CN117832148A - Wafer platform - Google Patents
Wafer platform Download PDFInfo
- Publication number
- CN117832148A CN117832148A CN202311873151.3A CN202311873151A CN117832148A CN 117832148 A CN117832148 A CN 117832148A CN 202311873151 A CN202311873151 A CN 202311873151A CN 117832148 A CN117832148 A CN 117832148A
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- block
- fixed block
- fixed
- spherical surface
- bearing plate
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- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000005489 elastic deformation Effects 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of wafer platforms, in particular to a wafer platform, which consists of a bottom plate, a bearing plate and a leveling mechanism, wherein the leveling mechanism is fixed on the side surfaces of the bottom plate and the bearing plate through a first fixed block and a second fixed block and is supported through a balance block, one side of the balance block is a convex spherical surface, and the convex spherical surface is propped against a matched concave spherical surface; each leveling mechanism is provided with two groups of limit tension springs on the side surfaces of the bottom plate and the bearing plate, Z-direction pretightening force is provided through the limit tension springs, Z-direction adjustment is limited, a limit spring piece is arranged, the middle end of the limit spring piece is connected with the second fixing block, the two ends of the limit spring piece are connected with the first fixing block, and XY-direction adjustment is limited. The invention adopts the abutting design of the convex spherical surface and the concave spherical surface, ensures that the contact stress surface is unchanged in the leveling process, enhances the stability after leveling, designs a X, Y, Z limiting device for adjusting, and avoids excessive movement in the adjusting process.
Description
Technical Field
The invention relates to the technical field of wafer platform equipment, and particularly provides a wafer platform.
Background
The wafer stage is a mechanism for placing a wafer, and because of the small size of the wafer, the accuracy requirements of various aspects of the semiconductor device related to the operation of the wafer are very high, and the parallelism of the wafer stage is one of the important accuracy requirements. The parallelism of the wafer stage generally refers to the parallelism between the surface of the wafer stage and a certain reference plane, which may be a horizontal plane or a surface of a device corresponding to the wafer stage, such as a chip head for placing a wafer. How to realize the high-precision and high-stability parallelism adjustment of the wafer platform is a technical problem to be solved.
Currently, parallelism adjustment of a wafer platform is generally realized by a leveling mechanism arranged on the periphery of the wafer platform, and a traditional wafer platform leveling mechanism is generally adjusted by adopting an adjusting bolt, and particularly, different heights are adjusted by rotating the adjusting bolt. However, when the wafer platform needs to be leveled with a certain reference plane with an inclination angle, the adjusting bolt can be integrally inclined, and particularly a certain angle can be generated between the bottom of the adjusting bolt and the contact surface, so that the area of the contact surface is reduced, and the instability is increased.
Disclosure of Invention
The invention provides a wafer platform for solving the problems, and the wafer platform is modularly designed for a leveling mechanism, adopts a bearing design of a convex spherical surface and a concave spherical surface, ensures that the contact area is unchanged in the adjusting process, improves the stability of the platform, and is provided with two groups of limiting devices, so that excessive movement during leveling and offset after leveling are avoided.
The wafer platform provided by the invention comprises: the device comprises a bottom plate, a bearing plate and a leveling mechanism;
the bearing plate is arranged above the bottom plate and is used for placing a wafer;
the leveling mechanism comprises a first fixed block, a second fixed block, a balance block, an adjusting block, a limiting tension spring and a limiting spring piece; the first fixing block is connected with the bottom plate, the second fixing block is connected with the bearing plate, and the balance block is arranged between the first fixing block and the second fixing block;
the balance block is connected with the first fixed block or the second fixed block, one side far away from the connecting surface is a convex spherical surface, the surface of the second fixed block or the first fixed block facing the convex spherical surface is provided with a concave spherical surface, and the convex spherical surface of the balance block is propped in the concave spherical surface;
the lower end of the adjusting block is fixed on the side face of the first fixed block, the upper end of the adjusting block is connected with a threaded rod, and the second fixed block is pushed by the threaded rod;
two ends of the limiting tension spring are respectively connected with the first fixed block and the second fixed block and are used for limiting the vertical adjustment of the bearing plate;
the two ends of the limiting spring piece are fixed with the first fixing block, and the middle end of the limiting spring piece is fixed with the second fixing block and used for limiting the horizontal direction adjustment of the bearing plate.
Preferably, the leveling mechanism comprises three leveling mechanisms, and the leveling mechanisms are uniformly distributed along the circumference of the bottom plate and the bearing plate.
Preferably, the connecting surface of the balance weight is provided with a threaded counter bore, the second fixed block is provided with a matched threaded through hole, the balance weight is connected with the second fixed block through a bolt, and the height of the bearing plate is adjusted by controlling the screwing quantity of the bolt.
Preferably, the adjusting block comprises three adjusting blocks, wherein the three adjusting blocks are respectively arranged on two sides and the outer side of the first fixing block and the second fixing block, a threaded through hole is formed in the upper ends of the three adjusting blocks and screwed into the threaded rod, the tail end of the threaded rod is propped against the second fixing block, and the bearing plate is adjusted by controlling the screwing quantity of the threaded rod.
Preferably, the adjusting block is a strip structure, and is made of a material with elastic deformation characteristics.
Preferably, the two limiting tension springs are arranged on two sides of the first fixing block and the second fixing block respectively, and two ends of each limiting tension spring are connected with the first fixing block and the second fixing block through fixing bolts.
Preferably, the limit spring piece comprises two symmetrical spring pieces and a T-shaped connecting piece, the far end of the spring piece is fixedly connected with the upper surface of the first fixed block through a fixing bolt, the near end of the spring piece is of an inward arch structure, the arch structures of the two spring pieces are connected through the head parts of the T-shaped connecting pieces, and the tail parts of the T-shaped connecting pieces are connected with the second fixed block.
Preferably, the limit spring piece is made of SUS301 stainless steel.
Compared with the prior art, the invention has the following beneficial effects:
the leveling mechanisms are modularized, the number of the leveling mechanisms can be determined according to the actual requirements of the wafer platform, and the leveling mechanisms are flexibly arranged around the wafer platform; the leveling mechanism adopts the abutting design of the convex spherical surface and the concave spherical surface, ensures that the contact stress surface is unchanged in the leveling process, enhances the stability after leveling, and avoids the reduction of the contact stress surface caused by the inclination of the support rod when the inclination exists between the bottom plate and the bearing plate of the traditional wafer platform, wherein the surface contact is changed into point contact, so that concentrated stress is generated, the long-time maintenance is not easy, and the mechanical stability is reduced.
The invention designs the tension spring for Z-direction limiting and the spring piece for XY-direction limiting, provides pretightening force through the tiny deformation of the limiting device, realizes high-precision and high-linearity platform leveling, and avoids excessive movement in the adjusting process through the limiting device.
The limiting spring piece designed by the invention is provided with three external force input ends, so that the limiting spring piece can provide a restoring force when being longitudinally stretched or compressed, and can also provide a restoring force when the two ends and the middle end are relatively deviated; and the limit spring piece is used for realizing the limit of the X direction and the Y direction.
Drawings
FIG. 1 is a block diagram of a wafer stage provided in accordance with an embodiment of the present invention;
FIG. 2 is a block diagram of a leveling mechanism provided in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a leveling mechanism provided in accordance with an embodiment of the present invention;
FIG. 4 is an exploded view of a leveling mechanism provided in accordance with an embodiment of the present invention;
fig. 5 is a structural view of a limit spring piece according to an embodiment of the present invention.
Wherein reference numerals include:
the bottom plate 1, the bearing plate 2, the leveling mechanism 3, the first fixed block 31, the second fixed block 32, the balance block 33, the convex spherical surface 331, the connecting surface 332, the adjusting block 34, the limit tension spring 35, the limit spring piece 36, the elastic sheet 361 and the T-shaped connecting sheet 362.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, like modules are denoted by like reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, a detailed description thereof will not be repeated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention.
As shown in fig. 1, the high-stability wafer platform provided by the embodiment of the invention mainly comprises a bottom plate 1, a bearing plate 2 and a leveling mechanism 3, wherein the bottom plate 1 and the bearing plate 2 are both in a circular design, and the bearing plate 2 is coaxially arranged above the bottom plate 1. The leveling mechanism 3 is arranged on the side surfaces of the bottom plate 1 and the bearing plate 2 and is used for leveling the bearing plate 2.
The bottom plate 1 is a base of the wafer platform and is used for supporting the whole wafer platform, and the bottom plate 1 can be fixed at a working position through bolts or other modes to realize the fixation of the whole wafer platform.
The carrying plate 2 is used for carrying a wafer or a wafer disc, and the like, and the carrying plate 2 needs to be adjusted according to actual working conditions to adjust the parallelism between the upper surface of the carrying plate and a working reference surface. It should be noted that the working reference plane is independent of the base plate 1, the reference plane may be a horizontal plane, or may be a device surface corresponding to the wafer platform, and the leveling process is to adjust the positional relationship between the carrier plate 2 and the reference plane, so that the carrier plate 2 and the base plate 1 may be parallel after leveling, or may have a horizontal included angle.
As shown in fig. 2, 3 and 4, the leveling mechanisms 3 are in a modularized design, the number of the leveling mechanisms 3 is designed according to actual requirements, and the leveling mechanisms 3 are uniformly distributed in the circumferences of the bottom plate 1 and the bearing plate 2. Each leveling mechanism 3 comprises a first fixing block 31, a second fixing block 32, a balance block 33, an adjusting block 34, a limit tension spring 35 and a limit spring piece 36, wherein the first fixing block 31 is arranged on the side face of the bottom plate 1, threaded blind holes are correspondingly formed in the side face of the bottom plate 1, and the first fixing block 31 is fixed through bolts. The second fixing block 32 is arranged on the side surface of the bearing plate 2, a threaded blind hole is correspondingly arranged on the side surface of the bearing plate 2, the second fixing block 32 is fixed through bolts, and the first fixing block 31 and the second fixing block 32 are oppositely arranged.
As a preferred embodiment, the number of the leveling mechanisms 3 is 3, and the leveling mechanisms are uniformly arranged at the side edge positions of the bottom plate 1 and the bearing plate 2, so that the height of the bearing plate 2 can be adjusted at three positions, and the parallelism of the bearing plate 2 can be adjusted.
The weight 33 is provided between the first fixed block 31 and the second fixed block 32, and the weight 33 abuts against the upper surface of the first fixed block 31 and the lower surface of the second fixed block 32, respectively. Specifically, the balance block 33 includes a connection surface 332 and a convex spherical surface 331, the convex spherical surface 331 is downward, and is connected with the second fixed block 32 through the connection surface 332, and is abutted to the first fixed block 31 through the convex spherical surface 331, and the surface of the abutment position of the first fixed block 31 is a concave spherical surface, and the convex spherical surface 331 of the balance block 33 is matched with the surface shape of the concave spherical surface of the first fixed block 31. The center of the connecting surface 332 of the balance weight 33 is provided with a threaded counter bore, the corresponding position of the second fixed block 32 is provided with a matched threaded through hole, the balance weight 33 is connected with the second fixed block 32 through a bolt, and the height of the bearing plate 2 or the included angle between the bearing plate 2 and the bottom plate 1 is adjusted through controlling the screwing quantity of the bolt. When an inclination angle exists between the bearing plate 2 and the bottom plate 1, the convex spherical surface 331 can relatively rotate in the concave spherical surface, and the contact stress area of the convex spherical surface 331 and the concave spherical surface is unchanged all the time in the rotation process.
As a preferred embodiment, the convex spherical surface 331 of the balance weight 33 faces upward, is connected to the first fixed block 31 by the connection surface 332, abuts against the second fixed block 32 by the convex spherical surface 331, and the abutment position surface of the second fixed block 32 is a concave spherical surface facing downward, and the convex spherical surface 331 of the balance weight 33 is adapted to the shape of the concave spherical surface of the second fixed block 32. The center of the connecting surface 332 of the balance weight 33 is provided with a threaded counter bore, the corresponding position of the first fixed block 31 is provided with a matched threaded through hole, the balance weight 33 is connected with the first fixed block 31 through a bolt, and the height of the bearing plate 2 or the included angle between the bearing plate 2 and the bottom plate 1 is adjusted by controlling the screwing quantity of the bolt. When an inclination angle exists between the bearing plate 2 and the bottom plate 1, the concave spherical surface can relatively rotate on the convex spherical surface 331, and in the rotation process, the contact stress area of the convex spherical surface 331 and the concave spherical surface is unchanged all the time.
Grooves are formed in both sides and the outer side face of the first fixing block 31, an adjusting block 34 is arranged in the grooves, the adjusting block 34 is of a strip-shaped structure and made of materials with elastic deformation characteristics, elastic deformation can occur after stress, the lower end of the adjusting block 34 faces the first fixing block 31, the upper end of the adjusting block 34 faces the second fixing block 32, a threaded through hole is formed in the position, facing the first fixing block 31, of the lower end of the adjusting block 34, a threaded through hole or a threaded counter bore is formed in the corresponding position of the side face of the first fixing block 31, and the lower end of the adjusting block 34 is fixed on the second fixing block 32 through matched bolts. A threaded through hole is also formed in the position, facing the second fixed block 32, of the upper end of the adjusting block 34, and a bolt is screwed into the threaded through hole to push and support the second fixed block 32. By controlling the screwing quantity of bolts at two sides of the second fixed block 32, the second fixed block 32 is pushed along the tangential direction to drive the bearing plate 2 to deflect, the convex spherical surface 331 of the balance block 33 can rotate in the concave spherical surface, so that the angle of the second fixed block 32 relative to the horizontal plane is changed, and the angle and the position of the bearing plate 2 at the connecting point can be changed due to the fixed connection of the second fixed block 32 and the bearing plate 2, so that the adjustment of the planeness of the whole bearing plate 2 is realized. In addition, by controlling the screwing amount of the outer bolt of the second fixing block 32, the second fixing block 32 can be pushed in the radial direction to drive the bearing plate 2 to deflect. According to the embodiment of the invention, the three adjusting blocks 34 are respectively arranged on three different sides of the second fixing block 32, so that the angle of the second fixing block 22 can be expected to be adjusted from three directions at the same time, more accurate flatness adjustment is realized, and after adjustment, the angle of the bearing plate 2 can be maintained through the abutting force of the bolts.
As a preferred embodiment, a through hole is opened at the upper end of the adjustment block 34 toward the second fixing block 32, and a pin is inserted into the through hole. The second fixing block 32 is pushed by the pin, and after adjustment, the pin is fixed to maintain the angle of the carrier plate 2.
Screw thread counter bores are formed in the side surfaces of the bottom plate 1 and the bearing plate 2 at the two side positions of the first fixing block 31 and the second fixing block 32, and 4 fixing bolts are fixed through the screw thread counter bores, wherein the fixing bolts are in pairs. The positions of the two fixing bolts in each group correspond to each other, two ends of the limiting tension spring 35 are sleeved on the fixing bolts, and the fixing bolts are provided with bayonets, so that the limiting tension spring 35 is prevented from falling off. The limiting tension spring 35 is a component for limiting the second fixed block 32 in the Z direction, and has the function of avoiding excessive movement of the second fixed block 32 caused by excessive adjustment of the bearing plate 2 in the Z direction, and limiting the movement range of the second fixed block, thereby being beneficial to improving the accuracy of adjustment.
As shown in fig. 5, the spacing spring piece 36 includes two symmetrical spring pieces 361 and a T-shaped connecting piece 362, the whole is in a long strip shape, the T-shaped connecting piece 362 includes a head and a tail, the head is the connecting ports on two sides on the same straight line, and the tail is the middle end perpendicular to the straight line where the connecting ports on two sides are located. The length direction of the two elastic sheets 361 is on the same straight line, and the distal ends of the elastic sheets 361 are sleeved on the fixed bolts through the connecting rings and are fixedly connected with the upper surface of the first fixed block 31 through the fixed bolts. The proximal ends of the elastic plates 361 are inward arch structures, the arch openings of the two elastic plates 361 are opposite, the apexes of the arch structures of the two elastic plates 361 are connected through the head parts of the T-shaped connecting plates 362, and the tail parts of the T-shaped connecting plates 362 are connected with the second fixed block 32. Specifically, the tail of the T-shaped connecting piece 362 is sleeved on the fixing bolt through the connecting ring, and the fixing bolt is fixed on the upper surface of the second fixing block 32. The limiting spring piece 36 is a member for limiting the second fixed block 32 in the X and Y directions, and has the function of avoiding excessive movement of the second fixed block 32 due to excessive adjustment of the carrier plate 2 in the X and Y directions, and limiting the movement range thereof, thereby being beneficial to improving the accuracy of adjustment.
As a preferred embodiment, the limit spring piece 36 is made of SUS301 stainless steel material, which is obtained by ductile working of the stainless steel material, and the stainless steel material is hardened after deformation, so that the shape is maintained, and when the elastic pieces 361 on both sides are longitudinally stretched or compressed, a restoring force is generated, and the adjustment amount in the direction is controlled; when the tail of the T-shaped connecting piece 362 is longitudinally stretched or compressed, the limit spring pieces 36 on the two sides are relatively offset from the middle end, and a restoring force is also generated to control the adjustment amount in the direction.
While embodiments of the present invention have been illustrated and described above, it will be appreciated that the above described embodiments are illustrative and should not be construed as limiting the invention. Variations, modifications, alternatives and variations of the above-described embodiments may be made by those of ordinary skill in the art within the scope of the present invention.
The above embodiments of the present invention do not limit the scope of the present invention. Any other corresponding changes and modifications made in accordance with the technical idea of the present invention shall be included in the scope of the claims of the present invention.
Claims (8)
1. A wafer platen, comprising: the device comprises a bottom plate, a bearing plate and a leveling mechanism;
the bearing plate is arranged above the bottom plate and is used for placing a wafer;
the leveling mechanism comprises a first fixed block, a second fixed block, a balance block, an adjusting block, a limiting tension spring and a limiting spring piece; the first fixing block is connected with the bottom plate, the second fixing block is connected with the bearing plate, and the balance block is arranged between the first fixing block and the second fixing block;
the balance block is connected with the first fixed block or the second fixed block, one side far away from the connecting surface is a convex spherical surface, the surface of the second fixed block or the first fixed block facing the convex spherical surface is provided with a concave spherical surface, and the convex spherical surface of the balance block is propped in the concave spherical surface;
the lower end of the adjusting block is fixed on the side face of the first fixed block, the upper end of the adjusting block is connected with a threaded rod, and the second fixed block is pushed by the threaded rod;
two ends of the limiting tension spring are respectively connected with the first fixed block and the second fixed block and are used for limiting the vertical adjustment of the bearing plate;
the two ends of the limiting spring piece are fixed with the first fixing block, and the middle end of the limiting spring piece is fixed with the second fixing block and used for limiting the horizontal direction adjustment of the bearing plate.
2. The wafer platform of claim 1, comprising three of said leveling mechanisms and being circumferentially spaced about said base plate and said carrier plate.
3. The wafer platform of claim 1, wherein the connecting surface of the balance weight is provided with a threaded counter bore, the second fixed block is provided with a matched threaded through hole, the balance weight is connected with the second fixed block through a bolt, and the height of the bearing plate is adjusted by controlling the screwing amount of the bolt.
4. The wafer platform according to claim 1, wherein the adjusting blocks comprise three adjusting blocks, which are respectively arranged at two sides and at the outer sides of the first fixing block and the second fixing block, the upper ends of the three adjusting blocks are respectively provided with a threaded through hole and screwed into a threaded rod, the tail ends of the threaded rod are propped against the second fixing block, and the bearing plate is adjusted by controlling the screwing amount of the threaded rod.
5. The wafer platform of claim 1, wherein the conditioning block is an elongated structure that is made of a material having elastic deformation characteristics.
6. The wafer platform of claim 1, comprising two said limit tension springs, one on each side of said first and second fixed blocks, wherein each of said limit tension springs is connected to said first and second fixed blocks by a securing pin.
7. The wafer platform of claim 1, wherein the limit spring comprises two symmetrical spring plates and a T-shaped connecting plate, the distal end of the spring plate is fixedly connected with the upper surface of the first fixing block through a fixing bolt, the proximal end of the spring plate is of an inward dome-shaped structure, the dome-shaped structures of the two spring plates are connected through the head of the T-shaped connecting plate, and the tail of the T-shaped connecting plate is connected with the second fixing block.
8. The wafer platform as claimed in claim 7, wherein the stopper spring piece is made of SUS301 stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311873151.3A CN117832148A (en) | 2023-12-29 | 2023-12-29 | Wafer platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311873151.3A CN117832148A (en) | 2023-12-29 | 2023-12-29 | Wafer platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117832148A true CN117832148A (en) | 2024-04-05 |
Family
ID=90518741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311873151.3A Pending CN117832148A (en) | 2023-12-29 | 2023-12-29 | Wafer platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117832148A (en) |
-
2023
- 2023-12-29 CN CN202311873151.3A patent/CN117832148A/en active Pending
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