CN118158921A - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
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- CN118158921A CN118158921A CN202211566891.8A CN202211566891A CN118158921A CN 118158921 A CN118158921 A CN 118158921A CN 202211566891 A CN202211566891 A CN 202211566891A CN 118158921 A CN118158921 A CN 118158921A
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- coupling agent
- silane coupling
- target conductive
- printed circuit
- circuit board
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 75
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 238000007598 dipping method Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 156
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 18
- 230000007797 corrosion Effects 0.000 claims description 18
- 239000003112 inhibitor Substances 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000007062 hydrolysis Effects 0.000 claims description 10
- 238000006460 hydrolysis reaction Methods 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000003301 hydrolyzing effect Effects 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 3
- 238000004891 communication Methods 0.000 abstract description 9
- 239000010949 copper Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 14
- 230000009257 reactivity Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910003849 O-Si Inorganic materials 0.000 description 2
- 229910003872 O—Si Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- -1 halogen ions Chemical class 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
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- 239000007822 coupling agent Substances 0.000 description 1
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- 238000005859 coupling reaction Methods 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a printed circuit board and a preparation method thereof, wherein the preparation method of the printed circuit board comprises the following steps: obtaining a plurality of plates to be processed, wherein at least one side of the plates to be processed is provided with a conductive layer; carrying out brown-oxidizing treatment on the target conductive layers in each plate to be processed until each target conductive layer is etched to a preset depth; dipping each target conductive layer through a silane coupling agent to form a silane coupling agent coating on the surface of each target conductive layer; and sequentially placing a plurality of plates to be processed and the multi-layer dielectric layers in a cross circulation mode and pressing to prepare the printed circuit board. Through the mode, the invention can simultaneously meet the requirements of high-frequency communication equipment on low signal loss and high use reliability.
Description
Technical Field
The invention is applied to the technical field of printed circuit boards, in particular to a printed circuit board and a preparation method thereof.
Background
PCB (Printed Circuit Board), also known as printed wiring boards or printed circuit boards, are important electronic components in a wide range of applications, as support for electronic components, and as carrier for the electrical connection of electronic components.
The binding force between the core board and the prepreg is improved by adopting the browning technology in the production of the printed circuit board. The specific surface area of the copper surface is increased through the treatment of the brown chemical liquid, and the roughened copper surface is formed, so that the direct physical binding force between the copper surface and the prepreg is increased.
However, the surface of the conductive layer of the high-frequency communication product needs to have lower roughness and specific surface area so as to reduce signal loss in the signal transmission process, and the current browning process is difficult to meet the signal requirement of the high-frequency communication product.
Disclosure of Invention
The invention provides a printed circuit board and a preparation method thereof, which are used for solving the problems of bonding force between plates of the printed circuit board and signal loss of a conductive layer.
In order to solve the technical problems, the invention provides a preparation method of a printed circuit board, which comprises the following steps: obtaining a plurality of plates to be processed, wherein at least one side of the plates to be processed is provided with a conductive layer; performing brown-oxidizing treatment on the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth; dipping each target conductive layer through a silane coupling agent to form a silane coupling agent coating on the surface of each target conductive layer; and sequentially placing a plurality of plates to be processed and the multi-layer dielectric layers in a cross circulation mode and pressing to prepare the printed circuit board.
The step of dipping each target conductive layer through the silane coupling agent to form a silane coupling agent coating on the surface of each target conductive layer comprises the following steps: and cleaning the surface of each target conductive layer.
The step of brown-oxidizing the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth comprises the following steps: carrying out browning treatment on the target conductive layers in the plates to be processed through the browning liquid until the target conductive layers are etched to a preset depth; wherein the brown oxide liquid comprises a corrosion inhibitor; the step of cleaning the surface of each target conductive layer comprises the following steps: and removing the corrosion inhibitor on the surface of each target conductive layer.
The step of removing the corrosion inhibitor on the surface of each target conductive layer comprises the following steps: and soaking each target conductive layer by using an organic solvent at a first set temperature for a first set period of time to remove corrosion inhibitors on the surfaces of each target conductive layer.
The step of performing dipping treatment on each target conductive layer through the silane coupling agent to form a silane coupling agent coating on the surface of each target conductive layer comprises the following steps: performing hydrolysis treatment on the silane coupling agent to enable the silane coupling agent to form hydroxyl groups; and at a second set temperature, carrying out dipping treatment on each target conductive layer through the silane coupling agent after hydrolysis treatment, and continuing the second set time period so as to enable the hydroxyl on the surface of each target conductive layer and the hydroxyl on the silane coupling agent to carry out dehydration condensation to form covalent connection, thereby obtaining the silane coupling agent coating.
Wherein the step of hydrolyzing the silane coupling agent to form a hydroxyl group of the silane coupling agent comprises: preparing a silane coupling agent ethanol water solution with preset concentration, regulating the pH value of the silane coupling agent ethanol water solution to a preset range, fully stirring at a third set temperature, and continuing for a third set time period to carry out hydrolysis treatment.
Wherein the range of the preset concentration comprises 0.1-5.0 wt%; the range of the preset range comprises 3-5; the volume ratio of the ethanol to the water of the ethanol aqueous solution of the silane coupling agent is in the range of 5:1-20:1.
Wherein, the preset depth comprises: 50-300 nm.
Wherein the thickness of the silane coupling agent coating ranges from 50nm to 300 nm.
In order to solve the technical problems, the invention also provides a printed circuit board, which is prepared by the preparation method of the printed circuit board.
In order to solve the technical problems, the preparation method of the printed circuit board comprises the steps of carrying out brown-chemical treatment on target conductive layers in all plates to be processed until all target conductive layers are etched to a preset depth, carrying out dipping treatment on all target conductive layers through silane coupling agents, and forming a silane coupling agent coating on the surfaces of all target conductive layers; the method comprises the steps of sequentially and circularly arranging a plurality of plates to be processed and a plurality of dielectric layers in a crossing mode and pressing the plates to prepare the printed circuit board, so that the roughness of the surface of a target conductive layer is reduced through weak browning treatment, signal loss caused by the roughness is reduced, and the binding force between the plates to be processed and the dielectric layers is enhanced by utilizing the reactivity or compatibility of a silane coupling agent so as to make up for the improvement of the weak browning binding force, and meanwhile, the requirements of high-frequency communication equipment on low signal loss and high use reliability are met.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention;
Fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention;
FIG. 3 is a schematic illustration of an interface connection between a conductive layer and a silane coupling agent, according to one embodiment.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention.
Step S11: obtaining a plurality of plates to be processed, wherein at least one side of the plates to be processed is provided with a conductive layer.
The plate to be processed can comprise a dielectric layer and a conductive layer attached to at least one side of the dielectric layer. In a specific application scenario, the plate to be processed may include a dielectric layer and a conductive layer that are disposed in a laminated manner. In another specific application scenario, the plate to be processed may include a dielectric layer, a conductive layer, and a dielectric layer that are sequentially laminated. In this embodiment, the dielectric layer in any of the application scenarios may be obtained separately or in a mixed manner.
The conductive layer may include a copper layer, an aluminum layer, a silver layer, or an alloy layer, etc. for achieving an electrical function of the printed circuit board.
Step S12: and carrying out brown-in treatment on the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth.
The target conductive layer refers to a conductive layer of each board to be processed that is to be browned, which may include an inner conductive layer of a printed circuit board, and subsequently laminated in combination with a dielectric layer.
The preset depth of the browning treatment of the present embodiment is lower than that of the conventional browning treatment, and the browning treatment of the present embodiment belongs to the weak browning treatment. Compared with the traditional browning process, the browning treatment in the step can reduce the roughness of the surface of the target conductive layer, reduce the signal loss caused by the roughness, and meet the requirement of high-frequency communication equipment on low signal loss.
The browning treatment is a process of roughening the surface of the conductive layer and forming a layer of organic film on the roughened surface, wherein the main component of the organic film is benzotriazole compounds.
Step S13: and carrying out dipping treatment on each target conductive layer through a silane coupling agent so as to form a silane coupling agent coating on the surface of each target conductive layer.
The molecular structural formula of the silane coupling agent is generally Y-R-Si (OR) 3 (wherein Y is an organic functional group and SiOR is a siloxy group). The siloxy groups are reactive with inorganic materials and the organic functional groups are reactive or compatible with organic materials. Thus, when the silane coupling agent is interposed between the inorganic and organic interfaces, a bonding layer of an organic matrix-the silane coupling agent-the inorganic matrix can be formed.
And a silane coupling agent coating is formed on the surface of each target conductive layer, so that the reactivity or compatibility of the silane coupling agent can be utilized in the subsequent lamination process to strengthen the binding force between the plate to be processed and the dielectric layer, so as to compensate the improvement of the weak browning binding force, and further meet the requirements of high-frequency communication equipment on low signal loss and high use reliability.
Step S14: and sequentially placing a plurality of plates to be processed and the multi-layer dielectric layers in a cross circulation mode and pressing to prepare the printed circuit board.
When the printed circuit board is placed in a cross circulation mode, the printed circuit board can be placed based on the actual requirements of the printed circuit board, the target conductive layer and the dielectric layer are attached to each other, the conductive layers except the target conductive layer in the conductive layers are exposed to be placed, and lamination is carried out, so that the printed circuit board is prepared.
Through the steps, the preparation method of the printed circuit board of the embodiment carries out brown-chemical treatment on the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth, then carries out dipping treatment on the target conductive layers through the silane coupling agent, and forms a silane coupling agent coating on the surfaces of the target conductive layers; the method comprises the steps of sequentially and circularly arranging a plurality of plates to be processed and a plurality of dielectric layers in a crossing mode and pressing the plates to prepare the printed circuit board, so that the roughness of the surface of a target conductive layer is reduced through weak browning treatment, signal loss caused by the roughness is reduced, and the binding force between the plates to be processed and the dielectric layers is enhanced by utilizing the reactivity or compatibility of a silane coupling agent so as to make up for the improvement of the weak browning binding force, and meanwhile, the requirements of high-frequency communication equipment on low signal loss and high use reliability are met.
Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention.
Step S21: obtaining a plurality of plates to be processed, wherein at least one side of the plates to be processed is provided with a conductive layer.
A plurality of single-sided core boards or double-sided core boards are obtained. The single-sided core board or the double-sided core board is different in that the conductive layer is arranged on one side or on both sides.
And at least pasting, exposing, developing, etching and stripping the target conductive layers of the single-sided core plate or the double-sided core plate to form conductive circuits on each target conductive layer.
And finally, performing alkali washing and cleaning on the plate to remove stains such as greasy dirt, impurities and the like on the plate, thereby obtaining the plate to be processed.
In a specific application scenario, the process of drilling and electroplating the plate to be processed to prepare the metallized holes can be performed based on actual requirements, which is not limited herein.
Step S22: and carrying out brown-in treatment on the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth.
Carrying out brown treatment on the target conductive layers in the plates to be processed through brown treatment liquid until each target conductive layer is etched to a preset depth; the preset depth comprises: 50-300 nm, specifically 50nm, 60 nm, 100 nm, 120 nm, 150 nm, 170 nm, 200nm, 230 nm, 250 nm, 260 nm, 280 nm or 300 nm, etc.
The preset depth of the embodiment is lower than the biting depth of the conventional browning treatment step, so that the roughness of the surface of the copper foil is reduced, and the signal loss caused by the roughness is effectively reduced.
Wherein, the browning liquid browning treatment liquid generally comprises: sulfuric acid, hydrogen peroxide, corrosion inhibitors, halogen ions, binding force promoters, water and the like. The corrosion inhibitor has poor suitability for the polyphenyl ether resin prepreg, influences the binding force between subsequent plates, and is removed in the subsequent steps.
The specific surface area of the copper surface is increased through weak browning treatment, and the roughened copper surface is formed, so that the direct physical binding force between the roughened copper surface and the dielectric layer is increased, and the situation that signal transmission is influenced by excessive deep biting is avoided.
Step S23: and cleaning the surface of each target conductive layer.
And cleaning the surfaces of the target conductive layers to remove corrosion inhibitors on the surfaces of the target conductive layers.
Specifically, at a first set temperature, soaking each target conductive layer by using an organic solvent for a first set period of time to remove corrosion inhibitors on the surfaces of each target conductive layer. The organic solvent comprises one or more of methanol, ethanol, toluene, chloroform, etc.
The first set temperature ranges from 30 to 40 degrees celsius, and may specifically be 30 degrees celsius, 32 degrees celsius, 34 degrees celsius, 35 degrees celsius, 36 degrees celsius, 37 degrees celsius, 39 degrees celsius, 40 degrees celsius, or the like. The first set period of time may be in the range of 30 to 60 seconds, specifically 30 seconds, 35 seconds, 41 seconds, 46 seconds, 49 seconds, 52 seconds, 56 seconds, 60 seconds, or the like.
The organic solvent is used for soaking each target conductive layer, so that corrosion inhibitors attached to the surface of the target conductive layer in the browning process can be removed while the surface configuration of the target conductive layer is not changed, and the surface of the conductive layer is exposed to prepare for the next step of dipping the silane coupling agent.
In a specific application scenario, when the target conductive layer is a copper layer, the corrosion inhibitor attached to the surface of the copper layer in the browning process is removed by soaking each copper layer in an organic solvent, so that Cu xOy on the surface of the copper layer is exposed. Cu xOy is mainly CuO and Cu 2 O.
The corrosion inhibitor is cleaned, so that the situation that the bonding force between the plates is affected after the subsequent lamination of the corrosion inhibitor is avoided.
Step S24: the silane coupling agent is subjected to hydrolysis treatment so that the silane coupling agent forms hydroxyl groups.
Preparing an ethanol aqueous solution of a silane coupling agent with preset concentration; the range of the predetermined concentration includes 0.1 to 5.0wt%, specifically, 0.1wt%, 0.6wt%, 1.0wt%, 1.5wt%, 1.9wt%, 2.3wt%, 2.6wt%, 3.0wt%, 3.5wt%, 3.9wt%, 4.1wt%, 4.6wt%, 5.0wt%, etc. The volume ratio of the ethanol to the water of the ethanol aqueous solution of the silane coupling agent is in the range of 5:1-20:1, and can be specifically 5:1, 7:1, 10:1, 13:1, 15:1, 18:1 or 20:1, etc.
And adjusting the pH value of the ethanol aqueous solution of the silane coupling agent to a preset range by utilizing glacial acetic acid, fully stirring at a third set temperature, and continuously performing hydrolysis treatment for a third set period of time to enable the silane coupling agent to form hydroxyl groups.
The range of the preset range includes 3 to 5, and specifically can be 3,4 or 5, etc. The third set temperature is normal temperature, and the third set time is 0.5-2 hours, specifically, 0.5 hour, 1 hour, 1.5 hours, 2 hours, etc.
Step S25: and (3) carrying out dipping treatment on each target conductive layer through the silane coupling agent after hydrolysis treatment at a second set temperature, and continuing the second set time period so as to enable the hydroxyl on the surface of each target conductive layer to be subjected to dehydration condensation with the hydroxyl on the silane coupling agent to form covalent connection, thereby obtaining the silane coupling agent coating.
The second set temperature ranges from 40 to 60 degrees celsius, and may specifically be 40 degrees celsius, 42 degrees celsius, 45 degrees celsius, 49 degrees celsius, 52 degrees celsius, 53 degrees celsius, 56 degrees celsius, 59 degrees celsius, 60 degrees celsius, or the like.
The second set period of time ranges from 60 to 90 seconds, and may specifically be 60 seconds, 65 seconds, 69 seconds, 75 seconds, 79 seconds, 82 seconds, 86 seconds, 90 seconds, or the like.
In a specific application scenario, when the conductive layer comprises a copper layer, the plate to be processed is immersed in the coupling agent solution at 40-60 ℃ for 60-90 s. The hydroxyl on the surface of the copper layer and the hydroxyl on the silane coupling agent are dehydrated and condensed through the silane coupling agent treatment, so that Cu-O-Si covalent bond connection is formed. Wherein the silane coupling agent solution may include: KH550 (γ -aminopropyl triethoxysilane), KH560 (γ -glycidoxypropyl trimethoxysilane), KH570 (γ - (methacryloyloxy) propyl trimethoxysilane), and the like.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating an interface connection between a conductive layer and a silane coupling agent according to an embodiment.
In this embodiment, the target conductive layer 31 is a copper layer, and the silane coupling agent is KH 550. The step is to impregnate each target conductive layer 31 by the silane coupling agent after hydrolysis treatment, so that the hydroxyl groups on the surface of each target conductive layer 31 and the hydroxyl groups on the silane coupling agent are dehydrated and condensed to form Cu-O-Si covalent connection, and the silane coupling agent coating 32 is obtained.
The thickness of the silane coupling agent coating ranges from 50 nm to 300nm, and can be specifically 50 nm, 60 nm, 62 nm, 69 nm, 70 nm, 76 nm, 85 nm, 92 nm, 110 nm, 126 nm, 135 nm, 145 nm, 168 nm, 182 nm, 193 nm, 200 nm, 210 nm, 230 nm, 256 nm, 268 nm, 290 nm or 300nm, etc.
Step S26: and sequentially placing a plurality of plates to be processed and the multi-layer dielectric layers in a cross circulation mode and pressing to prepare the printed circuit board.
This step is the same as step S14 of the previous embodiment, please refer to the previous description.
The dielectric layer may include one or more of prepregs, epoxy resins, polyester resins (PET), polyimides, polycarbonates (PC), bismaleimide triazines (Bismaleimide Triazine, BT), ceramic-based, and like insulating materials.
When the high-temperature treatment is carried out under the high pressure, the high-activity organic functional group of the silane coupling agent can react with the resin, and the silane coupling agent and the resin form covalent bond connection, so that the binding force between the plate to be processed and the dielectric layer is improved.
In a specific application scenario, the board may also be subjected to metallized hole preparation, solder resist ink coating, surface treatment, etc. after lamination to prepare a printed circuit board.
The preparation method of the printed circuit board comprises the steps of carrying out brown-chemical treatment on target conductive layers in all plates to be processed until all target conductive layers are etched to a preset depth, carrying out dipping treatment on all target conductive layers through silane coupling agents, and forming a silane coupling agent coating on the surfaces of all target conductive layers; the method comprises the steps of sequentially and circularly arranging a plurality of plates to be processed and a plurality of dielectric layers in a crossing mode and laminating the plates to be processed and the dielectric layers to prepare the printed circuit board, so that the roughness of the surface of a target conductive layer is reduced through weak browning treatment, signal loss caused by the roughness is reduced, the binding force between the plates to be processed and the dielectric layers is enhanced by utilizing the reactivity or compatibility of a silane coupling agent, the improvement of weak browning binding force is made up, the requirements of high-frequency communication equipment on low signal loss and high use reliability are met, and the reliability of the printed circuit board is ensured.
Specifically, compared with the traditional browning process, the weak browning process can reduce the roughness of the surface of the target conductive layer and reduce the signal loss caused by the roughness; removing the organic corrosion inhibitor on the surface of the target conductive layer under the condition of not changing the surface configuration of the target conductive layer by using a surface strengthening process, and avoiding the interlayer interconnection problem caused by poor compatibility of the corrosion inhibitor and the dielectric layer; and a chemical connection is formed between the target conductive layer and the dielectric layer by dipping the silane coupling agent, so that interlayer bonding force and thermal stability are provided.
Based on the same inventive concept, the invention also provides a printed circuit board, which is prepared by the preparation method of the printed circuit board in any embodiment.
The printed circuit board of the embodiment is suitable for the fields of high-reliability photoelectric interconnection field, high-frequency transmission field and the like.
Therefore, the dielectric layer and the inner conductive layer of the printed circuit board are combined and fixed through the weak browning and the silane coupling agent coating, so that the roughness of the surface of the inner conductive layer is reduced through the weak browning treatment, the signal loss caused by the roughness is reduced, and the bonding force between the plate to be processed and the dielectric layer is enhanced by utilizing the reactivity or the compatibility of the silane coupling agent, so that the improvement of the weak browning bonding force is compensated, and the requirements of high-frequency communication equipment on low signal loss and high use reliability are met. The printed circuit board of the embodiment has lower roughness and specific surface area, and the suitability between the inner conductive layer and the dielectric layer is wider, and the binding force and the thermal stability are higher.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The preparation method of the printed circuit board is characterized by comprising the following steps of:
obtaining a plurality of plates to be processed, wherein at least one side of the plates to be processed is provided with a conductive layer;
Performing brown-oxidizing treatment on the target conductive layers in the plates to be processed until the target conductive layers are etched to a preset depth;
Dipping each target conductive layer through a silane coupling agent to form a silane coupling agent coating on the surface of each target conductive layer;
And sequentially placing a plurality of plates to be processed and the multi-layer dielectric layers in a cross circulation mode and pressing to prepare the printed circuit board.
2. The method of manufacturing a printed circuit board according to claim 1, wherein the step of impregnating each of the target conductive layers with a silane coupling agent to form a silane coupling agent coating layer on the surface of each of the target conductive layers comprises:
And cleaning the surface of each target conductive layer.
3. The method of manufacturing a printed circuit board according to claim 2, wherein the step of browning the target conductive layers in the respective boards to be processed until the target conductive layers are etched to a predetermined depth comprises:
Carrying out browning treatment on the target conductive layers in the plates to be processed through the browning liquid until the target conductive layers are etched to a preset depth; wherein the brown oxide liquid comprises a corrosion inhibitor;
the step of cleaning the surface of each target conductive layer comprises the following steps:
and removing the corrosion inhibitor on the surface of each target conductive layer.
4. The method of manufacturing a printed circuit board of claim 3, wherein the step of removing the corrosion inhibitor from the surface of each of the target conductive layers comprises:
And soaking each target conductive layer by using an organic solvent at a first set temperature for a first set period of time to remove corrosion inhibitors on the surfaces of each target conductive layer.
5. The method of manufacturing a printed circuit board according to claim 1, wherein the step of impregnating each of the target conductive layers with a silane coupling agent to form a silane coupling agent coating layer on the surface of each of the target conductive layers comprises:
performing hydrolysis treatment on the silane coupling agent to enable the silane coupling agent to form hydroxyl groups;
and at a second set temperature, carrying out dipping treatment on each target conductive layer through the silane coupling agent after hydrolysis treatment, and continuing the second set time period so as to enable the hydroxyl on the surface of each target conductive layer and the hydroxyl on the silane coupling agent to carry out dehydration condensation to form covalent connection, thereby obtaining the silane coupling agent coating.
6. The method of manufacturing a printed circuit board according to claim 5, wherein the step of hydrolyzing the silane coupling agent to form a hydroxyl group comprises:
Preparing an ethanol aqueous solution of a silane coupling agent with preset concentration;
And adjusting the pH value of the ethanol water solution of the silane coupling agent to a preset range, fully stirring at a third set temperature, and continuously performing hydrolysis treatment for a third set period of time.
7. The method of manufacturing a printed circuit board according to claim 6, wherein the predetermined concentration range includes 0.1 to 5.0wt%; the range of the preset range comprises 3-5; the volume ratio of the ethanol to the water of the ethanol aqueous solution of the silane coupling agent is in the range of 5:1-20:1.
8. The method of manufacturing a printed circuit board according to claim 1, wherein the thickness of the silane coupling agent coating layer ranges from 50 to 300 nanometers.
9. The method for manufacturing a printed circuit board according to claim 1, wherein the preset depth comprises: 50-300 nm.
10. A printed circuit board, characterized in that it is produced by the method for producing a printed circuit board according to any one of the preceding claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211566891.8A CN118158921A (en) | 2022-12-07 | 2022-12-07 | Printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211566891.8A CN118158921A (en) | 2022-12-07 | 2022-12-07 | Printed circuit board and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN118158921A true CN118158921A (en) | 2024-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211566891.8A Pending CN118158921A (en) | 2022-12-07 | 2022-12-07 | Printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118158921A (en) |
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2022
- 2022-12-07 CN CN202211566891.8A patent/CN118158921A/en active Pending
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