CN117978116A - Equivalent circuit of 5G symmetrical LTCC (Low temperature Co-fired ceramic) multilayer band-pass filter and filter - Google Patents
Equivalent circuit of 5G symmetrical LTCC (Low temperature Co-fired ceramic) multilayer band-pass filter and filter Download PDFInfo
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- 239000003990 capacitor Substances 0.000 claims description 61
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- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses an equivalent circuit of a 5G symmetrical LTCC multilayer band-pass filter and the filter, which are formed by adopting an LTCC technology and then co-firing at a low temperature of about 800-900 ℃. The invention is based on LTCC (low temperature co-fired ceramic) technology, and adopts lumped parameter model design to realize special electrical performance requirements of the dielectric LTCC multilayer band-pass filter. The invention effectively realizes the characteristics of the dielectric LTCC multilayer band-pass filter, has the advantages of low loss, small size, high reliability, low cost, suitability for large-scale production and the like, and is also suitable for the development trend of integration and miniaturization of new electronic elements.
Description
Technical Field
The invention discloses a filter, in particular to an equivalent circuit of a 5G symmetrical LTCC multi-layer band-pass filter and the filter, which can be used in 5G mobile communication facilities and other various communication equipment.
Background
The low-temperature co-fired ceramic (Low Temperature Co-FIRED CERAMIC, LTCC) is used as a high-density packaging technology with a wide application range, and has become a preferred mode for integrating and modularizing electronic elements in the future by virtue of excellent electronic, mechanical and thermal characteristics, so that the low-temperature co-fired ceramic is widely applied to the modular design of a multi-layer chip circuit.
Radio frequency microwave elements and modules designed and produced based on LTCC technology include balun filters, multiplexers, diplexers, antennas, couplers, bridges, balun, receive front-end modules, antenna switch modules, etc., which have many advantages in terms of wiring linewidth and spacing, low impedance metallization, diversity of design, high frequency performance, etc., in addition to the advantages of cost and integrated packaging.
As modern electronic devices continue to evolve toward miniaturization and high frequency, they have been largely utilized in miniaturized electronic devices. In the field of mobile communication, the functions of communication products are more and more, the available spectrum resources are particularly important, and at the moment, filters in various frequency bands are needed to separate different signals, and at present, a special band-pass filter is lacking in the 5G field.
Disclosure of Invention
Aiming at the defect that a special 5G band-pass filter is absent in the prior art, the invention provides an equivalent circuit of a 5G symmetrical LTCC multilayer band-pass filter and the filter, which are formed by adopting an LTCC technology and then co-firing at a low temperature of about 800-900 ℃, wherein the 5G symmetrical LTCC multilayer band-pass filter comprises an LTCC ceramic substrate, a wiring terminal arranged outside the substrate and a circuit layer arranged inside the substrate, and the circuit layer inside the substrate is of a laminated structure.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a 5G symmetry LTCC multilayer band-pass filter equivalent circuit, the equivalent circuit includes the input, the output, inductance L1, inductance L2, inductance L3, inductance L4, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6, electric capacity C7 and electric capacity C8, be connected gradually in series between input and the output and have electric capacity C2, electric capacity C8 and electric capacity C5, be connected with parallel connection's ground inductance L1 and ground electric capacity C1 between input and the ground, be connected with parallel connection's ground inductance L2 and ground electric capacity C3 between the common terminal of electric capacity C2 and electric capacity C8 and ground, be connected with parallel connection's ground inductance L3 and ground electric capacity C4 between electric capacity C8 and the common terminal and the ground, be connected with parallel connection's ground inductance L4 and ground electric capacity C6 between input and the output, the cross-over connection has electric capacity C7.
The filter for realizing the equivalent circuit of the 5G symmetrical LTCC multilayer band-pass filter comprises a ceramic matrix, an input end, an output end and an internal circuit structure layer arranged in the ceramic matrix, wherein the input end and the output end are respectively arranged at two ends of the ceramic matrix, the internal circuit structure layer is distributed inside the ceramic matrix, and the internal circuit structure layer is sequentially as follows:
The first layer, the ceramic matrix is printed with a first metal plane conductor, the first metal plane conductor is exposed outside the ceramic matrix, as the ground plane;
The second layer, the ceramic matrix is printed with four mutually insulated metal plane conductors, second metal plane conductor, third metal plane conductor, fourth metal plane conductor and fifth metal plane conductor respectively, the second metal plane conductor stretches out to the side to form the first connecting plane conductor, the second metal plane conductor is connected with input end through the first connecting plane conductor, the third metal plane conductor stretches out to the side to form the second connecting plane conductor, the third metal plane conductor is connected with output end through the second connecting plane conductor, form the ground capacitor C1, the ground capacitor C3, the ground capacitor C4 and the ground capacitor C6 respectively between the second metal plane conductor, the third metal plane conductor, the fourth metal plane conductor and the first metal plane conductor in the first layer;
The third layer, the ceramic matrix is printed with three mutually insulated metal plane conductors, a sixth metal plane conductor, a seventh metal plane conductor and an eighth metal plane conductor are respectively arranged on the sixth metal plane conductor, a sixth metal plane conductor second end is arranged on the seventh metal plane conductor, a seventh metal plane conductor second end is arranged on the eighth metal plane conductor, the sixth metal plane conductor, the second metal plane conductor and the fifth metal plane conductor in the second layer form a bridging capacitor C2, the eighth metal plane conductor, the fifth metal plane conductor and the fourth metal plane conductor in the second layer form a bridging capacitor C8, and the seventh metal plane conductor, the fourth metal plane conductor and the third metal plane conductor in the second layer form a bridging capacitor C5;
A fourth layer, wherein three mutually insulated metal plane conductors are printed on the ceramic substrate, namely a ninth metal plane conductor, a tenth metal plane conductor and an eleventh metal plane conductor are respectively arranged on the ninth metal plane conductor, a second end of the ninth metal plane conductor is arranged on the ninth metal plane conductor, the ninth metal plane conductor and a second end of a sixth metal plane conductor in the third layer form a series capacitor C7 together with the second end of the seventh metal plane conductor in the third layer;
A fifth layer, the ceramic substrate is printed with four mutually insulated metal plane conductors, namely a twelfth metal plane conductor, a thirteenth metal plane conductor, a fourteenth metal plane conductor and a fifteenth metal plane conductor, wherein the twelfth metal plane conductor is connected with the first metal plane conductor in the first layer through a first point column, the thirteenth metal plane conductor is connected with the first metal plane conductor in the first layer through a second point column, the fourteenth metal plane conductor is connected with the first metal plane conductor in the first layer through a third point column, the fifteenth metal plane conductor is connected with the first metal plane conductor in the first layer through a fourth point column, the twelfth metal plane conductor is connected with the second metal plane conductor in the second layer through a fifth point column, the thirteenth metal plane conductor is connected with the fifth metal plane conductor in the second layer through a sixth point column, the fourteenth metal plane conductor is connected with the fourth metal plane conductor in the second layer through a seventh point column, and the fifteenth metal plane conductor is connected with the third metal plane conductor in the second layer through an eighth point column;
And a sixth layer, wherein four mutually insulated metal plane conductors are printed on the ceramic substrate, namely a sixteenth metal plane conductor, a seventeenth metal plane conductor, an eighteenth metal plane conductor and a nineteenth metal plane conductor, the sixteenth metal plane conductor is connected with the twelfth metal plane conductor in the fifth layer through a first point column, the seventeenth metal plane conductor is connected with the thirteenth metal plane conductor in the fifth layer through a second point column, the eighteenth metal plane conductor is connected with the fourteenth metal plane conductor in the fifth layer through a third point column, the nineteenth metal plane conductor is connected with the fifteenth metal plane conductor in the fifth layer through a fourth point column, and the metal plane conductors in the fifth layer and the sixth layer are jointly connected with the metal plane conductor in the first layer to form a grounding inductor L1, a grounding inductor L2, a grounding inductor L3 and a grounding inductor L4.
The technical scheme adopted by the invention for solving the technical problems further comprises the following steps:
The sixth metal plane conductor, the seventh metal plane conductor and the eighth metal plane conductor are arranged in a delta shape.
The ninth metal plane conductor is rectangular.
The tenth metal plane conductor and the eleventh metal plane conductor are kidney-shaped.
The twelfth metal plane conductor, the thirteenth metal plane conductor, the fourteenth metal plane conductor and the fifteenth metal plane conductor are all in strip shapes.
The twelfth metal plane conductor, the thirteenth metal plane conductor, the fourteenth metal plane conductor and the fifteenth metal plane conductor are arranged in parallel.
The sixteenth metal plane conductor, the seventeenth metal plane conductor, the eighteenth metal plane conductor and the nineteenth metal plane conductor are all in long strips.
The sixteenth metal plane conductor, the seventeenth metal plane conductor, the eighteenth metal plane conductor and the nineteenth metal plane conductor are arranged in parallel.
The sixteenth metal plane conductor, the seventeenth metal plane conductor, the eighteenth metal plane conductor and the nineteenth metal plane conductor are arranged in a vertically stacked manner with the twelfth metal plane conductor, the thirteenth metal plane conductor, the fourteenth metal plane conductor and the fifteenth metal plane conductor in the fifth layer.
The beneficial effects of the invention are as follows: the invention is based on LTCC (low temperature co-fired ceramic) technology, and adopts lumped parameter model design to realize special electrical performance requirements of the dielectric LTCC multilayer band-pass filter. The invention effectively realizes the characteristics of the dielectric LTCC multilayer band-pass filter, has the advantages of low loss, small size, high reliability, low cost, suitability for large-scale production and the like, and is also suitable for the development trend of integration and miniaturization of new electronic elements. The invention can be applied to the design of communication products, adopts a discrete bridge to process input signals of different frequency bands, and the 5G LTCC band-pass filter manufactured by the LTCC technology has the advantages of high reliability, low insertion loss, high selectivity, small volume, light weight, easy integration, low cost and the like, is suitable for large-scale production, and has very wide application.
The invention will be further described with reference to the drawings and detailed description.
Drawings
Fig. 1 is an equivalent circuit diagram of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 2 is a schematic diagram of the external appearance structure of a 5G symmetrical LTCC multilayer bandpass filter according to the invention.
Fig. 3 is a schematic diagram of the internal structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 4 is a schematic diagram of a first layer planar structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 5 is a schematic diagram of a second layer planar structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 6 is a schematic diagram of a third layer planar structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 7 is a schematic diagram of a fourth layer planar structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
Fig. 8 is a schematic plan view of a fifth layer of a 5G symmetrical LTCC multilayer bandpass filter according to the invention.
Fig. 9 is a schematic diagram of a sixth layer planar structure of a 5G symmetric LTCC multilayer bandpass filter according to the invention.
FIG. 10 is a graph showing the electrical frequency response of the product of the present invention.
Detailed Description
This example is a preferred embodiment of the present invention, and other principles and basic structures are the same as or similar to those of this example, and all fall within the scope of the present invention.
Referring to fig. 1, the invention provides a 5G symmetrical LTCC multilayer bandpass filter equivalent circuit, the bandpass filter equivalent circuit adopts a four-stage band cross-coupling filter circuit structure, the four-stage band cross-coupling filter is four groups of resonators, the equivalent circuit comprises an input end, an output end, an inductor L1, an inductor L2, an inductor L3, an inductor L4, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7 and a capacitor C8, the capacitor C2, the capacitor C8 and the capacitor C5 are sequentially connected in series between the input end and the output end, the grounded inductor L1 and the grounded capacitor C1 which are connected in parallel are connected between the common end of the capacitor C2 and the ground, the grounded inductor L2 and the grounded capacitor C3 which are connected in parallel are connected between the common end of the capacitor C8 and the ground, the grounded inductor L3 and the grounded capacitor C4 which are connected in parallel are connected between the common end of the capacitor C8 and the ground are connected in parallel, the grounded inductor L4 and the grounded capacitor C6 which are connected in parallel are connected between the output end and the ground are connected in series, namely the fourth-stage filter circuit can realize cross-coupling between the input end and the capacitor C7, and the fourth-stage filter circuit can realize cross-over coupling, and the fourth-stage filter circuit can be realized. In this embodiment, the input end and the output end are merely for convenience of expression, and the input end and the output end may be interchanged in practical application.
Referring to fig. 2 to 9, the present invention provides a filter capable of implementing the equivalent circuit of the 5G symmetric LTCC multilayer band-pass filter, comprising: a ceramic substrate 11, an input terminal 10a, an output terminal 10b, and an internal circuit structure layer provided in the ceramic substrate 11. In this embodiment, the input end 10a and the output end 10b are respectively disposed at two ends of the ceramic substrate 11 and are used for connecting with an external circuit, the ceramic substrate 11 is a body of the present invention, and adopts a cuboid structure, the ceramic substrate 11 mainly adopts alumina (Al 2O3), calcium oxide (CaO), magnesium oxide (MgO) and silica (SiO 2), the internal circuit structure layers are distributed inside the ceramic substrate 11, the total number of the internal circuit structure layers is 6, and the internal circuit structure layers sequentially from bottom to top (in the direction of the drawing) are:
a first layer, wherein a first metal plane conductor 1 is printed on a ceramic substrate 11, and the first metal plane conductor 1 is exposed outside the ceramic substrate 11 and serves as a ground plane of the product in the invention when the first metal plane conductor 1 is printed on the ceramic dielectric substrate;
The second layer, print four pieces of mutually insulated metal plane conductors on the ceramic base 11, the second metal plane conductor 2C, third metal plane conductor 2d, fourth metal plane conductor 2e and fifth metal plane conductor 2f respectively, can print on the ceramic dielectric base plate while printing, the second metal plane conductor 2C stretches out to the side to form the first connection plane conductor 2b, the second metal plane conductor 2C is connected with the input end 10a through the first connection plane conductor 2b, the third metal plane conductor 2d stretches out to the side to form the second connection plane conductor 2a, the third metal plane conductor 2d is connected with the output end 10b through the second connection plane conductor 2a, form the ground capacitor C1, the ground capacitor C3, the ground capacitor C4 and the ground capacitor C6 between the second metal plane conductor 2C, the third metal plane conductor 2d, the fourth metal plane conductor 2e and the fifth metal plane conductor 2f and the first metal plane conductor 1 in the first layer respectively;
A third layer, three mutually insulated metal plane conductors are printed on the ceramic substrate 11, a sixth metal plane conductor 3a, a seventh metal plane conductor 3b and an eighth metal plane conductor 3e are respectively printed on the ceramic dielectric substrate during printing, in this embodiment, the three mutually insulated metal plane conductors are arranged in a delta shape, a sixth metal plane conductor second end 3C is arranged on the sixth metal plane conductor 3a, a seventh metal plane conductor second end 3d is arranged on the seventh metal plane conductor 3b, a seventh metal plane conductor second end 3f is arranged on the eighth metal plane conductor 3e, the sixth metal plane conductor 3a forms a bridging capacitor C2 with the second metal plane conductor 2C and the fifth metal plane conductor 2f in the second layer, the eighth metal plane conductor 3 forms a bridging capacitor C8 with the fifth metal plane conductor 2f and the fourth metal plane conductor 2e in the second layer, and the fourth metal plane conductor 2e and the third metal plane conductor 2d in the second layer form a bridging capacitor C5;
A fourth layer, in which three mutually insulated metal plane conductors are printed on the ceramic substrate 11, and a ninth metal plane conductor 4a, a tenth metal plane conductor 4C and an eleventh metal plane conductor 4d are respectively printed on the ceramic dielectric substrate during printing, in this embodiment, the ninth metal plane conductor 4a is rectangular, the tenth metal plane conductor 4C and the eleventh metal plane conductor 4d are all in a kidney shape, a ninth metal plane conductor second end 4b is disposed on the ninth metal plane conductor 4a, the ninth metal plane conductor 4a and a sixth metal plane conductor second end 3C in the third layer, and the ninth metal plane conductor second end 4b and a seventh metal plane conductor second end 3d in the third layer together form a series capacitor C7;
a fifth layer, in which four mutually insulated metal plane conductors are printed on the ceramic substrate 11, namely, a twelfth metal plane conductor 5a, a thirteenth metal plane conductor 5b, a fourteenth metal plane conductor 5c and a fifteenth metal plane conductor 5d, which can be printed on the ceramic dielectric substrate during printing, wherein the twelfth metal plane conductor 5a, the thirteenth metal plane conductor 5b, the fourteenth metal plane conductor 5c and the fifteenth metal plane conductor 5d are all in a strip shape and are arranged in parallel, in the present embodiment, the twelfth metal plane conductor 5a is connected with the first metal plane conductor 1 in the first layer through a first point post 7a, the thirteenth metal plane conductor 5b is connected with the first metal plane conductor 1 in the first layer through a second point post 7b, the fourteenth metal plane conductor 5c is connected with the first metal plane conductor 1 in the first layer through a third point post 7c, the fifteenth metal plane conductor 5d is connected with the first metal plane conductor 5 in the first layer through a fourth point post 7d, the twelfth metal plane conductor 5a is connected with the thirteenth plane conductor 2f in the fifth layer through a fifth point post 8b, and the thirteenth metal plane conductor 5c is connected with the thirteenth plane conductor 2f in the eighth layer through a fifth point post 8 c;
A sixth layer, four mutually insulated metal plane conductors are printed on the ceramic substrate 11, a sixteenth metal plane conductor 6a, a seventeenth metal plane conductor 6b, an eighteenth metal plane conductor 6c and a nineteenth metal plane conductor 6d are respectively printed on the ceramic dielectric substrate, in this embodiment, the sixteenth metal plane conductor 6a, the seventeenth metal plane conductor 6b, the eighteenth metal plane conductor 6c and the nineteenth metal plane conductor 6d are all in a strip shape, are arranged in parallel, are arranged on top of and below the twelfth metal plane conductor 5a, the thirteenth metal plane conductor 5b, the fourteenth metal plane conductor 5c and the fifteenth metal plane conductor 5d in the fifth layer, the sixteenth metal plane conductor 6a is connected with the twelfth metal plane conductor 5a in the fifth layer through a fifth point post 7a, the seventeenth metal plane conductor 6b is connected with the thirteenth metal plane conductor 5b in the fifth layer through a second point post 7b, the eighteenth metal plane conductor 6c is connected with the fourteenth plane conductor 5c in the fifth layer through a third point post 7c, the thirteenth plane conductor is connected with the fourteenth plane conductor 5c in the fifth layer through the fifth point post 7c, the fifteenth plane conductor is connected with the fifth plane conductor 5d in the fifth layer through the fifth point post 7c and the fifth plane conductor is connected with the fifth plane conductor 1, the fifteenth plane conductor is connected with the fifth plane conductor is connected with the ground plane conductor 1, and the fifth plane conductor is connected with the fifth plane conductor 1, the fifth plane conductor is connected with the ground plane conductor 1.
Referring to fig. 10 in combination, the working frequency band of the 5G symmetric LTCC multilayer bandpass filter of the invention is 3.36 GHz-3.8 GHz, the transmission loss S21, the port signal transmission curve S (1, 2) from the electrode 10a to the electrode 10b and the return loss curve S (1, 1) of the electrode 10a, and the return loss curve S (2, 2) of the electrode 10b in the frequency range of 0.5GHz to 13 GHz.
The invention is based on LTCC (low temperature co-fired ceramic) technology, and adopts lumped parameter model design to realize special electrical performance requirements of the dielectric LTCC multilayer band-pass filter. The invention effectively realizes the characteristics of the dielectric LTCC multilayer band-pass filter, has the advantages of low loss, small size, high reliability, low cost, suitability for large-scale production and the like, and is also suitable for the development trend of integration and miniaturization of new electronic elements. The invention can be applied to the design of communication products, adopts a discrete bridge to process input signals of different frequency bands, and the 5G LTCC band-pass filter manufactured by the LTCC technology has the advantages of high reliability, low insertion loss, high selectivity, small volume, light weight, easy integration, low cost and the like, is suitable for large-scale production, and has very wide application.
Claims (10)
1. An equivalent circuit of a 5G symmetrical LTCC multilayer band-pass filter is characterized in that: the equivalent circuit comprises an input end, an output end, an inductor L1, an inductor L2, an inductor L3, an inductor L4, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7 and a capacitor C8, wherein the capacitor C2, the capacitor C8 and the capacitor C5 are sequentially connected in series between the input end and the output end, the grounded inductor L1 and the grounded capacitor C1 which are connected in parallel are connected between the input end and the ground, the grounded inductor L2 and the grounded capacitor C3 which are connected in parallel are connected between the common end of the capacitor C2 and the ground, the grounded inductor L3 and the grounded capacitor C4 which are connected in parallel are connected between the common end of the capacitor C8 and the ground, the grounded inductor L4 and the grounded capacitor C6 which are connected in parallel are connected between the output end and the ground, and the capacitor C7 is connected in a bridging manner between the input end and the output end.
2. A filter implementing the equivalent circuit of a 5G symmetric LTCC multilayer bandpass filter as recited in claim 1, characterized by: the filter comprises a ceramic matrix (11), an input end (10 a), an output end (10 b) and an internal circuit structure layer arranged in the ceramic matrix (11), wherein the input end (10 a) and the output end (10 b) are respectively arranged at two ends of the ceramic matrix (11), the internal circuit structure layer is distributed inside the ceramic matrix (11), and the internal circuit structure layer is sequentially as follows:
the first layer, the ceramic matrix (11) is printed with a first metal plane conductor (1), the first metal plane conductor (1) is exposed outside the ceramic matrix (11) and is used as a ground plane;
The second layer, the ceramic base body (11) is printed with four mutually insulated metal plane conductors, the second metal plane conductor (2C), the third metal plane conductor (2 d), the fourth metal plane conductor (2 e) and the fifth metal plane conductor (2 f) are respectively, the second metal plane conductor (2C) stretches out to the side to form a first connection plane conductor (2 b), the second metal plane conductor (2C) is connected with an input end (10 a) through the first connection plane conductor (2 b), the third metal plane conductor (2 d) stretches out to the side to form a second connection plane conductor (2 a), the third metal plane conductor (2 d) is connected with an output end (10 b) through the second connection plane conductor (2 a), and a grounding capacitor C1, a grounding capacitor C3, a grounding capacitor C4 and a grounding capacitor C6 are respectively formed between the second metal plane conductor (2 e) and the fifth metal plane conductor (2 f) and the first metal plane conductor (1) in the first layer;
The third layer, the ceramic base body (11) is printed with three mutually insulated metal plane conductors, a sixth metal plane conductor (3 a), a seventh metal plane conductor (3 b) and an eighth metal plane conductor (3 e) are respectively arranged on the sixth metal plane conductor (3 a), a sixth metal plane conductor second end (3C) is arranged on the seventh metal plane conductor (3 b), a seventh metal plane conductor second end (3 d) is arranged on the eighth metal plane conductor (3 e), a seventh metal plane conductor second end (3 f) is arranged on the eighth metal plane conductor (3 e), the sixth metal plane conductor (3 a) and the second metal plane conductor (2C) and the fifth metal plane conductor (2 f) in the second layer form a bridging capacitor C2, the eighth metal plane conductor (3 e) and the fifth metal plane conductor (2 f) and the fourth metal plane conductor (2 e) in the second layer form a bridging capacitor C8, and the seventh metal plane conductor (3 b) and the fourth metal plane conductor (2 e) and the third metal plane conductor (2 d) in the second layer form a bridging capacitor C5;
A fourth layer, wherein three mutually insulated metal plane conductors are printed on the ceramic substrate (11), namely a ninth metal plane conductor (4 a), a tenth metal plane conductor (4C) and an eleventh metal plane conductor (4 d), a ninth metal plane conductor second end (4 b) is arranged on the ninth metal plane conductor (4 a), the ninth metal plane conductor (4 a) and a sixth metal plane conductor second end (3C) in the third layer are connected, and the ninth metal plane conductor second end (4 b) and a seventh metal plane conductor second end (3 d) in the third layer jointly form a series capacitor C7;
A fifth layer, the ceramic substrate (11) is printed with four mutually insulated metal plane conductors, a twelfth metal plane conductor (5 a), a thirteenth metal plane conductor (5 b), a fourteenth metal plane conductor (5 c) and a fifteenth metal plane conductor (5 d), the twelfth metal plane conductor (5 a) is connected with the first metal plane conductor (1) in the first layer through a first point column (7 a), the thirteenth metal plane conductor (5 b) is connected with the first metal plane conductor (1) in the first layer through a second point column (7 b), the fourteenth metal plane conductor (5 c) is connected with the first metal plane conductor (1) in the first layer through a third point column (7 c), the fifteenth metal plane conductor (5 d) is connected with the first metal plane conductor (1) in the first layer through a fourth point column (7 d), the twelfth metal plane conductor (5 a) is connected with the second metal plane conductor (2 c) in the second layer through a fifth point column (8 a), the thirteenth metal plane conductor (5 c) is connected with the first metal plane conductor (1) in the fourth layer through a third point column (7 c), the fifteenth metal plane conductor (5 d) is connected with the third metal plane conductor (2 d) in the second layer through an eighth point post (8 d);
A sixth layer, the ceramic substrate (11) is printed with four mutually insulated metal plane conductors, a sixteenth metal plane conductor (6 a), a seventeenth metal plane conductor (6 b), an eighteenth metal plane conductor (6 c) and a nineteenth metal plane conductor (6 d) are respectively printed, the sixteenth metal plane conductor (6 a) is connected with the twelfth metal plane conductor (5 a) in the fifth layer through a first point column (7 a), the seventeenth metal plane conductor (6 b) is connected with the thirteenth metal plane conductor (5 b) in the fifth layer through a second point column (7 b), the eighteenth metal plane conductor (6 c) is connected with the fourteenth metal plane conductor (5 c) in the fifth layer through a third point column (7 c), the nineteenth metal plane conductor (6 d) is connected with the fifteenth metal plane conductor (5 d) in the fifth layer through a fourth point column (7 d), and the metal plane conductors in the fifth layer and the sixth layer are jointly connected with the metal plane conductors in the first layer to form a grounding inductor L1, a grounding inductor L2, a grounding inductor L3 and a grounding inductor L4.
3. The filter according to claim 2, characterized in that: the sixth metal plane conductor (3 a), the seventh metal plane conductor (3 b) and the eighth metal plane conductor (3 e) are arranged in a delta shape.
4. The filter according to claim 2, characterized in that: the ninth metal plane conductor (4 a) is rectangular.
5. The filter according to claim 2, characterized in that: the tenth metal plane conductor (4 c) and the eleventh metal plane conductor (4 d) are kidney-shaped.
6. The filter according to claim 2, characterized in that: the twelfth metal plane conductor (5 a), the thirteenth metal plane conductor (5 b), the fourteenth metal plane conductor (5 c) and the fifteenth metal plane conductor (5 d) are all in long strips.
7. The filter according to claim 2, characterized in that: the twelfth metal plane conductor (5 a), the thirteenth metal plane conductor (5 b), the fourteenth metal plane conductor (5 c) and the fifteenth metal plane conductor (5 d) are arranged in parallel.
8. The filter according to claim 2, characterized in that: the sixteenth metal plane conductor (6 a), the seventeenth metal plane conductor (6 b), the eighteenth metal plane conductor (6 c) and the nineteenth metal plane conductor (6 d) are all in long strips.
9. The filter according to claim 2, characterized in that: the sixteenth metal plane conductor (6 a), the seventeenth metal plane conductor (6 b), the eighteenth metal plane conductor (6 c) and the nineteenth metal plane conductor (6 d) are arranged in parallel.
10. The filter according to claim 2, characterized in that: the sixteenth metal plane conductor (6 a), the seventeenth metal plane conductor (6 b), the eighteenth metal plane conductor (6 c) and the nineteenth metal plane conductor (6 d) are arranged in a vertically stacked manner with the twelfth metal plane conductor (5 a), the thirteenth metal plane conductor (5 b), the fourteenth metal plane conductor (5 c) and the fifteenth metal plane conductor (5 d) in the fifth layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410381445.2A CN117978116A (en) | 2024-04-01 | 2024-04-01 | Equivalent circuit of 5G symmetrical LTCC (Low temperature Co-fired ceramic) multilayer band-pass filter and filter |
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| CN202410381445.2A CN117978116A (en) | 2024-04-01 | 2024-04-01 | Equivalent circuit of 5G symmetrical LTCC (Low temperature Co-fired ceramic) multilayer band-pass filter and filter |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104579220A (en) * | 2015-02-03 | 2015-04-29 | 深圳市麦捷微电子科技股份有限公司 | Multilayer ceramic dielectric sheet type low-pass filter |
| CN215601279U (en) * | 2021-04-08 | 2022-01-21 | 深圳市信维通信股份有限公司 | LTCC band-pass filter and communication terminal |
| CN117200729A (en) * | 2023-09-28 | 2023-12-08 | 深圳市麦捷微电子科技股份有限公司 | Ultra-small band-pass filter for 5G module based on LTCC technology |
| CN117525780A (en) * | 2023-12-08 | 2024-02-06 | 深圳市麦捷微电子科技股份有限公司 | Novel 5G LTCC band-pass filter |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104579220A (en) * | 2015-02-03 | 2015-04-29 | 深圳市麦捷微电子科技股份有限公司 | Multilayer ceramic dielectric sheet type low-pass filter |
| CN215601279U (en) * | 2021-04-08 | 2022-01-21 | 深圳市信维通信股份有限公司 | LTCC band-pass filter and communication terminal |
| CN117200729A (en) * | 2023-09-28 | 2023-12-08 | 深圳市麦捷微电子科技股份有限公司 | Ultra-small band-pass filter for 5G module based on LTCC technology |
| CN117525780A (en) * | 2023-12-08 | 2024-02-06 | 深圳市麦捷微电子科技股份有限公司 | Novel 5G LTCC band-pass filter |
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