CN118019807A - 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置 - Google Patents

树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置 Download PDF

Info

Publication number
CN118019807A
CN118019807A CN202280064918.5A CN202280064918A CN118019807A CN 118019807 A CN118019807 A CN 118019807A CN 202280064918 A CN202280064918 A CN 202280064918A CN 118019807 A CN118019807 A CN 118019807A
Authority
CN
China
Prior art keywords
group
resin composition
mass
formula
thermoplastic elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280064918.5A
Other languages
English (en)
Chinese (zh)
Inventor
镰田悠仁
山本克哉
长谷部惠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of CN118019807A publication Critical patent/CN118019807A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • C08L71/126Polyphenylene oxides modified by chemical after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
CN202280064918.5A 2021-09-27 2022-09-13 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置 Pending CN118019807A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-157025 2021-09-27
JP2021157025 2021-09-27
PCT/JP2022/034258 WO2023048024A1 (ja) 2021-09-27 2022-09-13 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

Publications (1)

Publication Number Publication Date
CN118019807A true CN118019807A (zh) 2024-05-10

Family

ID=85720640

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280064918.5A Pending CN118019807A (zh) 2021-09-27 2022-09-13 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置

Country Status (5)

Country Link
JP (1) JPWO2023048024A1 (https=)
KR (1) KR20240065287A (https=)
CN (1) CN118019807A (https=)
TW (1) TW202330788A (https=)
WO (1) WO2023048024A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0790173A (ja) * 1993-09-21 1995-04-04 Mitsubishi Gas Chem Co Inc 樹脂組成物
JPH1180535A (ja) * 1997-09-04 1999-03-26 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
JP2000143891A (ja) * 1998-09-09 2000-05-26 Asahi Chem Ind Co Ltd 熱可塑性樹脂組成物
DK3133121T3 (en) * 2014-04-16 2018-07-30 Asahi Chemical Ind THERMOPLASTIC ELASTOMER COMPOSITION, PROP FOR MEDICAL CONTAINER AND MEDICAL CONTAINER
WO2019230945A1 (ja) 2018-06-01 2019-12-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
TWI882987B (zh) 2019-02-28 2025-05-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂複合片、及印刷配線板

Also Published As

Publication number Publication date
JPWO2023048024A1 (https=) 2023-03-30
WO2023048024A1 (ja) 2023-03-30
KR20240065287A (ko) 2024-05-14
TW202330788A (zh) 2023-08-01

Similar Documents

Publication Publication Date Title
KR102634507B1 (ko) 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판
JP7380943B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN118019802A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
CN118019803A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
CN115151582A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂片和印刷电路板
WO2023171554A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2023171553A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN118019807A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
JP7380944B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
JP7616497B1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板および半導体装置
CN121794327A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794314A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794312A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121843978A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794328A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794326A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794315A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination