CN117806429B - Memory test server architecture - Google Patents
Memory test server architecture Download PDFInfo
- Publication number
- CN117806429B CN117806429B CN202410220312.7A CN202410220312A CN117806429B CN 117806429 B CN117806429 B CN 117806429B CN 202410220312 A CN202410220312 A CN 202410220312A CN 117806429 B CN117806429 B CN 117806429B
- Authority
- CN
- China
- Prior art keywords
- test
- temperature
- memory
- server
- tested
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 272
- 230000015654 memory Effects 0.000 title claims abstract description 93
- 230000001276 controlling effect Effects 0.000 claims abstract description 9
- 230000001105 regulatory effect Effects 0.000 claims abstract description 8
- 238000009423 ventilation Methods 0.000 claims description 8
- 230000007613 environmental effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000013441 quality evaluation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Quality & Reliability (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Test And Diagnosis Of Digital Computers (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a memory test server architecture, which relates to the technical field of servers and aims to solve the problem of improving the reliability of test results, and comprises a test host, a main board environment module and a temperature environment module; the main board environment module comprises a server main board, and a memory slot for being in plug-in fit with the memory card to be tested is arranged on the server main board; the temperature environment module comprises a test temperature cavity and a temperature regulator, wherein the test temperature cavity is used for forming a closed test space for a memory card to be tested which is arranged on the memory slot, and the temperature regulator is used for regulating the test temperature of the test temperature cavity; the test host is in signal connection with the server main board and the temperature regulator, and is used for controlling the working state of the temperature regulator according to a preset test program and testing the memory card to be tested through the server main board. The invention can ensure that the testing environment is close to the actual running server environment as much as possible on the basis of realizing the quality test of the memory, and improves the reliability of the testing result.
Description
Technical Field
The present invention relates to the field of server technologies, and in particular, to a memory test server architecture.
Background
The memory is one of important components of the server, and with the continuous iterative promotion of the memory body specification, the memory naturally brings higher data anomaly rate and higher fault risk due to the influence of the working principle of the memory. For example, when the capacity of the memory is greatly increased, the stacking density of the internal storage particles is greatly increased, the amount of charge stored in a single cell (memory cell) is reduced, the probability of bit flipping is increased, and the probability of failure in the operation process is increased. Meanwhile, the working voltage of the memory is gradually reduced and the working frequency is gradually increased, so that the performance of the memory is enhanced and the energy consumption is reduced, but after the working voltage is reduced, the failure rate is correspondingly increased, the leakage time of the memory is reduced, and the stability of charge retention is reduced; after the working frequency of the memory is increased, the fault rate is obviously increased, and the anti-interference capability of the high-frequency data line signal is weakened.
At present, in the related art, a memory detection device is mainly used for performing quality test on a memory, and the commonly used memory detection device is generally a device specific to a third party manufacturer or a device customized by the memory manufacturer, and then the detection device performs a test flow by using a memory card inserted into a customized test main board, however, the difference between the customized test main board of the third party manufacturer or the memory manufacturer and a server main board produced by a server system manufacturer is large, such as arrangement of electronic components, and other components except for a central processing unit and a memory slot of a core may be different, so that the main board environment where the memory is located in during test is inconsistent with the main board environment where the memory is actually operated on the server, further, the test result is greatly different, the quality judgment standard is not uniform, and the reliability of the test result is in doubt. Meanwhile, the memory actually operated in the server is usually in a higher temperature environment, so that the memory test result is greatly influenced by temperature, but the temperature influence is not considered when the memory is tested through a custom test main board in the related technology, and the temperature environment close to the actual operation environment cannot be simulated due to the difference between the custom test main board and the server main board, so that the reliability of the test result is further reduced.
Therefore, how to ensure that the testing environment is close to the actual running server environment as much as possible on the basis of realizing the quality test of the memory, and improving the reliability of the testing result is a technical problem faced by the person skilled in the art.
Disclosure of Invention
The invention aims to provide a memory test server architecture which can ensure that a test environment is close to an actually operated server environment as much as possible on the basis of realizing quality test of a memory and improve the reliability of a test result.
In order to solve the technical problems, the invention provides a memory test server architecture, which comprises a test host, a main board environment module and a temperature environment module;
The main board environment module comprises a server main board, wherein a memory slot for being in plug-in fit with a memory card to be tested is arranged on the server main board;
The temperature environment module comprises a test temperature cavity and a temperature regulator, wherein the test temperature cavity is used for forming a closed test space for a memory card to be tested which is arranged on the memory slot, and the temperature regulator is used for regulating the test temperature of the test temperature cavity;
The test host is in signal connection with the server main board and the temperature regulator, and is used for controlling the working state of the temperature regulator according to a preset test program and testing the memory card to be tested through the server main board.
On the other hand, the main board environment module further comprises a containing box body, and the server main board is arranged in the containing box body; the side face of the accommodating box body facing the memory slot is hollowed out.
On the other hand, the temperature environment module further comprises a connecting bottom plate, wherein the connecting bottom plate is used for being connected with the accommodating box body so as to cover the hollowed-out side surface of the accommodating box body; the test temperature chamber and the temperature regulator are both arranged on the connecting bottom plate.
On the other hand, the connecting bottom plate and the accommodating box body form detachable connection so as to detach and replace different mainboard environment modules and form different mainboard environments for the memory card to be tested.
On the other hand, the lateral wall of holding the box is protruding to be equipped with the joint post, the joint groove has been seted up to the lateral wall bottom of connecting the bottom plate, the joint groove be used for with the joint post forms joint cooperation.
On the other hand, the clamping groove is a triangular groove, the groove width of the triangular groove is gradually reduced from the bottom to the top of the triangular groove, and the triangular groove is used for forming vertical clamping fit with the clamping column.
On the other hand, the test temperature cavity is a groove formed in the connecting bottom plate, the groove is used for accommodating the memory slot and the memory card to be tested on the server main board, and the wall of the groove extends downwards to form butt joint with the surface of the server main board.
On the other hand, the temperature environment module further comprises a fan arranged on the connecting bottom plate, and the fan is used for generating air flow to the temperature regulator so that the air flow enters the test temperature cavity after being heated or cooled by the temperature regulator.
On the other hand, the temperature environment module further comprises a bottom cover, the bottom cover is connected to the front end of the connecting bottom plate, the temperature regulator and the fan are arranged on the bottom cover, and the fan, the temperature regulator and the temperature testing cavity are collinear.
On the other hand, the temperature environment module further comprises a top cover, wherein the top cover is buckled at the top of the bottom cover and is used for forming a closed space for the temperature regulator and the fan.
On the other hand, the temperature environment module further comprises an air guide top cover, wherein the air guide top cover is detachably connected to the connecting bottom plate and covers the test temperature cavity;
The front end of the wind-guiding top cover, which faces the fan, is provided with a guiding slope extending downwards in an inclined mode, and the guiding slope is used for guiding the air flow passing through the temperature regulator into the testing temperature cavity.
On the other hand, the end face of the rear end of the wind-guiding top cover, which is far away from the fan, is provided with a plurality of ventilation holes, and the distribution position of each ventilation hole is opposite to the diversion slope.
On the other hand, the test host is in signal connection with a management interface on the server main board through a network cable, the management interface is in signal connection with a baseboard management controller on the server main board, and the baseboard management controller is used for sending environment test parameters of the test host to the temperature environment module.
On the other hand, the temperature environment module further comprises a temperature sensor and a temperature controller;
the temperature sensor is in signal connection with the temperature controller and is used for detecting the temperature in the test temperature cavity;
the temperature controller is in signal connection with the baseboard management controller, the temperature regulator and the fan, and is used for controlling the working states of the temperature regulator and the fan according to the environment test parameters of the test host.
On the other hand, the device also comprises a plurality of indicator lamps arranged on the connecting bottom plate;
And each indicator light is in signal connection with the temperature controller so as to respectively indicate the test result of each corresponding memory card to be tested according to the test result fed back by the test host.
The invention provides a memory test server architecture, which mainly comprises a test host, a main board environment module and a temperature environment module. The main board environment module is mainly used for forming a real main board test environment for the memory card to be tested, and mainly comprises a server main board, wherein a memory slot is arranged on the server main board and is used for forming plug-in fit with the memory card to be tested so that the memory card to be tested and the server main board form signal connection, and the memory card to be tested is tested through the server main board. Of course, a conventional server component such as a central processing unit is further disposed on the server motherboard, so as to form a motherboard environment in which the server actually operates. The temperature environment module is mainly used for simulating the temperature environment of the memory card to be tested when the memory card is operated in the server, and mainly comprises a test temperature cavity and a temperature regulator. The test temperature cavity is connected with the server main board and is mainly used for forming a closed test space for the memory card to be tested which is arranged on the memory slot of the server main board so as to be matched with the temperature regulator, so that the temperature environment in the closed test space is maintained in the temperature environment when the server actually operates as much as possible. The temperature regulator is connected with the server main board and is mainly used for regulating the test temperature of the test temperature cavity so as to enable the temperature in the test temperature cavity to reach the target temperature and maintain the temperature in the test temperature cavity constant for a long time in the test process. The test host is in signal connection with the server main board and the temperature regulator, and is mainly used for controlling the working state of the temperature regulator according to a preset test program after the memory card to be tested is in plug-in fit with the memory slot on the server main board, so that the temperature regulator starts to regulate the temperature in the test temperature cavity until the target temperature is reached, and then the test host tests the memory card to be tested through the server main board according to the preset test program until the quality test of the memory card to be tested is completed; after the test is finished, the server main board feeds test result data back to the test host.
The invention has the beneficial effects that: and forming a main board test environment which is the same as the main board environment in the actual running process of the server by a main board of the server in the main board environment module, forming a closed test space by the memory card to be tested by a test temperature cavity in the temperature environment module, regulating and maintaining the temperature in the closed test space to a target test temperature by a temperature regulator in the temperature environment module, and finally completing the test operation of the memory card to be tested on the main board of the server by a test host. During the period, the memory card to be tested is directly tested on the server main board, and the server main board is a main board component actually configured in the server, so that the main board testing environment of the memory card to be tested is the same as the environment of the memory card in the server in operation, and the reliability and the accuracy of the testing result are higher; and before testing, the memory card to be tested is placed in the closed test space through the test temperature cavity, the temperature of the closed test space is regulated to the target test temperature through the temperature regulator, and the test temperature of the test temperature cavity is maintained through the temperature regulator in the test process, so that the temperature environment of the memory card in the operation process of the server is simulated, and the reliability of the test result is further improved.
In summary, the memory test server architecture provided by the invention can ensure that the test environment is close to the actually operated server environment as much as possible on the basis of realizing the quality test of the memory, and improve the reliability of the test result.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic overall structure of an embodiment of the present invention.
Fig. 2 is an exploded view of the structure of fig. 1.
Fig. 3 is an exploded view of a partial structure from another perspective of fig. 1.
Fig. 4 is a schematic diagram of a specific structure of the temperature environment module.
Fig. 5 is a schematic diagram of signal connection among a test host, a motherboard environment module, and a temperature environment module.
Wherein, in fig. 1-5:
A test host machine-1, a main board environment module-2, a temperature environment module-3 and an indicator lamp-4;
the server comprises a server main board-21, a containing box body-22, a clamping column-23, a management interface-24 and a substrate management controller-25;
the device comprises a test temperature chamber-31, a temperature regulator-32, a connecting bottom plate-33, a clamping groove-34, a fan-35, a bottom cover-36, a top cover-37, an air guide top cover-38, a vent hole-39, a temperature sensor-310 and a temperature controller-311;
Diversion ramp-381.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 2 and fig. 5, fig. 1 is a schematic diagram of an overall structure of an embodiment of the present invention, fig. 2 is an exploded view of the structure of fig. 1, and fig. 5 is a schematic diagram of signal connection of a test host 1, a motherboard environment module 2 and a temperature environment module 3.
In one embodiment of the present invention, the memory test server architecture mainly includes a test host 1, a motherboard environment module 2, and a temperature environment module 3.
The motherboard environment module 2 is mainly used for forming a real motherboard test environment for a memory card to be tested, the motherboard environment module 2 mainly comprises a server motherboard 21, a memory slot is arranged on the server motherboard 21, and the memory slot is used for forming plug-in fit with the memory card to be tested, so that the memory card to be tested and the server motherboard 21 form signal connection, and the memory card to be tested is tested through the server motherboard 21. Of course, a conventional server component such as a central processing unit is also disposed on the server motherboard 21 to form a motherboard environment in which the server actually operates.
The temperature environment module 3 is mainly used for simulating the temperature environment of the memory card to be tested when the memory card is operated in the server, and mainly comprises a test temperature cavity 31 and a temperature regulator 32. The test temperature chamber 31 is connected to the server motherboard 21, and is mainly used for forming a sealed test space for a memory card to be tested installed on a memory slot of the server motherboard 21, so as to cooperate with the thermostat 32, so that the temperature environment in the sealed test space is maintained in the temperature environment when the server actually operates as much as possible.
The thermostat 32 is connected to the server motherboard 21, and is mainly used for adjusting the test temperature of the test temperature chamber 31, so that the temperature in the test temperature chamber 31 reaches the target temperature, and the temperature in the test temperature chamber 31 is maintained constant for a long time in the test process. The test host 1 is in signal connection with the server main board 21 and the temperature regulator 32, and is mainly used for controlling the working state of the temperature regulator 32 according to a preset test program after the memory card to be tested is in plug-in fit with the memory slot on the server main board 21, so that the temperature regulator 32 starts to regulate the temperature in the test temperature cavity 31 until the target temperature is reached, and the test host 1 tests the memory card to be tested through the server main board 21 according to the preset test program until the quality test of the memory card to be tested is completed; after the test is finished, the server motherboard 21 feeds back the test result data to the test host 1.
In this way, in the memory test server architecture provided in this embodiment, the server motherboard 21 in the motherboard environment module 2 forms a motherboard test environment identical to the motherboard environment in the actual running process of the server, and forms a sealed test space for the memory card to be tested through the test temperature chamber 31 in the temperature environment module 3, and simultaneously adjusts and maintains the temperature in the sealed test space to the target test temperature through the thermostat 32 in the temperature environment module 3, and finally completes the test operation for the memory card to be tested on the server motherboard 21 through the test host 1. During the period, the memory card to be tested is directly tested on the server main board 21, and the server main board 21 is a main board component actually configured in the server, so that the main board testing environment of the memory card to be tested is the same as the environment of the memory card in the server in operation, and the reliability and the accuracy of the testing result are higher; meanwhile, before testing, the memory card to be tested is placed in the closed test space through the test temperature chamber 31, the temperature of the closed test space is regulated to the target test temperature through the temperature regulator 32, and the test temperature of the test temperature chamber 31 is maintained through the temperature regulator 32 in the test process, so that the temperature environment of the memory card in the running process of the server is simulated, and the reliability of the test result is further improved.
In summary, the memory test server architecture provided in this embodiment can ensure that the test environment is close to the actually running server environment as much as possible on the basis of implementing quality test on the memory, and improve the reliability of the test result. In addition, the system quality evaluation can be carried out on the memory in advance, effective detection measures are adopted in advance, the memory with poor quality is screened out, quality classification is carried out, and the field memory failure rate is reduced.
As shown in fig. 2, fig. 2 is an exploded view of the structure of fig. 1.
In a specific embodiment of the motherboard environment module 2, in order to facilitate the installation of the server motherboard 21 and the connection with the temperature environment module 3, a housing box 22 is added in this embodiment. Specifically, the accommodating case 22 may be a partial structure of the server chassis, and the server motherboard 21 is installed in the accommodating case 22, so that protection and stable installation of the server motherboard 21 are formed through the accommodating case 22. Generally, the housing case 22 may be a partial structure of a 1U server chassis, as desired. Meanwhile, in order to facilitate the connection with the temperature environment module 3 and the plugging and matching between the memory card to be tested and the memory slot on the server motherboard 21, in this embodiment, the side face of the accommodating box 22 facing the memory slot is hollowed out, for example, the server motherboard 21 is mounted on the bottom plate of the accommodating box 22, and the side face facing the memory slot is the top surface of the accommodating box 22, so that the top surface of the accommodating box 22 is hollowed out, even the top surface can be completely omitted, and only the bottom plate and the side plates are reserved.
In order to facilitate the connection between the server motherboard 21 and the test temperature chamber 31 and the thermostat 32, in this embodiment, the temperature environment module 3 further includes a connection base 33. Specifically, the connection bottom plate 33 is plate-shaped, and is mainly used for being connected with the accommodating box body 22, and is specifically connected to the hollow side surface of the accommodating box body 22, so that on the basis of realizing connection with the accommodating box body 22, the hollow side surface of the accommodating box body 22 is covered and sealed, and the accommodating box body 22 forms an integral type closed structure. For example, the connection bottom plate 33 is attached to the top surface of the housing case 22 instead of the top plate of the housing case 22. Accordingly, the test temperature chamber 31 and the thermostat 32 are provided on the connection base plate 33 to be indirectly connected to the server main board 21 through the connection base plate 33.
In a specific embodiment of the connection bottom plate 33, the connection bottom plate 33 may further be provided with an air duct structure (to avoid the memory slot position) on the bottom surface, so as to be used as an air guiding cover structure of the server motherboard 21, the server motherboard 21 can normally dissipate heat through cold air in the testing process, and since the air duct structure avoids the memory slot position, and the memory card to be tested is enclosed by the testing temperature chamber 31, the cold air flow in the server motherboard 21 does not affect the memory card to be tested in the testing temperature chamber 31, and the cold and hot environments are isolated from each other.
In view of the variety of server types, the mother boards used in different servers may be different (but the layout of the cpu and the memory slots is generally the same), so that the mother board environments corresponding to the memories in different servers are also different. To this end, in order to make the temperature environment module 3 be able to adapt to different motherboard environment modules 2, in this embodiment, the connection bottom plate 33 is specifically connected with the accommodating box 22 in a detachable manner, so as to conveniently realize decoupling and disassembly between the motherboard environment module 2 and the temperature environment module 3, and further disassemble and replace different motherboard environment modules 2, so that different motherboard test environments are formed for the memory card to be tested, so that the memory card to be tested can be tested in different motherboard test environments respectively, and the test result obtained in this way can reflect the quality of the memory card to be tested more comprehensively and truly. Meanwhile, as the connection bottom plate 33 and the accommodating box body 22 form detachable connection, the compatibility of memory test can be improved, and the multiplexing rate of the temperature environment module 3 is improved, namely, no matter what type of server main board 21 is faced, the temperature environment module 3 can be smoothly put into use, so that the test cost is reduced, and the problem that the temperature environment module 3 needs to be replaced when a new server main board 21 is tested is avoided.
Specifically, in this embodiment, in order to realize detachable connection between the connection bottom plate 33 and the accommodating box 22, the side wall of the accommodating box 22 is provided with a clamping post 23 in a protruding manner, and meanwhile, a clamping groove 34 is provided at the bottom of the side wall of the connection bottom plate 33, so that a clamping fit is formed between the clamping groove 34 and the clamping post 23, and thus, the clamping connection between the connection bottom plate 33 and the accommodating box 22 is realized. When the connecting bottom plate 33 is required to be disconnected from the current accommodating box body 22, the clamping groove 34 is only required to be pulled out from the clamping column 23, so that the connecting bottom plate 33 and the current accommodating box body are disconnected; on the contrary, when the connection bottom plate 33 is required to be connected with the current accommodating box 22, the clamping groove 34 is only required to be clamped into the clamping column 23, so that the operation is convenient and quick.
Of course, the connection bottom plate 33 and the accommodating case 22 may be detachably connected by bolts, rivets, i-nails, or other fasteners.
Further, considering that the server motherboard 21 is generally mounted on the bottom plate of the accommodating box 22, and the connecting bottom plate 33 is connected to the top surface of the accommodating box 22, in order to facilitate the snap fit between the snap posts 23 and the snap grooves 34, in this embodiment, the snap grooves 34 are triangular grooves. Specifically, the triangular groove is in an acute triangle shape, the groove width of the triangular groove gradually decreases from the bottom to the top of the triangular groove to form an upward sharp corner shape, and the triangular groove is mainly used for downward forming clamping fit with the clamping column 23 on the accommodating box body 22 along the vertical direction so as to clamp and fix the clamping column 23 by using the tapered groove wall of the triangular groove and compress the clamping column 23 by using the gravity of the temperature environment module 3. When the accommodating box 22 and the connecting bottom plate 33 are disassembled, the connecting bottom plate 33 is lifted upwards directly, and the triangular groove is naturally separated from the clamping column 23.
As shown in fig. 3, fig. 3 is an exploded view of a partial structure from another perspective of fig. 1.
In one embodiment of the test temperature chamber 31, in order to facilitate the accommodating of the memory slot and the memory card to be tested and the plugging operation of the memory card to be tested on the memory slot, in this embodiment, the test temperature chamber 31 is specifically a groove formed on the connection bottom plate 33, so as to accommodate the memory slot on the server motherboard 21 and the memory card to be tested plugged into the memory slot through the groove. Meanwhile, to ensure the tightness of the test temperature chamber 31, the wall of the groove extends downward by a preset height in the vertical direction until the groove is in contact with the surface of the server motherboard 21, specifically in contact with the peripheral area of the memory slot on the surface of the server motherboard 21, so as to form an annular enclosure for the memory slot and the memory card to be tested, isolate the memory slot and the memory card to be tested from other components on the server motherboard 21, and avoid the mutual influence of cold and hot environments. Generally, the test temperature chamber 31 is a rectangular recess to adapt to the shape of the memory slot and the memory card to be tested. In addition, one rectangular groove can usually accommodate a plurality of memory slots and a plurality of memory cards to be tested at the same time, so that each memory card to be tested can be tested at the same time, and the testing efficiency is improved. Of course, the test temperature chamber 31 is not limited to a rectangular groove structure, such as a circular groove, so long as it can form a complete annular enclosure for the memory slot and the memory card to be tested.
As shown in fig. 4, fig. 4 is a schematic diagram of a specific structure of the temperature environment module 3.
Further, in order to facilitate the temperature regulation and maintenance in the test temperature chamber 31 by the thermostat 32, a fan 35 is further added in the temperature environment module 3 in this embodiment. Specifically, the fan 35 is disposed on the connection base 33, specifically at a front end (based on the front end of the server motherboard 21) of the top surface of the connection base 33, and correspondingly, the thermostat 32 is also disposed on the top surface of the connection base 33, but at a rear end of the fan 35. When the fan 35 is operated, air flow is formed above the connection base plate 33 by means of forced convection and is blown to the rear end of the connection base plate 33, and since the temperature regulator 32 is opposite to the fan 35 and is located at the rear end of the fan 35, the air flow generated by the fan 35 will firstly pass through the temperature regulator 32, heat exchange is performed at the temperature regulator 32, heating or cooling of the air flow is achieved, and then the air flow temperature is regulated, and the air flow after temperature regulation finally enters the test temperature chamber 31 to heat or cool the test temperature chamber 31, so that temperature regulation in the test temperature chamber 31 is achieved until the target test temperature is reached.
Further, considering that the fan 35 and the thermostat 32 are disposed on the top surface of the connection base plate 33, and the test temperature chamber 31 is in a groove structure and is recessed in the top surface of the connection base plate 33, this may cause that the air flow generated by the fan 35 after passing through the thermostat 32 is difficult to smoothly enter into the test temperature chamber 31, and further cause problems of slow temperature rise of the test temperature chamber 31. In this regard, in a specific embodiment, the fan 35 is not mounted horizontally on the top surface of the connection base plate 33, but is mounted obliquely on the top surface of the connection base plate 33 by means of a support column or the like, so that the air flow generated by the fan 35 does not flow horizontally along the top surface of the connection base plate 33, but flows obliquely downward and directly toward the test temperature chamber 31, and of course passes through the thermostat 32, so that the air flow can flow obliquely downward smoothly and enter the test temperature chamber 31 after passing through the thermostat 32.
In another embodiment, the fan 35 is maintained in a horizontally mounted position on the top surface of the connection base 33, while the air guiding dome 38 is added in a temperature environment. Specifically, the air guiding top cover 38 is essentially an air guiding cover, and has the same function as an air guiding cover in a server, except that the air guiding top cover 38 forms a detachable connection with the connection base plate 33, and covers and seals the upper side of the test temperature chamber 31 on the connection base plate 33 after being connected with the connection base plate 33, so that the test temperature chamber 31 forms a complete closed test space. The air guiding top cover 38 and the connection bottom plate 33 form detachable connection, so that the memory card to be tested can be conveniently inserted into the test temperature chamber 31 before the test, or after the test is finished, the air guiding top cover 38 is detached from the connection bottom plate 33, and then the memory card to be tested is pulled out from the memory slot, so that the interference is avoided to influence the normal plugging and unplugging action of the memory card to be tested. Importantly, a guiding slope 381 is provided at the front end of the air guiding top cover 38 facing the fan 35, the guiding slope 381 extends downward for a preset length, the inclination angle is generally between 30 ° and 45 °, and the guiding slope 381 faces the fan 35, so that the air flow generated by the fan 35 can smoothly flow onto the guiding slope 381 after passing through the temperature regulator 32, and the bottom end of the guiding slope 381 extends to the upper side of the testing temperature chamber 31, for example, can form an abutting connection with the top end of the memory card to be tested in the testing temperature chamber 31, so that the air flow passing through the temperature regulator 32 flows downward along the guiding slope 381 until reaching the testing temperature chamber 31, thereby realizing the guiding function on the air flow. The fan 35 and the thermostat 32 are arranged in a normal installation posture on the top surface of the connecting bottom plate 33, the installation posture is not required to be adjusted, and when the fan 35 generates air flow, the air flow firstly passes through the thermostat 32 and then flows to the inclined slope, finally flows down along the inclined surface of the guiding slope, enters the testing temperature cavity 31 at the bottom, and smoothly heats or cools the testing temperature cavity 31 through the action of the guiding slope 381 on the air guiding top cover 38.
In view of the above, in order to ensure the temperature adjustment efficiency of the test temperature chamber 31, in this embodiment, the bottom of the guiding slope 381 of the guiding cover 38 extends to the upper position of the test temperature chamber 31, and maintains a certain distance from the top surface of the test temperature chamber 31, and of course also maintains a certain distance from the top surface of the memory card to be tested that is installed in place, and secondly, the rear end surface of the guiding cover 38, which is far away from the fan 35, is provided with a plurality of ventilation holes 39, so that after the air flow enters the test temperature chamber 31, part of the air flow after heat exchange can flow over the test temperature chamber 31, and flows out through each ventilation hole 39, so as to realize the normal flow of the air flow, ensure that the air flow newly generated by the fan 35 can continuously enter the test temperature chamber 31, thereby continuously exchanging heat with the test temperature chamber 31, and improving the temperature adjustment efficiency of the test temperature chamber 31; and another part of the air flow may strike the groove wall of the test temperature chamber 31 to form a convolution, so that a small-sized circulating air channel is formed in the test temperature chamber 31, thereby improving the heat exchange time of the part of the air flow and the test temperature chamber 31, improving the heat exchange efficiency and realizing full heat exchange.
Further, considering that the test temperature chambers 31 may be formed on the connection base plate 33 at the same time, for example, 2-6, etc., and the memory cards to be tested may be divided into 2-6 groups and placed in the corresponding test temperature chambers 31 for testing, in order to ensure the air flow heat exchange circulation in each test temperature chamber 31, in this embodiment, the specific distribution position of each ventilation hole 39 on the rear end face of the air guiding top cover 38 needs to be divided into a plurality of positions, and each ventilation hole is opposite to each diversion slope 381, and also opposite to each test temperature chamber 31, so that part of the air flow flowing through each test temperature chamber 31 can flow out smoothly after heat exchange.
In a specific embodiment of the thermostat 32, the thermostat 32 is embodied as a heater, such as an electric heater, a thermocouple plate, a PTC (Positive Temperature Coefficient ) thermistor, etc., so that when the air flow generated by the fan 35 passes through the thermostat 32, the air flow generated by the fan 35 defaults to cool air because the temperature of the normal temperature air flow is far less than the ambient temperature when the memory is running, and after the air flow is heated by the thermostat 32, hot air with a higher temperature can be formed, so that the test temperature chamber 31 is heated after the air flow enters the test temperature chamber 31.
Further, in order to improve the heating efficiency of the thermostat 32 for the airflow, in this embodiment, a plurality of cooling fins are further disposed on the top surface of the heater, so that the overall structure of the thermostat 32 is similar to a radiator. The arrangement is that the heat generated by the heater is efficiently absorbed by the plurality of radiating fins, and the large surface area of the radiating fins is used for contacting with cold air flow generated by the fan 35, so that efficient heat dissipation is realized, and the cold air flow is rapidly heated. Of course, the arrangement direction of the fins on the heater needs to ensure that the extending direction of the gaps between the adjacent fins is parallel to the direction of the fan 35, so as to ensure that the cold air flow can pass smoothly.
In another specific embodiment regarding thermostat 32, thermostat 32 may include not only a heater, but also both a heater and a refrigerator, such that when the temperature of the air stream is too high, the refrigerator is activated to cool the air stream appropriately to control the temperature of the air stream within a reasonable range. Of course, since the air flow generated by the fan 35 is cool air, the cooling flow can be increased by increasing the rotation speed or power of the fan 35, and the temperature of the air flow can be gradually reduced on the basis of the constant power of the heater, so that the cooling adjustment of the air flow can be realized.
In order to facilitate the installation of the fan 35 and the thermostat 32 on the top surface of the connection base plate 33, a bottom cover 36 is added in the present embodiment. Specifically, the bottom cover 36 is connected to the front end of the connection bottom plate 33 and is flush with the connection bottom plate 33, and is used to cover the hollow side of the accommodating box 22 together with the connection bottom plate 33, and meanwhile, the thermostat 32 and the fan 35 are both disposed on the bottom cover 36, so as to avoid interference with the position of the test temperature chamber 31 formed on the connection bottom plate 33. Meanwhile, the fan 35, the thermostat 32 and the test temperature chamber 31 need to be kept collinear, so as to ensure that the air flow generated by the fan 35 can be blown into the test temperature chamber 31 through the thermostat 32.
Further, in order to realize the airtight installation of the fan 35 and the thermostat 32 on the top surface of the connection base plate 33, the top cover 37 is further added in this embodiment to prevent the air flow generated by the fan 35 from being scattered to the outside. Specifically, the top cover 37 is fastened to the top of the bottom cover 36, and is mainly used for forming a closed structure around the bottom cover 36, so as to form a closed space for the thermostat 32 and the fan 35, and prevent the air flow formed by the fan 35 from overflowing.
Fig. 5 is a schematic diagram of signal connection among the test host 1, the motherboard environment module 2 and the temperature environment module 3.
In order to facilitate the signal connection between the test host 1 and the server motherboard 21, in this embodiment, the test host 1 is specifically connected to the management interface 24 on the server motherboard 21 through a network cable, and the management interface 24 is further connected to the baseboard management controller 25 (BMC, board Management Controller) on the server motherboard 21, and the baseboard management controller 25 is mainly used for sending the environmental test parameters of the test host 1 to the temperature environment module 3, such as the test temperature, so that the temperature regulator 32 adjusts the temperature of the test temperature chamber 31 accordingly. Meanwhile, the baseboard management controller 25 can also send test parameters such as test time sequence and test voltage to the BIOS (Basic Input Output System ) on the server motherboard 21, so that the server motherboard 21 can test the memory card to be tested according to the test parameters.
In one embodiment of the temperature environment module 3, the temperature environment module 3 mainly includes a temperature sensor 310 and a temperature controller 311. The temperature sensor 310 is specifically disposed in the test temperature chamber 31, and is mainly used for detecting the temperature in the test temperature chamber 31, and is connected with the temperature controller 311 through a signal, and can send detection data to the temperature controller 311. The temperature controller 311 is in signal connection with the baseboard management controller 25, the thermostat 32, and the fan 35, and is mainly used for controlling the operating states of the thermostat 32 and the fan 35 according to the environmental test parameters of the test host 1, such as controlling the rotation speed of the fan 35 and the heating temperature of the thermostat 32, so as to maintain the temperature of the test temperature chamber 31 at the target test temperature.
In addition, in order to enable the tester to intuitively observe the test result of each memory card to be tested, the indicator lamp 4 is further added in the embodiment. Specifically, the indicator lamps 4 are disposed on the top surface of the connection bottom plate 33, and are simultaneously disposed in a plurality of numbers, the setting positions of each indicator lamp 4 respectively correspond to the positions of each memory card to be tested, so as to realize one-to-one correspondence, and each indicator lamp 4 is connected with the temperature control maintaining signal, after the test procedure is completed by the test host 1, the test result is fed back to the test host 1 and the temperature controller 311 by the server main board 21 (the BIOS on) so that the temperature controller 311 respectively makes the corresponding indicator lamp 4 execute the identification action according to the test result condition of each memory card to be tested, for example, the indicator lamp 4 corresponding to the memory card to be tested through which the test result passes shows green, and the indicator lamp 4 corresponding to the memory to be tested through which the test result does not pass shows red lamp. By the arrangement, after the test is finished, a tester can intuitively and clearly observe the test result of each memory card to be tested so as to carry out subsequent processing.
In one embodiment of the test host 1, the test host 1 may specifically be an electronic device such as a PC (Personal Computer ), and test software may be installed on the PC to automatically execute a subsequent test procedure through the test software during the test.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (13)
1. The memory test server architecture is characterized by comprising a test host (1), a main board environment module (2) and a temperature environment module (3);
The mainboard environment module (2) comprises a server mainboard (21), and a memory slot for being in plug-in fit with a memory card to be tested is arranged on the server mainboard (21);
The temperature environment module (3) comprises a test temperature cavity (31) and a temperature regulator (32), the test temperature cavity (31) is used for forming a closed test space for a memory card to be tested which is arranged on the memory slot, and the temperature regulator (32) is used for regulating the test temperature of the test temperature cavity (31);
the test host (1) is in signal connection with the server main board (21) and the temperature regulator (32) and is used for controlling the working state of the temperature regulator (32) according to a preset test program and testing a memory card to be tested through the server main board (21);
The temperature environment module (3) further comprises a connecting bottom plate (33), a fan (35) and a wind-guiding top cover (38), wherein the fan (35) and the wind-guiding top cover (38) are arranged on the connecting bottom plate (33), and the wind-guiding top cover (38) is detachably connected to the connecting bottom plate (33) and covers the temperature testing cavity (31);
A guide slope (381) extending downwards obliquely is formed at the front end, facing the fan (35), of the air guide top cover (38), and the guide slope (381) is used for guiding air flow passing through the temperature regulator (32) into the test temperature cavity (31);
The end face of the rear end, deviating from the fan (35), of the air guide top cover (38) is provided with a plurality of ventilation holes (39), and the distribution position of each ventilation hole (39) is opposite to the air guide slope (381).
2. The memory test server architecture of claim 1, wherein the motherboard environment module (2) further comprises a housing case (22), the server motherboard (21) being mounted within the housing case (22); the side face of the accommodating box body (22) facing the memory slot is hollowed out.
3. The memory test server architecture according to claim 2, wherein the connection base plate (33) is configured to be connected to the accommodating case (22) so as to cover a hollowed-out side surface of the accommodating case (22); the test temperature cavity (31) and the temperature regulator (32) are arranged on the connecting bottom plate (33).
4. A memory test server architecture according to claim 3, characterized in that the connection base plate (33) forms a detachable connection with the housing box (22) for replacing different motherboard environment modules (2) and for forming different motherboard environments for the memory card to be tested.
5. The memory test server architecture according to claim 4, wherein a clamping post (23) is convexly arranged on a side wall of the accommodating box body (22), a clamping groove (34) is formed in a bottom of a side wall of the connecting bottom plate (33), and the clamping groove (34) is used for forming clamping fit with the clamping post (23).
6. The memory test server architecture of claim 5, wherein the clamping groove (34) is a triangular groove, a groove width of the triangular groove is tapered from a bottom to a top, and the triangular groove is used for forming a vertical clamping fit with the clamping post (23).
7. A memory test server architecture according to claim 3, wherein the test temperature chamber (31) is a groove formed on the connection base plate (33), the groove is used for accommodating a memory slot and a memory card to be tested on the server motherboard (21), and a wall of the groove extends downward to form a contact with a surface of the server motherboard (21).
8. The memory test server architecture of claim 7, wherein the fan (35) is configured to generate an air flow to the thermostat (32) such that the air flow enters the test temperature chamber (31) after being heated or cooled by the thermostat (32).
9. The memory test server architecture according to claim 8, wherein the temperature environment module (3) further comprises a bottom cover (36), the bottom cover (36) is connected to a front end of the connection base plate (33), the thermostat (32) and the fan (35) are both disposed on the bottom cover (36), and the fan (35), the thermostat (32) and the test temperature chamber (31) are collinear.
10. The memory test server architecture according to claim 9, wherein the temperature environment module (3) further comprises a top cover (37), the top cover (37) is buckled on top of the bottom cover (36), and is used for forming a closed space for the thermostat (32) and the fan (35).
11. The memory test server architecture according to claim 8, wherein the test host (1) is in signal connection with a management interface (24) on the server motherboard (21) through a network cable, and the management interface (24) is in signal connection with a baseboard management controller (25) on the server motherboard (21), and the baseboard management controller (25) is configured to send environmental test parameters of the test host (1) to the temperature environment module (3).
12. The memory test server architecture of claim 11, wherein the temperature environment module (3) further comprises a temperature sensor (310) and a temperature controller (311);
the temperature sensor (310) is in signal connection with the temperature controller (311) and is used for detecting the temperature in the test temperature cavity (31);
The temperature controller (311) is in signal connection with the baseboard management controller (25), the temperature regulator (32) and the fan (35), and is used for controlling the working states of the temperature regulator (32) and the fan (35) according to the environment test parameters of the test host (1).
13. The memory test server architecture of claim 12, further comprising a plurality of indicator lights (4) disposed on the connection backplane (33);
Each indicator lamp (4) is in signal connection with the temperature controller (311) so as to respectively indicate the test result of each corresponding memory card to be tested according to the test result fed back by the test host (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410220312.7A CN117806429B (en) | 2024-02-28 | 2024-02-28 | Memory test server architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410220312.7A CN117806429B (en) | 2024-02-28 | 2024-02-28 | Memory test server architecture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117806429A CN117806429A (en) | 2024-04-02 |
| CN117806429B true CN117806429B (en) | 2024-04-26 |
Family
ID=90426984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410220312.7A Active CN117806429B (en) | 2024-02-28 | 2024-02-28 | Memory test server architecture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117806429B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484145A (en) * | 2002-09-20 | 2004-03-24 | 联想(北京)有限公司 | System for realizing envivonment test of mainboard |
| CN108776537A (en) * | 2018-08-07 | 2018-11-09 | 郑州云海信息技术有限公司 | A kind of system and method for automatic test heat dissipation regulating strategy |
| CN109062745A (en) * | 2018-07-26 | 2018-12-21 | 郑州云海信息技术有限公司 | A kind of test terminal with testing service device hardware temperatures |
| WO2020176999A1 (en) * | 2019-03-06 | 2020-09-10 | Kingtiger Technology (Canada) Inc. | System and method for verifying and analyzing memory for high performance computing systems |
-
2024
- 2024-02-28 CN CN202410220312.7A patent/CN117806429B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484145A (en) * | 2002-09-20 | 2004-03-24 | 联想(北京)有限公司 | System for realizing envivonment test of mainboard |
| CN109062745A (en) * | 2018-07-26 | 2018-12-21 | 郑州云海信息技术有限公司 | A kind of test terminal with testing service device hardware temperatures |
| CN108776537A (en) * | 2018-08-07 | 2018-11-09 | 郑州云海信息技术有限公司 | A kind of system and method for automatic test heat dissipation regulating strategy |
| WO2020176999A1 (en) * | 2019-03-06 | 2020-09-10 | Kingtiger Technology (Canada) Inc. | System and method for verifying and analyzing memory for high performance computing systems |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117806429A (en) | 2024-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101456975B1 (en) | Cooling unit and display apparatus having the same | |
| JP4973782B2 (en) | Information processing apparatus system and control method thereof | |
| CN117806430B (en) | Memory test server system and double-air-duct memory test device thereof | |
| CN113253102B (en) | Large capacity aging testing case | |
| KR101750811B1 (en) | Apparatus for testing reliability of semiconductor component in which air flows efficiently | |
| TW201338681A (en) | Server cabinnet | |
| CN117806429B (en) | Memory test server architecture | |
| CN208705439U (en) | A kind of high power water cooling burning measurement equipment | |
| CN209311964U (en) | A kind of computer motherboard protective device | |
| KR101765286B1 (en) | Apparatus for testing reliability of semiconductor component having vertical loading direction | |
| CN116736080A (en) | Temperature control test incubator | |
| CN211856811U (en) | Feedback type presintering device of running furnace | |
| CN213586773U (en) | Heat dissipation device of power supply controller | |
| CN212970620U (en) | Switch | |
| CN114137352A (en) | Automatic temperature control aging device | |
| CN109031084A (en) | A kind of high power water cooling burning measurement equipment | |
| KR101740653B1 (en) | Apparatus for testing reliability of semiconductor component comprising detachable cooling member | |
| WO2023236950A1 (en) | Air conditioner indoor unit | |
| CN215494880U (en) | Reinforced computer heat dissipation case | |
| CN111722972A (en) | Memory high-low temperature testing device and testing method thereof | |
| CN218956053U (en) | Wind tunnel structure for heat radiation performance test | |
| CN216696503U (en) | Automatic temperature control aging device | |
| CN219121590U (en) | Auxiliary testing tool for electronic device and server testing system | |
| CN218069356U (en) | M.2 solid-state hard disk cartridge with radiating effect | |
| CN220323470U (en) | Temperature control test incubator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |