KR101765286B1 - Apparatus for testing reliability of semiconductor component having vertical loading direction - Google Patents

Apparatus for testing reliability of semiconductor component having vertical loading direction Download PDF

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Publication number
KR101765286B1
KR101765286B1 KR1020150117955A KR20150117955A KR101765286B1 KR 101765286 B1 KR101765286 B1 KR 101765286B1 KR 1020150117955 A KR1020150117955 A KR 1020150117955A KR 20150117955 A KR20150117955 A KR 20150117955A KR 101765286 B1 KR101765286 B1 KR 101765286B1
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South Korea
Prior art keywords
frame member
receiving frame
chamber
disposed
main body
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KR1020150117955A
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Korean (ko)
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KR20170023339A (en
Inventor
임종찬
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(주) 예스티
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Priority to KR1020150117955A priority Critical patent/KR101765286B1/en
Publication of KR20170023339A publication Critical patent/KR20170023339A/en
Application granted granted Critical
Publication of KR101765286B1 publication Critical patent/KR101765286B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A semiconductor component reliability testing apparatus having a vertical loading structure according to the present invention comprises a chamber member constituting an overall appearance of an apparatus, a door member formed on one side of the chamber member, and a filter member disposed inside the chamber member, An air circulation member installed in the chamber member, and an air circulation member connected to the chamber member, the chamber member having an air flow rate adjusting member for adjusting the amount of air supplied into the chamber member, And a receiving frame member that is mounted on the supporting frame member, wherein the receiving frame member accommodates a computer main body, and the receiving frame member is received in the receiving frame member, Wherein a connector portion connected to the computer main body is projected through a front surface of the frame member, The memory is adapted to be coupled, the connector unit may be a plurality of arranged in the height direction of the accommodating frame members.
According to the present invention, since the computer main body can be directly placed and tested in the test apparatus for reliability test, the work process for reliability testing of memory parts such as USB and SSD becomes very simple.
In addition, since more semiconductor components to be tested can be loaded in the test apparatus, the yield of the test process can be improved, and the computer main body can be protected from the high temperature environment in the reliability test process.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor component reliability test apparatus having a vertically stacked structure,

The present invention relates to an apparatus for testing high temperature and low temperature reliability of a semiconductor component, and more particularly, to an apparatus and a method for testing a semiconductor component having a vertically stacked structure And a semiconductor device reliability test apparatus.

Recently, with the rapid development and spread of computer technology, the memory part technology that can be used in connection with this has been dramatically developed.

In view of the fact that such high-density integration of memory parts is rapidly proceeding, the role of the manufacturing and testing apparatuses is becoming more important.

Normally, memory parts such as USB, SSD, and EMMC are used in various conditions and defects may occur due to the heat generated by the use of the memory. Therefore, Inspection is performed.

In order to protect the computer main body from a high temperature environment, the conventional memory component temperature reliability testing apparatus as described above has a structure in which a computer main body is disposed in a predetermined area in a test apparatus, Reliability tests were performed in the atmosphere.

Therefore, since the operator and the operator have to individually connect the computer main body and the memory part, the reliability test operation takes a long time and is inconvenient.

On the other hand, Korean Utility Model No. 435565 discloses a device capable of individually performing a temperature reliability test on a plurality of memory modules in order to solve the above problem.

The test apparatus has a plurality of cooling / heating systems for applying a temperature condition to a memory module installed in a base frame, and is installed on a base frame so that a plurality of cooling / heating systems can move up and down, forward and backward, And a plurality of cradles for supporting the system.

However, such a testing apparatus is complicated in the structure of a cradle for supporting the cold / hot system, and has a problem that the volume of the apparatus as a whole is increased because a moving space is secured so that the cold / hot system can move a predetermined distance.

Meanwhile, in the test apparatus, the space in which the memory components to be tested are disposed should be set to a very high or low temperature environment compared to room temperature, and the space in which the computer body for transmitting data to the memory components is disposed should be maintained at room temperature do.

If the temperature of the space in which the computer main body is disposed can not be maintained at room temperature, it may cause a deterioration or a service life of the computer main body due to repetitive testing work.

In addition, when the temperature of the space in which the memory components to be tested are disposed can not be uniformly maintained, the accuracy of the reliability test is lowered.

However, in the existing reliability testing apparatus, no separate measures are taken to maintain the temperature characteristics of the space with respect to the space where the memory component is disposed and the space where the computer main body is disposed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor memory component reliability test apparatus having a vertically stacked structure so as to simplify an operation for testing reliability of memory components .

Another object of the present invention is to provide a semiconductor component reliability test apparatus having a vertically stacked structure that is space-efficient configured to improve the yield of a test process by allowing more semiconductor components to be tested to be loaded in the test apparatus .

It is still another object of the present invention to provide a semiconductor component reliability test apparatus having a vertical loading structure configured to directly place a computer main body in a test apparatus and protect the computer main body from a high temperature or low temperature environment.

It is still another object of the present invention to provide a semiconductor component reliability test apparatus having a stacking structure in a vertical direction capable of efficiently circulating air in accordance with the requirements of spaces provided in a test apparatus.

In order to accomplish the above object, according to the present invention, there is provided an apparatus for testing reliability of a semiconductor component having a vertically stacked structure, including a chamber member constituting an overall appearance of the apparatus, a door member formed at one side of the chamber member, An air circulation member installed in the chamber member, and an air circulation member provided in the chamber member, wherein the air circulation member is disposed in the chamber member, A chamber member; a cooling member connected to the chamber member; a support frame member disposed inside the chamber member to support the plurality of accommodating frame members; and a receiving frame member that is mounted on the support frame member, And a connector portion connected to the computer main body through the front surface of the receiving frame member is protruded And a plurality of connector portions are arranged along a height direction of the accommodating frame member, wherein the accommodating frame member is configured such that a plurality of the connector portions are arranged in a vertical direction, Is disposed within the member.

Preferably, the receiving frame member is formed in a hexahedron shape, and a heat insulating member is disposed between the computer body and the connector portion in front of the receiving frame member.

Here, a fan may be installed at an upper portion or a lower portion of the receiving frame member.

Further, a plate-shaped heater member may be disposed on the back surface of the heat insulating member.

Meanwhile, the heat insulating member may be formed of a foamable synthetic resin material.

In addition, the plate-shaped heater member may be formed by inserting a heating wire inside a rectangular plate-shaped synthetic resin material.

Preferably, the receiving frame member is formed of a perforated metal plate.

Further, a space may be formed between the upper part of the support frame member and the chamber member, and a ventilation member may be installed on the upper or lower part of the support frame member.

The air flow rate regulating member may include a base member having a plurality of first air openings formed at equal intervals and a throttle plate overlapped with the base member. The throttle plate may have a plurality of second air openings formed at equal intervals have.

Here, the air volume adjusting member may be disposed on the entire surface of the filter member.

According to the present invention, since the computer main body can be directly placed and tested in the test apparatus for reliability test, the work process for reliability testing of memory parts such as USB and SSD becomes very simple.

In addition, since more semiconductor components to be tested can be loaded in the test apparatus, the yield of the test process can be improved.

In addition, the computer body can be protected from the high temperature environment during the reliability test.

In addition, by efficiently circulating air in accordance with the requirements of the spaces provided in the test apparatus, it is possible to improve the test reliability, prevent malfunction of the computer main body which transmits data to the test parts, and increase the service life.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a perspective view of a semiconductor part reliability testing apparatus having a vertical loading structure according to the present invention,
2 is an internal perspective view of the test apparatus,
3 is a rear view of the test apparatus,
Figure 4 is a rear interior perspective view of the test apparatus,
5 is a side cross-sectional view of the test apparatus,
6 is a front view of the test apparatus in which a cooling member is installed,
7 is a view of a receiving frame member disposed in the test apparatus,
8 is a view showing the state in which the receiving frame member is loaded,
9 is a perspective view of a receiving frame member,
10 is a front view of a plate-shaped heater member installed in the receiving frame member,
11 is an exploded perspective view of the airflow control member,
12 is a plan view of a base member and a throttle plate included in the air flow rate regulating member.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

1 is a perspective view of a semiconductor component reliability test apparatus having a vertical loading structure according to the present invention, FIG. 2 is an internal perspective view of the test apparatus, FIG. 3 is a rear view of the test apparatus, 6 is a front view of the test apparatus in which a cooling member is installed, Fig. 7 is a view of a receiving frame member disposed in the test apparatus, and Fig. 10 is a front view of a plate-shaped heater member installed in the receiving frame member, and Fig. 11 is a sectional view showing a disassembly of the airflow control member. Fig. And FIG. 12 is a plan view of a base member and a throttle plate included in the air volume adjusting member.

1 to 11, a semiconductor component reliability testing apparatus having a vertically stacked structure according to the present invention includes a chamber member 10 that constitutes an overall appearance of the apparatus, and a chamber member 10 which is formed on one side of the chamber member 10 A door member 20, a filter member 30 disposed inside the chamber member 10, a heating member 90 disposed inside the chamber member 10, An air circulation member 95 installed in the chamber member 10, a cooling member 70 connected to the chamber member 10, A supporting frame member 50 disposed inside the chamber member 10 to support a plurality of receiving frame members 60 and a receiving frame member 60 mounted on the supporting frame member 50, The receiving frame member (60) houses a computer body (65), and the receiving frame member (60) A connector portion 69 connected to the computer main body 65 is protruded through a surface of the receiving frame member 60 so that the test subject memory is coupled to the connector portion 69, The receiving frame member 60 is disposed in the support frame member 50 such that the connector portion 69 is disposed in a vertical direction.

The chamber member 10 forms an outer appearance of the semiconductor component reliability test apparatus according to the present invention and is formed in a substantially hexahedron shape as a whole for accommodating the filter member 30 and the airflow control member 40, do.

The chamber member 10 is made of a metal wire and a metal panel, and a control panel 100 for controlling various components of the reliability testing apparatus is installed on the front surface of the chamber member 10.

A door member 20 is disposed in front of the chamber member 10 so that the receiving frame member 60 and semiconductor components to be tested are introduced into and discharged from the chamber member 10 through the door member 20 .

The semiconductor component to be tested is, for example, a memory part such as a USB memory, an SSD memory, or an eMMC memory.

A filter member 30 is disposed on one side of the chamber member 10 so as to trap impurities in the air supplied into the chamber member 10 so that the inside of the chamber member 10 can be kept clean .

The filter member 30 is disposed in a wall portion 30 of a space in which the semiconductor component to be tested is disposed in the chamber member 10 and includes an ULPA filter.

The ultrafast filter is an ultra high performance filter capable of collecting 99.9995% or more with respect to 0.1 to 0.17 mu m particles, and is mainly applied to a clean room of class 1 to 100 or less.

An air volume adjusting member 40 for adjusting the amount of air supplied to the space where the semiconductor component to be tested is disposed is disposed on the front surface of the filter member 30, And is supplied to the space in which the semiconductor component to be tested is disposed through the air flow rate regulating member 40.

The upper portion of the chamber member 10 is provided with a heater member 90 for heating the air to a predetermined test temperature so as to supply the heated air into the space where the semiconductor components to be tested are disposed.

A cooling member 70 is installed on one side of the chamber member 10 so that the refrigerant cooled to a predetermined temperature flows into the chamber member 10 to keep the inside of the test space at a predetermined low temperature state .

Further, a pair of the air circulating members 95 is provided on the upper side of the chamber member 10 on the side where the receiving frame member 60 is disposed.

The air heated by the heater member 90 flows toward the filter member 30 by the air circulating member 95 and the foreign substance contained in the air heated by the filter member 30 is removed , The air is discharged to the space where the test object memory is disposed through the airflow control member (40).

The air flow rate regulating member 40 shown in Figs. 11 and 12 includes a base member 42 having a plurality of rectangular first ventilation holes 43 formed at equal intervals, a throttle plate 44).

The base member 42 is formed of a metal material, and is formed in the shape of a plate having a rectangular shape as a whole.

A plurality of second ventilation holes 45 having a rectangular shape are formed at equal intervals in the throttle plate 44. The throttle plate 44 is divided into a rectangular plate shape smaller in size than the base member 42, do.

12, the position of the throttle plate 44 is adjusted on the base member 42, and the position of the throttle plate 44 can be fixed by a coupling means such as a screw.

Thus, by adjusting the position of the second ventilation holes 45 formed in the throttle plate 44 with respect to the position of the first ventilation holes 43 formed in the base member 42, as a result, Can be adjusted.

In the test apparatus according to the present invention, when air is supplied to the test space through a duct (not shown), the flow rate (pressure) of air passing through the filter member 30 varies depending on the arrangement state of the duct.

The position of the second ventilation holes 45 formed in the throttle plate 44 is adjusted with respect to the position of the first ventilation holes 43 formed in the base member 42 as described above, The amount of the flow of the air passing through the region can be controlled. As a result, the flow amount of the heated air supplied into the test space can be adjusted for each region.

So that the temperature of the entire area of the memory components accommodated in the test space can be evenly raised.

 A supporting frame member 50 is disposed inside the chamber member 10 and accommodates a receiving frame member 60 formed in a hexahedron shape to accommodate a computer main body 65 for applying a signal to a memory to be tested. .

The support frame member 50 is configured in the shape of a shelf and is configured to accommodate the receiving frame member 60 formed in a hexahedron shape in each of the areas divided in the horizontal direction and the height direction.

The upper and lower spaces between the support frame member 50 and the chamber member 10 are provided with ventilation members 53 and 55 so that the ventilation members 53 and 55 Air flow is smooth.

A circular opening is formed in the ventilation members 53 and 55 so that the circular opening is arranged at a substantially vertical position with respect to the fan 66 and the ventilation hole 68 provided in the receiving frame member 60 do.

The receiving frame member 60 is a metal plate in which round holes 70 are formed. The receiving frame member 60 is formed into a hexahedron having a height in the height direction, and a computer main body 65 for receiving memory parts is accommodated therein.

The computer main body 65 is configured to transmit and receive data in combination with memory parts to be tested, and includes a CPU and various system boards.

A connector portion 69 for connection between the computer main body 65 and the memory component is disposed in front of the receiving frame member 60. [

Therefore, when the receiving frame member 60 is disposed in the divided portion of the support frame member 50, only the connector portion 69 protrudes toward the test space side, and the computer main body 65 is supported by the receiving frame member 50 60 in the rear space of the chamber member 10.

Therefore, the hot air discharged from the air flow rate regulating member 40 is supplied to the test space, and no hot air is supplied to the computer body 65.

In order to more completely protect the computer main body 65 from the hot air discharged through the air flow rate regulating member 40 between the computer main body 65 and the connector portion 69, 60 is disposed in front of the heat insulating member 62.

The heat insulating member 62 is formed of a foamed silicone material and is configured to prevent heat from being transferred from the hot air discharged from the air flow rate regulating member 40 to the computer body 65.

A plate-shaped heater member 64 is disposed on the rear side of the heat insulating member 62 in front of the receiving frame member 60.

Here, as shown in FIG. 10, the plate-shaped heater member 64 includes a heating wire 64-2 inside a rectangular plate-shaped synthetic resin material 64-1.

The portion where the connector portion 69 is disposed is a high temperature or low temperature environment for testing the high temperature and low temperature reliability of the memory component by the hot air discharged from the air flow rate regulating member 40, Is contained in the housing frame member 60 becomes an environment near room temperature.

As described above, the heat insulating member 62 is disposed between the portion where the computer main body 65 is accommodated and the portion where the connector portion 69 is disposed, so that the heat transfer amount is reduced.

Therefore, the portion of the computer main body 65, which is in a lower temperature or higher temperature environment, may be an environment having a higher relative humidity than the portion where the connector portion 65 is disposed, Condensation may occur on the back side of the water tank (69).

Therefore, by arranging the plate-shaped heater member 64 at the rear portion of the heat insulating member 62, it is possible to prevent the flow of the air from the airflow control member 40 through the synthetic resin material 64-1 forming the body of the plate- And generates heat at a constant temperature through the heating wire 64-2 disposed in the heater member 64 so that condensation is generated at the rear side of the heat insulating member 62. As a result, Thereby preventing occurrence of a phenomenon.

Thus, it is possible to prevent the high-temperature or low-temperature air from the reliability test space from being transmitted to the computer main body 65, while causing moisture caused by the condensation phenomenon to enter the computer main body 65 and causing malfunction of the computer main body 65 .

A fan 66 is installed on the upper portion of the receiving frame member 60 and a ventilation hole 68 is provided on the lower portion of the receiving frame member 60 to increase the air flow in the space where the computer body 65 is disposed, 65 can be maintained closer to room temperature.

It is possible to prevent the high temperature or low temperature air from being transmitted to the computer body 65 by the heat insulating member 62 and the plate heater member 64 as described above, Is disposed, it is possible to more completely prevent the computer main body 65 from being damaged by heat.

The connector portion 69 of the receiving frame member 60 formed in a long hexahedron shape is provided along the height direction of the receiving frame member 60 and the receiving frame member 60 Are accommodated such that the connector portion 69 is disposed along the height direction.

The connector portion 69 is a heat transfer passage from the test space to the space in which the receiving frame member 60 is disposed. The connector portion 69 is configured to be disposed along the height direction as described above, Can flow more smoothly through the fan (66) and the air circulating member (95).

Thus, a larger number of connector portions 69 and accommodating frame members 60 can be accommodated in the support frame member 50 than in the case where the connector portions 69 are arranged in the horizontal direction, The temperature difference between the space and the space where the computer body 65 is disposed can be more easily maintained.

The heat generated from the connector portion 69 and the computer main body 65 is allowed to flow through the fan 66 installed vertically above the computer main body 65, 60 are arranged in a space in which the test components are arranged, a larger number of memory components can be arranged along the height direction in the space in which the test components are disposed have.

While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.

10: chamber member
20: Door member
30: Filter element
40: air volume adjusting member
50: Support frame member
60: receiving frame member
70: Computer body
80:
90: heater member

Claims (10)

A chamber member constituting an overall appearance of the apparatus,
A door member formed in front of the chamber member;
A filter member disposed on an inner sidewall of the chamber member;
A heater member disposed at an upper portion within the chamber member;
An air volume adjusting member disposed on the front surface of the filter member inside the chamber member to adjust an amount of air supplied into the chamber member;
An air circulation member installed on the chamber member for flowing air heated by the heater member toward the filter member;
A cooling member connected to the side of the chamber member;
A support frame member disposed inside the chamber member and supporting a plurality of receiving frames;
And a receiving frame member that is mounted on the supporting frame member,
The receiving frame member accommodates a computer main body,
A connector portion connected to the computer main body through a front surface of the receiving frame member,
And a test object memory coupled to the connector unit,
A plurality of connector portions are disposed along the height direction of the receiving frame member,
Wherein the receiving frame member is disposed in the support frame member such that a plurality of the connector portions are arranged in a vertical direction,
Wherein the receiving frame member is formed in a hexahedron shape, and a heat insulating member is disposed between the computer body and the connector portion in front of the receiving frame member,
A plate-shaped heater member is disposed on the back surface of the heat insulating member,
A fan is installed on the upper part of the receiving frame member, a vent is provided on the lower part,
A space is formed between the upper portion of the support frame member and the chamber member, and a ventilation member is provided on an upper portion or a lower portion of the support frame member,
Wherein the ventilation member is provided with a circular opening, the circular opening is disposed at a position perpendicular to the fan installed in the receiving frame member,
Wherein the air flow rate regulating member includes a base member having a rectangular shape in which a plurality of first air vents are formed at equal intervals,
And a plurality of throttle plates overlapping the base member and formed in a rectangular plate shape having a smaller size than the base member,
And a plurality of second vents are formed at equal intervals on the throttle plate,
Wherein the position of the plurality of throttle plates is adjusted with respect to each region of the base member, and the position of the plurality of throttle plates is fixed by the engaging means. The method according to claim 1,
Wherein the heat insulating member is formed of a foamable synthetic resin material. The method according to claim 1,
Wherein the plate-shaped heater member is formed by incorporating a heating wire inside a rectangular plate-shaped synthetic resin material. The method according to claim 1,
Wherein the receiving frame member is formed of a perforated metal plate. delete delete delete delete delete delete
KR1020150117955A 2015-08-21 2015-08-21 Apparatus for testing reliability of semiconductor component having vertical loading direction KR101765286B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108562447A (en) * 2017-12-20 2018-09-21 西安航空制动科技有限公司 A kind of design method of civil aircraft brake system combined environment test case
KR20220090797A (en) 2020-12-23 2022-06-30 주식회사 유니테스트 Semiconductor test device with evaporator

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110047556B (en) * 2018-01-16 2022-07-22 苏州腾顺自动化设备有限公司 Solid state disk operation performance test machine with adjustable operational environment temperature

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108562447A (en) * 2017-12-20 2018-09-21 西安航空制动科技有限公司 A kind of design method of civil aircraft brake system combined environment test case
KR20220090797A (en) 2020-12-23 2022-06-30 주식회사 유니테스트 Semiconductor test device with evaporator

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