TW202421317A - Circuit processing system - Google Patents

Abstract

A circuit processing system, which is used for making circuits on an insulating substrate. The insulating substrate includes metal particles, and the circuit processing system includes a laser etching unit. The laser etching unit includes a laser source, a beam splitter, and a plurality of light emitting components. The laser source is used to emit the first laser beam, the beam splitter is used to divide the first laser beam into a plurality of second laser beams, each light emitting component is used to convert a second laser beam into a processing laser beam, and a plurality of processing laser beams are used to etch groove on different surfaces of the insulating substrate at the same time, The laser beam is processed to ablate metal particles to form an electroplating base layer around the inner circumference of the groove.

Description

Line processing system

The present application relates to circuit board processing, and more particularly to a circuit processing system.

Laser processing has the characteristics of high processing precision, simple process flow and green environmental protection. Currently, laser processing technology has begun to be applied to the field of circuit board processing. However, the current laser processing system has low efficiency and poor flexibility for circuit processing.

To solve the above deficiencies of the prior art, the present application provides a circuit processing system.

A circuit processing system is used to manufacture circuits on an insulating substrate, wherein the insulating substrate includes metal particles. The circuit processing system includes:

A laser etching unit, the laser etching unit comprising a laser source, a beam splitter, and a plurality of light emitting components, the laser source is used to emit a first laser beam, the beam splitter is used to split the first laser beam into a plurality of second laser beams, each of the light emitting components is used to convert one of the second laser beams into a processing laser beam, the plurality of processing laser beams are used to simultaneously etch grooves on different surfaces of the insulating substrate, the processing laser beams ablate the metal particles to form an electroplated base layer on the inner periphery of the groove;

The electroplating unit includes an electroplating fixture and a power source. The electroplating fixture holds the insulating substrate and is electrically connected to the electroplating base layer. The power source is connected to the electroplating fixture to provide a current required to form a plating circuit on the electroplating base layer.

Furthermore, each of the light-emitting components includes a diaphragm and a field lens, wherein the diaphragm is used to deflect the second laser beam, and the field lens is used to converge the biased second laser beam to form the processing laser beam.

Furthermore, the laser etching unit further comprises a beam shaper, and the beam shaper is arranged between the laser source and the beam splitter.

Furthermore, the laser etching unit also includes a light shield assembly, which is arranged between the beam splitter and the oscillating mirror. The light shield assembly includes a driver and a light shielding plate. The light shielding plate is penetrated by a light-through hole. The driver drives the light shielding plate to move so that the second laser beam passes through the light-through hole, or the second laser beam is blocked by the light shielding plate.

Furthermore, the laser etching unit also includes a plurality of energy monitoring modules, each of which is connected to the spectrometer. The energy monitoring module is used to detect the energy value of each of the second laser beams and generate control instructions based on the difference between the plurality of energy values. The spectrometer evenly distributes the energy of the first laser beam according to the control instructions.

Furthermore, each of the energy monitoring modules includes a reflector, a focusing lens, a sensor, and a controller. The reflector is used to reflect the second laser beam into the focusing lens. The focusing lens is arranged between the sensor and the reflector. The focusing lens is used to converge the second laser beam reflected by the reflector to the sensor. The sensor is connected to the controller. The sensor is used to sense the energy value of the second laser beam. The controller receives the energy value and forms the control instruction according to the energy value.

Furthermore, the pulse width of the first laser beam is in the picosecond level or the femtosecond level.

Furthermore, the electroplating clamp includes a first clamping part and a second clamping part spaced apart from the first clamping part, the power source electrically connects the first clamping part and the second clamping part, and the first clamping part and the second clamping part are both electrically connected to the electroplating base layer.

Furthermore, the electroplating tank includes a bottom plate and a plurality of side plates, wherein the plurality of side plates are arranged around the bottom plate to form a receiving space, and the receiving space can be used to receive the electroplating solution, the electroplating fixture, and the insulating substrate having a groove.

Furthermore, the wavelength of the first laser beam is 193-355 nanometers, and the power of the laser source is 0.9-2.1 watts, or the power of the laser source is 0.9-3.11 watts, and the wavelength of the first laser beam is 1030-1064 nanometers.

The circuit processing system provided by the present application divides the first laser beam emitted by the laser source into a plurality of second laser beams, each of which can form at least one groove on one side or both sides of the insulating substrate, and ablate the metal particles in the groove to form an electroplated base layer, and then form a circuit on the electroplated base layer by an electroplating unit. The circuit processing system can simultaneously form at least one groove on one side or both sides of the insulating substrate, thereby facilitating improving the manufacturing efficiency of the circuit.

The following will combine the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or can also be located in a central element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or can also be located in a central element. When an element is considered to be "set on" another element, it can be directly set on the other element or can also be located in a central element.

Please refer to FIG. 1 and FIG. 5 , an embodiment of the present application provides a circuit processing system 100, which can be used to make an electroplated circuit 201 on an insulating substrate 200. The circuit processing system 100 includes a laser etching unit 10 and an electroplating unit 20. The laser etching unit 10 is used to form a groove 202 on at least one surface of the insulating substrate 200 by laser etching. The electroplating unit 20 is used to form the electroplated circuit 201 on the inner periphery of the groove 202 by electroplating reaction.

Please refer to FIG. 2 , the laser etching unit 10 includes a laser source 11, a beam splitter 12, and a plurality of light emitting components 13. The laser source 11 is used to emit a first laser beam 111. The beam splitter 12 is used to split the first laser beam 111 into a plurality of second laser beams 112, each of which is directed toward one of the light emitting components 13. The light emitting component 13 is used to convert the second laser beam 112 into a processing laser beam 113, and the processing laser beam 113 is used to etch the insulating substrate 200 to form a groove 202. Specifically, the laser source 11 is one of a fiber optic ultraviolet laser, a semiconductor laser, or a gas laser. The wavelength of the first laser beam 111 is 193-355 nanometers, the power of the laser source is 0.9-2.1 watts, or the power of the laser source is 0.9-3.11 watts, and the wavelength of the first laser beam 111 is 1030-1064 nanometers. The beam splitter 12 includes a beam splitter 121 and a first driver 122. The first driver 122 can drive the beam splitter 121 to move, thereby changing the energy density of each of the second laser beams 112 emitted from the beam splitter 121.

3 , the electroplating unit 20 includes a plating tank 21, a plating solution 22, a plating fixture 23, and a power source 24. The plating solution 22 and the plating fixture 23 are disposed in the plating tank 21. The plating fixture 23 holds the insulating substrate 200, and the plating solution 22 immerses the groove 202. The power source 24 is connected to the plating fixture 23 to provide the current required to form the plating circuit 201 in the groove 202.

Please refer to FIG. 2 and FIG. 5. In this embodiment, metal particles 204 are dispersed in the insulating substrate 200. The processing laser beam 113 ablate the metal particles 204 exposed on the inner periphery of the groove 202, thereby forming the electroplating base layer 203. The electroplating fixture 23 is electrically connected to the electroplating base layer 203. When the power source 24 provides current, the electroplating circuit 201 can be electroplated on the electroplating base layer 203. Specifically, the metal particles 204 are low melting point alloy particles.

The circuit processing system 100 provided by the present application divides the first laser beam 111 emitted by the laser source 11 into a plurality of second laser beams 112. Each of the second laser beams 112 can form at least one groove 202 on one side or both sides of the insulating substrate 200, and ablate the metal particles in the groove 202 to form an electroplated base layer 203. Then, the electroplated circuit 201 is formed on the electroplated base layer 203 by the electroplating unit 20. The circuit processing system 100 can simultaneously form at least one groove 202 on one side or both sides of the insulating substrate 200, thereby facilitating the manufacturing efficiency of the electroplated circuit 201.

Please refer to FIG. 2 . In this embodiment, each of the light-emitting components 13 includes a galvanometer 131 and a field lens 132. The galvanometer 131 is used to deflect the second laser beam 112, and the field lens 132 is used to converge the deflected second laser beam 112 to form the processing laser beam 113. Specifically, the galvanometer 131 is an analog galvanometer or a digital galvanometer, and the field lens 132 is a fixed-focus lens. In specific operation, when the wavelength of the first laser beam 111 is 193-355 nm, the scanning speed of the galvanometer 131 is 800-1600 mm/s; when the wavelength of the first laser beam 111 is 1030-1064 nm, the scanning speed of the galvanometer 131 is 400-1400 mm/s.

Please refer to FIG. 2 . In this embodiment, the laser etching unit 10 further includes a beam shaper 14. The beam shaper 14 is disposed between the laser source 11 and the beam splitter 12. The beam shaper 14 is used to select a specific frequency and a specific polarization state in the first laser beam 111 emitted by the laser source 11, thereby making the first laser beam 111 more uniform. Specifically, the beam shaper 14 includes a reflective mirror with a scribed line, and the intensity of the spot of the first laser beam 111 emitted by the beam shaper 14 is Gaussian distributed.

Please refer to FIG. 2. In this embodiment, the laser etching unit 10 further includes a light shielding assembly 15, and the light shielding assembly 15 is disposed between the beam splitter 12 and the oscillating mirror 131. The light shielding assembly 15 includes a second driving member 151 and a light shielding plate 152 that is transmission-connected to the second driving member 151. The light shielding plate 152 is provided with a light-through hole 153. The second driving member 151 can drive the light shielding plate 152 to move, so that the second laser beam 112 passes through the light-through hole 153, or the second laser beam 112 is blocked by the light shielding plate 152. By providing the light shielding assembly 15, at least part of the plurality of second laser beams 112 can be shielded, thereby improving the flexibility of laser groove engraving. Specifically, when only a portion of the second laser beam 112 is needed to process one side of the insulating substrate 200 , the light shielding plate 152 can be moved so that another portion of the second laser beam 112 on another side of the insulating substrate 200 is shielded.

Please refer to Figures 2 and 4. In this embodiment, the laser etching unit 10 further includes a plurality of energy monitoring modules 16. Each of the energy monitoring modules 16 is connected to the spectrometer 12. The energy monitoring module 16 is used to detect the energy value of each of the second laser beams 112 and generate control instructions according to the difference between the plurality of energy values. The spectrometer 12 can evenly distribute the energy density of the first laser beam 111 according to the control instructions, so that the energy density of each of the second laser beams 112 is the same, and further the energy density of each of the processing laser beams 113 is the same, which is beneficial to etching the grooves 202 of the same size.

Please refer to FIG. 2 and FIG. 4 . In this embodiment, the energy monitoring module 16 includes a reflector 161, a focusing lens 162, a sensor 163, and a controller 164. The reflector 161 is used to reflect the second laser beam 112 emitted by the beam splitter 12 (i.e., sampling the second laser beam 112). Then, the reflected second laser beam 112 enters the focusing lens 162. The focusing lens 162 converges the second laser beam 112 to the sensor 163 (i.e., measuring the second laser beam 112). The sensor 163 measures the energy value and transmits the energy value to the controller 164. The controller 164 generates the control instruction according to the energy value.

Please refer to FIG. 3 . In this embodiment, the electroplating tank 21 is substantially in the shape of a rectangular parallelepiped, and includes a bottom plate 211 and a plurality of side plates 212. The plurality of side plates 212 are disposed around the bottom plate 211 to form a receiving space 213. The receiving space 213 can be used to receive the electroplating solution 22, the electroplating fixture 23, and the insulating substrate 200 having the groove 202. The electroplating solution 22 includes a copper sulfate solution.

Please refer to Figure 3. In this embodiment, the electroplating clamp 23 includes a first clamping portion 231 and a second clamping portion 232 spaced apart from the first clamping portion 231. The insulating substrate 200 is clamped between the first clamping portion 231 and the second clamping portion 232, and the first clamping portion 231 and the second clamping portion 232 are electrically connected to the electroplating base layer 203.

Please refer to FIG. 3 . In this embodiment, the power source 24 is electrically connected to the first clamping portion 231 and the second clamping portion 232 via a wire (not shown). The power source 24 is used to transmit direct current to the first clamping portion 231 and the second clamping portion 232 .

The above description is only an optimized specific implementation of this application, but it cannot be limited to this implementation in the actual application process. For ordinary technical personnel in this field, other variations and changes made based on the technical concept of this application should all fall within the scope of protection of this application.

100: Circuit processing system 200: Insulating substrate 201: Electroplating circuit 202: Groove 203: Electroplating base layer 204: Metal particles 10: Laser etching unit 11: Laser source 111: First laser beam 112: Second laser beam 113: Processing laser beam 12: Spectrometer 121: Spectrometer 122: First driver 20: Electroplating unit 21: Electroplating tank 211: Bottom plate 212: Side plate 213: Accommodating space 22: Electroplating liquid 23: Electroplating fixture 231: First clamping part 232: Second clamping part 24: Power supply 13: Light output assembly 131: Vibrating mirror 132: Field lens 14: Beam shaper 15: Light shield assembly 151: Second driver 152: Shading plate 153: Light aperture 16: Energy monitoring module 161: Reflector 162: Focusing lens 163: Sensor 164: Controller

FIG. 1 is a wireframe diagram of a circuit processing system provided in an embodiment of the present application.

FIG. 2 is a schematic diagram of a laser etching unit of the circuit processing system shown in FIG. 1 .

FIG3 is a schematic cross-sectional view of the electroplating unit of the circuit processing system shown in FIG1.

FIG. 4 is a schematic diagram showing the connection between the energy monitoring module and the optical splitter shown in FIG. 1 .

FIG. 5 is a schematic cross-sectional view of an insulating substrate after being processed by the circuit processing system shown in FIG. 1 .

200: Insulation substrate

202: Groove

10: Laser etching unit

11: Laser source

111: The first ray beam

112: Second laser beam

113: Processing laser beam

12:Spectrometer

121: Spectrometer

122: First drive member

13: Light emitting components

131: Vibration mirror

132: Scene

14: Beam shaper

15: Light mask assembly

151: Second drive element

152: Sunshade

153: Light hole

16: Energy monitoring module

Claims (10)

A circuit processing system is used to make circuits on an insulating substrate, wherein the insulating substrate includes metal particles, and is characterized in that the circuit processing system includes: A laser etching unit, wherein the laser etching unit includes a laser source, a beam splitter, and a plurality of light emitting components, wherein the laser source is used to emit a first laser beam, wherein the beam splitter is used to divide the first laser beam into a plurality of second laser beams, wherein each of the light emitting components is used to convert a second laser beam into a processing laser beam, wherein the plurality of processing laser beams are used to simultaneously etch grooves on different surfaces of the insulating substrate, wherein the processing laser beams ablate the metal particles to form an electroplated base layer on the inner periphery of the grooves; The electroplating unit includes an electroplating fixture and a power source. The electroplating fixture holds the insulating substrate and is electrically connected to the electroplating base layer. The power source is connected to the electroplating fixture to provide the current required to form a plating circuit on the electroplating base layer. A circuit processing system as described in claim 1, wherein each of the light-emitting components includes a diaphragm and a field lens, the diaphragm is used to deflect the second laser beam, and the field lens is used to converge the biased second laser beam to form the processing laser beam. A circuit processing system as described in claim 1, wherein the laser etching unit further includes a beam shaper, and the beam shaper is arranged between the laser source and the beam splitter. A circuit processing system as described in claim 2, wherein the laser etching unit further includes a light shield assembly, wherein the light shield assembly is disposed between the beam splitter and the galvanometer, wherein the light shield assembly includes a driver and a light shielding plate, wherein the light shielding plate is provided with a light-through hole, and wherein the driver drives the light shielding plate to move so that the second laser beam passes through the light-through hole, or the second laser beam is blocked by the light shielding plate. A circuit processing system as described in claim 1, wherein the laser etching unit further includes a plurality of energy monitoring modules, each of the energy monitoring modules is connected to the spectrometer, the energy monitoring module is used to detect the energy value of each of the second laser beams, and to generate control instructions based on the difference between the plurality of energy values, and the spectrometer evenly distributes the energy of the first laser beam based on the control instructions. A wiring processing system as described in claim 5, wherein each of the energy monitoring modules includes a reflector, a focusing lens, a sensor, and a controller, the reflector is used to reflect the second laser beam into the focusing lens, the focusing lens is arranged between the sensor and the reflector, the focusing lens is used to converge the second laser beam reflected by the reflector to the sensor, the sensor is connected to the controller, the sensor is used to sense the energy value of the second laser beam, and the controller receives the energy value and forms the control instruction according to the energy value. A wire processing system as described in claim 1, wherein the pulse width of the first laser beam is in the picosecond level or the femtosecond level. A circuit processing system as described in claim 1, wherein the electroplating fixture includes a first clamping part and a second clamping part spaced apart from the first clamping part, the power source electrically connects the first clamping part and the second clamping part, and the first clamping part and the second clamping part are both electrically connected to the electroplating base layer. A circuit processing system as described in claim 1, wherein the plating tank includes a bottom plate and a plurality of side plates, the plurality of side plates are arranged around the bottom plate to form a receiving space, and the receiving space can be used to receive the plating liquid, the plating fixture, and the insulating substrate having a groove. A wiring processing system as described in claim 1, wherein the wavelength of the first laser beam is 193-355 nanometers, and the power of the laser source is 0.9-2.1 watts, or The wavelength of the first laser beam is 1030-1064 nanometers, and the power of the laser source is 0.9-3.11 watts.

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