CN117855115A - Wafer storage device and method thereof - Google Patents

Wafer storage device and method thereof Download PDF

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Publication number
CN117855115A
CN117855115A CN202211210910.3A CN202211210910A CN117855115A CN 117855115 A CN117855115 A CN 117855115A CN 202211210910 A CN202211210910 A CN 202211210910A CN 117855115 A CN117855115 A CN 117855115A
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CN
China
Prior art keywords
wafer
wafer storage
piece
assembly
clamping jaw
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Pending
Application number
CN202211210910.3A
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Chinese (zh)
Inventor
林宇轩
杨浩渝
吕忠宪
张任玮
林柏彣
吕呈祥
佐佐木大辅
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Rorze Technology Inc
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Rorze Technology Inc
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Publication date
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Priority to CN202211210910.3A priority Critical patent/CN117855115A/en
Publication of CN117855115A publication Critical patent/CN117855115A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a wafer storage device and a method thereof, wherein the wafer storage device comprises a wafer storage component, the wafer storage component comprises a positioning column, an upper cover piece, a lower bearing piece and a wafer bearing piece, the left side and the right side of the wafer storage component are respectively provided with a left clamping component and a right clamping component, the lower bearing piece or the left clamping component and the right clamping component are connected with a longitudinal driving mechanism, the left clamping component comprises a left supporting piece, a left upper clamping jaw and a left lower clamping jaw, the right clamping component comprises a right supporting piece, a right upper clamping jaw and a right lower clamping jaw, the left clamping component is driven by a left transverse driving mechanism, the right clamping component is driven by a right transverse driving mechanism, thereby clamping the upper cover piece or each wafer bearing piece in the wafer storage component, generating a space for a user to take and put wafers in a driving mode of the longitudinal driving mechanism, and simultaneously matching with a wafer detection mechanism to detect the condition of the wafers, and improving convenience and efficiency in use.

Description

Wafer storage device and method thereof
Technical Field
The invention relates to a wafer storage device and a method for improving storage convenience and picking and placing efficiency.
Background
Wafer technology is the root of many semiconductor technologies at present, so the wafer manufacturing and developing technology is one of the important points of the semiconductor industry.
The wafers are often loaded by a container during storage or transportation, so as to prevent damage or reduce the possibility of contacting with the outside air, and stabilize and ensure the quality of the wafers. The normal wafer is placed in the container, most of which are stacked, and the wafer is taken out by a mechanical device such as a mechanical arm when needed.
When the device is applied to small wafers, the wafers are stacked in the container more tightly due to smaller size or thickness of the wafers, and the whole storage space is utilized completely.
Accordingly, it is an urgent need to solve the above-mentioned problems and disadvantages, and to provide an improved method for manufacturing a semiconductor device.
Disclosure of Invention
Accordingly, in view of the above-mentioned drawbacks, it is a primary object of the present invention to provide a wafer storage device and a method thereof that are more convenient and efficient to store and use.
The invention aims to drive the wafer storage assembly by utilizing the longitudinal driving mechanism, and the space for taking and placing the wafer is generated by matching the left clamping assembly and the right clamping assembly, and the condition of the wafer is detected by matching the wafer detection mechanism, so that the convenience and the efficiency in use are improved.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a wafer storage device, comprising:
the wafer storage assembly comprises a plurality of positioning columns, an upper cover piece movably arranged on the plurality of positioning columns, a lower bearing piece movably arranged on the plurality of positioning columns, and a plurality of wafer bearing pieces movably arranged on the plurality of positioning columns and positioned between the upper cover piece and the lower bearing piece, wherein the plurality of wafer bearing pieces are used for containing wafers;
the left clamping assembly is arranged at the left side of the wafer storage assembly and comprises a left supporting piece, an upper left clamping jaw arranged on the left supporting piece and a lower left clamping jaw movably arranged at the lower side of the upper left clamping jaw;
the left transverse driving mechanism is arranged on the left clamping assembly and used for driving the left clamping assembly to transversely move;
the right clamping assembly is arranged at the right side of the wafer storage assembly and comprises a right support piece, an upper right clamping jaw arranged on the right support piece and a lower right clamping jaw movably arranged at the lower side of the upper right clamping jaw;
the right transverse driving mechanism is arranged on the right clamping assembly and used for driving the right clamping assembly to transversely move;
the longitudinal driving mechanism is arranged at one side of the wafer storage assembly and is used for connecting the wafer storage assembly or the left clamping assembly and the right clamping assembly; and
And the wafer detection mechanism is arranged at one side of the wafer storage assembly and is used for detecting wafers in the wafer storage assembly.
The wafer storage device comprises: the wafer inspection mechanism has a warp inspection piece and a wafer confirmation piece arranged at one side of the warp inspection piece.
The wafer storage device comprises: the wafer storage assembly is provided with a confirmation window corresponding to the wafer confirmation piece in position, and each wafer bearing piece is provided with a check area corresponding to the confirmation window in position.
The wafer storage device comprises: the wafer storage assembly is provided with a gas inlet and outlet mechanism.
The wafer storage device comprises: an air curtain component is arranged at one side of the wafer storage component.
A method for storing wafers, comprising the steps of:
(a) The wafer storage assembly or the left clamping assembly and the right clamping assembly are driven to move to the appointed position by a longitudinal driving mechanism, and a wafer detection mechanism is used for detecting a wafer between an upper cover piece and a lower bearing piece in the wafer storage assembly;
(b) A left transverse driving mechanism drives a left supporting piece in the left clamping assembly to move towards the direction of the wafer storage assembly, and a left upper clamping jaw and a left lower clamping jaw respectively clamp a wafer bearing piece;
(c) A right transverse driving mechanism drives a right supporting piece in the right clamping assembly to move towards the direction of the wafer storage assembly, and a right upper clamping jaw and a right lower clamping jaw respectively clamp a wafer bearing piece;
(d) After the plurality of wafer carriers are clamped, the longitudinal driving mechanism drives the lower carrier or the left clamping component and the right clamping component to move a first preset distance; and
(e) When the longitudinal driving mechanism moves, the left lower clamping jaw and the right lower clamping jaw drive the clamped wafer bearing piece to descend by a second preset distance so that a user can take and put wafers by utilizing the space generated by the first preset distance and the second preset distance.
The wafer storage method comprises the following steps: the wafer inspection mechanism has a warp inspection piece and a wafer confirmation piece arranged at one side of the warp inspection piece.
The wafer storage method comprises the following steps: the wafer storage assembly is provided with a confirmation window corresponding to the wafer confirmation piece in position, and each wafer bearing piece is provided with a check area corresponding to the confirmation window in position.
The wafer storage method comprises the following steps: the wafer storage assembly is provided with a gas inlet and outlet mechanism.
The wafer storage method comprises the following steps: an air curtain component is arranged at one side of the wafer storage component.
By means of the structure, when a user wants to take and put wafers, the longitudinal driving mechanism drives the wafer storage assembly to move to the designated position, or drives the left clamping assembly and the right clamping assembly to move to the designated position, and the left transverse driving mechanism drives the left support piece in the left clamping assembly to move towards the direction of the wafer storage assembly, and simultaneously drives the right support piece in the right clamping assembly to move towards the direction of the wafer storage assembly.
At this time, the upper left clamping jaw and the upper right clamping jaw simultaneously clamp the same wafer carrier or the upper cover member, the lower left clamping jaw and the lower right clamping jaw simultaneously clamp the other wafer carrier, and then the longitudinal driving mechanism drives the lower carrier to move downwards along the direction of the positioning column for a first preset distance, and the wafer carrier which is not clamped is also driven downwards by the linkage of the lower carrier.
After the lower bearing piece is moved, the left lower clamping jaw and the right lower clamping jaw can drive the clamped wafer bearing piece to descend for a second preset distance, so that a user can take and put the wafer bearing piece through a space generated by the first preset distance and the second preset distance, and when the wafer bearing piece is taken and put the wafer bearing piece, the wafer condition in the wafer storage assembly can be detected through the wafer detection mechanism, and related operation of the user is assisted, so that the advantages of improving the use efficiency and convenience can be achieved.
By means of the technology, the problem that the conventional small-sized wafer is difficult to take and place can be overcome, and the practical progress of the advantages is achieved.
Drawings
Fig. 1 is a perspective view of a preferred embodiment of the present invention.
Fig. 2 is a partial schematic view (one) of a preferred embodiment of the present invention.
Fig. 3 is a partial schematic view (ii) of a preferred embodiment of the present invention.
Fig. 4 is an exploded view of a wafer storage assembly according to a preferred embodiment of the present invention.
FIG. 5 is a flow chart of the steps of the preferred embodiment of the present invention.
Fig. 6 is a schematic view of vertical movement (one) according to a preferred embodiment of the present invention.
FIG. 7 is a schematic diagram of the detection according to the preferred embodiment of the present invention.
FIG. 8 is a schematic diagram illustrating the clamping of the preferred embodiment of the present invention.
Fig. 9 is a schematic view of vertical movement (two) according to a preferred embodiment of the invention.
Fig. 10 is a schematic view illustrating the movement of the clamping jaw according to the preferred embodiment of the invention.
FIG. 11 is a schematic drawing showing the removal of the preferred embodiment of the present invention.
Fig. 12 is a perspective view of still another preferred embodiment of the present invention.
FIG. 13 is a schematic airflow diagram of a further preferred embodiment of the present invention.
FIG. 14 is a schematic view of an air curtain according to another preferred embodiment of the present invention.
Fig. 15 is a perspective view of still another preferred embodiment of the present invention.
Fig. 16 is a schematic view (one) of a vertical movement according to another preferred embodiment of the present invention.
Fig. 17 is a schematic diagram illustrating clamping according to another preferred embodiment of the present invention.
Fig. 18 is a schematic view of a vertical movement (two) according to another preferred embodiment of the invention.
Reference numerals illustrate: a wafer storage assembly 1; a positioning column 11; an upper cover 12; a lower carrier 13; a wafer carrier 14; an inspection zone 141; a confirmation window 15; a longitudinal driving mechanism 2; a left clamp assembly 3; a left side support 31; upper left jaw 32; a left lower jaw 33; a left lateral drive mechanism 34; a right clamping assembly 4; a right side support 41; upper right jaw 42; lower right jaw 43; a right lateral drive mechanism 44; a wafer detecting mechanism 5; a warp detecting member 51; a wafer validation piece 52; a gas inlet and outlet mechanism 6; an intake pipe 61; an air outlet hole 62; an air curtain assembly 7; wafer W.
Detailed Description
In order to achieve the above objects and effects, the present invention adopts the technical means and structures, and the features and functions of the preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings, so as to facilitate complete understanding.
Referring to fig. 1 to 11, which are perspective views and schematic views illustrating removal of a preferred embodiment of the present invention, the present invention includes:
the wafer storage assembly 1 comprises a plurality of positioning columns 11, an upper cover member 12 movably arranged on each positioning column 11, a lower bearing member 13 movably arranged on each positioning column 11, and a plurality of wafer bearing members 14 movably arranged on each positioning column 11 and positioned between the upper cover member 12 and the lower bearing member 13;
a confirmation window 15 provided on the wafer storage module 1, and each wafer carrier 14 has a check area 141 corresponding to the confirmation window 15;
a longitudinal driving mechanism 2 connected to the lower bearing member 13, wherein the longitudinal driving mechanism 2 of the embodiment of the present invention takes a servo motor as an example;
a left clamping assembly 3 disposed at the left side of the wafer storage assembly 1, wherein the left clamping assembly 3 comprises a left supporting member 31, a left upper clamping jaw 32 disposed on the left supporting member 31, and a left lower clamping jaw 33 movably disposed at the lower side of the left upper clamping jaw 32, and the left lower clamping jaw 33 in the embodiment of the present invention is driven by a lifting cylinder as an example;
a left lateral driving mechanism 34 disposed on the left clamping component 3, wherein the left lateral driving mechanism 34 in the embodiment of the present invention takes a lateral cylinder as an example;
a right clamping assembly 4 disposed at the right side of the wafer storage assembly 1, wherein the right clamping assembly 4 comprises a right support 41, a right upper clamping jaw 42 disposed on the right support 41, and a right lower clamping jaw 43 movably disposed at the lower side of the right upper clamping jaw 42, and the right lower clamping jaw 43 in the embodiment of the present invention is driven by a lifting cylinder as an example;
a right lateral driving mechanism 44 disposed on the right clamping component 4, wherein the right lateral driving mechanism 44 of the embodiment of the present invention takes a lateral cylinder as an example; and
A wafer inspection mechanism 5 provided at one side of the wafer storage module 1, the wafer inspection mechanism 5 having a warp inspection piece 51 and a wafer confirm piece 52 provided at one side of the warp inspection piece 51, wherein the warp inspection piece 51 and the wafer confirm piece 52 are exemplified by optical detectors provided on the left and right clamping modules 3 and 4.
The structure of the present invention can be understood by the above description, and the advantage of more convenient and efficient use can be achieved according to the corresponding cooperation of the structure, and the detailed description will be described below.
The wafer storage method of the invention comprises the following steps:
(a) And (3) longitudinally moving: the wafer W between an upper cover 12 and a lower carrier 13 in the wafer storage assembly 1 is detected by a wafer detection mechanism 5 by driving a wafer storage assembly 1 or a left clamping assembly 3 and a right clamping assembly 4 to move to a designated position by a longitudinal driving mechanism 2;
(b) Left side clamping action: a left transverse driving mechanism 34 drives a left supporting member 31 in the left clamping assembly 3 to move towards the direction of the wafer storage assembly 1, and a left upper clamping jaw 32 and a left lower clamping jaw 33 respectively clamp a wafer carrier 14;
(c) Right side clamping action: a right transverse driving mechanism 44 drives a right supporting member 41 of the right clamping assembly 4 to move towards the direction of the wafer storage assembly 1, and a right upper clamping jaw 42 and a right lower clamping jaw 43 respectively clamp a wafer carrier 14;
(d) First opening action: after the plurality of wafer carriers 14 are clamped, the longitudinal driving mechanism 2 drives the lower carrier 13 or the left clamping component and the right clamping component to move a first preset distance; and
(e) A second opening operation: after the longitudinal driving mechanism 2 moves, the left lower clamping jaw 33 and the right lower clamping jaw 43 drive the clamped wafer carrier 14 to descend by a second predetermined distance, so that a user can take and place the wafer W by using the space generated by the first predetermined distance and the second predetermined distance.
As can be seen from the above steps, when a user wants to take and place a wafer W, the wafer storage assembly 1 is driven by the longitudinal driving mechanism 2 to move longitudinally to a designated position, and the wafer W on the first wafer carrier 14 below the upper cover 12 is taken as an example, so that the position of the upper cover 12 is aligned with the positions of the left upper clamping jaw 32 in the left clamping assembly 3 and the right upper clamping jaw 42 in the right clamping assembly 4 when the wafer W is taken to the designated position, i.e. the wafer carrier 14 from which the wafer W is to be taken is aligned with the positions of the left lower clamping jaw 33 and the right lower clamping jaw 43.
At this time, as shown in fig. 7, the wafer confirming member 52 in the wafer inspection mechanism 5 detects the condition in the wafer storage assembly 1 by using the position of the confirming window 15, and since each wafer carrier 14 has the inspection area 141, the inspection area 141 exposes each wafer W and is not blocked by the wafer carrier 14, the accuracy is high and is not affected by the wafer carrier 14 if the wafer confirming member 52 passes through the confirming window 15 to confirm that the wafer W is present, thereby achieving the advantage of accurately detecting whether the wafer carrier 14 has the wafer W placed thereon.
After confirming the wafer W, as shown in fig. 2, 3 and 8-10, the left lateral driving mechanism 34 drives the left supporting member 31 to move toward the wafer storing assembly 1, so that the left upper clamping jaw 32 is clamped on the upper cover member 12, the left lower clamping jaw 33 is clamped on the wafer carrier 14, and the right lateral driving mechanism 44 drives the right supporting member 41 to move toward the wafer storing assembly 1, so that the right upper clamping jaw 42 is clamped on the upper cover member 12, and the right lower clamping jaw 43 is clamped on the wafer carrier 14. The order of the left side supporting member 31 and the right side supporting member 41 is not limited, that is, the order of the step (b) and the step (c) is not limited, and the steps may be performed simultaneously, left and right, or right and left.
After the clamping is completed, the longitudinal driving mechanism 2 drives the lower carrier 13 to move downward by a first predetermined distance, and simultaneously drives the non-clamped wafer carrier 14 to move downward. After the longitudinal driving mechanism 2 is moved, the left lower clamping jaw 33 and the right lower clamping jaw 43 drive the clamped wafer carrier 14 to move downwards for a second predetermined distance, and the length of the second predetermined distance is smaller than the first predetermined distance, so that the clamped wafer carrier 14 clamped by the left lower clamping jaw 33 and the right lower clamping jaw 43 and the upper cover 12 above and another wafer carrier 14 below generate space.
At this time, the user can use the space to pick up and place the wafer W on the wafer carrier 14 clamped by the left lower clamping jaw 33 and the right lower clamping jaw 43, thereby picking up and placing the wafer W in the wafer storage assembly 1 without touching the upper cover member 12 and the remaining wafer carrier 14 below, so as to improve the convenience in use and reduce the possibility of collision damage. If the wafer W is to be placed on the wafer carrier 14, the warpage degree of the wafer W may be detected by the warpage detecting member 51 in the wafer detecting mechanism 5, so as to prevent the wafer W from being damaged due to collision against other wafer carriers 14 or the upper cover 12 when the wafer W is excessively warped.
After the picking and placing is completed, the above-mentioned actions can be reversely operated, that is, the left lower clamping jaw 33 and the right lower clamping jaw 43 drive the clamped wafer carrier 14 to move upwards to the original position, then the lower carrier 13 and the rest of wafer carriers 14 are driven by the longitudinal driving mechanism 2 to return to the original position upwards, and the left transverse driving mechanism 34 and the right transverse driving mechanism 44 drive the left clamping assembly 3 and the right clamping assembly 4 to be far away from the wafer storage assembly 1, so that the original storage state can be restored.
Referring to fig. 12 to 14, a perspective view and an air curtain diagram of another preferred embodiment of the present invention are shown, and it can be clearly seen from the drawings that the embodiment of the present invention is different from the above embodiment in size, and only in the embodiment of the present invention, a gas inlet and outlet mechanism 6 is disposed on the wafer storage assembly 1, and the gas inlet and outlet mechanism 6 of the embodiment of the present invention is composed of a plurality of gas inlet pipes 61 and gas outlet holes 62 disposed on the wafer storage assembly 1, so that clean gas can be introduced into the wafer storage assembly 1 according to requirements.
And an air curtain component 7 is arranged at one side of the wafer storage component 1, and the air curtain component 7 in the embodiment of the invention takes air curtain machines arranged at two sides of an inlet and an outlet for taking and placing wafers as examples, so that the air curtain effect generated by the air curtain component 7 can be transmitted, and external dirt can not enter the wafer storage component 1.
Referring to fig. 15 to fig. 18, a perspective view and a vertical movement schematic view (two) of another preferred embodiment of the present invention are shown, and it can be clearly seen that the embodiment of the present invention is different from the above embodiment in size, but in the embodiment of the present invention, the longitudinal driving mechanism 2 is used to connect the left clamping component 3 and the right clamping component 4 respectively as an example, so as to indicate that the connection objective of the longitudinal driving mechanism 2 is not limited.
Thus, the wafer storage device 1 will not move during operation, and the longitudinal driving mechanism 2 will first drive the left clamping device 3 and the right clamping device 4 to move upwards to a designated position, such as aligning the position of the upper cover 12 with the position of the upper left clamping jaw 32 in the left clamping device 3 and the position of the upper right clamping jaw 42 in the right clamping device 4. Then, as in the previous embodiment, the left lateral driving mechanism 34 drives the left supporting member 31 to move toward the wafer storage assembly 1, so that the left upper clamping jaw 32 is clamped on the upper cover member 12, the left lower clamping jaw 33 is clamped on the wafer carrier 14, and the right lateral driving mechanism 44 drives the right supporting member 41 to move toward the wafer storage assembly 1, so that the right upper clamping jaw 42 is clamped on the upper cover member 12, and the right lower clamping jaw 43 is clamped on the wafer carrier 14.
After the clamping is completed, the longitudinal driving mechanism 2 drives the left clamping assembly 3 and the right clamping assembly 4 to move upwards by a first predetermined distance, and the left lower clamping jaw 33 and the right lower clamping jaw 43 also drive the clamped wafer carrier 14 to move downwards by a second predetermined distance, so that a space for a user to take and place the wafer can be generated. When the picking and placing are finished, the actions are reversed, and the whole body can be restored to the original state.
The above description is illustrative of the invention and is not to be construed as limiting, and it will be understood by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A wafer storage device, comprising:
the wafer storage assembly comprises a plurality of positioning columns, an upper cover piece movably arranged on the plurality of positioning columns, a lower bearing piece movably arranged on the plurality of positioning columns, and a plurality of wafer bearing pieces movably arranged on the plurality of positioning columns and positioned between the upper cover piece and the lower bearing piece, wherein the plurality of wafer bearing pieces are used for containing wafers;
the left clamping assembly is arranged at the left side of the wafer storage assembly and comprises a left supporting piece, an upper left clamping jaw arranged on the left supporting piece and a lower left clamping jaw movably arranged at the lower side of the upper left clamping jaw;
the left transverse driving mechanism is arranged on the left clamping assembly and used for driving the left clamping assembly to transversely move;
the right clamping assembly is arranged at the right side of the wafer storage assembly and comprises a right support piece, an upper right clamping jaw arranged on the right support piece and a lower right clamping jaw movably arranged at the lower side of the upper right clamping jaw;
the right transverse driving mechanism is arranged on the right clamping assembly and used for driving the right clamping assembly to transversely move;
the longitudinal driving mechanism is arranged at one side of the wafer storage assembly and is used for connecting the wafer storage assembly or the left clamping assembly and the right clamping assembly; and
And the wafer detection mechanism is arranged at one side of the wafer storage assembly and is used for detecting wafers in the wafer storage assembly.
2. The wafer storage device of claim 1, wherein: the wafer inspection mechanism has a warp inspection piece and a wafer confirmation piece arranged at one side of the warp inspection piece.
3. The wafer storage device of claim 2, wherein: the wafer storage assembly is provided with a confirmation window corresponding to the wafer confirmation piece in position, and each wafer bearing piece is provided with a check area corresponding to the confirmation window in position.
4. The wafer storage device of claim 1, wherein: the wafer storage assembly is provided with a gas inlet and outlet mechanism.
5. The wafer storage device of claim 1, wherein: an air curtain component is arranged at one side of the wafer storage component.
6. A method for storing wafers, comprising the steps of:
(a) The wafer storage assembly or the left clamping assembly and the right clamping assembly are driven to move to the appointed position by a longitudinal driving mechanism, and a wafer detection mechanism is used for detecting a wafer between an upper cover piece and a lower bearing piece in the wafer storage assembly;
(b) A left transverse driving mechanism drives a left supporting piece in the left clamping assembly to move towards the direction of the wafer storage assembly, and a left upper clamping jaw and a left lower clamping jaw respectively clamp a wafer bearing piece;
(c) A right transverse driving mechanism drives a right supporting piece in the right clamping assembly to move towards the direction of the wafer storage assembly, and a right upper clamping jaw and a right lower clamping jaw respectively clamp a wafer bearing piece;
(d) After the plurality of wafer carriers are clamped, the longitudinal driving mechanism drives the lower carrier or the left clamping component and the right clamping component to move a first preset distance; and
(e) When the longitudinal driving mechanism moves, the left lower clamping jaw and the right lower clamping jaw drive the clamped wafer bearing piece to descend by a second preset distance so that a user can take and put wafers by utilizing the space generated by the first preset distance and the second preset distance.
7. The wafer storage method of claim 6, wherein: the wafer inspection mechanism has a warp inspection piece and a wafer confirmation piece arranged at one side of the warp inspection piece.
8. The wafer storage method of claim 7, wherein: the wafer storage assembly is provided with a confirmation window corresponding to the wafer confirmation piece in position, and each wafer bearing piece is provided with a check area corresponding to the confirmation window in position.
9. The wafer storage method of claim 6, wherein: the wafer storage assembly is provided with a gas inlet and outlet mechanism.
10. The wafer storage method of claim 6, wherein: an air curtain component is arranged at one side of the wafer storage component.
CN202211210910.3A 2022-09-30 2022-09-30 Wafer storage device and method thereof Pending CN117855115A (en)

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