CN118028929A - CQFP lead frame surface treatment method and electroplating device - Google Patents
CQFP lead frame surface treatment method and electroplating device Download PDFInfo
- Publication number
- CN118028929A CN118028929A CN202410437548.6A CN202410437548A CN118028929A CN 118028929 A CN118028929 A CN 118028929A CN 202410437548 A CN202410437548 A CN 202410437548A CN 118028929 A CN118028929 A CN 118028929A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- straight cylinder
- injection channel
- openings
- infusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004381 surface treatment Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000001802 infusion Methods 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000013589 supplement Substances 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims description 53
- 239000007924 injection Substances 0.000 claims description 53
- 238000007747 plating Methods 0.000 claims description 23
- 229910021645 metal ion Inorganic materials 0.000 claims description 22
- 239000000243 solution Substances 0.000 claims description 17
- 238000013135 deep learning Methods 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052753 mercury Inorganic materials 0.000 claims description 4
- 238000012549 training Methods 0.000 claims description 4
- 238000013527 convolutional neural network Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- -1 silver ions Chemical class 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 5
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229960002523 mercuric chloride Drugs 0.000 description 1
- LWJROJCJINYWOX-UHFFFAOYSA-L mercury dichloride Chemical compound Cl[Hg]Cl LWJROJCJINYWOX-UHFFFAOYSA-L 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a CQFP lead frame surface treatment method and an electroplating device, and belongs to the technical field of lead frames. According to the method, oil and rust are removed from the surface of the lead frame, then the first metal coating and the second metal coating are plated, the second metal coating serving as the main coating is plated, in the electroplating process, when some emergency conditions occur and the surface of the lead frame is absent, the camera component can monitor the surface of the lead frame in real time and identify the absent condition, and after the controller receives the information, the infusion component is controlled to supplement liquid to the absent position and supplement the position of the coating on the lead frame.
Description
Technical Field
The invention belongs to the technical field of lead frame production and processing, and relates to a CQFP lead frame surface treatment method and an electroplating device.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electric connection between an internal circuit leading-out end of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electric loop, plays a role of a bridge connected with an external lead, and is an important basic material in the electronic information industry because the lead frame is needed to be used in most of semiconductor integrated blocks. In the production and processing of lead frames, a layer of metal, such as copper or copper alloy, is plated on the surface of the lead frames, and when silver plating is performed on the lead frames, the lead frames are subjected to degreasing and rust removal; then preplating thin silver or immersing in a solution prepared from mercuric chloride and the like, and performing mercurification treatment to plate a layer of mercury film on the surface of the manufactured part; then the product is used as cathode, the pure silver plate is used as anode, and the product is immersed into silver potassium cyanide electrolyte prepared from silver nitrate and potassium cyanide to carry out electroplating.
During the electroplating process, metal ions are transferred from the anode to the cathode serving as the lead frame, and when emergency conditions such as too high concentration of electroplating solution, unstable current density and incomplete cleaning of certain parts of the surface of the lead frame occur, plating loss is easily caused in certain parts of the lead frame.
Disclosure of Invention
The invention aims to provide a CQFP lead frame surface treatment method and an electroplating device, which can be used for supplementing in time when some emergency situations occur, and avoid the situation that the surface coating of the lead frame is lost.
The technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a CQFP leadframe surface treatment method, including the steps of:
s1, pre-plating a first metal coating after cleaning the surface of a lead frame;
s2, electroplating the lead frame with a second metal coating through an electroplating device;
S3, drying treatment;
The electroplating device comprises a body, a camera assembly, a controller and at least two infusion assemblies, wherein the body is used for electroplating the second metal coating for the lead frame, the camera assembly is suitable for identifying whether the surface of the lead frame is in a missing condition, the two infusion assemblies are suitable for respectively conveying solutions with metal ions to the two sides of the lead frame, and the input end of the controller is connected with the camera assembly and is used for controlling the infusion assemblies to supplement liquid when the missing condition occurs; the infusion assemblies are all arranged in the electroplating liquid of the body, each infusion assembly comprises a liquid pump, a steering engine and an ejector which are sequentially communicated, the input end of each liquid pump is close to the anode of the body, and each liquid pump and each steering engine are connected with the output end of the controller; the steering engine and the injector are adapted to open an infusion path to align the missing location.
Further, the first metal coating comprises a pre-silver plating or mercury film, the second metal coating comprises a silver plating layer, and the metal ions are silver ions.
Further, the camera shooting assembly comprises a deep learning module, wherein the deep learning module is suitable for carrying out deep learning training on the surface pictures of a plurality of lead frames, and finally judging whether the surface of the lead frames is missing or not.
Further, the deep learning module comprises a convolutional neural network module.
Further, the steering engine comprises a first straight cylinder, a second straight cylinder and a motor, wherein a main passage is arranged in the center of the first straight cylinder, a plurality of openings are uniformly formed in the first straight cylinder along the circumferential direction of the first straight cylinder, the openings are axisymmetric relative to the central axis of the first straight cylinder, the openings are communicated with the main passage through straight pipes, the central axis of each straight pipe is positioned in the radial direction of the main passage, the first end of the first straight cylinder is communicated with the output end of the liquid pump, and the second end of the first straight cylinder is communicated with the ejector; the second straight cylinder is sleeved on the outer wall of the first straight cylinder and is suitable for controlling one of the openings to be opened or all the openings to be closed, and the motor is suitable for driving the second straight cylinder to coaxially rotate around the first straight cylinder;
The ejector is provided with a main injection channel corresponding to the main passage, a secondary injection channel corresponding to the opening is provided, the main injection channel is correspondingly connected with the main passage, the secondary injection channel is correspondingly connected with the opening, and the main injection channel and the secondary injection channel face different areas of the lead frame.
Further, the secondary injection passage is a tesla valve passage.
Further, the outlets of all the tesla valve channels have the same shape and coaxially and uniformly surround the main injection channel.
Further, the outlet of the tesla valve passage is fan-shaped.
In a second aspect, the invention provides an electroplating device, which comprises a body, a camera component, a controller and at least two infusion components, wherein the body is used for electroplating the second metal coating on a lead frame, the camera component is suitable for monitoring and identifying whether the surface of the lead frame is in a missing condition, the two infusion components are suitable for respectively conveying solutions with metal ions to two sides of the lead frame, the input end of the controller is connected with the camera component, and the controller is used for controlling the infusion component to supplement liquid when the surface of the lead frame is in missing; the infusion assemblies are all arranged in the electroplating liquid of the body, each infusion assembly comprises a liquid pump, a steering engine and an ejector which are sequentially communicated, the input end of each liquid pump is close to the anode of the body, and each liquid pump and each steering engine are connected with the output end of the controller; the steering engine and the injector are adapted to open an infusion path to align the missing location.
Further, the steering engine comprises a first straight cylinder, a second straight cylinder and a motor, wherein a main passage is arranged in the center of the first straight cylinder, a plurality of openings are uniformly formed in the first straight cylinder along the circumferential direction of the first straight cylinder, the openings are axisymmetric relative to the central axis of the first straight cylinder, the openings are communicated with the main passage through straight pipes, the central axis of each straight pipe is positioned in the radial direction of the main passage, the first end of the first straight cylinder is communicated with the output end of the liquid pump, and the second end of the first straight cylinder is communicated with the ejector; the second straight cylinder is sleeved on the outer wall of the first straight cylinder and is suitable for controlling one of the openings to be opened or all the openings to be closed, and the motor is suitable for driving the second straight cylinder to coaxially rotate around the first straight cylinder;
The ejector is provided with a main injection channel corresponding to the main passage, a secondary injection channel corresponding to the opening is provided, the main injection channel is correspondingly connected with the main passage, the secondary injection channel is correspondingly connected with the opening, and the main injection channel and the secondary injection channel face different areas of the lead frame.
Compared with the prior art, the invention has the beneficial effects that:
According to the CQFP lead frame surface treatment method disclosed by the invention, the surface of the lead frame is cleaned, degreasing and rust removal are firstly carried out, then the first metal coating and the second metal coating are sequentially coated, and the second metal coating serving as the main coating is used, when the surface of the lead frame is in a missing state due to some emergency conditions in the electroplating process, the camera shooting assembly can monitor the surface of the lead frame in real time and identify the missing condition, after receiving the information, the controller controls the infusion assembly to supplement liquid to the missing position and supplement the missing position of the coating on the lead frame, and in specific work, the controller controls the liquid pump, controls the steering engine and the ejector to align the steering engine and the ejector to the missing position, so that metal ions are conveyed to the vicinity of the missing position, and then electrons of the metal ions are reduced, so that the second metal is attached to the missing position.
Drawings
For a clearer description of the technical solutions of embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and should not be considered limiting in scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of an infusion set according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the connection of a steering engine and an injector according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a first cylinder and a second cylinder according to an embodiment of the present invention;
Fig. 5 is a schematic side view of an ejector according to an embodiment of the present invention.
The marks in the figure:
100-electroplating device;
10-a body;
20-a camera assembly;
30-a controller;
40-an infusion set; 41-liquid pump; 42-steering engine; 421-first barrel; 4211—a main path; 4212-opening; 4213-straight line; 422-a second straight barrel; 4221-through slot; 423-motor; 424-a transmission component; 43-ejector; 431—main injection channel; 432-secondary injection channels; 433-branch.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the particular embodiments described herein are illustrative only and are not intended to limit the invention, i.e., the embodiments described are merely some, but not all, of the embodiments of the invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
It is noted that relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
As described in the background art, during the electroplating process, metal ions are transferred from the anode to the cathode serving as the lead frame, and when emergency situations occur, such as too high concentration of the electroplating solution, unstable current density and incomplete cleaning of a certain part of the surface of the lead frame, plating loss is easily caused in certain parts of the lead frame.
Based on this, the inventor creates a CQFP lead frame surface treatment method of the present application to solve the above-mentioned technical problems.
The features and capabilities of the present invention are described in further detail below in connection with examples.
Examples
In a first aspect, the present invention provides a CQFP leadframe surface treatment method, including the steps of:
s1, pre-plating a first metal plating layer after cleaning (for example, degreasing and rust removing) the surface of the lead frame. For example, the first metal plating layer may be a pre-silver plating layer or a mercury film, to which the present invention is not limited.
And S2, electroplating the lead frame with a second metal coating through the electroplating device 100. For example, the second metal coating may comprise a silver coating, in which case the corresponding metal ion is silver ion.
S3, drying treatment. Here, after the plating is completed, the second metal plating layer may be made stronger and more reliable by, for example, baking or air-drying.
Referring to fig. 1 to 5, the electroplating apparatus 100 includes a body 10, a camera assembly 20, a controller 30 and an infusion assembly 40, wherein the body 10 is used for electroplating the second metal coating on the lead frame. For example, the body 10 typically includes a container in which the plating solution is stored, with the metal rod as the anode, the lead frame as the cathode, and a power source disposed therebetween.
The camera assembly 20 is adapted to identify whether a missing condition has occurred on the surface of the lead frame. For example, the camera assembly 20 may include a deep learning module adapted to perform deep learning training on the surface pictures of several lead frames and ultimately determine whether the surface of the lead frames is missing. Here, the camera assembly 20 monitors both sides of the lead frame. Here, the deep learning module is to obtain the normal pictures and the pictures with the missing on the surfaces of the plurality of lead frames, then input the pictures into the deep learning module, and then manually judge whether the lead frames are in the missing condition, and automatically identify whether the missing condition occurs when the pictures on the surfaces of the lead frames shot by the camera assembly 20 are input into the deep learning module after a plurality of deep learning training. Preferably, the deep learning module comprises a convolutional neural network module.
The infusion assembly 40 is suitable for directional delivery of a solution with metal ions, the input end of the controller 30 is connected with the camera assembly 20, and the controller 30 is used for controlling the infusion assembly 40 to supplement liquid when the surface of the lead frame is missing. Here, the ionic state of the metal material corresponding to the second metal plating layer is the metal ion. For example, when the second plating metal is silver, then the metal ions are silver ions, and the solution with the metal ions may be a silver nitrate solution. The infusion assembly 40 is arranged in the electroplating liquid of the body 10, the infusion assembly 40 comprises a liquid pump 41, a steering engine 42 and an ejector 43 which are sequentially communicated, the input end of the liquid pump 41 is close to the anode of the body 10, and the liquid pump 41 and the steering engine 42 are connected with the output end of the controller 30. The steering engine 42 and the injector 43 are adapted to open an infusion path to align the missing site. Here, that is, the infusion set 40 directionally delivers a large amount of metal ions contained near the anode to the missing position, and the electrons of the metal ions at the missing position are reduced to form a second metal plating layer and complement the second metal plating layer at the missing position.
In the CQFP lead frame surface treatment method, the surface of the lead frame is cleaned to remove oil and rust, then the first metal coating and the second metal coating are sequentially coated, and the second metal coating serving as the main coating is coated, when the surface of the lead frame is in a missing state due to some emergency conditions in the electroplating process, the camera assembly 20 can monitor the surface of the lead frame in real time and identify the missing condition, after receiving the information, the controller 30 controls the infusion assembly 40 to supplement liquid to the missing position, and the missing position of the coating on the lead frame is complemented, and in specific work, the controller 30 controls the liquid pump 41 to control the steering engine 42 and the ejector 43 to align the missing position, so that metal ions are conveyed to the vicinity of the missing position, then electrons of the metal ions are reduced, and the second metal is formed to be attached to the missing position.
In another embodiment, the steering engine 42 includes a first straight cylinder 421, a second straight cylinder 422, and a motor 423, a main passage 4211 is disposed in the center of the first straight cylinder 421, a plurality of openings 4212 are uniformly disposed in the first straight cylinder 421 along the circumferential direction thereof, the plurality of openings 4212 are axisymmetric with respect to the central axis of the first straight cylinder 421, and the openings 4212 are all communicated with the main passage 4211 through straight pipes 4213. For example, the number of the openings 4212 is not limited, and may be four, five, six, or more, and the outer ends of the openings 4212 are abutted against the edge line of the first cylinder 421. The central axis of the straight tube 4213 is located in the radial direction of the main passage 4211, the first end of the first straight tube 421 is in communication with the output end of the liquid pump 41, and the second end of the first straight tube 421 is in communication with the injector 43. The second straight cylinder 422 is sleeved on the outer wall of the first straight cylinder 421 and is suitable for controlling one of the openings 4212 to be opened or all the openings 4212 to be closed, and the motor 423 is suitable for driving the second straight cylinder 422 to coaxially rotate around the first straight cylinder 421. For example, the exterior of the second straight barrel 422 may be provided with a through slot 4221, which when the through slot 4221 is aligned with the opening 4212, opens the opening 4212. For example, the motor 423 may directly drive the second straight cylinder 422 or may be driven through the transmission member 424, and the present invention is not limited thereto. For example, an electric control valve may be further disposed between the liquid pump 41 and the steering engine 42, and the electric control valve is connected to the output end of the controller 30, so that when the missing position needs to be replenished with liquid, the electric control valve and the adjusting motor 423 are started, so that frequent starting of the liquid pump 41 is avoided. When the liquid is needed to be replenished, the metal ion solution is directly injected to the missing position through the main passage 4211 and the main injection passage 431, when the missing position is in a certain secondary injection passage 432, the motor 423 is controlled to make the first opening 4212 on the opposite side of the first opening 4212 corresponding to the secondary injection passage 432 be in an open state, and due to the coanda effect of the liquid, the liquid is conveyed forward near the first opening 4212 corresponding to the secondary injection passage 432, so that the liquid tends to be conveyed by the secondary injection passage 432, and the metal ions are conveyed near the missing position.
The ejector 43 is provided with a main injection channel 431 corresponding to the main passage 4211, a sub injection channel 432 corresponding to the opening 4212, the main injection channel 431 is correspondingly connected to the main passage 4211, the sub injection channel 432 is correspondingly connected to the opening 4212, and the main injection channel 431 and the sub injection channel 432 are both directed to different areas of the lead frame.
In further embodiments, the secondary injection passage 432 is a tesla valve passage. Here, the tesla method refers to that a small branch 433 is formed on the side wall of the secondary injection channel 432 near the outer side and joins before the outlet, so that the wall attachment effect of the jet flow is better, and the output liquid is more concentrated in the secondary injection channel 432 and does not flow into the primary injection channel 431. Preferably, the outlets of all the tesla valve channels have the same shape and coaxially and uniformly surround the main injection channel 431, so that the liquid area sprayed by each sub injection channel 432 is more uniform. For example, there may be a small overlap between the ejection channels to allow more complete coverage of the surface of the leadframe by the output liquid. Preferably, the outlet of the tesla valve channel is sector-shaped.
In a second aspect, the present invention provides an electroplating apparatus 100, where the electroplating apparatus 100 includes a body 10, a camera assembly 20, a controller 30, and an infusion assembly 40, the body 10 is used to electroplate the second metal plating layer on the lead frame, the camera assembly 20 is adapted to monitor and identify whether a surface of the lead frame is missing, the infusion assembly 40 is adapted to directionally convey a solution with metal ions, an input end of the controller 30 is connected to the camera assembly 20, and the controller 30 is used to control the infusion assembly 40 to supplement the solution when the surface of the lead frame is missing; the infusion assembly 40 is arranged in the electroplating liquid of the body 10, the infusion assembly 40 comprises a liquid pump 41, a steering engine 42 and an ejector 43 which are sequentially communicated, the input end of the liquid pump 41 is close to the anode of the body 10, and the liquid pump 41 and the steering engine 42 are connected with the output end of the controller 30. The steering engine 42 and the injector 43 are adapted to open an infusion path to align the missing site.
The steering engine 42 includes a first straight cylinder 421, a second straight cylinder 422, and a motor 423, where a main passage 4211 is provided in the center of the first straight cylinder 421, the first straight cylinder 421 is uniformly provided with a plurality of openings 4212 along its circumferential direction, the plurality of openings 4212 are axisymmetric about a central axis of the first straight cylinder 421, the openings 4212 are all communicated with the main passage 4211 through straight pipes 4213, the central axis of the straight pipes 4213 is located in a radial direction of the main passage 4211, a first end of the first straight cylinder 421 is communicated with an output end of the liquid pump 41, and a second end of the first straight cylinder 421 is communicated with the injector 43; the second straight cylinder 422 is sleeved on the outer wall of the first straight cylinder 421 and is suitable for controlling one of the openings 4212 to be opened or all the openings 4212 to be closed, and the motor 423 is suitable for driving the second straight cylinder 422 to coaxially rotate around the first straight cylinder 421;
The ejector 43 is provided with a main injection channel 431 corresponding to the main passage 4211, a sub injection channel 432 corresponding to the opening 4212, the main injection channel 431 is correspondingly connected to the main passage 4211, the sub injection channel 432 is correspondingly connected to the opening 4212, and the main injection channel 431 and the sub injection channel 432 are both directed to different areas of the lead frame.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalents, improvements and modifications within the spirit and principles of the invention will become apparent to those skilled in the art.
Claims (10)
1. A CQFP lead frame surface treatment method, characterized by comprising the steps of:
s1, pre-plating a first metal coating after cleaning the surface of a lead frame;
S2, electroplating the lead frame with a second metal coating through an electroplating device (100);
S3, drying treatment;
The electroplating device (100) comprises a body (10), a camera assembly (20), a controller (30) and at least two infusion assemblies (40), wherein the body (10) is used for electroplating the second metal coating for the lead frame, the camera assembly (20) is suitable for identifying whether the surface of the lead frame is in a missing condition, the two infusion assemblies (40) are suitable for respectively conveying solutions with metal ions to the two sides of the lead frame, and the input end of the controller (30) is connected with the camera assembly (20) and is used for controlling the infusion assemblies (40) to supplement the solutions when the missing condition occurs; the infusion assembly (40) is arranged in the electroplating liquid of the body (10), the infusion assembly (40) comprises a liquid pump (41), a steering engine (42) and an ejector (43) which are sequentially communicated, the input end of the liquid pump (41) is close to the anode of the body (10), and the liquid pump (41) and the steering engine (42) are connected with the output end of the controller (30); the steering engine (42) and the injector (43) are adapted to open an infusion path to align the missing location.
2. The CQFP leadframe surface treatment method of claim 1, characterized in that the first metal plating layer comprises a pre-silver plating or a mercury film, the second metal plating layer comprises a silver plating layer, and the metal ions are silver ions.
3. The CQFP lead frame surface treatment method according to claim 1, characterized in that the camera assembly (20) comprises a deep learning module adapted to perform deep learning training on the surface pictures of several lead frames and finally determine whether the surface of the lead frame is missing.
4. The CQFP lead frame surface processing method of claim 3, characterized in that the deep learning module comprises a convolutional neural network module.
5. The CQFP lead frame surface treatment method according to any one of claims 1 to 4, characterized in that the steering engine (42) comprises a first straight cylinder (421), a second straight cylinder (422) and a motor (423), a main passage (4211) is provided in the center of the first straight cylinder (421), the first straight cylinder (421) is uniformly provided with a plurality of openings (4212) along the circumferential direction thereof, the plurality of openings (4212) are axisymmetric with respect to the central axis of the first straight cylinder (421), the openings (4212) are all communicated with the main passage (4211) through straight pipes (4213), the central axis of the straight pipes (4213) is located in the radial direction of the main passage (4211), the first end of the first straight cylinder (421) is communicated with the output end of the liquid pump (41), and the second end of the first straight cylinder (421) is communicated with the ejector (43); the second straight cylinder (422) is sleeved on the outer wall of the first straight cylinder (421) and is suitable for controlling one of the openings (4212) to be opened or all the openings (4212) to be closed, and the motor (423) is suitable for driving the second straight cylinder (422) to coaxially rotate around the first straight cylinder (421);
The ejector (43) is provided with a main injection channel (431) corresponding to the main passage (4211), a secondary injection channel (432) corresponding to the opening (4212), the main injection channel (431) is correspondingly connected with the main passage (4211), the secondary injection channel (432) is correspondingly connected with the opening (4212), and the main injection channel (431) and the secondary injection channel (432) are both oriented to different areas of the lead frame.
6. The CQFP leadframe surface treatment method according to claim 5, characterized in that the secondary injection channel (432) is a tesla valve channel.
7. The CQFP leadframe surface treatment method according to claim 6, characterized in that the outlet shapes of all the tesla valve channels are identical and all coaxially and uniformly surround the main injection channel (431).
8. The CQFP leadframe surface treatment method of claim 7, wherein the outlet of the tesla valve channel is fan-shaped in shape.
9. The electroplating device (100) is characterized by comprising a body (10), a camera assembly (20), a controller (30) and at least two infusion assemblies (40), wherein the body (10) is used for electroplating the second metal coating for a lead frame, the camera assembly (20) is suitable for monitoring and identifying whether the surface of the lead frame is missing, the two infusion assemblies (40) are suitable for respectively conveying solutions with metal ions to two sides of the lead frame, the input end of the controller (30) is connected with the camera assembly (20), and the controller (30) is used for controlling the infusion assemblies (40) to supplement liquid when the surface of the lead frame is missing; the infusion assembly (40) is arranged in the electroplating liquid of the body (10), the infusion assembly (40) comprises a liquid pump (41), a steering engine (42) and an ejector (43) which are sequentially communicated, the input end of the liquid pump (41) is close to the anode of the body (10), and the liquid pump (41) and the steering engine (42) are connected with the output end of the controller (30); the steering engine (42) and the injector (43) are adapted to open an infusion path to align the missing location.
10. The electroplating device (100) according to claim 9, wherein the steering engine (42) comprises a first straight cylinder (421), a second straight cylinder (422) and a motor (423), a main passage (4211) is arranged in the center of the first straight cylinder (421), a plurality of openings (4212) are uniformly arranged in the circumferential direction of the first straight cylinder (421), the plurality of openings (4212) are axisymmetric relative to the central axis of the first straight cylinder (421), the openings (4212) are communicated with the main passage (4211) through straight pipelines (4213), the central axis of the straight pipe (4213) is located in the radial direction of the main passage (4211), the first end of the first straight cylinder (421) is communicated with the output end of the liquid pump (41), and the second end of the first straight cylinder (421) is communicated with the ejector (43); the second straight cylinder (422) is sleeved on the outer wall of the first straight cylinder (421) and is suitable for controlling one of the openings (4212) to be opened or all the openings (4212) to be closed, and the motor (423) is suitable for driving the second straight cylinder (422) to coaxially rotate around the first straight cylinder (421);
The ejector (43) is provided with a main injection channel (431) corresponding to the main passage (4211), a secondary injection channel (432) corresponding to the opening (4212), the main injection channel (431) is correspondingly connected with the main passage (4211), the secondary injection channel (432) is correspondingly connected with the opening (4212), and the main injection channel (431) and the secondary injection channel (432) are both oriented to different areas of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437548.6A CN118028929B (en) | 2024-04-12 | 2024-04-12 | CQFP lead frame surface treatment method and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437548.6A CN118028929B (en) | 2024-04-12 | 2024-04-12 | CQFP lead frame surface treatment method and electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118028929A true CN118028929A (en) | 2024-05-14 |
| CN118028929B CN118028929B (en) | 2024-09-03 |
Family
ID=90991775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410437548.6A Active CN118028929B (en) | 2024-04-12 | 2024-04-12 | CQFP lead frame surface treatment method and electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118028929B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851902A (en) * | 1986-10-29 | 1989-07-25 | Electroplating Engineers Of Japan, Limited | Auatomatic inspection system for IC lead frames and visual inspection method thereof |
| JPH0598489A (en) * | 1991-10-02 | 1993-04-20 | Sumitomo Metal Mining Co Ltd | Device for partially plating both sides of lead frame |
| DE19735174A1 (en) * | 1997-08-13 | 1999-02-18 | Alfred R Franz Fa | Galvanic reconditioning of black chromated die castings consisting of magnesium alloys |
| US6350361B1 (en) * | 1999-02-17 | 2002-02-26 | Scitex Digital Printing, Inc. | Real time control device for electroformation, plating and deplating processes |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
| CN105696038A (en) * | 2014-11-28 | 2016-06-22 | 天津精工华晖制版技术开发有限公司 | Precision measurement type plating repairing technology |
| CN212410458U (en) * | 2020-05-26 | 2021-01-26 | 苏州苏仕朗智能科技有限公司 | Be used for lead frame plated item on-line measuring equipment |
| CN214881898U (en) * | 2021-01-08 | 2021-11-26 | 迈瑞沙(宁波)新材料科技有限公司 | Intelligent electroplating device for nickel alloy wear-resistant material |
| CN114645308A (en) * | 2022-03-03 | 2022-06-21 | 泰兴市龙腾电子有限公司 | Electroplating device based on lead frame and electroplating method thereof |
| CN116356408A (en) * | 2023-04-02 | 2023-06-30 | 吉林大学 | Micro-scale complex functional structure meniscus constraint electrodeposition additive manufacturing device and method |
| CN117305928A (en) * | 2023-10-07 | 2023-12-29 | 广州丰江微电子有限公司 | Silver plating process for surface of lead frame |
| CN117568907A (en) * | 2023-11-10 | 2024-02-20 | 天水华洋电子科技股份有限公司 | Novel electroplating process of nickel-palladium-gold lead frame |
| CN117822082A (en) * | 2024-01-04 | 2024-04-05 | 安徽翊昇表面处理科技有限公司 | Electroplating equipment and electroplating process suitable for precise electronic products |
-
2024
- 2024-04-12 CN CN202410437548.6A patent/CN118028929B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851902A (en) * | 1986-10-29 | 1989-07-25 | Electroplating Engineers Of Japan, Limited | Auatomatic inspection system for IC lead frames and visual inspection method thereof |
| JPH0598489A (en) * | 1991-10-02 | 1993-04-20 | Sumitomo Metal Mining Co Ltd | Device for partially plating both sides of lead frame |
| DE19735174A1 (en) * | 1997-08-13 | 1999-02-18 | Alfred R Franz Fa | Galvanic reconditioning of black chromated die castings consisting of magnesium alloys |
| US6350361B1 (en) * | 1999-02-17 | 2002-02-26 | Scitex Digital Printing, Inc. | Real time control device for electroformation, plating and deplating processes |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
| CN105696038A (en) * | 2014-11-28 | 2016-06-22 | 天津精工华晖制版技术开发有限公司 | Precision measurement type plating repairing technology |
| CN212410458U (en) * | 2020-05-26 | 2021-01-26 | 苏州苏仕朗智能科技有限公司 | Be used for lead frame plated item on-line measuring equipment |
| CN214881898U (en) * | 2021-01-08 | 2021-11-26 | 迈瑞沙(宁波)新材料科技有限公司 | Intelligent electroplating device for nickel alloy wear-resistant material |
| CN114645308A (en) * | 2022-03-03 | 2022-06-21 | 泰兴市龙腾电子有限公司 | Electroplating device based on lead frame and electroplating method thereof |
| CN116356408A (en) * | 2023-04-02 | 2023-06-30 | 吉林大学 | Micro-scale complex functional structure meniscus constraint electrodeposition additive manufacturing device and method |
| CN117305928A (en) * | 2023-10-07 | 2023-12-29 | 广州丰江微电子有限公司 | Silver plating process for surface of lead frame |
| CN117568907A (en) * | 2023-11-10 | 2024-02-20 | 天水华洋电子科技股份有限公司 | Novel electroplating process of nickel-palladium-gold lead frame |
| CN117822082A (en) * | 2024-01-04 | 2024-04-05 | 安徽翊昇表面处理科技有限公司 | Electroplating equipment and electroplating process suitable for precise electronic products |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118028929B (en) | 2024-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0571665B2 (en) | ||
| KR101391533B1 (en) | electroless plating apparatus and electroless plating method | |
| WO2001068952A1 (en) | Method and apparatus for electroplating | |
| CA1175520A (en) | Electric terminals having plated interior surfaces, apparatus for and method of selectively plating said terminals | |
| KR100477055B1 (en) | Chemical processing system, plating system and chemical processing method | |
| CN118028929B (en) | CQFP lead frame surface treatment method and electroplating device | |
| CN1232677C (en) | Regeneration method for a plating solution | |
| US5364523A (en) | Method of electroplating half sliding bearings | |
| US3123543A (en) | Method and apparatus for feeding articles | |
| JP3600787B2 (en) | Surface treatment method and surface treatment line for bag-like work | |
| CN112323111B (en) | Method for electrolyzing continuous terminal | |
| CN101492831B (en) | Anode apparatus for electroplating and electroplating apparatus comprising the same | |
| US9080246B2 (en) | Selective plating apparatus and method | |
| JPS63274794A (en) | Method for electroplating dielectric core | |
| CA2156644C (en) | Method and apparatus for continuous galvanic or chemical application of metallic layers on a body | |
| KR20040007399A (en) | Plating system with remote secondary anode for semiconductor manufacturing | |
| US6485627B1 (en) | Method and apparatus for electroplating | |
| CN110846695A (en) | Local area surface treatment device and surface treatment method thereof | |
| CN212669815U (en) | Local area surface treatment device | |
| EP0114216B1 (en) | Method for selective electroplating | |
| KR20040025854A (en) | Method of electroplating wire, device for electroplating wire, and electroplated wire | |
| CN220665491U (en) | Electroplating device | |
| JPS58217693A (en) | Material treated on its minute part with silver plating and plating method | |
| JPH08172271A (en) | Plating method of printed-circuit board | |
| JP2669085B2 (en) | Continuous strip plating system for metal strips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |