CN118149717B - Integrated multi-point film thickness measuring system and method - Google Patents
Integrated multi-point film thickness measuring system and method Download PDFInfo
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- CN118149717B CN118149717B CN202410586335.XA CN202410586335A CN118149717B CN 118149717 B CN118149717 B CN 118149717B CN 202410586335 A CN202410586335 A CN 202410586335A CN 118149717 B CN118149717 B CN 118149717B
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000523 sample Substances 0.000 claims abstract description 91
- 238000005259 measurement Methods 0.000 claims abstract description 86
- 230000005540 biological transmission Effects 0.000 claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 56
- 238000003384 imaging method Methods 0.000 claims abstract description 29
- 230000001360 synchronised effect Effects 0.000 claims abstract description 29
- 238000001228 spectrum Methods 0.000 claims abstract description 27
- 238000004891 communication Methods 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims description 43
- 239000013307 optical fiber Substances 0.000 claims description 41
- 238000000701 chemical imaging Methods 0.000 claims description 9
- 230000009466 transformation Effects 0.000 claims description 3
- 239000000835 fiber Substances 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 78
- 238000010586 diagram Methods 0.000 description 10
- 238000000691 measurement method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000005305 interferometry Methods 0.000 description 6
- 238000004556 laser interferometry Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
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Abstract
The invention provides an integrated multi-point film thickness measuring system and method, belonging to the technical field of film thickness measurement, wherein the system comprises: the system comprises a data processing module, a synchronous motor control module, a fiber multiplexer, a probe unit, a data processing module, a spectrum imaging module, a data processing module and a spectrum imaging module, wherein the data processing module is used for sending a control instruction, receiving transmission data, obtaining the film thickness of a sample to be detected based on the transmission data, the synchronous motor control module is in communication connection with the data processing module, and is used for controlling the fiber multiplexer and the probe unit to synchronously operate based on the control instruction, obtaining the transmission data of multi-point measurement, sending the transmission data of the multi-point measurement to the data processing module, the spectrum imaging module is in communication connection with the data processing module, and is used for collecting interference light formed on the surface of the sample to be detected, generating the transmission data of a two-dimensional image based on the interference light, and sending the transmission data of the two-dimensional image to the data processing module. The invention improves the measurement accuracy of measuring large-size objects and measuring non-uniform film thickness distribution.
Description
Technical Field
The invention relates to the technical field of film thickness measurement, in particular to an integrated multi-point film thickness measurement system and method.
Background
In the fields of optics, electronics, nanoscience and material science, it is very important to measure the thin film accurately. The thickness distribution information of the film has key significance for ensuring the quality of products, researching the material characteristics and optimizing the process parameters. In the conventional thin film thickness measurement method, single point measurement techniques are widely used, including laser interferometry and white light interferometry. However, these methods have a limit in measuring large-sized objects or high-precision measurement.
The laser interferometry method cannot accurately measure the film thickness when the film thickness exceeds a certain range due to the phase wrapping problem. This limits the application of laser interferometry to large-sized objects. The solution error of the white light interferometry method increases along with the increase of the surface height of the measured sample, and the requirement of high precision cannot be met. The conventional film thickness measurement method also has a certain limitation on samples with complex surface morphology.
Therefore, the technical problem of low measurement accuracy exists in the prior art for measuring large-size objects and measuring non-uniform film thickness distribution.
Disclosure of Invention
In view of the foregoing, it is desirable to provide an integrated multi-point film thickness measuring system and method for solving the technical problem of low measurement accuracy in measuring large-sized objects and non-uniform film thickness distribution.
In order to solve the above technical problems, in one aspect, the present invention provides an integrated multi-point film thickness measurement system and method, including:
the data processing module is used for sending a control instruction, receiving transmission data and obtaining the film thickness of the sample to be detected based on the transmission data;
The synchronous motor control module is in communication connection with the data processing module and is used for controlling the optical fiber multiplexer and the probe unit to synchronously operate based on the control instruction, obtaining transmission data of multi-point measurement and sending the transmission data of the multi-point measurement to the data processing module;
the spectrum imaging module is in communication connection with the data processing module and is used for collecting interference light formed on the surface of the sample to be detected, generating transmission data of the two-dimensional image based on the interference light and sending the transmission data of the two-dimensional image to the data processing module.
In one possible implementation manner, the obtaining the film thickness of the sample to be measured based on the transmission data includes:
and carrying out Fourier transformation and data fitting based on the transmission data to obtain the film thickness of the sample to be detected.
In one possible implementation, the system further includes: the white light source module is used for generating an incident light signal in a required wavelength range and transmitting the incident light signal to the optical fiber multiplexer;
the optical fiber multiplexer is in communication connection with the white light source module, and is used for decomposing based on the incident light signals to obtain a plurality of channel signals and transmitting the plurality of channel signals to the spectrum imaging module.
In one possible implementation, the spectral imaging module is further communicatively coupled to a fiber optic multiplexer for generating transmission data of the two-dimensional image based on the plurality of channel signals and the interference light.
In one possible implementation manner, the white light source module includes: a white light source for providing a broadband light source, based on which an incident light signal in a desired wavelength range is generated.
In one possible implementation manner, the white light source module further includes: and the collimation unit is in communication connection with the white light source and is used for carrying out collimation treatment on incident light signals within a required wavelength range.
In one possible implementation manner, the controlling, based on the control instruction, the synchronous operation of the optical fiber multiplexer and the probe unit to obtain the transmission data of the multi-point measurement includes:
And controlling the synchronous operation of the channel of the optical fiber multiplexer and the probe unit based on the control instruction, and simultaneously controlling the emergent signal of the optical fiber multiplexer to correspond to the probe in the probe unit, so as to obtain the transmission data of the multipoint measurement.
In one possible implementation, the system further includes: a beam splitter for splitting light focused on the surface of the sample to be measured by the incident light signal into a reflected part of the light signal and a transmitted part of the light signal;
And the probe unit is used for receiving the reflected part optical signal and the transmitted part optical signal of the surface of the sample to be detected and sending the reflected part optical signal and the transmitted part optical signal to the optical fiber multiplexer.
In one possible implementation, the optical fiber multiplexer is configured to send the reflected portion of the optical signal and the transmitted portion of the optical signal to the spectral imaging module;
and the spectrum imaging module is in communication connection with the optical fiber multiplexer and is used for generating transmission data of the two-dimensional image based on the plurality of channel signals, the interference light, the reflected part optical signals and the transmitted part optical signals.
On the other hand, the invention also provides an integrated multi-point film thickness measuring method, which comprises the following steps:
The method comprises the steps of sending a control instruction through a data processing module, receiving transmission data, and obtaining the film thickness of a sample to be detected based on the transmission data;
the synchronous motor control module controls the optical fiber multiplexer and the probe unit to synchronously operate based on the control instruction to obtain transmission data of multi-point measurement, and the transmission data of the multi-point measurement is sent to the data processing module;
the method comprises the steps of collecting interference light formed on the surface of a sample to be detected through a spectrum imaging module, generating transmission data of a two-dimensional image based on the interference light, and sending the transmission data of the two-dimensional image to a data processing module.
The beneficial effects of the application are as follows: the application provides an integrated multi-point film thickness measuring system, which comprises: the device comprises a data processing module, a synchronous motor control module and a spectrum imaging module, wherein the data processing module is used for sending control instructions, receiving transmission data, obtaining the film thickness of a sample to be detected based on the transmission data, the synchronous motor control module is in communication connection with the data processing module, and is used for controlling the synchronous operation of an optical fiber multiplexer and a probe unit based on the control instructions, obtaining transmission data of multi-point measurement, sending the transmission data of the multi-point measurement to the data processing module, and the spectrum imaging module is in communication connection with the data processing module and is used for collecting interference light formed on the surface of the sample to be detected, generating transmission data of a two-dimensional image based on the interference light and sending the transmission data of the two-dimensional image to the data processing module. Furthermore, the synchronous motor is used for controlling the synchronous operation of the optical fiber multiplexer and the probe unit, so that the incident optical signals and the emergent optical signals are controlled to correspond one by one, the multi-point measurement is realized, the limitation of the traditional film thickness measurement method is overcome, and the technical problem that the measurement precision is not high in the measurement of large-size objects and the measurement of uneven film thickness distribution is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of an integrated multi-point film thickness measurement system according to the present invention;
FIG. 2 is a schematic diagram of a white light source module according to an embodiment of the integrated multi-point film thickness measurement system provided by the present invention;
FIG. 3 is a schematic diagram of an optical fiber multiplexer according to an embodiment of the integrated multi-point film thickness measurement system provided by the present invention;
FIG. 4 is a schematic view of a beam splitter according to an embodiment of the integrated multi-point film thickness measurement system provided by the present invention;
FIG. 5 is a schematic diagram of a probe unit of an embodiment of an integrated multi-point film thickness measurement system according to the present invention;
FIG. 6 is a schematic end view of a reflective probe of one embodiment of an integrated multi-point film thickness measurement system provided by the present invention;
FIG. 7 is a schematic view of an imaging optical path of a surface of a sample to be measured according to an embodiment of the integrated multi-point film thickness measurement system provided by the present invention;
Fig. 8 is a schematic structural diagram of an embodiment of an integrated multi-point film thickness measurement method according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the embodiments of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. "and/or", describes an association relationship of an associated object, meaning that there may be three relationships, for example: a and/or B may represent: a exists alone, A and B exist together, and B exists alone.
References to "first," "second," etc. in the embodiments of the present invention are for descriptive purposes only and are not to be construed as indicating or implying a relative importance or the number of technical features indicated. Thus, a technical feature defining "first", "second" may include at least one such feature, either explicitly or implicitly.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The invention provides an integrated multi-point film thickness measuring system and method, which are respectively described below.
Fig. 1 is a schematic structural diagram of an embodiment of an integrated multi-point film thickness measurement system according to the present invention, where, as shown in fig. 1, the integrated multi-point film thickness measurement system includes:
the data processing module 110 is configured to send a control instruction, receive transmission data, and obtain a film thickness of a sample to be measured based on the transmission data;
The synchronous motor control module 120 is in communication connection with the data processing module 110, and is used for controlling the optical fiber multiplexer and the probe unit to synchronously operate based on the control instruction, obtaining transmission data of multi-point measurement, and sending the transmission data of the multi-point measurement to the data processing module 110;
the spectrum imaging module 130 is in communication connection with the data processing module 110, and is configured to collect interference light formed on the surface of the sample to be tested, generate transmission data of the two-dimensional image based on the interference light, and send the transmission data of the two-dimensional image to the data processing module 110.
It should be noted that, the integrated multi-point film thickness measuring system provided by the embodiment of the invention includes: a white light source module, an optical interference module, a synchronous motor control module 120, a spectrum imaging module 130 and a data processing module 110;
A white light source module 210 for providing a broadband light source, generating an incident light signal within a desired wavelength range and entering the optical interference module;
the optical interference module is used for transmitting an incident light signal to a sample to be detected, obtaining reflected light and transmitted light according to the incident light signal, and transmitting an emergent light signal to the spectrum imaging module;
the synchronous motor control module 120 is used for controlling the synchronous operation of the optical fiber multiplexer and the probe unit to realize multi-point measurement;
The spectrum imaging module 130 is used for collecting position information images and intensity information images of the reflected light and the transmitted light;
The data processing module 110 is used for processing the image obtained by the spectrum imaging module and calculating the film thickness value of the sample to be detected according to the processing result.
It can be understood that, by setting the optical interference module and the synchronous motor control module 120 in the integrated multi-point film thickness measuring system, the integrated multi-point film thickness measuring system provided by the embodiment of the application can realize the multi-point film thickness measurement of the sample to be measured in the same film thickness measuring system, overcomes the limitation that only a single point can be measured in the film thickness measurement, and achieves the technical effect that the same integrated multi-point film thickness measuring system can realize the film thickness measurement of different points of the sample, namely: the multi-point high-precision film thickness measurement of the same film thickness measurement system can be realized, and the applicability of the film thickness measurement system is improved.
It is further understood that the data processing module 110 includes pc (Personal Computer) machines, and the application discloses an integrated multi-point film thickness measuring system, which includes a white light source module, an optical interference module, a synchronous motor control module 120, a spectrum imaging module 130 and a data processing module 110; the white light source module is used for providing a broadband light source and generating an incident light signal in a required wavelength range; the optical interference module is used for focusing incident light signals at different positions on the surface of the sample to be detected to form reflected light and transmitted light; the synchronous motor control module 120 is used for controlling the optical fiber multiplexer to synchronously operate with the probe unit and realizing multi-point measurement; the spectrum imaging module 130 is used for collecting interference light formed on the surface of the sample to be detected and generating a two-dimensional image with a position dimension and an intensity dimension; the data processing module 110 is used for controlling the synchronous motor control module, analyzing the two-dimensional image, obtaining the film thickness of the sample to be measured according to data processing, realizing multi-point measurement, overcoming the limitation of the traditional film thickness measurement method and solving the technical problem of low measurement precision in the measurement of large-size objects and the measurement of non-uniform film thickness distribution.
In some embodiments of the present invention, the obtaining the film thickness of the sample to be measured based on the transmission data includes:
and carrying out Fourier transformation and data fitting based on the transmission data to obtain the film thickness of the sample to be detected.
The data processing module 110 is configured to process the image obtained by the spectrum imaging module, calculate a film thickness value of the sample to be measured according to the processing result, and calculate the film thickness value of the sample to be measured according to the processing result.
Fig. 2 is a schematic structural diagram of a white light source module according to an embodiment of the integrated multi-point film thickness measurement system provided by the present invention, including: a white light source module 210 for generating an incident light signal within a desired wavelength range and transmitting the incident light signal to the optical fiber multiplexer;
The optical fiber multiplexer is communicatively connected to the white light source module 210, and is configured to decompose the incident light signal to obtain a plurality of channel signals, and send the plurality of channel signals to the spectral imaging module 130.
It should be noted that, in order to increase the number of sampling points, the optical interference module includes an optical fiber multiplexer, a beam splitter, and a probe unit.
The optical fiber multiplexer is used for decomposing an incident optical signal into a plurality of channel signals and connecting the optical interference module and the spectrum imaging module.
Fig. 3 is a schematic structural diagram of an optical fiber multiplexer of an embodiment of an integrated multi-point film thickness measurement system according to the present invention, including:
The spectral imaging module 130 is also communicatively coupled to the fiber optic multiplexer for generating transmission data of the two-dimensional image based on the plurality of channel signals and the interference light.
It should be noted that, the spectrum imaging module 130 includes an image light path and a spectrometer, and the incident light signal generates reflection and transmission signals on the surface of the sample to be measured; and the spectrometer is used for collecting interference light on the surface of the sample to be detected and generating a two-dimensional image with a position dimension and an intensity dimension.
In some embodiments of the present invention, the white light source module 210 includes: a white light source 211 for providing a broadband light source, based on which an incident light signal in a desired wavelength range is generated.
It should be noted that, in order to avoid poor measurement accuracy of the integrated multi-point film thickness measurement system, in some embodiments of the present application, a white light source 211 is used to provide a bandwidth light source, so as to generate an incident light signal within a desired wavelength range.
In some embodiments of the present invention, the white light source module 210 further includes: and a collimation unit 212, which is communicatively connected with the white light source 211 and is used for performing collimation processing on the incident light signals within the required wavelength range.
By performing collimation processing on the incident light signal generated by the white light source 211, the parallelism and uniformity of the incident light can be improved, so that the definition and accuracy of spectral imaging can be improved, and the film thickness accuracy of the sample to be measured can be improved.
In some embodiments of the present invention, the controlling the optical fiber multiplexer 310 and the probe unit to operate synchronously based on the control instruction, to obtain the transmission data of the multi-point measurement includes:
and controlling the synchronous operation of the channel of the optical fiber multiplexer 310 and the probe unit based on the control instruction, and simultaneously controlling the emergent signal of the optical fiber multiplexer 310 to correspond to the probe in the probe unit, so as to obtain the transmission data of the multipoint measurement.
It should be noted that, the synchronous motor control module 120 is configured to control the channel of the optical fiber multiplexer 310 to correspond to the probe unit one by one, and simultaneously control the optical fiber multiplexer 310 of the outgoing signal to correspond to the probe one by one, so that the sample to be measured can realize multi-point measurement.
It can be appreciated that, in the embodiment of the present application, the synchronous motor control module 120 selects the imaging optical path, so that the incident signal can strike different surface positions of the sample to be measured, thereby realizing multi-point measurement.
Fig. 4 is a schematic view of a beam splitter structure of an embodiment of an integrated multi-point film thickness measurement system provided by the present invention, fig. 5 is a schematic view of a probe unit of an embodiment of an integrated multi-point film thickness measurement system provided by the present invention, and fig. 6 is a schematic view of an end face of a reflection probe of an embodiment of an integrated multi-point film thickness measurement system provided by the present invention, including:
A beam splitter 410 for splitting light focused on the surface of the sample to be measured into a reflected part of the light signal and a transmitted part of the light signal;
The probe unit 510 is configured to receive the reflected part of the optical signal and the transmitted part of the optical signal of the surface of the sample to be measured, and send the reflected part of the optical signal and the transmitted part of the optical signal to the optical fiber multiplexer 310.
The beam splitter 410 is configured to split light into a reflective portion and a transmissive portion; a probe unit for receiving the reflected or transmitted light signal from the sample surface; the probe is a visible light-near infrared reflecting probe with reference pins, the end surface of the probe is shown in the schematic diagram, the center is the reflecting probe, and the periphery is an illumination unit.
FIG. 7 is a schematic view of an imaging optical path of a surface of a sample to be measured according to an embodiment of the integrated multi-point film thickness measurement system according to the present invention, including:
the optical fiber multiplexer 310 is configured to send the reflected part of the optical signal and the transmitted part of the optical signal to the spectral imaging module 130;
The spectral imaging module 130 is communicatively connected to the optical multiplexer 310, and is configured to generate transmission data of the two-dimensional image based on the plurality of channel signals, the interference light, the reflected portion of the optical signal, and the transmitted portion of the optical signal.
In order to verify the effectiveness of the integrated multi-point film thickness measuring system provided by the invention, the integrated multi-point film thickness measuring system is used for measuring a typical object, so that multi-point measurement can be realized, and the film thickness can be accurately measured within an error range. The availability and the effectiveness of the integrated multi-point film thickness measuring system are verified.
It will be appreciated that the incident light signal produces reflected and transmitted signals at the surface of the sample to be measured, as shown in fig. 8.
In summary, the embodiment of the invention realizes multi-point measurement by combining the optical interferometry technology and the film thickness measurement technology and utilizing the synchronous motor to control the one-to-one correspondence of the incident light signal and the emergent light signal, thereby overcoming the problems of single-point limitation, limitation of the traditional measurement method and the like in the film thickness measurement; the spectrum image is processed by a series of processing methods in the optical interferometry technology, and the film thickness of the sample to be measured is calculated, so that the high-precision film thickness measurement of the nano-millimeter structure device is realized, and the applicability of the film thickness measurement system is improved.
Fig. 8 is a schematic structural diagram of an embodiment of an integrated multi-point film thickness measurement method according to the present invention, including:
S801, a control instruction is sent through a data processing module, transmission data is received, and the film thickness of a sample to be detected is obtained based on the transmission data;
S802, controlling the optical fiber multiplexer and the probe unit to synchronously operate based on a control instruction through the synchronous motor control module to obtain transmission data of multi-point measurement, and sending the transmission data of the multi-point measurement to the data processing module;
S803, collecting interference light formed on the surface of the sample to be detected through the spectrum imaging module, generating transmission data of the two-dimensional image based on the interference light, and sending the transmission data of the two-dimensional image to the data processing module.
The invention provides an integrated multi-point film thickness measuring system and method, which are characterized in that a clearance data processing module is used for sending control instructions, receiving transmission data, obtaining film thickness of a sample to be measured based on the transmission data, a synchronous motor control module is in communication connection with the data processing module and is used for controlling an optical fiber multiplexer and a probe unit to synchronously operate based on the control instructions, obtaining transmission data of multi-point measurement, sending the transmission data of multi-point measurement to the data processing module, a spectrum imaging module is in communication connection with the data processing module and is used for collecting interference light formed on the surface of the sample to be measured, generating transmission data of a two-dimensional image based on the interference light and sending the transmission data of the two-dimensional image to the data processing module. According to the invention, by combining an optical interferometry technology and a film thickness measurement technology, the synchronous motor is utilized to control the one-to-one correspondence between an incident light signal and an emergent light signal, so that multi-point measurement is realized, and the problems of single-point limitation, limitation of a traditional measurement method and the like in film thickness measurement are overcome; the spectrum image is processed by a series of processing methods in the optical interferometry technology, and the film thickness of the sample to be measured is calculated, so that the high-precision film thickness measurement of the nano-millimeter structure device is realized, and the applicability of the film thickness measurement system is improved.
The above embodiments are merely for illustrating the design concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, the scope of the present invention is not limited to the above embodiments. Therefore, all equivalent changes or decorations according to the principles and design ideas disclosed by the invention are within the protection scope of the invention.
Claims (9)
1. An integrated multi-point film thickness measurement system, comprising:
the data processing module is used for sending a control instruction, receiving transmission data and obtaining the film thickness of the sample to be detected based on the transmission data;
The synchronous motor control module is in communication connection with the data processing module and is used for controlling the optical fiber multiplexer and the probe unit to synchronously operate based on the control instruction, obtaining transmission data of multi-point measurement and sending the transmission data of the multi-point measurement to the data processing module;
The spectrum imaging module is in communication connection with the data processing module and is used for collecting interference light formed on the surface of the sample to be detected, generating transmission data of the two-dimensional image based on the interference light and sending the transmission data of the two-dimensional image to the data processing module;
the method for controlling the synchronous operation of the optical fiber multiplexer and the probe unit based on the control instruction to obtain the transmission data of the multi-point measurement comprises the following steps:
The optical fiber multiplexer channels are controlled to be in one-to-one correspondence with the probe units based on the control instructions, and the optical fiber multiplexer of the emergent signal is controlled to be in one-to-one correspondence with the probe so as to select imaging light paths, so that the incident signal is transmitted to different surface positions of the sample to be measured, and transmission data of multipoint measurement are obtained.
2. The integrated multi-point film thickness measurement system according to claim 1, wherein the obtaining the film thickness of the sample to be measured based on the transmission data comprises:
and carrying out Fourier transformation and data fitting based on the transmission data to obtain the film thickness of the sample to be detected.
3. The integrated multi-point film thickness measurement system of claim 1, further comprising:
The white light source module is used for generating an incident light signal in a required wavelength range and transmitting the incident light signal to the optical fiber multiplexer;
the optical fiber multiplexer is in communication connection with the white light source module, and is used for decomposing based on the incident light signals to obtain a plurality of channel signals and transmitting the plurality of channel signals to the spectrum imaging module.
4. The integrated multi-point film thickness measurement system of claim 3, wherein the spectral imaging module is further communicatively coupled to the optical fiber multiplexer for generating transmission data of the two-dimensional image based on the plurality of channel signals and the interference light.
5. The integrated multi-spot film thickness measurement system according to claim 3, wherein the white light source module comprises: a white light source for providing a broadband light source, based on which an incident light signal in a desired wavelength range is generated.
6. The integrated multi-spot film thickness measurement system according to claim 5, wherein the white light source module further comprises: and the collimation unit is in communication connection with the white light source and is used for carrying out collimation treatment on incident light signals within a required wavelength range.
7. The integrated multi-point film thickness measurement system of claim 1, further comprising: a beam splitter for splitting light focused on the surface of the sample to be measured by the incident light signal into a reflected part of the light signal and a transmitted part of the light signal;
And the probe unit is used for receiving the reflected part optical signal and the transmitted part optical signal of the surface of the sample to be detected and sending the reflected part optical signal and the transmitted part optical signal to the optical fiber multiplexer.
8. The integrated multi-point film thickness measurement system of claim 7, wherein the optical fiber multiplexer is configured to send the reflected portion of the optical signal and the transmitted portion of the optical signal to the spectral imaging module;
and the spectrum imaging module is in communication connection with the optical fiber multiplexer and is used for generating transmission data of the two-dimensional image based on the plurality of channel signals, the interference light, the reflected part optical signals and the transmitted part optical signals.
9. An integrated multi-point film thickness measuring method applied to the integrated multi-point film thickness measuring system according to any one of claims 1 to 8, comprising:
The method comprises the steps of sending a control instruction through a data processing module, receiving transmission data, and obtaining the film thickness of a sample to be detected based on the transmission data;
the synchronous motor control module controls the optical fiber multiplexer and the probe unit to synchronously operate based on the control instruction to obtain transmission data of multi-point measurement, and the transmission data of the multi-point measurement is sent to the data processing module;
the method comprises the steps of collecting interference light formed on the surface of a sample to be detected through a spectrum imaging module, generating transmission data of a two-dimensional image based on the interference light, and sending the transmission data of the two-dimensional image to a data processing module.
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|---|---|---|---|---|
| KR100234202B1 (en) * | 1997-09-12 | 1999-12-15 | 윤종용 | High power pumping for optical fiber amplication |
| CN1110692C (en) * | 1999-12-02 | 2003-06-04 | 中国科学院上海光学精密机械研究所 | Semiconductor laser vibration excitation vibration measurer |
| US11346689B2 (en) * | 2015-12-02 | 2022-05-31 | Danmarks Tekniske Universitet | Optical measuring system with an interrogator and a polymer-based single-mode fibre-optic sensor system |
| CN111189398A (en) * | 2020-01-13 | 2020-05-22 | 中国计量大学 | Wafer film thickness measuring device based on white light interference method |
| CN112781509A (en) * | 2021-01-29 | 2021-05-11 | 冯宗宝 | Film thickness measuring device and film thickness measuring method |
| CN113267130B (en) * | 2021-06-11 | 2022-08-05 | 华中科技大学 | Line scanning film thickness measuring system |
| CN114002777B (en) * | 2021-11-15 | 2023-12-22 | 中山大学 | Multi-core multi-mode optical fiber multiplexer |
| CN117516391A (en) * | 2023-11-17 | 2024-02-06 | 四平宏大液压机械制造有限公司 | Automatic thickness measuring device for photovoltaic calendared glass |
-
2024
- 2024-05-13 CN CN202410586335.XA patent/CN118149717B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109238152A (en) * | 2018-08-31 | 2019-01-18 | 玻尔兹曼（广州）科技有限公司 | Online white light interference calibrator |
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