CN117812855B - Method for pressing row plates by asymmetric structure in printed circuit board and circuit board member - Google Patents
Method for pressing row plates by asymmetric structure in printed circuit board and circuit board member Download PDFInfo
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Abstract
The invention belongs to the technical field of circuit board processing, and particularly discloses a method for pressing a row board by an asymmetric structure in a printed circuit board and a circuit board member, wherein the method comprises the following steps: obtaining a first core plate and a second core plate, and arranging at least one impregnated laminate between the first core plate and the second core plate so as to form a riveting plate in a stacking way; arranging the riveting plate between the two equalizing plates; according to the asymmetric difference between the first core plate and the second core plate, which can influence the warpage of the riveting plate, the layout position of the riveting plate is adjusted between the two equalizing plates, so that the riveting plate has a warpage trend along the lamination direction during lamination; arranging a base plate between the riveting plate and the pressure equalizing plate so as to inhibit the warping trend of the riveting plate along the pressing direction, and pressing the riveting plate through the pressure equalizing plate; has the following advantages: the warping problem of the asymmetric structural plate in the pressing process is remarkably reduced, and the stability and consistency of the pressing process are ensured; not only improves the production efficiency and the product quality, but also reduces the material waste and the production cost.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a method for pressing a row board by an asymmetric structure in a printed circuit board and a circuit board.
Background
The traditional PCB manufacturing process completes manufacturing of the pre-arranged plates and the copper foil at high temperature and high pressure through a vacuum pressing machine. This method is suitable for symmetrical structural panels, but for asymmetrical structures, warpage of the panel may result due to copper density, dielectric layer thickness differences and circuit layout imbalance. Warpage can cause quality problems in subsequent processes such as grinding, drilling, exposure, etc., such as substrate exposure, drilling misalignment, or exposure inaccuracy.
Therefore, a method for pressing the row plates of the asymmetric structure in the printed circuit board is provided to solve the above-mentioned problems.
Disclosure of Invention
The present invention is directed to a method for pressing a printed circuit board with an asymmetric structure, so as to solve or improve at least one of the above technical problems.
In view of the above, a first aspect of the present invention is to provide a method for pressing an asymmetric structure of a printed circuit board.
A second aspect of the present invention is to provide a circuit board member.
The first aspect of the invention provides a method for pressing an asymmetric structure of a printed circuit board into a row board, which comprises the following steps: obtaining a first core plate and a second core plate, and arranging at least one impregnated laminate between the first core plate and the second core plate so as to form a riveting plate in a stacking way; arranging the riveting plates between two equalizing plates along a preset pressing direction of pressing the row plates; according to the asymmetric difference between the first core plate and the second core plate, which can influence the warpage of the riveting plate, the layout position of the riveting plate is adjusted between the two pressure equalizing plates, so that the riveting plate has a warpage trend along the lamination direction when being laminated; and arranging a base plate between the riveting plate and the pressure equalizing plate so as to inhibit the warping trend of the riveting plate along the pressing direction, and pressing the riveting plate through the pressure equalizing plate.
In any of the above solutions, the asymmetric difference includes a difference in copper-containing density of a surface of the core plate and a difference in thickness of the core plate; the layout positions are set by adopting the following rules: when the first core plate and the second core plate have thickness difference, the first core plate and the second core plate are gradually reduced according to thickness along the pressing direction; when the opposite surfaces of the first core plate and/or the second core plate along the lamination direction have surface copper-containing density difference, the opposite surfaces of the first core plate and the second core plate are gradually reduced according to the surface copper-containing density along the lamination direction.
In any of the above technical solutions, the first core board, the second core board, and at least one of the dip layer boards stacked on each other are fixed to each other by punching blind holes, so that each of circumferential edge portions of the rivet board has a tendency of warping with respect to a middle portion of the rivet board.
In any of the above technical solutions, according to the arrangement position adjusted by the copper density difference or the thickness difference on the surface, the warp trend of the circumferential edge of the rivet plate is directed to the substrate.
In any of the above technical solutions, when the first core plate and the second core plate have the difference in copper density and the difference in thickness on the surfaces, soaking foils are provided between the rivet plate and the base plate and between the rivet plate and the pressure equalizing plate.
In any of the above technical solutions, the opposite sides of the first core plate and the second core plate are copper sheet surfaces covering the same thickness, and the soaking foil corresponds to the copper sheet surfaces.
In any of the above technical solutions, the thickness of the first core plate is a, and the thickness of the second core plate is b, and the first core plate has a first reference value ofWherein, alpha is a compensation coefficient; and said first core plate having a second reference value indicative of said surface copper-containing density differential thereof, said second core plate having a third reference value indicative of said surface copper-containing density differential thereof; when the first reference value is larger than the second reference value and the third reference value, setting the layout position according to the thickness difference; when the first reference value is not smaller than the second reference value or the third reference value, adjusting the thickness of the base plate to the thickness of the riveting plate, and setting the layout position according to the thickness difference; and when the first reference value is smaller than the second reference value or the third reference value, setting the layout position according to the surface copper-containing density difference.
In any of the above technical solutions, the thickness of the base plate is smaller than or equal to the thickness of the riveting plate, and the thickness of the base plate is larger than the thickness of the first core plate and the thickness of the second core plate.
In any of the above technical solutions, two surfaces of the substrate opposite to each other along the lamination direction are both provided with copper layers, and the copper layers have the same copper-containing thickness as the surfaces of the first core board or the second core board.
The second aspect of the invention provides a circuit board member manufactured by the method for laminating the row board with the asymmetric structure in the printed circuit board according to any one of the above technical schemes; wherein the warpage of the circuit board is A, and A is less than 0.25%.
Compared with the prior art, the invention has the following beneficial effects:
by selecting the substrate material with better toughness and stability to optimize the hot pressing process, the warping problem of the asymmetric structure plate in the manufacturing process can be remarkably reduced, the overall quality of the plate is improved, and the reliability and consistency of the plate are enhanced.
The production process becomes more efficient due to reduced scrap and rework caused by warpage, resulting in less material waste, shorter production time, and lower production costs, thereby improving overall production efficiency.
After optimization, the temperature and the pressure of the plate are uniformly received in all areas for the lamination process, the quality of the PCB can be ensured through uniform heating power, and the performance and the reliability of the product are improved.
The product improved by lamination can resist external stress and environmental change, improves mechanical stability, and is beneficial to maintaining higher service life in high-performance electronic products.
For a circuit board requiring high precision and complex circuit layout, the optimized lamination process can meet the requirement of high standards, so that the design is more flexible and diversified.
Reducing warpage problems also enables higher accuracy and better quality control during subsequent PCB processing, such as drilling, grinding, plating, etc.
Additional aspects and advantages of embodiments according to the invention will be apparent from the description which follows, or may be learned by practice of embodiments according to the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart of method steps of the present invention;
FIG. 2 is a schematic view of a riveting plate structure according to the present invention;
fig. 3 is a schematic layout diagram of each layer structure before the lamination process according to the present invention.
The correspondence between the reference numerals and the component names in fig. 1 to 3 is:
1 first core board, 101 GTL surface, 102 line surface, 2 impregnated laminate, 3 second core board, 301 smooth surface, 302 GBL surface, 4 equalizing board, 5 equalizing foil, 6 substrate.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
Referring to fig. 1-3, a method for pressing a printed circuit board with an asymmetric structure and a circuit board member according to some embodiments of the invention are described below.
As in the background art, the conventional PCB (printed circuit board) manufacturing process includes a number of key steps, pre-row boards and copper foil: before the lamination process begins, each layer of board (e.g., prepreg, copper foil, etc.) and copper foil first need to be pre-aligned. This involves placing the materials in order and orientation to ensure that the position and orientation of each layer is accurate, as required by the design of the final PCB. Splicing and arranging: and splicing and arranging the pre-arranged plates and the copper foil according to the sizes of the plates and the used steel plate. The purpose of the splice is to utilize materials to the greatest extent and reduce waste while maintaining the design sequence. And (3) vacuum lamination: the assembled materials are placed in a vacuum press. Vacuum presses utilize temperature and pressure to tightly bond the layers together. The vacuum environment can prevent the intervention of bubbles and impurities and ensure the uniform flow of the resin. Temperature and pressure control: in the lamination process, accurate control of temperature and pressure is critical. The temperature needs to be high enough to promote the crosslinking and flow of the resin while the pressure ensures intimate bonding between the layers. These parameters must be precisely adjusted according to the type and thickness of the sheet. Resin crosslinking and bonding: under the condition of high temperature and high pressure, the epoxy resin between the plates starts to carry out the crosslinking reaction to form a firm structure. During this process, the resin can penetrate into the pores of the adjacent layers, creating strong chemical and physical bonds.
Warpage is a common challenge in conventional PCB (printed circuit board) manufacturing processes, particularly for boards with asymmetric structures; the reason for this challenge is the difference in thermal expansion coefficients: different materials (such as copper and epoxy) in the PCB have different coefficients of thermal expansion, and the coefficient of thermal expansion of copper isEpoxy resin has a thermal expansion coefficient of/>. During high temperature lamination, these materials may not expand and contract at the same rate, which may lead to warpage of the panel. Line copper density differences: different areas of the PCB may have different copper densities. The higher copper density regions will have more thermal expansion during heating, while the lower density regions will have less expansion. This uneven expansion can cause internal stresses in the panel after cooling, which in turn can cause warping. Thickness difference of dielectric layer: in a multi-layer PCB, the thickness of the dielectric (insulating layer) may be different between layers. Dielectric layers of different thickness can lead to non-uniform thermal expansion behavior, increasing the risk of warpage. Improper circuit layout: if the PCB is designed without consideration of thermal expansion and stress distribution, such as uneven distribution of copper traces, it may result in the board on one side being subjected to greater thermal stress than the board on the other side.
If excessive warping occurs, the substrate is ground and exposed due to the influence of subsequent process manufacture: the warped board may cause exposure of the substrate during subsequent grinding, affecting the performance and reliability of the circuit board. Drilling offset: due to the unevenness of the plate, the drill bit may shift during drilling, resulting in inaccurate hole positions. Poor exposure positioning: during exposure, the unevenness of the plate may affect the accuracy of exposure, resulting in erroneous positioning of the pattern.
In order to ensure the subsequent process manufacture, the warpage of less than 0.75% is required to be a basic requirement for the flatness of the board in the PCB (printed circuit board) manufacturing process. Warpage refers to the ratio of the maximum bending degree of a PCB board in a free state (i.e., without any external force) to the diagonal length thereof. This index is critical to ensure quality and performance of the PCB during subsequent assembly and application. Specifically: the warpage is calculated by measuring the vertical distance between the highest point and the lowest point when the PCB is naturally placed on a horizontal plane, and then the ratio of the vertical distance to the diagonal length of the PCB. For example, a warpage of 0.75% means that if the diagonal length of the PCB is 100cm, the maximum allowable warpage height is 0.75cm.
In view of the above-mentioned technical problems, an embodiment of a first aspect of the present invention provides a method for pressing an asymmetric structure of a printed circuit board. In some embodiments of the present invention, as shown in fig. 1-3, the method includes:
s101, acquiring a first core plate 1 and a second core plate 3, and arranging at least one impregnated laminate 2 between the first core plate 1 and the second core plate 3 to form a riveting plate in a stacking way.
Here, the impregnated laminate 2, as a reinforcing material, provides the necessary structural support and stability to help maintain a fixed position between the layers of the PCB, preventing interlayer shifting; insulating materials such as epoxy resin and the like contained in the dipping laminate 2 can effectively isolate electrical signals, avoid electrical interference between different layers and ensure correct functions of a circuit; the dipping layer plate 2 is beneficial to the dispersion and management of heat, and the heat conduction paths are provided between different layers, so that the uniform distribution of the whole heat is facilitated, and the sensitive elements are protected from being damaged by overheating; by adding the dip layer board 2 between the two core boards, the overall thickness and mechanical strength of the PCB is increased, making the PCB more stable and durable under physical stress.
The enhanced structural stability and electrical insulation performance are helpful to improve the reliability of the PCB in complex environments and reduce the failure rate; the PCB can bear more physical stress and environmental change due to better mechanical strength and toughness, so that the service life of the product is prolonged; effective thermal management and electrical insulation help to optimize PCB performance, ensuring stable operation of electronic devices at high efficiency; the stacking method using the dip-coated sheet 2 allows the designer greater flexibility to accommodate different application requirements, including different layer thicknesses, material types, and electrical property requirements; the standardized impregnation laminate 2 and stacking process helps to simplify the production flow, improve the manufacturing efficiency and yield, and reduce material waste.
S102, arranging the riveting plates between the two equalizing plates 4 along the preset pressing direction of the pressing row plates.
Here, by arranging the rivet plates between the two pressure equalizing plates 4, it is ensured that the pressure applied to the rivet plates is evenly distributed throughout the pressing process. The method is beneficial to avoiding partial overpressure or insufficient overpressure, thereby improving the consistency and quality of products; the use of the caul plate 4 helps to control and reduce the warpage and deformation of the rivet plate that may occur during high temperature compression. By providing stable support in the press-fit direction, it is ensured that the rivet plate remains flat; in the pressing process, the uniform pressure is favorable for the resin to flow and solidify uniformly in the riveting plate, so that the bonding quality and the electrical performance between layers are improved; the preset pressing direction and the use of the equalizing plate 4 are conducive to standardization of the pressing process, reduction of the setting time and improvement of the production efficiency.
The above-mentioned results show that the uniform pressure distribution is helpful for reducing internal stress and interlayer voids and defects, thereby improving the overall quality of the PCB; by using the equalizing plates 4, each riveting plate is ensured to be subjected to the same treatment in the pressing process, so that the high consistency among product batches is realized; the warping and the deformation are controlled, the resin flow and the solidification are optimized, the reworking and the rejection rate can be obviously reduced, and the production cost is reduced; the standardized pressing process and the quick setting time directly improve the production efficiency, so that the production line can process more riveting plates more quickly; the uniform pressure distribution reduces uneven loading on the lamination device, thereby helping to extend the service life of the device and reduce maintenance costs.
Specifically, the equalizing plate 4 is a steel plate, and the pressing direction is the longitudinal direction in the vacuum pressing machine; the function is to apply a uniform pressure across the rivet plate surface. This helps to ensure that every part of the rivet plate is uniformly compressed during the high temperature compression process, avoiding warpage or interlayer separation problems due to local pressure non-uniformity; the lamination direction is the longitudinal direction within the vacuum lamination machine. The setting is helpful to provide stable support in the pressing process, and ensures that the riveting plate can be uniformly pressed in the longitudinal direction, thereby optimizing the flow and solidification of resin and improving the bonding quality between layers.
Specifically, two impregnation plates 2 are provided and stacked on each other.
S103, according to the asymmetric difference between the first core plate 1 and the second core plate 3, which can influence the warpage of the riveting plate, the layout position of the riveting plate is adjusted between the two pressure equalizing plates 4, so that the riveting plate has a warpage trend along the lamination direction during lamination.
Here, by adjusting the position of the rivet plate before press-fitting, warpage due to asymmetry of the material can be prevented. This adjustment takes into account the asymmetry of the material's coefficient of thermal expansion, thickness, copper foil layout, etc.; arranging the riveting plates so that the warp trend generated in the pressing process is consistent with the expected direction, and correcting the warp through the subsequent pressing step; this arrangement helps to more uniformly apply pressure and heat during lamination, thereby optimizing resin flow, cure, and interlayer adhesion quality.
The above-mentioned can be seen, through preventing and controlling the warpage trend, can improve the flatness of the riveted plate after pressing, reduce the number of plates needing additional processing or correction; the high flatness of the plate is beneficial to improving the precision of the subsequent processing process (such as drilling, electroplating and printing), thereby enhancing the quality and reliability of the final product; by effectively controlling the warping, reworking and waste caused by unqualified plates can be reduced, so that the production cost is reduced; production interruption and reworking caused by warping problems are reduced, and the efficiency and the output of the whole production line are improved; for the PCB production of high-precision electronic products, the method can meet stricter flatness and consistency requirements, and is beneficial to meeting the requirements of high-end markets.
Specifically, the asymmetric differences include differences in copper-containing density of the surface of the core plate and differences in thickness of the core plate; the layout positions are set by adopting the following rules:
When the first core board 1 and the second core board 3 have a thickness difference, the first core board 1 and the second core board 3 are disposed with the thickness gradually reduced in the pressing direction.
When the opposite surfaces of the first core plate 1 and/or the second core plate 3 in the lamination direction have a difference in surface copper-containing density, the opposite surfaces of the first core plate 1 and the second core plate 3 are disposed so as to gradually decrease in surface copper-containing density in the lamination direction.
For the specific description above, the regions of higher copper density thermally expand less during heating, while the regions of lower copper density expand more. By adjusting the layout position, the asymmetry of the thermal expansion can be compensated in advance, and the warping after lamination is reduced; different pressures are applied to different areas of the riveted plate, which helps to balance internal stresses due to copper density differences and reduce deformation. Considering thickness difference, even the core boards with different thicknesses can be ensured to be subjected to uniform pressure in the pressing process by adjusting the arrangement positions; thickness differences are taken into account during the layout, which can be compensated for by a specific layout strategy.
The above-mentioned can be seen that the effective control of warpage helps to prevent dislocation between layers, and improve alignment accuracy of the multi-layer PCB; by reducing warpage, the risk of electrical connection failure may be reduced, thereby improving the electrical performance of the PCB. The uniform pressure and heat distribution is beneficial to improving the bonding quality between layers with different thicknesses and reducing the delamination risk; the warping possibly caused by the thickness difference is controlled, the precision of the subsequent processing process (such as drilling and cutting) is facilitated, and the processing error is reduced.
For the above-described concrete description, when the first core plate 1 and the second core plate 3 have thickness differences, arranging these core plates in the pressing direction in order of gradually decreasing thickness is a method for pressing row plates for an asymmetric structure, which aims to optimize the pressing process of Printed Circuit Boards (PCBs), and particularly involves arranging core plates of different thicknesses in a gradual manner to cope with and alleviate the warpage problem due to the thickness inconsistencies; by this progressive arrangement, the tendency of the rivet plate to warp during the press-fit process can be more effectively controlled to minimize or be within acceptable limits. The layout is beneficial to balancing internal stress in the lamination process and reducing warping caused by inconsistent thickness; the progressive reduction in thickness of the core plates along the press fit direction helps to evenly distribute the pressure across the rivet plate, particularly between the different layers of the rivet plate. This equalization helps to improve the bond quality from layer to layer; in the lamination process, the core plates with different thicknesses have different heat absorption and conduction capacities. Arranging the core plates in this manner helps to optimize the distribution of heat in the rivet plates, promoting more uniform heating and cooling.
The above-mentioned can be seen that by reducing warpage during lamination, flatness and structural integrity of the final product can be significantly improved, thereby improving quality of the PCB; the improvement of the flatness is beneficial to the subsequent processing processes, such as drilling, edge milling and the like, reduces the processing error and improves the processing precision; the warping is reduced by optimizing the lamination process, so that reworking and waste caused by disqualification can be reduced, and the production cost is reduced; the warp problem is reduced, so that the production period can be shortened, and the overall efficiency of the production line can be improved.
For the above-described specific description, when the opposite surfaces of the first core board 1 and/or the second core board 3 in the lamination direction have a difference in copper density on the surfaces, disposing the opposite surfaces of these core boards in order of decreasing copper density on the surfaces is another effective method for solving the warpage problem that may occur in the PCB lamination process. The method particularly considers the influence of the non-uniformity of the distribution of the copper foil on the lamination process and the product quality, and reduces the influence by optimizing the layout of the riveting plate; the copper foil has a coefficient of thermal expansion that is different from other materials of the PCB, such as epoxy, and uneven copper distribution may cause different areas to expand unevenly during heating, thereby causing warpage. The surface with high copper density is arranged on one side and gradually reduced to the other side, so that the expansion difference is balanced, and the warping and deformation are relieved; this arrangement helps to more evenly distribute internal stresses during lamination, particularly during the heat treatment and cooling phases of the PCB, reducing internal stress concentrations due to differences in thermal expansion coefficients; the fluidity and final cure of the resin during lamination is also affected by the distribution of the copper foil. By adjusting the copper-containing density, the uniform flow and solidification of the resin in the PCB can be promoted, and the interlayer bonding quality can be improved.
As can be seen from the above, the flatness of the PCB can be significantly improved by reducing warpage and deformation, which helps to ensure the subsequent processing steps (such as Surface Mount Technology (SMT)) and the final performance of the product; by optimizing copper foil distribution and resin curing inside the PCB, electrical connectivity and signal integrity can be improved, especially for high frequency applications; the uniform internal stress distribution and optimized interlayer bonding help to improve structural stability and long-term reliability of the PCB, reducing performance degradation due to material aging or environmental changes.
Specifically, the first core plate 1, the second core plate 3 and the at least one impregnated laminate 2 stacked on each other are fixed to each other by punching blind holes so that each of circumferential edge portions of the rivet laminate has a tendency to warp with respect to the middle portion of the rivet laminate.
For the above detailed description, the first core board 1, the second core board 3, and the at least one impregnation plate 2 stacked on each other are fixed using a blind hole technology in a Printed Circuit Board (PCB) manufacturing process, which is an effective method for improving the structural stability of the multi-layered PCB and reducing the warpage tendency. The blind holes are used as electric connection points and physical fixing points, so that the circumferential edge of the riveting plate can be ensured to effectively control the warping trend relative to the middle part; the blind holes are arranged between different layers of the riveting plate, and the interlayer is physically fixed through the blind holes, so that the structural stability of the whole riveting plate can be remarkably improved; the distribution of blind holes can be designed to create a uniform warp trend in the circumferential edges of the rivet plate relative to the middle, which helps balance internal stresses throughout the plate, thereby reducing uncontrolled warp; during high temperature lamination, different areas of the rivet plate may develop different stresses due to thermal expansion. Through the blind hole fixing structure, the distribution of the thermal stresses can be adjusted and optimized to a certain extent, and warping caused by stress concentration is avoided.
As can be seen from the above, the blind hole is an advanced PCB design element, and besides being used for fixing and electrical connection, the layout of the blind hole can be optimized according to the need to adapt to more complex circuit design and functional requirements; the use of the blind holes is also beneficial to optimizing the electrical path of the circuit, reducing signal loss and interference and improving the integrity and performance of signals; the multi-layer PCB structure is fixed through the blind hole technology, so that the product quality can be improved, and meanwhile, the final product is ensured to have better performance and higher stability.
Specifically, the warp tendency of the circumferential edge portion of the rivet plate is directed to the substrate 6 according to the layout position adjusted by the difference in copper density or thickness of the surface.
For the above specific description, the layout position of the rivet board is adjusted according to the copper density difference or thickness difference of the surface so that the warpage trend of the circumferential edge of the rivet board is directed to the substrate 6, aiming at optimizing the lamination process of the multilayer Printed Circuit Board (PCB). This approach is particularly focused on managing and directing the direction of warpage through the physical layout inside the rivet plate, ensuring that the effects of warpage on the overall structure and performance of the PCB are minimized; by adjusting the core layout in the rivet plate, the tendency of warpage due to copper density or thickness differences is guided and controlled so that all warpage is directed in the direction of the substrate 6. Such a layout helps to concentrate the warp stress and avoid structural instability caused by unevenly distributed warp; such a layout strategy helps to balance internal stresses throughout the structure of the laminated board, especially during high temperature lamination, and helps to more evenly distribute thermal stresses caused by temperature variations; the tendency to warp toward the substrate 6 may reduce interlayer voids, promote better resin flow and interlayer adhesion, and improve the mechanical and electrical performance of the PCB.
The above-mentioned can be seen that effective control of the warpage tendency helps to enhance the structural stability of the PCB and reduce the risk of physical damage caused by uneven warpage; through adjusting the layout to control the warping direction, the heat management of the PCB can be optimized to a certain extent, hot spots and uneven heating are reduced, and the performance and reliability of the product in practical application are improved.
S104, arranging a base plate 6 between the riveting plate and the pressure equalizing plate 4 so as to inhibit the warping trend of the riveting plate along the pressing direction, and pressing the riveting plate through the pressure equalizing plate 4.
Here, a base plate 6 is disposed between the rivet plate and the pressure equalizing plate 4 to suppress a warp tendency of the rivet plate in a press-fit direction, and press-fit is performed by the pressure equalizing plate 4 for optimizing a press-fit process of a Printed Circuit Board (PCB). The method aims to directly resist and control the warpage by a physical means, so that the riveting plate can be kept flat in the pressing process, and the quality and consistency of a PCB product are improved; the substrate 6 serves as a physical support layer, and by virtue of its rigidity and stability, applies a uniform back pressure to the rivet plate during the lamination process, helping to resist the tendency of warpage due to thermal expansion non-uniformity or material asymmetry; the use of the pressure equalizing plate 4 ensures that the pressure applied across the rivet plate surface is uniform, the presence of the base plate 6 further enhancing this uniformity, particularly in areas such as plate edges and corners where warping tends to occur; the substrate 6 not only helps to control warpage, but also helps to maintain flatness of the rivet plate during lamination, thereby optimizing resin flow and curing and improving interlayer adhesion quality.
As can be seen from the above, the use of the substrate 6 to suppress the tendency of warpage can significantly improve the flatness of the PCB, which is particularly important for High Density Interconnect (HDI) boards and fine line boards.
Specifically, when the first core plate 1 and the second core plate 3 have a difference in copper density and a difference in thickness on the surfaces, soaking foils 5 are provided between the rivet plate and the base plate 6 and between the rivet plate and the pressure equalizing plate 4.
For the above-described specific description, when the first core plate 1 and the second core plate 3 have the difference in surface copper density and the difference in thickness, the soaking foil 5 is provided between the rivet plate and the base plate 6 and between the rivet plate and the pressure equalizing plate 4, and more uniform heat distribution and pressure transmission are provided by the soaking foil 5, thereby reducing or eliminating warpage and internal stress caused by the difference in materials; the soaking foil 5 can provide more uniform heat distribution in the lamination process, especially in the riveting plate areas with different copper densities or different material thicknesses, so as to help balance the thermal expansion difference generated by the soaking foil; the soaking foil 5 is arranged between the riveting plate and the base plate 6 and between the riveting plate and the soaking plate 4, so that the even distribution of heat is facilitated, and meanwhile, more even pressure transmission can be realized, and the pressing force is ensured to act on each part of the riveting plate more evenly; the uniform heat distribution is beneficial to uniform flow and solidification of the resin in the lamination process, so that inconsistent solidification of the resin caused by uneven heat is reduced, and the interlayer bonding strength is improved.
Specifically, the opposite surfaces of the first core plate 1 and the second core plate 3 are copper sheet surfaces covered with the same thickness, and the soaking foil 5 corresponds to the copper sheet surfaces.
For the specific description, the soaking foil 5 directly corresponds to the copper sheet surface, so that more uniform heat distribution is realized in the lamination process, and particularly in the thicker area of the copper-clad layer, hot spots and uneven heating can be effectively reduced; the use of the soaking foil 5 not only contributes to an even distribution of heat, but also promotes a more uniform pressure across the surface of the rivet plate, especially in the copper skin coverage area, helping to avoid warpage or interlayer separation due to uneven pressure; the uniform heat and pressure distribution promotes uniform flow and curing of the resin, particularly at the interface of the copper-clad surface and other materials, thereby improving the quality and reliability of interlayer bonding.
As can be seen from the above, by ensuring the corresponding arrangement of the soaking foil 5 and the copper foil surface, processing defects such as bubbles, interlayer separation, and the like caused by uneven heat or uneven pressure can be effectively reduced; the balanced heat and pressure are beneficial to improving the flatness of the riveting plate and reducing the warping phenomenon, which is important to ensuring the accuracy of the subsequent processing process (such as drilling, edge milling and surface mounting); the optimized lamination process ensures good adhesion between the copper sheet and other layers, is beneficial to improving the electrical performance of the PCB and reduces the risk of electrical faults.
Specifically, the soaking foil 5 is copper foil, and when the difference of copper density and thickness of the surfaces of the first core board 1 and the second core board 3 exist, the soaking foil 5 is arranged between the riveting plate and the base board 6 and between the riveting plate and the pressure equalizing plate 4, and the soaking foil 5 (copper foil in this case) is used for treating and optimizing the differences, so that the warping and uneven heating problems in the lamination process are reduced; copper foil corresponds to copper foil surface: the opposite surfaces of the first core plate 1 and the second core plate 3 are copper sheet surfaces covered with the same thickness, and the soaking foil 5 corresponds to the copper sheet surfaces. This means that the use of the soaking foil 5 is not only to improve the uniformity of the heat distribution, but also to ensure uniformity between copper layers, thereby optimizing the electrical performance and structural stability of the circuit board.
The soaking foil 5 (copper foil) helps to provide a uniform heat diffusion capability on both sides of the substrate 6, which is important for maintaining the heat balance during lamination, helping to reduce warpage caused by thermal expansion; the uniform distribution of the copper layer is beneficial to balancing stress in the pressing process, reducing stress concentration points, and being beneficial to maintaining the overall stability of the plate and reducing deformation; due to the uniformity of copper layer thickness, electrical characteristics (such as impedance and capacitance) can be more easily matched and predicted, thereby achieving higher accuracy in design.
Specifically, the first core plate 1 has a thickness a and the second core plate 3 has a thickness b, and has a first reference value ofWherein alpha is a compensation coefficient; and the first core plate 1 has a second reference value characterizing the copper density difference on its surface, and the second core plate 3 has a third reference value characterizing the copper density difference on its surface;
when the first reference value is larger than the second reference value and the third reference value, setting a layout position according to the thickness difference;
when the first reference value is not smaller than the second reference value or the third reference value, adjusting the thickness of the base plate 6 to the thickness of the riveting plate, and setting the layout position according to the thickness difference;
When the first reference value is smaller than the second reference value or the third reference value, setting the layout position according to the copper density difference of the surface.
For the above detailed description, when the first reference value is greater than the second reference value and the third reference value, it is indicated that the difference in thickness between the first core board 1 and the second core board 3 has a greater influence on the warpage of the circuit board member than the difference in thickness of the copper layer; in this case, the layout position is set based on the thickness difference. The method is beneficial to balancing the thermal expansion difference caused by different thicknesses, and reduces the warpage generated in the lamination process, thereby improving the flatness of the PCB.
When the first reference value is not smaller than the second reference value or the third reference value, it means that the effect between the thickness difference and the copper layer thickness difference is equivalent, or the thickness difference is equivalent to at least the thickness difference of one of the copper layers; in this case, the thickness of the base plate 6 is adjusted to be the same as the rivet plate, and the layout position is determined according to the thickness difference. Helping to ensure that the rivet plate is subjected to uniform pressure during the press-fit process, and pressure equalization can be maintained even in the case of inconsistent thickness.
When the first reference value is smaller than the second reference value or the third reference value: indicating that the copper layer thickness difference has a greater effect on the warpage of the circuit board member than the thickness difference of the core plate; at this time, the layout position is set based on the difference in the copper density of the surface. The proper layout position can compensate the thermal expansion difference caused by the uneven copper density in advance, and is beneficial to reducing the warping caused by the thermal expansion coefficient difference.
Specifically, the second reference value is a difference in surface copper-containing density between two opposite sides of the first core plate 1 in the lamination direction, and the third reference value is a difference in surface copper-containing density between two opposite sides of the second core plate 3 in the lamination direction.
Specifically, the first core board 1 has a GTL surface 101 and a line surface 102, and the first core board 1 has a light surface 301 and a GBL surface 302, where both the GTL surface 101 and the GBL surface 302 are copper sheet surfaces, and the light surface 301 does not contain copper.
Compared with the traditional manufacturing process, the novel manufacturing process of the PCB asymmetric structure laminated row plate effectively solves the problems. The method ensures the stability and consistency of the asymmetric structural plate in the pressing process through optimized material selection and pressing process, and remarkably reduces the warping problem. The improved process method not only improves the production efficiency and the product quality, but also reduces the material waste and the production cost. By a more uniform hot pressing and cooling process, it is ensured that all areas are uniformly stressed, and the problem of warpage due to uneven local thermal expansion or contraction is avoided. The method can meet the requirements of complex and high-performance electronic products, and enables PCB manufacturers to more flexibly cope with diversified design requirements.
In any of the above embodiments, the thickness of the base plate 6 is less than or equal to the thickness of the rivet plate, and the thickness of the base plate 6 is greater than the thickness of the first core plate 1 and the thickness of the second core plate 3.
In this embodiment, during the lamination of the Printed Circuit Board (PCB), the thickness of the base plate 6 is set to be less than or equal to the thickness of the rivet board and greater than the individual thicknesses of the first core plate 1 and the second core plate 3; the thickness of the base plate 6 provides a stable support for the press fit, helping to maintain the shape and flatness of the rivet plate during the press fit process; the thicker substrate 6 can more effectively suppress warpage due to uneven thermal expansion during lamination; a suitable thickness of the base plate 6 ensures that the stresses are distributed evenly over the rivet plate during the pressing process, in particular in the edge region of the rivet plate; thicker substrates 6 may help to disperse heat more evenly, help to evenly heat and cool the process, and avoid local overheating or cooling too quickly.
In any of the above embodiments, the two surfaces of the substrate 6 opposite to each other along the lamination direction have copper layers, and the copper layers have the same copper-containing thickness as the surfaces of the first core board 1 or the second core board 3.
In this embodiment, the copper layer of the same thickness helps to provide a uniform heat diffusion capability on both sides of the substrate 6, which helps to maintain a thermal balance during lamination, thereby reducing warpage caused by thermal expansion; the uniform distribution of the copper layers helps to equalize stress during lamination, reduces stress concentration points, and helps to maintain overall stability and reduce deformation of the sheet material; due to the uniformity of copper layer thickness, electrical characteristics (such as impedance and capacitance) can be more easily matched and predicted, thereby achieving higher accuracy in design.
In any of the embodiments, according to the number of the produced plates, firstly cutting a 1.2mm double-sided copper-containing 1/1OZ PCB plate into equal parts of base plates 6, wherein the single side is larger than the sizes of the first core plate 1 and the second core plate 3 by 5mm, ensuring that the produced plates can be completely placed on the base plates 6 when the plates are arranged, carrying out browning and baking after edging, and preparing the plates after cooling;
Then placing the riveted plates to be arranged with the thin core plate surface or the low-density copper surface downwards according to the following steps: steel plate-1.2 mm double-sided copper-containing 1/1oz substrate 6-copper foil-riveting plate-copper foil-steel plate sequence, laminating to a proper height, and placing the laminated plate into a vacuum lamination machine for hot pressing after plate arrangement is completed;
The subsequent steps comprise grinding, drilling, copper deposition, outer dry film plating, etching, solder resist, character, tin spraying, electric measurement, plate milling, packaging and shipment, wherein the actual measured warping degree of the finished product is less than 0.25%, and the yield is 100%.
In this embodiment, the tendency of warpage due to copper-containing density or thickness differences is controlled by the physical layout inside the rivet plate, with all warpage being directed toward the substrate 6. Such a layout helps concentrate the warp stress and avoids uneven distribution of warp resulting in structural instability. In addition, it helps to balance internal stresses throughout the sheet, especially during high temperature lamination, and helps to more evenly distribute thermal stresses caused by temperature variations. The tendency to warp toward the substrate 6 may reduce interlayer voids, promote better resin flow and interlayer adhesion, and improve the mechanical and electrical performance of the PCB.
Embodiments of the second aspect of the present invention provide a circuit board member. In some embodiments of the invention, the circuit board member is made by the method of pressing the rows of boards in the asymmetric structure in the printed circuit board of any of the embodiments described above.
Wherein, the warpage of the circuit board piece is A, and A is less than 0.25%.
The circuit board provided by the invention is manufactured by adopting the method of pressing the row plates with the asymmetric structure, which is mentioned in the embodiment, and shows a specific manufacturing process, wherein the process is focused on controlling and optimizing the warping degree of the circuit board, the warping degree of the circuit board is strictly controlled within the range of A <0.25%, and the performance and the reliability of the circuit board in the subsequent processing and using processes are directly influenced; by adopting a specific pressing board arrangement method, the warping degree of the PCB can be finely controlled in the manufacturing process of the PCB so as to ensure that the PCB is within a specified tolerance range; the tight warp control helps optimize physical properties of the circuit board, such as flatness and mechanical stability; a highly planar PCB helps to improve the quality and accuracy of subsequent processing steps such as soldering, punching and assembly of the assembly.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The foregoing embodiments are merely illustrative of the preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but various modifications and improvements made by those skilled in the art to which the present invention pertains are made without departing from the spirit of the present invention, and all changes and modifications and improvements fall within the scope of the present invention as defined in the appended claims.
Claims (8)
1. A method for pressing a row board with an asymmetric structure in a printed circuit board, which is characterized by comprising the following steps:
Obtaining a first core plate and a second core plate, and arranging at least one impregnated laminate between the first core plate and the second core plate so as to form a riveting plate in a stacking way;
arranging the riveting plates between two equalizing plates along a preset pressing direction of pressing the row plates;
According to the asymmetric difference between the first core plate and the second core plate, which can influence the warpage of the riveting plate, the layout position of the riveting plate is adjusted between the two pressure equalizing plates, so that the riveting plate has a warpage trend along the lamination direction when being laminated; the asymmetric differences include differences in copper-containing density on the surface of the core plate and differences in thickness of the core plate; the layout positions are set by adopting the following rules: when the first core plate and the second core plate have thickness difference, the first core plate and the second core plate are gradually reduced according to thickness along the pressing direction; when opposite surfaces of the first core plate and/or the second core plate along the lamination direction have surface copper-containing density difference, gradually reducing the surface copper-containing density of the opposite surfaces of the first core plate and the second core plate along the lamination direction;
arranging a base plate between the riveting plate and the pressure equalizing plate so as to inhibit the warping trend of the riveting plate along the pressing direction, and pressing the riveting plate through the pressure equalizing plate;
Wherein the first core plate has a thickness a and the second core plate has a thickness b, and has a first reference value of Wherein, alpha is a compensation coefficient; and said first core plate having a second reference value indicative of said surface copper-containing density differential thereof, said second core plate having a third reference value indicative of said surface copper-containing density differential thereof; when the first reference value is larger than the second reference value and the third reference value, setting the layout position according to the thickness difference; when the first reference value is not smaller than the second reference value or the third reference value, adjusting the thickness of the base plate to the thickness of the riveting plate, and setting the layout position according to the thickness difference; and when the first reference value is smaller than the second reference value or the third reference value, setting the layout position according to the surface copper-containing density difference.
2. The method of pressing an array of boards in an asymmetrical structure in a printed circuit board according to claim 1, wherein the first core board, the second core board and at least one of the dip boards stacked on each other are fixed to each other by blind holes formed therein so that each of circumferential edge portions of the rivet boards has a tendency to warp with respect to a central portion of the rivet board.
3. The method for pressing the bent plates with the asymmetric structure in the printed circuit board according to claim 2, wherein the warpage tendency of the circumferential edge portion of the rivet plate is directed to the substrate according to the arrangement position adjusted by the surface copper-containing density difference or the thickness difference.
4. The method of pressing an array of boards in an asymmetrical structure in a printed circuit board of claim 1, wherein when the first core board and the second core board have the difference in copper density and the difference in thickness on the surfaces, a soaking foil is provided between the rivet board and the base board and between the rivet board and the pressure equalizing board.
5. The method of pressing an array of asymmetrical structures in a printed circuit board according to claim 4, wherein the opposite sides of the first core board and the second core board are copper surfaces covered with the same thickness, and the soaking foil corresponds to the copper surfaces.
6. The method of claim 1, wherein the thickness of the base plate is less than or equal to the thickness of the rivet plate and the thickness of the base plate is greater than the thickness of the first core plate and the thickness of the second core plate.
7. The method of claim 6, wherein the two opposite surfaces of the substrate in the bonding direction each have a copper layer, and the copper layer has the same copper-containing thickness as the first core board or the second core board.
8. A circuit board member made by the method of pressing an asymmetric structure of a printed circuit board as claimed in any one of claims 1 to 7;
Wherein the warpage of the circuit board is A, and A is less than 0.25%.
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| CN103153005A (en) * | 2013-02-02 | 2013-06-12 | 汕头超声印制板（二厂）有限公司 | Multilayer printed board lamination method |
| CN110493978A (en) * | 2019-07-24 | 2019-11-22 | 广合科技（广州）有限公司 | A kind of thickness and angularity control method of printed circuit board |
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
| CN216873450U (en) * | 2021-12-30 | 2022-07-01 | 珠海杰赛科技有限公司 | Laminated structure of printed circuit board and printed circuit board |
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| US10194537B2 (en) * | 2013-03-25 | 2019-01-29 | International Business Machines Corporation | Minimizing printed circuit board warpage |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153005A (en) * | 2013-02-02 | 2013-06-12 | 汕头超声印制板（二厂）有限公司 | Multilayer printed board lamination method |
| CN110493978A (en) * | 2019-07-24 | 2019-11-22 | 广合科技（广州）有限公司 | A kind of thickness and angularity control method of printed circuit board |
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
| CN216873450U (en) * | 2021-12-30 | 2022-07-01 | 珠海杰赛科技有限公司 | Laminated structure of printed circuit board and printed circuit board |
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