CN118106620A - Circuit processing system - Google Patents

Abstract

A circuit processing system is used for manufacturing a circuit on an insulating substrate, the insulating substrate comprises metal particles, and the circuit processing system comprises a laser etching unit and an electroplating unit. The laser etching unit comprises a laser source, a beam splitter and a plurality of light emitting components, wherein the laser source is used for emitting a first laser beam, the beam splitter is used for dividing the first laser beam into a plurality of second laser beams, each light emitting component is used for converting a two-laser beam into a processing laser beam, the plurality of processing laser beams are used for respectively etching and forming grooves on different surfaces of the insulating substrate at the same time, and the processing laser beams ablate metal particles to form an electroplating basal layer on the inner periphery of the grooves. The electroplating unit comprises an electroplating clamp and a power supply, wherein the electroplating clamp clamps the insulating substrate and is electrically connected with the electroplating basal layer, and the power supply is connected with the electroplating clamp to provide current required by forming an electroplating circuit on the electroplating basal layer.

Description

Circuit processing system

Technical Field

The application relates to circuit board processing, in particular to a circuit processing system.

Background

The laser processing has the characteristics of high processing precision, simple process flow and environmental protection, and the current laser processing technology is already applied to the field of circuit board processing, but the current laser processing system has low efficiency for circuit processing and poor flexibility.

Disclosure of Invention

In order to solve the above defects in the prior art, the application provides a circuit processing system.

A line processing system for fabricating a line on an insulating substrate, the insulating substrate comprising metal particles, the line processing system comprising:

the laser etching unit comprises a laser source, a beam splitter and a plurality of light emitting components, wherein the laser source is used for emitting a first laser beam, the beam splitter is used for dividing the first laser beam into a plurality of second laser beams, each light emitting component is used for converting one of the two laser beams into a processing laser beam, the plurality of processing laser beams are used for simultaneously etching and forming grooves on different surfaces of the insulating substrate respectively, and the processing laser beams ablate the metal particles to form an electroplating substrate layer on the inner periphery of the grooves;

The electroplating unit comprises an electroplating clamp and a power supply, wherein the electroplating clamp clamps the insulating substrate and is electrically connected with the electroplating basal layer, and the power supply is connected with the electroplating clamp to provide current required by forming an electroplating circuit on the electroplating basal layer.

Further, each light emitting assembly includes a galvanometer for deflecting the second laser beam and a field lens for converging the biased second laser beam to form the processing laser beam.

Further, the laser etching unit further includes a beam shaper disposed between the laser source and the beam splitter.

Further, the laser etching unit further comprises a light shielding assembly, the light shielding assembly is arranged between the light splitter and the galvanometer, the light shielding assembly comprises a driving piece and a light shielding plate, the light shielding plate penetrates through a light through hole, the driving piece drives the light shielding plate to move, so that the second laser beam penetrates through the light through hole, or the second laser beam is shielded by the light shielding plate.

Further, the laser etching unit further includes a plurality of energy monitoring modules, each energy monitoring module is connected to the beam splitter, the energy monitoring modules are configured to detect an energy value of each second laser beam, and produce a control command according to a difference between the plurality of energy values, and the beam splitter evenly distributes the energy of the first laser beam according to the control command.

Further, each energy monitoring module comprises a reflecting mirror, a focusing lens, a sensing piece and a controller, wherein the reflecting mirror is used for reflecting the second laser beam to enter the focusing lens, the focusing lens is arranged between the sensing piece and the reflecting mirror, the focusing lens is used for converging the second laser beam reflected by the reflecting mirror to the sensing piece, the sensing piece is connected with the controller, the sensing piece is used for sensing the energy value of the second laser beam, and the controller receives the energy value and forms the control instruction according to the energy value.

Further, the pulse width of the first laser beam is in the picosecond or femtosecond level.

Further, the electroplating clamp comprises a first clamping part and a second clamping part which is arranged at intervals with the first clamping part, the power supply is electrically connected with the first clamping part and the second clamping part, and the first clamping part and the second clamping part are electrically connected with the electroplating basal layer.

Further, the plating tank includes a bottom plate and a plurality of side plates, and a plurality of side plates are disposed on the periphery of the bottom plate to form a receiving space, where the receiving space can be used for receiving the plating solution, the plating jig, and the insulating substrate with a groove.

Further, the wavelength of the first laser beam is 193-355 nm, the power of the laser source is 0.9-2.1 w, or the power of the laser source is 0.9-3.11 w, and the wavelength of the first laser beam is 1030-1064 nm.

According to the circuit processing system provided by the application, the first laser beam emitted by the laser source is divided into a plurality of second laser beams, each second laser beam can be processed to form at least one groove on one side surface or two side surfaces of the insulating substrate, metal particles are ablated in the groove to form an electroplating basal layer, and then a circuit is formed on the electroplating basal layer through an electroplating unit. The circuit processing system can simultaneously form at least one groove on one side surface or two side surfaces of the insulating substrate, thereby being beneficial to improving the manufacturing efficiency of the circuit.

Drawings

Fig. 1 is a block diagram of a line processing system according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a laser etching unit of the line processing system shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of an electroplating unit of the line processing system shown in fig. 1.

Fig. 4 is a schematic diagram illustrating connection between the energy monitoring module and the beam splitter shown in fig. 1.

Fig. 5 is a schematic cross-sectional view of the circuit processing system of fig. 1 after processing an insulating substrate.

Description of the main reference signs

Line processing system 100

Insulating substrate 200

Electroplating line 201

Groove 202

Electroplating base layer 203

Metal particles 204

Laser etching unit 10

Laser source 11

First laser beam 111

Second laser beam 112

Machining laser beam 113

Beam splitter 12

Light splitting sheet 121

First driving member 122

Electroplating unit 20

Plating tank 21

Bottom plate 211

Side plate 212

Accommodation space 213

Electroplating solution 22

Electroplating clamp 23

First clamping portion 231

Second clamping portion 232

Power supply 24

Light emitting module 13

Vibrating mirror 131

Field lens 132

Beam shaper 14

Light shielding assembly 15

Second driving piece 151

Mask 152

Light-passing hole 153

Energy monitoring module 16

Mirror 161

Focusing lens 162

Sensing element 163

Controller 164

The application will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Referring to fig. 1 and 5, an embodiment of the present application provides a wire processing system 100, wherein the wire processing system 100 can be used to fabricate a plated wire 201 on an insulating substrate 200. The line processing system 100 includes a laser etching unit 10 and an electroplating unit 20. The laser etching unit 10 is used for etching the insulating substrate 200 by laser to form a groove 202 on at least one surface of the insulating substrate 200. The plating unit 20 is used to form the plating line 201 on the inner periphery of the recess 202 by a plating reaction.

Referring to fig. 2, the laser etching unit 10 includes a laser source 11, a beam splitter 12, and a plurality of light emitting components 13. The laser source 11 is configured to emit a first laser beam 111. The beam splitter 12 is configured to split the first laser beam 111 into a plurality of second laser beams 112, and each of the second laser beams 112 is directed to one of the light emitting assemblies 13. The light extraction assembly 13 is configured to convert the second laser beam 112 into a processing laser beam 113, and the processing laser beam 113 is configured to etch the insulating substrate 200 to form a groove 202. Specifically, the laser source 11 is one of a fiber ultraviolet laser, a semiconductor laser, or a gas laser. The wavelength of the first laser beam 111 is 193-355 nm, the power of the laser source is 0.9-2.1 w, or the power of the laser source is 0.9-3.11 w, and the wavelength of the first laser beam 111 is 1030-1064 nm. The beam splitter 12 includes a beam splitter 121 and a first driving member 122, and the first driving member 122 can drive the beam splitter 121 to move, so as to change the energy density of each of the second laser beams 112 emitted from the beam splitter 121.

Referring to fig. 3, the plating unit 20 includes a plating tank 21, a plating solution 22, a plating jig 23, and a power supply 24. The plating solution 22 and the plating jig 23 are provided in the plating tank 21. The plating jig 23 holds the insulating substrate 200, and the plating liquid 22 submerges the recess 202. The power supply 24 is connected to the plating jig 23 to supply a current required to form the plating line 201 in the recess 202.

Referring to fig. 2 and 5, in the present embodiment, metal particles 204 are dispersed in the insulating substrate 200, and the processing laser beam 113 ablates the metal particles 204 exposed at the inner periphery of the groove 202, thereby forming the plating base layer 203. The plating jig 23 is electrically connected to the plating base 203, and after the power supply 24 supplies current, the plating circuit 201 can be formed on the plating base 203 by electroplating. Specifically, the metal particles 204 are low melting point alloy particles.

The present application provides a line processing system 100, by dividing a first laser beam 111 emitted from a laser source 11 into a plurality of second laser beams 112, each of the second laser beams 112 may process one side or both sides of an insulating substrate 200 to form at least one groove 202, and ablate the metal particles in the groove 202 to form an electroplating base layer 203, and then form an electroplating line 201 on the electroplating base layer 203 by an electroplating unit 20. The circuit processing system 100 can simultaneously form at least one of the grooves 202 on one side or both sides of the insulating substrate 200, thereby facilitating the improvement of the manufacturing efficiency of the plating circuit 201.

Referring to fig. 2, in the present embodiment, each of the light emitting assemblies 13 includes a galvanometer 131 and a field lens 132. The galvanometer 131 is used for deflecting the second laser beam 112, and the field lens 132 is used for converging the deflected second laser beam 112 to form the processing laser beam 113. Specifically, the galvanometer 131 is an analog galvanometer or a digital galvanometer, and the field lens 132 is a fixed focus lens. In specific operation, when the wavelength of the first laser beam 111 is 193-355 nm, the scanning speed of the galvanometer 131 is 800-1600 mm/s, and when the wavelength of the first laser beam 111 is 1030-1064 nm, the scanning speed of the galvanometer 131 is 400-1400 mm/s.

Referring to fig. 2, in the present embodiment, the laser etching unit 10 further includes a beam shaper 14, where the beam shaper 14 is disposed between the laser source 11 and the beam splitter 12, and the beam shaper 14 is configured to screen out a specific frequency and a specific polarization state of the first laser beam 111 emitted by the laser source 11, so that the first laser beam 111 is more uniform. Specifically, the beam shaper 14 includes a mirror provided with a scribe line, and the intensity of the spot of the first laser beam 111 emitted from the beam shaper 14 is in a gaussian distribution.

Referring to fig. 2, in the present embodiment, the laser etching unit 10 further includes a light shielding assembly 15, and the light shielding assembly 15 is disposed between the beam splitter 12 and the galvanometer 131. The light shielding assembly 15 includes a second driving member 151 and a light shielding plate 152 drivingly connected to the second driving member 151. The light shielding plate 152 is provided with a light passing hole 153. The second driving member 151 may drive the light shielding plate 152 to move, so that the second laser beam 112 passes through the light passing hole 153, or the second laser beam 112 is shielded by the light shielding plate 152, and by providing the light shielding assembly 15, at least part of the plurality of second laser beams 112 may be shielded, thereby improving flexibility of laser grooving. Specifically, when only a portion of the second laser beam 112 is required to process one side of the insulating substrate 200, the second laser beam 112 of another portion of the other side of the insulating substrate 200 may be shielded by moving the shielding plate 152.

Referring to fig. 2 and 4, in the present embodiment, the laser etching unit 10 further includes a plurality of energy monitoring modules 16, each of the energy monitoring modules 16 is connected to the beam splitter 12, the energy monitoring modules 16 are configured to detect an energy value of each of the second laser beams 112, and generate a control command according to a difference between the energy values, and the beam splitter 12 can evenly distribute the energy density of the first laser beam 111 according to the control command, so that the energy densities of each of the second laser beams 112 are the same, and further, the energy densities of each of the processing laser beams 113 are the same, so as to facilitate etching to form the grooves 202 with the same size.

Referring to fig. 2 and 4, in the present embodiment, the energy monitoring module 16 includes a mirror 161, a focusing lens 162, a sensing member 163, and a controller 164. The reflecting mirror 161 is configured to reflect the second laser beam 112 emitted from the beam splitter 12 (i.e., sample the second laser beam 112), and then the reflected second laser beam 112 enters the focusing lens 162, the focusing lens 162 converges the second laser beam 112 on the sensing element 163 (i.e., measures the second laser beam 112), the sensing element 163 measures an energy value and transmits the energy value to the controller 164, and the controller 164 forms the control command according to the energy value.

Referring to fig. 3, in the present embodiment, the plating tank 21 is substantially rectangular, and the plating tank 21 includes a bottom plate 211 and a plurality of side plates 212. The plurality of side plates 212 are disposed on the periphery of the bottom plate 211 to form a receiving space 213, and the receiving space 213 may be used to receive the plating solution 22, the plating jig 23, and the insulating substrate 200 with the grooves 202. Wherein the plating solution 22 comprises a copper sulfate solution.

Referring to fig. 3, in the present embodiment, the plating jig 23 includes a first clamping portion 231 and a second clamping portion 232 spaced from the first clamping portion 231, the insulating substrate 200 is clamped between the first clamping portion 231 and the second clamping portion 232, and the first clamping portion 231 and the second clamping portion 232 are electrically connected to the plating base layer 203.

Referring to fig. 3, in the present embodiment, the power source 24 is electrically connected to the first clamping portion 231 and the second clamping portion 232 through a wire (not shown), and the power source 24 is used for delivering direct current to the first clamping portion 231 and the second clamping portion 232.

The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application. Other modifications and variations to the present application will be apparent to those of ordinary skill in the art in light of the present teachings.

Claims (10)

1. A line processing system for fabricating a line on an insulating substrate, the insulating substrate comprising metal particles, the line processing system comprising:

the laser etching unit comprises a laser source, a beam splitter and a plurality of light emitting components, wherein the laser source is used for emitting a first laser beam, the beam splitter is used for dividing the first laser beam into a plurality of second laser beams, each light emitting component is used for converting one of the two laser beams into a processing laser beam, the plurality of processing laser beams are used for simultaneously etching and forming grooves on different surfaces of the insulating substrate respectively, and the processing laser beams ablate the metal particles to form an electroplating substrate layer on the inner periphery of the grooves;

The electroplating unit comprises an electroplating clamp and a power supply, wherein the electroplating clamp clamps the insulating substrate and is electrically connected with the electroplating basal layer, and the power supply is connected with the electroplating clamp to provide current required by forming an electroplating circuit on the electroplating basal layer.

2. The line processing system of claim 1, wherein each of the light extraction assemblies includes a galvanometer for deflecting the second laser beam and a field lens for converging the biased second laser beam to form the processing laser beam.

3. The line processing system of claim 1, wherein the laser etching unit further comprises a beam shaper disposed between the laser source and the beam splitter.

4. The line processing system of claim 2, wherein the laser etching unit further comprises a light shielding assembly, the light shielding assembly is disposed between the beam splitter and the galvanometer, the light shielding assembly comprises a driving member and a light shielding plate, the light shielding plate is provided with a light through hole in a penetrating manner, and the driving member drives the light shielding plate to move, so that the second laser beam passes through the light through hole or is shielded by the light shielding plate.

5. The line processing system of claim 1, wherein the laser etching unit further comprises a plurality of energy monitoring modules, each of the energy monitoring modules being connected to the beam splitter, the energy monitoring modules being configured to detect an energy value of each of the second laser beams and to produce a control command based on a difference between the plurality of energy values, the beam splitter being configured to evenly distribute the energy of the first laser beam based on the control command.

6. The line processing system of claim 5, wherein each of said energy monitoring modules comprises a mirror for reflecting said second laser beam into said focusing lens, a focusing lens disposed between said sensing element and said mirror for converging said second laser beam reflected by said mirror to said sensing element, a sensing element coupled to said controller for sensing an energy value of said second laser beam, and a controller for receiving said energy value and forming said control command based on said energy value.

7. The line processing system of claim 1, wherein the pulse width of the first laser beam is in the picosecond or femtosecond order.

8. The line processing system of claim 1, wherein the plating jig comprises a first clamping portion, a second clamping portion spaced apart from the first clamping portion, the power source electrically connected to the first clamping portion and the second clamping portion, the first clamping portion and the second clamping portion both electrically connected to the plating base layer.

9. The line processing system of claim 1, wherein the plating bath comprises a bottom plate and a plurality of side plates disposed on a periphery of the bottom plate to form a receiving space for receiving the plating solution, the plating jig, and the insulating substrate having the grooves.

10. The line processing system of claim 1, wherein the first laser beam has a wavelength of 193 nm to 355 nm, the laser source has a power of 0.9 watts to 2.1 watts, or

The wavelength of the first laser beam is 1030-1064 nanometers, and the power of the laser source is 0.9-3.11 watts.