CN117921127A

CN117921127A - Hydrogen furnace for welding semiconductors

Info

Publication number: CN117921127A
Application number: CN202311716357.5A
Authority: CN
Inventors: 梁聪元; 罗文欣; 彭招良
Original assignee: Shenzhen Haobao Technology Co ltd
Current assignee: Shenzhen Haobao Technology Co ltd
Priority date: 2023-12-13
Filing date: 2023-12-13
Publication date: 2024-04-26

Abstract

The present invention provides a hydrogen furnace for soldering semiconductors, comprising: the device comprises a rack, and an upper cavity and a lower cavity which are connected with the rack; the welding platform and the cooling platform are symmetrically arranged in the working cavity in parallel along the horizontal direction and are horizontally connected with the lower cavity; the transport mechanism, connect in lower cavity includes: a transfer frame, a jacking component and a transfer component; the transfer assembly includes: gear, rack, transmission shaft and move and carry driving piece. According to the invention, the lifting assembly drives the transfer frame to move up and down, and the gear is rotated to enable the rack and the transfer frame connected with the rack to move horizontally, so that materials are transferred from the welding platform to the cooling platform, and the transfer driving piece is positioned outside the working cavity, so that the service lives of the transfer driving piece and the hydrogen furnace are ensured, the working cavity is not influenced during maintenance, resources are saved, and the maintenance difficulty and cost are reduced.

Description

Hydrogen furnace for welding semiconductors

Technical Field

The invention relates to the field of semiconductor hydrogen welding, in particular to a hydrogen furnace for welding semiconductors.

Background

Semiconductor bonding is a common electronic device manufacturing process used to connect semiconductor chips to other electronic components or circuit boards. The welding of the semiconductor needs to heat the welding flux to the melting point, so that the welding flux is contacted with the welding surface and cooled and solidified, the process is extremely easy to cause oxidation of the welding surface, further the welding quality is affected, and the ideal welding requirement can be met by processing the welding flux in a hydrogen protection environment, so that a hydrogen furnace is a device with larger requirements in the semiconductor welding industry.

The existing hydrogen furnace generally sets a driving piece for horizontally moving materials in a working cavity, and heat of the working cavity in a sealing state is accumulated, so that the driving piece is easy to damage, the hydrogen furnace is damaged, and the materials are not timely separated from a welding platform, so that the materials are excessively heated and damaged; and the working cavity is in a vacuum state, hydrogen exists in the working cavity when the hydrogen furnace works, and the maintenance of the driving piece is performed after the hydrogen is required to be emptied, so that the maintenance is difficult, the resources are wasted and the maintenance cost is increased.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a hydrogen furnace for welding semiconductors, so as to solve the technical problems of easy failure, difficult maintenance and high maintenance cost of the existing hydrogen furnace.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

A hydrogen furnace for soldering semiconductors, comprising:

The device comprises a rack, an upper cavity and a lower cavity, wherein the upper cavity and the lower cavity are connected to the rack, and the upper cavity is positioned above the lower cavity and is connected to the lower cavity in a sealing manner; a working cavity is formed between the upper cavity and the lower cavity;

The welding platform and the cooling platform are symmetrically arranged in the working cavity in parallel along the horizontal direction and are horizontally connected with the lower cavity;

the transport mechanism, connect in lower cavity includes: a transfer frame, a jacking component and a transfer component; the transferring frame is horizontally arranged above the welding platform and the cooling platform, and the jacking component is arranged corresponding to the transferring frame and is positioned at one side of the lower cavity far away from the upper cavity; the jacking component and the transferring component vertically penetrate through the lower cavity and are connected with the transferring frame; the jacking component is used for driving the transfer frame to execute lifting action, and the transfer component is used for driving the transfer frame to reciprocate between the welding platform and the cooling platform;

The transfer assembly includes: the device comprises a gear, a rack, a transmission shaft and a transfer driving piece; the rack is arranged in the working cavity, is arranged along the direction from the welding platform to the cooling platform, and is fixedly connected to one end of the transfer frame far away from the center of the transfer frame; the gear is horizontally arranged in the working cavity, and the rack is meshed with the gear; the transmission shaft vertically penetrates through the lower cavity, one end of the transmission shaft is fixedly connected with the center of the gear, and the other end of the transmission shaft is connected with the transfer driving piece; the transfer driving piece is used for driving the gear to rotate.

Wherein, handling mechanism still includes: two slide bars; the two sliding rods are symmetrically arranged in the working cavity; the sliding rod is movably connected to the lower cavity, and the sliding rod and the rack are arranged in parallel; the transfer frame is connected with the sliding rod in a sliding manner, and the jacking component is connected with the sliding rod.

The gear and the rack are positioned on one side of the sliding rod away from the welding platform and the cooling platform, the gear is arranged between the welding platform and the cooling platform, and the rack extends from the gear to one end of the welding platform or the cooling platform away from the gear.

Wherein, the jacking subassembly includes: four lifting rods, a connecting plate and a jacking driving piece; the connecting plate is arranged on one side, far away from the upper cavity, of the lower cavity, and a space exists between the connecting plate and the lower cavity; the lifting rods penetrate through the lower cavity, four lifting rods are correspondingly arranged at two ends of the two sliding rods, one ends of the lifting rods are connected with the sliding rods, and the other ends of the lifting rods are fixedly connected with the connecting plates; the jacking driving piece is used for driving the connecting plate to execute lifting action.

Wherein, move and carry the frame and include: two sleeves, a plurality of connecting rods and connecting blocks; the two sleeves are respectively sleeved on the two sliding rods, two ends of the connecting rod are respectively connected with the two sleeves, one end of the connecting block is connected with the sleeve, and the other end of the connecting block is connected with the rack.

The number of the shifting components is two, the two shifting components are symmetrically arranged on two sides of the shifting frame, and two ends of the shifting frame are respectively connected with the two shifting components.

Wherein, move and carry the subassembly still includes: the device comprises a mounting seat, a synchronous rod, two first bevel gears and two second bevel gears; the mounting seat is fixedly connected to one side, far away from the upper cavity, of the lower cavity and is positioned below the connecting plate; the transmission shaft penetrates through the mounting seat; the synchronous rod is horizontally arranged and rotationally connected to one side, far away from the lower cavity, of the mounting seat; the first bevel gear is fixedly connected to one end, far away from the gear, of the transmission shaft, and the second bevel gear is fixedly connected to the synchronizing rod and meshed with the first bevel gear; the transfer driving piece is used for driving the synchronous rod to rotate.

The lower cavity is far away from one side of the upper cavity, a plurality of through holes and a plurality of sealing elements are arranged on one side of the lower cavity, the through holes correspond to the transmission shaft and the lifting rod, the sealing elements are arranged in the through holes, and the transmission shaft and the lifting rod penetrate through the sealing elements.

Wherein, the upper cavity is provided with a lifting mechanism and a locking mechanism; the lifting mechanism is arranged on one side of the upper cavity, which is far away from the lower cavity, and is used for driving the upper cavity to be far away from or close to the lower cavity; the locking mechanism is used for locking or unlocking the upper cavity and the lower cavity.

Wherein, the lower cavity is also provided with a hydrogen pipe, a nitrogen pipe and a vacuum pipe; the hydrogen pipe and the nitrogen pipe are respectively used for filling hydrogen and nitrogen into the working cavity; the vacuum tube is used for vacuumizing the working cavity.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, the lifting assembly drives the transfer frame to move up and down, and the gear is rotated to enable the rack and the transfer frame connected with the rack to move horizontally, so that materials are transferred from the welding platform to the cooling platform, and the transfer driving piece is positioned outside the working cavity, so that the service lives of the transfer driving piece and the hydrogen furnace are ensured, the working cavity is not influenced during maintenance, resources are saved, and the maintenance difficulty and cost are reduced.

The foregoing description is only an overview of the present invention, and is intended to be more clearly understood as being carried out in accordance with the following description of the preferred embodiments, as well as other objects, features and advantages of the present invention.

Drawings

FIG. 1 is a schematic view of the overall structure of a hydrogen furnace for soldering semiconductors according to the present invention;

fig. 2 is a schematic view of the internal structure of a lower chamber of a hydrogen furnace for welding semiconductors according to the present invention;

FIG. 3 is a schematic top view of a lower chamber of a hydrogen furnace for soldering semiconductors according to the present invention;

FIG. 4 is a schematic side view of a lower chamber of a hydrogen furnace for soldering semiconductors according to the present invention;

FIG. 5 is a schematic diagram of a handling mechanism of a hydrogen furnace for soldering semiconductors according to the present invention;

FIG. 6 is a schematic side view of a handling mechanism of a hydrogen furnace for soldering semiconductors according to the present invention;

FIG. 7 is a schematic diagram showing a front view of a carrying mechanism of a hydrogen furnace for soldering semiconductors according to the present invention;

Fig. 8 is a schematic diagram of the positional relationship between the upper cavity and the lower cavity of the hydrogen furnace for welding semiconductors.

Reference numerals:

1. A frame; 2. an upper cavity; 21. a locking mechanism; 22. a cooling water pipe; 3. a lower cavity; 31. a seal; 32. a hydrogen pipe; 33. a nitrogen pipe; 34. a vacuum tube; 35. a seal ring; 4. a working chamber; 5. a welding platform; 51. a rod groove; 6. cooling the platform; 7. a carrying mechanism; 71. a transfer frame; 711. a sleeve; 712. a connecting rod; 713. a connecting block; 72. a jacking assembly; 721. a lifting rod; 722. a connecting plate; 723. jacking the driving piece; 73. a transfer assembly; 731. a gear; 732. a rack; 733. a transmission shaft; 734. a transfer driving member; 74. a slide bar; 75. a mounting base; 751. a mounting column; 752. a fixing plate; 753. a mounting plate; 76. a synchronizing lever; 77. a first bevel gear; 78. a second bevel gear; 8. a lifting mechanism; 81. a support plate; 82. a moving block; 83. a guide rod; 84. lifting the driving member; 9. and a vacuum pump.

Detailed Description

The present invention will be described in further detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present invention more apparent.

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Referring to fig. 1 to 8, the present embodiment discloses a hydrogen furnace for welding semiconductors, comprising:

The device comprises a frame 1, an upper cavity 2 and a lower cavity 3, wherein the upper cavity 2 and the lower cavity 3 are connected to the frame 1, and the upper cavity 2 is positioned above the lower cavity 3 and is connected to the lower cavity 3 in a sealing manner; a working cavity 4 is formed between the upper cavity 2 and the lower cavity 3;

the welding platform 5 and the cooling platform 6 are symmetrically arranged in the working cavity 4 in parallel along the horizontal direction and are horizontally connected with the lower cavity 3;

The carrying mechanism 7 is connected to the lower chamber 3, and includes: a transfer frame 71, a lift-up unit 72, and a transfer unit 73; the transferring frame 71 is horizontally arranged above the welding platform 5 and the cooling platform 6, and the jacking component 72 is arranged corresponding to the transferring frame 71 and is positioned at one side of the lower cavity 3 away from the upper cavity 2; the jacking component 72 and the transferring component 73 vertically penetrate through the lower cavity 3 and are connected with the transferring frame 71; the jacking component 72 is used for driving the transfer frame to execute lifting action, and the transfer component 73 is used for driving the transfer frame 71 to reciprocate between the welding platform 5 and the cooling platform 6;

The transfer unit 73 includes: gear 731, rack 732, drive shaft 733, and transfer drive 734; the rack 732 is disposed in the working chamber 4, along the direction from the welding platform 5 to the cooling platform 6, and is fixedly connected to one end of the transfer frame 71 far from the center of the transfer frame 71; the gear 731 is horizontally arranged in the working chamber 4, and the rack 732 is meshed with the gear 731; the transmission shaft 733 vertically penetrates through the lower cavity 3, one end of the transmission shaft 733 is fixedly connected with the center of the gear 731, and the other end of the transmission shaft 733 is connected with the transfer driving piece 734; the transfer driving member 734 is configured to drive the gear 731 to rotate.

In this embodiment, the material includes: the welding device comprises a welding piece, a to-be-welded piece and welding flux, wherein the welding flux is arranged between the welding piece and the to-be-welded piece, the welding piece is a semiconductor or other electronic devices, and the to-be-welded piece is an electronic component such as a circuit board. In other embodiments, the types of the welding piece and the to-be-welded piece can be adjusted according to actual needs.

The transfer frame 71 is connected to a rack 732, and when the lift unit 72 drives the transfer frame 71 to move up and down, the rack 732 also moves up and down along with the transfer frame 71, and when the gear 731 rotates to drive the rack 732 to move horizontally, the transfer frame 71 also moves horizontally along with the rack 732. In the initial state, the transfer frame 71 is attached to the welding platform 5, and the welding platform 5 is heated to melt the solder so that the weldment is welded on the weldment to be welded; the jacking component 72 drives the transfer frame 71 to move upwards, so that the transfer frame 71 is separated from the welding platform 5; the transfer driving member 734 drives the gear 731 to rotate, so that the rack 732 and the transfer frame 71 connected to the rack 732 move horizontally until the transfer frame 71 is located above the cooling platform 6; the jacking component 72 drives the transfer frame 71 to move downwards until the transfer frame 71 is attached to the cooling platform 6, so that the materials are cooled and solidified; after the welding process of the materials is completed, the transferring frame is restored to the initial state. The transfer driving piece 734 of the embodiment is located outside the working chamber 4, so that the service lives of the transfer driving piece 734 and the hydrogen furnace are guaranteed, the working chamber 4 is not affected during maintenance, resources are saved, and maintenance difficulty and cost are reduced.

Specifically, the side that goes up cavity 2 and cavity 3 each other are close to all is equipped with the cavity, and the cavity opening of going up cavity 2 is downward, and the cavity opening of cavity 3 down upwards, and when last cavity 2 and cavity 3 sealing connection down, two cavities form working chamber 4. The working chamber 4 provides working space for welding, carrying and cooling materials.

Specifically, the carrying mechanism 7 further includes: two slide bars 74; the two slide bars 74 are symmetrically arranged in the working cavity 4; the sliding rod 74 is movably connected to the lower cavity 3, and the sliding rod 74 and the rack 732 are mutually parallel; the transfer frame 71 is slidably connected to the slide bar 74, and the lift assembly 72 is connected to the slide bar 74. The slide bars 74 facilitate the horizontal movement of the transfer frame 71, and the two slide bars 74 balance the two ends of the transfer frame 71, so that materials can be stably placed on the transfer frame 71, and the materials are prevented from sliding off the transfer frame 71.

Specifically, the gear 731 and the rack 732 are located on a side of the slide bar 74 away from the welding stage 5 and the cooling stage 6, the gear 731 is disposed between the welding stage 5 and the cooling stage 6, and the rack 732 extends from the gear 731 to an end of the welding stage 5 or the cooling stage 6 away from the gear 731. When the transfer frame 71 is positioned above the welding platform 5, one end of the rack 732 is meshed with the gear 731, the other end of the rack 732 is positioned at one end of the welding platform 5 far away from the cooling platform 6, the gear 731 rotates, the rack 732 gradually approaches the cooling platform 6 until one end of the rack 732 far away from the gear 731 moves to the position of the gear 731, and the transfer frame 71 is positioned above the cooling platform 6; the gear 731 is reversed to move the transfer frame from the cooling stage 6 to the welding stage 5. The rack 732 may be lifted and then engaged with the gear 731, or the height of the gear 731 may be set to be greater than the range of up-down movement of the rack 732, so that the rack 732 is engaged with the gear 731 when it moves up and down.

Specifically, the jacking assembly 72 includes: four elevating levers 721, a connection plate 722, and an elevating driving member 723; the connecting plate 722 is arranged on one side of the lower cavity 3 away from the upper cavity 2, and a space exists between the connecting plate 722 and the lower cavity 3; the lifting rods 721 penetrate through the lower cavity 3, four lifting rods 721 are correspondingly arranged at two ends of the two sliding rods 74, one end of each lifting rod 721 is connected with the sliding rod 74, and the other end of each lifting rod 721 is fixedly connected with the connecting plate 722; the jacking driving member 723 is used for driving the connection plate 722 to perform a lifting action. The jacking driving member 723 drives the connecting plate 722 to move up and down, the connecting plate 722 drives the lifting rod 721 to move up and down, the lifting rod 721 drives the sliding rod 74 to move up and down, the sliding rod 74 drives the transferring frame 71 to move up and down, and the transferring frame 71 drives the material and the rack 732 to move up and down.

In this embodiment, the jacking driving member 723 is an air cylinder, which is fixedly connected to one side of the connecting plate 722 near the lower cavity 3, and the output rod of the air cylinder is connected to one side of the lower cavity 3 far away from the upper cavity 2, and the distance between the air cylinder and each lifting rod 721 is equal. When the output rod of the air cylinder extends out, the air cylinder is far away from the lower cavity 3, and drives the connecting plate 722 to move downwards, so that the transfer frame 71 moves downwards; when the output rod of the air cylinder is retracted, the air cylinder approaches the lower cavity 3, and drives the connecting plate 722 to move upwards, so that the transfer frame 71 moves upwards. In other embodiments, an electric cylinder or other driving member may be used instead of the air cylinder, and the position of the jacking driving member 723 may be adjusted according to actual needs.

Specifically, the transfer frame 71 includes: two sleeves 711, several connecting rods 712 and connecting blocks 713; the two sleeves 711 are respectively sleeved on the two slide bars 74, two ends of the connecting rod 712 are respectively connected to the two sleeves 711, one end of the connecting block 713 is connected to the sleeve 711, and the other end is connected to the rack 732. The material is placed on connecting rod 712, and a plurality of connecting rods 712 have the clearance between, and the material of being convenient for heats and cools off. The sleeve 711 is hollow, and prevents the transfer frame 71 from being separated from the slide bar 74 when it moves up and down.

Specifically, the welding platform 5 and the cooling platform 6 are both concavely provided with the rod groove 51 corresponding to the connecting rod 712, when the transfer frame 71 is attached to the welding platform 5 or the cooling platform 6, the connecting rod 712 is attached to the rod groove 51, so that the material on the connecting rod 712 is closer to the welding platform 5 or the cooling platform 6, the material is easier to heat and cool to a preset effect, and the welding quality is improved.

Specifically, the number of the transfer units 73 is two, the two transfer units 73 are symmetrically disposed on both sides of the transfer frame 71, and both ends of the transfer frame 71 are connected to the two transfer units 73, respectively. The two transfer assemblies 73 facilitate a smoother and smoother movement of the transfer frame 71 in the horizontal direction.

Specifically, the transfer assembly 73 further includes: a mounting seat 75, a synchronizing rod 76, two first bevel gears 77 and two second bevel gears 78; the mounting seat 75 is fixedly connected to one side of the lower cavity 3 away from the upper cavity 2 and is positioned below the connecting plate 722; the transmission shaft 733 is disposed through the mount 75; the synchronizing rod 76 is horizontally arranged and rotatably connected to one side of the mounting seat 75 away from the lower cavity 3; the first bevel gear 77 is fixedly connected to one end of the transmission shaft 733 far from the gear 731, and the second bevel gear 78 is fixedly connected to the synchronizing bar 76 and meshed with the first bevel gear 77; the transfer driving member 734 is used to drive the synchronizing bar 76 to rotate. The synchronizing bar 76, the first bevel gear 77 and the second bevel gear 78 achieve the same-speed rotation of the gears 731 of the two transfer units 73. The transfer driving member 734 drives the synchronizing rod 76 to rotate, the synchronizing rod 76 drives the second bevel gear 78 to rotate, the second bevel gear 78 drives the first bevel gear 77 to rotate, the first bevel gear 77 drives the transmission shaft 733 to rotate, and the transmission shaft 733 drives the gear 731 to rotate.

In the present embodiment, the two gears 731 are respectively mounted on the sides of the two racks 732 near the transfer frame 71, the engagement surfaces of the two racks 732 are disposed on the sides near the transfer frame 71, and the two second bevel gears 78 are disposed in opposite directions. The rotation directions of the two gears 731 are opposite, so that the moving directions of the two racks 732 are the same, and the synchronous movement of the racks 732 is realized.

In this embodiment, the transfer driving member 734 is a motor, horizontally disposed at one end of the synchronizing bar 76, and fixedly connected to one side of the mounting base 75, and an output shaft of the motor is fixedly connected to the synchronizing bar 76. In other embodiments, a rotary cylinder or other driving member may be used instead of the motor, and the position of the transfer driving member 734 may be adjusted according to actual needs.

In the present embodiment, the mounting base 75 includes: four mounting posts 751, two fixing plates 752 and a mounting plate 753; the mounting plate 753 is arranged corresponding to symmetry axes of the welding platform 5 and the cooling platform 6, is arranged below the connecting plate 722, and the fixing plate 752 and the mounting plate 753 are mutually perpendicular; the two fixing plates 752 are mutually parallel and symmetrically arranged, and two ends of the mounting plate 753 are respectively and fixedly connected with the centers of the two fixing plates 752 and are in an I shape; one end of each of the four mounting posts 751 is connected to both ends of the two fixing plates 752, and the other end is fixedly connected to the lower chamber 3.

Specifically, a side of the lower cavity 3 away from the upper cavity 2 is provided with a plurality of through holes (not labeled in the figure) and a plurality of sealing elements 31, the plurality of through holes are arranged corresponding to the transmission shaft 733 and the lifting rod 721, the sealing elements 31 are arranged in the through holes, and the transmission shaft 733 and the lifting rod 721 penetrate through the sealing elements 31. The transfer driving part 734 and the lifting driving part 723 are arranged below the lower cavity 3, so that the hydrogen furnace is not easy to damage and is convenient to maintain; meanwhile, the working cavity 4 is facilitated to be sealed, the transmission shaft 733 and the lifting rod 721 do not need to move horizontally, so that the lower cavity 3 does not need to be provided with corresponding grooves, the transmission shaft 733 and the lifting rod 721 do not need to move horizontally, the grooves are also sealed without complex sealing elements 31, the sealing elements 31 for sealing the through holes are easier to set, and the cost is lower.

Specifically, the upper cavity 2 is provided with a lifting mechanism 8 and a locking mechanism 21; the lifting mechanism 8 is arranged at one side of the upper cavity 2 far away from the lower cavity 3 and is used for driving the upper cavity 2 to be far away from or close to the lower cavity 3; the locking mechanism 21 is used for locking or unlocking the upper chamber 2 and the lower chamber 3. In practical application, the upper cavity 2 is required to be opened frequently to carry out material placing, material taking, cleaning of the working cavity 4 or maintenance and overhaul work, the upper cavity 2 and the lower cavity 3 conduct heat in the working cavity 4, and the lifting mechanism 8 avoids scalding workers due to manual opening of the upper cavity 2; the locking mechanism 21 enables the upper cavity 2 and the lower cavity 3 to be stably and tightly attached, so that the sealing performance of the working cavity 4 is ensured, and the welding safety is ensured.

Specifically, the lifting mechanism 8 includes: a support plate 81, a moving block 82, a guide bar 83, and a lift driving member 84; the supporting plate 81 is fixedly connected to the frame 1, the moving block 82 is fixedly connected to one side, far away from the lower cavity 3, of the upper cavity 2, the lifting driving piece 84 is connected to the supporting plate 81, and the output end of the lifting driving piece 84 is connected to the moving block 82; the guide rod 83 penetrates through the supporting plate 81, and one end, close to the upper cavity 2, of the guide rod is connected with the upper cavity 2; the lifting driving member 84 is a cylinder, and is connected to one side of the support plate 81 away from the upper cavity 2, and the output end of the lifting driving member penetrates through the support plate 81. The guide rod 83 facilitates the upper cavity 2 to slide up and down under the driving of the lifting driving member 84, and the lifting driving member 84 is used for driving the moving block 82 to perform the up and down movement, so that the moving block 82 drives the upper cavity 2 to move up and down.

Specifically, the upper chamber 2 is further provided with an exhaust pipe (not shown) for pumping the mixture of hydrogen and nitrogen to the working chamber 4. The nitrogen enters the working chamber 4 to discharge the hydrogen out of the working chamber 4 for diluting the hydrogen concentration in the working chamber 4.

Specifically, the lower cavity 3 is also provided with a hydrogen pipe 32, a nitrogen pipe 33 and a vacuum pipe 34; the hydrogen pipe 32 and the nitrogen pipe 33 are respectively used for filling hydrogen and nitrogen into the working cavity 4; the vacuum tube 34 is used to evacuate the working chamber 4. The hydrogen has a reducing effect, and can be used for placing the oxidation of the welding surface; when the hydrogen is used, the working cavity 4 needs to reach an anaerobic environment, so that the working cavity 4 needs to be vacuumized before the hydrogen is filled; the nitrogen gas is used to dilute and discharge the hydrogen gas in the working chamber 4 after the welding process is completed. One end of the hydrogen pipe 32, the nitrogen pipe 33 and the vacuum pipe 34 are connected with the lower cavity 3, and the other end extends out of the lower cavity 3.

Specifically, a hydrogen furnace for welding semiconductors of the present embodiment further includes: and one end of the vacuum tube 34 is connected with the vacuum pump 9, and the other end is connected with the lower cavity 3. The vacuum pump 9 evacuates the working chamber 4 through the vacuum tube 34.

Specifically, the lower chamber 3 is further provided with a sealing ring 35. The sealing ring 35 enhances the tightness of the working chamber 4.

Specifically, the upper cavity 2 and the lower cavity 3 are provided with cooling water pipes 22. The cooling water pipe 22 is wound on the upper cavity 2 and the lower cavity 3 and is used for introducing cooling water to cool the upper cavity 2 and the lower cavity 3.

The welding work flow of the hydrogen furnace for welding semiconductors of the embodiment is as follows:

step one, confirming that materials are placed on a transfer frame, and closing an upper cavity and a lower cavity;

step two, extracting air in the working cavity until the working cavity is in a vacuum state;

Filling hydrogen into the working cavity until the concentration of the hydrogen in the working cavity reaches a preset value;

Step four, moving the transfer frame to attach the transfer frame to the welding platform;

step five, starting a welding platform to heat the materials;

step six, moving the transfer frame to attach the transfer frame to the cooling platform;

Step seven, starting a cooling platform to cool and solidify the material;

Step eight, filling nitrogen into the working cavity, and opening an exhaust pipe to discharge hydrogen;

And step nine, moving the upper cavity away from the lower cavity, and finishing welding.

According to the hydrogen furnace for welding semiconductors, the lifting assembly drives the transfer frame to move up and down, the rack and the transfer frame connected with the rack horizontally move through the rotating gear, materials are transferred from the welding platform to the cooling platform, the transfer driving piece is located outside the working cavity, the service lives of the transfer driving piece and the hydrogen furnace are guaranteed, the working cavity is not affected during overhauling, resources are saved, and maintenance difficulty and cost are reduced.

The foregoing examples are provided to further illustrate the technical contents of the present invention for the convenience of the reader, but are not intended to limit the embodiments of the present invention thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.

Claims

1. A hydrogen furnace for soldering semiconductors, comprising:

2. The hydrogen furnace for soldering semiconductors as recited in claim 1, wherein the handling mechanism further comprises: two slide bars; the two sliding rods are symmetrically arranged in the working cavity; the sliding rod is movably connected to the lower cavity, and the sliding rod and the rack are arranged in parallel; the transfer frame is connected with the sliding rod in a sliding manner, and the jacking component is connected with the sliding rod.

3. The hydrogen furnace for welding semiconductors according to claim 2, wherein the gear and the rack are located at a side of the slide bar away from the welding stage and the cooling stage, the gear is disposed between the welding stage and the cooling stage, and the rack extends from the gear to one end of the welding stage or the cooling stage away from the gear.

4. A hydrogen furnace for soldering semiconductors as recited in claim 3, wherein the jacking assembly comprises: four lifting rods, a connecting plate and a jacking driving piece; the connecting plate is arranged on one side, far away from the upper cavity, of the lower cavity, and a space exists between the connecting plate and the lower cavity; the lifting rods penetrate through the lower cavity, four lifting rods are correspondingly arranged at two ends of the two sliding rods, one ends of the lifting rods are connected with the sliding rods, and the other ends of the lifting rods are fixedly connected with the connecting plates; the jacking driving piece is used for driving the connecting plate to execute lifting action.

5. The hydrogen furnace for soldering semiconductors according to claim 4, wherein the transfer frame comprises: two sleeves, a plurality of connecting rods and connecting blocks; the two sleeves are respectively sleeved on the two sliding rods, two ends of the connecting rod are respectively connected with the two sleeves, one end of the connecting block is connected with the sleeve, and the other end of the connecting block is connected with the rack.

6. The hydrogen furnace for soldering semiconductors according to claim 5, wherein the number of the transfer units is two, the two transfer units are symmetrically disposed at both sides of the transfer frame, and both ends of the transfer frame are respectively connected to the two transfer units.

7. The hydrogen furnace for soldering semiconductors according to claim 6, wherein the transfer assembly further comprises: the device comprises a mounting seat, a synchronous rod, two first bevel gears and two second bevel gears; the mounting seat is fixedly connected to one side, far away from the upper cavity, of the lower cavity and is positioned below the connecting plate; the transmission shaft penetrates through the mounting seat; the synchronous rod is horizontally arranged and rotationally connected to one side, far away from the lower cavity, of the mounting seat; the first bevel gear is fixedly connected to one end, far away from the gear, of the transmission shaft, and the second bevel gear is fixedly connected to the synchronizing rod and meshed with the first bevel gear; the transfer driving piece is used for driving the synchronous rod to rotate.

8. The hydrogen furnace for welding semiconductors according to claim 7, wherein a plurality of through holes and a plurality of sealing members are arranged on one side of the lower cavity away from the upper cavity, the plurality of through holes are arranged corresponding to the transmission shaft and the lifting rod, the sealing members are arranged in the through holes, and the transmission shaft and the lifting rod penetrate through the sealing members.

9. The hydrogen furnace for soldering semiconductors according to claim 8, wherein the upper chamber is provided with a lifting mechanism and a locking mechanism; the lifting mechanism is arranged on one side of the upper cavity, which is far away from the lower cavity, and is used for driving the upper cavity to be far away from or close to the lower cavity; the locking mechanism is used for locking or unlocking the upper cavity and the lower cavity.

10. The hydrogen furnace for soldering semiconductors according to claim 9, wherein the lower chamber is further provided with a hydrogen pipe, a nitrogen pipe, and a vacuum pipe; the hydrogen pipe and the nitrogen pipe are respectively used for filling hydrogen and nitrogen into the working cavity; the vacuum tube is used for vacuumizing the working cavity.