equipment, packaging equipment, a sintering platform and transfer equipment,

The pre-assembly equipment at least comprises two groups of pre-assembly stations, and the pre-assembly stations comprise: the pre-assembly bridge frame supports and fixes the pre-assembly conveying device, the grabbing mechanical device and the alignment mechanical device, and the pre-assembly equipment can complete pre-assembly of the bar stacking array;

the packaging equipment at least comprises two groups of packaging stations, and the packaging stations comprise: the packaging device comprises a packaging bridge, a packaging conveying device and a reflow cavity, wherein the packaging bridge supports and fixes the packaging conveying device and the reflow cavity, and packaging equipment can complete packaging of the bar array;

the sintering platform bears and fixes the pre-assembled component and the packaging component of the bar array;

the transfer equipment at least comprises three groups of transfer devices, and the transfer devices transfer the sintering platform between the adjacent pre-assembly stations and the packaging stations.

Further, the preassembling equipment at least comprises a first preassembling station and a second preassembling station, wherein the first preassembling station is used for completing the preassembling of the first package of the bar array, and the second preassembling station is used for completing the preassembling of the second package of the bar array;

The packaging equipment at least comprises a first packaging station and a second packaging station, wherein the first packaging station is used for finishing the first packaging of the bar stacking array, and the second packaging station is used for finishing the second packaging of the bar stacking array;

the automatic packaging equipment of the bar stacking array is sequentially provided with a first preassembling station, a first transferring device, a first packaging station, a second transferring device, a second preassembling station, a third transferring device and a second packaging station.

Further, the sintering platform at least comprises a first sintering platform and a second sintering platform, the first sintering platform comprises a plurality of concave parts, the concave parts are used for placing a sintering jig, the sintering jig comprises an inclined sintering table top and a plurality of positioning sheets, and the sintering jig is used for placing a preassembled component of the bar stacked array for the first time;

The first preassembling component of the bar stacking array comprises a bar chip, a heat sink, a weight block and a first welding sheet;

the second sintering platform is provided with a plurality of positioning grooves, the positioning grooves are used for positioning and placing the second preassembling component of the bar laminated array, and the second preassembling component of the bar laminated array comprises a first packaging piece of the bar laminated array, a secondary heat sink, an insulating substrate and a second soldering lug.

Further, the transfer device comprises a double-shaft mechanical arm and a bracket, wherein the double-shaft mechanical arm is provided with two groups of driving components, and one group of driving components comprises an X-axis driving arm fixed with the bracket and an X-axis driving cylinder for driving the X-axis driving arm to move along the X-axis direction;

the other group of driving components comprises a Z-axis driving arm connected with the X-axis driving arm and a Z-axis driving cylinder for driving the Z-axis driving arm to lift along the Z axis.

Further, the reflow cavity comprises a vacuumizing system, a heating system and a gas control system, and the heating system comprises a heating module and a temperature control module.

Further, the left side and the right side of the reflux cavity along the X-axis direction are respectively provided with a transfer door and a conveying door;

the sintering platform is transported to the transport position of the reflow cavity by the transport device, and the transport door is automatically closed after the sintering platform ascends from the transport position to the working position in the reflow cavity; the conveying door is automatically opened after the preassembled component carried by the sintering platform descends from the working position to the conveying position after the preassembled component finishes reflow packaging, and the packaging conveying device conveys the sintering platform out of the reflow cavity.

Further, the starting end of the short side of the first preassembly station along the Y-axis direction is respectively provided with a heat sink tray for storing the heat sink, a bar tray for storing the bar chip, a first soldering lug tray for storing the first soldering lug and a first weight block tray for storing the weight block.

Further, one side or two sides of the long side of the second preassembling station along the X-axis direction are respectively provided with a secondary heat sink tray, a second soldering lug tray, an insulating substrate tray, a first packaging piece tray and a second weight tray, wherein the secondary heat sink tray is used for storing the secondary heat sink, the second soldering lug tray is used for storing the second soldering lug, the insulating substrate tray is used for storing the insulating substrate, and the first packaging piece tray and the second weight tray are used for pressing the second weight.

Further, the second preassembling station at least comprises two grabbing mechanical devices, and the two grabbing mechanical devices are located on one side or two sides of the long side of the second preassembling station along the X-axis direction so as to grab the second preassembling component.

Further, the transfer device comprises a double-shaft mechanical arm and a bracket, the bracket comprises a positioning protrusion, and the sintering platform comprises a positioning hole, so that the positioning protrusion is inserted into the positioning hole, and the sintering platform is lifted from the previous station along the X direction and transferred to the next station by virtue of the transfer device; wherein the last station is a pre-assembly station, and the next station is a packaging station; or the last station is a packaging station, and the next station is a preassembling station.

In a second aspect, the present invention provides an automated packaging method for a bar stacked array, where the method adopts the automated packaging device for a bar stacked array, and the method includes:

the first step, the grabbing mechanical device on the preassembling station places the preassembled components of the bar stacking array on the sintering platform, and the aligning mechanical device performs fine alignment on the preassembled components placed on the sintering platform;

Step two: starting the preassembly conveying device to convey the loaded sintering platform to the tail end of the preassembly station along the X direction;

Step three: starting the transferring device to transfer the sintering platform from the preassembling station to the packaging station;

Step four: after the sintering platform is transferred to the reflow cavity of the packaging station, the reflow cavity starts a high-temperature program to complete packaging of the bar stacking array, and then the packaging conveying device conveys the packaged sintering platform to the tail end of the packaging station along the X direction;

Step five: starting the transferring device to transfer the sintering platform from the packaging station to the preassembling station; and circularly executing the first step to the fourth step until the packaging process of the bar laminated array is finished.

Further, the preassembling equipment at least comprises a first preassembling station and a second preassembling station; the packaging equipment at least comprises a first packaging station and a second packaging station;

The first preassembly station comprises: the device comprises a first preassembled bridge, a first preassembled conveying device, a first grabbing mechanical device and a first alignment mechanical device;

the second preassembly station comprises: the second preassembled bridge frame, the second preassembled conveying device, the second grabbing mechanical device, the third grabbing mechanical device and the second alignment mechanical device;

The first encapsulation station comprises: the first packaging bridge, the first packaging conveying device and the first reflow cavity;

the second encapsulation station comprises: the second packaging bridge, the second packaging conveying device and the second reflow cavity are arranged in the first packaging bridge;

The transfer device comprises a first transfer device positioned between a first preassembling station and a first packaging station, a second transfer device positioned between the first packaging station and a second preassembling station, and a third transfer device positioned between the second preassembling station and the second packaging station;

The sintering platform at least comprises a first sintering platform and a second sintering platform;

the automatic packaging method of the bar stacking array comprises the following steps:

The first step comprises the following steps: s11, arranging a heat sink tray stored with a heat sink, a bar tray stored with a bar chip, a first soldering lug tray stored with a first soldering lug and a first weight block tray stored with a weight block at the starting end of the first preassembled bridge along the X direction;

Step S12, sequentially grabbing the heat sink, the first welding lug, the bar chip, the first welding lug, the heat sink and the weight block on the first preassembling station by using the first grabbing mechanical device to form a first preassembling assembly, and sequentially placing the heat sink, the first welding lug, the bar chip, the first welding lug, the heat sink and the weight block on a first sintering platform from bottom to top in sequence;

Step S13, using the first alignment mechanical device to finely position each assembly when the first preassembled assembly is placed in sequence according to the sequence of the heat sink, the first soldering lug, the bar chip, the first soldering lug, the heat sink and the weight;

The second step comprises: step S21: starting the first preassembly conveying device to convey the first sintering platform to the tail end of the first preassembly station along the X direction;

The third step comprises: step S31: and transferring the first sintering platform into the first reflow cavity of the first packaging station by using the first transferring device.

Further, the left side and the right side of the first backflow cavity along the X-axis direction are respectively provided with a first transfer door and a first conveying door;

An automated packaging method for a bar code array, comprising the following steps:

the fourth step comprises: step 41, after the first sintering platform is transferred to a conveying position of a first backflow cavity of the first packaging station, the first backflow cavity ascends the first sintering platform from the conveying position to a working position, and the first transfer door of the first backflow cavity is automatically closed after the first transfer device exits;

Step S42: the first reflow cavity is automatically vacuumized and heated, and the first preassembled component of the bar array is welded into a first packaging piece through reflow soldering;

Step S43: the first reflow cavity is cooled, the first conveying door automatically opens the first sintering platform loaded with the first packaging piece after the first reflow cavity descends from a working position to a conveying position, and the first sintering platform is conveyed to the tail end of a first packaging station along the X direction through the first packaging conveying device;

the fifth step comprises: step S51: the second transferring device transfers the first sintering platform to a second preassembling and conveying device of the second preassembling station.

Further, the first step includes: step S14: placing a first package tray, a second weight tray, a second soldering lug tray storing a second soldering lug, a secondary heat sink tray storing a secondary heat sink, and an insulating substrate tray storing an insulating substrate on two sides of the second preassembled bridge along the X direction;

step S15: the second grabbing mechanical device is utilized to take down the weight block on the first sintering platform and place the weight block on the second weight block tray;

step S16: taking down the first package on the first sintering platform and placing the first package on the first package tray by using the second grabbing mechanical device;

step S17: placing a second sintering platform on the second preassembly conveyor of the second preassembly station;

Step S18: sequentially grabbing the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece by using the second grabbing mechanical device and the third grabbing mechanical device, and placing the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece on the second sintering platform in sequence;

step S19: using a second alignment mechanism to finely position each component when sequentially placing a second pre-assembled component in the order of the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece;

the second step comprises: step S22: starting the second preassembly conveying device to convey the second sintering platform to the tail end of the second preassembly station along the X direction;

the third step comprises: step S32: and transferring the second sintering platform to a second reflow cavity of the second packaging station by using the third transferring device.

Further, the left side and the right side of the second reflux cavity along the X-axis direction are respectively provided with a second transfer door and a second conveying door;

An automated packaging method for a bar code array, comprising the following steps:

The fourth step comprises: step S45, after the second sintering platform is transferred to a conveying position of a second reflow cavity of the second packaging station, the second reflow cavity ascends the second sintering platform from the conveying position to a working position, and a second transfer door of the second reflow cavity is automatically closed after a third transfer device exits;

step S46: the second reflow cavity is automatically vacuumized and heated, and the second preassembled component of the bar array is welded into a second packaging piece through reflow soldering;

Step S47: the second reflow cavity is cooled, the second conveying door is automatically opened after the second reflow cavity descends to a conveying position on the second sintering platform carrying the second packaging piece, and the second packaging piece is conveyed to the tail end of the second packaging station along the X direction through the second packaging conveying device.

The automatic packaging equipment and the automatic packaging method for the bar overlapping array provided by the invention have at least the following advantages or beneficial effects: the automatic packaging equipment at least comprises two groups of preassembling stations and two groups of packaging stations, so that the requirement that the bar chip array needs to be packaged for multiple times can be met, and the bar chip array can be automatically preassembled and packaged for multiple times; and by means of the sintering platform and the transferring equipment, transfer and conveying of the bar chips between the pre-assembly station and the packaging station are realized, so that automatic packaging of the bar chip stacking array is realized, and the consistency of products is improved.

Furthermore, the automatic packaging equipment for the bar chip provided by the invention is provided with a first pre-assembly station, a first packaging station, a second pre-assembly station and a second packaging station, wherein the first pre-assembly station can automatically complete pre-assembly of the first package of the bar chip, the high-precision alignment mechanical device is combined with a sintering jig of a first sintering platform to position and fix the heat sink, the first soldering lug, the bar chip and the weight block component with high precision, the first packaging station can automatically complete first reflow package of the bar chip to form a first package part, the second pre-assembly station can automatically complete pre-assembly of the second package of the bar chip, the high-precision alignment mechanical device is combined with the second sintering platform to position the secondary heat sink, the second soldering lug, the insulating substrate and the first package part with high precision, and the second packaging station can automatically complete second reflow package of the bar chip to form a second package part. The automatic packaging equipment for the bar chips can realize automatic packaging of the bar stacking array by means of the four stations and the transferring equipment positioned among the four stations, so that the production efficiency is improved, the productivity is improved, and the consistency of products is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a bar code stacked automatic packaging device;

FIG. 2 is a block diagram of a first preassembly station;

FIG. 3 is an enlarged view of a portion of the first preassembly station;

FIG. 4 is a left rear side view of the first encapsulation station;

FIG. 5 is a right rear side view of the first encapsulation station;

FIG. 6 is a diagram of a second preassembly station;

FIG. 7 is an enlarged view of a portion of the second preassembly station;

FIG. 8 is a front side elevational view of the second encapsulation station;

FIG. 9 is a rear side elevational view of the second encapsulation station;

FIG. 10 is a first transfer device diagram;

FIG. 11 is a view showing a structure of a first sintering platform and a first bracket;

FIG. 12 is a diagram of a sintering jig structure;

Icon: 1-a first preassembly station; 2-a first encapsulation station; 3-a second preassembly station; 4-a second encapsulation station; 5-a first transfer device; 51-a first bracket; 511-a first positioning protrusion; 6-a second transfer device; 61-a second bracket; 7-a third transfer device; 71-a third bracket;

11-a first pre-assembled bridge; 12-a first preassembled conveyor; 13-a first alignment mechanism; 14-a first gripping mechanism; 15-a first sintering stage; 151-sintering jig; 152-tilting the sintering table; 153-first positioning piece; 154-a second spacer; 155-a third positioning piece; 156-a first positioning hole; 161-a first weight tray; 162-weight block; 17-a heatsink tray; 171-heat sink; 18-bar tray; 181-bar chip; 182-first preassembly of components; 19-a first tab tray; 191-first soldering lug;

21-a first package bridge; 22-first package conveyance means; 23-a first reflow chamber; 231-a first transfer gate; 232-a first heat sink grill; 233-a first transfer gate;

31-a second pre-assembled bridge; 32-a second preassembled conveyor; 331-a second grasping mechanism; 332-a third grasping mechanism; 34-a second alignment mechanism; 35-a second sintering stage; 36-a secondary heatsink tray; 361-a secondary heat sink; 37-insulating base tray; 371-an insulating substrate; 38-a second tab tray; 381-second tab; 39-a first package tray; 391-first package; 163-a second weight tray;

41-a second packaging bridge; 42-a second package conveyance device; 43-a second reflow chamber; 431-a second transfer gate; 432-a second heat sink grill; 433-a second transfer gate; 44-second preassembly of the assembly.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings and specific implementations of the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In a first aspect, the present invention provides an automated packaging apparatus for a bar code array, comprising: the equipment of preassembling, encapsulation equipment, sintering platform, transfer equipment, the equipment of preassembling includes two sets of station of preassembling at least, and the station of preassembling includes: the pre-assembly device can complete the pre-assembly of the bar stacked array; the encapsulation equipment includes two sets of encapsulation stations at least, and the encapsulation station includes: the packaging bridge supports and fixes the packaging conveying device and the reflow cavity, and packaging equipment can complete packaging of the bar stacked array; the sintering platform bears a pre-assembled component and a packaging component for fixing the bar overlapping array; the transfer equipment at least comprises three groups of transfer devices, and the transfer devices transfer the sintering platform between the adjacent pre-assembly stations and the packaging stations.

In a second aspect, specifically, as shown in fig. 1 and fig. 2, an automated packaging device for a bar stacked array provided by the present invention includes: the first preassembling station 1, the first preassembling station 1 is used for completing the preassembling of the first packaging of the bar chip, the first preassembling station 1 comprises a first preassembling bridge frame 11, a first preassembling conveying device 12, a first aligning mechanical device 13 and a first grabbing mechanical device 14, the first preassembling bridge frame 11 can support and fix the first preassembling conveying device 12, the first aligning mechanical device 13 and the first grabbing mechanical device 14, the first aligning mechanical device 13 is located on one side of a long axis of the first preassembling bridge frame 11, the first grabbing mechanical device 14 is located on the other side of the long axis of the first preassembling bridge frame 11, and in addition, the X direction is the flow packaging direction of the bar stacked array.

As shown in fig. 2 and 3, the starting end of the short side of the first preassembled bridge 11 along the Y-axis direction may be used to place the first weight tray 161 storing the weight 162, the heat sink tray 17 storing the heat sink 171, the bar tray 18 storing the bar chip 181, and the first tab tray 19 storing the first tab 191, and the tray may have a recess with a certain size for storing and positioning components with a corresponding size, where the heat sink 171 is used to conduct heat and dissipate the heat to the bar chip 181, plays a structural supporting role to the bar chip 181 and may be used as an electrode, the heat sink 171 may use WuCu heat sinks with good heat dissipation, but is not limited to WuCu heat sinks may be other conductive materials with good heat dissipation, the first tab 191 may be AuSn alloy sheets with a certain proportion, and be used to connect the heat sink 171 and the bar chip 181 together by a high temperature during reflow soldering, and the weight tray 162 is used to apply a certain pressure to the structure of the bar chip during the automatic reflow soldering, thereby helping to provide quality and efficiency of the stacked heat sink.

The first grabbing mechanical device 14 may be a middle-high precision mechanical arm, and is used for grabbing related components of the transfer heat sink 171, the bar chip 181, the first soldering lug 191, and the weight block 162, and placing the components in the sintering fixture 151 in the first sintering platform 15 in sequence. The first alignment mechanism 13 may be a high-precision mechanical arm, and is used to perform high-precision alignment on the related components during the process of placing the components on the sintering fixture 151.

As shown in fig. 2 and 12, the first sintering platform 15 is placed on the first preassembly conveyor 12, and the first sintering platform 15 has a plurality of recesses therein, and the recesses have precisely arranged sintering jigs 151 therein.

The sintering jig 151 has an inclined sintering table 152 and a plurality of positioning pieces, which are made of high-precision polished silicon wafers. The positioning sheets include a first positioning sheet 153, a second positioning sheet 154, and a third positioning sheet 155. Wherein the first positioning piece 153 is placed on the side of the platform of the sintering jig 151, and plays a role in positioning the side of the first preassembly component 182; the second positioning sheet 154 is placed on the opposite side of the inclined sintering table 152 and functions to position the lowest component of the first preassembled component 182, i.e., the heat sink; the third positioning tabs 155 are placed on the inclined sintering table 152 and function to position the various components of the first pre-assembly 182; the three positioning sheets play a role in placing and fixing the alignment bar stacking array first preassembling component 182, and the silicon wafer with high flatness is used as a part directly contacted with the bar stacking array first packaging component, so that the preassembling consistency and accuracy can be ensured. Each assembly of the first encapsulation of the bar stacked array is placed on the inclined sintering table in sequence, and the inclined placement can tightly attach each part to the silicon wafer by utilizing the self gravity of each part assembly without adding extra weight and pressure. The sintering jig 151 can be used for aligning and fixing components placed in sequence, and the first sintering platform 15 is used as a conveying carrier and a sintering platform during reflow and is made of a high-heat-conductivity material so as to facilitate heat conduction.

The first preassembled conveyor 12 is used for transferring sintering platforms, objects and the like, and a transmission device thereof comprises a stepping motor and a PLC module, so that the stepping, the transmission distance, the residence time and the like can be freely set.

The first preassembling station 1 can realize the preassembling of the first package of the bar stacked array, and sequentially place the heat sink 171, the first soldering lug 191, the bar chip 181, the first soldering lug 191, the heat sink 171 and the weight block 162 in the sintering jig 151 of the first sintering platform 15, and the first preassembling and conveying device 12 transfers the loaded first sintering platform 15 to the tail end of the first preassembling station 1.

As shown in fig. 4, the automated packaging device for a bar code array further comprises: the first encapsulation station 2, the first encapsulation station 2 is used for realizing the first reflow encapsulation of the bar stacked array, and the first encapsulation station 2 comprises: the first package bridge 21, the first package conveying device 22 and the first reflow cavity 23, wherein the first package bridge 21 plays a role of fixedly supporting the first package conveying device 22 and the first reflow cavity 23.

As shown in fig. 10, the first transferring device 5 is further included, the first transferring device 5 includes a dual-shaft mechanical arm and a first bracket 51, the first transferring device 5 is located between the first pre-assembly station 1 and the first packaging station 2, the dual-shaft mechanical arm includes two groups of driving components, one group of driving components includes an X-axis driving arm fixed with the first bracket 51, an X-axis driving cylinder for driving the X-axis driving arm to move along the X-axis direction, and the other group of driving components includes a Z-axis driving arm connected with the X-axis driving arm, and a Z-axis driving cylinder for driving the Z-axis driving arm to lift along the Z-axis.

In addition, as shown in fig. 11, a first positioning hole 156 for facilitating transfer of the turnover assembly is designed on the first sintering platform 15, and the first positioning hole 156 is distributed on the right side of the first sintering platform 15 along the X direction, so that transfer equipment can conveniently transfer by using the positioning hole. The first bracket 51 has a first positioning protrusion 511 on the left side in the X direction, which can be inserted into a first positioning hole 156 of the first sintering stage 15, so as to transfer the first sintering stage 15 from the first preassembly station 1 to the first encapsulation station 2.

When rotating, after the first positioning protrusion 511 of the first bracket 51 is inserted into the first positioning hole 156 of the first sintering platform 15, the first transferring device 5 lifts the first bracket 51 to a certain height, horizontally moves to the next station, and then descends to be placed at a corresponding preset position, so that the first sintering platform 15 is transferred to the preset position of the first packaging station 2.

The first reflow cavity 23 comprises a first vacuumizing system, a first heating system and a first gas control system, wherein the vacuumizing system can vacuumize to remove oxygen in the cavity, so that the reflow soldering of the product is completed in an anaerobic environment; the first heating system comprises a heating module and a temperature control module, wherein the heating module can quickly heat to a process temperature of about 280 ℃ to ensure that the solder is fully melted; the temperature control module can ensure that the heating device provides a heat source according to a preset process temperature curve; the first gas control module can provide inert gases such as nitrogen, hydrogen and the like or reducing gases during the reflow soldering process so as to ensure that the solder is not oxidized during the reflow process. As shown in fig. 4 and 5, the first reflow chamber 23 further includes a first transfer door 231, a first heat dissipation grille 232, and a first conveying door 233, where the first transfer door 231 and the first conveying door 233 are distributed on the left and right sides of the first reflow chamber 23 along the X-axis direction, and the widths of the first transfer door 231 and the first conveying door 233 are expanded along the Y-axis direction; in addition, the first heat dissipation grille 232 can dissipate heat of the first reflow chamber 23, which is beneficial to maintaining the first reflow chamber 23. After the first transferring device 5 places the loaded first sintering platform 15 at the conveying position of the first reflow chamber 23, the first reflow chamber 23 internally lifts the first sintering platform 15 from the conveying position to the working position, and simultaneously the first transferring device 5 is retracted to the initial position, and then the first transferring door 231 of the first reflow chamber 23 is automatically closed. The first reflow chamber 23 start-up procedure is completed in sequence: vacuumizing, introducing inert gas, heating, preserving heat, cooling, introducing compressed gas and blanking, so that the first reflow packaging of the bar stacked array is realized to form a first packaging piece with a heat sink, a bar chip and a heat sink. The first reflow chamber 23 then lowers the first sintering station 15 internally from the working position to the transport position, and the first encapsulation transport 22 transports the first encapsulation along with the first sintering station 15 out of the first reflow chamber 23 and to the end of the first encapsulation station 2.

As shown in fig. 6, the automated packaging device for a bar code array further comprises: the second preassembling station 3, the second preassembling station 3 can automatically realize the preassembling of the second packaging of the bar stacking array, and the second preassembling station 3 comprises: the second preassembled bridge 31, the second preassembled conveying device 32, the second grabbing mechanical device 331, the third grabbing mechanical device 332 and the second aligning mechanical device 34, wherein the second preassembled bridge 31 plays a role in supporting and fixing the second preassembled conveying device 32, the second grabbing mechanical device 331, the third grabbing mechanical device 332 and the second aligning mechanical device 34, the second grabbing mechanical device 331 and the third grabbing mechanical device 332 are located on one side of the long axis of the second preassembled bridge 31, and the second aligning mechanical device 34 is located on the other side of the long axis of the second preassembled bridge 31. It will be appreciated that the second gripping mechanism 331 and the third gripping mechanism 332 may also be disposed on different sides of the long axis of the second preassembled bridge 31.

The automatic packaging equipment of the bar stacking array further comprises a second transfer device 6, the second transfer device 6 comprises a double-shaft mechanical arm and a second bracket 61, wherein the second transfer device 6 is positioned between the first packaging station 2 and the second preassembling station 3, the double-shaft mechanical arm is provided with two groups of driving components, one group of driving components comprises an X-axis driving arm fixed with the second bracket 61 and an X-axis driving cylinder for driving the X-axis driving arm to move along the X-axis direction, and the other group of driving components comprises a Z-axis driving arm connected with the X-axis driving arm and a Z-axis driving cylinder for driving the Z-axis driving arm to lift along the Z-axis. After the first sintering platform 15 loaded with the first package is transferred to the end of the first packaging station 2, the second transfer device 6 moves the horizontal shaft, and the positioning protrusion of the second bracket 61 fixed with the horizontal shaft is inserted into the first positioning hole 156 of the first sintering platform 15, so that the matching is completed. Continuing to move the vertical and horizontal axes, the first sintering stage 15 is transferred to the preset position of the second preassembly station 3.

As shown in fig. 7, one side or two sides of the long side of the second preassembled bridge 31 along the X-axis direction are respectively provided with a secondary heat sink tray 36 storing a secondary heat sink 361, an insulating substrate tray 37 storing an insulating substrate 371, a second soldering lug tray 38 storing a second soldering lug 381, a first package tray 39 and a second weight tray 163, wherein the trays are provided with a concave with a certain specification size for storing, positioning, placing and transferring components with corresponding specifications, a waterway is arranged in the secondary heat sink 361 for overall heat dissipation and structural connection of the bar stacked array, a marking point or a limiting area is arranged above the secondary heat sink, namely, a surface contacted with the second sub-package component is provided with a marking point or a limiting area, the insulating substrate 371 and the secondary heat sink 361 are welded to play a role of transition and heat dissipation, and the first package 391 is an output of the bar stacked array after the first package is completed; the second bonding pad 381 may be a SAC bonding pad, in which Sn, ag, and Cu are alloy bonding pads made of a certain composition, and used for bonding the first package 391, the insulating substrate 371, and the secondary heat sink 361, and the weight 162 is a weight taken out from the upper side of the product obtained by the first packaging of the bar array, that is, the weight 162 above the first package 391.

The second grabbing mechanical device 331 and the third grabbing mechanical device 332 are middle-high precision mechanical arms, firstly, the second grabbing mechanical device 331 takes out the weight block 162 above the first package 391 and places the weight block on the second weight block tray, then takes out the first package 391 in the first sintering platform 15 and places the first package tray, secondly, the second grabbing mechanical device 331 and the third grabbing mechanical device 332 are used for grabbing and transferring the relevant components of the secondary heat sink 361, the second soldering lug 381, the insulating substrate 371, the second soldering lug 381 and the first package 391 in the corresponding trays in sequence, and places the relevant components in the second sintering platform 35.

The second sintering platform 35 is placed on the second preassembling and conveying device 32, a plurality of recesses are formed in the second sintering platform 35, limiting areas are formed in the recesses, alignment and fixation of the secondary heat sink 361 placed inside can be achieved, the second alignment mechanical device 34 is a high-precision mechanical arm, marking points or limiting areas of the secondary heat sink can be identified, and accordingly high-precision alignment is conducted on all components preassembled for the second time in the placing process.

The second sintering platform 35 is made of a high thermal conductivity material as a transfer carrier and a sintering tool during reflow to facilitate heat conduction.

The second preassembling station 3 can realize the preassembling of the second package of the bar stacked array, and the secondary heat sink 361, the second soldering lug 381, the insulating substrate 371, the second soldering lug 381 and the first package 391 are sequentially placed in the second sintering platform 35, and the second preassembling conveying device 32 transfers the loaded second sintering platform 35 to the tail end of the second preassembling station 3.

As shown in fig. 8 and 9, the automated packaging device for a bar code stacked array further includes: the second encapsulation station 4, the second encapsulation station 4 is used for realizing the second reflow encapsulation of the bar stacked array, and the second encapsulation station 4 includes: the second package bridge 41, the second package conveying device 42 and the second reflow cavity 43, wherein the second package bridge 41 plays a role of fixedly supporting the second package conveying device 42 and the second reflow cavity 43.

The automatic packaging equipment of the bar stacking array further comprises a third transfer device 7, the third transfer device 7 comprises a double-shaft mechanical arm and a third bracket 71, wherein the third transfer device 7 is positioned between the second preassembling station 3 and the second packaging station 4, the double-shaft mechanical arm is provided with two groups of driving components, one group of driving components comprises an X-axis driving arm fixed with the third bracket 71 and an X-axis driving cylinder for driving the X-axis driving arm to move along the X-axis direction, and the other group of driving components comprises a Z-axis driving arm connected with the X-axis driving arm and a Z-axis driving cylinder for driving the Z-axis driving arm to lift along the Z-axis. After the loaded second sintering platform 35 is transferred to the end of the second pre-assembly station 3, the third transfer device 7 moves the horizontal shaft, inserts the support plate of the third bracket 71 fixed with the horizontal shaft into the positioning hole of the second sintering platform 35, completes the matching, continues to move the vertical shaft and the horizontal shaft, and transfers the second sintering platform 35 to the preset position of the second packaging station 4.

The second reflow chamber 43 comprises a second vacuumizing system, a second heating system and a second gas control system, wherein the second vacuumizing system can vacuumize to remove oxygen in the chamber, so that the reflow soldering of the product is completed in an anaerobic environment; the second heating system comprises a heating module and a temperature control module, wherein the heating module can quickly heat to a process temperature of about 280 ℃ to ensure that the solder is fully melted; the temperature control module can ensure that the heating device provides a heat source according to a preset process temperature curve; the second gas control module can provide inert gas such as nitrogen, hydrogen and the like or reducing gas in the reflow soldering process so as to ensure that the solder is not oxidized in the reflow process. The second reflow chamber 43 further includes a second transfer door 431, a second heat dissipating grid 432, and a second conveying door 433, where the second transfer door 431 and the second conveying door 433 are distributed on the left and right sides of the second reflow chamber 43 along the X-axis direction, and the widths of the second transfer door 431 and the second conveying door 433 are expanded along the Y-axis direction; in addition, the second heat dissipating grille 432 can dissipate heat of the second reflow chamber 43, which is beneficial to maintenance of the second reflow chamber 43. After the third transferring device 7 places the loaded second sintering platform 35 at the conveying position of the second reflow chamber 43, the second reflow chamber 43 internally lifts the second sintering platform 35 from the conveying position to the working position, the second transferring door 431 of the second reflow chamber 43 is automatically closed, and the third transferring device 7 is retracted to the initial position.

After receiving the loaded second sintering platform 35, the second reflow chamber 43 sequentially completes the start-up procedure: vacuumizing, introducing inert gas, heating, preserving heat, cooling, introducing compressed gas and blanking, so that the second packaging of the bar overlapping array is realized, and a second packaging piece with a secondary heat sink 361, an insulating substrate 371 and a first packaging piece 391 is formed. The second reflow chamber 43 then lowers the second sintering station 35 internally from the working position onto the second encapsulation conveyor 42, and the second encapsulation conveyor 42 conveys the second encapsulation along with the second sintering station 35 out of the second reflow chamber 43 and to the end of the second encapsulation station 4.

The automatic packaging equipment for the bar chip comprises a first pre-assembly station 1, a first packaging station 2, a second pre-assembly station 3 and a second packaging station 4, wherein the first pre-assembly station 1 is used for automatically completing the pre-assembly of the first package of the bar chip, the first packaging station 2 is used for automatically completing the first reflow package of the bar chip, the second pre-assembly station 3 is used for automatically completing the pre-assembly of the second package of the bar chip, and the second packaging station 4 is used for automatically completing the second reflow package of the bar chip; the automatic packaging equipment for the bar chips can realize twice automatic packaging of the bar stacking array by means of the four stations, the transfer device and the bracket between the four stations, thereby improving the production efficiency, the productivity and the consistency of products.

On the other hand, the invention provides an automatic packaging method of the bar stacking array, which adopts the automatic packaging equipment of the bar stacking array and comprises the following steps:

the method comprises the steps that firstly, a grabbing mechanical device on a preassembling station places a preassembled component of a bar stacking array on a sintering platform, and a positioning mechanical device performs fine positioning on the preassembled component placed on the sintering platform;

Step two: starting a preassembly conveying device to convey the loaded sintering platform to the tail end of a preassembly station along the X direction;

step three: starting a transfer device to transfer the sintering platform from the pre-assembly station to the packaging station;

Step four: after transferring to the reflow cavity of the packaging station, the reflow cavity starts a high-temperature program to complete packaging of the bar stacking array, and then the packaging conveying device conveys the packaged sintering platform to the tail end of the packaging station along the X direction;

step five: starting a transfer device to transfer the sintering platform from the packaging station to the pre-assembly station; and circularly executing the first step to the fourth step until the packaging process of the bar laminated array is finished.

Further, the preassembling equipment at least comprises a first preassembling station 1 and a second preassembling station 3; the packaging equipment at least comprises a first packaging station 2 and a second packaging station 4;

the first preassembly station 1 comprises: a first preassembled bridge 11, a first preassembled conveyor 12, a first gripping mechanism 14, a first alignment mechanism 13;

The second preassembly station 3 comprises: the second preassembled bridge 31, the second preassembled conveyor 32, the second gripper mechanism 331, the third gripper mechanism 332, and the second alignment mechanism 34;

The first encapsulation station 2 comprises: a first package bridge 21, a first package conveyor 22, a first reflow chamber 23;

the second encapsulation station 4 comprises: a second package bridge 41, a second package conveyor 42, a second reflow chamber 43;

the transfer device comprises a first transfer device 5 positioned between the first preassembling station 1 and the first packaging station 2, a second transfer device 6 positioned between the first packaging station 2 and the second preassembling station 3, and a third transfer device 7 positioned between the second preassembling station 3 and the second packaging station 4;

The sintering platform at least comprises a first sintering platform 15 and a second sintering platform 35;

the automatic packaging method of the bar stacking array comprises the following steps:

The first step comprises the following steps: step S11, arranging a heat sink tray 17 storing a heat sink 171, a bar tray 18 storing a bar chip 181, a first soldering lug tray 19 storing a first soldering lug 191 and a first weight block tray 161 storing a weight block 162 at the starting end of the first preassembled bridge 11 along the X direction;

Step S12, sequentially grabbing the heat sink 171, the first soldering lug 191, the bar chip 181, the first soldering lug 191, the heat sink 171 and the weight block 162 on the first preassembling station 1 by utilizing the first grabbing mechanical device 14 to form a first preassembled component 182, and sequentially placing the heat sink 171, the first soldering lug 191, the bar chip 181, the first soldering lug 191, the heat sink 171 and the weight block 162 in the first sintering platform 15 from bottom to top;

Step S13, fine positioning is carried out on each assembly by utilizing the first alignment mechanical device 13 when the first pre-assembled assembly 182 is placed in sequence according to the sequence of the heat sink 171, the first soldering lug 191, the bar chip 181, the first soldering lug 191, the heat sink 171 and the weight block 162;

The second step comprises: step S21: starting the first preassembly conveying device 12 to convey the first sintering platform 15 to the tail end of the first preassembly station 1 along the X direction;

The third step comprises: step S31: the first sintering station 15 is transferred into the first reflow chamber 23 of the first encapsulation station 2 using the first transfer device 5.

Further, the first reflow chamber 23 has a first transfer door 231 and a first transfer door 233 along the left and right sides along the X-axis direction, respectively;

An automated packaging method for a bar code array, comprising the following steps:

The fourth step comprises: step S41, after the first sintering platform 15 is transferred to the conveying position of the first reflow cavity 23 of the first packaging station 2, the first reflow cavity 23 ascends the first sintering platform 15 from the conveying position to the working position, and the first transfer door 231 of the first reflow cavity 23 is automatically closed after the first transfer device 5 is withdrawn;

Step S42: the first reflow chamber 23 is automatically vacuumized and heated, and the first preassembled assembly 182 of the bar array is welded into a first package 391 by reflow soldering;

Step S43: the first reflow chamber 23 is cooled, and the first conveying door 233 is automatically opened after the first reflow chamber 23 descends the first sintering platform 15 carrying the first package 391 from the working position to the conveying position, and conveys the first sintering platform 15 to the end of the first packaging station 2 along the X direction through the first packaging conveying device 22;

the fifth step comprises: step S51: the second transfer device 6 transfers the first sintering platform 15 to the second preassembly conveyor 32 of the second preassembly station 3.

Further, the first step includes: step S14: placing the first package tray 39, the second weight tray 163, the second tab tray 38 storing the second tab 381, the secondary heat sink tray 36 storing the secondary heat sink 361, and the insulating base tray 37 storing the insulating base 371 on both sides of the second pre-assembled bridge 31 in the X direction;

step S15: the second grabbing mechanical device 331 is utilized to take down the weight block 162 on the first sintering platform 15 and place the weight block on the second weight block tray 163;

step S16: the first package 391 on the first sinter deck 15 is removed and placed on the first package tray 39 using the second gripper mechanism 331;

Step S17: placing a second sintering station 35 on a second preassembly conveyor 32 of a second preassembly station 3;

Step S18: sequentially grabbing the secondary heat sink 361, the second soldering lug 381, the insulating base 371, the second soldering lug 381 and the first package 391 by using the second grabbing mechanical device 331 and the third grabbing mechanical device 332, and placing the secondary heat sink 361, the second soldering lug 381, the insulating base 371, the second soldering lug 381 and the first package 391 on the second sintering platform 35 in the sequence of the secondary heat sink 361, the second soldering lug 381 and the first package 391;

Step S19: fine positioning of the components while sequentially placing the second pre-assembled component 44 in the order of the secondary heat sink 361, the second solder tab 381, the insulating base 371, the second solder tab 381, the first package 391 using the second alignment mechanism 34;

The second step comprises: step S22: starting the second preassembly conveying device 32 to convey the second sintering platform 35 to the tail end of the second preassembly station 3 along the X direction;

The third step comprises: step S32: the second sintering station 35 is transferred to the second reflow chamber 43 of the second encapsulation station 4 by means of the third transfer device 7.

Further, the left and right sides of the second reflow chamber 43 along the X-axis direction are respectively provided with a second transfer door 431 and a second conveying door 433;

An automated packaging method for a bar code array, comprising the following steps:

The fourth step comprises: step S45, after the second sintering platform 35 is transferred to the conveying position of the second reflow cavity 43 of the second packaging station 4, the second reflow cavity 43 ascends the second sintering platform 35 from the conveying position to the working position, and the second transfer door 431 of the second reflow cavity 43 is automatically closed after the third transfer device 7 is withdrawn;

Step S46: the second reflow chamber 43 is automatically vacuumized and heated, and the second preassembled assembly 44 of the bar array is welded into a second package by reflow soldering;

Step S47: the second reflow chamber 43 is cooled, and the second conveying door 433 is automatically opened after the second reflow chamber 43 descends the second sintering platform 35 carrying the second package to the conveying position, so that the second package is conveyed to the end of the second packaging station 4 along the X direction by the second packaging conveying device.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (15)

1. An automatic encapsulation equipment of bar pile up battle array which characterized in that:

Comprising the following steps: pre-assembly equipment, packaging equipment, a sintering platform and transfer equipment,

The pre-assembly equipment at least comprises two groups of pre-assembly stations, and the pre-assembly stations comprise: the pre-assembly bridge frame supports and fixes the pre-assembly conveying device, the grabbing mechanical device and the alignment mechanical device, and the pre-assembly equipment can complete pre-assembly of the bar stacking array;

the packaging equipment at least comprises two groups of packaging stations, and the packaging stations comprise: the packaging device comprises a packaging bridge, a packaging conveying device and a reflow cavity, wherein the packaging bridge supports and fixes the packaging conveying device and the reflow cavity, and packaging equipment can complete packaging of the bar array;

the sintering platform bears and fixes the pre-assembled component and the packaging component of the bar array;

the transfer equipment at least comprises three groups of transfer devices, and the transfer devices transfer the sintering platform between the adjacent pre-assembly stations and the packaging stations.

2. The automated packaging apparatus of a bar code array of claim 1, wherein:

The pre-assembly equipment at least comprises a first pre-assembly station and a second pre-assembly station, wherein the first pre-assembly station is used for completing the pre-assembly of the first package of the bar array, and the second pre-assembly station is used for completing the pre-assembly of the second package of the bar array;

The packaging equipment at least comprises a first packaging station and a second packaging station, wherein the first packaging station is used for finishing the first packaging of the bar stacking array, and the second packaging station is used for finishing the second packaging of the bar stacking array;

the automatic packaging equipment of the bar stacking array is sequentially provided with a first preassembling station, a first transferring device, a first packaging station, a second transferring device, a second preassembling station, a third transferring device and a second packaging station.

3. The automated packaging apparatus of a bar code array of claim 2, wherein:

The sintering platform at least comprises a first sintering platform and a second sintering platform, the first sintering platform comprises a plurality of concave parts, the concave parts are used for placing a sintering jig, the sintering jig comprises an inclined sintering table top and a plurality of positioning sheets, and the sintering jig is used for placing a preassembled component of the bar stacking array for the first time;

The first preassembling component of the bar stacking array comprises a bar chip, a heat sink, a weight block and a first welding sheet;

the second sintering platform is provided with a plurality of positioning grooves, the positioning grooves are used for positioning and placing the second preassembling component of the bar laminated array, and the second preassembling component of the bar laminated array comprises a first packaging piece of the bar laminated array, a secondary heat sink, an insulating substrate and a second soldering lug.

4. The automated packaging apparatus of a bar code array of claim 1, wherein:

the transfer device comprises a double-shaft mechanical arm and a bracket, wherein the double-shaft mechanical arm is provided with two groups of driving components, and one group of driving components comprises an X-axis driving arm fixed with the bracket and an X-axis driving cylinder for driving the X-axis driving arm to move along the X-axis direction;

the other group of driving components comprises a Z-axis driving arm connected with the X-axis driving arm and a Z-axis driving cylinder for driving the Z-axis driving arm to lift along the Z axis.

5. The automated packaging apparatus of a bar code array of claim 1, wherein:

The reflow cavity comprises a vacuumizing system, a heating system and a gas control system, wherein the heating system comprises a heating module and a temperature control module.

6. The automated packaging apparatus of a bar code array of claim 1, wherein:

the left side and the right side of the reflux cavity along the X-axis direction are respectively provided with a transfer door and a conveying door;

the sintering platform is transported to the transport position of the reflow cavity by the transport device, and the transport door is automatically closed after the sintering platform ascends from the transport position to the working position in the reflow cavity; the conveying door is automatically opened after the preassembled component carried by the sintering platform descends from the working position to the conveying position after the preassembled component finishes reflow packaging, and the packaging conveying device conveys the sintering platform out of the reflow cavity.

7. An automated packaging apparatus for a bar code array according to claim 3, wherein:

The starting end of the short side of the first preassembly station along the Y-axis direction is respectively provided with a heat sink tray for storing the heat sink, a bar tray for storing the bar chip, a first soldering lug tray for storing the first soldering lug and a first weight block tray for storing the weight block.

8. An automated packaging apparatus for a bar code array according to claim 3, wherein:

one side or two sides of the long side of the second preassembling station along the X-axis direction are respectively provided with a secondary heat sink tray, a second soldering lug tray, an insulating substrate tray, a first packaging piece tray and a second weight block tray, wherein the secondary heat sink tray is used for storing the secondary heat sink, the second soldering lug tray is used for storing the second soldering lug, the insulating substrate tray is used for storing the insulating substrate.

9. The automated packaging apparatus of claim 8, wherein:

the second preassembling station at least comprises two grabbing mechanical devices, and the two grabbing mechanical devices are located on one side or two sides of the long side of the second preassembling station along the X-axis direction so as to grab the second preassembling component.

10. Automated packaging apparatus for a bar code array according to any of claims 1-9, wherein:

the transfer device comprises a double-shaft mechanical arm and a bracket, the bracket comprises a positioning protrusion, and the sintering platform comprises a positioning hole, so that the positioning protrusion is inserted into the positioning hole, and the sintering platform is lifted from the previous station along the X direction and transferred to the next station by virtue of the transfer device; wherein the last station is a pre-assembly station, and the next station is a packaging station; or the last station is a packaging station, and the next station is a preassembling station.

11. An automatic packaging method of a bar stacking array is characterized by comprising the following steps of: the method employs the automated packaging apparatus of the bar code array of any one of claims 1-10, comprising:

the first step, the grabbing mechanical device on the preassembling station places the preassembled components of the bar stacking array on the sintering platform, and the aligning mechanical device performs fine alignment on the preassembled components placed on the sintering platform;

Step two: starting the preassembly conveying device to convey the loaded sintering platform to the tail end of the preassembly station along the X direction;

Step three: starting the transferring device to transfer the sintering platform from the preassembling station to the packaging station;

Step four: after the sintering platform is transferred to the reflow cavity of the packaging station, the reflow cavity starts a high-temperature program to complete packaging of the bar stacking array, and then the packaging conveying device conveys the packaged sintering platform to the tail end of the packaging station along the X direction;

Step five: starting the transferring device to transfer the sintering platform from the packaging station to the preassembling station; and circularly executing the first step to the fourth step until the packaging process of the bar laminated array is finished.

12. The automated packaging method of a bar code array of claim 11, wherein:

the preassembling equipment at least comprises a first preassembling station and a second preassembling station; the packaging equipment at least comprises a first packaging station and a second packaging station;

The first preassembly station comprises: the device comprises a first preassembled bridge, a first preassembled conveying device, a first grabbing mechanical device and a first alignment mechanical device;

the second preassembly station comprises: the second preassembled bridge frame, the second preassembled conveying device, the second grabbing mechanical device, the third grabbing mechanical device and the second alignment mechanical device;

The first encapsulation station comprises: the first packaging bridge, the first packaging conveying device and the first reflow cavity;

the second encapsulation station comprises: the second packaging bridge, the second packaging conveying device and the second reflow cavity are arranged in the first packaging bridge;

The transfer device comprises a first transfer device positioned between a first preassembling station and a first packaging station, a second transfer device positioned between the first packaging station and a second preassembling station, and a third transfer device positioned between the second preassembling station and the second packaging station;

The sintering platform at least comprises a first sintering platform and a second sintering platform;

the automatic packaging method of the bar stacking array comprises the following steps:

The first step comprises the following steps: s11, arranging a heat sink tray stored with a heat sink, a bar tray stored with a bar chip, a first soldering lug tray stored with a first soldering lug and a first weight block tray stored with a weight block at the starting end of the first preassembled bridge along the X direction;

Step S12, sequentially grabbing the heat sink, the first welding lug, the bar chip, the first welding lug, the heat sink and the weight block on the first preassembling station by using the first grabbing mechanical device to form a first preassembling assembly, and sequentially placing the heat sink, the first welding lug, the bar chip, the first welding lug, the heat sink and the weight block on a first sintering platform from bottom to top in sequence;

Step S13, using the first alignment mechanical device to finely position each assembly when the first preassembled assembly is placed in sequence according to the sequence of the heat sink, the first soldering lug, the bar chip, the first soldering lug, the heat sink and the weight;

The second step comprises: step S21: starting the first preassembly conveying device to convey the first sintering platform to the tail end of the first preassembly station along the X direction;

The third step comprises: step S31: and transferring the first sintering platform into the first reflow cavity of the first packaging station by using the first transferring device.

13. The automated packaging method of a bar code array of claim 12, wherein:

The left side and the right side of the first backflow cavity along the X-axis direction are respectively provided with a first transfer door and a first conveying door;

An automated packaging method for a bar code array, comprising the following steps:

the fourth step comprises: step 41, after the first sintering platform is transferred to a conveying position of a first backflow cavity of the first packaging station, the first backflow cavity ascends the first sintering platform from the conveying position to a working position, and the first transfer door of the first backflow cavity is automatically closed after the first transfer device exits;

Step S42: the first reflow cavity is automatically vacuumized and heated, and the first preassembled component of the bar array is welded into a first packaging piece through reflow soldering;

Step S43: the first reflow cavity is cooled, the first conveying door automatically opens the first sintering platform loaded with the first packaging piece after the first reflow cavity descends from a working position to a conveying position, and the first sintering platform is conveyed to the tail end of a first packaging station along the X direction through the first packaging conveying device;

the fifth step comprises: step S51: the second transferring device transfers the first sintering platform to a second preassembling and conveying device of the second preassembling station.

14. The automated packaging method of a bar code array of claim 13, wherein,

The first step comprises the following steps: step S14: placing a first package tray, a second weight tray, a second soldering lug tray storing a second soldering lug, a secondary heat sink tray storing a secondary heat sink, and an insulating substrate tray storing an insulating substrate on two sides of the second preassembled bridge along the X direction;

step S15: the second grabbing mechanical device is utilized to take down the weight block on the first sintering platform and place the weight block on the second weight block tray;

step S16: taking down the first package on the first sintering platform and placing the first package on the first package tray by using the second grabbing mechanical device;

step S17: placing a second sintering platform on the second preassembly conveyor of the second preassembly station;

Step S18: sequentially grabbing the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece by using the second grabbing mechanical device and the third grabbing mechanical device, and placing the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece on the second sintering platform in sequence;

step S19: using a second alignment mechanism to finely position each component when sequentially placing a second pre-assembled component in the order of the secondary heat sink, the second soldering lug, the insulating substrate, the second soldering lug and the first packaging piece;

the second step comprises: step S22: starting the second preassembly conveying device to convey the second sintering platform to the tail end of the second preassembly station along the X direction;

the third step comprises: step S32: and transferring the second sintering platform to a second reflow cavity of the second packaging station by using the third transferring device.

15. The automated packaging method of a bar code array of claim 14, wherein:

the left side and the right side of the second reflux cavity along the X-axis direction are respectively provided with a second transfer door and a second conveying door;

An automated packaging method for a bar code array, comprising the following steps:

The fourth step comprises: step S45, after the second sintering platform is transferred to a conveying position of a second reflow cavity of the second packaging station, the second reflow cavity ascends the second sintering platform from the conveying position to a working position, and a second transfer door of the second reflow cavity is automatically closed after a third transfer device exits;

step S46: the second reflow cavity is automatically vacuumized and heated, and the second preassembled component of the bar array is welded into a second packaging piece through reflow soldering;

Step S47: the second reflow cavity is cooled, the second conveying door is automatically opened after the second reflow cavity descends to a conveying position on the second sintering platform carrying the second packaging piece, and the second packaging piece is conveyed to the tail end of the second packaging station along the X direction through the second packaging conveying device.