CN118102576A - M6 high-speed material printed board with low expansion and contraction deviation and preparation method thereof - Google Patents
M6 high-speed material printed board with low expansion and contraction deviation and preparation method thereof Download PDFInfo
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- CN118102576A CN118102576A CN202410202497.9A CN202410202497A CN118102576A CN 118102576 A CN118102576 A CN 118102576A CN 202410202497 A CN202410202497 A CN 202410202497A CN 118102576 A CN118102576 A CN 118102576A
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Abstract
The invention discloses a low-expansion-contraction deviation M6 high-speed material printed board and a preparation method thereof, wherein the preparation method comprises the following steps: a first steel plate, a pre-laminated plate and a second steel plate; a first steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer; the pre-lamination plate comprises a first outer layer core and a second outer layer core and an inner layer core; one surface of the first outer core is covered with a release film, and the other surface is connected with the inner core through a PP layer; one surface of the second outer core is covered with a release film, and the other surface is connected with the inner core through a PP layer; a second steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer; wherein the engineering pretension values of the first outer layer core and the second outer layer core are more than two parts per million based on the engineering pretension values of the inner layer core. The invention achieves the purposes of stabilizing the shrinkage of the M6 high-speed material printed board in the pressing process and reducing the expansion and contraction deviation among the core boards.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to an M6 high-speed material printed board with low expansion and contraction deflection and a preparation method thereof.
Background
PCB, which is called Printed Circuit Board, chinese name is printed circuit board. The concept of PCB originated in 1936 and was first proposed by Eisler doctor, and the copper foil etching process was first invented, which is a technique of coating etching-resistant ink on a substrate covered with a metal foil to make a pattern, and etching unnecessary copper foil area with chemical liquid medicine to make a transmission line. This is the origin of modern PCB processes. Through decades of development, printed circuit board PCBs have long become an indispensable cornerstone for the modern electronics industry. The printed circuit board plays a role of skeleton support in a complete electronic device, and enables electronic components welded on the circuit board to be communicated with each other. The printed circuit board is required for mobile equipment, household appliances, satellites or base stations used for military aviation in the life of people.
With the rapid development of the electronic industry, the printed circuit board has a development trend of high multilayer, high density and high quality, and the quality requirement of customers on the printed circuit board is also becoming severe.
In the PCB production process, the requirements on the hole-to-line spacing capability are tighter and tighter, the PCB manufacturing layers are higher and higher, the high-level manufacturing and the hole-to-line spacing are in conflict, and the defective rate of the inner layer short circuit can be reduced only by better controlling the offset between each core plate.
With the development of high frequency and high speed of communication equipment and the requirement of signal transmission loss, most of PCB designs adopt high-speed materials. The main reason for the interlayer offset in the lamination process of the high-speed material is that the core plates are inconsistent in expansion and contraction.
For the M6 high-speed material, in order to alleviate interlayer offset occurring during lamination, the current production scheme is to laminate the M6 high-speed material into a core+core structure, and the precompensation value of the outer core is six parts per million more than that of the inner core. However, in the actual production process, the compensation rule is not stable, and the shrinkage variation in the lamination process is still large, so that obvious deviation between the core plates is still caused.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an M6 high-speed material printed board with low expansion and contraction deviation and a preparation method thereof, which are used for solving the technical problem of abnormal deviation caused by inconsistent expansion and contraction among core boards of the traditional M6 high-speed material printed board, thereby achieving the purposes of stabilizing the contraction amount of the M6 high-speed material printed board in the pressing process and reducing the expansion and contraction deviation among the core boards.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
an M6 high-speed material printed board with low collapsible bias, comprising:
a first steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer;
A pre-lamination including a first outer core, an inner core, and a second outer core; one surface of the first outer core is covered with a release film, and the other surface of the first outer core is connected with the inner core through a PP layer; one surface of the second outer core is covered with a release film, and the other surface of the second outer core is connected with the inner core through a PP layer; the inner core is arranged between the first outer core and the second outer core;
a second steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer;
wherein the first outer core, the inner core and the second outer core are made of M6 high-speed materials;
The surface of the first steel plate covered with the release film is connected with the surface of the first outer core covered with the release film through a PP layer, and the surface of the second steel plate covered with the release film is connected with the surface of the second outer core covered with the release film through a PP layer;
The engineering pre-stretch values of the first outer layer core and the second outer layer core are two parts per million more based on the engineering pre-stretch values of the inner layer core.
The invention provides a preparation method of a low-expansion-shrinkage offset M6 high-speed material printed board, which comprises the following steps:
Carrying out engineering pre-stretching design, and carrying out plate cutting according to design parameters to obtain the first outer core, the inner core and the second outer core;
Imaging the first outer core, the inner core, and the second outer core with internal light;
AOI is carried out on the first outer layer core, the inner layer core and the second outer layer core which finish the inner light imaging;
After passing AOI detection, browning the first outer core, the inner core, and the second outer core;
After the browning is finished, prestack the first outer core, the inner core and the second outer core to obtain the prestack board;
and providing the first steel plate and the second steel plate, laminating the pre-laminated plate with the first steel plate and the second steel plate, and laminating after lamination is completed to obtain the printed board.
As a preferred embodiment of the present invention, when engineering pre-stretching design is performed, it includes:
The engineering pre-stretch values of the first outer layer core and the second outer layer core are designed to add two parts per million more based on the engineering pre-stretch value of the inner layer core.
As a preferred embodiment of the present invention, when the engineering pre-stretching design is performed, the method further comprises:
the appearance parameters of the first outer core and the second outer core are designed as follows: x=1.0006, y=1.0006;
The appearance parameters of the inner core are designed as follows: x=1.0004, y= 1.0004.
In a preferred embodiment of the present invention, when the first outer core, the inner core, and the second outer core are pre-stacked to obtain the pre-stacked board, the method includes:
drilling riveting holes with one-to-one correspondence positions on the plate edges of the first outer core, the inner core and the second outer core by adopting drilling equipment;
from top to bottom, pre-stacking the first outer core, the PP layer, the inner core, the PP layer and the second outer core in the sequence of the first outer core, the PP layer, the inner core and the PP layer;
and riveting the first outer core, the inner core and the second outer core by taking the riveting holes of the first outer core, the inner core and the second outer core as base points to obtain the pre-laminated board.
In a preferred embodiment of the present invention, when the pre-laminated sheet is laminated with the first steel sheet and the second steel sheet, the method includes:
And the first steel plate, the release film, the PP layer, the release film, the pre-laminated plate, the release film, the PP layer, the release film and the second steel plate are sequentially placed on the chassis.
As a preferred embodiment of the present invention, when imaging the first outer layer core, the inner layer core, and the second outer layer core with internal light, the method includes:
obtaining a precompensation requirement of a circuit pattern film, and determining a pattern precompensation value of the inner core according to the precompensation requirement;
determining the graphic precompensation values of the first outer core and the second outer core according to the graphic precompensation values of the inner core;
wherein the graphic precompensation values of the first and second outer layer cores are two ten thousandth more than the graphic precompensation values of the inner layer core.
As a preferred embodiment of the present invention, when imaging the first outer layer core, the inner layer core, and the second outer layer core with internal light, the method includes:
Obtaining a precompensation requirement of a circuit pattern film, and determining pattern precompensation values of riveting holes of the first outer layer core, the inner layer core and the second outer layer core according to the precompensation requirement;
The graphic precompensation value of the rivet holes of the first outer core, the inner core and the second outer core is 1:1:1.
In a preferred embodiment of the present invention, the browning is performed by:
Baking the first outer core, the inner core and the second outer core for 2-3 hours at 140-170 ℃, oxidizing the cores in a browning mode, and baking the first outer core, the inner core and the second outer core for 2-3 hours at 100-110 ℃ after the oxidation is completed.
As a preferred embodiment of the present invention, when the lamination is performed, the method comprises:
And adopting vacuum pressing plate equipment to press, wherein the pressing parameters comprise:
Controlling the heating rate to be 2.5-3 ℃/s, and heating the lamination temperature to 130-150 ℃ at the heating rate;
in the heating process, judging whether the temperature of the high-pressure turning point is reached, wherein the temperature of the high-pressure turning point is 120-130 ℃;
if the temperature of the high-pressure point is reached, converting the pressure into high pressure, wherein the pressure of the high pressure is 400-460PSI;
Controlling the temperature at 200-230 ℃ during curing and controlling the curing time at 80-100min;
the vacuumizing time is controlled to be 25-45min, and the temperature of the hot pressing material is controlled to be less than 120 ℃.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention solves the problem of abnormal deviation caused by the fact that the shrinkage variation of the pressed printed board made of the M6 high-speed material is large and the expansion and shrinkage of the core boards are inconsistent in the pressing process; therefore, the shrinkage of the obtained M6 high-speed material printed board in the pressing process is stable, and the requirement of customers on the product functions can be met;
(2) The invention designs engineering pretension rules for the core+core structure of the M6 high-speed material, and adopts a cladding mode for production in the lamination process, so that the expansion and contraction change of the M6 high-speed material printed board is more stable;
(3) The invention improves the qualification rate of the M6 high-speed material core+core structure product, reduces the offset rejection rate by 31%, reduces the rejection loss amount of the high-value plate, and achieves the effects of reducing the cost and enhancing the efficiency.
The invention is described in further detail below with reference to the drawings and the detailed description.
Drawings
FIG. 1 is a step diagram of a preparation method of an M6 high-speed material printed board with low expansion and contraction deviation;
FIG. 2 is a schematic view of the structure of a pre-stack provided by the present invention;
Fig. 3 is a schematic structural diagram of the low-expansion-shrinkage offset M6 high-speed material printed board provided by the invention.
Reference numerals illustrate: 1. a first steel plate; 2. pre-lamination; 3. a second steel plate; 4. a release film; 5. a PP layer; 6. a first outer core; 7. an inner core; 8. and a second outer core.
Detailed Description
The invention provides a low-expansion and contraction deflection M6 high-speed material printed board, which comprises: a first steel plate 1, a pre-laminated plate 2 and a second steel plate 3.
The first steel sheet 1 is covered on one side with a release film 4 and is connected to the pre-laminated sheet 2 by a PP layer 5.
The pre-stack 2 comprises a first outer core 6, an inner core 7 and a second outer core 8.
Wherein, one surface of the first outer core 6 is covered with a release film 4, and the other surface is connected with the inner core 7 through a PP layer 5; one surface of the second outer core 8 is covered with a release film 4, and the other surface is connected with the inner core 7 through a PP layer 5; the inner core 7 is disposed between the first outer core 6 and the second outer core 8.
A second steel plate 3, one surface of which is covered with a release film 4, is connected to the pre-laminated plate 2 via a PP layer 5.
In the printed board provided by the invention, the first outer layer core 6, the inner layer core 7 and the second outer layer core8 are made of M6 high-speed materials.
In the printed board provided by the invention, one surface of the first steel plate 1 covered with the release film 4 is connected with one surface of the first outer core 6 covered with the release film 4 through the PP layer 5, and one surface of the second steel plate 3 covered with the release film 4 is connected with one surface of the second outer core 8 covered with the release film 4 through the PP layer 5.
In the printed board provided by the invention, the engineering pre-stretching value of the first outer layer core 6 and the second outer layer core 8 is two parts per million more based on the engineering pre-stretching value of the inner layer core 7.
The preparation method of the M6 high-speed material printed board with low expansion and contraction deflection provided by the invention, as shown in figure 1, comprises the following steps:
Step S1: carrying out engineering pre-stretching design, and carrying out plate cutting according to design parameters to obtain a first outer layer core 6, an inner layer core 7 and a second outer layer core 8;
Step S2: imaging the first outer core 6, the inner core 7 and the second outer core 8 with internal light;
Step S3: AOI is carried out on the first outer layer core 6, the inner layer core 7 and the second outer layer core8 which finish the inner light imaging;
step S4: after passing the AOI detection, browning the first outer core 6, the inner core 7 and the second outer core 8;
Step S5: after the browning is completed, prestack the first outer core 6, the inner core 7 and the second outer core8 to obtain a prestack board 2;
Step S6: a first steel plate 1 and a second steel plate 3 are provided, the pre-laminated plate 2, the first steel plate 1 and the second steel plate 3 are laminated, and after the lamination is completed, the lamination is performed to obtain a printed board.
In the step S1, when the engineering pre-stretching design is performed, the method includes:
the engineering pre-stretch values of the first outer layer core 6 and the second outer layer core 8 are designed to be two parts per million more based on the engineering pre-stretch value of the inner layer core 7.
In the step S1, when the engineering pre-stretching design is performed, the method further includes:
the profile parameters of the first outer core 6 and the second outer core8 are designed as follows: x=1.0006, y=1.0006;
the profile parameters of the inner core 7 were designed as: x=1.0004, y= 1.0004.
In step S5, when the first outer core 6, the inner core 7, and the second outer core 8 are pre-stacked to obtain the pre-stacked board 2, the method includes:
Drilling riveting holes in one-to-one correspondence to the plate edges of the first outer layer core 6, the inner layer core 7 and the second outer layer core 8 by adopting drilling equipment;
As shown in fig. 2, the pre-stacking is performed in the order of the first outer layer core 6, the PP layer 5, the inner layer core 7, the PP layer 5 and the second outer layer core 8 from top to bottom;
And riveting the first outer core 6, the inner core 7 and the second outer core 8 by taking the riveting holes as base points to obtain the pre-laminated plate 2.
In step S6, when the pre-laminated sheet 2 is laminated with the first steel sheet 1 and the second steel sheet 3, the method includes:
as shown in fig. 3, a first steel plate 1, a release film 4, a PP layer 5, a release film 4, a pre-laminated plate 2, a release film 4, a PP layer 5, a release film 4 and a second steel plate 3 are sequentially placed on a chassis.
In the step S2, when the first outer core 6, the inner core 7, and the second outer core 8 are subjected to the inner-light imaging, the method includes:
Acquiring a precompensation requirement of a circuit pattern film, and determining a pattern precompensation value of an inner layer core 7 according to the precompensation requirement;
Determining the graphic precompensation value of the first outer layer core 6 and the second outer layer core 8 according to the graphic precompensation value of the inner layer core 7;
wherein the first outer core 6 and the second outer core 8 have graphics precompensations that are two parts per million greater than the graphics precompensations of the inner core 7.
In the step S2, when the first outer core 6, the inner core 7, and the second outer core 8 are subjected to the inner-light imaging, the method includes:
Obtaining the precompensation requirement of a circuit pattern film, and determining pattern precompensation values of the riveting holes of the first outer layer core 6, the inner layer core 7 and the second outer layer core 8 according to the precompensation requirement;
Wherein, the graphic precompensation value of the riveting hole of the first outer layer core 6, the inner layer core 7 and the second outer layer core8 is 1:1:1.
In the step S4, the browning process includes:
Baking the first outer layer core 6, the inner layer core 7 and the second outer layer core 8 at 140-170 ℃ for 2-3 hours, oxidizing the cores by browning, and baking the first outer layer core 6, the inner layer core 7 and the second outer layer core 8 at 100-110 ℃ for 2-3 hours after the oxidation is completed.
In the step S6, the method includes:
And adopting vacuum pressing plate equipment to press, wherein the pressing parameters comprise:
controlling the heating rate to be 2.5-3 ℃/s, and heating the lamination temperature to 130-150 ℃ at the heating rate;
In the heating process, judging whether the temperature of the high-pressure point is reached, wherein the temperature of the high-pressure point is 120-130 ℃;
if the temperature of the high-pressure point is reached, converting the pressure into high pressure, wherein the pressure of the high pressure is 400-460PSI;
Controlling the temperature at 200-230 ℃ during curing and controlling the curing time at 80-100min;
the vacuumizing time is controlled to be 25-45min, and the temperature of the hot pressing material is controlled to be less than 120 ℃.
The following examples are further illustrative of the present invention, but the scope of the present invention is not limited thereto.
The core+core structure product of the M6 high-speed material of this embodiment has two parts per million of the engineering pre-stretching value of the outer core based on the engineering pre-stretching value of the inner core 7, and the outer core is produced by PP cladding when laminating the laminated board.
The processing flow of this embodiment:
Engineering prestretching design, material opening, internal light, AOI, browning, prestack, lamination and lamination
The processing method of the embodiment comprises the following steps:
a. Prestretching design: outer core: x=1.0006, y=1.0006; inner core plate: x=1.0004, y= 1.0004.
B. And (5) cutting to prestack normal production.
C. Lamination: sequentially placing the components on a chassis: steel plate, release film 4, PP, release film 4, pre-lamination plate 2, release film 4, PP, release film 4 and steel plate.
Effect contrast:
M6 high-speed material core+core structure product uses a raw production scheme: the engineering pretension value of the outer core is six parts per million more than that of the inner core 7, the laminated board is produced without covering, and the expansion deflection rejection rate is up to 33%.
The method of the embodiment comprises the following steps: the engineering pretension value of the outer layer core is two ten thousandths more than that of the inner layer core 7, the lamination is produced by using PP (Polypropylene) cladding, and the expansion and contraction deflection rejection rate is 2%.
The M6 high-speed material core+core structure product is produced by using the method of the embodiment, and the expansion and contraction deflection rejection rate is reduced by 31%.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (10)
1. The utility model provides a low-expansion off-set M6 high-speed material printed board which characterized in that includes:
a first steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer;
A pre-lamination including a first outer core, an inner core, and a second outer core; one surface of the first outer core is covered with a release film, and the other surface of the first outer core is connected with the inner core through a PP layer; one surface of the second outer core is covered with a release film, and the other surface of the second outer core is connected with the inner core through a PP layer; the inner core is arranged between the first outer core and the second outer core;
a second steel plate, one surface of which is covered with a release film and is connected with the pre-laminated plate through a PP layer;
wherein the first outer core, the inner core and the second outer core are made of M6 high-speed materials;
The surface of the first steel plate covered with the release film is connected with the surface of the first outer core covered with the release film through a PP layer, and the surface of the second steel plate covered with the release film is connected with the surface of the second outer core covered with the release film through a PP layer;
The engineering pre-stretch values of the first outer layer core and the second outer layer core are two parts per million more based on the engineering pre-stretch values of the inner layer core.
2. A method for preparing a low-expansion and contraction deviation M6 high-speed material printed board as claimed in claim 1, which is characterized by comprising the following steps:
Carrying out engineering pre-stretching design, and carrying out plate cutting according to design parameters to obtain the first outer core, the inner core and the second outer core;
Imaging the first outer core, the inner core, and the second outer core with internal light;
AOI is carried out on the first outer layer core, the inner layer core and the second outer layer core which finish the inner light imaging;
After passing AOI detection, browning the first outer core, the inner core, and the second outer core;
After the browning is finished, prestack the first outer core, the inner core and the second outer core to obtain the prestack board;
and providing the first steel plate and the second steel plate, laminating the pre-laminated plate with the first steel plate and the second steel plate, and laminating after lamination is completed to obtain the printed board.
3. The method for manufacturing a low-expansion-shrinkage offset M6 high-speed material printed board according to claim 2, wherein the method comprises the following steps of:
The engineering pre-stretch values of the first outer layer core and the second outer layer core are designed to add two parts per million more based on the engineering pre-stretch value of the inner layer core.
4. The method for manufacturing a low-expansion-shrinkage offset M6 high-speed material printed board according to claim 3, further comprising, when performing engineering pre-stretching design:
the appearance parameters of the first outer core and the second outer core are designed as follows: x=1.0006, y=1.0006;
The appearance parameters of the inner core are designed as follows: x=1.0004, y= 1.0004.
5. The method for manufacturing a low-expansion offset M6 high-speed material printed board according to claim 2, wherein when the first outer core, the inner core and the second outer core are pre-stacked to obtain the pre-stacked board, the method comprises:
drilling riveting holes with one-to-one correspondence positions on the plate edges of the first outer core, the inner core and the second outer core by adopting drilling equipment;
from top to bottom, pre-stacking the first outer core, the PP layer, the inner core, the PP layer and the second outer core in the sequence of the first outer core, the PP layer, the inner core and the PP layer;
and riveting the first outer core, the inner core and the second outer core by taking the riveting holes of the first outer core, the inner core and the second outer core as base points to obtain the pre-laminated board.
6. The method for manufacturing a low-expansion and contraction offset M6 high-speed material printed board according to claim 2, wherein when the pre-laminated board is laminated with the first steel plate and the second steel plate, the method comprises:
And the first steel plate, the release film, the PP layer, the release film, the pre-laminated plate, the release film, the PP layer, the release film and the second steel plate are sequentially placed on the chassis.
7. The method for manufacturing a low-shrinkage and low-deviation M6 high-speed material printed board according to claim 2, wherein when the first outer core, the inner core and the second outer core are subjected to internal light imaging, the method comprises the following steps:
obtaining a precompensation requirement of a circuit pattern film, and determining a pattern precompensation value of the inner core according to the precompensation requirement;
determining the graphic precompensation values of the first outer core and the second outer core according to the graphic precompensation values of the inner core;
wherein the graphic precompensation values of the first and second outer layer cores are two ten thousandth more than the graphic precompensation values of the inner layer core.
8. The method for manufacturing a low-shrinkage and low-deviation M6 high-speed material printed board according to claim 5, wherein when the first outer core, the inner core and the second outer core are subjected to internal light imaging, the method comprises the following steps:
Obtaining a precompensation requirement of a circuit pattern film, and determining pattern precompensation values of riveting holes of the first outer layer core, the inner layer core and the second outer layer core according to the precompensation requirement;
The graphic precompensation value of the rivet holes of the first outer core, the inner core and the second outer core is 1:1:1.
9. The method for manufacturing the low-expansion-shrinkage offset M6 high-speed material printed board according to claim 2, wherein the method comprises the following steps of:
Baking the first outer core, the inner core and the second outer core for 2-3 hours at 140-170 ℃, oxidizing the cores in a browning mode, and baking the first outer core, the inner core and the second outer core for 2-3 hours at 100-110 ℃ after the oxidation is completed.
10. The method for manufacturing a low-expansion and contraction deviation M6 high-speed material printed board according to claim 2, wherein the method comprises the following steps of:
And adopting vacuum pressing plate equipment to press, wherein the pressing parameters comprise:
Controlling the heating rate to be 2.5-3 ℃/s, and heating the lamination temperature to 130-150 ℃ at the heating rate;
in the heating process, judging whether the temperature of the high-pressure turning point is reached, wherein the temperature of the high-pressure turning point is 120-130 ℃;
if the temperature of the high-pressure point is reached, converting the pressure into high pressure, wherein the pressure of the high pressure is 400-460PSI;
Controlling the temperature at 200-230 ℃ during curing and controlling the curing time at 80-100min;
the vacuumizing time is controlled to be 25-45min, and the temperature of the hot pressing material is controlled to be less than 120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410202497.9A CN118102576A (en) | 2024-02-23 | 2024-02-23 | M6 high-speed material printed board with low expansion and contraction deviation and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410202497.9A CN118102576A (en) | 2024-02-23 | 2024-02-23 | M6 high-speed material printed board with low expansion and contraction deviation and preparation method thereof |
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|---|---|
| CN118102576A true CN118102576A (en) | 2024-05-28 |
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| CN202410202497.9A Pending CN118102576A (en) | 2024-02-23 | 2024-02-23 | M6 high-speed material printed board with low expansion and contraction deviation and preparation method thereof |
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| CN (1) | CN118102576A (en) |
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