CN114645308A - Electroplating device based on lead frame and electroplating method thereof - Google Patents
Electroplating device based on lead frame and electroplating method thereof Download PDFInfo
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- CN114645308A CN114645308A CN202210202255.0A CN202210202255A CN114645308A CN 114645308 A CN114645308 A CN 114645308A CN 202210202255 A CN202210202255 A CN 202210202255A CN 114645308 A CN114645308 A CN 114645308A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating device based on a lead frame and an electroplating method thereof, wherein the electroplating device comprises a device main body, a mounting support, a liquid outlet box and an electroplating function management platform, the device main body is positioned at the upper end of the mounting support, the liquid outlet box is positioned at the bottom of the mounting support, an observation window and a liquid outlet are arranged at the front end of the liquid outlet box, lifting columns are arranged at four corners of the upper end of the device main body, lifting plates are arranged at the upper ends of the lifting columns, and an opening is formed in the middle of the upper end of the device main body. The electroplating device based on the lead frame and the electroplating method thereof are provided with the temperature control type electroplating mechanism, the lifting material taking mechanism and the electroplating function management platform, so that electroplating operation can be conveniently and better carried out, the temperature control effect is achieved, the cathode part can move and stir, the electroplating effect is improved, the efficiency is higher, material taking operation can be conveniently carried out, the speed is higher, the control on a function module of the whole device is convenient, and the electroplating device is simple and practical.
Description
Technical Field
The invention relates to the field of electroplating devices, in particular to an electroplating device based on a lead frame and an electroplating method thereof.
Background
The electroplating device is a supporting device for carrying out surface treatment of parts, and electroplating refers to a surface processing method for forming a coating by using a plated base metal as a cathode in a salt solution containing the metal to be plated and depositing cations to be plated in the plating solution on the surface of the base metal through electrolysis.
The existing electroplating device has certain disadvantages when in use, firstly, when the lead frame is used for electroplating operation, the internal temperature cannot be conveniently controlled, the position of a cathode cannot be well moved, the use structure is single, the use structure is not beneficial to people, in addition, the material taking operation is troublesome when in use, certain adverse effects are brought to the use process of people, and therefore, the electroplating device based on the lead frame and the electroplating method thereof are provided.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the electroplating device based on the lead frame and the electroplating method thereof, which can conveniently and better carry out electroplating operation, have the effect of temperature control, can move and stir the cathode part, increase the electroplating effect, have higher efficiency, can also conveniently carry out material taking operation, are quicker, are convenient to control the function module of the whole device, are simple and practical, and can effectively solve the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention adopts the technical scheme that: based on lead frame is with electroplating device, including device main part, erection support, play liquid case and electroplating function management platform, the device main part is located erection support's upper end, it is located erection support's bottom to go out the liquid case, the front end that goes out the liquid case is provided with observation window and liquid outlet, the upper end four corners of device main part is provided with the lift post, the lifter plate is installed to the upper end of lift post, the opening has been seted up at the upper end middle part of device main part, the stabilizer blade is installed to erection support's bottom.
As an optimal technical scheme of this application, the internally mounted of device main part has the bedplate, the inboard of bedplate is provided with the expansion plate, the avris fixed position of expansion plate is connected with sealed the pad, the bottom fixed position of bedplate has the seal box, the inboard erection mounting of seal box has the heater, the heating driver is installed in the outside of device main part, and heats the driver and be connected with the heater, the cistern has been seted up to the bottom position of device main part.
As an optimal technical scheme of this application, the rear end position fixed mounting of device main part has the electroplating power, the negative pole is installed to the front side one end of electroplating the power, the positive pole is installed to the front side other end of electroplating the power, the negative pole outside is provided with the carousel, install the puddler on the carousel.
As an optimal technical scheme of this application, the cylinder is installed to the upper end of lifter plate, the bottom of cylinder is provided with the lifter, the location connecting seat is installed to the bottom position of lifter, the bottom position of location connecting seat is installed and is got the material seat, the location connecting seat with get and install the locating lever between the material seat, get and seted up the draining hole on the material seat, get the bottom of material seat and install the locator, the sucking disc is installed to the bottom of locator.
As a preferred technical scheme of this application, the expansion plate moves about in the inboard position of bedplate, fix through the mode of veneer between expansion plate and the sealed pad, the position of heating driver drive heater is installed, fix a position the installation between seal box and the bedplate.
As an optimal technical scheme of this application, the cylinder drives the lifter and drives the position of carousel and carries out lift adjustment, the bottom position of location connecting seat is fixed through the locating lever and the upper end position of getting the material seat, the bottom of getting the material seat is fixed a position through the upper end of locator and sucking disc.
As an optimal technical scheme of this application, it is connected with state monitoring module to electroplate function management platform, state monitoring module connects the PLC the control unit, the PLC the control unit is connected with display module and state control module, state monitoring module includes temperature monitoring module, electroplates monitoring module and stirring drive monitoring module, state control module includes temperature control module, electroplates control module and stirring drive control module.
As an optimal technical scheme of this application, electroplate function management platform's output and state monitoring module's input electric connection, state monitoring module's output and PLC the input electric connection of control unit, PLC the output of control unit and display module, state control module's input electric connection.
The electroplating method based on the electroplating device for the lead frame comprises the following operation steps:
s1: the device comprises a mounting support, a liquid outlet box, a lifting column, a telescopic plate, a sealing gasket and a lead frame to be electroplated, wherein the mounting support is arranged at the upper end of the mounting support;
s2: adding electroplating solution into the inner position of the device main body, simultaneously heating the position of the heater driven by the heating driver to heat so as to keep the temperature inside the device main body at about centigrade, turning on an electroplating power supply at the rear end of the device main body, respectively outputting a cathode and an anode at the positions of the cathode and the anode, and stirring at a certain speed at the position of the cathode through a turntable and a stirring rod;
s3: after the electroplating is finished, the cylinder drives the lifting rod to lift, the material taking seat is driven to reach the position of the upper end of the expansion plate, the lead frame is attracted by the sucker, the lifting rod is lifted to the position of the outlet, after the surface solution is filtered, the lead frame is taken out, and finally the electroplating is finished.
(III) advantageous effects
Compared with the prior art, the invention provides the electroplating device based on the lead frame and the electroplating method thereof, and the electroplating device has the following beneficial effects: the electroplating device and the electroplating method based on the lead frame can conveniently and better perform electroplating operation through the temperature control type electroplating mechanism, the lifting material taking mechanism and the electroplating function management platform, have the effect of temperature control, can move and stir the cathode part, increase the electroplating effect, have higher efficiency, can also conveniently perform material taking operation, are quicker, are convenient for controlling the whole device functional module, are simple and practical, install the device main body at the upper end of the installation support, arrange the liquid outlet box at the lower end of the installation support, arrange the liquid outlet box at the bottom position of the device main body, arrange the lifting column at the upper end of the device main body, perform lifting movement on the device main body, drive the lifting plate to lift through the lifting column, close the expansion plate, seal through the sealing gasket, place the lead frame to be electroplated into the inner position of the device main body, adding electroplating solution to the inside position of the device main body, simultaneously heating the position of the driver driving heater, keeping the temperature inside the device main body at about centigrade, opening the electroplating power supply at the rear end of the device main body, respectively outputting a cathode and an anode at the positions of the cathode and the anode, and stirring at a certain speed through a turntable and a stirring rod at the position of the cathode, after electroplating is completed, lifting a cylinder driving lifting rod, driving a material taking seat to the position of the upper end of a telescopic plate, attracting the lead frame by a sucker, lifting the lifting rod, lifting the lead frame to the position of an outlet, after surface solution is filtered, taking the lead frame out, finally electroplating is completed, the whole electroplating device is simple in structure, and the operation is convenient, and the use effect is better than that of a traditional mode.
Drawings
Fig. 1 is a schematic overall structure diagram of an electroplating device and an electroplating method thereof for a lead frame according to the present invention.
FIG. 2 is a schematic structural diagram of a device body in an electroplating device for lead frames and an electroplating method thereof according to the present invention.
FIG. 3 is a schematic structural diagram of the interior of the device body in the electroplating device and the electroplating method for lead frame according to the present invention.
FIG. 4 is a schematic structural diagram of an electroplating power supply in the electroplating apparatus for lead frame and the electroplating method thereof according to the present invention.
FIG. 5 is a schematic structural diagram of a pickup base of an electroplating apparatus for a lead frame and an electroplating method thereof according to the present invention.
FIG. 6 is a schematic structural diagram of a plating function management platform in the plating apparatus and the plating method for a lead frame according to the present invention.
In the figure: 1. a device main body; 2. a liquid outlet; 3. an observation window; 4. a liquid outlet box; 5. a support leg; 6. a heating driver; 7. a lifting column; 8. an opening; 9. a cylinder; 10. a lifting plate; 11. a lifting rod; 12. a turntable; 13. an electroplating power supply; 14. a seat plate; 15. a heater; 16. sealing the box; 17. a retractable plate; 18. a liquid bath; 19. a gasket; 20. a cathode; 21. a stirring rod; 22. an anode; 23. positioning the connecting seat; 24. positioning a rod; 25. a positioner; 26. a suction cup; 27. a material taking seat; 28. filtering the pores; 29. and (7) mounting a support.
Detailed Description
The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and the detailed description, but those skilled in the art will understand that the following described embodiments are some, not all, of the embodiments of the present invention, and are only used for illustrating the present invention, and should not be construed as limiting the scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
as shown in fig. 1-6, the electroplating device for the lead frame comprises a device body 1, a mounting support 29, a liquid outlet box 4 and an electroplating function management platform, wherein the device body 1 is located at the upper end of the mounting support 29, the liquid outlet box 4 is located at the bottom of the mounting support 29, an observation window 3 and a liquid outlet 2 are arranged at the front end of the liquid outlet box 4, lifting columns 7 are arranged at four corners of the upper end of the device body 1, a lifting plate 10 is arranged at the upper ends of the lifting columns 7, an opening 8 is formed in the middle of the upper end of the device body 1, and support legs 5 are arranged at the bottom of the mounting support 29.
Furthermore, a seat plate 14 is installed inside the device main body 1, an expansion plate 17 is arranged inside the seat plate 14, a sealing gasket 19 is fixedly connected to the side position of the expansion plate 17, a sealing box 16 is fixedly installed at the bottom position of the seat plate 14, a heater 15 is installed inside the sealing box 16, a heating driver 6 is installed outside the device main body 1, the heating driver 6 is connected with the heater 15, and a liquid tank 18 is arranged at the bottom position of the device main body 1.
Furthermore, an electroplating power supply 13 is fixedly installed at the rear end position of the device main body 1, a cathode 20 is installed at one end of the front side of the electroplating power supply 13, an anode 22 is installed at the other end of the front side of the electroplating power supply 13, a rotary disc 12 is arranged outside the cathode 20, and a stirring rod 21 is installed on the rotary disc 12.
Further, the expansion plate 17 is movable at a position inside the seat plate 14, the expansion plate 17 and the gasket 19 are fixed by gluing, the heater actuator 6 is installed at a position where the heater 15 is driven, and the seal box 16 and the seat plate 14 are installed in a positioned manner.
Example two:
on the basis of the first embodiment, as shown in fig. 1 to 6, an electroplating device for a lead frame includes a device main body 1, a mounting support 29, a liquid outlet tank 4 and an electroplating function management platform, the device main body 1 is located at the upper end of the mounting support 29, the liquid outlet tank 4 is located at the bottom of the mounting support 29, an observation window 3 and a liquid outlet 2 are arranged at the front end of the liquid outlet tank 4, lifting columns 7 are arranged at four corners of the upper end of the device main body 1, a lifting plate 10 is arranged at the upper end of each lifting column 7, an opening 8 is formed in the middle of the upper end of the device main body 1, and support legs 5 are arranged at the bottom of the mounting support 29.
Further, the cylinder 9 is installed to the upper end of lifter plate 10, the bottom of cylinder 9 is provided with lifter 11, location connecting seat 23 is installed to the bottom position of lifter 11, the bottom position of location connecting seat 23 is installed and is got material seat 27, location connecting seat 23 and get and install locating lever 24 between the material seat 27, get and seted up draining hole 28 on the material seat 27, get the bottom of material seat 27 and install locator 25, sucking disc 26 is installed to the bottom of locator 25.
Further, the cylinder 9 drives the lifting rod 11 and drives the position of the rotary disc 12 to be lifted and adjusted, the bottom position of the positioning connection seat 23 is fixed with the upper end position of the material taking seat 27 through the positioning rod 24, and the bottom of the material taking seat 27 is positioned with the upper end of the suction disc 26 through the positioner 25.
Example three:
on the basis of the first and second embodiments, as shown in fig. 1 to 6, the electroplating device for a lead frame includes a device body 1, a mounting support 29, a liquid outlet tank 4 and an electroplating function management platform, the device body 1 is located at the upper end of the mounting support 29, the liquid outlet tank 4 is located at the bottom of the mounting support 29, an observation window 3 and a liquid outlet 2 are arranged at the front end of the liquid outlet tank 4, lifting columns 7 are arranged at four corners of the upper end of the device body 1, a lifting plate 10 is arranged at the upper ends of the lifting columns 7, and an opening 8 is formed in the middle of the upper end of the device body 1.
Further, electroplating function management platform is connected with the state monitoring module, and the state monitoring module is connected with the PLC the control unit, and the PLC the control unit is connected with display module and state control module, and the state monitoring module includes temperature monitoring module, electroplates monitoring module and stirring drive monitoring module, and the state control module includes temperature control module, electroplates control module and stirring drive control module.
Furthermore, the output end of the electroplating function management platform is electrically connected with the input end of the state monitoring module, the output end of the state monitoring module is electrically connected with the input end of the PLC control unit, and the output end of the PLC control unit is electrically connected with the input ends of the display module and the state control module.
Example four:
as shown in fig. 1 to 6, the electroplating method based on the electroplating device for lead frame comprises the following operation steps:
s1: the device comprises a device body 1, a liquid outlet box 4, a lifting column 7, a lead frame to be electroplated and a sealing gasket 19, wherein the device body 1 is arranged at the upper end of an installation support 29, the liquid outlet box 4 is arranged at the lower end of the installation support 29, the liquid outlet box 4 is arranged at the bottom position of the device body 1, the lifting column 7 is arranged at the upper end of the device body 1, the lifting column 7 can lift on the device body 1, the lifting column 7 drives a lifting plate 10 to lift, the telescopic plate 17 is closed, the lead frame to be electroplated is sealed through the sealing gasket 19, and the lead frame to be electroplated is placed in the inner position of the device body 1;
s2: adding electroplating solution into the inner position of the device body 1, simultaneously heating the position of the heater 15 by the heating driver 6, keeping the temperature in the device body 1 at about 50 ℃, turning on the electroplating power supply 13 at the rear end of the device body 1, respectively outputting a cathode and an anode at the positions of the cathode 20 and the anode 22, and stirring at a certain speed at the position of the cathode 20 by the rotary disc 12 and the stirring rod 21;
s3: after the electroplating is finished, the cylinder 9 drives the lifting rod 11 to lift, the material taking seat 27 is driven to reach the position of the upper end of the expansion plate 17, the lead frame is sucked by the sucker 26, the lifting rod 11 is lifted, the lead frame is lifted to the position of an outlet, after surface solution is filtered, the lead frame is taken out, and finally the electroplating is finished.
The working principle is as follows: the invention comprises a device main body 1, a liquid outlet 2, an observation window 3, a liquid outlet box 4, a support leg 5, a heating driver 6, a lifting column 7, an opening 8, a cylinder 9, a lifting plate 10, a lifting rod 11, a turntable 12, an electroplating power supply 13, a seat plate 14, a heater 15, a sealing box 16, a telescopic plate 17, a liquid tank 18, a sealing gasket 19, a cathode 20, a stirring rod 21, an anode 22, a positioning connecting seat 23, a positioning rod 24, a positioner 25, a suction cup 26, a material taking seat 27, a draining hole 28 and a mounting support 29, wherein the device main body 1 is arranged at the upper end of the mounting support 29, the liquid outlet box 4 is arranged at the lower end of the mounting support 29, the liquid outlet box 4 is arranged at the bottom of the device main body 1, the lifting column 7 is arranged at the upper end of the device main body 1, the lifting column 7 can lift up and down on the device main body 1, the lifting column 7 drives the lifting plate 10 to lift up and down, the telescopic plate 17 is closed and sealed through the sealing gasket 19, putting a lead frame to be electroplated into the inner position of the device body 1, adding electroplating solution into the inner position of the device body 1, simultaneously heating the position of the heater 15 driven by the heating driver 6 to keep the temperature inside the device body 1 at about 50 ℃, opening the electroplating power supply 13 at the rear end of the device body 1, respectively outputting a cathode and an anode at the positions of the cathode 20 and the anode 22, stirring at a certain speed at the position of the cathode 20 through the turntable 12 and the stirring rod 21, after electroplating is finished, driving the lifting rod 11 to lift by the cylinder 9, driving the material taking seat 27 to the position at the upper end of the expansion plate 17, attracting the lead frame by the sucker 26, lifting the lifting rod 11, lifting the lead frame to the position of an outlet, taking out the lead frame after surface solution is filtered, and finally completing electroplating.
It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (9)
1. Based on lead frame is with electroplating device, including device main part (1), erection support (29), play liquid box (4) and electroplating function management platform, its characterized in that: device main part (1) is located the upper end of erection support (29), it is located the bottom of erection support (29) to go out liquid case (4), the front end that goes out liquid case (4) is provided with observation window (3) and liquid outlet (2), the upper end four corners of device main part (1) is provided with lift post (7), lifter plate (10) are installed to the upper end of lift post (7), opening (8) have been seted up at the upper end middle part of device main part (1), stabilizer blade (5) are installed to the bottom of erection support (29).
2. The lead frame-based plating apparatus according to claim 1, characterized in that: the utility model discloses a heating device, including device main part (1), the internally mounted of device main part (1) has bedplate (14), the inboard of bedplate (14) is provided with expansion plate (17), the sealed pad (19) of avris position fixedly connected with of expansion plate (17), the bottom position fixed mounting of bedplate (14) has seal box (16), heater (15) are installed to the inboard installation of seal box (16), heating driver (6) are installed in the outside of device main part (1), and heating driver (6) are connected with heater (15), cistern (18) have been seted up to the bottom position of device main part (1).
3. The lead frame-based plating apparatus according to claim 1, characterized in that: the device is characterized in that an electroplating power supply (13) is fixedly mounted at the rear end of the device body (1), a cathode (20) is mounted at one end of the front side of the electroplating power supply (13), an anode (22) is mounted at the other end of the front side of the electroplating power supply (13), a rotary table (12) is arranged on the outer side of the cathode (20), and a stirring rod (21) is mounted on the rotary table (12).
4. The lead frame-based plating apparatus according to claim 1, characterized in that: cylinder (9) are installed to the upper end of lifter plate (10), the bottom of cylinder (9) is provided with lifter (11), location connecting seat (23) is installed to the bottom position of lifter (11), the bottom position of location connecting seat (23) is installed and is got material seat (27), location connecting seat (23) and get and install locating lever (24) between material seat (27), it strains dry hole (28) to have seted up on material seat (27) to get, locator (25) are installed to the bottom of getting material seat (27), sucking disc (26) are installed to the bottom of locator (25).
5. The lead frame-based plating apparatus according to claim 2, characterized in that: the telescopic plate (17) moves at the inner side position of the seat plate (14), the telescopic plate (17) and the sealing gasket (19) are fixed in a gluing mode, the heating driver (6) drives the heater (15) to be installed, and the sealing box (16) and the seat plate (14) are installed in a positioning mode.
6. The plating apparatus for lead frame according to claim 4, wherein: the lifting adjusting device is characterized in that the cylinder (9) drives the lifting rod (11) and drives the position of the rotary table (12) to be lifted and adjusted, the bottom position of the positioning connecting seat (23) is fixed with the upper end position of the material taking seat (27) through a positioning rod (24), and the bottom of the material taking seat (27) is positioned with the upper end of the sucker (26) through a positioner (25).
7. The lead frame-based plating apparatus according to claim 1, characterized in that: electroplating function management platform is connected with status monitoring module, status monitoring module connects PLC the control unit, PLC the control unit is connected with display module and status control module, status monitoring module includes temperature monitoring module, electroplates monitoring module and stirring drive monitoring module, status control module includes temperature control module, electroplates control module and stirring drive control module.
8. The lead frame-based plating apparatus according to claim 7, characterized in that: the output end of the electroplating function management platform is electrically connected with the input end of the state monitoring module, the output end of the state monitoring module is electrically connected with the input end of the PLC control unit, and the output end of the PLC control unit is electrically connected with the input ends of the display module and the state control module.
9. The electroplating method based on the electroplating device for the lead frame is characterized in that: the method comprises the following operation steps:
s1: the device comprises a device body (1), a liquid outlet box (4), a lifting column (7), a mounting support (29), a liquid outlet box (4), a lifting plate (10), a telescopic plate (17), a sealing gasket (19), a lead frame to be electroplated and a sealing gasket (7), wherein the device body (1) is mounted at the upper end of the mounting support (29);
s2: adding electroplating solution into the inner position of the device main body (1), simultaneously heating the position of the heater (15) by the heating driver (6), keeping the temperature inside the device main body (1) at about 50 ℃, turning on the electroplating power supply (13) at the rear end of the device main body (1), respectively outputting a cathode and an anode at the positions of the cathode (20) and the anode (22), and stirring at a certain speed at the position of the cathode (20) through the rotary table (12) and the stirring rod (21);
s3: after the electroplating is finished, the air cylinder (9) drives the lifting rod (11) to lift, the material taking seat (27) is driven to reach the upper end of the expansion plate (17), the lead frame is sucked by the sucker (26), the lifting rod (11) is lifted, the lead frame is lifted to the outlet, after the surface solution is filtered, the lead frame is taken out, and finally the electroplating is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210202255.0A CN114645308A (en) | 2022-03-03 | 2022-03-03 | Electroplating device based on lead frame and electroplating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210202255.0A CN114645308A (en) | 2022-03-03 | 2022-03-03 | Electroplating device based on lead frame and electroplating method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114645308A true CN114645308A (en) | 2022-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210202255.0A Pending CN114645308A (en) | 2022-03-03 | 2022-03-03 | Electroplating device based on lead frame and electroplating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114645308A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08167684A (en) * | 1994-12-12 | 1996-06-25 | Dainippon Printing Co Ltd | Device for plating lead frame and its operation control method |
| CN112663123A (en) * | 2020-12-24 | 2021-04-16 | 铜陵蓝盾丰山微电子有限公司 | Sheet type electroplating clamp for lead frame and clamping method thereof |
| CN112760702A (en) * | 2020-12-24 | 2021-05-07 | 铜陵蓝盾丰山微电子有限公司 | Silver plating device for lead frame |
-
2022
- 2022-03-03 CN CN202210202255.0A patent/CN114645308A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08167684A (en) * | 1994-12-12 | 1996-06-25 | Dainippon Printing Co Ltd | Device for plating lead frame and its operation control method |
| CN112663123A (en) * | 2020-12-24 | 2021-04-16 | 铜陵蓝盾丰山微电子有限公司 | Sheet type electroplating clamp for lead frame and clamping method thereof |
| CN112760702A (en) * | 2020-12-24 | 2021-05-07 | 铜陵蓝盾丰山微电子有限公司 | Silver plating device for lead frame |
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