CN118023156A - Semiconductor chip detection sorter and method - Google Patents
Semiconductor chip detection sorter and method Download PDFInfo
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- CN118023156A CN118023156A CN202410296351.5A CN202410296351A CN118023156A CN 118023156 A CN118023156 A CN 118023156A CN 202410296351 A CN202410296351 A CN 202410296351A CN 118023156 A CN118023156 A CN 118023156A
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Abstract
The invention relates to the technical field of semiconductor automation, and provides a semiconductor chip detection sorting machine which comprises a cover removing and feeding device, a detection device and an automatic feeding and discharging device, wherein the cover removing and feeding device is used for removing a top cover of a jig to expose semiconductor chips on a frame of the jig, the detection device is used for detecting the semiconductor chips on the frame and tracing batches of the semiconductor chips, and the automatic feeding and discharging device is used for carrying the semiconductor chips on the frame onto a tray. A semiconductor chip detecting and sorting method is provided. The invention can realize full-automatic detection and separation, and has multiple functions and simple structure.
Description
Technical Field
The invention relates to the technical field of semiconductor automation, in particular to a semiconductor chip detection and sorting machine and a method.
Background
Most of the existing semiconductor chip detection and sorting devices are complex, single in function and low in precision, and cannot meet the requirements of full-automatic detection and sorting.
Disclosure of Invention
The invention aims to provide a semiconductor chip detection and sorting machine and a method, which can at least solve part of defects in the prior art.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: a semiconductor chip detection and sorting machine comprises a cover-removing feeding and discharging device, a detection device and an automatic feeding and discharging device,
The cover-removing feeding and discharging device is used for removing the top cover of the jig to expose the semiconductor chip on the frame of the jig,
The detecting device is used for detecting the semiconductor chips on the frame and tracing the batches of the semiconductor chips,
The automatic loading and unloading device is used for carrying the semiconductor chips on the frame onto the tray.
Further, the semiconductor chip loading device further comprises a tray loading device, wherein the tray loading device is used for providing an empty tray for loading the semiconductor chips in the frame.
Further, the device also comprises a top cover recovery assembly, wherein the top cover recovery assembly is used for receiving the top cover detached by the cover detaching feeding and discharging device.
Further, the top cover recycling assembly includes a receiving area for the top cover to be placed and an adjusting assembly for adjusting the size of the receiving area.
Further, a clip device is included for receiving the frame in the empty position.
Further, the clip device comprises a clip frame and a clip conveying mechanism, wherein the clip conveying mechanism is used for replacing a clip on the clip frame.
Further, the cartridge clip device also comprises a feeding component with an advancing force overload prompt.
Further, the device comprises a positioning induction level device, wherein the positioning induction level device is used for receiving a jig filled with the semiconductor chip and judging levelness of the jig.
Further, the automatic feeding and discharging device comprises a vacuum chuck and an adjusting assembly for adjusting the posture of the vacuum chuck.
The embodiment of the invention provides another technical scheme that: a semiconductor chip detection and sorting method comprises the following steps:
The top cover of the jig is taken down by adopting the cover removing and feeding device, the semiconductor chip on the frame of the jig is exposed,
Then the semiconductor chips on the frame of the detection device are used for detecting and tracing the batches of the semiconductor chips,
And then the semiconductor chips on the frame are conveyed to the tray by adopting an automatic feeding and discharging device.
Compared with the prior art, the invention has the beneficial effects that: the full-automatic detection and separation can be realized, and the device has multiple functions and simple structure.
Drawings
Fig. 1 is a schematic diagram of a semiconductor chip detecting and sorting machine according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of a second dual-station cross platform of a semiconductor chip inspection sorter according to an embodiment of the present invention;
Fig. 3 is a schematic diagram of a positioning sensing horizontal device of a semiconductor chip detection and sorting machine according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a track transmission device according to an embodiment of the present invention;
FIG. 5 is a schematic view of a transport mechanism according to an embodiment of the present invention;
Fig. 6 is a schematic diagram of a cover-removing loading and unloading device of a semiconductor chip detection and sorting machine according to an embodiment of the present invention;
Fig. 7 is a schematic diagram of a magnetic cover removing structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a structure for removing a cover by magnetic attraction of a robot according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a first dual-station cross-platform according to an embodiment of the present invention;
Fig. 10 is a schematic diagram of an automatic loading and unloading device of a semiconductor chip detection and sorting machine according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of an up-and-down motion module according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a detection module according to an embodiment of the present invention;
FIG. 13 is a schematic diagram of an adsorption module according to an embodiment of the present invention;
FIG. 14 is a schematic view of a vacuum chuck according to an embodiment of the present invention;
FIG. 15 is a schematic view of a leveling assembly according to an embodiment of the present invention;
fig. 16 is a schematic view of a top cover recovery assembly of a semiconductor chip inspection sorter according to an embodiment of the present invention;
fig. 17 is a schematic diagram of a tray feeding device of a semiconductor chip detection and sorting machine according to an embodiment of the present invention;
fig. 18 is a schematic view of a cartridge clip device of a semiconductor chip inspection and sorting machine according to an embodiment of the present invention;
FIG. 19 is a schematic diagram of a feeding assembly with a propulsion overload notification according to an embodiment of the present invention;
FIG. 20 is a schematic diagram of an auxiliary rail transport system according to an embodiment of the present invention;
Fig. 21 is a schematic diagram of a propulsion overload prompting mechanism according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
referring to fig. 1 to 21, an embodiment of the invention provides a semiconductor chip detection and sorting machine, which specifically includes a tray feeding device, a positioning sensing horizontal device, a cover removing feeding and discharging device, a detection device, an automatic feeding and discharging device, a top cover recycling assembly, a tray recycling device and a cartridge clip device. The empty tray is sent to the tray feeding device for loading the semiconductor chips in the frame (the jig comprises a top cover and a frame, the semiconductor chips are placed in the frame in advance and then covered with the top cover for protection), and the step can be carried out before or after the jig is sent. Before the tool material loading, can be earlier through the judgement of the horizontality of location response horizontal device to it, if not level then need leveling, avoid the later stage to pack into the cartridge clip device and take place the problem. After the jig is sent, the top cover of the jig is taken down through the cover removing and feeding device, and the semiconductor chip on the frame of the jig is exposed. The inspection device then inspects the semiconductor chips on the frame and traces back the lot of the semiconductor chips, finding out the broken semiconductor chips and recording the positions of the semiconductor chips and the lot of the frame. And then the automatic loading and unloading device conveys the semiconductor chips on the frame to the tray. The top cover detached by the detaching feeding and discharging device can be placed in the top cover recycling assembly. And the trays filled with good semiconductor chips and the trays filled with bad semiconductor chips are all sent to a tray recycling device for storage. The frame from which the semiconductor chip is extracted is fed into a magazine for storage. The respective devices in the present separator are described in detail below.
Embodiment two:
Referring to fig. 1 to 21, an embodiment of the present invention provides a semiconductor chip detecting and sorting method, which includes the following steps: the empty tray is sent to the second double-station cross platform shown in fig. 2 by adopting the tray feeding device, the top cover of the jig is taken down by adopting the cover removing and loading device, the semiconductor chips on the frame of the jig are exposed, the semiconductor chips on the frame of the jig are detected and the batches of the semiconductor chips are traced back by adopting the detecting device, the semiconductor chips on the frame are carried to the tray by adopting the automatic feeding and loading device, the top cover is sent to the top cover recovery device, the tray filled with the chips is sent to the tray recovery device, and the empty frame is sent to the cartridge clip device for storage. For specific details, reference is made to the above embodiments and to the following details of the respective devices.
Embodiment III:
referring to fig. 17, an embodiment of the present invention provides a tray feeding device, where the tray feeding device 30 is configured to provide an empty tray for loading semiconductor chips in the frame. The tray feeding device comprises a drawer 300 and a lifting assembly 301, wherein the drawer 300 stores empty trays, the lifting assembly 301 is used for driving the drawer 300 to lift to feed, the height of the taken target tray is always consistent, and the material taking efficiency and precision are improved. The tray feeding device further comprises a tray distributing mechanism 302, wherein the tray distributing mechanism 302 is arranged on the outer side of the drawer and used for separating a target tray to be taken from a tray below the target tray, and the target tray is convenient to grasp. Specifically, the tray distributing mechanism 302 can fix the target tray, then the lifting assembly 301 descends, so that the target tray can be separated from the adjacent trays, and the target tray is removed without being worry about carrying other trays. The tray dividing mechanism 302 is supported outside the drawer 300 by a supporting column 303. The tray distributing mechanism may be provided with two sets of cylinders and push rods to fix the tray on two sides of the drawer 300. The cylinder drives the push rod to extend out of the notch of the tray so as to select the tray. The second double station cross-platform then in turn takes the trays away.
As an optimization scheme of the embodiment of the present invention, referring to fig. 17, the drawer 300 is provided with a limit post 304. In this embodiment, the tray placement position is defined by designing a plurality of limiting posts 304, which can play a foolproof role.
Referring to fig. 2, the tray loading device includes a second dual-station cross platform 307. The specific working principle of the first dual-station cross platform is consistent with that of the fifth embodiment, and the description thereof will be omitted.
Embodiment four:
Referring to fig. 3,4 and 5, an embodiment of the present invention provides a positioning sensing horizontal device, which includes a horizontal leveling base plate 100 on which a jig can be placed, a pressing sensing piece 101 pressed by the jig, and a sensor touched by the pressing sensing piece 101 pressed, wherein the pressing sensing piece 101 is mounted on the horizontal leveling base plate 100, one end of the horizontal leveling base plate 100 is in contact with the jig, the other end of the horizontal leveling base plate 100 is in contact with the sensor, the pressing sensing piece 101 and the sensor are respectively provided with two and one-to-one corresponding arrangements, one end of each pressing sensing piece 101 in contact with the jig is located on the same horizontal plane, and the two sensors are located on the same horizontal plane. In this embodiment, after the jig is mounted on the horizontal leveling base plate 100, the jig presses the pressing sensing member 101, the pressing sensing member 101 touches the sensors, at this time, only two sensors on the same horizontal plane need to be designed, and it is ensured that the two pressing sensing members 101 can act synchronously, so that whether the jig is horizontal can be easily determined. At this time, after receiving the signal, the staff can correspondingly adjust the horizontal leveling base plate 100, so that the horizontal leveling base plate 100 and the jig are horizontal, and after the level is debugged, the later leveling is not needed. The sensor may be a low cost photosensor, which is defined as the first photosensor 102 for differentiation. The first photosensor 102 may be a trench type photosensor. So can realize the level judgement of tool through this simple mechanical structure, also improved judgement efficiency when having saved the device cost, judgement yield is higher.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, the pressing sensing member 101 is sleeved with a return spring 103. In this embodiment, the return spring 103 is designed, and after the jig leaves from the horizontal leveling base plate 100, the pressing sensing member 101 can be reset, so as to be convenient for matching with the subsequent jig.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, the horizontal leveling base plate 100 is provided with a through hole for the pressing sensing element 101 to pass through, and the pressing sensing element 101 is vertically arranged. In this embodiment, the compaction sensing element 101 passes through the horizontal leveling base plate 100 to touch the first photoelectric sensor 102 under the compaction sensing element 101.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, the horizontal leveling base plate 100 is provided with a positioning rod 104 that can be inserted into a positioning hole of a jig. In this embodiment, a positioning rod 104 is designed on the horizontal leveling base plate 100, and can be inserted into a positioning hole of a jig to fix the jig, and the positioning rod 104 can use a positioning pin.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, the apparatus further includes a bracket 105 for supporting the horizontal leveling base plate 100, and the sensor is mounted on the bracket 105. And also includes a lifting structure for lifting the horizontal leveling base plate 100, which is mounted on the bracket 105. In this embodiment, the horizontal leveling base plate 100 is disposed on the bracket 105, and the lifting structure drives the horizontal leveling base plate 100 to lift, so that the positioning rod 104 can be inserted into the positioning hole of the jig. The lifting structure can adopt an air cylinder 106 or other linear driving structures or adopt a screw rod 115 for transmission. The support 105 is provided with slider rails to provide for the guiding of the leveling plate 100.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, the apparatus further includes a first rail assembly 107 for moving the support 105. In the present embodiment, the bracket 105 can be moved along the extending direction of the first rail assembly 107 by designing the first rail assembly 107. Preferably, the first rail assembly 107 includes a first slider 1070 and a first track 1071, wherein the bracket 105 is disposed on the first slider 1070 and the first slider 1070 moves on the first track 1071. The carriage 105 is movable with the rail housing 110 of the track conveyor 11.
An embodiment of the present invention provides a transport mechanism, please refer to fig. 3, 4 and 5, including a track transmission device 11 and the above-mentioned positioning sensing horizontal device 10, wherein the positioning sensing horizontal device 10 is mounted on the track transmission device 11. In this embodiment, the matching track transmission device 11 can transfer the jig to the next station after judging the level.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, 4 and 5, the track transmission device 11 includes a guide rail frame 110 and a transmission belt 111 disposed on the guide rail frame 110, and the horizontal leveling base plate 100 is disposed at the guide rail frame 110. In this embodiment, the rail frame 110 has two rails, which are disposed in parallel and spaced apart, and the jig is abutted to the rail frame by the previous process. The horizontal leveling base plate 100 is arranged between the two track frames, and when the conveying belt 111 on the track frame 110 conveys the jig to the upper side of the horizontal leveling base plate 100, the air cylinder 106 drives the horizontal leveling base plate 100 to lift so that the positioning rod 104 is inserted into the positioning hole of the jig, and the jig is fixed. The pressing sensor 101 is pressed down to touch the first photoelectric sensor 102, so as to determine whether the jig and the horizontal leveling base plate 100 are horizontal. Preferably, the transmission belt 111 comprises a pulley assembly driven to rotate by a first motor 112, and the spline 114 is used to achieve synchronous rotation of the transmission belt 111 on the two guide frames 110.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3,4 and 5, a second photoelectric sensor 117 is provided on the rail frame 110, so as to determine whether the jig is transported in place, and then control the first motor 112 to stop working.
As an optimization scheme of the embodiment of the present invention, referring to fig. 3, 4 and 5, the track transmission device 11 further includes a second rail assembly 116 that drives the rail frame 110 to move. In this embodiment, the second rail assembly 116 is designed to move the rail frame 110, thereby moving the positioning sensing horizon device 10. Preferably, the second guide rail assembly 116 comprises a second motor 113, a screw rod 115, a second sliding block 1160 and a second rail 1161, the second motor 113 drives the screw rod 115 to rotate, the screw rod 115 is driven to drive the guide rail frame 110 to move, the guide rail frame 110 is arranged on the second sliding block 1160, the second sliding block 1160 slides on the second rail 1161, and the second rail 1161 plays a guiding role. The second rail 1161 is disposed parallel to the first rail 1071.
Fifth embodiment:
referring to fig. 6, 7, 8 and 9, an embodiment of the invention provides a cover removing, loading and unloading device, which comprises a magnetic cover removing structure 40, wherein the magnetic cover removing structure 40 comprises a magnet 400 capable of adsorbing a top cover of a jig, a fixed top cover plate 401 capable of propping against the top cover when the magnet 400 is adsorbed, and a pressing component capable of pressing a frame of the jig, and the magnet 400 is driven to lift by a driving component. In the embodiment, the magnetic cover-dismantling structure 40 is adopted to carry out magnetic cover-dismantling, and the magnetic size is utilized for feeding and discharging, so that the structure is simple and easy to realize, the applicability is wide, and the manufacturing cost is low. Specifically, the number of the magnet 400 may be selected as desired to form the magnet 400 assembly, so that a larger sized cap may be adsorbed by increasing the number of the magnet 400, which is less costly than conventional clamps holding caps. The magnet 400 can be installed on the plate body in a sustainable connection mode. When the device is used, the frame is pressed and fixed through the pressing component, then the magnet 400 is adopted to absorb the top cover, at the moment, the top cover is propped against the fixed top cover plate 401, the magnet 400 is driven to ascend through the driving component, the top cover is taken down from the frame, then the magnet is moved to the position of the top cover recovery component 43, the magnet 400 is driven to ascend through the driving component, the suction force of the magnet 400 to the top cover is smaller and smaller, the top cover is propped against the fixed top cover plate 401 until the suction force of the magnet 400 is smaller than the gravity of the top cover, and the top cover falls onto the top cover recovery component 43, so that the discharging of the top cover is completed. Preferably, the pressing assembly adopts a micro cylinder 404, and presses the jig downwards through the micro cylinder 404.
As an optimization scheme of the embodiment of the present invention, referring to fig. 6, 7, 8 and 9, the driving assembly includes a magnet Dan Qigang and a linear bearing 403, the linear bearing 403 is vertically disposed, and the magnet 400 is installed at the driving end of the magnet cylinder 402. In this embodiment, the magnet Dan Qigang is used to drive the magnet 400 to move up and down, and the magnet Dan Qigang is used to drive the plate to move, so that a plurality of magnets 400 can be carried. The linear bearing 403 can improve the stability of lifting.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 6, 7, 8 and 9, the magnet 400 is located at a side of the fixed top cover 401 away from the fixture. In this embodiment, the magnet 400 is spaced from the top cover by a fixed top cover plate 401, facilitating the fixing of the top cover plate 401 against the top cover. The top cover is made of metal, the suction force is applied to the magnet 400 after the magnet 400 approaches the top cover, and the magnet 400 can be ensured to adsorb the top cover through the fixed top cover plate 401 by selecting the thickness of the fixed top cover plate 401. Preferably, the fixed top cover 401 has a hole through which the magnet 400 passes, and the magnet 400 is more close to the top cover by penetrating the magnet 400 into the hole, so that the suction force is larger, but the top cover is still supported by the fixed top cover 401, and the effect of stripping the top cover from the magnet 400 when the magnet 400 is lifted can be still achieved.
As an optimization scheme of the embodiment of the present invention, referring to fig. 6, 7, 8 and 9, the apparatus further includes a material taking and grabbing clamp 41 for clamping the jig, and a robot 42 for driving the material taking and grabbing clamp 41 to move. In this embodiment, the robot 42 drives the material taking and grabbing jig 41 to move to the first double-station cross platform 44, places the jig on the first double-station cross platform 44, and then performs the cap taking operation on the first double-station cross platform 44. The driving direction of the robot 42 includes translation, elevation, rotation, and the like. The material taking and grabbing clamp 41 is driven to lift by a clamping jaw cylinder 410, and clamping jaws realize grabbing.
As an optimization scheme of the embodiment of the present invention, referring to fig. 6, 7, 8 and 9, the present apparatus further includes a top cover recycling assembly 43 for recycling the top cover. In this embodiment, the top cover removed from the jig is placed in the top cover recovery assembly 43. The following embodiments further refine the specific structure of the top cover recovery assembly 43.
As an optimization scheme of the embodiment of the invention, please refer to fig. 6, 7, 8 and 9, the device further comprises a double-station cross platform for receiving the jig, wherein the double-station cross platform is provided with two rest platforms, and the two rest platforms alternately receive materials. In the embodiment, the double-station cross platform is adopted for operation, so that the working efficiency can be improved. We define the dual-station cross-platform as a first dual-station cross-platform 44 for the transport of the jig, as distinguished from another second dual-station cross-platform for the transport of the pallet. The dual-station cross-platform includes an a-lay-up platform 440 and a B-lay-up platform 441, wherein when the a-lay-up platform 440 receives a material, such as a jig or pallet, the material is sent to the B-lay-up platform 441 for operation, and the B-lay-up platform 441 returns to the a-lay-up platform 440 for receiving the material. Thus, alternating circulation operation can be formed, so that the operation efficiency is higher. The double-station cross platform further comprises a conveying belt and a lifting assembly, wherein the conveying belt is used for conveying the shelving platforms, the lifting assembly lifts or lowers the two shelving platforms, and the two shelving platforms are staggered in space to realize alternate operation of the two shelving platforms. Preferably, the placing platform can adopt a vacuum platform, and the fixture is adsorbed and fixed through vacuum.
As an optimization scheme of the embodiment of the invention, the shelving platform is provided with locating points. In the embodiment, the positioning points are designed on the shelving platform, so that the positioning points can be positioned with pins on the jig, and the situation that the positioning of the jig is inaccurate is avoided.
The embodiment of the invention provides a cover removing, loading and unloading method, please refer to fig. 6,7, 8 and 9, which is used for the cover removing, loading and unloading device 4, and comprises the following steps: s1, the frame is pressed and fixed by adopting the pressing assembly; s2, absorbing the top cover by adopting the magnet 400, wherein the top cover is propped against the fixed top cover plate 401; s3, driving the magnet 400 to ascend through the driving assembly, and removing the top cover from the frame; s4, moving the magnetic attraction and detachment cover structure 40 to the top cover recovery assembly 43, driving the magnet 400 to ascend again through the driving assembly, and enabling the top cover to be propped against the fixed top cover plate 401 until the top cover falls onto the top cover recovery assembly 43 when the attraction force of the magnet 400 is smaller than the gravity force of the top cover, so that the top cover blanking is completed. In the embodiment, the magnetic cover-dismantling structure 40 is adopted to carry out magnetic cover-dismantling, and the magnetic size is utilized for feeding and discharging, so that the structure is simple and easy to realize, the applicability is wide, and the manufacturing cost is low.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 6, 7, 8 and 9, the magnetic cover removing structure 40 is combined with the positioning sensing horizontal device 10, the robot 42, the material taking and grabbing clamp 41, the top cover recycling assembly 43, the first duplex cross platform 44 and the third photoelectric sensor 45. After the positioning and sensing horizontal device 10 receives the jig, the levelness of the jig is judged, after the jig is ensured to be horizontal, the robot 42 can control the material taking and grabbing clamp 41 to the positioning and sensing horizontal device 10 to grab the jig, in the process again, the position of the jig is sensed by combining the third photoelectric sensor 45, accurate material taking is achieved, then the jig is placed on the first double-station cross platform 44, and then the cover removing operation is carried out by the magnetic cover removing structure 40, and the top cover is sent to the top cover recycling assembly 43.
Example six:
Referring to fig. 10, 11, 12, 13, 14 and 15, an embodiment of the present invention provides an automatic feeding and discharging device, which includes an adsorption module 4 for grabbing materials and an up-and-down movement module 3 for driving the adsorption module 4 to move up and down, wherein the adsorption module 4 has a pneumatic material shaking mechanism 13 and a vacuum chuck 14 for sucking the materials, the vacuum chuck 14 is disposed at an end of the pneumatic material shaking mechanism 13, the up-and-down movement module 3 has a sliding table cylinder 6, and the sliding table cylinder 6 drives the adsorption module 4 to move up and down. In this embodiment, the material is gripped by the suction module 4, and the gripping manner may be a vacuum suction manner, for example, a vacuum chuck 14 is used to adsorb the material, and then the up-and-down movement module 3 is used to drive the suction module 4 to move up and down to complete gripping of the material. When the materials are found to be sticky, for example, two products are stacked together, at the moment, a pneumatic shaking mechanism can be adopted to rapidly shake the products at high frequency, so that the products are separated, and further, the products are matched with the up-down high-frequency expansion of the sliding table cylinder 6, so that a better stripping effect can be achieved. The pneumatic shaking mechanism, i.e. the pneumatic vibrator, is of prior art and its specific working principle will not be described in detail here. Of course, besides the pneumatic shaking mechanism, a small sliding table cylinder 6 can be used for mounting the vacuum chuck 14, shaking of a plurality of positions can be realized, and the stripping effect is improved.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the adsorption module 4 further includes a width adjusting structure 11 for adjusting a range of gripping materials, and the width adjusting structure 11 is connected with the sliding table cylinder 6. In this embodiment, the width adjusting structure 11 is designed, so that the automatic feeding and discharging device is suitable for grabbing materials with any size and model, for example, when the breadth of a product is relatively large or relatively small, the width adjusting structure 11 can be used for adjusting the range of grabbing materials. Preferably, the width adjusting structure 11 includes at least two adjusting plates and an adsorption rod arranged on the adjusting plates, and a plurality of pneumatic shaking mechanisms 13 are arranged on the adsorption rod, so that the width adjusting structure 11 is thinned and provided with the translatable adjusting plates, and when the adjusting plates are moved, the adsorption rods on the width adjusting structure can also move along with the translating plates, thereby adjusting the distance between the adjacent adsorption rods, and realizing width adjustment. Preferably, the pneumatic shaking mechanisms are detachably arranged on the adsorption rods, so that the number of the pneumatic shaking mechanisms can be designed according to the needs. Preferably, the pneumatic shaking mechanism is movably arranged on the adsorption rod, so that the position of the pneumatic shaking mechanism can be adjusted according to the requirement. Here can adopt L type connecting rod and lock nut to cooperate and realize pneumatic shake mechanism and adsorbing the connection of pole, have the screw hole on the vertical pole of L type connecting rod, lock nut passes through the screw hole and fixes vertical pole on adsorbing the pole, and the horizontal pole of L type connecting rod has the installation position, and pneumatic shake mechanism installation of air.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the adsorption module 4 further includes a negative pressure mechanism, and the negative pressure mechanism is provided with a negative pressure meter 12. In this embodiment, the suction module 4 may use a negative pressure mechanism to provide vacuum suction force, and use an air pipe to communicate with the vacuum chuck 14. The negative pressure gauge 12 can perform pressure regulation display.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the up-down movement module 3 further includes an electromagnetic valve 7 for controlling the movement of the sliding table cylinder 6. In the present embodiment, the solenoid valve 7 may be employed to control the telescopic action of the slide table cylinder 6.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the apparatus further includes a detection module 2 for detecting the adsorption state of the adsorption module 4. In the present embodiment, the adsorption state of the adsorption module 4 can be detected by the detection module 2. Preferably, the detection module 2 includes an ultrasonic sensor 8 and a color sensor 10. The detection module 2 further comprises a horizontal sliding cylinder 9 for driving the ultrasonic sensor 8 to move. The ultrasonic sensor 8 and the color sensor 10 are plural. Specifically, when the slide cylinder 6 descends, the vacuum chuck 14 adsorbs the product, the slide cylinder 6 ascends, and the color sensor works to confirm whether the adsorbed product is a product or a separator. If the adsorption product is a paper separating, the paper separating is placed in the paper separating bin, if the adsorption product is a product, the horizontal sliding table cylinder 6 extends out, the ultrasonic sensor 8 works, and whether the product is sticky or not is detected, wherein the ultrasonic sensor 8 and the color sensor 10 are all existing sensors, and the description is not made here. When the product is found to be sticky, the pneumatic shaking mechanism is used for high-frequency on-off and shaking up and down with the sliding table cylinder 6, the sticky product is peeled off, then the product is placed, and if the product is not sticky, the product is placed directly.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the apparatus further includes a horizontal transfer belt module 1 for driving the up-down motion module 3 to move horizontally. In this embodiment, the horizontal transfer belt module 1 includes a linear guide 5 for conveying the up-and-down movement module 3 to the position where the material is located. Then after grabbing the materials, the materials are sent to positions of a paper separating bin, a cartridge clip device and the like through the linear guide rail 5, so that full-automatic feeding and discharging are realized.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, the vacuum chuck 14 includes a suction head 15 and a suction nozzle 16, the suction head 15 is detachably connected with the suction nozzle 16, and the suction head 15 is also detachably connected with a driving part thereof. In this embodiment, the model of the vacuum chuck 14 can be quickly changed by means of a detachable connection. Preferably, the suction head 15 has a buffer structure. The adoption of the buffer structure can prevent the pressing-down misoperation from crushing the suction nozzle 16. The cushioning structure may be a spring.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 10, 11, 12, 13, 14 and 15, and further include an adjusting component for adjusting the posture of the vacuum chuck 14. The vacuum chuck 14 is required to be moved frequently to carry the material, so that a problem of incorrect posture may occur, which may result in low material taking accuracy. Therefore, the posture of the vacuum chuck 14 is adjusted by adopting the adjusting component, so that the working surface is horizontal, and the direction of the suction nozzle and the levelness of the suction nozzle are ensured to meet the requirements. Preferably, the adjusting assembly comprises a leveling jig 17 and a vision system 18, and the leveling jig 17 is arranged beside the vision system 18. The suction nozzles are moved onto the leveling jig 17 until the suction nozzle plane is in contact with the jig plane, then gaps between the suction nozzles and the jig in all directions are detected by using the feelers until the feelers in each direction of each suction nozzle are not plugged in, and a vision system 18 can be adopted for real-time observation. Preferably, the leveling fixture 17 is a cube.
Embodiment seven:
Referring to fig. 16, an embodiment of the present invention provides a top cover recycling assembly 43, which includes a receiving area 430 for placing a top cover, and an adjusting assembly for adjusting the size of the receiving area 430. In this embodiment, when the sizes of the top covers are different, the size of the receiving area 430 can be adjusted by the adjusting assembly, so as to match the size of the top cover, and achieve stable storage of the top cover. Preferably, the receiving area 430 is formed on the base plate 433. The adjusting assembly comprises a plurality of adjusting rods 431, each adjusting rod 431 is perpendicular to the bottom plate 433, guide grooves 432 corresponding to the adjusting rods 431 one by one are arranged on the bottom plate 433, the adjusting rods 431 can slide in the guide grooves 432, the extending directions of the guide grooves 432 face the same place, and the adjusting rods 431 enclose the receiving area 430. Since each guide groove 432 is directed to one place, as shown in fig. 16, there are four guide grooves 432 and four adjusting rods 431, each adjusting rod 431 slides in its corresponding guide groove 432, and when sliding to the center of the four guide grooves 432, the receiving area 430 becomes small, and a smaller top cover can be received, so that the size of the receiving area 430 can be adjusted as needed.
Example eight:
Referring to fig. 17, an embodiment of the present invention provides a tray recycling device for storing trays filled with semiconductor chips. The structure of the tray feeding device is identical to that of the second embodiment, and will not be described again here. This sorter can design a plurality of tray feed mechanisms and a plurality of tray feed mechanisms, and the cooperation is used, promotes the efficiency of unloading.
Example nine:
Referring to fig. 18, 19, 20 and 21, an embodiment of the present invention provides a clip device, which includes a clip frame 50 and a clip transporting mechanism for replacing a clip on the clip frame. In this embodiment, the spring clip 50 is used to store the empty frame from which the semiconductor chip is removed for recycling. The clips 51 are placed on clip holders 50, each clip holder 50 can hold a plurality of clips 51, the positions of clips 51 can be replaced by a clip conveying mechanism, as shown in fig. 18, two clips 51 are shown, when an upper clip 50 is selected as a clip to be used first, when the clip 51 is full, a gripper 52 moves to grasp the clip and then moves away, the clip below is lifted to a receiving position, the gripper 52 can grasp the clip to wait, the clip 51 can be released after being lowered, and the clip is conveyed to the position below the working clip by a driving rail. The overall action flow may be a return font.
As an optimization scheme of the embodiment of the invention, referring to fig. 19, 20 and 21, the clip device further includes a feeding component with an overload prompt for pushing force. The device comprises an auxiliary track transmission system 20 and a propulsion force overload prompting mechanism 30, wherein the auxiliary track transmission system 20 is provided with a conveying assembly which can be connected with the previous working procedure, the propulsion force overload prompting mechanism 30 comprises a pushing assembly for pushing materials on the conveying assembly and a groove-shaped photoelectric sensor 34 for outputting signals when the pushing assembly has pushing resistance, and the groove-shaped photoelectric sensor 34 is arranged on the pushing assembly. In this embodiment, the overload of the pushing force is prompted by the trough-type photoelectric sensor 34 which can output signals when the pushing component pushes to meet the resistance, so that the failure of automatic feeding and the damage of materials and feeding positions are avoided. Specifically, the auxiliary rail conveying system 20 can be connected with the previous working procedure, and after the jig is placed on the conveying component, the jig is pushed to advance into the magazine by the pushing component. When the jig is level or consistent with the magazine entrance, the jig can advance the magazine smoothly. When the jig and magazine entrance are not horizontal or are otherwise, the pushing assembly has resistance, the state change reacts through the groove type photoelectric sensor 34 to output signals, the signal feedback prompts the pushing assembly to not apply pushing force any more, the equipment alarms and stops, otherwise, if the pushing force is forced, the jig is jacked or the magazine 50 is damaged due to overlarge pushing force, the magazine or the auxiliary rail transmission system 20 needs to be adjusted by manually adjusting the level and the inclination angle of the magazine or the auxiliary rail transmission system 20 so as to be horizontal with the jig, and after the level is adjusted, the leveling is not needed.
As an optimization scheme of the embodiment of the present invention, referring to fig. 19, 20 and 21, the pushing assembly includes a linear module 31, a pushing plate 38 capable of contacting with a material, and a cylinder 32 driving the pushing plate 38, where the cylinder 32 is disposed on the linear module 31. The pushing assembly further comprises a first sliding block guide rail 33 on which the pushing plate 38 can slide, the groove type photoelectric sensor 34 is arranged at the first sliding block guide rail 33, and a spring 35 which can prop against the pushing plate 38 is further arranged at the first sliding block guide rail 33. The spring 35 is mounted at the first slider rail 33 by a fixing plate 36. The pushing assembly further comprises a light barrier 37 which can be pushed into the recess of the trough-type photosensor 34 by a sliding push plate 38. In the present embodiment, the above-described pushing assembly is refined, which includes the linear module 31, the push plate 38, the air cylinder 32, the first slider rail 33, the spring 35, the fixing plate 36, and the light blocking plate 37. Normally, the push plate 38 is free from resistance when moving forward to push the jig towards the magazine, so that the jig can be pushed into the magazine smoothly. When the tool is abnormal, namely the tool is not horizontal with the magazine entrance or is blocked, the push plate 38 generates resistance when being pushed, the spring 35 is extruded at the moment and drives the light barrier 37 to enter the groove of the groove type photoelectric sensor 34, the receiver can not receive the light of the emitter, the groove type photoelectric sensor 34 can output a signal to prompt the overload of the pushing force, at the moment, the driving of the air cylinder 32 is disconnected, the push plate 38 is not driven to continue to advance, and the protection function is further realized.
As an optimization scheme of the embodiment of the present invention, referring to fig. 19, 20 and 21, the auxiliary rail conveying system 20 further includes a photoelectric sensor 24 for sensing materials. In this embodiment, the photoelectric sensor is used to sense whether a material enters the auxiliary rail conveying system 20, and when the material is sensed, the output signal can control the propulsion force overload prompting mechanism 30 to start to act, so that the jig is operated on the conveying assembly through the push plate 38.
As an optimization scheme of the embodiment of the present invention, referring to fig. 19, 20 and 21, the conveying assembly includes two parallel rails spaced apart, each rail has a supporting block capable of carrying a material, the supporting blocks are slidably disposed on the rails through rollers 21, and the propulsion overload prompting mechanism 30 is disposed between the two rails. In this embodiment, the conveying assembly may be composed of two parallel rails, on which there are supporting blocks slidably disposed through rollers 21, each supporting block being capable of supporting a material in cooperation.
Further optimizing the above, referring to fig. 19, 20 and 21, the conveying assembly further includes a bracket for supporting the rail. The conveyor assembly further includes a second slider rail 22 on which one of the brackets slides, the other bracket being secured to the base plate. The slidable support is fixed to the base plate by a fixing member 23. In this embodiment, the rail is supported by the support frame, so that the rail can be matched with the propulsion force overload prompting mechanism 30. Through the second slider guide rail 22 of design, can adjust the position of support, we can both adjust two supports, also can only adjust one of them support, and another one is fixed can, so can adjust the interval between two supports according to the size of material. After the adjustment, the slidable support can be fixed by the fixing piece 23, so that the stability of the operation is ensured.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A semiconductor chip detects sorter which characterized in that: comprises a cover-removing feeding and discharging device, a detecting device and an automatic feeding and discharging device,
The cover-removing feeding and discharging device is used for removing the top cover of the jig to expose the semiconductor chip on the frame of the jig,
The detecting device is used for detecting the semiconductor chips on the frame and tracing the batches of the semiconductor chips,
The automatic loading and unloading device is used for carrying the semiconductor chips on the frame onto the tray.
2. The semiconductor chip inspection sorter of claim 1 wherein: the tray feeding device is used for providing an empty tray for loading the semiconductor chips in the frame.
3. The semiconductor chip inspection sorter of claim 1 wherein: the device also comprises a top cover recovery assembly, wherein the top cover recovery assembly is used for receiving the top cover detached by the cover detaching feeding and discharging device.
4. A semiconductor chip inspection sorter as in claim 3 wherein: the top cover recycling assembly includes a receiving area for placement of a top cover and an adjustment assembly for adjusting the size of the receiving area.
5. The semiconductor chip inspection sorter of claim 1 wherein: a clip device is also included for receiving the frame in the empty position.
6. The semiconductor chip inspection sorter of claim 5 wherein: the clip device comprises a clip frame and a clip conveying mechanism, wherein the clip conveying mechanism is used for replacing a clip on the clip frame.
7. The semiconductor chip inspection sorter of claim 5 wherein: the cartridge clip device further comprises a feeding component with a propulsion force overload prompt function.
8. The semiconductor chip inspection sorter of claim 1 wherein: the positioning induction horizontal device is used for receiving a jig filled with the semiconductor chip and judging levelness of the jig.
9. The semiconductor chip inspection sorter of claim 1 wherein: the automatic feeding and discharging device comprises a vacuum chuck and an adjusting assembly for adjusting the posture of the vacuum chuck.
10. The semiconductor chip detection and sorting method is characterized by comprising the following steps:
The top cover of the jig is taken down by adopting the cover removing and feeding device, the semiconductor chip on the frame of the jig is exposed,
Then the semiconductor chips on the frame of the detection device are used for detecting and tracing the batches of the semiconductor chips,
And then the semiconductor chips on the frame are conveyed to the tray by adopting an automatic feeding and discharging device.
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