CN117991025A - Laser device assembly level live aging device - Google Patents

Abstract

The invention relates to the technical field of high-temperature aging and power-up devices of laser components, in particular to a laser component-level charged aging device, which comprises: the test device comprises a plurality of clamp assemblies, a test bottom plate, a test circuit board and a cover plate assembly; the clamp assembly and the test circuit board are placed on the test bottom plate, and the cover plate assembly is positioned above the test bottom plate; the laser assembly is clamped in the clamp assembly; the test base plate is provided with a probe connector, and the probe connector is abutted with the clamp assembly and used for realizing connection between the positive electrode of the laser assembly and the positive electrode of the test circuit board; the cover plate assembly comprises a circuit adapter plate, and the circuit adapter plate is respectively in butt joint with the clamp assembly and the test circuit board and is used for realizing connection between the negative electrode of the laser assembly and the negative electrode of the test circuit board. Through this device, integrated functional module such as anchor clamps subassembly, test circuit board, realized the assembly of laser instrument subassembly and device fixed and the power connection, have the function of batch test laser instrument subassembly high temperature area electricity ageing.

Description

Laser device assembly level live aging device

Technical Field

The invention relates to the technical field of high-temperature aging and power-up devices of laser components, in particular to a laser component-level charged aging device.

Background

The stability of the laser chip, which is used as a core component of the optical module, directly affects the service life of the optical module and the quality of an optical communication link. Therefore, the accelerated aging test is usually carried out on the laser chip under the action of electric stress or the simultaneous action of electric stress and thermal stress, so that the laser chip with the problems of material growth defect, assembly processing, damage introduction, unqualified indexes and the like is exposed and screened out in advance, and the reliability of the optical module in the long-term use process is ensured. The laser component level live aging test is a screening test method for effectively eliminating early laser chip failures.

In the existing laser assembly level live-line aging test method, a laser assembly is generally tested through a single aging plate die, and the test efficiency is low.

In view of this, overcoming the drawbacks of the prior art is a problem to be solved in the art.

Disclosure of Invention

The invention aims to solve the technical problem of how to test laser components in batches and improve efficiency.

The invention adopts the following technical scheme:

In one aspect, there is provided a laser assembly level live burn-in apparatus comprising: a plurality of clamp assemblies 1, a test base plate 2, a test circuit board 3 and a cover plate assembly 4; the clamp assembly 1 and the test circuit board 3 are placed on the test base plate 2, and the cover plate assembly 4 is located above the test base plate 2; the laser assembly 5 is clamped in the clamp assembly 1;

the test base plate 2 is provided with a probe connector 20, and the probe connector 20 is abutted with the clamp assembly 1 and used for realizing connection between the positive electrode of the laser assembly 5 and the positive electrode of the test circuit board 3;

The cover plate assembly 4 comprises a circuit adapter plate 40, and the circuit adapter plate 40 is respectively abutted against the clamp assembly 1 and the test circuit board 3 and used for realizing connection between the negative electrode of the laser assembly 5 and the negative electrode of the test circuit board 3.

Preferably, the clamp assembly 1 comprises: a clamp base 10, an L-shaped insulating block 11, an L-shaped conductive block 12 and an elastic pressing block 13; the L-shaped conductive block 12 and the L-shaped insulating block 11 are sequentially arranged above the clamp base 10 from top to bottom; the elastic pressing block 13 is arranged on the side surface of the clamp base 10 and is rotationally connected with the clamp base 10;

The fixture base 10 is provided with a first accommodating groove 100, and the first accommodating groove 100 is used for accommodating the laser assembly 5;

the clamp base 10 is provided with a spring 101 at an end far from the first accommodating groove 100, and the spring 101 is located between the elastic pressing block 13 and the clamp base 10.

Preferably, the L-shaped conductive block 12 is electrically connected to the positive electrode of the laser assembly 5, and the probe connector 20 abuts against the first end face 120 of the L-shaped conductive block 12, so as to connect the positive electrode of the laser assembly 5 with the positive electrode of the test circuit board 3;

A conductive unit 14 is disposed on the opposite side of the elastic pressing block 13, the conductive unit 14 is electrically connected with the negative electrode of the laser assembly 5, and the conductive unit 14 seals one side of the first accommodating groove 100.

Preferably, the inner surface of the first receiving groove 100 is in a conductive state; the laser assembly 5 is provided with a heat sink block 50, the heat sink block 50 is connected with the negative electrode of the laser assembly 5, and when the laser assembly 5 is placed on the fixture base 10, the heat sink block 50 and the fixture base 10 are in a conducting state.

Preferably, the circuit adapting board 40 is provided with a plurality of first adapting probes 400 and second adapting probes 401, the test circuit board 3 is provided with a plurality of bonding pads 31, the bonding pads 31 are correspondingly arranged with the second adapting probes 401, the bonding pads 31 are abutted with the second adapting probes 401, and the first adapting probes 400 are abutted with the conductive units 14 of the fixture assembly 1, so as to realize connection between the negative electrode of the laser assembly 5 and the negative electrode of the test circuit board 3;

The first switching probe 400 and the second switching probe 401 are communicated through wiring in the circuit switching board 40;

The bonding pad 31 is in wiring communication with the negative electrode of the golden finger 30 of the test circuit board 3 in the test circuit board 3.

Preferably, first limiting bars 103 are disposed on two sides of the first accommodating groove 100 perpendicular to the conductive unit 14, and are used for sealing the side surfaces of the first accommodating groove 100, and the first limiting bars 103 located on the outer side are in a stretchable structure.

Preferably, the clamp assembly 1 comprises: a clamp base 10, an L-shaped conductive block 12 and an elastic pressing block 13; the L-shaped conductive block 12 is arranged on the upper surface of the clamp base 10, and the elastic pressing block 13 is arranged on the side surface of the clamp base 10 and is in rotary connection with the clamp base 10;

The fixture base 10 is provided with a first accommodating groove 100, and the first accommodating groove 100 is used for accommodating the laser assembly 5;

The inner and outer surfaces of the fixture base 10 are in a conductive state, the laser assembly 5 is provided with a heat sink block 50, the heat sink block 50 is connected with the positive electrode of the laser assembly 5, and the heat sink block 50 is in a conductive state with the fixture base 10 and the L-shaped conductive block 12 so as to connect the positive electrode of the laser assembly 5 with the positive electrode of the test circuit board 3;

the clamp base 10 is provided with a spring 101 at an end far from the first accommodating groove 100, and the spring 101 is located between the elastic pressing block 13 and the clamp base 10.

Preferably, the circuit adapter plate 40 is provided with a plurality of first adapter probes 400 and second adapter probes 401, the surface of the laser assembly 5 is provided with a negative pole disc 51, and the first adapter probes 400 are abutted against the negative pole disc 51; the test circuit board 3 is provided with a plurality of bonding pads 31, the bonding pads 31 and the second transfer probes 401 are correspondingly arranged, the second transfer probes 401 are abutted to the bonding pads 31, and the first transfer probes 400 and the second transfer probes 401 are communicated through wiring in the circuit transfer board 40 and are used for realizing connection of the negative electrode of the laser assembly 5 with the negative electrode of the test circuit board 3.

Preferably, the test base plate 2 is provided with a plurality of second receiving grooves 21, and the jig assembly 1 and the probe connector 20 are placed in the second receiving grooves 21;

The bottom of the test circuit board 3 is provided with a conductive metal 32, and the test bottom board 2 is made of a metal material and is used for realizing the connection between the positive electrode of the laser component 5 and the positive electrode of the golden finger 30 of the test circuit board 3.

Preferably, a probe pressing plate 22 is disposed above the probe connector 20, and the probe pressing plate 22 fixes the probe connector 20 on the test base plate 2;

The probe connector 20 comprises a probe plastic body 200 and a connection probe 201, one end of the connection probe is a flat end probe 2010, the other end of the connection probe is an elastic tip probe 2011, the probe plastic body 200 is positioned in the middle of the flat end probe 201 and the elastic tip probe 202, the flat end probe 201 is abutted to the side wall of the second accommodating groove 21, and the elastic tip probe 202 is abutted to the L-shaped conductive block 12 of the clamp assembly 1.

Compared with the prior art, the invention has the beneficial effects that: in the first aspect, the laser assembly-level live aging device provided by the invention integrates the functional modules of the laser assembly 5, the clamp assembly 1, the test circuit board 3 and the like, realizes the assembly fixing and the power-on connection of the laser assembly 5 and the device, has the function of batch test of high-temperature live aging of the laser assembly 5, and can improve the efficiency.

In the preferred scheme, the clamp assembly 1 provided by the invention is provided with the elastic pressing block 13 and other structures, so that the clamping operation of the laser assembly 5 is facilitated, the horizontal assembly of the laser assembly 5 and the device is ensured, the structure and positive and negative electrode definitions of the laser assembly 5 with different sizes are compatible, the universality of the device is improved, and the production cost is reduced.

In a preferred scheme, the probe connector 20 provided by the invention and the circuit switching board 40 are provided with a plurality of first switching probes 400 and second switching probes 401, so that the anode and the cathode of the laser assembly 5 are skillfully connected to the test circuit board 3, and the function of power-on test of the batch laser assembly 5 is realized; meanwhile, the golden fingers 30 on the front and back sides of the two sides of the test circuit board 3 are output and designed, so that the test circuit board is compatible with bidirectional power-up use test, is convenient for power-up operation, and can prolong the service life of the test circuit board 3.

The test base plate 2 of the device can be compatible with COC components and COS components with different sizes and specifications, can be used for performing aging test on the COC components and the COS components at the same time, does not limit the electrode characteristics of the heat sink block 50 of the laser component 5, can be designed into the positive electrode or the negative electrode of the laser component 5, can not be used as the electrode of the laser component 5, and has lower use cost and stronger universality.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings that are required to be used in the embodiments of the present invention will be briefly described below. It is evident that the drawings described below are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic diagram of the overall structure of a laser assembly-level live aging device according to an embodiment of the present invention;

FIG. 2 is an exploded view of a laser assembly level charged burn-in apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a cover plate assembly and test base plate separation of a laser assembly level charged burn-in apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a test circuit board of a laser assembly level burn-in apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic view of a fixture assembly of a laser assembly level live aging device in a second receiving groove according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a fixing bolt of a laser assembly level live aging device according to an embodiment of the present invention;

FIG. 6a is a schematic diagram of a conductive metal of a laser assembly level charged aging device according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a locating pin of a laser assembly level live aging device according to an embodiment of the present invention;

FIG. 7a is a schematic diagram of a first via and a second via of a laser assembly level burn-in device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a first fixture assembly solution for a laser assembly level live burn-in apparatus according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of a fixture base of a laser assembly level live burn-in apparatus provided by an embodiment of the present invention;

FIG. 10 is a schematic diagram of an insulating block of a laser assembly level live aging apparatus according to an embodiment of the present invention;

FIG. 11 is a schematic diagram of the working principle of an elastic pressing block of a laser assembly level charged aging device according to an embodiment of the present invention;

FIG. 12 is a schematic view of a probe connector of a laser assembly level live burn-in device in abutment with a fixture assembly according to an embodiment of the present invention;

fig. 13 is a schematic diagram of a circuit adapter board of a laser assembly level live aging device according to an embodiment of the present invention;

Fig. 14 is a schematic diagram of a mounting hole on a circuit adapter board of a laser assembly level live aging device according to an embodiment of the present invention;

FIG. 15 is a schematic diagram of a bonding pad of a laser assembly level live burn-in device according to an embodiment of the present invention;

FIG. 16 is a schematic diagram of a second fixture assembly scheme for a laser assembly level live burn-in apparatus provided in accordance with an embodiment of the present invention;

FIG. 17 is a schematic diagram of a third clamp assembly solution for a laser assembly level live burn-in apparatus provided in accordance with an embodiment of the present invention;

Fig. 18 is a schematic diagram of an installation method of a laser assembly level live aging device according to an embodiment of the present invention.

Wherein, the reference numerals are as follows:

1-clamp assembly, 10-clamp base, 100-first receiving slot, 101-spring, 102-third through hole, 103-first stop, 104-bump, 1040-fourth through hole, 105-second stop, 11-L-shaped insulating block, 110-mounting post, 12-L-shaped conductive block, 120-first end face, 13-spring press, 130-through slot, 14-conductive unit, 2-test floor, 20-probe connector, 200-probe molding, 201-connection probe, 2010-flat end probe, 2011-spring tip probe, 21-second receiving slot, 22-probe press, 23-fixing bolt, 24-locating pin, 3-test circuit board, 30-gold finger, 31-bonding pad, 32-conductive metal, 4-cover plate assembly, 40-circuit adapter plate, 400-first adapter probe, 401-second adapter probe, 41-cover plate frame, 410-high-limit post, 42-insulating plate, 420-first through hole, 421-second through hole, 43-locking nut, 5-laser assembly, 50-negative plate, 51-negative plate, heat sink.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

In the description of the present invention, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom", etc. refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The terms "first," "second," and the like herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the present invention, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium. Furthermore, the term "coupled" may be a means of electrical connection for achieving signal transmission.

In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.

Example 1:

embodiment 1 of the present invention provides a laser assembly level live aging apparatus, as shown in fig. 1-3, including: a plurality of clamp assemblies 1, a test base plate 2, a test circuit board 3 and a cover plate assembly 4; the clamp assembly 1 and the test circuit board 3 are placed on the test base plate 2, and the cover plate assembly 4 is located above the test base plate 2 and matched with the test base plate 2; the laser assembly 5 is clamped within the clamp assembly 1 (see fig. 5); as shown in fig. 4, a plurality of gold fingers 30 are disposed on the front and back sides of the two ends of the test circuit board 3, and the gold fingers 30 are used for electrically connecting the laser assembly 5 and an external circuit. The test base plate 2 and the test circuit board 3 are in a conducting state, and the test circuit board 3 is fixed on the test base plate 2 through a locking screw.

In this embodiment, the test board 2 is used as an intermediary for connecting the positive electrode of the laser assembly 5 and the positive electrode of the test circuit board 3, that is, the positive electrode of the laser assembly 5 is connected to the test board 2, and the gold fingers 30 of the positive electrode of the test circuit board 3 are also all communicated with the test board 2. Therefore, the test base plate 2 is the common positive terminal of the test device, and in order to ensure excellent electrical conductivity and thermal conductivity of the test base plate 2, the test base plate 2 is made of tungsten copper material. In addition, the test circuit board 3 is of a multilayer wiring structure, the golden finger 30 is designed on the front and back surfaces of the left and right ends, and the golden finger 30 has a bidirectional pluggable function, so that the power-on operation is convenient, the service life is prolonged, and the production cost is reduced.

As shown in fig. 5, the test base 2 is provided with a plurality of second receiving grooves 21, and the jig assembly 1 and the probe connector 20 are placed in the second receiving grooves 21. Wherein the second receiving groove 21 is provided with a step (as shown in a dotted frame of fig. 5) on which the probe connector 20 is fitted. Referring to fig. 6a, a conductive metal 32 is disposed at the bottom of the test circuit board 3, and the test base plate 2 is made of a metal material, so as to connect the positive electrode of the laser assembly 5 with the positive electrode of the gold finger 30 of the test circuit board 3.

The probe connector 20 may be a 2pin cascade probe structure, and specifically includes a probe pressing plate 22 disposed above the probe connector 20, where the probe pressing plate 22 fixes the probe connector 20 on the test base plate 2; the probe connector 20 includes a probe plastic body 200 and a connection probe 201, one end of the connection probe 201 is a flat end probe 2010, the other end is an elastic tip probe 2011, the probe plastic body 200 is located in the middle of the flat end probe 201 and the elastic tip probe 202, the flat end probe 201 is abutted with a side wall of the second accommodating groove 21, and the elastic tip probe 202 is abutted with the L-shaped conductive block 12 of the fixture assembly 1 (as shown in fig. 8, the structure of the fixture assembly 1 will be specifically stated in the following embodiments).

Specifically, an array of threaded holes (not shown in fig. 5) are provided in the upper surface of the test base plate 2, each of which corresponds to the second accommodation groove 21, and the probe press plate 22 is fixed above the second accommodation groove 21 by a locking screw provided at the long-side end portion of the L-shaped short side away from the probe press plate 22, which limits the probe connector 20 in the second accommodation groove 21.

Referring to fig. 1-3, the cover plate assembly 4 includes a circuit adapter plate 40, where the circuit adapter plate 40 is respectively abutted against the fixture assembly 1 and the test circuit board 3, so as to realize connection between the negative electrode of the laser assembly 5 and the negative electrode of the test circuit board 3. The circuit board 40 and the test circuit board 3 will be specifically described in the following embodiments, and will not be described here again.

For the cover assembly 4, the cover assembly 4 further includes a cover frame 41 and an insulating plate 42 in addition to the circuit board 40, and the insulating plate 42 is disposed between the cover frame 41 and the circuit board 40. The circuit adapter board 40 is provided with a plurality of probes (not shown in fig. 3), and the probes are used for being abutted against the test circuit board 3 or the fixture assembly 1, so as to realize the electrical connection between the negative electrode of the laser assembly 5 and the negative electrode of the golden finger 30 on the test circuit board 3. Based on this, the cover plate assembly 4 needs to have a certain weight so that the probes on the circuit board 40 are in sufficient contact with the test board 3 and the jig assembly 1, and the pressure applied by the weight of the circuit board 40 alone is far from sufficient, so that the cover plate frame 41 is made of a metal material; because the circuit switching board 40 is provided with a plurality of probes, an insulating board 42 is arranged between the metal cover plate frame 41 and the circuit switching board 40 to separate the cover plate frame 41 and the circuit switching board 40, so that the probes of all channels on the circuit switching board 40 are prevented from being conducted mutually, and the reliability of the circuit switching board 40 in operation is ensured.

In order to facilitate assembly and positioning of the circuit switching board 40, the cover plate frame 41 and the insulating board 42, as shown in fig. 6 to 7a, the test base plate 2 is provided with a fixing bolt 23 and a positioning pin 24, the same positions of the circuit switching board 40, the cover plate frame 41 and the insulating board 42 are provided with a first through hole 420, the fixing bolt 23 penetrates through the first through hole 420, and the circuit switching board 40, the cover plate frame 41 and the insulating board 42 are fixed together through a locking nut 43; the circuit adapting board 40, the cover plate frame 41 and the insulating board 42 are provided with second through holes 421 at the same positions, the form of the second through holes 421 is matched with that of the positioning pins 24, and the positioning pins 24 are accommodated in the second through holes 421; wherein, the positioning pin 24 may be elliptical. The reason why the positioning pins 24 are designed to have an oval structure is to ensure that the cover plate frame 41 is stable and does not shake after being assembled with the test base plate 2.

In order to effectively control the assembly height of the test frame and avoid excessive stress of the probes on the circuit adapter plate 40, a plurality of height limiting columns 410 are arranged on the bottom surface of the cover plate frame 41, and a plurality of limit grooves corresponding to the height limiting columns 410 are arranged on the test bottom plate 2 and used for controlling the assembly height of the cover plate assembly 4.

The laser assembly-level charged aging device integrates the functional modules of the laser assembly 5, the clamp assembly 1, the test circuit board 3 and the like, realizes the assembly, fixation and power-on connection of the laser assembly 5 and the device, and has the function of batch test of high-temperature charged aging of the laser assembly 5.

Example 2:

The embodiment of the present invention proposes a solution of the fixture assembly 1 and the circuit adapting board 40 based on the embodiment 1.

In the prior art, a single aging board die can only be used for a Carrier Chip assembly (Chip on Carrier, abbreviated as COC) with one size specification, so that the design of Carrier boards of laser assemblies with different requirements is limited, the compatibility is poor, and the manufacturing cost is increased; in the existing method, the COC component needs to be powered up and tested firstly, the qualified COC component needs to be pasted on a heat sink for forming a heat sink Chip Component (COS) after the test, the COS component is tested, the process is complicated, and the electrode attribute design of the heat sink block of the laser component is limited to a certain extent. Through the provided fixture assembly scheme, the embodiment of the invention can adapt to COC assemblies or COS assemblies with different dimensions, and the heat sink block electrode properties of the laser assembly are highlighted in the embodiment 3 and the embodiment 4.

As shown in fig. 8, the jig assembly 1 includes: a clamp base 10, an L-shaped insulating block 11, an L-shaped conductive block 12 and an elastic pressing block 13; the L-shaped conductive block 12 and the L-shaped insulating block 11 are sequentially arranged above the fixture base 10 from top to bottom. Specifically, as shown in fig. 9, a third through hole 102 penetrating through the upper and lower surfaces of the fixture base 10 is provided on the fixture base 10, correspondingly, as shown in fig. 10, a mounting post 110 corresponding to the third through hole 102 is provided on the lower surface of the L-shaped insulating block 11, and during assembly, the mounting post 110 is accommodated in the third through hole 102, and in order to limit the L-shaped insulating block 11, as shown in fig. 9, second limiting bars 105 are provided on two sides of the third through hole 102 to avoid the rotation of the L-shaped insulating block 11 after being coupled with the third through hole 102. Screw holes are formed in the upper surface of the L-shaped insulating block 11, namely, the mounting surface of the L-shaped insulating block 12, and the L-shaped insulating block 12 and the L-shaped insulating block 11 are fixedly connected through screw coupling and screw coupling.

The elastic pressing block 13 is disposed on a side surface of the clamp base 10 and is rotatably connected with the clamp base 10. Specifically, the elastic pressing block 13 is rotatably connected with the fixture base 10 by using a pin as a center, as shown in fig. 9, a protrusion 104 is provided on a side surface of the fixture base 10, a fourth hole 1040 for accommodating the pin is provided on the protrusion 104, correspondingly, as shown in fig. 8, the elastic pressing block 13 is also provided with a fourth hole 1040 penetrating through the upper surface and the lower surface, a through groove 130 with a height matched with that of the protrusion 104 is provided on the side surface of the elastic pressing block 13, and when the fixture is assembled, the elastic pressing block 13 is aligned with the fourth hole 1040 of the protrusion 104, and the protrusion 104 is accommodated in the through groove 130.

As shown in fig. 8 and 9, the jig base 10 is provided with a first receiving groove 100, and the first receiving groove 100 is used for placing the laser assembly 5; the clamp base 10 is provided with a spring 101 at one end far away from the first accommodating groove 100, and the spring 101 is positioned between the elastic pressing block 13 and the clamp base 10; a conductive unit 14 is disposed on the opposite side of the elastic pressing block 13, the conductive unit 14 is electrically connected with the negative electrode of the laser assembly 5, and the conductive unit 14 seals one side of the first accommodating groove 100. Specifically, the conductive unit 14 is electrically connected to the negative electrode of the laser assembly 5 by a gold wire bonding method, and in this embodiment, the bonding surface between the conductive unit 14 and the gold wire is the upper surface of the conductive unit 14. When the laser assembly 5 is placed in the first accommodating groove 100, as shown in fig. 11, one end of the elastic pressing block 13 provided with the spring 101 applies a pushing force to the elastic pressing block 13, the elastic pressing block 13 rotates around the pin as a center, so that the other end of the elastic pressing block 13 abuts against the side surface of the laser assembly 5 placed in the first accommodating groove 100, and the laser assembly 5 is limited in the first accommodating groove 100.

According to the above-mentioned scheme, two sides of the laser assembly 5 are respectively limited by the conductive unit 14 and the elastic pressing block 13, and for the other two sides, referring to fig. 9, first limiting strips 103 are disposed on two sides of the first accommodating groove 100 perpendicular to the conductive unit 14, for sealing the side surfaces of the first accommodating groove 100. In order to be able to adapt to laser assemblies 5 with more dimensions, in a preferred embodiment, the first limiting bar 103 located on the outer side may be designed to be in a stretchable structure (refer to a stretchable mobile phone holder structure), so as to adapt to the dimensions of laser assemblies 5 with different lengths and widths to the greatest extent.

For the connection of the positive electrode of the laser assembly 5 with the positive electrode golden finger 30 of the test circuit board 3, in this embodiment, as described below, the L-shaped conductive block 12 is electrically connected with the positive electrode of the laser assembly 5, and the probe connector 20 abuts against the first end face 120 of the L-shaped conductive block 12, so as to realize the connection of the positive electrode of the laser assembly 5 with the positive electrode of the test circuit board 3. Referring to fig. 8 and 12, the L-shaped conductive block 12 is electrically connected to the positive electrode of the laser assembly 5 by gold wire bonding, the first end face 120 of the L-shaped conductive block 12 is in a conductive state, the probe connector 20 is abutted to the first end face 120 and the test base plate 2, and is communicated with the L-shaped conductive block 12 and the test base plate 2, and since the fixture assembly 1 is placed in the second accommodating groove 21 of the test base plate 2, the bottom of the test circuit board 3 is provided with the conductive metal 32, and the test base plate 2 is made of a metal material and is used for realizing the positive connection between the positive electrode of the laser assembly 5 and the positive electrode of the gold finger 30 of the test circuit board 3. Therefore, in summary, the conducting circuit between the positive electrode of the laser assembly 5 and the positive electrode of the test circuit board 3 is: the laser component 5 is positive, the L-shaped conductive block 12, the probe connector 20, the test base plate 2 and the golden finger 30 of the test circuit board 3 are positive.

In addition to the electrical conduction function achieved by the abutment of the probe connector 20 with the first end face 120 of the L-shaped conductive block 12, since the probe of the probe connector 20 abutting against the fixture assembly 1 is the elastic tip probe 2011, when the fixture assembly 1 is placed in the second accommodating groove 21 of the test base plate 2, the elastic tip probe 2011 applies a pushing force to the fixture assembly 1, and the fixture assembly 1 is fixed in the second accommodating groove 21.

For the connection between the negative electrode of the laser assembly 5 and the negative electrode golden finger 30 of the test circuit board 3, as shown in fig. 13 and 14, in this embodiment, a plurality of first switching probes 400 and second switching probes 401 are disposed on the circuit switching board 40, as shown in fig. 15, a plurality of bonding pads 31 are disposed on the test circuit board 3, the bonding pads 31 are disposed corresponding to the second switching probes 401, the bonding pads 31 are abutted against the second switching probes 401, and the first switching probes 400 are abutted against the conductive units 14 of the fixture assembly 1, so as to realize the connection between the negative electrode of the laser assembly 5 and the negative electrode of the test circuit board 3; the first switching probe 400 and the second switching probe 401 are communicated through wiring in the circuit switching board 40; the bonding pad 31 is in wiring communication with the negative electrode of the gold finger 30 in the test circuit board 3. Wherein, the bonding pads 31 are disposed corresponding to the second accommodating groove 21 of the test base plate 2, and the circuit adapter board 40 is provided with an array through hole for accommodating the first adapter probe 400 and the second adapter probe 401. According to the above structure, the connection process between the negative electrode of the laser assembly 5 and the negative electrode of the gold finger 30 specifically includes: the negative electrode of the laser component 5 is connected with the conductive unit 14 by using a bond alloy wire, so that the negative electrode of the laser component 5 is communicated with the negative electrode of the golden finger 30 of the test circuit board 3 through the upper surface of the conductive unit 14, the first switching probe 400, the second switching probe 401 and the bonding pad 31.

The proposal of the clamp assembly 1 provided by the embodiment of the invention is designed with the structures such as the L-shaped insulating block 11, the L-shaped conducting block 12, the elastic pressing block 13 and the like, thereby facilitating the clamping operation of the laser assembly 5, ensuring the horizontal assembly of the laser assembly 5 and the device, being compatible with the structures and positive and negative electrode definitions of the laser assembly 5 with different sizes, improving the universality of the device and reducing the production cost.

In addition, the probe connector 20 provided by the embodiment of the invention and the circuit adapter board 40 are provided with a plurality of first adapter probes 400 and second adapter probes 401, so that the anode and the cathode of the laser assembly 5 are skillfully connected to the test circuit board 3, and the function of power-on test of the batch laser assemblies 5 is realized; meanwhile, the golden fingers 30 on the front and the back of the two sides of the test circuit board 3 are output and designed, so that the test circuit board is compatible with bidirectional power-up use test, is convenient for power-up operation, and can prolong the service life.

Example 3:

Embodiment 3 of the present invention further provides a solution of the fixture assembly 1 and the circuit adapter board 40 based on different application scenarios based on embodiment 1 and embodiment 2. Unlike embodiment 2, this embodiment communicates between the cathodes of the laser assemblies 5 to the heat sink block 50 of the laser assemblies 5.

For some laser assemblies 5, such as high-speed modulated laser assemblies, analog modulated laser assemblies, etc., good grounding characteristics are considered in the design process. Therefore, as shown in fig. 16, the heat sink block 50 of the laser assembly 5 needs to be used as the negative electrode, and the transition heat sink of the laser assembly 5 is designed as a metallized through hole structure, so that the negative electrode of the laser assembly 5 is directly connected to the heat sink block 50 of the laser assembly 5. Whereas existing conventional common-cathode laser assembly-level charge aging devices are not suitable for charge aging and testing of laser assemblies 5 of the type described above.

As shown in fig. 16, the jig assembly 1 includes: a jig base 10, an L-shaped insulating block 11, an L-shaped conductive block 12, an elastic pressing block 13, and a conductive unit 14; the L-shaped conductive block 12 and the L-shaped insulating block 11 are sequentially arranged above the clamp base 10 from top to bottom; the elastic pressing block 13 is arranged on the side surface of the clamp base 10 and is rotationally connected with the clamp base 10; the conductive unit 14 is arranged at the opposite side of the elastic pressing block 13; the fixture base 10 is provided with a first accommodating groove 100, the conductive unit 14 seals one side of the first accommodating groove 100, and the first accommodating groove 100 is used for accommodating the laser assembly 5; the inner surface of the first receiving groove 100 is in a conductive state; the clamp base 10 is provided with a spring 101 at an end far from the first accommodating groove 100, and the spring 101 is located between the elastic pressing block 13 and the clamp base 10. The above embodiments are described in example 2, and are not described herein.

In this embodiment, the outer surface of the fixture base 10 is subjected to oxidation insulation treatment, so that the fixture base 10 is insulated from the second accommodating groove 21 of the test base plate 2, and the upper surfaces of the first accommodating groove 100 of the fixture base 10 and the conductive unit 14 are not subjected to surface treatment, and are in a conductive state, so that the heat sink block 50 of the laser assembly 5, which will be described later, is in electrical conduction with the fixture base 10 and the conductive unit 14, as will be described later.

The laser assembly 5 is provided with a heat sink block 50, the heat sink block 50 is connected with the negative electrode of the laser assembly 5, and when the laser assembly 5 is placed on the fixture base 10, the heat sink block 50 and the fixture base 10 are in a conducting state. For the connection between the negative electrode of the laser assembly 5 and the negative electrode golden finger 30 of the test circuit board 3, as described below in detail in this embodiment, referring to fig. 14 and 15, a plurality of first switching probes 400 and second switching probes 401 are disposed on the circuit switching board 40, a plurality of bonding pads 31 are disposed on the test circuit board 3, the bonding pads 31 are disposed corresponding to the second switching probes 401, the bonding pads 31 are abutted with the second switching probes 401, and the first switching probes 400 are abutted with the conductive units 14 of the fixture assembly 1, so as to realize the connection between the negative electrode of the laser assembly 5 and the negative electrode of the test circuit board 3; the first switching probe 400 and the second switching probe 401 are communicated through wiring in the circuit switching board 40; the bonding pad 31 is in wiring communication with the negative electrode of the gold finger 30 in the test circuit board 3. Wherein, the bonding pads 31 are disposed corresponding to the second accommodating groove 21 of the test base plate 2, and the circuit adapter board 40 is provided with an array through hole for accommodating the first adapter probe 400 and the second adapter probe 401. According to the above structure, the connection process between the cathode of the laser assembly 5 and the golden finger 30 of the cathode of the test circuit board 3 specifically includes that the heat sink block 50, which is communicated with the cathode of the laser assembly 5, is conducted with the fixture base 10, the first switching probe 400 is abutted with the conductive unit 14, the second switching probe 401 is abutted with the bonding pad 31, and the second switching probe 401 is communicated with the golden finger 30 of the cathode, so that the connection process between the cathode of the laser assembly 5 and the golden finger 30 of the cathode of the test circuit board 3 is, in summary, that the cathode of the laser assembly 5, the heat sink block 50, the fixture base 10, the conductive unit 14, the first switching probe 400, the second switching probe 401 and the golden finger 30 are connected.

For the connection between the positive electrode of the laser assembly 5 and the positive electrode of the gold finger 30, in this embodiment, as described below, the L-shaped conductive block 12 is electrically connected to the positive electrode of the laser assembly 5, and the probe connector 20 abuts against the first end face 120 of the L-shaped conductive block 12, so as to connect the positive electrode of the laser assembly 5 with the positive electrode of the test circuit board 3. Specifically, referring to fig. 16, the positive electrode of the L-shaped conductive block 12 and the positive electrode of the laser component 5 are electrically connected by gold wire bonding, the first end face 120 of the L-shaped conductive block 12 is in a conductive state, the probe connector 20 is abutted against the first end face 120 and the test base plate 2, and the L-shaped conductive block 12 and the test base plate 2 are communicated, since the fixture component 1 is placed in the second accommodating groove 21 of the test base plate 2, the second accommodating groove 21 is communicated to the positive electrode end of the gold finger 30 of the test circuit board 3 through the wiring in the board, so that in summary, the conducting circuit between the positive electrode of the laser component 5 and the positive electrode of the test circuit board 3 is as follows: the laser component 5 is positive, the L-shaped conductive block 12, the probe connector 20, the test base plate 2 and the golden finger 30 of the test circuit board 3 are positive.

According to the scheme of the clamp assembly 1 provided by the embodiment 2, the oxidation insulation treatment is carried out on the outer surface of the clamp base 10, so that the insulation and isolation energizing effect between the anode and the cathode of the laser assembly 5 is realized, the design scheme of the laser assembly 5 product with the heat sink of the laser assembly 5 as the cathode is compatible, the aging assembly of the laser assembly 5 is more universal, and the production cost is reduced. The test base plate 2 of the device can be compatible with COC components and COS components with different sizes and specifications, can perform aging test on the COC components and the COS components at the same time, and does not limit the electrode characteristics of the heat sink block 50 of the laser component 5, in this embodiment, the heat sink block 50 can be designed as the negative electrode of the laser component 5, so that the use cost is lower and the universality is stronger.

Example 4:

The embodiment of the invention further provides a solution of the fixture assembly 1 and the circuit adapter board 40 based on different application scenarios based on the embodiment 1, the embodiment 2 and the embodiment 3. Unlike embodiments 2 and 3, the jig assembly 1 does not include the L-shaped insulating block 11, and connects the positive electrode of the laser assembly 5 to the heat sink block 50 of the laser assembly 5, and connects the negative electrode of the laser assembly 5 to the negative electrode disk 51.

In particular, for some laser assemblies 5, the heat sink block 50 of the laser assembly 5 needs to be used as the positive electrode in the design process, as shown in the laser assembly 5 in fig. 17, the transition heat sink of the laser assembly 5 is designed as a metallized through hole structure, and the positive electrode of the laser assembly 5 is directly connected to the heat sink block 50 of the laser assembly 5.

As shown in fig. 17, the jig assembly 1 includes: a jig base 10, an L-shaped conductive block 12, an elastic pressing block 13, and a conductive unit 14; the L-shaped conductive block 12 is arranged on the upper surface of the clamp base 10, and the elastic pressing block 13 is arranged on the side surface of the clamp base 10 and is in rotary connection with the clamp base 10; the fixture base 10 is provided with a first accommodating groove 100, the conductive unit 14 seals one side of the first accommodating groove 100, and the first accommodating groove 100 is used for accommodating the laser assembly 5; the clamp base 10 is provided with a spring 101 at an end far from the first accommodating groove 100, and the spring 101 is located between the elastic pressing block 13 and the clamp base 10. In the present embodiment, the conductive unit 14 does not perform a conductive function, and serves to close only one side of the first receiving groove 100.

The inner surface and the outer surface of the fixture base 10 are in a conductive state, the laser assembly 5 is provided with a heat sink block 50, the heat sink block 50 is connected with the positive electrode of the laser assembly 5, and the heat sink block 50 is in a conductive state with the fixture base 10 and the L-shaped conductive block 12, so that the positive electrode of the laser assembly 5 is connected with the positive electrode of the test circuit board 3. Based on the above structure, the positive electrode of the laser component 5 is connected with the positive electrode golden finger 30 of the test circuit board 3, in this embodiment, as described below, the positive electrode of the laser component 5 is conducted with the heat sink block 50, the heat sink block 50 contacts with the fixture base 10, the fixture base 10 contacts with the L-shaped conductive block 12, the probe connector 20 contacts with the L-shaped conductive block 12, and the second accommodating groove 21 on the test base plate 2 is connected with the positive electrode golden finger 30 of the test circuit board 3, so that the connection process between the positive electrode of the laser component 5 and the positive electrode golden finger 30 of the test circuit board 3 is that the positive electrode of the laser component 5, the heat sink block 50, the fixture base 10, the L-shaped conductive block 12, the probe connector 20, and the test base plate 2 are connected with the positive electrode golden finger 30 of the test circuit board 3.

For the connection between the cathode of the laser assembly 5 and the cathode golden finger 30 of the test circuit board 3, as described in detail below in this embodiment, referring to fig. 14 and 15, a plurality of first switching probes 400 and second switching probes 401 are disposed on the circuit switching board 40, a cathode disc 51 is disposed on the surface of the laser assembly 5, and the first switching probes 400 are abutted against the cathode disc 51; the test circuit board 3 is provided with a plurality of bonding pads 31, the bonding pads 31 and the second transfer probes 401 are correspondingly arranged, the second transfer probes 401 are abutted to the bonding pads 31, and the first transfer probes 400 and the second transfer probes 401 are communicated through wiring in the circuit transfer board 40 and are used for realizing connection of the negative electrode of the laser assembly 5 with the negative electrode of the test circuit board 3. Compared with embodiment 2 and embodiment 3, the position of the first transfer probe 400 is adjusted in this embodiment, so that the first transfer probe 400 directly abuts against the anode disc 51 of the laser assembly 5, thereby improving the electrical transmission efficiency and saving the process. According to the above structure, the connection process between the cathode of the laser assembly 5 and the cathode golden finger 30 of the test circuit board 3 is that the cathode disc 51, the first switching probe 400, the second switching probe 401 and the bonding pad 31 of the test circuit board 3 of the laser assembly 5 reach the cathode golden finger 30 of the test circuit board 3.

According to the clamp assembly 1 scheme provided by the embodiment 4 of the invention, the mutual isolation and electrification effect between the positive electrode and the negative electrode of the laser assembly 5 is realized by changing the conductive characteristic of the surface of the clamp base 10 and the position of the first switching probe 400, and the product design scheme that the heat sink of the laser assembly 5 is the positive electrode is compatible, so that the aging assembly of the laser assembly 5 is more universal, and the production cost is reduced.

Example 5:

This embodiment 5 provides a method for mounting a laser assembly-level live aging apparatus based on embodiments 1 to 4, as shown in fig. 18, the method comprising:

in step 60, the laser assembly 5 is assembled on the jig base 10 of the jig assembly 1, and the laser assembly 5 is resiliently fixed by the elastic pressing block 13.

In step 61, the positive electrode of the laser module 5 is electrically connected to the L-shaped conductive block 12, and the negative electrode of the laser module 5 is electrically connected to the jig base 10.

In step 62, the probe connector 20 is fixed to the test base 2 by the probe press plate 22, the jig assembly 1 is fitted into the second receiving groove 21 of the test base 2, and the jig assembly 1 is fixed by the elastic tip probes 2011 of the probe connector 20.

In step 63, the insulating board 42 and the circuit board 40 are assembled on the cover frame 41 in sequence, and the cover frame 41 is back-fastened on the test base 2.

In step 64, a locking nut is assembled on the locking bolt to fix the cover plate assembly 4, thereby realizing the assembly of the charged aging device.

In summary, according to the laser assembly-level live aging device provided by the embodiment of the invention, the test base plate 2 and the test circuit board 3 are integrated and packaged, and the batch assembly and power-up functions of the laser assemblies 5 are realized by combining the circuit adapter board 40 and the probe connector 20; the proposal of the probe connector 20, the first switching probe 400 and the second switching probe 401 provided by the embodiment of the invention skillfully realizes the electric connection between the positive electrode and the negative electrode of the laser component 5 and the golden finger 30; according to the clamp assembly 1 structure provided by the embodiment of the invention, the laser assemblies 5 with different sizes are assembled by adjusting the positions of the elastic pressing plates, and the laser assemblies 5 with different polarity designs are compatible by the surface treatment of the clamp base 10.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (10)

1. A laser assembly level live burn-in apparatus comprising: a plurality of clamp assemblies (1), a test base plate (2), a test circuit board (3) and a cover plate assembly (4); the clamp assembly (1) and the test circuit board (3) are arranged on the test base plate (2), and the cover plate assembly (4) is positioned above the test base plate (2); a laser assembly (5) is clamped within the clamp assembly (1);

The test base plate (2) is provided with a probe connector (20), and the probe connector (20) is abutted with the clamp assembly (1) and used for realizing connection between the positive electrode of the laser assembly (5) and the positive electrode of the test circuit board (3);

The cover plate assembly (4) comprises a circuit adapter plate (40), wherein the circuit adapter plate (40) is respectively abutted with the clamp assembly (1) and the test circuit board (3) and used for realizing connection of the negative electrode of the laser assembly (5) and the negative electrode of the test circuit board (3).

2. The laser assembly level live aging device according to claim 1, wherein the fixture assembly (1) comprises: a clamp base (10) and an elastic pressing block (13); the elastic pressing block (13) is arranged on the side surface of the clamp base (10) and is rotationally connected with the clamp base (10);

The fixture base (10) is provided with a first accommodating groove (100), and the first accommodating groove (100) is used for accommodating the laser assembly (5);

The clamp base (10) is provided with a spring (101) at one end far away from the first accommodating groove (100), and the spring (101) is located between the elastic pressing block (13) and the clamp base (10).

3. The laser assembly level live aging device according to claim 2, wherein the fixture assembly (1) further comprises: the L-shaped insulating block (11) and the L-shaped conducting block (12), and the L-shaped conducting block (12) and the L-shaped insulating block (11) are sequentially arranged above the clamp base (10) from top to bottom; the L-shaped conducting block (12) is electrically connected with the positive electrode of the laser assembly (5), and the probe connector (20) is abutted with the first end face (120) of the L-shaped conducting block (12) and used for realizing connection between the positive electrode of the laser assembly (5) and the positive electrode of the test circuit board (3).

4. The laser assembly level charged aging device according to claim 2, characterized in that a conductive unit (14) is provided on the opposite side of the elastic press block (13), the conductive unit (14) is electrically connected with the negative electrode of the laser assembly (5), and the conductive unit (14) closes one side of the first accommodating groove (100);

or, the inner surface of the first accommodating groove (100) is in a conductive state; the laser assembly (5) is provided with a heat sink block (50), the heat sink block (50) is connected with the negative electrode of the laser assembly (5), and when the laser assembly (5) is placed on the clamp base (10), the heat sink block (50) and the clamp base (10) are in a conducting state.

5. The laser assembly level live aging device according to claim 4, wherein a plurality of first switching probes (400) and second switching probes (401) are arranged on the circuit switching board (40), a plurality of bonding pads (31) are arranged on the test circuit board (3), the bonding pads (31) are correspondingly arranged with the second switching probes (401), the bonding pads (31) are abutted with the second switching probes (401), the first switching probes (400) are abutted with conductive units (14) of the fixture assembly (1), and the negative electrode of the laser assembly (5) is connected with the negative electrode of the test circuit board (3);

The first transfer probe (400) and the second transfer probe (401) are communicated through wiring in the circuit transfer board (40);

the bonding pad (31) is communicated with the negative electrode of the golden finger (30) of the test circuit board (3) in a wiring mode.

6. The laser assembly level charged aging device according to claim 2, wherein first stopper strips (103) are provided on both sides of the first accommodation groove (100) for closing side surfaces of the first accommodation groove (100), the first stopper strips (103) being of a stretchable structure.

7. The laser assembly level live aging device according to claim 2, wherein the fixture assembly (1) further comprises: an L-shaped conductive block (12); the L-shaped conductive block (12) is arranged on the upper surface of the clamp base (10);

The laser assembly (5) is provided with a heat sink block (50), the heat sink block (50) is connected with the anode of the laser assembly (5), the inner surface and the outer surface of the clamp base (10) are in a conductive state, the heat sink block (50) and the clamp base (10) are in a conductive state, and the clamp base (10) and the L-shaped conductive block (12) are in a conductive state;

the probe connector (20) is abutted with the first end face (120) of the L-shaped conductive block (12) and used for realizing connection between the anode of the laser assembly (5) and the anode of the test circuit board (3).

8. The laser assembly level charged aging device according to claim 7, wherein a plurality of first switching probes (400) and second switching probes (401) are arranged on the circuit switching board (40), a negative disc (51) is arranged on the surface of the laser assembly (5), and the first switching probes (400) are abutted with the negative disc (51); be provided with a plurality of pads (31) on test circuit board (3), pad (31) with second switching probe (401) correspond the setting, second switching probe (401) with pad (31) butt, first switching probe (400) with second switching probe (401) are linked together through wiring in circuit switching board (40) for realize the negative pole of laser subassembly (5) with the negative pole of test circuit board (3) is connected.

9. The laser assembly level live burn-in device according to claim 1, wherein the test floor (2) is provided with a plurality of second receiving slots (21), the fixture assembly (1) and the probe connector (20) being placed within the second receiving slots (21);

the bottom of the test circuit board (3) is provided with conductive metal (32), the test bottom board (2) is made of metal materials, and the test bottom board (2) is connected with the conductive metal (32).

10. The laser assembly level live burn-in device according to claim 9, characterized in that a probe platen (22) is provided above the probe connector (20), the probe platen (22) fixing the probe connector (20) to the test floor (2);

The probe connector (20) comprises a probe plastic body (200) and a connecting probe (201), one end of the connecting probe is a flat-end probe (2010), the other end of the connecting probe is an elastic tip probe (2011), the probe plastic body (200) is located in the middle of the flat-end probe (201) and the elastic tip probe (202), the flat-end probe (201) is abutted to the side wall of the second accommodating groove (21), and the elastic tip probe (202) is abutted to the L-shaped conductive block (12) of the clamp assembly (1).