CN117998834A - Plane coordinate thermal compensation method and system based on fixed mark points and storage medium - Google Patents
Plane coordinate thermal compensation method and system based on fixed mark points and storage medium Download PDFInfo
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Abstract
The invention relates to the technical field of mounting error compensation, and particularly discloses a plane coordinate thermal compensation method and system based on fixed mark points and a storage medium, wherein the method comprises the following steps: determining 3 marking points distributed in a triangle on a thermal compensation plane, determining coordinates of the marking points as a base reference coordinate point and determining coordinates of points to be compensated; re-determining the current coordinates of the mark points at intervals of preset fixed time; respectively calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under a coordinate system according to the datum reference coordinate point and the current coordinate; and calculating offset of the point to be compensated in the X and Y directions respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated. The scheme can compensate plane coordinates on the mounting plane in real time, thereby achieving the purpose of ensuring in-place precision, overcoming the problem of in-place precision deterioration caused by temperature change, improving the mounting precision and having simple method.
Description
Technical Field
The invention relates to the technical field of mounting error compensation, in particular to a plane coordinate thermal compensation method and system based on fixed mark points and a storage medium.
Background
After the surface mounting machine warms up, correct through the key part to the surface mounting machine, like the patent of the invention of application number 202211681882.3, and then guarantee the accurate degree in position at actual machine operation in-process. However, as the conditions of the operating environment, particularly the temperature, change, the machine parts expand or contract due to heat, and further the in-place accuracy of the mounting head moving to the designated position is deteriorated or even lost. Therefore, after the chip mounter is calibrated, the in-place accuracy of the operation of the chip mounter can be ensured at a certain environmental temperature, and the in-place accuracy of the mounting head is lost under the condition of too low temperature or too high temperature.
In order to solve the problem of mounting errors caused by temperature change, the prior art adopts a dynamic error compensation method to establish a mathematical relationship between two variables of temperature change and movement distance and a coordinate error correction value, and can dynamically compensate the movement coordinate by acquiring the value of a temperature sensor in real time, but the method needs to additionally add the temperature sensor and measure the temperature in real time, if mathematical modeling is carried out, measurement errors are introduced in actual conditions, and engineering significance is very limited. Therefore, there is a lack of a method for solving the problem of mounting errors caused by poor in-place accuracy due to temperature changes.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a plane coordinate thermal compensation method, a system and a storage medium based on fixed mark points.
In order to achieve the above object, a first aspect of the present invention provides a planar coordinate thermal compensation method based on a fixed mark point, comprising the steps of:
Determining 3 marking points distributed in a triangle on a thermal compensation plane, determining coordinates of the marking points as a base reference coordinate point and determining coordinates of points to be compensated;
Along with the temperature change of the thermal compensation plane, the current coordinates of the marking points are redetermined at intervals of preset fixed time;
Respectively calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under a coordinate system according to the datum reference coordinate point and the current coordinate;
And calculating offset of the point to be compensated in the X and Y directions respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated.
Preferably, 3 marking points are distributed and arranged at the peripheral position of the point area to be compensated on the thermal compensation plane.
Preferably, the expansion ratio formula in the X direction is as follows: ，
the expansion ratio formula in the Y direction is as follows: ；
Wherein, And/>Current coordinates of 3 mark points,/>, respectivelyAnd respectively corresponding to the current coordinates of the 3 marking points.
Preferably, the offset in the X direction is calculated as follows:，
The offset in the Y-axis direction is calculated as follows: ；
wherein, (X p,Yp) is the mounting point coordinate, deltaX is the offset in the X-axis direction, deltaY is the offset in the Y-axis direction.
Preferably, the 3 marking points are distributed in a right triangle, and are distributed at 3 corner positions of the thermal compensation plane, and the X axis and the Y axis of the coordinate system are respectively parallel to two adjacent right-angle sides of the right triangle.
Preferably, the offset is compensated to the point to be compensated for having coordinates (X p+ΔX,Yp + deltay).
Preferably, a camera is used to obtain a thermal compensation plane image, and coordinates of a mark point or a point to be compensated are calculated based on the image, wherein the calculation formula is as follows:
Wherein, Theoretical mechanical coordinates of marked points or points to be compensated,/>Is the deviation of the mounting angle of the camera,For the pixel deviation of the marked point or the point to be compensated from the center of the image,/>For the camera X-direction pixel scale,/>Is the camera Y-direction pixel scale.
A second aspect of the present invention provides a planar coordinate thermal compensation system based on fixed marker points, comprising:
The coordinate recognition module is used for determining 3 marking points distributed in a triangle shape on the thermal compensation plane, determining the coordinates of the marking points as a base reference coordinate point and determining the coordinates of the points to be compensated; the current coordinates of the marking points are redetermined every preset fixed time along with the temperature change of the thermal compensation plane;
The calculation module is used for calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under the coordinate system according to the datum reference coordinate point and the current coordinate respectively;
And the compensation module is used for calculating the offset of the point to be compensated in the X direction and the Y direction respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated.
The third aspect of the present invention provides a surface thermal compensation system for mounting a chip mounter, comprising:
The motion control module is used for driving the image acquisition module to move to a specified coordinate position in a plane coordinate system of the chip mounter;
the image acquisition module is used for identifying and acquiring mounting plane images containing marking points and mounting points at intervals of preset fixed time;
The compensation module is used for calculating the offset of the mounting point by adopting the method as set forth in any one of claims 1-7 through the image acquired by the image acquisition module, and feeding back the offset to the motion control module to drive the mounting head to compensate the offset to the coordinates of the mounting point.
A fourth aspect of the present invention provides a computer readable storage medium having stored thereon a program executable by a processor to perform the steps of the above method.
According to the technical scheme, in the running process of the machine, the camera on the mounting head is used for shooting the fixed mark points on the mounting plane according to a certain time interval, the coordinate drifting condition is identified according to the mark points, and the plane coordinates on the mounting plane are compensated in real time, so that the purpose of ensuring in-place precision is achieved, the problem of in-place precision deterioration caused by temperature change is solved, the mounting precision is improved, and the method is simple.
Drawings
FIG. 1 is a schematic diagram of a planar coordinate thermal compensation flow based on fixed marker points according to the present invention;
fig. 2 is a schematic diagram of a placement plane marking point setting according to an embodiment of the present invention.
Detailed Description
In order to further explain the features of the invention, the following describes the technical scheme of the invention in more detail through specific embodiments. The invention can be practiced otherwise than as specifically described, and similar modifications can be made by those skilled in the art without departing from the spirit of the invention, so that the invention is not limited to the specific embodiments disclosed below.
The first aspect of the present invention provides a planar coordinate thermal compensation method based on fixed mark points, as shown in fig. 1, comprising the following steps:
S1, determining 3 marking points distributed in a triangle on a thermal compensation plane, determining coordinates of the marking points as a base reference coordinate point and determining coordinates of points to be compensated;
The embodiment of the invention takes the mounting plane of the chip mounter as an example, but it is worth explaining that the plane coordinate thermal compensation method of the invention is applicable to the correction and compensation production scenes of all planes due to temperature change, and is not limited to the mounting plane of the chip mounter. In the mounting process of the chip mounter, a mark recognition camera on a mounting head is adopted to recognize and collect images, the mounting head is driven to move to a theoretical mechanical coordinate with a fixed mark point, the mark recognition camera is used for shooting the mark point images, and pixel deviation of the center of the mark point from the center of the image is recognized. The 3 mark points may be distributed in an arbitrary triangle and disposed at the peripheral position of the area of the point to be compensated on the thermal compensation plane, and specifically, the area formed by the 3 mark points along the XY direction of the coordinate system may cover the area of the point to be compensated on the plane. The marking points are preferably arranged in a right triangle distribution, and further preferably, the right-angle sides of the triangle are respectively parallel to the XY axis of the coordinate system. Taking the distribution mode as shown in fig. 2 as an example, the mechanical coordinate identification and determination method of the marking point or the mounting point (namely the point to be compensated) takes the upper left corner marking point as shown in fig. 2 as an example, and the pixel deviation of the center of the identified marking point from the center of the image is recorded as The camera X-direction pixel scale is noted/>The camera Y-direction pixel scale is noted/>. The upper left corner mark point is taken as a base reference coordinate point/>The calculation formula of (2) is as follows:
Wherein, For the upper left corner mark point theoretical mechanical coordinates,/>Is a mark identifying camera mounting angle deviation. The coordinate recognition method of other mark points and mounting points is the same.
S2, along with the temperature change of the thermal compensation plane, the current coordinates of the marking point are redetermined every preset fixed time.
S3, respectively calculating the expansion ratio of the thermal compensation plane in the X direction and the Y direction under a coordinate system according to the datum reference coordinate point and the current coordinate;
the expansion ratio formula in the X direction is as follows: ，
the expansion ratio formula in the Y direction is as follows: ；
Wherein, And/>Current coordinates of 3 mark points,/>, respectivelyAnd respectively corresponding to the current coordinates of the 3 marking points.
S4, calculating offset of the point to be compensated in the X direction and the Y direction respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated;
The offset in the X direction is calculated as follows: ，
The offset in the Y-axis direction is calculated as follows: ；
wherein, (X p,Yp) is the mounting point coordinate, deltaX is the offset in the X-axis direction, deltaY is the offset in the Y-axis direction.
The fixed mark points are arranged on the surface mount machine table, and the height is set so that a camera on the surface mount head can clearly shoot. Practical tests have found that heating the fixed marker point alone does not cause a shift in its identification position. However, after the whole machine runs for a period of time or is cooled for a period of time, the marking point is identified, the position of the marking point is found to generate offset, and after the environmental temperature is controlled, the coordinate of the identified marking point can be recovered. In addition, after the machine is electrified, the temperature of the camera for identifying the mounting head mark is quickly increased, the subsequent process is stable, and in actual production, the thermal expansion of the camera is negligible.
In one embodiment of the invention, the compensation flow of the surface mount machine mounting plane by adopting the plane coordinate thermal compensation method based on the fixed mark points is as follows:
step 1: firstly, carrying out structural preparation, as shown in fig. 2, fixing a marking point at the left upper corner, the right upper corner and the right lower corner of a chip mounter machine table, and ensuring that a marking recognition camera is focused clearly in height. The connecting line of the right upper corner marking point and the right lower corner marking point is parallel to the X axis of the machine, and the connecting line of the left upper corner marking point and the right upper corner marking point is parallel to the Y axis of the machine.
Step 2: after the chip mounter is electrified, the chip mounter is warmed up for about half an hour.
Step 3: driving the mounting head to move, shooting images of 3 mark points by using a mark recognition camera, calculating coordinates of each mark point on a machine plane, taking the 3 coordinate points as datum reference coordinate points, and marking as(Upper left corner mark coordinates),/>(Right lower corner mark coordinates),/>(Upper right corner marks coordinates).
Step 4: in actual production, the mounting head is driven to move at fixed intervals (a round of photographing can be performed every 10 minutes), and images of 3 mark points are photographed by using the mark recognition camera. Calculating the coordinates of each marking point on the machine plane, and respectively marking as(Upper left corner mark coordinates),/>(Right lower corner mark coordinates),(Upper right corner marks coordinates).
Step 5: calculating the expansion ratio between the marking points of the upper left corner and the upper right cornerCalculating the expansion ratio/>, between the right lower corner and the right upper corner mark point。
Step 6: calculating X-direction offset of mounting point position P according to the expansion ratio
Y-direction offset of mounting point P。
Step 7: theoretical sitting mark of mounting point P on machine table plane is as followsThe coordinates after the compensation of the mounting point position P are/>。
Based on the same inventive concept, a second aspect of the embodiment of the present invention provides a plane coordinate thermal compensation system based on a fixed mark point, comprising:
The coordinate recognition module is used for determining 3 marking points distributed in a triangle shape on the thermal compensation plane, determining the coordinates of the marking points as a base reference coordinate point and determining the coordinates of the points to be compensated; the current coordinates of the marking points are redetermined every preset fixed time along with the temperature change of the thermal compensation plane;
The calculation module is used for calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under the coordinate system according to the datum reference coordinate point and the current coordinate respectively;
And the compensation module is used for calculating the offset of the point to be compensated in the X direction and the Y direction respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated.
A third aspect of the embodiment of the present invention provides a mounting plane thermal compensation system of a chip mounter, including:
The motion control module is used for driving the image acquisition module to move to a specified coordinate position in a plane coordinate system of the chip mounter;
the image acquisition module is used for identifying and acquiring mounting plane images containing marking points and mounting points at intervals of preset fixed time;
And the compensation module is used for calculating the offset of the mounting point by adopting a plane coordinate thermal compensation method based on the fixed mark point through the image acquired by the image acquisition module, and feeding back the offset to the motion control module to drive the mounting head to compensate the offset to the coordinate of the mounting point.
A fourth aspect of the embodiments of the present invention provides a computer-readable storage medium having stored thereon a program executable by a processor to implement the steps of a fixed marker point based planar coordinate thermal compensation method.
Test example:
After the calibration of each parameter of the surface mounting machine is finished, the surface mounting precision data is directly tested, the number of sample points is 600, the initial calibration test result in the table 1 is obtained, when the room temperature is changed, the surface mounting precision test without adopting a thermal compensation scheme is respectively carried out at the same temperature, the non-heating compensation test result in the table 1 is obtained, and the surface mounting precision test with adopting the thermal compensation method of the application is used for obtaining the thermal compensation test result in the table 1, and the number of sample points is 600. The individual test data are shown in table 1:
TABLE 1 mounting accuracy test results
CP: process precision (Capability of Precision), the ability of the characterization process to meet specification tolerances, i.e., reflect the degree of dispersion; the larger the Cp value, the smaller the characterization process variation and the stronger the process capability. CPK: process capability index (Complex Process Capability index): indicating the extent to which the process capability meets technical criteria (e.g., specifications, tolerances). Chip mounter manufacturers often describe the accuracy of machine mounting, with greater Cpk and greater process capability.
From the above results, the mounting accuracy is obviously higher than the mounting test accuracy without thermal compensation after thermal compensation, and is close to the test result after primary calibration, which indicates that the mounting accuracy is obviously recovered after thermal compensation.
In summary, in the running process of the machine, the camera on the mounting head is used for shooting the fixed mark points on the mounting plane according to a certain time interval, and the plane coordinates on the mounting plane are compensated in real time according to the condition of identifying coordinate drifting of the mark points, so that the purpose of ensuring in-place precision is achieved, the problem of poor in-place precision caused by temperature change is solved, the mounting precision is improved, and the method is simple.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, a number of simple variants of the technical solution of the invention are possible, including the combination of the individual specific technical features in any suitable way. The various possible combinations of the invention are not described in detail in order to avoid unnecessary repetition. Such simple variations and combinations are likewise to be regarded as being within the scope of the present disclosure.
Claims (10)
1. The plane coordinate thermal compensation method based on the fixed mark points is characterized by comprising the following steps of:
Determining 3 marking points distributed in a triangle on a thermal compensation plane, determining coordinates of the marking points as a base reference coordinate point and determining coordinates of points to be compensated;
Along with the temperature change of the thermal compensation plane, the current coordinates of the marking points are redetermined at intervals of preset fixed time;
Respectively calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under a coordinate system according to the datum reference coordinate point and the current coordinate;
And calculating offset of the point to be compensated in the X and Y directions respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated.
2. The method according to claim 1, characterized in that 3 of the marking points are distributed at peripheral positions of the area of points to be compensated on the thermal compensation plane.
3. The method of claim 1, wherein the step of determining the position of the substrate comprises,
The expansion ratio formula in the X direction is as follows: ，
the expansion ratio formula in the Y direction is as follows: ；
Wherein, And/>The current coordinates of the 3 marker points respectively,And respectively corresponding to the current coordinates of the 3 marking points.
4. The method of claim 3, wherein the step of,
The offset in the X direction is calculated as follows:，
The offset in the Y-axis direction is calculated as follows: ；
wherein, (X p,Yp) is the mounting point coordinate, deltaX is the offset in the X-axis direction, deltaY is the offset in the Y-axis direction.
5. The method of claim 4, wherein 3 of the marking points are distributed in a right triangle, are disposed at 3 corner positions of the thermal compensation plane, and the X-axis and the Y-axis of the coordinate system are respectively parallel to two adjacent right-angle sides of the right triangle.
6. The method according to any one of claims 1-5, wherein the offset is compensated to the point to be compensated for having coordinates (X p+ΔX,Yp + Δy).
7. The method of claim 6, wherein a camera is used to obtain a thermally compensated planar image, and coordinates of the marker points or points to be compensated are calculated based on the image as follows:
Wherein, Theoretical mechanical coordinates of marked points or points to be compensated,/>Is the deviation of the mounting angle of the camera,For the pixel deviation of the marked point or the point to be compensated from the center of the image,/>For the camera X-direction pixel scale,/>Is the camera Y-direction pixel scale.
8. A planar coordinate thermal compensation system based on fixed marker points, comprising:
The coordinate recognition module is used for determining 3 marking points distributed in a triangle shape on the thermal compensation plane, determining the coordinates of the marking points as a base reference coordinate point and determining the coordinates of the points to be compensated; the current coordinates of the marking points are redetermined every preset fixed time along with the temperature change of the thermal compensation plane;
The calculation module is used for calculating the expansion proportion of the thermal compensation plane in the X direction and the Y direction under the coordinate system according to the datum reference coordinate point and the current coordinate respectively;
And the compensation module is used for calculating the offset of the point to be compensated in the X direction and the Y direction respectively according to the expansion ratio and the coordinates of the point to be compensated, and compensating the offset to the coordinates of the point to be compensated.
9. The utility model provides a chip mounter mounting plane thermal compensation system which characterized in that includes:
The motion control module is used for driving the image acquisition module to move to a specified coordinate position in a plane coordinate system of the chip mounter;
the image acquisition module is used for identifying and acquiring mounting plane images containing marking points and mounting points at intervals of preset fixed time;
The compensation module is used for calculating the offset of the mounting point by adopting the method as set forth in any one of claims 1-7 through the image acquired by the image acquisition module, and feeding back the offset to the motion control module to drive the mounting head to compensate the offset to the coordinates of the mounting point.
10. A computer readable storage medium, having stored thereon a program executable by a processor to perform the steps of the method according to any of claims 1-7.
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