CN117810134A - Temperature control system and temperature control method - Google Patents

Abstract

The application provides a temperature control system and a temperature control method, and relates to the field of semiconductor temperature control. The temperature control system comprises a first liquid storage tank, a second liquid storage tank and a cooling liquid circulation pipeline. The cooling liquid circulation pipeline comprises a cooling liquid return pipe and a cooling liquid supply pipe which are communicated, the temperature of the first liquid storage tank is higher than that of the second liquid storage tank, and the liquid outlet of the first liquid storage tank and the liquid outlet of the second liquid storage tank are converged to the cooling liquid supply pipe. Compared with the temperature switching mode that the whole temperature in the water tank is increased or reduced by the existing temperature control system, the method for converging the high-temperature cooling liquid and the low-temperature cooling liquid in the cooling liquid supply pipe can quickly and accurately modulate the temperature of the cooling liquid required by the load. Therefore, the temperature control device shortens the processing period of the semiconductor and improves the production efficiency of the semiconductor.

Description

Temperature control system and temperature control method

Technical Field

The invention relates to the field of semiconductor temperature control, in particular to a temperature control system and a temperature control method.

Background

Currently, in semiconductor manufacturing processes, a temperature control device is generally used to provide a temperature-stabilized coolant to a load side. Typically, the execution of different processes requires cooling fluids at different temperatures. When temperature switching is performed by a temperature control system in the market, the temperature in the water tank is often raised or lowered to a target temperature as a whole.

However, since a large amount of coolant is stored in the water tank, when the coolant in the water tank is heated or cooled as a whole, the processing time is too long, which seriously affects the processing cycle of the semiconductor and reduces the processing efficiency of the semiconductor.

Disclosure of Invention

The invention provides a temperature control system and a temperature control method, which can meet the temperature of a cooling liquid required by a load at a higher speed and higher precision, thereby shortening the processing period of a semiconductor and improving the production efficiency of the semiconductor.

Embodiments of the invention may be implemented as follows:

in a first aspect, the present invention provides a temperature control system, including a first liquid storage tank, a second liquid storage tank, and a cooling liquid circulation line;

the cooling liquid circulation pipeline comprises a cooling liquid return pipe and a cooling liquid supply pipe which are communicated, the temperature of the first liquid storage tank is higher than that of the second liquid storage tank, and the liquid outlet of the first liquid storage tank and the liquid outlet of the second liquid storage tank are converged to the cooling liquid supply pipe.

Based on the above arrangement, the high-temperature cooling liquid provided by the first liquid storage tank and the low-temperature cooling liquid provided by the second liquid storage tank are converged to the cooling liquid supply pipe in proportion to be mixed, and then the mixed cooling liquid acts on the load through the cooling liquid supply pipe. Compared with the temperature switching mode that the whole temperature in the water tank is increased or reduced by the existing temperature control system, the method for converging the high-temperature cooling liquid and the low-temperature cooling liquid in the cooling liquid supply pipe can quickly and accurately modulate the temperature of the cooling liquid required by the load.

In an alternative embodiment, the outlet of the cooling liquid return pipe is in communication with the inlet of the first reservoir and/or the inlet of the second reservoir.

Based on the arrangement, on one hand, the first liquid storage tank or the second liquid storage tank is used for supplementing liquid, so that the recycling of the cooling liquid is realized; in addition, in the aspect, the reflowed cooling liquid can reflow to the first liquid storage tank or the second liquid storage tank which is closer to the self temperature, so that the overlarge temperature difference between the cooling liquid and the first liquid storage tank or the second liquid storage tank is avoided, and larger temperature difference fluctuation is brought.

In an alternative embodiment, the temperature control system further comprises a first plate heat exchanger, the first plate heat exchanger comprises a first flow path and a second flow path, the first flow path and the second flow path are in heat exchange, the first flow path is connected to the cooling liquid circulation pipeline, an outlet of the first flow path is communicated with a liquid inlet of the second liquid storage tank, and the second flow path is connected to the cooling medium circulation pipeline.

Based on the arrangement, the cooling liquid flowing back to the first flow path exchanges heat with the cooling medium in the second flow path, so that the temperature of the cooling liquid flowing back to the second liquid storage tank is further reduced, the temperature fluctuation of the low-temperature cooling liquid in the second liquid storage tank is ensured to be in a normal range, and the second liquid storage tank is convenient to participate in temperature switching adjustment in subsequent working conditions.

In an alternative embodiment, the temperature control system further comprises a first branch and a second branch, the cooling liquid return pipe is communicated with the liquid inlet of the first liquid storage tank through the first branch, and the cooling liquid return pipe is communicated with the liquid inlet of the second liquid storage tank through the second branch; the cooling liquid return pipe is provided with a three-way valve, and two outlets of the three-way valve are respectively communicated with the first branch and the second branch;

or the temperature control system further comprises a first branch, a second branch, a first electromagnetic valve and a second electromagnetic valve, wherein the cooling liquid return pipe is communicated with the liquid inlet of the first liquid storage tank through the first branch, and the cooling liquid return pipe is communicated with the liquid inlet of the second liquid storage tank through the second branch; the first solenoid valve is arranged on the first branch path, and the second solenoid valve is arranged on the second branch path.

Based on the above arrangement, when the temperature of the liquid return of the load is high, at this time, the outlet of the first electromagnetic valve or the three-way valve communicated with the first liquid storage tank is opened, and the cooling liquid flows back into the first liquid storage tank through the first branch, so as to avoid the occurrence of larger fluctuation of the temperature in the first liquid storage tank; when the liquid return temperature of the load is low, an outlet of the second electromagnetic valve or the three-way valve communicated with the second liquid storage tank is opened, and the cooling liquid flows back to the second liquid storage tank through the second branch, so that the temperature in the second liquid storage tank is prevented from greatly fluctuating.

In an alternative embodiment, the temperature control system further comprises a first regulating valve and a second regulating valve, wherein the first regulating valve is arranged at a liquid outlet of the first liquid storage tank and is used for controlling the on-off of the first liquid storage tank and the cooling liquid supply pipe, the second regulating valve is arranged at a liquid outlet of the second liquid storage tank and is used for controlling the on-off of the second liquid storage tank and the cooling liquid supply pipe;

or, the temperature control system further comprises a three-way regulating valve, the first inlet of the three-way regulating valve is communicated with the liquid outlet of the first liquid storage tank, the second inlet of the three-way regulating valve is communicated with the liquid outlet of the second liquid storage tank, and the outlet of the three-way regulating valve is communicated with the cooling liquid supply pipe.

Based on the setting, the opening of the first inlet of the first regulating valve or the three-way regulating valve is controlled, so that the high-temperature cooling liquid provided by the first liquid storage tank flows into the cooling liquid supply pipe at a certain flow rate; the opening of the second inlet of the second regulating valve or the three-way regulating valve is controlled, so that the low-temperature cooling liquid provided by the second liquid storage tank flows to the cooling liquid supply pipe at a certain flow rate. Therefore, the high-temperature cooling liquid and the low-temperature cooling liquid are mixed in the cooling liquid supply pipe in proportion to prepare the mixed cooling liquid meeting the load requirement.

In a second aspect, the present invention provides a temperature control method for controlling the temperature control system according to any one of the foregoing embodiments, including:

acquiring a first preset temperature required by a load;

calculating a first liquid outlet flow and/or temperature of the first liquid storage tank and a first liquid outlet flow and/or temperature of the second liquid storage tank according to a first preset temperature;

the difference value between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the first liquid outlet flow and/or temperature of the first liquid storage tank is controlled to be smaller than a preset value, and the difference value between the actual liquid outlet flow and/or temperature of the second liquid storage tank and the first liquid outlet flow and/or temperature of the second liquid storage tank is controlled to be smaller than the preset value.

According to the temperature control method, the liquid outlet flow and/or the liquid outlet temperature of the first liquid storage tank and the liquid outlet flow and/or the liquid outlet temperature of the second liquid storage tank are/is determined according to the temperature required by the load, so that the temperature of cooling liquid required by the load can be met rapidly and accurately, the processing period of a semiconductor is shortened, and the production efficiency of the semiconductor is improved.

In an alternative embodiment of the present invention,

after the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the first liquid outlet flow and/or temperature of the first liquid storage tank to be smaller than a preset value, the temperature control method further comprises one of the following characteristics:

(1) Acquiring a second preset temperature required by the load, wherein the second preset temperature is higher than the first preset temperature;

calculating a second liquid outlet flow and/or temperature of the first liquid storage tank and a second liquid outlet flow and/or temperature of the second liquid storage tank according to a second preset temperature;

controlling the difference value between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the second liquid outlet flow and/or temperature of the first liquid storage tank to be smaller than a preset value, and controlling the difference value between the actual liquid outlet flow and/or temperature of the second liquid storage tank and the second liquid outlet flow and/or temperature of the second liquid storage tank to be smaller than the preset value;

(2) Acquiring a third preset temperature required by the load, wherein the third preset temperature is lower than the first preset temperature;

calculating a third liquid outlet flow and/or temperature of the first liquid storage tank and a third liquid outlet flow and/or temperature of the second liquid storage tank according to a third preset temperature;

the difference value between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the third liquid outlet flow and/or temperature of the first liquid storage tank is controlled to be smaller than a preset value, and the difference value between the actual liquid outlet flow and/or temperature of the second liquid storage tank and the third liquid outlet flow and/or temperature of the second liquid storage tank is controlled to be smaller than the preset value.

According to the temperature control method, when the temperature required by a load is increased, the liquid outlet flow and/or the temperature of the first liquid storage tank are increased, the liquid outlet flow and/or the temperature of the second liquid storage tank are reduced, when the temperature required by the load is reduced, the liquid outlet flow and/or the temperature of the second liquid storage tank are increased, and the liquid outlet flow and/or the temperature of the first liquid storage tank are reduced, so that the cooling liquid temperature required by the load in different process flows is rapidly and accurately met under the condition of ensuring the total flow unchanged, the processing period of a semiconductor is shortened, and the production efficiency of the semiconductor is improved.

In an alternative embodiment of the present invention,

after the step of controlling the difference between the actual liquid outlet flow rate and/or temperature of the first liquid storage tank and the first liquid outlet flow rate and/or temperature of the first liquid storage tank to be smaller than a preset value, the temperature control method further comprises the following steps of:

and controlling the flow of the cooling liquid return pipe flowing back to the first liquid storage tank and/or the second liquid storage tank.

According to the temperature control method, according to the temperature of the cooling liquid return liquid, the flow of the cooling liquid return liquid pipe flowing back to the first liquid storage tank and/or the second liquid storage tank is controlled, and the temperature change of the first liquid storage tank or the second liquid storage tank is prevented from being too large.

In an alternative embodiment, the temperature control system further comprises a three-way regulating valve, a first inlet of the three-way regulating valve is communicated with a liquid outlet of the first liquid storage tank, a second inlet of the three-way regulating valve is communicated with a liquid outlet of the second liquid storage tank, and an outlet of the three-way regulating valve is communicated with the cooling liquid supply pipe;

the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the first liquid outlet flow and/or temperature of the first liquid storage tank to be smaller than a preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank and the first liquid outlet flow and/or temperature of the second liquid storage tank to be smaller than the preset value specifically comprises the following steps:

Controlling the opening of the first inlet of the three-way regulating valve to control the difference value between the actual liquid outlet flow of the first liquid storage tank and the first liquid outlet flow of the first liquid storage tank to be smaller than a preset value;

and controlling the opening of the second inlet of the three-way regulating valve to control the difference value between the actual liquid outlet flow of the second liquid storage tank and the first liquid outlet flow of the second liquid storage tank to be smaller than a preset value.

According to the temperature control method, the opening degree of the first inlet or the second inlet of the three-way regulating valve is controlled so as to realize the liquid outlet flow of the first liquid storage tank or the second liquid storage tank.

In an alternative embodiment, the temperature control system further comprises a first regulating valve and a second regulating valve, wherein the first regulating valve is arranged at a liquid outlet of the first liquid storage tank and is used for controlling the on-off of the first liquid storage tank and the cooling liquid supply pipe, the second regulating valve is arranged at a liquid outlet of the second liquid storage tank and is used for controlling the on-off of the second liquid storage tank and the cooling liquid supply pipe;

the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank and the first liquid outlet flow and/or temperature of the first liquid storage tank to be smaller than a preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank and the first liquid outlet flow and/or temperature of the second liquid storage tank to be smaller than the preset value specifically comprises the following steps:

Controlling the opening degree of the first regulating valve to control the difference value between the actual liquid outlet flow of the first liquid storage tank and the first liquid outlet flow of the first liquid storage tank to be smaller than a preset value;

and controlling the opening degree of the second regulating valve to control the difference value between the actual liquid outlet flow of the second liquid storage tank and the second liquid outlet flow of the second liquid storage tank to be smaller than a preset value.

According to the temperature control method, the opening degree of the first regulating valve or the second regulating valve is controlled so as to achieve the liquid outlet flow of the first liquid storage tank or the second liquid storage tank.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a temperature control system according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart of a temperature control method according to an embodiment of the present invention;

fig. 3 is a schematic flow chart of another temperature control method according to an embodiment of the present invention.

Icon: 10-a temperature control system; 100-a first liquid storage tank; 200-a second liquid storage tank; 300-three-way regulating valve; 400-load; 500-a cooling liquid circulation pipeline; 510-a first leg; 511-a first solenoid valve; 530-a second leg; 531-a second solenoid valve; 541-a coolant supply pipe; 543-a cooling liquid return pipe; 550-a pump; 570—a temperature sensor; 600-refrigerant circulation pipeline; 610-a first plate heat exchanger; 611-a first flow path; 613-a second flow path; 630-second plate heat exchanger; 631-a third flow path; 633 to fourth flow paths; 650-compressors; 670-an expansion valve; 700-heater.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

Fig. 1 is a schematic structural diagram of a temperature control system 10 according to an embodiment of the present invention, please refer to fig. 1. The arrow direction shown in fig. 1 is the flow direction of the cooling medium. The present application provides a temperature control system 10 that includes a first tank 100, a second tank 200, and a coolant circulation line 500. The cooling liquid circulation pipeline 500 includes a cooling liquid return pipe 543 and a cooling liquid supply pipe 541, which are connected, the temperature of the first liquid storage tank 100 is higher than that of the second liquid storage tank 200, and the liquid outlet of the first liquid storage tank 100 and the liquid outlet of the second liquid storage tank 200 are merged into the cooling liquid supply pipe 541.

It should be noted that the first tank 100 is used for storing high-temperature cooling liquid, and the second tank 200 is used for storing low-temperature cooling liquid, that is, the cooling liquid temperature in the first tank 100 is higher than the cooling liquid temperature in the second tank 200. The coolant supply pipe 541 is used to act on the load 400. Based on this, the high-temperature coolant supplied from the first tank 100 and the low-temperature coolant supplied from the second tank 200 are mixed in proportion to the coolant supply pipe 541, so as to prepare a mixed coolant at a temperature required for the load 400. Thereafter, the mixed coolant is applied to the load 400 through the coolant supply pipe 541.

Compared with the temperature switching mode that the whole temperature in the water tank is increased or reduced by the existing temperature control system 10, the method for converging the high-temperature cooling liquid and the low-temperature cooling liquid in the cooling liquid supply pipe 541 can quickly and accurately modulate the temperature of the cooling liquid required by the load 400. Therefore, the temperature control device shortens the processing period of the semiconductor and improves the production efficiency of the semiconductor.

In some embodiments, temperature control system 10 further includes a three-way regulator valve 300, a first inlet of three-way regulator valve 300 is in communication with a liquid outlet of first liquid reservoir 100, a second inlet of three-way regulator valve 300 is in communication with a liquid outlet of second liquid reservoir 200, and an outlet of three-way regulator valve 300 is in communication with a coolant liquid supply tube 541.

In addition, in order to facilitate automatic control of on-off of each inlet or outlet, the three-way regulating valve 300 is an electric three-way regulating valve 300. In detail, the first inlet of the three-way regulator valve 300 is the b port shown in fig. 1, the second inlet of the three-way regulator valve 300 is the a port shown in fig. 1, and the outlet of the three-way regulator valve 300 is the c port shown in fig. 1.

Based on the above-described setting, by controlling the opening degree of the first inlet of the three-way regulating valve 300, the high-temperature coolant supplied from the first tank 100 is caused to flow in from the first inlet of the three-way regulating valve 300 at a certain flow rate; by controlling the opening degree of the second inlet of the three-way regulator valve 300, the cryogenic cooling liquid supplied from the second tank 200 is caused to flow in from the second inlet of the three-way regulator valve 300 at a certain flow rate. Then, the two are mixed in proportion and flow to the coolant supply pipe 541 through the outlet of the three-way regulator valve 300, and then supplied to the load 400.

In other embodiments, the temperature control system 10 further includes a first adjusting valve and a second adjusting valve, the first adjusting valve is disposed at the liquid outlet of the first liquid storage tank 100, the first adjusting valve is used for controlling the on-off of the first liquid storage tank 100 and the cooling liquid supply pipe 541, the second adjusting valve is disposed at the liquid outlet of the second liquid storage tank 200, and the second adjusting valve is used for controlling the on-off of the second liquid storage tank 200 and the cooling liquid supply pipe 541.

It will be appreciated that the first and second regulating valves are implemented as solenoid valves to facilitate automated control of the fluid output from the first and second reservoirs 100, 200. In detail, by controlling the opening degree of the first regulating valve, the high-temperature coolant supplied from the first tank 100 is caused to flow into the coolant supply pipe 541 at a certain flow rate; by controlling the second adjusted opening degree, the low-temperature coolant supplied from the second tank 200 flows to the coolant supply pipe 541 at a certain flow rate. As described above, the high-low temperature coolant is proportionally mixed in the coolant supply pipe 541 to prepare the mixed coolant in accordance with the temperature requirement of the load 400.

The cooling liquid passing through the load 400 has different liquid return modes according to different temperatures. As an alternative embodiment, the outlet of the cooling liquid return tube 543 communicates with the liquid inlet of the first liquid storage tank 100 and/or the liquid inlet of the second liquid storage tank 200. It is to be understood that the load 400 is disposed between the coolant return pipe 543 and the coolant supply pipe 541, and that the coolant flows through the coolant supply pipe 541, the load 400, and the coolant return pipe 543 in this order. That is, after the load 400 is applied, the cooling liquid can flow to the first liquid storage tank 100 or the second liquid storage tank 200 through the cooling liquid return pipe 543 selectively, so as to supplement the cooling liquid to the first liquid storage tank 100 or the second liquid storage tank 200, thereby realizing recycling of the cooling liquid.

Specifically, in some embodiments, temperature control system 10 further includes a first branch 510, a second branch 530, a first solenoid valve 511, and a second solenoid valve 531, wherein a cooling liquid return tube 543 communicates with a liquid inlet of first liquid storage tank 100 through first branch 510, and cooling liquid return tube 543 communicates with a liquid inlet of second liquid storage tank 200 through second branch 530; the first electromagnetic valve 511 is disposed on the first branch 510, and the second electromagnetic valve 531 is disposed on the second branch 530. The first solenoid valve 511 can control the on/off of the first branch 510 to regulate the amount of the cooling liquid flowing back into the first liquid tank 100. The second solenoid valve 531 can control the on-off of the second branch 530 to adjust the amount of the cooling liquid flowing back into the second tank 200.

When the temperature of the liquid returning of the load 400 is high, the first electromagnetic valve 511 is opened, and the cooling liquid flows back to the first liquid storage tank 100 through the first branch 510, so as to avoid the occurrence of large fluctuation of the temperature in the first liquid storage tank 100; when the temperature of the liquid returning of the load 400 is low, the second electromagnetic valve 531 is opened, and the cooling liquid flows back to the second liquid storage tank 200 through the second branch 530, so as to avoid the occurrence of large temperature fluctuation in the second liquid storage tank 200.

Further, by adjusting the opening degrees of the first solenoid valve 511 and the second solenoid valve 531, the amount of the coolant flowing back to the first tank 100 or the second tank 200 can be controlled. Therefore, when the return temperature of the load 400 is high, both the first solenoid valve 511 and the second solenoid valve 531 are opened, and the opening degree of the first solenoid valve 511 is larger than that of the second solenoid valve 531, so that most of the cooling liquid returns to the first tank 100 through the first solenoid valve 511 and a small part of the cooling liquid returns to the second tank 200 through the second solenoid valve 531, thereby simultaneously realizing the return of the cooling liquid to the first tank 100 and the second tank 200.

In other embodiments, the temperature control system 10 further includes a first branch 510 and a second branch 530, the cooling liquid return tube 543 is connected to the liquid inlet of the first liquid storage tank 100 through the first branch 510, and the cooling liquid return tube 543 is connected to the liquid inlet of the second liquid storage tank 200 through the second branch 530; the coolant liquid return tube 543 is provided with a three-way valve, and two outlets of the three-way valve are respectively communicated with the first branch 510 and the second branch 530. It will be appreciated that, similar to the foregoing, the opening or the on-off of the inlet and the different outlets of the three-way valve can be controlled to realize the backflow of the first liquid storage tank 100 or the second liquid storage tank 200, and simultaneously avoid the occurrence of larger temperature fluctuation of the first liquid storage tank 100 or the second liquid storage tank 200. And will not be described in detail herein.

Based on the different liquid return modes of the load 400, on one hand, the first liquid storage tank 100 or the second liquid storage tank 200 is used for supplementing liquid, so that the recycling of the cooling liquid is realized; on the other hand, the returned cooling liquid can be returned to the first liquid storage tank 100 or the second liquid storage tank 200 which is closer to the temperature of the cooling liquid, so that the temperature difference between the cooling liquid and the first liquid storage tank 100 or the second liquid storage tank 200 is avoided from being too large, and larger temperature difference fluctuation is caused.

Referring again to fig. 1, in order to ensure that the temperature of the coolant provided by the temperature control system 10 to the load 400 is the temperature required by the load 400, the temperature control system 10 further includes a pump 550 and a temperature sensor 570 disposed in the coolant supply tube 541, and the pump 550 and the temperature sensor 570 are sequentially disposed between the outlet of the three-way regulator valve 300 and the load 400.

It will be appreciated that when temperature control system 10 is in operation, pump 550 is capable of pressurizing coolant pump 550 in coolant supply line 541 to load 400. The temperature sensor 570 disposed behind the pump 550 can determine whether the temperature of the coolant prepared by the above process meets the requirement of the load 400.

That is, the first liquid storage tank 100 and the second liquid storage tank 200 directly mix and regulate the cooling liquid to the target temperature through the three-way regulating valve 300, and the mixed cooling liquid with the target temperature value meets the requirement of the load 400 and flows to the load 400 to participate after being judged by the temperature sensor 570 on the cooling liquid supply pipe 541.

It will be appreciated, therefore, that the temperature control system 10 provided herein is more responsive and capable of switching to the desired temperature of the load 400 in a different process flow in a shorter time than other temperature control systems 10 that perform integral tank temperature regulation. In particular, the faster the switching rate of the present application, the more pronounced the advantage is at larger temperature spans.

To further ensure that the high temperature coolant in first tank 100 always fluctuates within a normal range, temperature control system 10 further includes a heater 700, heater 700 being disposed within first tank 100. It will be appreciated that the return flow of coolant from the load 400 into the first tank 100 may cause a drop in temperature in the first tank 100. And the heater 700 has a temperature adjusting function, and can offset heat dissipation in the first liquid storage tank 100, so that the cooling liquid in the first liquid storage tank 100 is stabilized at a required temperature.

To further reduce the temperature of the cooling fluid flowing back into the second tank 200, so as to ensure that the temperature fluctuation of the cooling fluid in the second tank 200 is within the normal range, the temperature control system 10 further includes a first plate heat exchanger 610, the first plate heat exchanger 610 includes a first flow path 611 and a second flow path 613, the first flow path 611 exchanges heat with the second flow path 613, the first flow path 611 is connected to the cooling fluid circulation line 500, an outlet of the first flow path 611 is communicated with a fluid inlet of the second tank 200, and the second flow path 613 is connected to the refrigerant circulation line 600.

The principle of operation of the plate heat exchanger is achieved by a heat transfer mechanism in which heat is always transferred spontaneously from a high temperature object to a low temperature object. In detail, the plate heat exchanger makes two fluids with different temperatures flow in the space separated by the wall surface, and heat conduction and convection of the fluids are formed on the wall surface through the wall surface, so that heat exchange between the two fluids is promoted.

That is, the cooling liquid flowing back to the first flow path 611 exchanges heat with the cooling medium in the second flow path 613, so as to further reduce the temperature of the cooling liquid flowing back to the second liquid storage tank 200, ensure that the temperature fluctuation of the low-temperature cooling liquid in the second liquid storage tank 200 is within a normal range, and facilitate the second liquid storage tank 200 to participate in temperature switching adjustment in subsequent working conditions.

The refrigerant circulation line 600 specifically refers to a refrigeration circuit including a compressor 650, a second plate heat exchanger 630, an expansion valve 670, a first plate heat exchanger 610, and the like. The second plate heat exchanger 630 includes a third flow path 631 and a fourth flow path 633, and the third pipe exchanges heat with the fourth pipe. And, the third flow path 631 communicates with the second flow path 613 to form a circulation flow path, and the fourth flow path 633 is used to access the process cooling system. The expansion valve 670 is provided at one end of the third flow path 631, communicates with the second flow path 613, and the compressor 650 is provided at the other end of the third flow path 631, and communicates with the first flow path 611.

The amount of cooling in the second tank 200 is mainly controlled by adjusting the opening of the expansion valve 670 to adjust the amount of cooling medium supplied to the second flow passage 613 by the evaporation heat exchange. Alternatively, the opening degree of the expansion valve 670 is controlled according to the temperature of the coolant flowing back from the load 400 and the target temperature to which it is desired to be reduced, thereby ensuring that the temperature of the coolant in the second tank 200 remains stable.

In detail, the compressor 650 compresses the cold return air in the second flow path 613 of the first plate heat exchanger 610. The compressed high-temperature high-pressure superheated refrigerant gas enters the third flow path 631 of the second plate heat exchanger 630 to exchange heat with the process cooling water system. At this time, the refrigerant gas is condensed into a medium-temperature high-pressure refrigerant liquid in the process.

Then, the medium-temperature high-pressure refrigerant liquid is throttled and depressurized by the expansion valve 670 to be low-temperature low-pressure refrigerant liquid, and then returns to the second flow path 613 to exchange heat with the cooling liquid in the first flow path 611. At this time, the temperature of the cooling liquid is reduced to a lower temperature, and enters the second liquid storage tank 200 for storage and use. The refrigerant is changed from low-temperature low-pressure liquid into low-temperature low-pressure gas.

Thereafter, the refrigerant is repeatedly circulated between the second flow path 613 and the third flow path 631 in the above process, so as to continuously cool the cooling liquid flowing through the first flow path 611, so as to further ensure that the temperature fluctuation of the low-temperature cooling liquid in the second liquid storage tank 200 is within a normal range, and facilitate the second liquid storage tank 200 to participate in temperature switching in subsequent working conditions.

In addition, it is preferable that the upper temperature limit of the first tank 100 is higher than the highest temperature required for the load 400 by 3 ℃ to avoid that the heater 700 is always in a high load state; the lower temperature limit of the second tank 200 is 3 deg.c lower than the minimum temperature required for the load 400 to avoid the compressor 650 from being in a high load state at all times.

In addition, the invention also provides a temperature control method for controlling the temperature control system 10 in any of the previous embodiments. An exemplary description of the operation method of the temperature control system 10 according to the embodiment of the present invention is given below with reference to the flowchart of the temperature control system 10 shown in fig. 1.

Specifically, referring to fig. 2, fig. 2 is a flow chart of a temperature control method according to an embodiment of the invention. When the temperature control system 10 is the structure shown in fig. 1, the temperature control method includes the following steps:

step S210, obtaining a first preset temperature required by the load 400;

step S220, calculating a first liquid outlet flow and/or temperature of the first liquid storage tank 100 and a first liquid outlet flow and/or temperature of the second liquid storage tank 200 according to the first preset temperature;

in step S230, the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank 100 and the first liquid outlet flow and/or temperature of the first liquid storage tank 100 is controlled to be smaller than the preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank 200 and the first liquid outlet flow and/or temperature of the second liquid storage tank 200 is controlled to be smaller than the preset value.

In some embodiments, when the flow is used as the reference data, the preset value is 0.6L/min. When the temperature is used as a reference value, the preset value takes a value of 0.5 ℃.

According to the temperature control method in the embodiment of the application, the liquid outlet flow rates of the first liquid storage tank 100 and the second liquid storage tank 200 are determined according to the preset temperature required by the load 400, so that the temperature of cooling liquid required by the load 400 is rapidly and accurately met, the processing period of a semiconductor is shortened, and the production efficiency of the semiconductor is improved.

Further, in some embodiments, to facilitate adjusting the actual liquid flow of the first liquid storage tank 100 or the second liquid storage tank 200, the temperature control system 10 further includes a three-way adjusting valve 300, a first inlet of the three-way adjusting valve 300 is communicated with the liquid outlet of the first liquid storage tank 100, a second inlet of the three-way adjusting valve 300 is communicated with the liquid outlet of the second liquid storage tank 200, and an outlet of the three-way adjusting valve 300 is communicated with the cooling liquid supply pipe 541.

The step of controlling the difference between the actual liquid outlet flow rate and/or temperature of the first liquid storage tank 100 and the first liquid outlet flow rate and/or temperature of the first liquid storage tank 100 to be smaller than a preset value, and the difference between the actual liquid outlet flow rate and/or temperature of the second liquid storage tank 200 and the first liquid outlet flow rate and/or temperature of the second liquid storage tank 200 to be smaller than a preset value specifically includes:

Controlling the opening of the first inlet of the three-way regulating valve 300 to control the difference between the actual liquid outlet flow of the first liquid storage tank 100 and the first liquid outlet flow of the first liquid storage tank 100 to be smaller than a preset value;

the opening degree of the second inlet of the three-way regulating valve 300 is controlled to control the difference between the actual liquid outlet flow rate of the second liquid storage tank 200 and the first liquid outlet flow rate of the second liquid storage tank 200 to be smaller than a preset value.

When the maximum flow rate through which the coolant supply pipe 541 can pass is 30L/min, the deviation range of the opening adjustment of the first inlet or the second inlet of the three-way regulator valve 300 is 2%, so that the flow rate preset value is calculated to be 0.6L/min.

In other embodiments, the temperature control system 10 further includes a first adjusting valve and a second adjusting valve, the first adjusting valve is disposed at the liquid outlet of the first liquid storage tank 100, the first adjusting valve is used for controlling the on-off of the first liquid storage tank 100 and the cooling liquid supply pipe 541, the second adjusting valve is disposed at the liquid outlet of the second liquid storage tank 200, and the second adjusting valve is used for controlling the on-off of the second liquid storage tank 200 and the cooling liquid supply pipe 541;

the step of controlling the difference between the actual liquid outlet flow rate and/or temperature of the first liquid storage tank 100 and the first liquid outlet flow rate and/or temperature of the first liquid storage tank 100 to be smaller than a preset value, and the difference between the actual liquid outlet flow rate and/or temperature of the second liquid storage tank 200 and the first liquid outlet flow rate and/or temperature of the second liquid storage tank 200 to be smaller than a preset value specifically includes:

Controlling the opening degree of the first regulating valve to control the difference value between the actual liquid outlet flow of the first liquid storage tank 100 and the first liquid outlet flow of the first liquid storage tank 100 to be smaller than a preset value;

the opening degree of the second regulating valve is controlled to control the difference between the actual liquid outlet flow of the second liquid storage tank 200 and the second liquid outlet flow of the second liquid storage tank 200 to be smaller than a preset value.

The first and second adjusting valves are similar to the three-way adjusting valve 300, and each of them adjusts the flow rate of the first or second tank 100 or 200 by adjusting the opening of the corresponding valve.

In addition to regulating the flow of first tank 100 and/or second tank 200, temperature control system 10, in some embodiments, includes a heater 700 disposed within first tank 100. The power of the heater 700 is controlled to control the difference between the actual tapping temperature in the first tank 100 and the first tapping temperature of the first tank 100 to be less than a temperature preset value.

Temperature control system 10 further includes a refrigerant circulation line 600 formed by a first plate heat exchanger 610, an expansion valve 670, a second plate heat exchanger 630, and a compressor 650. Wherein the cooling liquid flowing back to the second liquid storage tank 200 exchanges heat in the first plate heat exchanger 610, and the second plate heat exchanger 630 exchanges heat with the process cooling water system. At least one of the opening of the expansion valve 670, the flow rate and/or temperature of the process cooling water, and the power of the compressor 650 is controlled to control the difference between the actual outlet temperature in the second tank 200 and the first outlet temperature of the second tank 200 to be less than a temperature preset value.

Step S310, obtaining a second preset temperature required by the load 400, wherein the second preset temperature is higher than the first preset temperature;

in some embodiments, the load 400 requiring the second preset temperature may be another load 400 after replacement, or the same load 400 may have different requirements for the coolant temperature when executing different process flows.

Step S311, calculating a second liquid outlet flow and/or temperature of the first liquid storage tank 100, and a second liquid outlet flow and/or temperature of the second liquid storage tank 200 according to a second preset temperature;

in some embodiments, to meet the second preset temperature required by the load 400 while ensuring that the total flow in the cooling liquid supply tube 541 is constant, the second liquid outlet flow of the first liquid tank 100 is greater than the first liquid outlet flow, and the second liquid outlet flow of the second liquid tank 200 is less than the first liquid outlet flow.

In step S312, the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank 100 and the second liquid outlet flow and/or temperature of the first liquid storage tank 100 is controlled to be smaller than the preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank 200 and the second liquid outlet flow and/or temperature of the second liquid storage tank 200 is controlled to be smaller than the preset value.

In some embodiments, the high temperature coolant provided by the first tank 100 has a large ratio in the coolant supply pipe 541, and the low temperature coolant provided by the second tank 200 has a small ratio in the coolant supply pipe 541, so that the mixed solution temperature of the high temperature coolant and the low temperature coolant formed in the coolant supply pipe 541 is higher. Or, when the difference between the temperature of the high-temperature freezing liquid in the first liquid storage tank 100 and the second preset temperature is smaller than the preset value, controlling the first liquid storage tank 100 to discharge liquid, stopping discharging the liquid by the second liquid storage tank 200, and only providing the cooling liquid meeting the second preset temperature by the first liquid storage tank 100.

According to the temperature control method in the embodiment of the application, when the temperature required by the load 400 is increased, the liquid outlet flow and/or the temperature of the first liquid storage tank 100 are increased, the liquid outlet flow and/or the temperature of the second liquid storage tank 200 are reduced, and under the condition that the total flow is unchanged, the temperature of the cooling liquid required by the load 400 in different process flows is rapidly and accurately met, so that the processing period of a semiconductor is shortened, and the production efficiency of the semiconductor is improved.

Step S320, obtaining a third preset temperature required by the load 400, wherein the third preset temperature is lower than the first preset temperature;

in some embodiments, the load 400 requiring the third preset temperature may be another load 400 after replacement, or the same load 400 may have different requirements for the coolant temperature when executing different process flows.

Step S321, calculating a third liquid outlet flow and/or temperature of the first liquid storage tank 100, and a third liquid outlet flow and/or temperature of the second liquid storage tank 200 according to a third preset temperature;

in some embodiments, to meet the third preset temperature required by the load 400 while ensuring that the total flow in the coolant supply tube 541 is constant, the third liquid outlet flow of the second liquid tank 200 is greater than the first liquid outlet flow, and the third liquid outlet flow of the first liquid tank 100 is less than the first liquid outlet flow.

In step S322, the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank 100 and the third liquid outlet flow and/or temperature of the first liquid storage tank 100 is controlled to be smaller than the preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank 200 and the third liquid outlet flow and/or temperature of the second liquid storage tank 200 is controlled to be smaller than the preset value.

In some embodiments, the high temperature coolant provided by the first tank 100 has a small ratio in the coolant supply tube 541, and the low temperature coolant provided by the second tank 200 has a large ratio in the coolant supply tube 541, so that the mixed solution temperature of the high temperature coolant and the low temperature coolant formed in the coolant supply tube 541 is lower. Or, when the difference between the temperature of the low-temperature freezing liquid in the second liquid storage tank 200 and the third preset temperature is smaller than the preset value, controlling the second liquid storage tank 200 to discharge liquid, stopping discharging the liquid by the first liquid storage tank 100, and only providing the cooling liquid meeting the third preset temperature by the second liquid storage tank 200.

According to the temperature control method in the embodiment of the application, when the temperature required by the load 400 is reduced, the liquid outlet flow and/or the temperature of the second liquid storage tank 200 are increased, the liquid outlet flow and/or the temperature of the first liquid storage tank 100 are reduced, and under the condition that the total flow is unchanged, the temperature of the cooling liquid required by the load 400 in different process flows is rapidly and accurately met, so that the processing period of a semiconductor is shortened, and the production efficiency of the semiconductor is improved.

Referring to fig. 3, fig. 3 is a schematic flow chart of a temperature control method according to an embodiment of the invention. When the temperature control system 10 is the structure shown in fig. 1, the temperature control method further includes the following steps:

in step S400, the flow rate of the cooling liquid return tube 543 flowing back to the first tank 100 and/or the second tank 200 is controlled.

Specifically, in some embodiments, temperature control system 10 further includes a first branch 510, a second branch 530, a first solenoid valve 511, and a second solenoid valve 531, wherein a cooling liquid return tube 543 communicates with a liquid inlet of first liquid storage tank 100 through first branch 510, and cooling liquid return tube 543 communicates with a liquid inlet of second liquid storage tank 200 through second branch 530; the first electromagnetic valve 511 is disposed on the first branch 510, and the second electromagnetic valve 531 is disposed on the second branch 530.

The liquid return temperature is obtained, a first difference value between the liquid return temperature and the cooling liquid temperature in the first liquid storage tank 100 is calculated according to the liquid return temperature, a second difference value between the liquid return temperature and the cooling liquid temperature in the second liquid storage tank 200 is calculated, and the first difference value and the second difference value are compared.

Here, the temperature of the liquid return refers to the temperature of the cooling liquid flowing through the load 400 and then flowing back to the first liquid storage tank 100 and/or the second liquid storage tank 200.

If the first difference is smaller than the second difference, the opening of the first solenoid valve 511 is controlled to be larger than the opening of the second solenoid valve 531, so that a large amount of coolant flows back to the first tank 100 from the coolant return pipe 543 and a small amount of coolant flows back to the second tank 200 from the coolant return pipe 543. Alternatively, the first electromagnetic valve 511 is opened, and the second electromagnetic valve 531 is closed, so that the coolant flows back to the first tank 100 only from the coolant return pipe 543.

If the first difference is greater than the second difference, the opening of the second solenoid valve 531 is controlled to be greater than the opening of the first solenoid valve 511, so that a large amount of coolant flows back to the second tank 200 from the coolant return pipe 543 and a small amount of coolant flows back to the first tank 100 from the coolant return pipe 543. Alternatively, the first electromagnetic valve 511 is closed, and the second electromagnetic valve 531 is opened so that the coolant flows back to the second tank 200 only from the coolant return pipe 543.

It can be appreciated that by comparing and judging the first difference value and the second difference value, the liquid storage tank closest to the temperature of the backflow cooling liquid is determined, so that the electromagnetic valve is controlled to be opened and closed, so that the cooling liquid flows back to the first liquid storage tank 100 or the second liquid storage tank 200 closest to the liquid storage tank, and the temperature fluctuation of the liquid storage tank caused by overlarge temperature difference between the backflow cooling liquid and the liquid storage tank is prevented from influencing the subsequent temperature control adjustment.

In other embodiments, the temperature control system 10 further includes a first branch 510 and a second branch 530, the cooling liquid return tube 543 is connected to the liquid inlet of the first liquid storage tank 100 through the first branch 510, and the cooling liquid return tube 543 is connected to the liquid inlet of the second liquid storage tank 200 through the second branch 530; the coolant liquid return tube 543 is provided with a three-way valve, and two outlets of the three-way valve are respectively communicated with the first branch 510 and the second branch 530. In this embodiment, the difference between the first preset temperature and the first liquid storage tank 100/the second liquid storage tank 200 is still calculated, so that the different outlets of the three-way valve are controlled to control the liquid return of the cooling liquid, which is not described herein.

In summary, the present application provides a temperature control system 10 and a temperature control method, wherein the temperature control system 10 includes a first tank 100, a second tank 200, and a cooling fluid circulation line 500. The cooling liquid circulation pipeline 500 includes a cooling liquid return pipe 543 and a cooling liquid supply pipe 541, which are connected, the temperature of the first liquid storage tank 100 is higher than that of the second liquid storage tank 200, and the liquid outlet of the first liquid storage tank 100 and the liquid outlet of the second liquid storage tank 200 are merged into the cooling liquid supply pipe 541. Compared with the temperature switching mode that the whole temperature in the water tank is increased or reduced by the existing temperature control system 10, the method for converging the high-temperature cooling liquid and the low-temperature cooling liquid in the cooling liquid supply pipe 541 can quickly and accurately modulate the temperature of the cooling liquid required by the load 400. Therefore, the temperature control device shortens the processing period of the semiconductor and improves the production efficiency of the semiconductor.

The present invention is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims (10)

1. A temperature control system is characterized by comprising a first liquid storage tank (100), a second liquid storage tank (200) and a cooling liquid circulation pipeline (500);

the cooling liquid circulation pipeline (500) comprises a cooling liquid return pipe (543) and a cooling liquid supply pipe (541) which are communicated, the temperature of the first liquid storage tank (100) is higher than that of the second liquid storage tank (200), and the liquid outlet of the first liquid storage tank (100) and the liquid outlet of the second liquid storage tank (200) are converged to the cooling liquid supply pipe (541).

2. Temperature control system according to claim 1, characterized in that the outlet of the cooling liquid return pipe (543) communicates with the inlet of the first tank (100) and/or the inlet of the second tank (200).

3. The temperature control system according to claim 1, characterized in that the temperature control system (10) further comprises a first plate heat exchanger (610), the first plate heat exchanger (610) comprises a first flow path (611) and a second flow path (613), and the first flow path (611) is in heat exchange with the second flow path (613), and the first flow path (611) is connected to the cooling liquid circulation line (500), and the outlet of the first flow path (611) is connected to the liquid inlet of the second liquid storage tank (200), and the second flow path (613) is connected to the cooling liquid circulation line (600).

4. A temperature control system according to any one of claims 1-3, wherein the temperature control system (10) further comprises a first branch (510) and a second branch (530), the cooling liquid return pipe (543) is communicated with the liquid inlet of the first liquid storage tank (100) through the first branch (510), and the cooling liquid return pipe (543) is communicated with the liquid inlet of the second liquid storage tank (200) through the second branch (530); the cooling liquid return pipe (543) is provided with a three-way valve, and two outlets of the three-way valve are respectively communicated with the first branch (510) and the second branch (530);

or, the temperature control system (10) further comprises the first branch (510), the second branch (530), a first electromagnetic valve (511) and a second electromagnetic valve (531), the cooling liquid return pipe (543) is communicated with the liquid inlet of the first liquid storage tank (100) through the first branch (510), and the cooling liquid return pipe (543) is communicated with the liquid inlet of the second liquid storage tank (200) through the second branch (530); the first electromagnetic valve (511) is arranged on the first branch (510), and the second electromagnetic valve (531) is arranged on the second branch (530).

5. A temperature control system according to any one of claims 1-3, wherein the temperature control system (10) further comprises a first regulating valve and a second regulating valve, the first regulating valve is arranged at a liquid outlet of the first liquid storage tank (100), the first regulating valve is used for controlling the on-off of the first liquid storage tank (100) and the cooling liquid supply pipe (541), the second regulating valve is arranged at a liquid outlet of the second liquid storage tank (200), and the second regulating valve is used for controlling the on-off of the second liquid storage tank (200) and the cooling liquid supply pipe (541);

Or, the temperature control system (10) further comprises a three-way regulating valve (300), a first inlet of the three-way regulating valve (300) is communicated with a liquid outlet of the first liquid storage tank (100), a second inlet of the three-way regulating valve (300) is communicated with a liquid outlet of the second liquid storage tank (200), and an outlet of the three-way regulating valve (300) is communicated with the cooling liquid supply pipe (541).

6. A temperature control method for controlling the temperature control system according to any one of claims 1 to 4, comprising:

acquiring a first preset temperature required by the load (400);

calculating a first liquid outlet flow and/or temperature of the first liquid storage tank (100) and a first liquid outlet flow and/or temperature of the second liquid storage tank (200) according to the first preset temperature;

the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the first liquid outlet flow and/or temperature of the first liquid storage tank (100) is controlled to be smaller than a preset value, and the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank (200) and the first liquid outlet flow and/or temperature of the second liquid storage tank (200) is controlled to be smaller than the preset value.

7. The method of claim 6, wherein,

after the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the first liquid outlet flow and/or temperature of the first liquid storage tank (100) to be smaller than a preset value, the temperature control method further comprises one of the following features:

(1) Acquiring a second preset temperature required by a load (400), wherein the second preset temperature is higher than the first preset temperature;

calculating a second liquid outlet flow and/or temperature of the first liquid storage tank (100) and a second liquid outlet flow and/or temperature of the second liquid storage tank (200) according to the second preset temperature;

controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the second liquid outlet flow and/or temperature of the first liquid storage tank (100) to be smaller than a preset value, and controlling the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank (200) and the second liquid outlet flow and/or temperature of the second liquid storage tank (200) to be smaller than the preset value;

(2) Acquiring a third preset temperature required by a load (400), wherein the third preset temperature is lower than the first preset temperature;

calculating a third liquid outlet flow and/or temperature of the first liquid storage tank (100) and a third liquid outlet flow and/or temperature of the second liquid storage tank (200) according to the third preset temperature;

the difference value between the actual liquid outlet flow rate and/or temperature of the first liquid storage tank (100) and the third liquid outlet flow rate and/or temperature of the first liquid storage tank (100) is controlled to be smaller than a preset value, and the difference value between the actual liquid outlet flow rate and/or temperature of the second liquid storage tank (200) and the third liquid outlet flow rate and/or temperature of the second liquid storage tank (200) is controlled to be smaller than the preset value.

8. The method of claim 6, wherein,

after the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the first liquid outlet flow and/or temperature of the first liquid storage tank (100) to be smaller than a preset value, the temperature control method further comprises:

controlling the flow rate of the cooling liquid return pipe (543) flowing back to the first liquid storage tank (100) and/or the second liquid storage tank (200).

9. The temperature control method according to claim 6, wherein the temperature control system (10) further comprises a three-way regulating valve (300), a first inlet of the three-way regulating valve (300) being in communication with a liquid outlet of the first liquid reservoir (100), a second inlet of the three-way regulating valve (300) being in communication with a liquid outlet of the second liquid reservoir (200), an outlet of the three-way regulating valve (300) being in communication with the cooling liquid supply pipe (541);

the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the first liquid outlet flow and/or temperature of the first liquid storage tank (100) to be smaller than a preset value, and the step of controlling the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank (200) and the first liquid outlet flow and/or temperature of the second liquid storage tank (200) to be smaller than a preset value specifically comprises the following steps:

Controlling the opening degree of the first inlet of the three-way regulating valve (300) to control the difference value between the actual liquid outlet flow of the first liquid storage tank (100) and the first liquid outlet flow of the first liquid storage tank (100) to be smaller than a preset value;

and controlling the opening degree of the second inlet of the three-way regulating valve (300) so as to control the difference value between the actual liquid outlet flow of the second liquid storage tank (200) and the first liquid outlet flow of the second liquid storage tank (200) to be smaller than a preset value.

10. The temperature control method according to claim 6, wherein the temperature control system (10) further comprises a first regulating valve and a second regulating valve, the first regulating valve is disposed at a liquid outlet of the first liquid storage tank (100), the first regulating valve is used for controlling on-off of the first liquid storage tank (100) and the cooling liquid supply pipe (541), the second regulating valve is disposed at a liquid outlet of the second liquid storage tank (200), and the second regulating valve is used for controlling on-off of the second liquid storage tank (200) and the cooling liquid supply pipe (541);

the step of controlling the difference between the actual liquid outlet flow and/or temperature of the first liquid storage tank (100) and the first liquid outlet flow and/or temperature of the first liquid storage tank (100) to be smaller than a preset value, and the step of controlling the difference between the actual liquid outlet flow and/or temperature of the second liquid storage tank (200) and the first liquid outlet flow and/or temperature of the second liquid storage tank (200) to be smaller than a preset value specifically comprises the following steps:

Controlling the opening degree of the first regulating valve to control the difference value between the actual liquid outlet flow of the first liquid storage tank (100) and the first liquid outlet flow of the first liquid storage tank (100) to be smaller than a preset value;

and controlling the opening degree of the second regulating valve to control the difference value between the actual liquid outlet flow of the second liquid storage tank (200) and the second liquid outlet flow of the second liquid storage tank (200) to be smaller than a preset value.