CN118039571A - Chip packaging structure, packaging module and electronic equipment - Google Patents

Abstract

The application discloses a chip packaging structure, a packaging module and electronic equipment, which comprise a packaging substrate, at least one bare chip and a packaging cover shell, wherein the at least one bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate, the packaging cover shell is positioned on one side of the at least one bare chip, which is away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose an accommodating space, the at least one bare chip is positioned in the accommodating space, a plurality of first solder balls and a plurality of supporting devices are arranged on the surface of one side of the packaging substrate, which is away from the bare chip, and the plurality of supporting devices are used for supporting the plurality of first solder balls after welding. Based on the above, the plurality of first solder balls after welding can be supported by the supporting device, so that the problems of first solder ball collapse and bridging failure of the chip packaging structure can be avoided.

Description

Chip packaging structure, packaging module and electronic equipment

Technical Field

The present application relates to the field of chip packaging technologies, and in particular, to a chip packaging structure, a packaging module, and an electronic device.

Background

Along with the increasing size of the chip packaging structure, the packaging cover shell in the chip packaging structure is thicker and thicker to inhibit the increasing warping generated by the chip packaging structure after the heating process, so that key components of the chip packaging structure are protected from being damaged, but the weight of the packaging cover shell is larger, and the problems of collapse and bridging failure of the first solder balls of the chip packaging structure are easily caused.

Disclosure of Invention

The application discloses a chip packaging structure, a packaging module and electronic equipment, which are used for avoiding the problems of collapse and bridging failure of a first solder ball of the chip packaging structure.

In a first aspect, the application discloses a chip packaging structure, which comprises a packaging substrate, at least one bare chip and a packaging cover shell; the at least one bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate; the packaging cover shell is positioned on one side of the at least one bare chip, which is away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose an accommodating space, and the at least one bare chip is positioned in the accommodating space; the surface of one side of the packaging substrate, which is away from the bare chip, is provided with a plurality of first solder balls and a plurality of supporting devices, wherein the plurality of supporting devices are used for supporting the plurality of first solder balls after welding. Based on the above, the plurality of first solder balls after welding can be supported by the supporting device, so that the problems of first solder ball collapse and bridging failure of the chip packaging structure can be avoided.

In some alternative examples, the thickness difference between the support device and the first solder ball prior to soldering is in the range of 0.2mm to 0.3mm. Based on the above, the support device can be prevented from being too high or too low, and the support device can play a better role in support.

In some alternative examples, the support device includes a passive device including at least a capacitance or a resistance. Since passive devices such as capacitors and resistors having ceramic and metal structures are not easily deformed, the chip package structure can be effectively supported.

In some alternative examples, the plurality of support devices are located at a peripheral edge of the package substrate and at least partially surround the plurality of first solder balls. Based on this, fewer support means 18 are used for greater support, to save costs.

In some alternative examples, the plurality of support devices are located at a plurality of corners of the package substrate, respectively. Because the first solder balls at the corners of the package substrate are more prone to collapse, the support devices are arranged at the corners of the package substrate respectively, so that the collapse of the first solder balls at the corners of the package substrate can be avoided, and the maximum support effect can be achieved with the minimum support devices.

In some alternative examples, the package substrate has three support devices at each corner, the three support devices are arranged in two parallel rows, one having one support device and the other having two support devices arranged in parallel, and the three support devices at each corner of the package substrate all form a triangular pattern. Based on this, the three support members 18 of the triangular pattern can be made more stable and better support

In some alternative examples, the three support devices at each corner are aligned at a 45 ° angle to the side of the package substrate. Based on the above, three supporting devices of the triangular pattern can be more stable, and the supporting function can be better achieved.

In some optional examples, the minimum distance between the first solder ball and the edge of the package substrate is 1 mm-1.9 mm; the length of the supporting device ranges from 0.6mm to 2mm.

In a second aspect, the application discloses a packaging module, which comprises the chip packaging structure as described in any one of the above. Based on the above, the plurality of first solder balls after being welded are supported by the supporting device, so that the problems of collapse and bridging failure of the first solder balls in the chip packaging structure can be avoided, and the yield and the structural stability of the packaging module can be further ensured.

In a third aspect, the application discloses an electronic device comprising a chip package structure as defined in any one of the above or a package module as defined above. Based on the above, the plurality of first solder balls after being welded are supported by the supporting device, so that the problems of collapse and bridging failure of the first solder balls in the chip packaging structure can be avoided, and the yield and the structural stability of the electronic equipment can be further ensured.

Drawings

In order to more clearly describe the embodiments of the present application or the technical solutions in the background art, the following description will describe the drawings that are required to be used in the embodiments of the present application or the background art.

Fig. 1 is a schematic cross-sectional structure of a chip package structure according to the present disclosure.

Fig. 2 is a schematic cross-sectional structure of a chip package structure according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of another chip package structure according to an embodiment of the application.

Fig. 4 is a schematic cross-sectional view of a chip package structure and a printed circuit board according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a first solder ball and a supporting device of a package substrate according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a first solder ball and a supporting device of another package substrate according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a first solder ball and a supporting device of another package substrate according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a first solder ball and a supporting device of another package substrate according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Most of the current Chip package structures are Flip Chip (Flip Chip) structures, which are short-pin structures, and as shown in fig. 1, fig. 1 is a schematic cross-sectional structure of a Chip package structure disclosed in the present application, and a die 10 has a second solder ball 11, where the second solder ball 11 includes a tin-lead ball, and by heating the die 10, the die 10 can be electrically connected to a package substrate 12 through the melted second solder ball 11. Since the bottom of the package substrate 12 also has a plurality of first solder balls 14 electrically connected to a printed circuit (Printed Circuit Board, PCB) board 13, and the plurality of first solder balls 14 are arranged in a grid-like pattern, the package structure is also called a BGA (Ball GRID ARRAY ) package structure.

As shown in fig. 1, the chip package structure generally includes a package cover 15, where the package cover 15 is adhered to the package substrate 12 and encloses a receiving space with the package substrate 12, and the receiving space is used for receiving the die 10 to provide a certain mechanical protection for the die 10. Along with the increasing size of the chip packaging structure, the packaging cover shell 15 is thicker and thicker to inhibit the increasing warping generated by the chip packaging structure after the heating process, so that key components of the chip packaging structure are protected from damage, but the too thick packaging cover shell 15 can cause the weight of the packaging cover shell 15 to be larger, so that the problem that the first solder balls 14 of the chip packaging structure collapse easily, and the problem that the welding spots where the first solder balls 14 are located have bridging failure easily occurs.

Based on the above, the application discloses a chip packaging structure, which is characterized in that a supporting device is arranged on the same layer as a first solder ball, and the thickness of the supporting device is smaller than that of the first solder ball before welding, so that the supporting device supports a plurality of first solder balls after welding, and the problem that the first solder balls collapse is avoided.

As an alternative implementation of the disclosure, an embodiment of the present application discloses a chip package structure, as shown in fig. 2, fig. 2 is a schematic cross-sectional structure of the chip package structure disclosed in the embodiment of the present application, where the chip package structure includes a package substrate 12, at least one die 10, and a package cover 15.

At least one die 10 is located on one side of the package substrate 12 and is electrically connected to the package substrate 12. Alternatively, the die 10 may be electrically connected with the package substrate 12 through the second solder balls 11. The package cover 15 is located on a side of the at least one die 10 facing away from the package substrate 12, and the package cover 15 and the package substrate 12 define an accommodating space. Optionally, the package cover 15 is adhered and fixed to the package substrate 12 by an adhesive layer 16.

At least one die 10 is located within the receiving space. Wherein, a heat sink 17 is disposed between each die 10 and the package cover 15, and the heat sink 17 is used for transferring heat generated by the die 10 to the package cover 15 and through the package cover 15 to the outside. Wherein the material of the heat sink 17 comprises a metal solder material, which in turn comprises indium metal; the material of the encapsulation cover 15 includes a metal such as copper or copper alloy. Preferably, the surface of the encapsulation cover 15 is plated with nickel or gold to achieve good wetting of the material of the heat sink 17, such as indium, for reliable soldering.

It should be understood that, in fig. 2, only one die 10 is included in the chip package structure as an example, but the present application is not limited thereto, and in other embodiments, as shown in fig. 3, fig. 3 is a schematic cross-sectional structure of another chip package structure disclosed in the embodiment of the present application, the chip package structure may further include two dies 10, and in other embodiments, the chip package structure may further include three or more dies 10, which will not be described herein.

The package substrate 12 has a plurality of first solder balls 14 and a plurality of support devices 18 on a side surface facing away from the die 10. The plurality of first solder balls 14 are used to make electrical connection of the package substrate 12 to the printed circuit board. The thickness D1 of the support device 18 is smaller than the thickness D2 of the first solder ball 14 before soldering, and the plurality of support devices 18 are used for supporting the plurality of first solder balls 14 after soldering.

Based on this, as long as the plurality of supporting devices 18 are disposed on the side of the package substrate 12 having the plurality of first solder balls 14, and the supporting devices 18 have a certain thickness, that is, the thickness D1 of the supporting devices 18 is greater than 0 and smaller than the thickness D2 of the first solder balls 14 before soldering, the plurality of supporting devices 18 can play a role in supporting the plurality of first solder balls 14 after soldering, so as to avoid the problems of collapse and bridging failure of the first solder balls 14 in the chip package structure, and further, the service life of the first solder balls 14 can be prolonged, and the stability of the chip package structure can be improved.

Optionally, as shown in fig. 4, fig. 4 is a schematic cross-sectional structure of a chip package structure and a printed circuit board according to an embodiment of the present application, where a thickness D1 of the supporting device 18 is approximately equal to a normal thickness D3 of the first solder ball 14 after soldering. Wherein, before soldering means before the chip package structure is soldered on the printed circuit board 13, after soldering means after the chip package structure is soldered on the printed circuit board 13, it is approximately equal to or slightly smaller than that. That is, the thickness D1 of the support device 18 is equal to the normal thickness D3 of the soldered first solder ball 14, or the thickness D1 of the support device 18 is slightly smaller than the normal thickness D3 of the soldered first solder ball 14. For example, the thickness D1 of the support device 18 is 0-0.1 mm less than the normal thickness D3 of the first solder ball 14 after soldering.

However, since the normal thickness D3 of the first solder balls 14 after soldering is not the same for different chip package structures, in some embodiments of the present application, the thickness difference between the supporting device 18 and the first solder balls 14 before soldering is limited to ensure that the supporting device 18 can perform a good supporting function, for example, the thickness difference between the supporting device 18 and the first solder balls 14 before soldering ranges from 0.2mm to 0.3mm. Based on this, the support device 18 can be made neither too high nor too low so that the support device 18 is too low to support, so that the support device 18 is too high to affect the proper soldering of the first solder balls 14.

In some embodiments of the application, the support device 18 comprises a passive device including at least a capacitor or resistor, etc. That is, in some embodiments, the plurality of support devices 18 are a plurality of capacitors, and in other embodiments, the plurality of support devices 18 are a plurality of resistors. Wherein the passive device may be soldered to the package substrate 12 via pads, the type of passive device may be selected according to the height of the first solder balls 14 in particular. For example, the thickness of the passive device is smaller than the thickness D2 of the first solder ball 14 before soldering, and the thickness difference between the passive device and the first solder ball 14 before soldering is in the range of 0.2mm to 0.3mm. Since passive devices such as capacitors and resistors having ceramic and metal structures are not easily deformed, the chip package structure can be effectively supported.

It should be noted that, in some embodiments, the passive device that is originally disposed in the accommodating space of the package cover 15 and the package substrate 12 may be moved to the side of the package substrate 12 away from the die 10 or the package cover 15, so that the passive device may also perform the function of supporting the first solder ball 14 while performing its own function.

Of course, the present application is not limited thereto, and in other embodiments, the supporting device 18 may further include an active device including a decoupling capacitor electrically connected to the package substrate 12, and in other embodiments, the supporting device 18 may further include an insulating device such as a stiffener, which is not described herein.

In some embodiments of the present application, as shown in fig. 5, fig. 5 is a schematic structural diagram of a first solder ball and a supporting device of a package substrate according to an embodiment of the present application, and a plurality of supporting devices 18 are located at the peripheral edge of the package substrate 12 and at least partially surround the plurality of first solder balls 14. Based on this, fewer support means 18 are used for greater support, to save costs. Preferably, the plurality of support devices 18 are located on four sides of the plurality of first solder balls 14, respectively. The first solder balls 14 may be normal solder balls such as lead-containing solder balls, or lead-free solder balls. The first solder balls 14 are located in the middle area of the package substrate 12 and are arranged in an array.

In some embodiments, as shown in fig. 6, fig. 6 is a schematic structural diagram of a first solder ball and a supporting device of another package substrate disclosed in the embodiment of the present application, and a plurality of supporting devices 18 are respectively located at a plurality of corners of the package substrate 12. For example, the package substrate 12 is a square substrate, and the plurality of support devices 18 are located at four corners of the package substrate 12, respectively. Applicant's research has found that the first solder balls 14 at the corners of the package substrate 12 are more prone to collapse, and thus, the support devices 18 are disposed at the corners of the package substrate 12, respectively, so that collapse of the first solder balls 14 at the corners of the package substrate 12 can be avoided, and the maximum support effect can be achieved with the minimum support devices 18.

In some embodiments, as shown in fig. 7, fig. 7 is a schematic structural diagram of a first solder ball and a supporting device of another package substrate disclosed in the embodiment of the present application, where three supporting devices 18 are disposed at each corner of the package substrate 12, and the three supporting devices 18 are arranged in two parallel rows, where one row has one supporting device 18 and the other row has two supporting devices 18 disposed in parallel. Preferably, two rows of support devices 18 are arranged in parallel and three support devices 18 at each corner of the package substrate 12 form a triangular pattern. Preferably, one support device 18, which is located individually in a row, is located on the side of the other two support devices 18 facing away from the first solder balls 14.

In some embodiments, as shown in fig. 7, the three support devices 18 at each corner are aligned at a 45 ° angle to the sides of the package substrate 12. Based on this, the three support means 18 of the triangular pattern can be made more stable and better support. Of course, the present application is not limited thereto, and in other embodiments, as shown in fig. 8, fig. 8 is a schematic view of a first solder ball and a supporting device of another package substrate according to an embodiment of the present application, and the three supporting devices 18 at each corner are arranged in a direction parallel to the side of the package substrate 12. It should be noted that, the arrangement direction of the three supporting devices 18 at each corner may be at any angle with the side of the package substrate 12, and may be set according to practical situations, which is not described herein.

Preferably, the plurality of support devices 18 on the package substrate 12 are the same passive device such as a capacitor, but the application is not limited thereto, and in some embodiments, the plurality of support devices 18 may be different types of passive devices such as a capacitor and a resistor, but it is necessary to ensure that the thicknesses of the different types of passive devices such as a capacitor and a resistor are the same.

In some embodiments of the present application, taking a chip package structure with 4 dies 10 as an example, the side length of the package substrate 12 ranges from 60mm to 80mm, the pitch of the first solder balls 14 ranges from about 1mm, as shown in fig. 7, the minimum distance S between the first solder balls 14 and the edge of the package substrate 12 ranges from 1mm to 1.9mm, and the length L of the supporting device 18 ranges from 0.6mm to 2mm. The thickness D2 of the first solder ball 14 before soldering is about 0.6mm, the thickness D3 of the first solder ball 14 after soldering is about 0.4mm, and the thickness D1 of the supporting device 18 is about 0.3mm.

As another alternative implementation of the disclosure, an embodiment of the present application discloses a packaging module, as shown in fig. 4, where the packaging module includes a chip packaging structure and a printed circuit board as disclosed in any one of the embodiments above. Based on the above, the plurality of first solder balls after welding can be supported by the supporting device in the chip packaging structure, so that the problems of collapse and bridging failure of the first solder balls in the chip packaging structure can be avoided, and the yield and the structural stability of the packaging module can be further ensured.

As another optional implementation of the disclosure, an embodiment of the present disclosure discloses an electronic device, where the electronic device includes a chip package structure as disclosed in any one of the foregoing embodiments or a package module as disclosed in any one of the foregoing embodiments. The electronic device may be a smart phone, a tablet computer, a digital camera, a server, etc. Based on the above, the plurality of first solder balls after welding can be supported by the supporting device in the chip packaging structure, so that the problems of collapse and bridging failure of the first solder balls in the chip packaging structure can be avoided, and the yield and the structural stability of the electronic equipment can be further ensured.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present specification, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the present description, which is within the scope of the present description. Accordingly, the protection scope of the patent should be determined by the appended claims.

Claims (10)

1. The chip packaging structure is characterized by comprising a packaging substrate, at least one bare chip and a packaging cover shell;

The at least one bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate;

the packaging cover shell is positioned on one side of the at least one bare chip, which is away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose an accommodating space, and the at least one bare chip is positioned in the accommodating space;

The surface of one side of the packaging substrate, which is away from the bare chip, is provided with a plurality of first solder balls and a plurality of supporting devices, the thickness of each supporting device is smaller than that of the first solder balls before welding, and the plurality of supporting devices are used for supporting the plurality of first solder balls after welding.

2. The chip package structure of claim 1, wherein a thickness difference between the supporting device and the first solder ball before soldering is in a range of 0.2mm to 0.3mm.

3. The chip package structure of claim 1, wherein the support device comprises a passive device comprising at least a capacitance or a resistance.

4. The chip package structure of claim 1, wherein the plurality of support devices are located at a peripheral edge of the package substrate and at least partially surround the plurality of first solder balls.

5. The chip package structure of claim 4, wherein the plurality of support devices are located at a plurality of corners of the package substrate, respectively.

6. The chip package structure according to claim 5, wherein the package substrate has three supporting devices at each corner, the three supporting devices are arranged in two parallel rows, one having one supporting device and the other having two supporting devices arranged in parallel, and the three supporting devices at each corner of the package substrate all form a triangular pattern.

7. The chip package structure according to claim 6, wherein the three supporting devices at each corner are arranged at an angle of 45 ° to the side of the package substrate.

8. The chip package structure of claim 1, wherein a minimum distance between the first solder ball and an edge of the package substrate is in a range of 1mm to 1.9mm; the length of the supporting device ranges from 0.6mm to 2mm.

9. A packaging module comprising the chip packaging structure of any one of claims 1 to 8.

10. An electronic device comprising the chip package structure of any one of claims 1 to 8 or the package module of claim 9.