CN118181554A - Non-contact height measurement device of wafer cutting equipment - Google Patents
Non-contact height measurement device of wafer cutting equipment Download PDFInfo
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- CN118181554A CN118181554A CN202410608190.9A CN202410608190A CN118181554A CN 118181554 A CN118181554 A CN 118181554A CN 202410608190 A CN202410608190 A CN 202410608190A CN 118181554 A CN118181554 A CN 118181554A
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- water
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- tool setting
- way valve
- assembly
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- 238000005520 cutting process Methods 0.000 title claims abstract description 30
- 238000005259 measurement Methods 0.000 title claims description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 160
- 238000005507 spraying Methods 0.000 claims abstract description 106
- 238000004140 cleaning Methods 0.000 claims abstract description 35
- 238000004891 communication Methods 0.000 claims abstract description 17
- 238000007664 blowing Methods 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000002347 injection Methods 0.000 claims description 44
- 239000007924 injection Substances 0.000 claims description 44
- 239000000428 dust Substances 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000443 aerosol Substances 0.000 description 2
- 238000000861 blow drying Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of wafer processing, and particularly relates to a non-contact height measuring device of wafer cutting equipment, which comprises a tool setting mounting seat, a tool setting module and a cleaning module for cleaning the tool setting module; the cleaning module comprises a water spraying assembly, an air spraying assembly and a water-air communication assembly, wherein the water spraying assembly is used for spraying water to clean the tool setting module, the air spraying assembly is used for blowing and drying the tool setting module, the water-air communication assembly is used for communicating the water spraying assembly with the air spraying assembly, and residual water in the water spraying assembly is dried through air spraying; the cleaning module is used for carrying out joint design on cleaning and drying of the tool setting module, and the water channel and the air channel of the cleaning module are communicated through the water-gas communication assembly, so that the cleaning and drying of the height measuring device are realized, the residual water in the water spraying assembly can be dried through the air channel, and the problem that the residual water in the water spraying assembly drops on the tool setting module in the tool setting process to influence the tool setting accuracy is solved.
Description
Technical Field
The invention belongs to the technical field of wafer processing, and particularly relates to a non-contact height measuring device of wafer cutting equipment.
Background
In the cutting process of the wafer material, height measurement (namely tool setting) of the cutting tool is one of main operation and important skills, and under certain conditions, the tool setting precision determines the machining precision of the part and directly influences the cutting efficiency of the wafer material.
At present, in the cutting processing process of wafer materials, the height measurement sensor needs to be cleaned before tool setting operation, so that the cleanliness of the height measurement sensor is ensured, the accuracy of tool setting is ensured, the height measurement sensor is in a dry state when measuring the height, the residual of small water drops has a great influence on the tool setting accuracy of the height measurement device, the existing wafer material height measurement device, the residual cleaning water in the water nozzle elbow pipe is easy to drop on the height measurement sensor under the driving of vibration of operation equipment and the suction force of blowing of the air-jet elbow pipe, or the residual water can form an aerosol environment around the height measurement sensor under the blowing action of the air-jet elbow pipe, so that the height measurement accuracy is influenced.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to overcome the defect that the height measurement accuracy is influenced by residual water in the height measurement device in the prior art, the non-contact height measurement device for the wafer cutting equipment is provided, which can ensure that no cleaning water remains in the water outlet bent pipe during height measurement, thereby ensuring high precision.
The technical scheme adopted for solving the technical problems is as follows:
the non-contact height measurement device of the wafer cutting equipment comprises a tool setting installation seat, a tool setting module arranged on the tool setting installation seat and a cleaning module arranged on the tool setting module and used for cleaning the tool setting module; wherein,
The tool setting module comprises a height measurement sensor with at least two signal ends, wherein one part of the signal ends is a signal transmitting end, and the other part of the signal ends is a signal receiving end which is arranged opposite to the signal transmitting end;
The cleaning module includes:
The water spraying assembly is used for spraying water to clean the tool setting module and comprises at least two water spraying bent pipes, wherein the water spraying port of one part of the water spraying bent pipes faces the signal transmitting end, and the water spraying port of the other part of the water spraying bent pipes faces the signal receiving end;
The air injection assembly is used for blowing and drying the tool setting module and comprises at least two air injection bent pipes, wherein the air injection ports of one part of the air injection bent pipes face the signal transmitting end, and the air injection ports of the other part of the air injection bent pipes face the signal receiving end;
and the water-air communication assembly is used for communicating the water spraying assembly with the air spraying assembly so that one part of air flow is sprayed out through the air spraying assembly, and the other part of air flow is sprayed out through the water spraying assembly to blow-dry residual water in the air spraying assembly.
Further, the water gas communication assembly includes:
The first air inlet T1 of the first three-way valve is communicated with an air source connector, and the first air outlet A1 of the first three-way valve is communicated with the air injection assembly;
The second air inlet T2 of the second three-way valve is communicated with the second air outlet B1 of the first three-way valve, and the water inlet P2 of the second three-way valve is communicated with the water source joint; the water outlet B2 of the second three-way valve is communicated with the water spraying assembly;
Further, the water gas communication assembly further comprises:
the first one-way valve is arranged on a pipeline between the water source connector and the second three-way valve and is used for controlling one-way movement of water flow;
And the second one-way valve is arranged on a pipeline between the first three-way valve and the second three-way valve and is used for controlling one-way movement of air flow.
Further, the air injection elbow is positioned between the height measurement sensor and the water injection elbow.
Further, the height of the water spraying elbow pipe is higher than that of the air spraying elbow pipe.
Further, an included angle between the water spraying bent pipe and the corresponding signal end is 10 degrees+/-2 degrees, and an included angle between the air spraying bent pipe and the corresponding signal end is 10 degrees+/-2 degrees.
Further, a U-shaped groove is formed between the signal sending end and the signal receiving end, the groove bottom of the U-shaped groove is obliquely arranged, one surface, away from each other, of the signal sending end and the signal receiving end is an outer end surface, and the two outer end surfaces are obliquely arranged.
Further, the water spraying assembly comprises a water inlet pipe which is arranged on the cleaning installation block and communicated with the water spraying elbow pipe;
One end of the water inlet pipe is communicated with the water source joint, and the other end of the water inlet pipe is communicated with the water spraying elbow pipe sequentially through the first one-way valve and the second three-way valve.
Further, the air injection assembly comprises an air inlet pipe which is arranged on the cleaning installation block and communicated with the air injection elbow pipe;
One end of the air inlet pipe is communicated with the air source joint, and the other end of the air inlet pipe is communicated with the air injection elbow pipe through a first three-way valve.
Further, the tool setting device also comprises a protection assembly, wherein the protection assembly comprises a rotary cylinder arranged on the tool setting mounting seat and a dust cover coaxially arranged with an output shaft of the rotary cylinder;
When the tool setting operation is not needed, the dust cover is arranged on the tool setting module.
The non-contact height measuring device of the wafer cutting equipment has the beneficial effects that: the cleaning module disclosed by the invention is used for jointly installing the cleaning and the blow-drying of the tool setting module, and the waterway and the air channel of the cleaning module are communicated through the water-air communication assembly, so that the cleaning and the blow-drying of the height measuring device are realized, the residual water in the water spraying assembly can be blow-dried by skillfully utilizing the air channel, the problem that the residual water in the water spraying assembly drops on the tool setting module in the tool setting process to influence the tool setting accuracy is solved, and the cutting precision of the cutting equipment is improved.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a three-dimensional block diagram of a first view of the height measurement device of the present invention;
FIG. 2 is a three-dimensional block diagram of a second view of the height measurement device of the present invention;
FIG. 3 is an enlarged partial view of portion A of FIG. 2;
FIG. 4 is a front view of the height measurement device of the present invention;
FIG. 5 is a schematic view of the structure of the removal guard assembly of the present invention;
FIG. 6 is a schematic diagram of the structure of the altimetric sensor of the present invention;
Fig. 7 is a schematic view of the structure of the protective assembly of the present invention.
In the figure:
1. Setting a tool mounting seat;
2. A tool setting module; 21. a height measurement sensor; 211. a signal transmitting end; 212. a signal receiving end; 213. a U-shaped groove;
3. a cleaning module; 31. cleaning the mounting block; 32. a water spray assembly; 321. a water spraying elbow pipe; 322. a water inlet pipe; 323. a water source connector; 324. a water spraying connector; 33. a jet assembly; 331. a jet elbow; 332. an air inlet pipe; 333. an air source connector; 334. an air injection connector; 34. a water-gas communication assembly; 341. a first three-way valve; 342. a second three-way valve; 343. a first one-way valve; 344. a second one-way valve;
4. a protective assembly; 41. a rotary cylinder; 42. a dust cover;
t1, a first air inlet; a1, a first air outlet; b1, a second air outlet; t2, a second air inlet; p2, a water inlet; b2, a water outlet.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
As shown in fig. 1 to 7, a non-contact height measuring device of a wafer cutting apparatus is used for measuring the height of a cutting knife before cutting so as to control the cutting depth of a wafer, and comprises a tool setting mounting seat 1, a tool setting module 2 mounted on the tool setting mounting seat 1, and a cleaning module 3 mounted on the tool setting module 2 and used for cleaning the tool setting module 2; wherein,
The tool setting module 2 comprises a height measurement sensor 21 with at least two signal ends, wherein the height measurement sensor 21 is an optical fiber sensor, one part of the signal ends is a signal transmitting end 211, the other part of the signal ends is a signal receiving end 212 which is arranged opposite to the signal transmitting end 211, and the signal transmitting end 211 transmits signals to the signal receiving end 212; it should be understood that the tool setting module 2 in this embodiment further includes a water tank for collecting the cleaning water, so as to avoid the random spillage of the cleaned water, which affects the normal operation of other components of the wafer material cutting apparatus.
The cleaning module 3 comprises a cleaning mounting block 31, a water spraying component 32, a gas spraying component 33 and a water-gas communication component 34 which are fixedly mounted on the tool setting module 2;
the water spraying assembly 32 is mounted on the cleaning mounting block 31 and is used for spraying water to clean the tool setting module 2, and comprises at least two water spraying bent pipes 321, wherein the water spraying port of one part of the water spraying bent pipes 321 faces the signal sending end 211, the water spraying port of the other part of the water spraying bent pipes 321 faces the signal receiving end 212, and the water spraying bent pipes 321 are communicated with the water spraying connector 324 mounted on the cleaning mounting block 31;
The air injection assembly 33 is mounted on the cleaning mounting block 31 and is used for blowing and drying the tool setting module 2, and comprises at least two air injection bent pipes 331, wherein the air injection ports of one part of the air injection bent pipes 331 face the signal transmitting end 211, the air injection ports of the other part of the air injection bent pipes 331 face the signal receiving end 212, and the air injection bent pipes 331 are communicated with the air injection connectors 334 mounted on the cleaning mounting block 31;
The water-air communication assembly 34 is used for communicating the water spraying assembly 32 and the air spraying assembly 33, so that a part of air flow is sprayed out through the air spraying assembly 33 to blow the tool setting module 2 to dry, and the other part of air flow is sprayed out through the water spraying assembly 32 to blow the residual water in the tool setting module 2 to dry, thereby avoiding the situation that in the prior art, in the tool setting process, residual water in the water spraying assembly 32 drops on the tool setting module 2 due to equipment vibration and the like, and affecting the tool setting accuracy.
When the cutter is set, firstly, the cutter moves to the upper part of the cutter setting module 2 and gradually moves downwards between the signal sending end 211 and the signal receiving end 212 to shade light rays between the signal sending end and the signal receiving end, the height of the cutter can be measured through the shielding degree, so that the cutter setting operation is realized, and the cutting depth of a wafer is ensured. However, during the process of cutting the wafer by the dicing blade, chips are continuously generated, and the chips adhere to the signal transmitting end 211 and the signal receiving end 212, so that light between the signal transmitting end and the signal receiving end is blocked, and the dicing operation is affected; it is therefore necessary to clean the tool setting module 2 before setting;
During cleaning, the water spraying assembly 32 is started firstly, one water spraying bent pipe 321 washes the signal sending end 211, the other water spraying bent pipe 321 washes the signal receiving end 212, after the washing is finished, the water spraying assembly 32 is closed, the air spraying assembly 33 is started, a part of air flows through the two air spraying bent pipes 331 to blow out the tool setting module 2, meanwhile, the other part of air flows through the two water spraying bent pipes 321 to blow out residual water in the air spraying bent pipes 321 in the blowing process, so that a drying environment is formed in the water spraying bent pipes 321, the influence on the subsequent tool setting process is avoided, the air flow in the air spraying bent pipes 331 can blow the tool setting module 2 on one hand, and the residual water blown out from the water spraying bent pipes 321 can blow out on the other hand.
In some examples, the water gas communication assembly 34 includes a first three-way valve 341 and a second three-way valve 342;
a first air inlet T1 of the first three-way valve 341 is communicated with the air source connector 333, and a first air outlet A1 of the first three-way valve 341 is communicated with the air injection assembly 33;
The second air inlet T2 of the second three-way valve 342 is communicated with the second air outlet B1 of the first three-way valve 341, the water inlet P2 of the second three-way valve 342 is communicated with the water source connector 323, and the water outlet B2 of the second three-way valve 342 is communicated with the water spraying assembly 32.
When the water spraying assembly 32 is started, water flows sequentially through the water source connector 323, the second three-way valve 342 and the water spraying elbow 321 and then is sprayed out to flush the tool setting module 2;
When the air injection assembly 33 is started, a part of air flow from the air source connector 333 is sequentially sprayed out after passing through the first three-way valve 341 and the air injection elbow 331 to blow the tool setting module 2 to dry; the other part of air flow is sprayed out after passing through the first three-way valve 341, the second three-way valve 342 and the water spraying elbow 321 in sequence, and the knife setting module 2 is dried while the water spraying elbow 321 is dried.
In some examples, the water gas communication assembly 34 further includes a first one-way valve 343 and a second one-way valve 344, the number of first one-way valve 343 and second one-way valve 344 being at least one;
The first one-way valve 343 is arranged on the pipeline between the water source connector 323 and the second three-way valve 342 and is used for controlling the one-way movement of water flow;
A second one-way valve 344 is provided on the line between the first three-way valve 341 and the second three-way valve 342 for controlling the one-way movement of the air flow.
In some examples, the air injection elbow 331 is located between the altimeter sensor 21 and the water injection elbow 321, i.e., the air injection elbow 331 is closer to the altimeter sensor 21, and the water injection elbow 321 is farther from the altimeter sensor 21, so as to further reduce the influence of residual water in the water injection elbow 321 on the altimeter sensor 21.
In some examples, the height of the water spraying elbow 321 is higher than that of the air spraying elbow 331 to achieve the staggered arrangement of the two, so as to avoid interference between the air spraying elbow 331 and the water spraying elbow 321.
In some examples, the water spraying elbow 321 and the corresponding signal end form an included angle therebetween, the two are not parallel to each other, and the included angle is 10++2°, the air spraying elbow 331 and the corresponding signal end also form an included angle therebetween, and the two are not parallel to each other, and the included angle is 10++2°.
In some examples, a U-shaped groove is formed between the signal transmitting end 211 and the signal receiving end 212, one surface of the signal transmitting end 211 and the signal receiving end 212, which are close to each other, is an inner end surface, two inner end surfaces are two groove walls of the U-shaped groove, the groove bottom of the U-shaped groove is obliquely arranged, one surface of the signal transmitting end 211, which is far away from the signal receiving end 212, is an outer end surface, the two outer end surfaces are also obliquely arranged, and the two outer end surfaces are far away from each other from top to bottom; the water flows through the water spraying bent pipe 321 to flush the signal transmitting end 211 and the signal receiving end 212, most of the water sprayed on the inner end face flows downwards to the tank bottom, the tank bottom which is obliquely arranged discharges part of the water flow, and the small part of the water sprayed on the outer end face flows downwards to the discharge tool setting module 2 along the oblique outer end face.
In some examples, as shown in fig. 2 and 3, the water spraying assembly 32 further includes a water inlet pipe 322 installed on the cleaning installation block 31 and communicated with the water spraying elbow 321, one end of the water inlet pipe 322 is communicated with the water source connector 323, and the other end is communicated with the water spraying elbow 321 through a first one-way valve 343 and a second three-way valve 342 in sequence.
The air injection assembly 33 includes an air inlet tube 332 mounted on the purge mounting block 31 in communication with the air injection elbow 331; one end of the air inlet pipe 332 is communicated with the air source connector 333, and the other end is communicated with the air injection elbow 331 through the first three-way valve 341.
In some examples, as shown in fig. 5, the height measuring device of the present invention further includes a protection component 4 for protecting the tool setting module 2, where the protection component 4 includes a rotary cylinder 41 installed on the tool setting mount 1, and a dust cover 42 coaxially disposed with an output shaft of the rotary cylinder 41, and when the tool setting operation is not required, the dust cover 42 is covered on the tool setting module 2, so as to effectively ensure the cleanliness of the height measuring sensor 21, and ensure the accuracy of measuring the height of the height measuring sensor 21. As one embodiment, the rotary cylinder 41 is a 180 ° rotary cylinder.
Working principle:
during cleaning, the water spraying assembly 32 is started firstly, at this time, the air spraying assembly 33 is closed, water flows sequentially through the water source connector 323, the first one-way valve 343, the water inlet P2 and the water outlet B2 of the second three-way valve 342 and then enters the water spraying bent pipe 321, one water spraying bent pipe 321 washes the signal sending end 211, and the other water spraying bent pipe 321 washes the signal receiving end 212;
After the flushing is finished, the water spraying component 32 is closed, the air spraying component 33 is opened, the air flow from the air source connector 333 is divided into two parts after passing through the first three-way valve 341, and one part of the air flow passes through the first air outlet A1 of the first three-way valve 341 and then enters the air spraying elbow 331 to be sprayed out to blow the tool setting module 2 to be dried; the other part of air flow sequentially enters the water spraying elbow 321 through the second check valve 344, the second air outlet B1 of the first three-way valve 341, the second air inlet T2 and the second air outlet B2 of the second three-way valve 342 and then is sprayed out, in the spraying process, residual water in the water spraying elbow 321 is firstly blown out, so that a dry environment is formed in the water spraying elbow 321, when the tool is set, the situation that residual water in the water spraying elbow 321 forms aerosol around the height measuring sensor 21 or drops onto the height measuring sensor 21 to influence the accuracy of non-contact tool setting is avoided, the air flow in the air spraying elbow 331 blows the tool setting module 2 on one hand, and the residual water blown out from the water spraying elbow 321 is blown dry on the other hand, so that the tool setting module 2 is kept dry.
It should be understood that the above-described specific embodiments are only for explaining the present invention and are not intended to limit the present invention. Obvious variations or modifications which extend from the spirit of the present invention are within the scope of the present invention.
Claims (10)
1. The non-contact height measurement device of the wafer cutting equipment is characterized by comprising a tool setting installation seat (1), a tool setting module (2) installed on the tool setting installation seat (1) and a cleaning module (3) installed on the tool setting module (2) and used for cleaning the tool setting module (2); wherein,
The tool setting module (2) comprises a height measurement sensor (21) with at least two signal ends, wherein one part of the signal ends is a signal transmitting end (211), and the other part of the signal ends is a signal receiving end (212) which is arranged opposite to the signal transmitting end (211);
The cleaning module (3) comprises:
The water spraying assembly (32) is used for spraying water to clean the tool setting module (2) and comprises at least two water spraying bent pipes (321), wherein the water spraying port of one part of the water spraying bent pipes (321) faces the signal sending end (211), and the water spraying port of the other part of the water spraying bent pipes (321) faces the signal receiving end (212);
The air injection assembly (33) is used for blowing and drying the tool setting module (2) and comprises at least two air injection bent pipes (331), wherein the air injection ports of one part of the air injection bent pipes (331) face the signal sending end (211), and the air injection ports of the other part of the air injection bent pipes (331) face the signal receiving end (212);
and the water-air communication assembly (34) is used for communicating the water spraying assembly (32) with the air spraying assembly (33) so that one part of air flow is sprayed out through the air spraying assembly (33) and the other part of air flow is sprayed out through the water spraying assembly (32) to blow the residual water in the air spraying assembly to dry.
2. The non-contact height measurement device of a wafer cutting apparatus according to claim 1, wherein the water gas communication assembly (34) comprises:
A first three-way valve (341), wherein a first air inlet T1 of the first three-way valve (341) is communicated with an air source joint (333), and a first air outlet A1 of the first three-way valve (341) is communicated with the air injection assembly (33);
A second three-way valve (342), wherein a second air inlet T2 of the second three-way valve (342) is communicated with a second air outlet B1 of the first three-way valve (341), and a water inlet P2 of the second three-way valve (342) is communicated with a water source joint (323); the water outlet B2 of the second three-way valve (342) is communicated with the water spraying assembly (32).
3. The non-contact height measurement device of a wafer cutting apparatus according to claim 2, wherein said water gas communication assembly (34) further comprises:
A first one-way valve (343) arranged on the pipeline between the water source joint (323) and the second three-way valve (342) for controlling one-way movement of water flow;
And a second one-way valve (344) arranged on the pipeline between the first three-way valve (341) and the second three-way valve (342) and used for controlling the one-way movement of the airflow.
4. A non-contact height measurement device for a wafer cutting apparatus according to claim 1, wherein the air injection elbow (331) is located between the height measurement sensor (21) and the water injection elbow (321).
5. The non-contact height measurement device of a wafer cutting apparatus according to claim 4, wherein the height of the water spray elbow (321) is higher than the height of the air spray elbow (331).
6. A non-contact height measurement device for a wafer cutting apparatus according to claim 1, wherein the angle between the water spray elbow (321) and the corresponding signal end is 10 ° ± 2 °, and the angle between the air spray elbow (331) and the corresponding signal end is 10 ° ± 2 °.
7. The non-contact height measurement device of a wafer cutting apparatus according to claim 1, wherein a U-shaped groove is formed between the signal transmitting end (211) and the signal receiving end (212), the groove bottom of the U-shaped groove is inclined, one surface of the signal transmitting end (211) and one surface of the signal receiving end (212) facing away from each other are outer end surfaces, and the two outer end surfaces are also inclined.
8. A non-contact height measurement device for a wafer cutting apparatus according to claim 3, wherein said water spray assembly (32) further comprises a water inlet pipe (322) in communication with said water spray elbow (321);
one end of the water inlet pipe (322) is communicated with the water source joint (323), and the other end of the water inlet pipe is communicated with the water spraying elbow pipe (321) through a first one-way valve (343) and a second three-way valve (342) in sequence.
9. A non-contact height measurement device for a wafer cutting apparatus according to claim 3, wherein said air injection assembly (33) further comprises an air inlet pipe (332) communicating with said air injection elbow (331);
One end of the air inlet pipe (332) is communicated with an air source joint (333), and the other end of the air inlet pipe is communicated with the air injection bent pipe (331) through a first three-way valve (341).
10. The non-contact height measurement device of a wafer cutting apparatus according to claim 1, further comprising a protection assembly (4), the protection assembly (4) comprising a rotary cylinder (41) mounted on the tool setting mount (1) and a dust cover (42) coaxially arranged with an output shaft of the rotary cylinder (41);
when the tool setting operation is not needed, the dust cover (42) is covered on the tool setting module (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2024202740264 | 2024-02-04 | ||
| CN202420274026 | 2024-02-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118181554A true CN118181554A (en) | 2024-06-14 |
| CN118181554B CN118181554B (en) | 2024-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410608190.9A Active CN118181554B (en) | 2024-02-04 | 2024-05-16 | Non-contact height measurement device of wafer cutting equipment |
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| KR20220051799A (en) * | 2020-10-19 | 2022-04-26 | 가부시기가이샤 디스코 | Cutting apparatus |
| CN218160299U (en) * | 2022-08-31 | 2022-12-27 | 江苏京创先进电子科技有限公司 | Non-contact height measuring device and scribing machine |
| CN219403777U (en) * | 2022-08-19 | 2023-07-25 | 无锡立朵科技有限公司 | Cutter non-contact height measurement mechanism of dicing saw |
| CN117410222A (en) * | 2023-10-27 | 2024-01-16 | 合肥艾凯瑞斯智能装备有限公司 | Be applied to full-automatic dicing saw of wafer |
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| CN117410222A (en) * | 2023-10-27 | 2024-01-16 | 合肥艾凯瑞斯智能装备有限公司 | Be applied to full-automatic dicing saw of wafer |
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| Publication number | Publication date |
|---|---|
| CN118181554B (en) | 2024-07-19 |
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