CN117895221A - Antenna unit and broadband miniaturized microstrip array antenna - Google Patents
Antenna unit and broadband miniaturized microstrip array antenna Download PDFInfo
- Publication number
- CN117895221A CN117895221A CN202410254346.8A CN202410254346A CN117895221A CN 117895221 A CN117895221 A CN 117895221A CN 202410254346 A CN202410254346 A CN 202410254346A CN 117895221 A CN117895221 A CN 117895221A
- Authority
- CN
- China
- Prior art keywords
- dielectric substrate
- antenna
- feed network
- antenna unit
- feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 239000002184 metal Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The application relates to an antenna unit and a broadband miniaturized microstrip array antenna, wherein the antenna unit comprises a grounding plate, a dielectric substrate and a metal patch, and the dielectric substrate is arranged on the upper surface of the grounding plate; the metal patch is arranged on the upper surface of the medium substrate, a microstrip feeder is connected to one side end face of the metal patch, two U-shaped grooves with opposite openings are formed in the metal patch, and grooves are formed in two ends of the metal patch located on two sides of the microstrip feeder. The antenna unit is provided with the two U-shaped grooves in the metal patch, and the two sides of the edge of the metal patch are respectively provided with the grooves, so that the frequency band of the antenna unit is widened, and the antenna unit has wider bandwidth; the broadband miniaturization problem of the microstrip array antenna is solved. According to the broadband miniaturized microstrip array antenna, the upper medium substrate and the lower medium substrate are used for isolating a part of feed network from the antenna unit, so that the impedance matching bandwidth of the broadband miniaturized microstrip array antenna is effectively expanded.
Description
Technical Field
The present application relates to the field of wireless communications technologies, and in particular, to an antenna unit and a miniaturized microstrip array antenna for broadband.
Background
With the rapid development of wireless communication technology, microstrip array antennas with wide frequency band and small volume are increasingly popular. The bandwidth of the existing microstrip antenna is relatively narrow, so that the bandwidth of the array antenna formed by the microstrip antenna is also relatively narrow. In addition, the feed network and the antenna unit of the existing array antenna are coplanar, and due to space limitation, the feed network and the antenna unit are close to each other and are easily affected by the antenna unit, so that the impedance bandwidth of the array antenna is reduced.
Disclosure of Invention
The embodiment of the application provides an antenna unit and a broadband miniaturized microstrip array antenna, which are used for solving the technical problem of broadband miniaturization of the microstrip array antenna.
In order to achieve the above object, the embodiment of the present application provides the following technical solutions:
in one aspect, an antenna unit is provided, including:
a ground plate;
The dielectric substrate is arranged on the upper surface of the grounding plate;
the metal patch is arranged on the upper surface of the dielectric substrate, a microstrip feeder is connected to one side end face of the metal patch, two U-shaped grooves with opposite openings are formed in the metal patch, and grooves are formed in two ends of the metal patch, located on two sides of the microstrip feeder.
Preferably, the dielectric substrate has a relative dielectric constant of 4.4 and a thickness of 1mm.
Preferably, the shape of the groove is rectangular, semicircular or triangular.
Preferably, the impedance bandwidth of the antenna unit is 8.7GHz to 9.8GHz.
In yet another aspect, a broadband miniaturized microstrip array antenna is provided, comprising: the antenna unit comprises a floor and the antenna units, wherein an upper medium substrate is arranged on the upper surface of the floor, a lower medium substrate is arranged on the lower surface of the floor, N rows and N columns of antenna units are arranged on the upper medium substrate, N antenna units in each row are connected through an upper feed network, and a lower feed network matched and connected with the upper feed network is arranged on the lower surface of the lower medium substrate.
Preferably, the upper layer feeding network and the lower layer feeding network are 1-6 power division networks, each upper layer feeding network and each lower layer feeding network are provided with a connecting hole, and each upper layer medium substrate and each lower layer medium substrate are provided with a connecting through hole corresponding to each connecting hole; and the connecting holes of each upper layer feed network, the connecting holes of the corresponding lower layer feed network, the connecting through holes of the upper layer dielectric substrate and the connecting through holes of the lower layer dielectric substrate form feed through holes.
Preferably, the floor is provided with a circular slot corresponding to the feed via hole in a matching manner, one end of each feed via hole is connected with the input end of the corresponding upper layer feed network, and the other end of each feed via hole sequentially penetrates through the corresponding upper layer dielectric substrate connecting through hole, the circular slot and the lower layer dielectric substrate connecting through hole to be connected with the output end of the corresponding lower layer feed network.
Preferably, a plurality of fan-shaped grounding through holes are formed in the upper dielectric substrate, and the plurality of fan-shaped grounding through holes are distributed on the upper left half circumference of the feed through holes.
Preferably, the radius of each grounding via hole is 0.2mm, and the center distance between the feeding via hole and each grounding via hole is 2.72mm.
Preferably, the row spacing of every two adjacent antenna units is 22mm, and the column spacing of every two adjacent antenna units is 25mm.
The antenna unit comprises a grounding plate, a dielectric substrate and a metal patch, wherein the dielectric substrate is arranged on the upper surface of the grounding plate; the metal patch is arranged on the upper surface of the medium substrate, a microstrip feeder is connected to one side end face of the metal patch, two U-shaped grooves with opposite openings are formed in the metal patch, and grooves are formed in two ends of the metal patch located on two sides of the microstrip feeder. From the above technical solutions, the embodiment of the present application has the following advantages: the antenna unit is provided with the two U-shaped grooves in the metal patch, and the two sides of the edge of the metal patch are respectively provided with the grooves, so that the frequency band of the antenna unit is widened, and the antenna unit has wider bandwidth; the technical problem of broadband miniaturization of the microstrip array antenna is solved.
According to the broadband miniaturized microstrip array antenna, the upper medium substrate and the lower medium substrate are used for isolating a part of feed network from the antenna unit, so that the impedance matching bandwidth of the broadband miniaturized microstrip array antenna is effectively expanded. The broadband miniaturized microstrip array antenna adopts an upper layer dielectric substrate and a lower layer dielectric substrate to form a double-layer dielectric substrate, and a part of feed network is arranged on the upper surface of the upper layer dielectric substrate, and the other part of feed network is arranged on the lower surface of the lower layer dielectric substrate, so that the feed networks of the upper layer and the lower layer can be connected by only using a small amount of metallized feed through holes, and the extra energy loss caused by using too many feed through holes is avoided. Half circles of metallized grounding through holes are arranged around the metallized feeding through holes, so that the loss of a feeding network can be reduced, and the broadband miniaturized microstrip array antenna has higher gain.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic perspective view of an antenna unit according to an embodiment of the present application;
fig. 2 is a schematic top view of an antenna unit according to an embodiment of the application;
fig. 3 is a schematic diagram of a front view of an antenna unit according to an embodiment of the present application;
Fig. 4 is a graph showing a change of return loss of an antenna unit with frequency according to an embodiment of the present application;
Fig. 5 is a schematic diagram of a front view of a miniaturized broadband microstrip array antenna according to an embodiment of the present application;
Fig. 6 is a schematic top view of a miniaturized wideband microstrip array antenna according to an embodiment of the present application;
Fig. 7 is a schematic bottom view of a miniaturized broadband microstrip array antenna according to an embodiment of the present application;
Fig. 8 is a schematic structural diagram of a floor board in a broadband miniaturized microstrip array antenna according to an embodiment of the present application;
Fig. 9 is a graph showing the return loss of a miniaturized broadband microstrip array antenna according to an embodiment of the present application with frequency;
fig. 10 is a radiation pattern of a broadband miniaturized microstrip array antenna according to an embodiment of the present application.
Detailed Description
In order to make the objects, features and advantages of the present application more comprehensible, the following description of the embodiments accompanied with the accompanying drawings in the embodiments of the present application will make it apparent that the embodiments described below are only some embodiments but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
The microstrip antenna has the advantages of low section, light weight, small volume, low cost and the like, and has wide application scene. However, sometimes the gain and the beam width of a single microstrip antenna cannot meet the actual application requirements, and the microstrip antenna is generally required to be used as a unit for array, so as to realize the requirements of high gain, low side lobe and narrow beam width. With the rapid development of wireless communication technology, a microstrip antenna array with wide frequency band and small volume is gradually developed, and is widely applied to the scenes such as satellite-borne, missile-borne, vehicle-mounted, carrier-borne and the like.
The bandwidth of the existing microstrip antenna array is mainly determined by the microstrip antenna units, but the bandwidth of the existing microstrip antenna is relatively narrow, and only about 3%, so that the bandwidth of the microstrip antenna units is firstly expanded in order to enable the microstrip antenna array to have relatively wide bandwidth. In the prior art, expanding the bandwidth of a microstrip antenna unit adopts increasing the thickness of a dielectric substrate and using a dielectric substrate with small relative dielectric constant, namely, increasing the relative bandwidth by reducing the quality factor of the microstrip antenna. In addition, in order to avoid that the coupling effect of the microstrip antenna to the feed network affects impedance matching, the antenna and the feed network are generally separated in the prior art, so that each microstrip antenna unit needs a metallized via hole to be connected with the feed network. For example, microstrip array antennas proposed in the prior art "design of a broadband low-side lobe microstrip array antenna" are assembled with a common rectangular microstrip antenna. The array antenna comprises two dielectric substrates, and a floor is arranged between the two dielectric substrates. The antenna unit is printed on the upper surface of the upper layer substrate, the thickness of the upper layer dielectric substrate is 2.5mm, and the relative dielectric constant is 2.65. The feed network is arranged on the lower surface of the lower dielectric substrate, the thickness of the lower dielectric substrate is 1mm, and the relative dielectric constant is 2.65. An operating bandwidth of about 10% is achieved due to the use of a thick dielectric substrate with a small relative permittivity.
Therefore, the prior art bandwidth-extended antenna array has the disadvantage of larger size. The bandwidth of the microstrip antenna array is mainly determined by the microstrip antenna units, while the bandwidth of a common microstrip antenna is narrower. In order to expand the bandwidth of the microstrip antenna unit in the prior art, a common method is to use a thick dielectric substrate, and the bandwidth of the antenna becomes larger along with the thickening of the substrate. Another common approach is to use a dielectric substrate with a small relative permittivity, the smaller the relative permittivity, the larger the bandwidth of the antenna. However, the size of the antenna elements is larger, so the overall size of the array antenna formed by the antenna elements is larger. Second, because the feed network and the antenna element are placed on different sides, more metallized vias are required to connect the antenna element to the feed network.
The embodiment of the application provides an antenna unit and a broadband miniaturized microstrip array antenna, which solves the technical problem of broadband miniaturization of the microstrip array antenna.
Embodiment one:
fig. 1 is a schematic perspective view of an antenna unit according to an embodiment of the present application, fig. 2 is a schematic top view of the antenna unit according to an embodiment of the present application, and fig. 3 is a schematic front view of the antenna unit according to an embodiment of the present application.
As shown in fig. 1 to 3, an embodiment of the present application provides an antenna unit, including:
A ground plate 6;
a dielectric substrate 5 provided on the upper surface of the ground plate 6;
The metal patch 1 is arranged on the upper surface of the dielectric substrate 5, one side end surface of the metal patch 1 is connected with a microstrip feeder 4, two U-shaped grooves 2 with opposite openings are formed in the metal patch 1, and grooves 3 are formed in two ends of the metal patch 1 located on two sides of the microstrip feeder 4.
The microstrip feed line 4 is printed on the same plane as the metal patch 1, and the microstrip feed line 4 is connected to one side of the metal patch 1, so as to form a side-feed type feed to the metal patch 1. In this embodiment, as shown in fig. 3, the metal patch 1 is printed on the upper surface of the dielectric substrate 5, and the ground plate 6 is printed on the lower surface of the dielectric substrate 5.
In the embodiment of the present application, the material of the metal patch 1 may be selected from copper, and the shape of the metal patch 1 may be set according to requirements. In this embodiment, the metal patch 1 is preferably rectangular in shape, two U-shaped grooves 2 with opposite openings are formed in the metal patch 1, and grooves 3 are formed at two side edges of the metal patch 1. Wherein the shape of the recess 3 may be selected from rectangular, semi-circular or triangular.
The metal size between the two U-shaped grooves 2 was 0.2mm. The shape of the groove 3 can also be set according to the requirements.
Fig. 4 is a graph showing a change of return loss of an antenna unit with frequency according to an embodiment of the present application.
In the embodiment of the application, the impedance bandwidth of the antenna unit is 8.7 GHz-9.8 GHz.
It should be noted that, this antenna unit has realized the expansion of antenna unit's frequency band through opening two U type grooves in the inside of metal paster to set up flutedly respectively in metal paster edge both sides. The return loss parameter of the antenna unit is shown in fig. 4, and it can be known that the impedance bandwidth of the antenna unit is 8.7 GHz-9.8 GHz, that is, the-10 dB relative bandwidth is 11.9%, so that the antenna unit has a wider bandwidth.
The application provides an antenna unit, which comprises a grounding plate, a dielectric substrate and a metal patch, wherein the dielectric substrate is arranged on the upper surface of the grounding plate; the metal patch is arranged on the upper surface of the medium substrate, a microstrip feeder is connected to one side end face of the metal patch, two U-shaped grooves with opposite openings are formed in the metal patch, and grooves are formed in two ends of the metal patch located on two sides of the microstrip feeder. The antenna unit is provided with the two U-shaped grooves in the metal patch, and the two sides of the edge of the metal patch are respectively provided with the grooves, so that the frequency band of the antenna unit is widened, and the antenna unit has wider bandwidth; the technical problem of broadband miniaturization of the microstrip array antenna is solved.
In one embodiment of the present application, the dielectric substrate 5 preferably has a relative permittivity of 4.4, and the dielectric substrate 5 preferably has a thickness of 1mm.
The dielectric substrate 5 may be made of a plate material having a relative dielectric constant of 4.4, a thickness of 1mm, and a model number of F4BTM 440. In this embodiment, the antenna unit is made of a plate material with a relative dielectric constant of 4.4 and a model F4BTM440, and the thickness of the plate material is 1mm, so that the array antenna formed by the antenna unit has a low profile height. The antenna unit is made of the dielectric substrate made of the plates with the relative dielectric constant of 4.4, the thickness of 1mm and the model number of F4BTM440, and the relative bandwidth of the antenna unit is expanded to about 10% on the thin dielectric substrate with the high dielectric constant.
Embodiment two:
Fig. 5 is a schematic diagram of a front view of a miniaturized wideband microstrip array antenna according to an embodiment of the present application, fig. 6 is a schematic diagram of a top view of a miniaturized wideband microstrip array antenna according to an embodiment of the present application, and fig. 7 is a schematic diagram of a bottom view of a miniaturized wideband microstrip array antenna according to an embodiment of the present application.
As shown in fig. 5 to 7, an embodiment of the present application provides a miniaturized broadband microstrip array antenna, including: the antenna unit 8 comprises a floor 11 and the antenna units 8, wherein an upper layer dielectric substrate 7 is arranged on the upper surface of the floor 11, a lower layer dielectric substrate 10 is arranged on the lower surface of the floor 11, N rows and N columns of antenna units 8 are arranged on the upper layer dielectric substrate 7, N antenna units 8 in each row are connected through an upper layer feed network 9, and a lower layer feed network 12 which is in matched connection with the upper layer feed network 9 is arranged on the lower surface of the lower layer dielectric substrate 10.
It should be noted that, in the second embodiment, the content of the antenna unit has been described in the first embodiment, and in this embodiment, the description of the content of the antenna unit is not repeated. The upper dielectric substrate 7 and the lower dielectric substrate 10 can be made of plates with a relative dielectric constant of 4.4, a thickness of 1mm and a model of F4BTM440, and the shapes of the floor 11, the upper dielectric substrate 7 and the lower dielectric substrate 10 can be rectangular, and the size specifications can be 157mm x 142mm x 1mm. In this embodiment, as shown in fig. 5, the upper layer feeding network 9 is printed on the upper surface of the upper layer dielectric substrate 7, and the floor 11 is printed between the upper layer dielectric substrate 7 and the lower layer dielectric substrate 10. As shown in fig. 6, 6 rows and 6 columns of 3 antenna units are arranged on the upper dielectric substrate 7, the row spacing between every two adjacent antenna units 8 in each row can be 22mm, and the column spacing between every two adjacent antenna units 8 in each column can be 25mm; in other embodiments, the line spacing and the column spacing of the antenna elements in the wideband miniaturized microstrip array antenna can be set according to the requirement. As shown in fig. 7, the lower feed network 12 is printed on the lower surface of the lower dielectric substrate 10.
In the embodiment of the application, the broadband miniaturized microstrip array antenna isolates a part of the feed network from the antenna units by using the upper medium substrate and the lower medium substrate, so that impedance mismatch caused by coupling among the antenna units is effectively reduced, the broadband miniaturized microstrip array antenna can maintain wider working bandwidth, and the expansion of the impedance matching bandwidth of the broadband miniaturized microstrip array antenna is realized.
As shown in fig. 6 and fig. 7, in an embodiment of the present application, the upper layer feed network 9 and the lower layer feed network 12 are 1-6 power division networks, each of the upper layer feed network 9 and each of the lower layer feed network 12 is provided with a connection hole, and each of the upper layer dielectric substrate 7 and the lower layer dielectric substrate 10 is provided with a connection through hole corresponding to each connection hole; the connection hole of each upper layer feed network 9 forms a feed via 14 with the connection hole of the corresponding lower layer feed network 12, the connection through hole of the upper layer dielectric substrate 7 and the connection through hole of the lower layer dielectric substrate 10.
It should be noted that, the upper layer feed network 9 and the lower layer feed network 12 of the broadband miniaturized microstrip array antenna may be 1-division 6-power-division networks, and the 1-division 6-power-division networks may be chebyshev unequal-amplitude power-division feed networks, so as to reduce side lobes by using chebyshev unequal-amplitude power-division feed principles. In the present embodiment, the feed-through 14 is used to connect the upper feed network 9 and the lower feed network 12. As shown in fig. 6, the microstrip array antenna of the broadband miniaturization is provided with 6 feed vias 14, and the connection vias formed in the upper dielectric substrate 7 and the lower dielectric substrate 10 are correspondingly provided with 6 feed vias.
Fig. 8 is a schematic structural diagram of a floor board in a broadband miniaturized microstrip array antenna according to an embodiment of the present application.
As shown in fig. 5 and 8, in one embodiment of the present application, the floor 11 is provided with a circular slot 13 matching with the feed via holes 14, one end of each feed via hole 14 is connected with the input end of the corresponding upper layer feed network 9, and the other end of the feed via hole 14 sequentially passes through the connection through hole of the corresponding upper layer dielectric substrate 7, the circular slot 13 and the connection through hole of the lower layer dielectric substrate 10 to be connected with the output end of the corresponding lower layer feed network 12.
It should be noted that, one end of each feed via 14 is connected to the input end of the corresponding upper feed network 9, and then passes through the upper dielectric substrate 7, through the circular slot 13 of the floor 11, and then passes through the lower dielectric substrate 20 to reach the corresponding output end of the lower feed network 12. As shown in fig. 8, the circular grooves 13 are formed by forming circular through holes with a radius of 2.1mm in the floor 11, 6 circular grooves are formed in total, and the distance between two adjacent circular grooves 13 is matched with the distance between two adjacent feed through holes 14. In this embodiment, the distance between two adjacent circular slots 13 may be 25mm.
As shown in fig. 6, in one embodiment of the present application, a plurality of sector-shaped ground vias 15 are formed on the upper dielectric substrate 7, and a plurality of sector-shaped ground vias 15 are distributed on the upper left half circumference of the feed via 14. The radius of the ground via 15 is 0.2mm, and the center distance between the feed via 14 and each ground via 15 is 2.72mm.
The ground vias 15 are distributed on the upper left half circumference of the feed via 14, and 15 ground vias 15 with a radius of 0.2mm are disposed around each feed via 14, and a center distance between each ground via 15 and the feed via 14 is 2.72mm. The broadband miniaturized microstrip array antenna can reduce the energy loss of the feed via hole through the introduction of the ground via hole, so that the gain of the broadband miniaturized microstrip array antenna is increased.
In the embodiment of the application, the broadband miniaturized microstrip array antenna adopts the upper layer dielectric substrate and the lower layer dielectric substrate to form the double-layer dielectric substrate, and the feeding network of the upper layer and the feeding network of the lower layer can be connected only by using a small amount of metallized feeding through holes by arranging part of the feeding network on the upper surface of the upper layer dielectric substrate and the other part of the feeding network on the lower surface of the lower layer dielectric substrate, so that extra energy loss caused by using too many through holes is avoided. Half circles of metallized grounding through holes are arranged around the metallized feeding through holes, so that the loss of a feeding network can be reduced, and the broadband miniaturized microstrip array antenna has higher gain.
Fig. 9 is a graph showing the return loss of the miniaturized wideband microstrip array antenna according to the embodiment of the present application as a function of frequency, and fig. 10 is a radiation pattern of the miniaturized wideband microstrip array antenna according to the embodiment of the present application.
In the embodiment of the application, the broadband miniaturized microstrip array antenna is simulated to obtain the simulation results shown in fig. 9 and 10, and the return loss simulation result shown in fig. 9 shows that the bandwidth of-10 dB is 8.6 GHz-10.7 GHz, the relative bandwidth is 21.9%, and the bandwidth is wider than the bandwidth of a single antenna unit, which indicates that the feed network of the broadband miniaturized microstrip array antenna has good impedance matching with the antenna array. The maximum gain is 13.15db, the half-power beam width of the E plane is 10.9 ° and the half-power beam width of the H plane is 13.7 °, which indicates that the miniaturized microstrip array antenna has better directivity.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. An antenna unit, comprising:
a ground plate;
The dielectric substrate is arranged on the upper surface of the grounding plate;
the metal patch is arranged on the upper surface of the dielectric substrate, a microstrip feeder is connected to one side end face of the metal patch, two U-shaped grooves with opposite openings are formed in the metal patch, and grooves are formed in two ends of the metal patch, located on two sides of the microstrip feeder.
2. The antenna unit of claim 1, wherein the dielectric substrate has a relative permittivity of 4.4 and a thickness of 1mm.
3. The antenna element of claim 1, wherein the recess is rectangular, semi-circular or triangular in shape.
4. The antenna element of claim 1, wherein the antenna element has an impedance bandwidth of 8.7GHz to 9.8GHz.
5. A broadband miniaturized microstrip array antenna, comprising: the antenna unit of floor and any one of claims 1-4, the upper surface of floor is provided with upper dielectric substrate, the lower surface of floor is provided with lower dielectric substrate, be provided with N on the upper dielectric substrate row N listed antenna unit, every row N antenna unit passes through upper feed network connection, the lower surface of lower dielectric substrate is provided with the lower feed network of upper feed network matching connection.
6. The miniaturized broadband microstrip array antenna of claim 5, wherein the upper feed network and the lower feed network are 1-6 power division networks, each of the upper feed network and each of the lower feed network is provided with a connection hole, and each of the upper dielectric substrate and the lower dielectric substrate is provided with a connection through hole corresponding to each connection hole; and the connecting holes of each upper layer feed network, the connecting holes of the corresponding lower layer feed network, the connecting through holes of the upper layer dielectric substrate and the connecting through holes of the lower layer dielectric substrate form feed through holes.
7. The miniaturized broadband microstrip array antenna of claim 6, wherein the floor is provided with circular slots corresponding to the feed vias, one end of each feed via is connected with the input end of the corresponding upper feed network, and the other end of the feed via sequentially passes through the connecting through hole corresponding to the upper dielectric substrate, the circular slots and the connecting through hole of the lower dielectric substrate to be connected with the output end of the corresponding lower feed network.
8. The miniaturized broadband microstrip array antenna of claim 6, wherein a plurality of sector-shaped ground vias are formed in the upper dielectric substrate, and the plurality of sector-shaped ground vias are distributed on the upper left half circumference of the feed via.
9. The broadband miniaturized microstrip array antenna of claim 8, wherein each of said ground vias has a radius of 0.2mm and the center-to-center distance of said feed via from each of said ground vias is 2.72mm.
10. The miniaturized broadband microstrip array antenna according to claim 5, wherein the row spacing of each row of two adjacent antenna elements is 22mm and the column spacing of each column of two adjacent antenna elements is 25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410254346.8A CN117895221A (en) | 2024-03-06 | 2024-03-06 | Antenna unit and broadband miniaturized microstrip array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410254346.8A CN117895221A (en) | 2024-03-06 | 2024-03-06 | Antenna unit and broadband miniaturized microstrip array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117895221A true CN117895221A (en) | 2024-04-16 |
Family
ID=90645035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410254346.8A Pending CN117895221A (en) | 2024-03-06 | 2024-03-06 | Antenna unit and broadband miniaturized microstrip array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117895221A (en) |
-
2024
- 2024-03-06 CN CN202410254346.8A patent/CN117895221A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9954288B2 (en) | Waveguide fed and wideband complementary antenna | |
| CN109216904B (en) | Broadband low-profile microstrip antenna | |
| CN112688081B (en) | Broadband cavity-backed planar slot array antenna based on dielectric integrated waveguide | |
| CA2335671C (en) | Sheet-metal antenna | |
| CN108777343B (en) | Substrate integrated waveguide transmission structure, antenna structure and connection method | |
| CN113809518B (en) | Microwave and millimeter wave large-frequency ratio common-aperture antenna with high isolation | |
| CN211789536U (en) | Multimode broadband filtering antenna and wireless communication equipment | |
| CN113571893B (en) | High-efficiency filter antenna array and communication equipment | |
| CN114639956A (en) | Microwave and millimeter wave large-frequency-ratio common-aperture antenna combining MIMO technology | |
| KR100805028B1 (en) | Patch antenna and manufacturing method thereof | |
| CN111697350B (en) | Broadband SIW slot antenna based on 77GHz balanced symmetrical formula feed | |
| CN111952722A (en) | Reflective array antenna unit, reflective array antenna and manufacturing method | |
| CN111987442A (en) | Radiation patch array and planar microstrip array antenna | |
| CN109904629B (en) | Array antenna based on defected ground structure | |
| CN108448260B (en) | Low sidelobe gap standing wave array based on gap waveguide | |
| CN117895221A (en) | Antenna unit and broadband miniaturized microstrip array antenna | |
| CN211670320U (en) | ISGW (integrated signal ground wire) beam scanning leaky-wave antenna | |
| CN114122696A (en) | 5G millimeter wave filtering antenna based on SIW | |
| CN112886246A (en) | Planar integrated microwave millimeter wave common-caliber edge-emitting antenna | |
| CN111244619A (en) | Patch array antenna based on air substrate integrated waveguide | |
| CN110829013B (en) | C-band planar MIMO antenna based on interdigital coupling structure | |
| CN213878439U (en) | Rectangular shaped array antenna | |
| CN115395251B (en) | Circular polarization integrated filter antenna array based on hybrid feed network | |
| CN220873857U (en) | Low sidelobe miniaturized substrate integrated waveguide filter horn antenna and wireless communication equipment | |
| CN118017209A (en) | Multiband antenna applied to 5G terminal and design method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |