CN217763975U

CN217763975U - Vehicle-mounted semiconductor refrigerating and heating equipment

Info

Publication number: CN217763975U
Application number: CN202221802643.4U
Authority: CN
Inventors: 谭永华
Original assignee: Xuanbo Electronic Technology Shenzhen Co ltd
Current assignee: Xuanbo Electronic Technology Shenzhen Co ltd
Priority date: 2022-07-12
Filing date: 2022-07-12
Publication date: 2022-11-08
Anticipated expiration: 2032-07-12

Abstract

The utility model discloses an on-vehicle semiconductor refrigeration equipment of heating relates to mobile unit technical field, including base and transparent sealing cover, inside one side fixed mounting of base has the radiator, radiator top fixed mounting has the fixed bolster, top one side fixed mounting of fixed bolster has heat conduction silica gel and TEC module, the top opposite side fixed mounting of fixed bolster has the bullet to detain the subassembly, the face frame is installed at the top of bullet knot subassembly. This on-vehicle semiconductor refrigeration equipment of heating, this on-vehicle semiconductor refrigeration structure of heating is whole, through increase transparent sealing lid on equipment, enables whole cavity and forms a confined space, and the cavity is not slotted, and whole space is sealed, is equipped with the aluminium cup, and aluminium cup and zero clearance fit of aluminum alloy cavity simultaneously, heating and refrigeration are faster, and heats and refrigerate the beverage in the big bore beverage bottle that does not put down.

Description

Vehicle-mounted semiconductor refrigerating and heating equipment

Technical Field

The utility model relates to an on-vehicle equipment technical field specifically is an on-vehicle semiconductor refrigeration equipment of heating.

Background

In order to facilitate the use of drivers and passengers in the driving process, a cup holder is generally arranged in the middle of a front seat of a common automobile. However, the common cup stand can not refrigerate or heat drinks in the cup, and the vehicle-mounted cold and hot cup is produced in order to meet the requirements of people on refrigeration and heating of drinks in the vehicle.

The cup stand of the existing vehicle-mounted cold and hot cup stand is not cylindrical, a groove is formed in the cup stand, the cup stand is not sealed by a cover, the external environment has great influence on refrigeration and heating, the refrigeration and heating effects are poor, particularly, during refrigeration, the refrigeration time is long, the temperature cannot be reached, and the refrigeration taste is influenced.

Therefore, it is necessary to provide a semiconductor cooling and heating apparatus for vehicle to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an on-vehicle semiconductor refrigeration equipment of heating to solve the current on-vehicle cold and hot equipment saucer that provides in the above-mentioned background art not the cylinder integrative, do not have sealed processing, lead to the refrigeration heating effect not good, when refrigerating very much, refrigeration efficiency is long slowly, and the refrigeration temperature can not reach moreover, influences the problem of taste.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an on-vehicle semiconductor refrigeration equipment of heating, includes base and transparent sealing lid, inside one side fixed mounting of base has the radiator, radiator top fixed mounting has the fixed bolster, top one side fixed mounting of fixed bolster has heat conduction silica gel and TEC module, the top opposite side fixed mounting of fixed bolster has bullet knot subassembly, the face frame is installed at the top of bullet knot subassembly, the bottom fixed mounting of face frame has aluminum alloy cavity and plastic normal atmospheric temperature cavity, the bottom and the bullet knot subassembly of plastic normal atmospheric temperature cavity are connected, the face frame is with the corresponding fixedly connected with sealing washer of plastic normal atmospheric temperature cavity, the aluminium cup has been placed to the inside of aluminum alloy cavity, the top outside fixedly connected with aluminium cup sealing washer of aluminium cup, the face frame has button PCBA with the corresponding fixed position of aluminum alloy cavity, button PCBA's top fixed mounting has the button base, the top of button base is equipped with the control button.

Optionally, a screw is connected to the radiator, and the radiator is connected with the heat-conducting silica gel below the TEC module through the screw in the base.

Optionally, a PCBA control panel is fixedly mounted on the other side of the interior of the base.

Optionally, the outer side of the aluminum alloy cavity is sleeved with heat insulation foam.

Optionally, the bottom of the aluminum alloy cavity is provided with a thermistor temperature sensor and is connected with the PCBA control panel.

Optionally, a fan and a fan protective sleeve are fixedly mounted above the PCBA control plate.

Optionally, the fan and the fan protective sleeve are mutually sleeved and mutually adaptive.

Optionally, a panel decorative cover plate is fixedly mounted at the top of the control key, and a transparent sealing cover matched with the aluminum alloy cavity is arranged at the top of the panel decorative cover plate.

Optionally, the control key includes a cooling key and a heating key.

Optionally, a flip cover is arranged at the top of the aluminum cup.

Compared with the prior art, the utility model provides an on-vehicle semiconductor refrigeration equipment of heating possesses following beneficial effect:

1. this on-vehicle semiconductor refrigeration equipment of heating, this on-vehicle semiconductor refrigeration structure of heating is whole, through increase transparent sealed lid on equipment, enables whole cavity and forms a confined space, and the cavity does not fluting, and whole space is sealed, is equipped with aluminum alloy cavity and aluminum cup, and aluminum alloy cavity and aluminum cup zero clearance fit simultaneously heat and refrigerate faster.

2. This on-vehicle semiconductor refrigeration equipment of heating, the cylinder in diameter 68 ≤ mm can only be placed to the aluminum alloy cavity internal diameter, consider that big bottle beverage can't heat and refrigerate, the configuration aluminium cup, the aluminium cup sealing washer, other beverages and mineral water that need heating or refrigeration can be placed to the aluminium cup of flip combination, the aluminium cup heat conduction is fast, heating refrigeration effect is better, can heat and refrigerate the beverage in the beverage bottle that big bore can not be put down through pouring the beverage into the aluminium cup, and can take out the aluminium cup in the aluminum alloy cavity after refrigeration or heating, conveniently go out to carry and drink.

Drawings

Fig. 1 is a schematic diagram of the explosion structure of the vehicle-mounted semiconductor refrigeration and heating equipment of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure I of the vehicle-mounted semiconductor cooling and heating device of the present invention;

FIG. 3 is a schematic view of the vehicular semiconductor refrigeration and heating device of the present invention, showing a top view I;

fig. 4 is a schematic sectional view of the structure of the vehicle-mounted semiconductor cooling and heating device of the present invention;

fig. 5 is a schematic view of a three-dimensional structure II of the vehicle-mounted semiconductor cooling and heating device of the present invention;

fig. 6 is a schematic view of the structure overlooking II of the vehicle-mounted semiconductor refrigeration and heating device of the present invention;

fig. 7 is the sectional view of the heat insulation foam structure of the vehicle-mounted semiconductor refrigerating and heating device of the present invention.

In the figure: 1. a base; 2. a screw; 3. a heat sink; 4. fixing a bracket; 5. heat conducting silica gel; 6. a TEC module; 7. a thermistor temperature sensor; 8. an aluminum alloy cavity; 9. heat insulation foam; 10. an aluminum cup; 11. an aluminum cup seal ring; 13. a cover is turned; 14. a transparent sealing cover; 15. a panel decorative cover plate; 16. heating the key; 17. a refrigeration key; 18. a key base; 19. a key PCBA; 20. a seal ring; 21. a face frame; 22. a snap assembly; 23. a fan; 24. a fan protective sleeve; 25. PCBA control panel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Please refer to fig. 1-7, an embodiment of the present application provides a vehicle-mounted semiconductor refrigerating and heating apparatus, which includes a base 1 and a transparent sealing cover 14, a heat sink 3 is fixedly installed on one side inside the base 1, a fixing support 4 is fixedly installed above the heat sink 3, a heat conducting silica gel 5 and a TEC module 6 are fixedly installed on one side of the top of the fixing support 4, a latch assembly 22 is fixedly installed on the other side of the top of the fixing support 4, a face frame 21 is installed on the top of the latch assembly 22, an aluminum alloy cavity 8 and a plastic normal temperature cavity are fixedly installed on the bottom of the face frame 21, the bottom of the plastic normal temperature cavity is connected to the latch assembly 22, the plastic normal temperature cavity is a common cup holder, four latch assemblies 22 are installed in the cup holder, beverage bottles of different sizes can be fixedly placed through the latch assemblies 22, a sealing ring 20 is fixedly connected to positions corresponding to the face frame 21 and the plastic normal temperature cavity, a sealing ring 20 is added between the

face frames

8 and 21, a transparent sealing cover 14 is added on the top, the transparent sealing cover can prevent loss of the top of the cup holder, an aluminum alloy cavity 10 is placed inside the aluminum alloy cavity 8, a sealing ring 11 is fixedly connected to the top of the aluminum alloy cavity, a PCBA 18 a is installed on the top of the base, and a PCBA 18 is installed on the base.

In this embodiment, the structure of this on-board semiconductor refrigeration and heating is whole, through increase transparent sealed lid 14 on equipment, CAN make whole cavity form a confined space, the cavity does not open the slot, whole space is sealed, be equipped with aluminium cup 10, aluminium cup 10 and aluminium alloy cavity 8 zero clearance fit simultaneously, heating and refrigeration are faster, aluminium alloy cavity 8 CAN carry out rapid heating or refrigeration to the cylinder that is less than or equal to 68mm, and CAN pour into aluminium cup 10 and heat and refrigerate the beverage in the big bore beverage bottle that CAN not put down, equipment CAN control equipment refrigeration and heating through the CAN communication with the car machine central controller.

In this embodiment, the heat sink 3 is connected with the screws 2, and the heat sink 3 is mounted inside the base 1 through the screws 2.

In this embodiment, wherein the inside opposite side fixed mounting of base 1 has PCBA control panel 25, controls MCU output heating control signal through PCBA control panel 25, heats for TEC module 6 power supply.

In this embodiment, further, the outside cover of aluminum alloy cavity 8 is equipped with thermal-insulated bubble cotton 9, improves the heat preservation effect, avoids the loss of heat or air conditioning.

In this embodiment, the bottom of aluminum alloy cavity 8 is equipped with thermistor temperature sensor 7 in addition, and is connected with PCBA control panel 25, through thermistor temperature sensor 7 to temperature real-time supervision.

In this embodiment, further, PCBA control panel 25's top fixed mounting has fan 23 and fan protective sheath 24, and fan 23 cup joints each other and mutual adaptation with fan protective sheath 24. When the TEC module 6 refrigerates, the fan 23 is started, heat generated at the bottom of the TEC module 6 can be absorbed by the radiator 3 and then taken away by the fan 23, the fan 23 is prevented from generating vibration noise through the fan protective sleeve 24, and the fan 23 can be protected.

In this embodiment, a panel decorative cover plate 15 is fixedly installed on the top of the control key, a transparent sealing cover 14 matched with the aluminum alloy cavity 8 is arranged on one side of the top of the panel decorative cover plate 15, the control key comprises a refrigeration key 17 and a heating key 16, the tec module 6 transfers heat to the aluminum alloy cavity 8 to prevent heat loss, and the aluminum alloy cavity 8 is matched with the 21-face frame to prevent external air from entering or heat from flowing out of the cup holder.

In this embodiment, further, a flip 13 is disposed on the top of the aluminum cup 10, the inner diameter of the aluminum alloy cavity 8 can only accommodate a cylinder with a diameter less than or equal to 68mm, considering that a large bottle of beverage cannot be heated or cooled, the aluminum cup 10 is configured, the aluminum cup sealing ring 11 is configured, the aluminum cup 10 combined by the flip 13 can accommodate any other beverage or mineral water which needs to be heated or cooled, the aluminum cup 10 has a fast heat conduction and a better heating and cooling effect, the beverage poured into the aluminum cup 10 can be taken out from the aluminum alloy cavity 8 after being heated or cooled, and can be conveniently taken out for carrying after being cooled or heated, and can be drunk at any time.

In summary, in actual use:

the refrigerating/heating of the device makes good use of the peltier effect of a thermoelectric cooler, and by applying a low voltage dc power supply, heat is transferred from one side of the TEC to the other, thereby causing the TEC to heat up on one side and cool down on the other side. When the current is reversed, the refrigerating and heating directions of the TEC can be reversed, so that cold and hot switching is realized.

When the refrigeration key 17 is pressed, the MCU outputs a refrigeration control signal to control a group of coils of the relay to be conducted and powered, a contact on one side of the refrigeration switch is closed, and a Battery +12V power supply supplies power to the TEC module 6; meanwhile, the power supply of the heat dissipation control circuit is turned on to supply power to the heat dissipation module fan 23;

when the heating key 16 is pressed down, the MCU outputs a heating control signal to control the other group of coils of the relay to be conducted for power supply, the contact on one side of the heating switch is closed, and the Battery +12V power supply supplies power to the TEC module 6.

The heating key 16 is pressed down, the MCU of the PCBA control board 25 outputs a heating control signal to supply power to the TEC module 6 for heating,

the refrigeration key 17 is pressed, the MCU of the PCBA control board 25 outputs a refrigeration control signal to supply power to the TEC module 6 for refrigeration, the fan 23 is started while the TEC module 6 is refrigerated, heat generated at the bottom surface of the TEC module 6 is taken away, the fan 23 is prevented from generating vibration noise, and the fan 23 is wrapped by the fan protective sleeve 24 made of silica gel.

The TEC module 6 transmits heat to the aluminum alloy cavity 8, prevents that heat loss from increasing thermal-insulated cotton 9 parcel saucer bottom and border, and aluminum alloy cavity 8 matches with the assembly of face frame 21, prevents that outside air from getting into or the saucer in heat from flowing out, increases sealing washer 20 in the middle of aluminum alloy cavity 8 and face frame 21, prevents heat loss in the saucer, and the top increases 14 transparent sealing covers.

The inner diameter of the aluminum alloy cavity 8 can only be used for placing a cylinder with the diameter less than or equal to 68mm, and considering that a large bottle of beverage can not be heated and refrigerated, the aluminum cup 10 is configured, the aluminum cup sealing ring 11 and the aluminum cup 10 combined by the flip cover 13 can be used for placing any other beverage and mineral water which need to be heated or refrigerated, the aluminum cup 10 has fast heat conduction, and the heating and refrigerating effect is better.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an on-vehicle semiconductor refrigeration equipment of heating, includes base (1) and transparent sealed lid (14), its characterized in that: the inside one side fixed mounting of base (1) has radiator (3), radiator (3) top fixed mounting has fixed bolster (4), top one side fixed mounting of fixed bolster (4) has heat conduction silica gel (5) and TEC module (6), the top opposite side fixed mounting of fixed bolster (4) has bullet knot subassembly (22), face frame (21) are installed at the top of bullet knot subassembly (22), the bottom fixed mounting of face frame (21) has aluminum alloy cavity (8) and plastic normal atmospheric temperature cavity, the bottom and the bullet of plastic normal atmospheric temperature cavity are detained subassembly (22) and are connected, face frame (21) and the corresponding position fixedly connected with sealing washer (20) of plastic normal atmospheric temperature cavity, aluminum cup (10) have been placed to the inside of aluminum alloy cavity (8), the top outside fixedly connected with aluminum cup sealing washer (11) of aluminum cup (10), face frame (21) and the corresponding position fixed mounting of aluminum alloy cavity (8) have button PCBA (19), the top fixed mounting of button PCBA (19) has button base (18), the top of button base (18) is equipped with the control button.

2. The vehicle-mounted semiconductor refrigerating and heating device according to claim 1, characterized in that: be connected with screw (2) on radiator (3), radiator (3) are installed in the inside of base (1) through the screw and are connected with thermal conductive silica gel (5) below TEC module (6).

3. The vehicle-mounted semiconductor refrigerating and heating device according to claim 2, characterized in that: the other side of the inside of the base (1) is fixedly provided with a PCBA control plate (25).

4. The vehicle-mounted semiconductor refrigerating and heating device according to claim 3, characterized in that: the outer side of the aluminum alloy cavity (8) is sleeved with heat insulation foam (9).

5. The vehicle-mounted semiconductor refrigerating and heating device according to claim 4, characterized in that: and a thermistor temperature sensor (7) is arranged at the bottom of the aluminum alloy cavity (8) and is connected with a PCBA control board (25).

6. The vehicle-mounted semiconductor refrigerating and heating device according to claim 5, characterized in that: and a fan (23) and a fan protective sleeve (24) are fixedly arranged above the PCBA control board (25).

7. The vehicle-mounted semiconductor refrigerating and heating device according to claim 6, characterized in that: the fan (23) and the fan protective sleeve (24) are mutually sleeved and matched.

8. The vehicle-mounted semiconductor refrigerating and heating device according to claim 7, characterized in that: the top fixed mounting of control button has panel dress trim (15), the top of panel dress trim (15) is equipped with aluminum alloy cavity (8) assorted transparent sealing lid (14).

9. The vehicle-mounted semiconductor refrigerating and heating device according to claim 8, characterized in that: the control keys comprise a cooling key (17) and a heating key (16).

10. The vehicle-mounted semiconductor refrigerating and heating device according to claim 9, characterized in that: the top of the aluminum cup (10) is provided with a turnover cover (13).