CN117954362A - Automatic feeding and discharging system and method for wafer processing - Google Patents

Abstract

The invention discloses an automatic feeding and discharging system and method for wafer processing, comprising a lifting unit, a positioning unit, a clamping jaw unit, a rotating unit, a basket and a horizontal module, wherein the basket is of a multi-layer structure, an iron ring is arranged in each layer of basket for storing wafers, the rotating unit is fixed on the horizontal module, the clamping jaw unit is driven by the horizontal module, the clamping jaw unit horizontally moves for clamping the iron ring, the rotating unit adsorbs the iron ring and places the iron ring on a loading level, the lifting unit comprises a bottom plate, the lifting module and a drawer, the bottom plate is horizontally arranged on the lifting module, the drawer is connected to a drawer box at the bottom of the bottom plate in a sliding manner, the drawer is used for sampling wafers, the basket is placed on the bottom plate, the lifting module drives the whole lifting unit to move up and down so that the basket is flush with the positioning unit, and after the processing of the previous wafers is finished, the rotating unit simultaneously completes feeding and discharging the iron ring is pushed to the basket, and the wafer pollution and wafer breakage risks caused by frequently taking the basket are effectively reduced.

Description

Automatic feeding and discharging system and method for wafer processing

Technical Field

The invention relates to the technical field of wafer processing, in particular to an automatic feeding and discharging system and method for wafer processing.

Background

The feeding and discharging system in the wafer processing is an important device in the semiconductor manufacturing process, and is mainly used for taking out the wafer from the carrier and placing the wafer into the processing device, or taking out the processed wafer from the processing device and placing the processed wafer back into the carrier, and the efficient, stable and accurate feeding and discharging system can improve the production efficiency and the product quality of the wafer processing and reduce the risk of wafer damage.

An automatic wafer loading and unloading system is proposed in the prior patent with the application number 202020497028.1, and comprises a lifting mechanism, a fixing frame, a material tray, a sliding shaft, a clamping mechanism and a carrying table. According to the system, the lifting mechanism is adopted to move the material tray, the clamping mechanism is adopted to move, the wafers are sequentially taken out and placed at the limiting positions on the carrying table, so that an automatic loading and unloading system is realized, but the system does not clearly show how to move the material tray from the carrying table to a required processing platform, the system does not have equipment universality, the requirement on the hardware structure of equipment is high, and the system portability is not strong.

A wafer blanking mechanism is proposed in the prior patent application number 202223321984.2, and includes a platform, a lifting mechanism, a wafer box, and a pick-and-place mechanism. The mechanism utilizes the elevating system to control the lifting of the wafer box, ensures that each wafer in the wafer box is at the same horizontal height when being grabbed, and the picking and placing mechanism replaces the used wafer in the wafer box to form closed-loop feeding and discharging, but the mechanism needs to take down the whole wafer box in the working condition of sampling inspection of the wafer, and then samples the wafer to be inspected from the wafer box to complete sampling inspection, so that the sampling inspection device is not strong in applicability and easy to generate fragment risks.

Disclosure of Invention

In order to meet the above-mentioned needs of the prior art or improve, the invention provides an automatic feeding and discharging system and method for wafer processing, in order to achieve the above-mentioned purpose, the system includes lifting unit, locating unit, clamping jaw unit, rotating unit, basket, horizontal module, basket is placed on lifting unit, basket is multilayer structure, set up the iron ring in basket of every layer, level that basket needs to spot check is flush with locating unit through lifting unit, rotating unit is fixed on horizontal module, clamping jaw unit is driven by horizontal module and moves to near basket horizontally, clamping jaw unit clamps the iron ring and moves to locating unit return to the zero position, rotating unit adsorbs the iron ring on the locating unit and rotates and place it to the material loading position of processing platform, when processing the wafer of processing platform, repeat the step and transport the iron ring from basket to locating unit and press from the clamp waiting, after last wafer processing is accomplished, rotating unit finishes material loading and unloading simultaneously, and pushes down the iron ring to basket by clamping jaw unit, the risk of getting the wafer that frequent lifting is produced is effectively reduced.

As one aspect of the invention, the invention provides an automatic feeding and discharging system for wafer processing, which comprises a lifting unit, a positioning unit, a clamping jaw unit, a rotating unit, a material basket and a horizontal module, wherein the material basket is of a multi-layer structure, an iron ring is arranged in each layer of material basket for storing wafers, the rotating unit is fixed on the horizontal module, the clamping jaw unit is driven by the horizontal module, the clamping jaw unit moves horizontally for clamping the iron ring, and the rotating unit adsorbs the iron ring and places the iron ring on a loading position;

The lifting unit comprises a bottom plate, a lifting module and a drawer, wherein the bottom plate is horizontally arranged on the lifting module, the drawer is connected to a drawer box at the bottom of the bottom plate in a sliding manner, the drawer is used for carrying out spot inspection on the wafer, the bottom plate is fixed with the drawer box, the basket is placed on the bottom plate, and the lifting module drives the whole lifting unit to move up and down so that the basket is flush with the positioning unit; the positioning unit comprises a base with the bottom, a first guide rail and a second guide rail which are fixed on the base, the lifting unit drives the first layer basket to be flush with the first guide rail and the second guide rail, and the clamping jaw unit clamps the iron ring to translate along the first guide rail and the second guide rail; the rotary unit comprises a rotary motor, a feeding assembly and a discharging assembly, wherein the rotary motor is fixed on the horizontal module, and the rotary motor drives the feeding assembly and the discharging assembly to finish feeding and discharging in a horizontal plane conversion position.

Further, the positioning unit comprises a clamping cylinder and a fifth sensor, wherein the clamping cylinder is fixed on the base and is positioned between the first guide rail and the second guide rail; the fifth sensor is arranged on the first guide rail and the second guide rail, and the clamping jaw unit is loosened when the iron ring contacts with the fifth sensor.

Further, the positioning unit comprises a code scanning gun, the code scanning gun is fixed on the base and is located above the first guide rail and the second guide rail, and the code scanning gun is used for identifying the information mark of the wafer.

Further, the feeding assembly comprises a feeding sucker and a feeding suction nozzle which are arranged at the end part of the feeding cylinder, and the discharging assembly comprises a discharging sucker and a discharging suction nozzle which are arranged at the end part of the discharging cylinder.

Further, the lifting unit comprises a reflecting plate and a first sensor, the first sensor is arranged above the bottom plate, the reflecting plate is arranged at the lower part of the bottom plate, the first sensor corresponds to the reflecting plate in position, and the first sensor and the reflecting plate are used for monitoring whether the iron ring in the material basket protrudes from the material basket or not.

Further, the clamping jaw unit comprises a clamping jaw air cylinder, the clamping jaw air cylinder drives the clamping jaw to open and close, and the clamping jaw air cylinder is arranged on the horizontal module.

Further, the clamping jaw unit comprises a magnetic switch, and the magnetic switch is arranged on the clamping jaw cylinder and used for monitoring the opening and closing states of the clamping jaw cylinder.

Further, the lifting unit comprises a second sensor, the second sensor is arranged on the inner wall of the drawer box, and the second sensor detects whether the iron ring exists in the drawer.

According to another aspect of the present invention, there is provided an automatic loading and unloading method for wafer processing, comprising the steps of:

S100, adjusting the height of the material basket to align, placing the material basket on the bottom plate, and driving the whole lifting unit and the material basket to move up and down by the lifting module so that the material basket is flush with the first guide rail and the second guide rail;

s200, conveying the iron ring, driving the clamping jaw units to move forwards to the material basket by the horizontal module, clamping the iron ring by the clamping jaw units, and then driving the clamping jaw units to move to the first guide rail and the second guide rail by the horizontal module;

S300, when the clamping jaw cylinder clamps the iron ring to move to contact the fifth sensor, the clamping jaw cylinder is loosened, the horizontal module drives the clamping jaw unit to move back, and the clamping cylinder drives the first guide rail and the second guide rail to clamp and position the iron ring;

S400, feeding and discharging operations, wherein the rotating motor rotates the feeding assembly to a feeding level, the feeding sucker is driven by the feeding cylinder to move downwards until the feeding suction nozzle contacts the iron ring, at the moment, the feeding suction nozzle vacuumizes and sucks the iron ring, the clamping cylinder loosens the first guide rail and the second guide rail, and the feeding cylinder carries the iron ring to return to the original position; the rotary motor rotates to a feeding position of the processing platform, the feeding cylinder descends to place the wafer with the iron ring on the processing platform, the feeding suction nozzle is broken in vacuum, and the feeding cylinder returns to the original position to finish the transfer of the iron ring and the wafer; finally, the rotating motor rotates to drive the feeding sucker and the discharging sucker to return to zero positions; when a first wafer is processed, repeatedly conveying the iron ring to the fifth sensor on the positioning unit for waiting for the material level and clamping by a clamping cylinder, after the wafer processing is completed, rotating the rotating motor to a material discharging position, driving the material discharging sucker to move downwards by the material discharging cylinder until the material discharging sucker contacts the iron ring, simultaneously vacuumizing the material feeding sucker and the material discharging sucker, loosening the first guide rail and the second guide rail by the clamping cylinder, simultaneously sucking the iron ring by the suction nozzles in the material feeding assembly and the material discharging assembly, driving the material feeding assembly and the material discharging assembly to rotate by the rotating motor, and simultaneously completing material feeding and material discharging; the clamping jaw is driven by the horizontal module to push the blanking iron ring to the drawer or the material basket, so that the loading and unloading of the wafer are completed.

Further, the S includes S: after the clamping cylinder drives the first guide rail and the second guide rail to clamp the iron ring, the clamping jaw cylinder clamps the iron ring again, and then the clamping cylinder is loosened to perform positioning.

In general, the above technical solutions conceived by the present invention, compared with the prior art, enable the following beneficial effects to be obtained:

1. The invention provides an automatic feeding and discharging system for wafer processing, which comprises a lifting unit, a positioning unit, a clamping jaw unit, a rotating unit, a material basket and a horizontal module, wherein the material basket is placed on the lifting unit, the material basket is of a multi-layer structure, an iron ring is arranged in each layer of material basket and used for storing wafers, the lifting unit is used for leveling the level of the material basket required to be subjected to spot inspection with the positioning unit, the rotating unit is fixed on the horizontal module, the clamping jaw unit is driven by the horizontal module and horizontally moves to be close to the material basket, the clamping jaw unit clamps the iron ring to move to the zero position of the positioning unit, the rotating unit adsorbs the iron ring on the positioning unit and rotates to place the iron ring on a material loading position of a processing platform, when the processing platform processes the wafers, the iron ring is repeatedly conveyed from the material basket to the positioning unit and clamped and waits, and after the processing of the previous wafers, the rotating unit simultaneously completes feeding and discharging the iron ring is pushed to the material basket by the clamping jaw unit, so that the pollution and the risk of wafers produced by frequently lifting the material basket are effectively reduced.

2. The invention provides an automatic feeding and discharging system for wafer processing, which comprises a rotating unit, wherein the rotating unit comprises a rotating motor, a feeding assembly and a discharging assembly, the rotating motor is fixed on a horizontal module, the feeding assembly and the discharging assembly are arranged in an included angle, the rotating motor drives the feeding assembly and the discharging assembly to change positions in a horizontal plane, the feeding and discharging synchronous operation is completed, the problem of lower processing efficiency when the wafers are manually conveyed is solved, and the processing cost is reduced.

3. The invention provides an automatic feeding and discharging method for wafer processing, which provides a drawer sampling inspection function in the automatic feeding and discharging of the wafer processing, avoids taking out the whole basket and then extracting the wafer for inspection, can select any wafer at any time and send the wafer into a drawer, performs wafer inspection on the premise of not moving the basket, and reduces the risk of breaking the wafer due to repeated material lifting and taking of the basket.

Drawings

FIG. 1 is a schematic diagram of an automatic loading and unloading system for wafer processing according to an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of a lifting unit in an automatic loading and unloading system for wafer processing according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a positioning unit in an automatic loading and unloading system for wafer processing according to an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a clamping jaw unit in an automatic loading and unloading system for wafer processing according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a rotary unit in an automatic loading and unloading system for wafer processing according to an embodiment of the present invention;

Fig. 6 is a flow chart of automatic loading and unloading for wafer processing according to an embodiment of the present invention.

Like reference numerals denote like technical features throughout the drawings, in particular: 1. a lifting unit; 2. a positioning unit; 3. a jaw unit; 4. a rotating unit; 5. a basket; 6. a horizontal module; 101. a bottom plate; 102. a lifting module; 1031. a light reflecting plate; 1032. a first sensor; 104. a second sensor; 105. a drawer; 106. a third sensor; 2011. a first guide rail; 2012. a second guide rail; 202. a code scanning gun; 203. a fourth sensor; 204. a clamping cylinder; 205. a fifth sensor; 301. a clamping jaw cylinder; 302. a magnetic switch; 401. a rotating electric machine; 402. feeding sucking discs; 403. discharging a sucker; 404. a blanking cylinder; 405. a feeding cylinder; 406. a feeding suction nozzle; 407. and (5) discharging a suction nozzle.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.

As shown in fig. 1-6, the embodiment of the invention provides an automatic feeding and discharging system for wafer processing, which comprises a lifting unit 1, a positioning unit 2, a clamping jaw unit 3, a rotating unit 4, a material basket 5 and a horizontal module 6, wherein the material basket 5 is placed on the lifting unit 1, the material basket 5 is in a multi-layer structure, an iron ring is arranged in each layer of material basket 5 and used for storing wafers, the lifting unit 1 is used for flushing the level of the material basket 5 required for sampling with the positioning unit 2, the rotating unit 4 is fixed on the horizontal module 6, the clamping jaw unit 3 is driven by the horizontal module 6 and horizontally moves to be close to the material basket 5, the clamping jaw unit 3 clamps the iron ring to move to the positioning unit 2 and returns to a zero position to ensure that the clamping jaw unit 4 does not interfere with the rotating unit 4, the iron ring on the positioning unit 2 is adsorbed by the rotating unit 4 and rotates to be placed on the material loading position of a processing platform, when the processing platform processes wafers, the iron ring is repeatedly clamped and waiting from the material basket 5 to the positioning unit 2, after the previous wafer processing is completed, the rotating unit 4 simultaneously completes the material loading and the material unloading, the iron ring is pushed by the lifting unit 3 to the drawer to the material basket 5 for sampling and the material basket is not repeatedly pumped and the material basket is required to be repeatedly removed after the wafer is not required to be sampled.

Further, as shown in fig. 1 and 2, the lifting unit 1 includes a bottom plate 101, a lifting module 102, a light reflecting plate 1031, a first sensor 1032, a second sensor 104, a drawer 105, and a third sensor 106, wherein the bottom plate 101 is horizontally arranged on the lifting module 102, the drawer 105 is slidably connected to a drawer box at the bottom of the bottom plate 101, the bottom plate 101 is fixed to the drawer box, the basket 5 is placed on the bottom plate 101, and the lifting module 102 is used for driving the whole lifting unit 1 to move up and down so that the basket 5 is flush with the positioning unit 2; the first sensor 1032 is arranged above the bottom plate 101, the light reflecting plate 1031 is arranged at the lower part of the bottom plate 101, the first sensor 1032 corresponds to the light reflecting plate 1031 in position, and the first sensor 1032 and the light reflecting plate 1031 are used for monitoring whether the iron ring in the material basket 5 protrudes from the material basket 5 or not; the second sensor 104 is arranged on the inner wall of the drawer box, and the second sensor 104 is used for detecting whether an iron ring exists in the drawer 105 or not; further, the drawer 105 is used for sampling single wafer, and the wafer to be inspected can be sampled without taking down the whole basket 5; further, 4 third sensors 106 are arranged and are respectively positioned at the periphery of the bottom plate 101 and used for detecting whether the basket 5 is flat or not; by arranging a plurality of groups of sensors, whether the iron ring and the basket 5 are in the correct position or not can be monitored.

Further, as shown in fig. 1, 3 and 4, the positioning unit 2 includes a base with a bottom, and a first guide rail 2011, a second guide rail 2012, a code scanning gun 202, a fourth sensor 203, a clamping cylinder 204 and a fifth sensor 205, the clamping jaw unit includes a clamping jaw cylinder 301 and a magnetic switch 302, wherein the first guide rail 2011 and the second guide rail 2012 are horizontally fixed on the base, the lifting unit 1 drives the clamping slot of the first layer basket 5 to be flush with the first guide rail 2011 and the second guide rail 2012, the iron ring translates on the first guide rail 2011 and the second guide rail 2012, preferably, the maximum distance between the first guide rail 2011 and the second guide rail 2012 is greater than the width of the iron ring by more than 5mm, the fifth sensor 205 is embedded in the two guide rails, when the iron ring moves to contact with the fifth sensor 205 on the two guide rails, the clamping jaw cylinder 301 arranged on the horizontal module 6 is loosened, and the horizontal module 6 drives the clamping jaw unit 3 to move to a zero position to prevent interference with the rotating unit 4; the clamping jaw cylinder 301 is used for driving the clamping jaw to open and close, the magnetic switch 302 is arranged on the clamping jaw cylinder 301 and used for monitoring whether the clamping jaw cylinder 301 is opened or closed in place, and preferably, the clamping jaw cylinder 301 is arranged in a section of 5mm above and below a plane where the first guide rail 2011 and the second guide rail 2012 are located; the code scanning gun 202 is fixed on the base by adopting a bracket and is positioned above the first guide rail 2011 and the second guide rail 2012, and is used for identifying information marks of wafers passing through the two guide rails; the fourth sensor 203 and the clamping cylinder 204 are fixed on the base, are located in the middle of the first guide rail 2011 and the second guide rail 2012 and are lower than the upper surfaces of the two guide rails, the fourth sensor 203 is used for scanning the specific positions and the number of the iron rings in the whole basket 5 so as to improve the efficiency of obtaining the iron rings, the clamping cylinder 204 is used for limiting the position error of the iron rings, preferably, the error is ensured to be within +/-1 mm, the passing position precision of the iron rings can be accurately controlled through the positioning unit 2, the wafer information is recorded, and support is provided for accurately completing the feeding and discharging operation of the rotating unit 4.

Further, as shown in fig. 1-5, the rotating unit 4 includes a rotating motor 401, a feeding component and a discharging component, wherein the rotating motor 401 is fixed on the horizontal module 6, the feeding component and the discharging component are disposed at an included angle of 180 °, the rotating motor 401 drives the feeding component and the discharging component to change positions in a horizontal plane, the feeding component includes a feeding suction cup 402 and a feeding suction nozzle 406 disposed at an end of a feeding cylinder 405, and the discharging component includes a discharging suction cup 403 and a discharging suction nozzle 407 disposed at an end of a discharging cylinder 404; the rotating motor 401 completes the synchronous feeding and discharging operation by driving the feeding assembly and the discharging assembly, so that the risk that the wafer is polluted and broken when the wafer is manually conveyed is solved, the processing efficiency is improved, and the processing cost is reduced.

As another aspect of the present invention, the present invention provides an automatic loading and unloading method for wafer processing, the method comprising the steps of:

S100, adjusting the height of the material basket 5 to align, placing the material basket 5 on the bottom plate 101, and driving the whole lifting unit 1 and the material basket 5 to move up and down by the lifting module 102 so that the clamping groove position of the material basket 5 is flush with the first guide rail 2011 and the second guide rail 2012;

S200, conveying the iron ring, driving the clamping jaw unit 3 to move forwards from a zero position to the material basket 5 by the horizontal module 6, clamping the iron ring by the clamping jaw unit 3, and driving the clamping jaw unit 3 to move onto the first guide rail 2011 and the second guide rail 2012 by the horizontal module 6;

S300, positioning an iron ring, when the clamping jaw cylinder 301 clamps the iron ring and moves to contact with the fifth sensor 205, the clamping jaw cylinder 301 is loosened, the horizontal module 6 drives the clamping jaw unit 3 to move back to a zero position, and the clamping cylinder 204 drives the first guide rail 2011 and the second guide rail 2012 to clamp and position the iron ring;

S301, after the clamping cylinder 204 drives the first guide rail 2011 and the second guide rail 2012 to clamp the iron ring, the clamping jaw cylinder 301 clamps the iron ring again, and then the clamping cylinder 204 is loosened to position the iron ring;

S400, feeding and discharging operations, wherein a rotary motor 401 rotates a feeding assembly to a feeding level, a feeding sucker 402 is driven by a feeding cylinder 405 to move downwards until a feeding suction nozzle 406 contacts an iron ring, at the moment, the feeding suction nozzle 406 vacuumizes and sucks the iron ring, a clamping cylinder 204 loosens a first guide rail 2011 and a second guide rail 2012, and the feeding cylinder 405 carries the iron ring to return to the original position; further, the rotating motor 401 rotates to the feeding position of the processing platform, the feeding cylinder 405 descends to place the wafer with the iron ring on the processing platform, the feeding suction nozzle 406 is broken in vacuum, and the feeding cylinder 405 returns to the original position to finish the transfer of the iron ring and the wafer; finally, the rotary motor 401 rotates to drive the feeding sucker 402 and the discharging sucker 403 to return to zero positions; when a first wafer is processed, repeatedly conveying the iron ring to a fifth sensor 205 on the positioning unit 2 for waiting for the material level and clamping by a clamping cylinder 204, after the wafer is processed, rotating a rotary motor 401 to a discharging material level, and driving a discharging sucker 403 to move downwards by a discharging cylinder 404 until the discharging sucker 407 contacts the iron ring, wherein the feeding sucker 406 and the discharging sucker 407 are vacuumized at the same time, the clamping cylinder 204 loosens a first guide rail 2011 and a second guide rail 2012, and suction nozzles in a feeding assembly and a discharging assembly suck the iron ring at the same time, and the rotary motor 401 drives the two assemblies to rotate 180 degrees to finish feeding and discharging at the same time; further, the clamping jaw 301 is driven by the horizontal module 6, and pushes the blanking iron ring to the drawer 105 or the basket 5 according to the mode selected by the system at the beginning, and the like, so as to complete the loading and unloading of all wafers.

It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.

Claims (10)

1. The automatic feeding and discharging system for wafer processing is characterized by comprising a lifting unit (1), a positioning unit (2), clamping jaw units (3), a rotating unit (4), material baskets (5) and a horizontal module (6), wherein each material basket (5) is of a multi-layer structure, an iron ring is arranged in each material basket (5) and used for storing wafers, the rotating unit (4) is fixed on the horizontal module (6), the clamping jaw units (3) are driven by the horizontal module (6), the clamping jaw units (3) move horizontally and are used for clamping the iron rings, and the rotating unit (4) adsorbs the iron rings and places the iron rings at a loading position;

The lifting unit (1) comprises a bottom plate (101), a lifting module (102) and a drawer (105), wherein the bottom plate (101) is horizontally arranged on the lifting module (102), the drawer (105) is connected to a drawer box at the bottom of the bottom plate (101) in a sliding manner, the drawer (105) is used for carrying out spot inspection on the wafer, the bottom plate (101) is fixed with the drawer box, the material basket (5) is placed on the bottom plate (101), and the lifting module (102) drives the whole lifting unit (1) to move up and down so that the material basket (5) is flush with the positioning unit (2); the positioning unit (2) comprises a base with the bottom, a first guide rail (2011) and a second guide rail (2012) which are fixed on the base, the lifting unit (1) drives the first layer basket (5) to be flush with the first guide rail (2011) and the second guide rail (2012), and the clamping jaw unit (3) clamps the iron ring to translate along the first guide rail (2011) and the second guide rail (2012); the rotary unit (4) comprises a rotary motor (401), a feeding assembly and a discharging assembly, wherein the rotary motor (401) is fixed on the horizontal module (6), and the rotary motor (401) drives the feeding assembly and the discharging assembly to finish feeding and discharging in a horizontal plane conversion position.

2. An automatic loading and unloading system for wafer processing according to claim 1, characterized in that the positioning unit (2) comprises a clamping cylinder (204) and a fifth sensor (205), the clamping cylinder (204) being fixed to the base, the clamping cylinder (204) being located in the middle of the first guide rail (2011), the second guide rail (2012); the fifth sensor (205) is arranged on the first guide rail (2011) and the second guide rail (2012), and the clamping jaw unit (3) is loosened when the iron ring contacts the fifth sensor (205).

3. An automatic loading and unloading system for wafer processing according to claim 2, wherein the positioning unit (2) comprises a code scanning gun (202), the code scanning gun (202) is fixed on the base and is located above the first guide rail (2011) and the second guide rail (2012), and the code scanning gun (202) is used for identifying the information identification of the wafer.

4. The automatic loading and unloading system for wafer processing according to claim 1, wherein the loading assembly comprises a loading suction cup (402) and a loading suction nozzle (406) arranged at the end of a loading cylinder (405), and the unloading assembly comprises a unloading suction cup (403) and a unloading suction nozzle (407) arranged at the end of an unloading cylinder (404).

5. The automatic loading and unloading system for wafer processing according to claim 1, wherein the lifting unit (1) comprises a light reflecting plate (1031) and a first sensor (1032), the first sensor (1032) is arranged above the bottom plate (101), the light reflecting plate (1031) is arranged at the lower part of the bottom plate (101), the first sensor (1032) corresponds to the light reflecting plate (1031) in position, and the first sensor (1032) and the light reflecting plate are used for monitoring whether the iron ring in the basket (5) protrudes from the basket (5).

6. An automatic loading and unloading system for wafer processing according to claim 3, characterized in that the clamping jaw unit (3) comprises a clamping jaw cylinder (301), the clamping jaw cylinder (301) drives clamping jaws to open and close, and the clamping jaw cylinder (301) is arranged on the horizontal module (6).

7. An automatic loading and unloading system for wafer processing according to claim 6, characterized in that the clamping jaw unit (3) comprises a magnetic switch (302), the magnetic switch (302) being arranged on the clamping jaw cylinder (301) for monitoring the open and closed state of the clamping jaw cylinder (301).

8. An automatic loading and unloading system for wafer processing according to any one of claims 1-7, characterized in that the lifting unit (1) comprises a second sensor (104), the second sensor (104) being arranged on the inner wall of the drawer box, the second sensor (104) detecting the presence or absence of the iron ring in the drawer (105).

9. An automatic loading and unloading method for wafer processing, characterized in that the method is implemented by using an automatic loading and unloading system for wafer processing according to any one of claims 1-8, and comprises the following steps:

S100, adjusting the height of the material basket (5) to align, placing the material basket (5) on the bottom plate (101), and driving the whole lifting unit (1) and the material basket (5) to move up and down by the lifting module (102) so that the material basket (5) is flush with the first guide rail (2011) and the second guide rail (2012);

S200, conveying the iron ring, driving the clamping jaw unit (3) to move forwards to the material basket (5) by the horizontal module (6), clamping the iron ring by the clamping jaw unit (3), and then driving the clamping jaw unit (3) to carry the iron ring to move onto the first guide rail (2011) and the second guide rail (2012) by the horizontal module (6);

s300, when the clamping jaw cylinder (301) clamps the iron ring to move to contact with the fifth sensor (205), the clamping jaw cylinder (301) is loosened, the horizontal module (6) drives the clamping jaw unit (3) to move back, and the clamping cylinder (204) drives the first guide rail (2011) and the second guide rail (2012) to clamp and position the iron ring;

S400, feeding and discharging operations, wherein the rotating motor (401) rotates the feeding assembly to a feeding level, the feeding sucker (402) is driven by the feeding cylinder (405) to move downwards until the feeding suction nozzle (406) contacts the iron ring, at the moment, the feeding suction nozzle (406) vacuumizes and sucks the iron ring, the clamping cylinder (204) loosens the first guide rail (2011) and the second guide rail (2012), and the feeding cylinder (405) carries the iron ring to return to the original position; the rotary motor (401) rotates to a loading position of the processing platform, the loading cylinder (405) descends to place the wafer with the iron ring on the processing platform, the loading suction nozzle (406) breaks in vacuum, and the loading cylinder (405) returns to the original position to finish the transfer of the iron ring and the wafer; finally, the rotating motor (401) rotates to drive the feeding sucker (402) and the discharging sucker (403) to return to zero positions; when a first wafer is processed, repeatedly conveying the iron ring to the fifth sensor (205) on the positioning unit (2) for waiting for the material level and clamping the iron ring by the clamping cylinder (204), after the wafer is processed, rotating the rotating motor (401) to a material discharging position, and driving the material discharging sucker (403) to move downwards by the material discharging cylinder (404) until the material discharging sucker (407) contacts the iron ring, wherein the material feeding sucker (406) and the material discharging sucker (407) vacuumize at the same time, the clamping cylinder (204) loosens the first guide rail (2011) and the second guide rail (2012), and the suction nozzles in the material feeding assembly and the material discharging assembly suck the iron ring at the same time, and the rotating motor (401) drives the material feeding assembly and the material discharging assembly to rotate 180 degrees and completes material feeding and material discharging at the same time; the clamping jaw is driven by the horizontal module (6) to push the blanking iron ring to the drawer (105) or the basket (5), so that the loading and unloading of the wafer are completed.

10. The automatic loading and unloading method for wafer processing according to claim 9, wherein S300 includes S301: after the clamping cylinder (204) drives the first guide rail (2011) and the second guide rail (2012) to clamp the iron ring, the clamping jaw cylinder (301) clamps the iron ring again, and then the clamping cylinder (204) is loosened to position.