CN117818445A - Vehicle-mounted integrated cooling and heating cup stand and automobile - Google Patents
Vehicle-mounted integrated cooling and heating cup stand and automobile Download PDFInfo
- Publication number
- CN117818445A CN117818445A CN202410200490.3A CN202410200490A CN117818445A CN 117818445 A CN117818445 A CN 117818445A CN 202410200490 A CN202410200490 A CN 202410200490A CN 117818445 A CN117818445 A CN 117818445A
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- liner
- inner container
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- 238000001816 cooling Methods 0.000 title claims abstract description 144
- 238000010438 heat treatment Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 83
- 238000009413 insulation Methods 0.000 claims abstract description 41
- 238000005057 refrigeration Methods 0.000 claims description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 26
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 238000004321 preservation Methods 0.000 claims description 15
- 239000004519 grease Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000010792 warming Methods 0.000 abstract description 15
- 230000009545 invasion Effects 0.000 abstract description 4
- 235000013361 beverage Nutrition 0.000 description 21
- 238000000034 method Methods 0.000 description 7
- 230000035622 drinking Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 241000196324 Embryophyta Species 0.000 description 4
- 241000190070 Sarracenia purpurea Species 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 235000020965 cold beverage Nutrition 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000012171 hot beverage Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N3/00—Arrangements or adaptations of other passenger fittings, not otherwise provided for
- B60N3/10—Arrangements or adaptations of other passenger fittings, not otherwise provided for of receptacles for food or beverages, e.g. refrigerated
- B60N3/104—Arrangements or adaptations of other passenger fittings, not otherwise provided for of receptacles for food or beverages, e.g. refrigerated with refrigerating or warming systems
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a vehicle-mounted integrated cooling and heating cup holder and an automobile, wherein the vehicle-mounted integrated cooling and heating cup holder comprises a semiconductor refrigerating sheet, a cooling liner and a thermal liner; the semiconductor cooling device comprises a cooling inner container and is characterized in that a first temperature conduction device is arranged between a cooling end of the semiconductor cooling sheet and the cooling inner container, a second temperature conduction device is arranged between a heating end of the semiconductor cooling sheet and the thermal insulation inner container, and accommodating cavities are formed in the cooling inner container and the thermal insulation inner container. The automobile comprises a handrail box, and a vehicle-mounted integrated cooling and heating cup stand is arranged in the handrail box. The invention can provide cooling or/and warming functions, does not need parts such as fans to cool and dissipate heat, avoids the common fan noise and hot air invasion problems of similar products in the market, and simplifies the structure.
Description
Technical Field
The invention relates to automobile parts, in particular to a vehicle-mounted integrated cooling and heating cup stand and an automobile.
Background
The cup stand is generally arranged on a central control armrest box of an automobile and is used for placing water cups or beverages. Along with the promotion of living standard, the passenger has also had different demands to the beverage, for example some passengers like to drink hot drink, and some passengers like to drink cold drink, and the saucer only is used for placing drinking cup or beverage and can't satisfy passenger's requirement to the quality of life, although in prior art through being provided with refrigeration and refrigerating plant in the saucer bottom to can cool down or keep warm to drinking cup or beverage in the saucer, but current refrigeration and refrigerating plant structure is complicated on the one hand, and most supporting have parts such as fan easily to produce noise, and on the other hand current refrigeration and refrigerating plant can't realize cooling and cold-keeping two kinds of functions simultaneously.
CN209888717U discloses a novel vehicle-mounted cooling and heating cup holder, which is of a split structure and comprises a control button, a temperature control device, a cup body, a shell and a magic tape; the cup body comprises a cup seat and a cup, the cup seat is provided with a cavity for accommodating the cup, and the shell comprises a shell, a large cover plate and a small cover plate; the magic subsides are including taking gluey magic subsides pin thread, taking gluey magic subsides box, and it sets up the interior bottom at the outer bottom of shell and central channel storing box respectively, the magic subsides cooperation is fixed the changes in temperature saucer in central channel storing box, just the changes in temperature saucer is fixed through the constant head tank cooperation of the constant head tank of central channel storing box with the shell. The cold and warm cup stand is of a split structure, is convenient to drink and clean, has the functions of refrigerating and heating, realizes the fixed installation of the cold and warm cup stand and the storage box through the magic tape, ensures the driving safety, simultaneously facilitates the replacement of the cold and warm cup stand, reasonably utilizes the space of the storage box, and cannot damage the original vehicle structure. Needless to say, the technical solution disclosed in the above patent document is a beneficial attempt in the technical field, but the technical problems of complex structure, easy noise generation, and incapability of realizing two functions of cooling and warming at the same time are not solved yet.
CN103786622a discloses a heating and refrigerating device and method for a cup stand of an automobile armrest box, the cup stand is arranged on the armrest box body, and a semiconductor chip for heating and refrigerating is arranged at the bottom end of the cup stand in the armrest box body; the heating and refrigerating method for the cup stand of the automobile armrest box is realized by using the heating and refrigerating device; this car handrail case saucer heating and refrigerating plant is through setting up semiconductor chip in handrail case saucer bottom, and semiconductor chip can realize quick heating or refrigeration after the circular telegram to teacup or beverage in the quick heating or the cooling saucer, and then improves the travelling comfort of user by bus. Needless to say, the technical solution disclosed in the above patent document is a beneficial attempt in the technical field, but the technical problems that two functions of cooling and warming cannot be achieved at the same time are not solved yet.
Disclosure of Invention
Therefore, the invention aims to provide the vehicle-mounted integrated cooling and heating cup stand and the vehicle, which can provide cooling or/and warming functions, do not need parts such as fans to cool and dissipate heat, avoid the common fan noise and hot air invasion problems of similar products in the market, and simplify the structure.
The invention relates to a vehicle-mounted integrated cooling and heating cup stand, which comprises a semiconductor refrigerating sheet, a cooling liner and a thermal liner; the semiconductor cooling device comprises a cooling inner container and is characterized in that a first temperature conduction device is arranged between a cooling end of the semiconductor cooling sheet and the cooling inner container, a second temperature conduction device is arranged between a heating end of the semiconductor cooling sheet and the thermal insulation inner container, and accommodating cavities are formed in the cooling inner container and the thermal insulation inner container.
Further, the first temperature conduction device comprises a first aluminum block, one side of the first aluminum block, which faces the cooling inner container, is provided with a first groove, one side of the first aluminum block, which faces the semiconductor refrigerating piece, is provided with a first plane, the first groove is attached to the outer wall of the cooling inner container in a conformal manner, and the first plane is connected with the refrigerating end of the semiconductor refrigerating piece in a heat conduction manner.
Further, the first plane is directly contacted with the refrigerating end of the semiconductor refrigerating sheet, or the first plane is contacted with the refrigerating end of the semiconductor refrigerating sheet after silicone grease is smeared.
Further, the second temperature conduction device comprises a second aluminum block, a second groove is formed in one side, facing the thermal insulation inner container, of the second aluminum block, a second plane is formed in one side, facing the semiconductor refrigerating sheet, of the second aluminum block, the second groove is attached to the outer wall of the thermal insulation inner container in a conformal mode, and the second plane is connected with the heating end of the semiconductor refrigerating sheet in a heat conducting mode.
Further, the second plane is directly contacted with the heating end of the semiconductor refrigeration sheet, or is contacted with the heating end of the semiconductor refrigeration sheet after silicone grease is coated on the second plane.
Further, the heat insulation liner comprises a temperature control balance heat dissipation block, the temperature control balance heat dissipation block is arranged on one side, far away from the second temperature conduction device, of the heat insulation liner, a third groove is formed in one side, facing the heat insulation liner, of the temperature control balance heat dissipation block, the third groove is in conformal fit with the outer wall of the heat insulation liner, and a plurality of heat dissipation ribs are arranged on one side, far away from the heat insulation liner, of the temperature control balance heat dissipation block.
Further, the vehicle temperature control device comprises a control module, a first temperature sensor and a second temperature sensor, wherein the first temperature sensor, the second temperature sensor and the semiconductor refrigerating sheet are connected with the control module, and the control module is connected with the whole vehicle ECU or the vehicle internal environment temperature sensor; the first temperature sensor is used for collecting a first temperature of the cooling liner; the second temperature sensor is used for collecting a second temperature of the heat preservation liner; the control module is used for: acquiring a first temperature and a second temperature; acquiring the in-vehicle environment temperature from the whole vehicle ECU or an in-vehicle environment temperature sensor; responding to the difference value between the first temperature and the internal environment temperature of the vehicle not smaller than the first temperature difference upper critical value and the difference value between the second temperature and the internal environment temperature of the vehicle not smaller than the second temperature difference upper critical value, and sending out a control instruction for closing the semiconductor refrigerating sheet; and responding to the fact that the difference value between the first temperature and the internal environment temperature is not larger than a critical value under the first temperature difference or/and the difference value between the second temperature and the internal environment temperature is not larger than a critical value under the second temperature difference, and sending a control instruction for starting the semiconductor refrigerating sheet.
Further, still include the heat preservation casing, set up in the pre-buried bottom plate of heat preservation casing's downside and set up in the installing support of pre-buried bottom plate's downside, the inside of heat preservation casing is provided with and is used for holding semiconductor refrigeration piece, cooling inner bag and the cavity of cold-proof inner bag, still set up the recess of stepping down on the heat preservation casing, temperature control device set up in the outside of heat preservation casing.
Further, the control module is provided with a button switch, a wire harness connector and a fixing device; and cup pads are arranged in the cooling inner container and the thermal insulation inner container.
The invention relates to an automobile, which comprises a handrail box, wherein a vehicle-mounted integrated cooling and heating cup stand is arranged in the handrail box, a button switch is exposed out of the handrail box, a mounting bracket is connected with an automobile body below the handrail box, an opening is formed in the handrail box at a position corresponding to the cooling inner container and the thermal insulation inner container, a first decorative ring is arranged in the handrail box at a position corresponding to the cooling inner container, and a second decorative ring is arranged in the handrail box at a position corresponding to the thermal insulation inner container.
The beneficial effects of the invention are as follows:
(1) The vehicle-mounted integrated cooling and heating cup stand can provide cooling or/and warming functions, a passenger can only select the cooling function, only select the warming function or simultaneously perform the cooling and warming functions respectively according to own requirements, and when the vehicle-mounted integrated cooling and heating cup stand is used, the passenger can place a water cup or beverage into the cooling liner or/and the warming liner according to the requirements.
(2) The cooling liner and the thermal liner are mutually opposite cooling and radiating, parts such as a fan and the like are not required to cool and radiate, the common fan noise and hot air invasion problems of similar products in the market are avoided, and the structures of the cover plate and the sealing part are greatly simplified because the fan is not required, so that the integral structure is simplified.
(3) The first aluminum block and the second aluminum block have good heat conductivity, and the temperature conduction effect can be further ensured by increasing the contact area.
(4) According to the invention, the heat of the thermal insulation inner container is radiated to the environment in the vehicle by the temperature control balance radiating block, so that the balance of the thermal insulation inner container and the cooling inner container in the temperature control process is ensured, and the thermal insulation inner container is prevented from being heated too fast.
(5) The temperature control device can control temperature more accurately when realizing the cooling and warming functions.
Drawings
In order to make the objects, technical solutions and advantageous effects of the present invention more clear, the present invention provides the following drawings for description:
FIG. 1 is a schematic diagram of a vehicle-mounted integrated cooling and heating cup holder;
FIG. 2 is an exploded view of the vehicle-mounted integrated cooling and heating cup holder of the present invention;
FIG. 3 is a schematic diagram of the connection between the vehicle-mounted integrated cooling and heating cup holder and the armrest box;
FIG. 4 is a top view of the connection of the vehicle-mounted integrated cooling and heating cup holder and the armrest box of the invention
FIG. 5 is a schematic view in section A-A of FIG. 4;
fig. 6 is a schematic diagram of the working principle of the vehicle-mounted integrated cooling and heating cup stand.
The figures are marked as follows:
the cooling and heating cup comprises a 1-vehicle-mounted integrated cooling and heating cup holder, 11-semiconductor refrigerating sheets, 12-cooling inner containers, 13-first aluminum blocks, 131-first grooves, 132-first planes, 14-heat-preserving inner containers, 15-second aluminum blocks, 151-second grooves, 152-second planes, 16-temperature-control balance radiating blocks, 161-third grooves, 162-radiating ribs, 17-temperature control devices, 171-control modules, 172-first temperature sensors, 173-button switches, 174-wire harness connectors, 175-fixing devices, 18-heat-preserving shells, 181-cavities, 182-giving-out grooves, 19-embedded bottom plates, 110-mounting brackets and 120-cup mats;
2-armrest box, 3-first decorative ring, 4-second decorative ring and 5-cup.
Detailed Description
The technical scheme of the invention is described in detail below with reference to the accompanying drawings and examples.
As shown in fig. 1-6, a vehicle-mounted integrated cooling and heating cup holder 1 in this embodiment includes a semiconductor refrigeration sheet 11, a cooling liner 12 and a thermal liner 14; a first temperature conduction device is arranged between the refrigerating end of the semiconductor refrigerating sheet 11 and the cooling liner 12, a second temperature conduction device is arranged between the heating end of the semiconductor refrigerating sheet 11 and the thermal liner 14, and the cooling liner 12 and the thermal liner 14 are both provided with accommodating cavities.
When the semiconductor cooling device is arranged, the cooling liner 12 and the thermal liner 14 are respectively arranged on different sides of the semiconductor cooling plate 11, for example, the cooling end of the semiconductor cooling plate 11 faces leftwards and the heating end faces rightwards, the cooling liner 12 and the first temperature conduction device are arranged on the left side of the semiconductor cooling plate 11, and the thermal liner 14 and the second temperature conduction device are arranged on the right side of the semiconductor cooling plate 11; for another example, the refrigerating end of the semiconductor refrigerating sheet 11 faces right, the heating end faces left, and the cooling liner 12 and the first temperature conduction device are disposed on the right side of the semiconductor refrigerating sheet 11, and the thermal insulation liner 14 and the second temperature conduction device are disposed on the left side of the semiconductor refrigerating sheet 11. In this embodiment, the structure in which the refrigerating end of the semiconductor refrigerating sheet 11 faces leftward and the refrigerating end faces rightward will be described.
The semiconductor cooling fin 11 is also called a semiconductor chip, and is cooled and heated while energized by the peltier effect.
The cooling generated by the refrigerating end of the semiconductor refrigerating piece 11 after being electrified is conducted to the cooling liner 12 through the first temperature conduction device and diverged into the accommodating cavity of the cooling liner 12, so that the water cup 5, beverage or air in the accommodating cavity of the cooling liner 12 can be cooled; the heating temperature generated by the heating end of the semiconductor refrigeration piece 11 after being electrified is conducted to the thermal insulation liner 14 through the second temperature conduction device and is dispersed into the accommodating cavity of the thermal insulation liner 14, so that the temperature of the water cup 5, the beverage or the air in the accommodating cavity of the thermal insulation liner 14 can be increased. In this process, the cooling liner 12 and the thermal liner 14 are mutually cooled and radiated, and parts such as a fan are not required to cool and radiate, so that the common fan noise and hot air invasion problems of similar products in the market are avoided, and the cover plate and sealing part structure are greatly simplified because the fan is not required, so that the simplification of the whole structure is realized.
The vehicle-mounted integrated cooling and heating cup stand 1 can provide cooling and heat-preserving functions to a certain extent, for example, the temperature is 7-15 ℃ lower than the environment temperature in the vehicle, for example, the heat preservation temperature is 7-15 ℃ higher than the environment temperature, an occupant can only select the cooling function, only select the heat-preserving function or simultaneously perform the cooling and heat-preserving functions respectively according to own needs, and when in use, the occupant can place the water cup 5 or beverage in the cooling liner 12 or/and the heat-preserving liner 14 according to the needs.
When the passenger has the cooling demand, place the drinking cup 5 or the beverage that need cool down in the holding chamber of cooling inner bag 12, can pass through first temperature conduction device conduction to cooling inner bag 12 with the low temperature of refrigeration end after the semiconductor refrigeration piece 11 circular telegram to can make cooling inner bag 12 hold in the chamber drinking cup 5 or beverage cooling, can pass through second temperature conduction device conduction to cold-proof inner bag 14 with the heat that produces after the semiconductor refrigeration piece 11 circular telegram this moment, heat the air in holding the chamber of cold-proof inner bag 14 in order to realize the heat dissipation to the interior environment of car.
When the passenger has the heat preservation or the heating demand, place the drinking cup 5 or the beverage that need keep warm or heat up in the holding chamber of cold-proof inner bag 14, the semiconductor refrigeration piece 11 can pass through the conduction of second temperature conduction device with the heat that produces and keep warm inner bag 14 to can make the drinking cup 5 or the beverage that keep warm in the holding chamber of inner bag 14 heat up, can pass through first temperature conduction device conduction to cooling inner bag 12 with the low temperature of refrigeration end after the semiconductor refrigeration piece 11 circular telegram this moment, the air in the holding chamber of cooling inner bag 12 is cooled down in order to realize cooling to the interior environment of car.
When the passenger has cooling and warm keeping requirements simultaneously, the cup 5 or beverage needing cooling is placed in the accommodating cavity of the cooling liner 12, the cup 5 or beverage needing warm keeping or heating is placed in the accommodating cavity of the warm keeping liner 14, the semiconductor refrigerating sheet 11 can conduct the low temperature of the refrigerating end to the cooling liner 12 through the first temperature conduction device after being electrified, so that the cup 5 or beverage in the accommodating cavity of the cooling liner 12 can be cooled, and the generated heat can be conducted to the warm keeping liner 14 through the second temperature conduction device after the semiconductor refrigerating sheet 11 is electrified, so that the cup 5 or beverage in the accommodating cavity of the warm keeping liner 14 can be warmed. The cooling liner 12 and the warm liner 14 are mutually opposite to cool and dissipate heat.
In this embodiment, the first temperature conduction device includes a first aluminum block 13, one side of the first aluminum block 13 facing the cooling liner 12 is provided with a first groove 131, one side of the first aluminum block 13 facing the semiconductor cooling plate 11 is provided with a first plane 132, the first groove 131 is in conformal fit with the outer wall of the cooling liner 12, and the first plane 132 is connected with the cooling end of the semiconductor cooling plate 11 in a heat-conducting manner. The aluminum block has good heat conductivity, the first plane 132 of the aluminum block is in contact with the refrigeration end surface, the first groove 131 of the aluminum block is in contact with the outer wall surface of the cooling liner 12, and the contact area is large, so that the temperature conduction effect can be further ensured.
In this embodiment, the first plane 132 is directly contacted with the refrigerating end of the semiconductor refrigerating plate 11, or the first plane 132 is contacted with the refrigerating end of the semiconductor refrigerating plate 11 after silicone grease is coated. Silicone grease can be used to improve heat transfer efficiency, so applying silicone grease on the first plane 132 can further enhance the effect of temperature transfer to the first aluminum block 13.
In this embodiment, the second temperature conduction device includes a second aluminum block 15, one side of the second aluminum block 15 facing the thermal insulation liner 14 is provided with a second groove 151, one side of the second aluminum block 15 facing the semiconductor refrigeration sheet 11 is provided with a second plane 152, the second groove 151 is in conformal fit with the outer wall of the thermal insulation liner 14, and the second plane 152 is connected with the heating end of the semiconductor refrigeration sheet 11 in a heat conducting manner.
In this embodiment, the second plane 152 is directly contacted with the heating end of the semiconductor refrigeration sheet 11, or the second plane 152 is contacted with the heating end of the semiconductor refrigeration sheet 11 after silicone grease is coated.
In this embodiment, the heat dissipation device further includes a temperature-controlling balance heat dissipation block 16, the temperature-controlling balance heat dissipation block 16 is disposed on one side of the thermal insulation liner 14 away from the second temperature conduction device, a third groove 161 is disposed on one side of the temperature-controlling balance heat dissipation block 16 facing the thermal insulation liner 14, the third groove 161 is in conformal fit with an outer wall of the thermal insulation liner 14, and a plurality of heat dissipation ribs 162 are disposed on one side of the temperature-controlling balance heat dissipation block 16 away from the thermal insulation liner 14. Because the speed of the semiconductor refrigerating sheet 11 for raising the temperature of the thermal insulation liner 14 at the heating end is higher than the speed of the cooling end for lowering the temperature of the cooling liner 12 when the semiconductor refrigerating sheet 11 is in operation, in order to ensure the balance of the thermal insulation liner 14 and the cooling liner 12 in the temperature control process, the thermal insulation liner 14 is prevented from raising the temperature too fast, and therefore, the heat of the thermal insulation liner 14 is dispersed into the environment in the vehicle through the temperature control balance radiating block 16.
In this embodiment, the temperature control device 17 further includes a temperature control device 17, where the temperature control device 17 includes a control module 171, a first temperature sensor 172, and a second temperature sensor, where the first temperature sensor 172, the second temperature sensor, and the semiconductor refrigeration sheet 11 are all connected to the control module 171, and the control module 171 is connected to the whole vehicle ECU or the in-vehicle environmental temperature sensor; the first temperature sensor 172 is configured to collect a first temperature of the cooling liner 12; the second temperature sensor is used for collecting a second temperature of the heat preservation liner; the control module 171 is configured to: acquiring a first temperature and a second temperature; acquiring the in-vehicle environment temperature from the whole vehicle ECU or an in-vehicle environment temperature sensor; a control instruction for closing the semiconductor refrigerating sheet 11 is sent out in response to the difference between the first temperature and the in-vehicle environment temperature being not smaller than a first upper critical value of temperature difference and the difference between the second temperature and the in-vehicle environment temperature being not smaller than a second upper critical value of temperature difference; and a control instruction for starting the semiconductor refrigerating sheet 11 is sent out in response to the difference between the first temperature and the internal environment temperature being not greater than a critical value under the first temperature difference or/and the difference between the second temperature and the internal environment temperature being not greater than a critical value under the second temperature difference.
The vehicle-mounted integrated cooling and heating cup stand 1 can provide a certain degree of cooling and warming functions, for example, the temperature is 7-15 ℃ lower than the environment temperature in the vehicle, for example, the temperature is 7-15 ℃ higher than the environment temperature, and the temperature control device 17 can control the temperature more accurately when realizing the cooling and warming functions.
When the passenger has the requirements of cooling and keeping warm at the same time, the cup 5 or beverage to be cooled is placed in the accommodating cavity of the cooling liner 12, the cup 5 or beverage to be warmed or to be heated is placed in the accommodating cavity of the warming liner 14, the semiconductor refrigerating sheet 11 can conduct the low temperature of the refrigerating end to the cooling liner 12 through the first temperature conduction device after being electrified, so that the cup 5 or beverage in the accommodating cavity of the cooling liner 12 can be cooled, the first temperature sensor 172 can collect the first temperature at the bottom of the cooling liner 12 in the process, the generated heat can be conducted to the warming liner 14 through the second temperature conduction device after the semiconductor refrigerating sheet 11 is electrified, and the cup 5 or beverage in the accommodating cavity of the warming liner 14 can be warmed, and the second temperature sensor can collect the second temperature at the bottom of the warming liner 14 in the process.
When the difference between the first temperature and the vehicle interior environment temperature is not less than the first temperature difference upper critical value and the difference between the second temperature and the vehicle interior environment temperature is not less than the second temperature difference upper critical value, it indicates that the temperature of the cooling liner 12 has reached the requirement, and the temperature of the thermal liner 14 has also reached the requirement, at this time, the semiconductor refrigeration sheet 11 may stop. The first temperature difference upper critical value may be 12-15, the second temperature difference upper critical value may be 12-15, the first temperature difference upper critical value and the second temperature difference upper critical value may be the same or different, for example, the first temperature difference upper critical value may be set to 13, the second temperature difference upper critical value may be set to 15, and if the temperature of the cooling liner 12 is already 13 ℃ lower than the temperature in the vehicle interior and the temperature of the thermal liner 14 is already 15 ℃ higher than the temperature in the vehicle interior, the semiconductor refrigeration sheet 11 stops working, and continuous refrigeration and heating are not needed.
When the difference between the first temperature and the vehicle interior environment temperature is not greater than the critical value under the first temperature difference or/and the difference between the second temperature and the vehicle interior environment temperature is not greater than the critical value under the second temperature difference, it is indicated that the temperature of the cooling liner 12 or/and the temperature of the thermal liner 14 does not reach the requirement, and at this time, the semiconductor refrigeration sheet 11 needs to be turned on and kept working. The critical value under the first temperature difference may be 6-9, the critical value on the second temperature difference may also be 6-9, the critical value on the first temperature difference may be the same or different from the critical value on the second temperature difference, for example, the critical value on the first temperature difference may be set to 7, the critical value on the second temperature difference may be set to 6, if the temperature of the cooling liner 12 is lower than the temperature in the vehicle by 7 ℃ or/and the temperature of the thermal liner 14 is higher than the temperature in the vehicle by 6 ℃, the semiconductor refrigerating sheet 11 is turned on to keep refrigerating and heating.
In this embodiment, the semiconductor cooling device further comprises a heat insulation shell 18, an embedded bottom plate 19 arranged at the lower side of the heat insulation shell 18, and a mounting bracket 110 arranged at the lower side of the embedded bottom plate 19, wherein a cavity 181 for accommodating the semiconductor cooling plate 11, the cooling liner 12 and the heat insulation liner 14 is arranged inside the heat insulation shell 18, a yielding groove 182 is further formed in the heat insulation shell 18, the temperature control device 17 is arranged outside the heat insulation shell 18, and the yielding groove 182 is used for mounting the temperature control balance heat dissipation block 16. The heat-insulating shell 18 has the functions of heat insulation and heat transfer isolation on the one hand and bonding and fixing on the other hand, so that no additional fixing points are needed among the semiconductor refrigerating sheet 11, the cooling liner 12, the heat-insulating liner 14 and the temperature-control balance radiating block 16.
In this embodiment, the control module 171 is provided with a push button switch 173, a harness connector 174, and a fixing device 175; cup pads 120 are arranged in the cooling liner 12 and the thermal liner 14. The button switch 173 is used for turning on or off the control module 171, and the button switch 173 can be selected from existing button switches 173 with different light colors or light brightness, so as to remind the passenger whether to turn on or not. The harness connector 174 is used to connect to a power source or vehicle ECU. The coaster 120 can play a role in interior decoration, slip prevention, and friction noise reduction.
An automobile in this embodiment, as shown in fig. 3-5, includes a handrail case 2, a vehicle-mounted integrated cooling and heating cup holder 1 is provided in the handrail case 2, a button switch 173 is exposed out of the handrail case 2, a mounting bracket 110 is connected with a vehicle body below the handrail case 2, an opening is provided on the handrail case 2 corresponding to the position of the cooling liner 12 and the thermal liner 14, a first decorative ring 3 is provided on the handrail case 2 corresponding to the position of the cooling liner 12, and a second decorative ring 4 is provided on the handrail case 2 corresponding to the position of the thermal liner 14. The first decorative ring 3 and the second decorative ring 4 can be in different colors so as to facilitate the distinction of the cooling liner 12 and the thermal liner 14 by passengers. The outside of the armrest box 2 may be provided with external decorative elements and the like.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered by the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a on-vehicle integrated form changes in temperature saucer which characterized in that: comprises a semiconductor refrigerating sheet (11), a cooling liner (12) and a thermal liner (14); a first temperature conduction device is arranged between the refrigerating end of the semiconductor refrigerating sheet (11) and the cooling liner (12), a second temperature conduction device is arranged between the heating end of the semiconductor refrigerating sheet (11) and the thermal liner (14), and accommodating cavities are formed in the cooling liner (12) and the thermal liner (14).
2. The vehicle-mounted integrated cooling and heating cup holder according to claim 1, wherein: the first temperature conduction device comprises a first aluminum block (13), a first groove (131) is formed in one side of the first aluminum block (13) facing the cooling inner container (12), a first plane (132) is formed in one side of the first aluminum block (13) facing the semiconductor refrigerating sheet (11), the first groove (131) is attached to the outer wall of the cooling inner container (12) in a conformal mode, and the first plane (132) is connected with the refrigerating end of the semiconductor refrigerating sheet (11) in a heat conducting mode.
3. The vehicle-mounted integrated cooling and heating cup holder according to claim 2, wherein: the first plane (132) is directly contacted with the refrigerating end of the semiconductor refrigerating sheet (11), or the first plane (132) is contacted with the refrigerating end of the semiconductor refrigerating sheet (11) after silicone grease is smeared.
4. The vehicle-mounted integrated cooling and heating cup holder according to claim 1, wherein: the second temperature conduction device comprises a second aluminum block (15), one side of the second aluminum block (15) facing the thermal insulation inner container (14) is provided with a second groove (151), one side of the second aluminum block (15) facing the semiconductor refrigerating sheet (11) is provided with a second plane (152), the second groove (151) is attached to the outer wall of the thermal insulation inner container (14) in a conformal mode, and the second plane (152) is connected with a heating end of the semiconductor refrigerating sheet (11) in a heat conduction mode.
5. The vehicle-mounted integrated cooling and heating cup holder of claim 4, wherein: the second plane (152) is directly contacted with the heating end of the semiconductor refrigeration piece (11), or the second plane (152) is contacted with the heating end of the semiconductor refrigeration piece (11) after silicone grease is coated.
6. The vehicle-mounted integrated cooling and heating cup holder according to claim 1, wherein: the heat-insulating inner container is characterized by further comprising a temperature-control balance heat dissipation block (16), wherein the temperature-control balance heat dissipation block (16) is arranged on one side, far away from the second temperature conduction device, of the heat-insulating inner container (14), a third groove (161) is formed in one side, facing the heat-insulating inner container (14), of the temperature-control balance heat dissipation block (16), the third groove (161) is attached to the outer wall of the heat-insulating inner container (14) in a conformal mode, and a plurality of heat dissipation ribs (162) are arranged on one side, far away from the heat-insulating inner container (14), of the temperature-control balance heat dissipation block (16).
7. The vehicle-mounted integrated cooling and heating cup holder according to any one of claims 1-6, wherein: the temperature control device (17) comprises a control module (171), a first temperature sensor (172) and a second temperature sensor, wherein the first temperature sensor (172), the second temperature sensor and the semiconductor refrigerating sheet (11) are connected with the control module (171), and the control module (171) is connected with the whole vehicle ECU or the in-vehicle environment temperature sensor; the first temperature sensor (172) is used for collecting a first temperature of the cooling liner (12); the second temperature sensor is used for collecting a second temperature of the heat preservation liner; the control module (171) is configured to: acquiring a first temperature and a second temperature; acquiring the in-vehicle environment temperature from the whole vehicle ECU or an in-vehicle environment temperature sensor; responding to the difference value between the first temperature and the internal environment temperature of the vehicle not smaller than a first temperature difference upper critical value and the difference value between the second temperature and the internal environment temperature of the vehicle not smaller than a second temperature difference upper critical value, and sending out a control instruction for closing the semiconductor refrigerating sheet (11); and responding to the fact that the difference value between the first temperature and the internal environment temperature is not larger than a critical value under the first temperature difference or/and the difference value between the second temperature and the internal environment temperature is not larger than a critical value under the second temperature difference, and sending a control instruction for starting the semiconductor refrigerating sheet (11).
8. The vehicle-mounted integrated cooling and heating cup holder of claim 7, wherein: still include heat preservation casing (18), set up in pre-buried bottom plate (19) of the downside of heat preservation casing (18) and set up in installing support (110) of the downside of pre-buried bottom plate (19), the inside of heat preservation casing (18) is provided with and is used for holding cavity (181) of semiconductor refrigeration piece (11), cooling inner bag (12) and cold-proof inner bag (14), still set up on heat preservation casing (18) and give way recess (182), temperature control device (17) set up in the outside of heat preservation casing (18).
9. The vehicle-mounted integrated cooling and heating cup holder of claim 8, wherein: the control module (171) is provided with a button switch (173), a wire harness connector (174) and a fixing device (175); the cooling inner container (12) and the thermal insulation inner container (14) are internally provided with cup pads (120).
10. An automobile, characterized in that: including handrail case (2), be provided with on-vehicle integrated form changes in temperature saucer according to claim 9 in handrail case (2), push button switch (173) expose in handrail case (2), installing support (110) with body coupling of handrail case (2) below, correspond on handrail case (2) cooling inner bag (12) with the position of cold-proof inner bag (14) is provided with the opening, correspond on handrail case (2) cooling inner bag (12) position is provided with first decorative circle (3), correspond on handrail case (2) the position of cold-proof inner bag (14) is provided with second decorative circle (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410200490.3A CN117818445A (en) | 2024-02-23 | 2024-02-23 | Vehicle-mounted integrated cooling and heating cup stand and automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410200490.3A CN117818445A (en) | 2024-02-23 | 2024-02-23 | Vehicle-mounted integrated cooling and heating cup stand and automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117818445A true CN117818445A (en) | 2024-04-05 |
Family
ID=90521190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410200490.3A Pending CN117818445A (en) | 2024-02-23 | 2024-02-23 | Vehicle-mounted integrated cooling and heating cup stand and automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117818445A (en) |
-
2024
- 2024-02-23 CN CN202410200490.3A patent/CN117818445A/en active Pending
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