CN117799072A - Cutting mechanism and cutting system - Google Patents

Cutting mechanism and cutting system Download PDF

Info

Publication number
CN117799072A
CN117799072A CN202410094587.0A CN202410094587A CN117799072A CN 117799072 A CN117799072 A CN 117799072A CN 202410094587 A CN202410094587 A CN 202410094587A CN 117799072 A CN117799072 A CN 117799072A
Authority
CN
China
Prior art keywords
laser
cutting
laser light
curved surface
reflecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410094587.0A
Other languages
Chinese (zh)
Inventor
周晓勤
郭列维
裴嘉琳
王荣奇
王超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jilin University
Original Assignee
Jilin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jilin University filed Critical Jilin University
Priority to CN202410094587.0A priority Critical patent/CN117799072A/en
Publication of CN117799072A publication Critical patent/CN117799072A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a cutting mechanism and a cutting system. The cutter comprises a cutting edge for cutting a workpiece and a zoom curved surface, and the material of the cutter is light-transmitting material. The laser assembly is configured to emit laser light that can be directed into the tool by the variable focal length curved surface. The zoom curved surface is configured to focus the transmitted laser light so that the focal point of the laser light can be located at the cutting point of the cutting edge. The laser penetrating through the cutter focuses on the part to be machined of the workpiece, so that the material property of the part to be machined of the workpiece is changed, the cutting force is reduced, the material removal rate is improved, the machining damage is reduced, and the machining quality of the cutting system with the cutting mechanism is improved.

Description

Cutting mechanism and cutting system
Technical Field
The invention relates to the field of optical part manufacturing equipment, in particular to a cutting mechanism and a cutting system.
Background
The manufacture of optical parts is mainly divided into two types, namely a plane (rotationally symmetric part) and a free-form surface (non-rotationally symmetric part) according to the final forming structure of the parts. The workability of parts is divided into two types, plastic easily-workable materials and hard brittle difficult-to-work materials. For plastic and easily processed (plane and free-form surfaces), and brittle and difficult-to-process plane parts. Related processing methods can be realized at present. However, for brittle free-form surface parts, no good processing method is available at present to perform processing under the condition of ensuring processing efficiency, morphology precision, surface quality and subsurface quality. In short, the existing processing methods are either not available or are of poor quality.
The planar part has a simple structure, and the surface morphology and the surface precision meeting the requirements can be obtained by adopting a common processing method. The non-rotationally symmetrical part mainly refers to a part comprising a free-form surface. Or the parts comprise micro grooves, micro lenses, micro prisms and micro mirror arrays. Because the free-form surface part has irregular shape and smaller size, the free-form surface part cannot be manufactured by a common processing technology, and the problem of ensuring the shape precision and the surface quality precision in the processing process is solved.
The traditional processing methods of free-form surfaces and microarrays mainly comprise the following steps: grinding and polishing process, additive forming process, milling process, special machining process (electron beam, ion beam), photoetching process and quick and slow cutter servo process. The product quality (morphology precision and surface quality precision) after processing is ranked according to the height, and the photoetching technology has the highest precision and the best effect on micro-size processing. However, the processing technology has high threshold, complex equipment and high cost. Grinding and polishing processes, additive forming processes, milling processes and special processing processes (electron beams and ion beams) have general process thresholds, general equipment and equipment, general cost and lower product quality. The quick tool servo process can ensure the shape accuracy, the surface quality and the subsurface quality under the condition of ensuring the production period and lower production cost.
For the traditional quick cutter servo system, if the material characteristics of the processed workpiece are good, the formability and the machinability are good, namely the material in the traditional sense is softer and suitable for cutting. The free-form surface or the product quality of the microarray system after the processing of the workpiece is completed is ideal. However, for some brittle and hard material workpieces such as silicon wafers, fused quartz and silicon carbide, the formability and machinability of the workpiece are poor, and in the processing process, the cutting is broken irregularly, the material removal is incoherent, and the product quality is difficult to control.
The brittle free-form surface parts are difficult to process, and are just key optical parts applied to optical and national defense equipment. Such as lithography machine mirrors, chip micro-electronic lenses, missile fairings, etc.
Disclosure of Invention
The invention mainly aims to provide a cutting mechanism and a cutting system, which aim at solving the technical problem of how to improve the processing quality of brittle and hard materials.
In order to achieve the above object, the present invention provides a cutting mechanism comprising:
the cutter comprises a cutting edge, wherein the cutter is made of a light-transmitting material and comprises a zooming curved surface;
a laser assembly configured to emit laser light from the variable focal length curved surface into the tool;
the zoom curved surface is configured to focus the transmitted laser light so that a focal point of the laser light transmitted through the zoom curved surface is located at a cutting point of the cutting edge.
In some embodiments, the variable focus curved surface is located on a side of the tool facing away from the cutting edge.
In some embodiments, the laser assembly is further configured to be capable of translating the path of the laser in response to a change in the cutting point of the cutting edge;
the zoom curved surface is configured to enable a focus of the laser to be located at a cutting point of the cutting edge after the path of the laser is switched.
In some embodiments, the cutting edge has a first end and a second end arranged opposite to each other, a direction from the first end to the second end being a first direction;
the laser light includes an incident segment that impinges in front of the zoom curve, and the laser assembly is configured to translate the incident segment in the first direction to alter a path of the laser light.
In some embodiments, the laser assembly comprises a laser generating device for generating the laser light and a laser adjusting device for changing a path of the laser light;
the laser light adjusting device includes a reflecting portion that changes a path of the laser light by reflecting the laser light; and/or the laser adjusting device comprises a refraction part, and the laser light passes through the refraction part and is refracted so as to adjust the path of the laser light.
In some embodiments, the variable focus curved surface is located on a side of the tool facing away from the cutting edge;
the cutting edge is provided with a first end and a second end which are oppositely arranged, and the direction from the first end to the second end is a first direction;
the laser light adjusting device includes a reflecting portion that changes a path of the laser light by reflecting the laser light, the reflecting portion being configured to shift the path of the laser light by translating in the first direction so as to translate the laser light in the first direction; alternatively, the laser light adjusting device includes a refraction portion that changes a path of the laser light by refracting the laser light, the refraction portion being configured to rotate about an axis perpendicular to the first direction to change the path of the laser light so as to translate the laser light in the first direction.
In some embodiments, the laser light adjusting device includes a reflecting portion including a reflecting mirror for reflecting the laser light, the reflecting mirror including a first reflecting surface, the reflecting mirror being provided on a side of the zoom curved surface facing away from the cutting edge, the laser light generating device being provided on a side of the reflecting mirror in the first direction and emitting the laser light toward the first reflecting surface;
or alternatively;
the laser adjusting device comprises a reflecting part, the reflecting part comprises a total reflection prism used for reflecting the laser, the total reflection prism comprises a second reflecting surface, the total reflection prism is arranged on one side of the zoom curved surface, which is away from the cutting edge, and the laser generating device is arranged on one side of the total reflection prism along the first direction and emits the laser towards the second reflecting surface;
or alternatively;
the laser adjusting device comprises a refraction part, the refraction part is arranged on one side of the zooming curved surface, which is away from the cutting edge, the laser generating device is arranged on one side of the refraction part, which is away from the zooming curved surface, and the laser emitted by the laser generating device passes through the refraction part to the zooming curved surface.
In some embodiments, the cutting mechanism further comprises a drive configured to drive the cutter in a feed motion.
In some embodiments, the zoom curved surface is located at a side of the cutter away from the cutting edge, and a direction from the zoom curved surface to the cutting edge is a second direction;
the cutting mechanism further includes a controller coupled to the drive portion, the controller configured to acquire a control signal and control the drive portion to drive the tool to translate in a second direction in accordance with the control signal.
A second aspect of the invention also provides a cutting system comprising a cutting mechanism according to any of the embodiments described above.
Compared with the prior art, the invention has the beneficial effects that:
in the technical scheme of the invention, the cutting mechanism comprises a cutter and a laser component. The cutter comprises a cutting edge for cutting a workpiece and a zoom curved surface, and the material of the cutter is light-transmitting material. The laser assembly is configured to emit laser light that can be directed into the tool by the variable focal length curved surface. The zoom curved surface is configured to focus the transmitted laser light so that the focal point of the laser light can be located at the cutting point of the cutting edge. The laser penetrating through the cutter focuses on the part to be machined of the workpiece, so that the material property of the part to be machined of the workpiece is changed, the cutting force is reduced, the material removal rate is improved, the machining damage is reduced, and the machining quality is improved.
In the related art, although laser can focus on a workpiece through a cutter, in the cutting process of the cutter, due to the change of the processing appearance of the workpiece, the cutting point of a cutting edge can be changed along with the processing appearance of the workpiece. The laser in the related art can only always penetrate through a certain position of the cutter, namely, the position of the laser penetrating through the cutter is not changed along with the change of the cutting point of the cutting edge, so that the laser cannot be accurately focused on the cutting point of the cutting edge. In the cutting mechanism, the position of the laser penetrating through the cutter can be changed along with the change of the cutting point of the cutting edge through zooming the curved surface, and the laser is focused on the position of a workpiece to be cut. The cutting mechanism provided by the invention effectively improves the processing quality of brittle and hard materials.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a cutter according to an embodiment of the present invention;
FIG. 2 is a schematic view of a tool according to another embodiment of the invention;
FIG. 3 is a schematic view of a second view of a tool according to another embodiment of the invention;
FIG. 4 is an enlarged view of a portion A of FIG. 3 of a tool according to another embodiment of the invention;
FIG. 5 is a schematic view showing a structure of a tool assembled on a tool carrier according to an embodiment of the invention;
FIG. 6 is a schematic diagram illustrating the operation of a cutting system according to an embodiment of the present invention; wherein the laser adjusting device comprises a refraction part;
FIG. 7 is a schematic diagram illustrating operation of a cutting system according to yet another embodiment of the present invention; wherein the laser adjusting device comprises a reflecting part;
FIG. 8 is a schematic diagram of a cutting system, cutting mechanism, and FTS module according to an embodiment of the present invention;
FIG. 9 is a schematic view of a laser penetration tool cutting point in accordance with one embodiment of the present invention; the laser has a first incidence position on the zooming curved surface, and the zooming curved surface enables the laser penetrated from the first incidence position to be focused on a first cutting point of the cutting edge;
FIG. 10 is a schematic view of a laser penetration tool cutting point according to another embodiment of the present invention; the laser has a second incidence position on the zooming curved surface, and the zooming curved surface enables the laser penetrated from the second incidence position to be focused on a second cutting point of the cutting edge; the first incident point and the second incident point are distributed along the first direction, the laser incident on the zoom curved surface can be focused on the cutting point of the cutting edge of the cutter under the action of the zoom curved surface, and the shape of the cutting edge is distributed in the three-dimensional space.
Reference numerals illustrate:
10-a cutting system;
100-a cutting mechanism;
110-a cutter; 111-cutting edges; 112-a zoom curve; 113-a first end; 114-a second end;
120-a laser assembly; 121-a laser generating device; 122-laser adjustment device; 1221-a reflective part;
1222-a refractive portion; 123-laser; 1231-entrance section;
130-a cutter carrier;
a 200-FTS module;
x-a first direction; y-second direction.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the process of manufacturing non-planar optical parts, because of the irregular shape and small size of the non-planar parts, a fast tool servo system is generally adopted to process the parts. After the traditional rapid tool servo system processes a workpiece with excellent material characteristics, formability and machinability, a part with the surface morphology and the surface precision meeting the product use requirements can be obtained. However, for materials with high hardness, high brittleness and low fracture toughness, the elastic limit and the strength are very close, and the characteristics result in that when certain external force is applied to the materials, the materials are not easy to deform, but when the external force reaches a certain degree, the stress part of the parts made of the materials suddenly breaks, and no obvious plastic deformation exists when the parts break. The existence of the characteristics causes irregular breakage of the workpiece in the cutting process, material removal is incoherent, and finally, the surface morphology and surface precision of the processed part are difficult to meet the use requirement of a product, and the quality of the product is difficult to control.
The applicant has found that when a laser beam is applied to the surface of a brittle material, its energy is absorbed and converted into thermal energy, causing the surface of the material to heat rapidly. With the rise of temperature, the moisture and gas on the surface of the material are evaporated to form a layer of vapor film, and the vapor film can effectively prevent heat conduction, so that the heat in the material cannot diffuse to the surface, and high temperature is formed in the material. At high temperatures, the strength and hardness of the brittle and hard material decreases, making it easier to cut. Meanwhile, the energy density of the laser beam is very high, the temperature of the material can be raised instantaneously, the workpiece processing efficiency is improved, and the material can be kept at a higher temperature in the cutting process, so that the cutting tool is beneficial to cutting the workpiece.
When the workpiece is heated by laser irradiation and the material of the workpiece is denatured (from brittleness to plastic transformation), the cutter can easily process the workpiece with a specific shape, and the surface morphology and the surface precision of the workpiece can meet the use requirements at the moment of processing. However, in the process that the workpiece is processed and the temperature is reduced to normal temperature, the workpiece can shrink under the action of thermal expansion and contraction, so that the surface morphology, the surface precision and the like of the workpiece are changed, the final morphology of the workpiece is easy to be insufficient for use, the rejection rate is increased, and the manufacturing cost of parts is not facilitated to be reduced.
The applicant has thus proposed a mechanism for combining a tool with a laser, which enables the processing of brittle and hard materials and the obtaining of parts with a surface morphology and a surface precision that meet the requirements of use. The cutter adopts a light-transmitting material, and laser can be focused on a part to be cut of a processed workpiece through the cutter, so that the material of the workpiece only at the processed part of the processed surface is denatured (the ultimate strength of a brittle and hard material is obviously reduced). The laser can promote the brittle-plastic transformation of the material in the processed area, reduce the cutting force, thereby improving the material removal rate, reducing the processing damage, and improving the processing quality and the processing efficiency. The applicant has found that during cutting, the cutting point of the cutting edge of the tool varies due to the variation in the machining profile of the workpiece, rather than the workpiece being cut at all times by a fixed location of the cutting edge. However, the laser can only always penetrate through a certain position of the cutter, namely, the position of the laser penetrating through the cutter is not changed along with the change of the cutting point of the cutting edge, so that the position of the laser on the surface of the workpiece deviates from the cutting point of the cutting edge on the workpiece, the precision of the surface of the cut part is low, the surface morphology is poor, the rejection rate is high, and the use requirement is difficult to meet.
In view of this, referring to fig. 1-10, the present application proposes a cutting mechanism 100, the cutting mechanism 100 including a tool 110 and a laser assembly 120, the tool 110 being capable of cutting a workpiece. In some embodiments, the cutting mechanism 100 further comprises a tool carrier 130, the tool carrier 130 being configured to carry the tool 110 such that the tool 110 can be mounted to the cutting mechanism 100, i.e. in particular embodiments, the tool 110 is located at a tip of the tool carrier 130, which can be in direct contact with and cut a workpiece. The material of the cutter 110 is a light transmissive material, and in one embodiment, the material of the cutter 110 may be a completely transparent material. In another embodiment, the material used for the cutter 110 may also be other light transmissive materials having a color. In some embodiments, the tool 110 may be made of a cemented carbide material having a light transmitting property. In other embodiments, the tool 110 may be made of a transparent crystal material, which may be crystal, diamond, or the like. In one embodiment, the tool carrier 130 is also a light transmissive material. In other embodiments, other non-light transmissive materials may be used for the tool carrier 130. For convenience of description, the cutter 110 made of diamond will be described below as an example.
The tool 110 includes a cutting edge 111 and a zoom curved surface 112, see fig. 1 to 3. The laser assembly 120 is configured to emit laser light 123, and the laser light 123 is capable of penetrating into the tool 110 from the variable focal length curved surface 112. Cutting edge 111 refers to the portion of tool 110 actually used to cut a workpiece. The zoom curve 112 refers to a specially designed curved lens structure that focuses light onto a point, but the location of this point may be varied. By changing the shape and position of the curved surface, the position of the focus point can be changed, thereby realizing the effect of the zoom lens. That is, the zoom curved surface 112 can focus the transmitted laser light 123, so that the focal point of the laser light 123 transmitted through the zoom curved surface 112 can be located at the cutting point of the cutting edge 111. The cutting point may be changed according to the change in the outer shape of the workpiece to be machined. That is, in particular, since the machined surface of the workpiece is not always in one plane or curved surface, it may be a stepped, meandering, rugged surface. The contact position of the cutting edge 111 with the workpiece surface during the machining of the tool 110 varies with the variation of the characteristics of the workpiece surface, and thus the position (i.e., cutting point) where the cutting edge 111 actually plays a cutting role varies.
The following definition is made for "a cutting point where a focus can be located at the cutting edge 111: the distance between the center point of the focus and the center point of the cutting point satisfies:
the focal point is considered to be located at the cutting point, and the focal point and the cutting point may be completely coincident, partially coincident, or spaced apart from each other.
Wherein y represents the distance from the center point of the focus to the center point of the cutting point, in units of: mm.
x 1 Represents a focal characteristic parameter, which is determined by the shape of the spot of the laser and the power of the laser, and the focus of the laser is of many types, e.g. Gaussian laser has a circular spot on a plane, x 1 0-2.3 x 10000.
x 2 Represents a cutting characteristic parameter, which is determined by the nature of the workpiece and the tool properties of the diamond. The properties of the workpiece mainly refer to material properties, material mechanical properties, hardness, fracture toughness, and the like. The diamond cutter characteristics mainly refer to cutter material characteristics, front and back angles of a cutter, blade inclination angles and other relevant parameters. X is x 2 0-2.3 x 1000 is taken and 0 is not taken.
R represents the radius of the cutting edge of the tool, and is usually the radius of the arc of the cutting edge, and R is 0-10.
L represents laser parameters, wherein the laser parameters refer to the properties of laser, namely the power, wavelength, frequency, emission mode and the like of the laser, and L is 0-58.
F represents focusing parameter, which is mainly determined by the medium penetrated in the process of the light path from the starting point to the end point and the comprehensive properties of reflection, refraction, absorption and the like of the laser and the medium, and F takes 0-63.
Alpha, beta and gamma represent spatial relative position parameters, which correspond to the position parameters of the vectors in the x, y and z directions in space respectively. Alpha, beta and gamma are 0-10.
In a preferred embodiment, the focal point and the cut position on the surface of the workpiece may be partially overlapped, and a part of the focal point is overlapped with the cut position, and another part of the focal point is located in front of the cut position (along the movement direction of the cut point), so that the part of the focal point located in front of the cut position may preheat the material to be processed, and the cutter cuts the material after preheating the material, thereby improving the processing efficiency and reducing the processing difficulty of the brittle and hard material.
In one embodiment, the cutting mechanism 100 may be a workpiece moving while the tool 110 is stationary during processing of the workpiece, and the tool 110 may cut the workpiece by changing the position of the workpiece. In another embodiment, the workpiece may be stationary while the tool 110 is moved by changing the position of the tool 110 to cut the surface of the workpiece. In yet another embodiment, the workpiece may be moved, the tool 110 may be moved, and the cutting of the workpiece by the tool 110 may be performed by changing the positional relationship between the two.
In some embodiments, the variable focus curved surface 112 may be located on a side of the tool 110 facing away from the cutting edge 111. In other embodiments, the variable focus curved surface 112 may also be disposed on either side of the tool 110 adjacent to the cutting edge 111. For convenience of description, the zoom curved surface 112 is disposed on a side of the cutter 110 facing away from the cutting edge 111. The laser 123 can be focused on the actual cutting point of the cutting edge 111 through the zoom curved surface 112, so that the focal point of the laser 123 transmitted through the tool 110 can be focused on the workpiece precut. The laser 123 is prevented from being irradiated on other temporary cutting-free positions on the surface of the workpiece, so that the material in the pre-cutting point area of the workpiece is still in the brittle and hard characteristic, and further the cutting position of the workpiece is prevented from being broken, and the yield of the workpiece is influenced.
In some embodiments, the laser assembly 120 is configured to be able to change the path of the laser light 123 emitted therefrom in response to a change in the cutting point of the cutting edge 111, and the variable-focus curved surface 112 is configured to be able to locate the focal point of the laser light 123 at the cutting point of the cutting edge 111 when the path of the laser light 123 is switched. That is, the path of the laser 123 can be changed in real time along with the change of the cutting point of the cutting edge 111, so that the focus of the laser 123 can be always focused on the workpiece pre-cutting point, and the focus of the laser 123 is prevented from deviating from the workpiece pre-cutting point. In one embodiment, the changing of the path of the laser light 123 may be achieved by changing the incident angle of the laser light 123 into the zoom curved surface 112 and ensuring that the incident point of the laser light 123 into the zoom curved surface 112 is unchanged, and the zoom curved surface 112 can focus the laser light 123 with different incident angles at different cutting points at the cutting edge 111. In another embodiment, the change of the path of the laser light 123 may also be achieved by changing the position of the incidence point of the laser light 123 penetrating the zoom curved surface 112, and the zoom curved surface 112 can focus the focus of the laser light 123 penetrating from different incidence points at different cutting points at the cutting edge 111. In yet another embodiment, the change of the path of the laser light 123 may be achieved by changing the position of the incidence point of the laser light 123 on the zoom curved surface 112 and changing the incidence angle of the laser light 123 on the zoom curved surface 112, and the zoom curved surface 112 may be capable of focusing the focal point of the laser light 123 with different incidence angles at different cutting points at the cutting edge 111.
In some embodiments, referring to fig. 4, the cutting edge 111 has a first end 113 and a second end 114 that are oppositely disposed, and for convenience of description, a direction from the first end 113 to the second end 114 is defined as a first direction X. The laser 123 includes an entrance segment 1231 before impinging on the zoom curve 112, and the laser assembly 120 is configured to translate the entrance segment 1231 in the first direction X to effect a change in the path of the laser 123. After the laser 123 translated along the first direction X is incident on the zoom curved surface 112, the zoom curved surface 112 can sequentially focus on the actual cutting point of the cutting edge 111, and the laser 123 can penetrate the cutting edge 111 and irradiate at the workpiece pre-cutting point.
In some embodiments, referring to fig. 6 and 7, the laser assembly 120 includes a laser generating device 121 and a laser adjusting device 122, the laser generating device 121 can be used to generate the laser 123, and the laser adjusting device 122 can be used to change the path of the laser 123. In one embodiment, referring to fig. 7, the laser adjustment device 122 includes a reflective portion 1221, and the laser generating device 121 may be disposed on either side of the reflective portion 1221. For convenience of description, the following description will be given taking an example in which the laser generating device 121 is disposed on a side of the reflecting portion 1221 close to the zoom curved surface 112, and the laser generating device 121 is away from the zoom curved surface 112 in a direction perpendicular to the first direction X. The reflecting portion 1221 is capable of changing the path of the laser light 123 by reflecting the laser light 123, that is, the reflecting portion 1221 is capable of reflecting the laser light 123 having different incident angles and different incident positions to different positions of the zoom curved surface 112, and the zoom curved surface 112 focuses the transmitted laser light 123 on the actual cutting point of the cutting edge 111 to change the path of the laser light 123. In this case, the incident segment 1231 of the laser light 123 is a portion of the laser light 123 between the reflecting portion 1221 and the zoom curved surface 112.
Referring to fig. 6, in another embodiment, the laser adjustment device 122 includes a refraction portion 1222, and the laser generating device 121 may be disposed on a side of the laser adjustment device 122 facing away from the zoom curved surface 112. The laser light 123 can penetrate the refraction portion 1222, and the refraction portion 1222 can refract the laser light 123 with different incident angles and different incident positions to different positions of the zoom curved surface 112, and the zoom curved surface 112 focuses the refracted laser light 123 at the actual cutting point of the cutting edge 111 to change the path of the laser light 123. In this case, the incident segment 1231 of the laser light 123 is a portion of the laser light 123 between the refractive portion 1222 and the zoom curved surface 112. In yet another embodiment, the laser adjustment device 122 may also be used to focus the laser light 123 such that laser light 123 having different incident positions and different incident angles can be focused to the actual cutting point of the cutting edge 111.
In a specific embodiment, the zoom curved surface 112 is disposed on a side of the cutter 110 facing away from the cutting edge 111, the cutting edge 111 has a first end 113 and a second end 114 that are oppositely disposed, and a direction from the first end 113 to the second end 114 is a first direction X. In one embodiment, referring to fig. 7, the reflecting portion 1221 included in the laser adjustment device 122 is configured to be translatable along the first direction X, and the setting position of the laser generating device 121 is unchanged, that is, the incident angle of the laser light 123 is unchanged. When the reflecting portion 1221 translates along the first direction X, since the positions of the laser light 123 incident on the reflecting portion 1221 are different, the laser light 123 can be reflected by the reflecting portion 1221 to different positions of the zoom curved surface 112, so that the zoom curved surface 112 can focus the laser light 123 on the actual cutting point of the cutting edge 111. In another embodiment, the reflecting portion 1221 is further movable along a direction perpendicular to the first direction X to change the position of the laser light 123 incident on the reflecting portion 1221, thereby changing the path of the incident segment 1231 of the laser light 123.
For convenience of description, the following description will be given by taking an example in which the laser light generating device 121 is disposed on a side of the refractive portion 1222 away from the zoom curved surface 112. In some embodiments, referring to fig. 6, the refractive portion 1222 included in the laser adjustment device 122 may be configured to be rotatable about an axis perpendicular to the first direction X, so that an incident angle of the laser light 123 to the refractive portion 1222 may be changed, and thus a path of an incident segment 1231 (a portion of the laser light 123 between the zoom curved surface 112 and the refractive portion 1222) of the laser light 123 refracted by the refractive portion 1222 may be changed. Thereby enabling the variable focus curved surface 112 to focus the laser light 123 at the actual cutting point of the cutting edge 111. In other embodiments, the refractive portion 1222 may also be configured to be rotatable about an axis parallel to the first direction X.
In some embodiments, the laser generating device 121 is disposed on a side of the zoom curved surface 112 facing away from the tool 110, and the laser generating device 121 is configured to be capable of moving to enable the incident position and the incident angle of the laser 123 emitted by the laser generating device to be variable when the laser 123 is incident on the zoom curved surface 112, so that the path of the incident segment 1231 of the laser 123 can be changed, and thus the laser 123 can be focused on the actual cutting point of the cutting edge 111 by the zoom curved surface 112. The laser assembly 120 may not be provided with the laser adjustment device 122.
In some embodiments, the reflective portion 1221 includes a mirror for reflecting the laser light 123, the mirror including a first reflective surface. Specifically, the mirror may be disposed on a side of the zoom curved surface 112 facing away from the cutting edge 111. The laser light generating device 121 may be disposed at one side of the mirror in the first direction X, and the laser light generating device 121 may be capable of emitting the laser light 123 toward the first reflecting surface. In other embodiments, the laser generating device 121 may also be disposed on a side of the mirror that is perpendicular to the first direction X and that is close to the zoom curved surface 112.
In some embodiments, the reflective portion 1221 may include a total reflection prism for reflecting the laser light 123, the total reflection prism including the second reflective surface, and the total reflection prism may be disposed on a side of the zoom curved surface 112 facing away from the cutting edge 111. The laser light generating device 121 may be disposed at one side of the total reflection prism in the first direction X, and it may be capable of reflecting the laser light 123 toward the second reflection surface. By adjusting the positional relationship of the total reflection prism with respect to the zoom curved surface 112, the path of the incident segment 1231 of the laser light 123 (i.e., the portion of the laser light 123 between the zoom curved surface 112 and the total reflection prism) can be changed. It should be noted that, the total reflection prism is a device capable of changing the direction of light, which is made by using the principle of total reflection of light, that is, when the incident angle exceeds a certain angle (critical angle) when light is emitted from an optically dense medium to an optically sparse medium, the refracted light completely disappears, and only the reflected light remains.
In some embodiments, the refraction portion 1222 is disposed on a side of the zoom curved surface 112 away from the cutting edge 111, and the laser light generating device 121 may be disposed on a side of the refraction portion 1222 away from the zoom curved surface 112, so that the laser light 123 emitted by the laser light generating device 121 can penetrate the refraction portion 1222 and be refracted to the zoom curved surface 112 by the refraction portion 1222. When the laser light 123 strikes the zoom curve 112, the zoom curve 112 focuses or diverges the laser light 123 according to its shape and material properties, thereby changing the beam size and propagation direction of the laser light 123. In one embodiment, the zoom curve 112 may be a convex lens or concave lens configuration. In another embodiment, the zoom curve 112 may also be a more complex polyhedral structure. The main function of the zoom curve 112 is to change the direction of propagation of the laser light 123 by focusing or diverging the laser light 123.
In some embodiments, the cutting mechanism 100 further includes a drive configured to drive the cutter 110 in a feed motion. Specifically, the driving part may control the movement of the tool 110 according to the workpiece profile parameters and various preset parameters acquired by the cutting mechanism 100. In one embodiment, to better describe this configuration, a process scenario may be envisaged. In this processing scenario, the workpiece is stationary, and the cutting mechanism 100 is able to acquire the profile parameters of the workpiece as well as the preset parameters. These parameters are output to a driving section, which can precisely control the movement of the tool 110 based on these parameters. Thus, the tool 110 can perform cutting processing on the workpiece, and precise machining can be achieved. In another embodiment, the workpiece may also be moved relative to the tool 110. The cutting mechanism 100 is employed in more advanced machining systems, such as five-axis machining centers and the like. In this case, the cutting mechanism 100 outputs not only the motion parameters of the tool 110 but also the motion parameters of the workpiece. These parameters are supplied together to the driving section, and the driving section drives the tool 110 to perform cutting processing on the workpiece based on these parameters.
In some embodiments, the zoom curved surface 112 is disposed on a side of the tool 110 facing away from the cutting edge 111, and for convenience of description, a direction from the zoom curved surface 112 to the cutting edge 111 is defined as the second direction Y. The cutting mechanism 100 also includes a controller that can be coupled to the drive portion. Specifically, the controller may be a stand alone device or may be part of the cutting mechanism 100. The main function of the controller is to acquire control signals and control the driving part to drive the cutter 110 to move along the second direction Y according to the control signals.
When the controller receives the control signals, the controller can transmit the signals to the driving part. The driving part drives the tool 110 to move in the second direction Y according to the signals, thereby enabling the tool 110 to perform cutting processing on the workpiece. To achieve precise control of the movement of the tool 110 and the cutting process, thereby improving the machining quality and efficiency.
In addition, to better adapt to different processing requirements, the controller may be further configured to automatically adjust the processing parameters such as the moving speed, the feeding speed, etc. of the cutter 110 according to preset parameters or external inputs. Thus, the cutting mechanism 100 can automatically adjust the machining parameters according to the actual machining conditions, so as to better adapt to different machining requirements.
In some embodiments, the feeding of the cutter 110 may also be controlled manually by an operator. The feeding of the tool 110 has the advantage of being simple and easy to operate by manual control, i.e. the manual feeding does not require complex control systems and equipment, reducing the cost of use. The manual feeding is suitable for small-batch or single-piece production, namely, the manual feeding can be quickly adjusted and adapted to different processing requirements, and the production efficiency is improved. The machining precision of the manual feeding is controllable, namely, the machining precision of the manual feeding can be controlled through the skill and experience of operators, and better quality control can be realized on parts needing high-precision machining. The manual feeding can also improve the machining efficiency, namely, the machining rhythm and efficiency can be better mastered by manually controlling the feeding of the cutter 110 by an operator, so that the machining process is optimized, and the overall machining efficiency is improved.
The second aspect of the present invention also provides a cutting system 10, the cutting system 10 comprising a cutting mechanism 100 as described in any of the embodiments above. The drive section is configured to be able to drive the tool 110 for a feed motion, which enables the tool 110 to perform a cutting process on a workpiece. In this process, the driving part ensures the accuracy and stability of the cutting process by precisely controlling the movement of the tool 110. The laser 123 assembly 120 is another important component, which includes a laser generating device 121 and a laser adjustment device 122. The laser generator 121 is used for emitting laser light 123, and the laser regulator 122 is used for adjusting the path and the emitting direction of the laser light 123. The laser assembly 120 is characterized in that it can focus the laser 123 at the cutting point of the cutting edge 111 through the zoom curved surface 112 provided to the tool 110. The position of the focal point of the laser 123 on the surface of the workpiece can be changed along with the change of the actual cutting point of the cutting edge 111, so that the laser 123 can be precisely irradiated on the pre-cutting surface of the workpiece, and the cutter 110 can be used for effectively removing materials from the workpiece, so that the workpiece is prevented from being broken in the processing process.
Specifically, the laser light 123 is emitted from the laser light generating device 121, and is adjusted by the laser light adjusting device 122 so as to be focused on the cutting point of the cutting edge 111 through the zoom curved surface 112. Such focused laser light 123 may be used to cut, melt or cauterize a workpiece, thereby achieving an efficient, high precision cutting process. In addition, the cutting system 10 may also be equipped with sensors and feedback control systems to monitor and adjust the cutting process in real time. For example, the sensors may monitor the position, shape, and material of the workpiece, as well as the wear level and temperature of the tool 110. This information is fed back into the controller for adjusting the operating parameters of the drive and laser assembly 120 to ensure stability and accuracy of the cutting process.
Referring to fig. 6-8, in some embodiments, the cutting system 10 further includes a FTS (fast tool servo) module 200. In one embodiment, FTS module 200 is a stand alone device independent of the machine tool that is based on the principle of machining by driving cutting tool 110 to perform high frequency and preset motions in a preset direction (typically the machine spindle). In one embodiment, FTS module 200 may employ a one-dimensional drive type device, i.e., FTS module 200 drives knife 110 in second direction Y. In another embodiment, FTS module 200 may also employ a two-dimensional drive type device, i.e., FTS module 200 is capable of driving movement of tool 110 in first direction X as well as second direction Y. In yet another embodiment, the FTS module 200 may also employ a piezo-electric drive type device. In yet another embodiment, the FTS module 200 may also employ a coil drive type device. FTS module 200 can function in cutting system 10 as follows:
ensuring the accuracy of the control: by precisely controlling the movement of the tool 110 and other parts, the surface profile accuracy and shape accuracy of the workpiece are finally maintained.
Ensuring the accuracy of the movement of the tool 110: automated control and operation may be achieved. This helps to reduce human intervention and improve the stability and consistency of the production process.
The processing quality is improved: FTS module 200 helps to improve the machining quality of cutting system 10. It can reduce vibration and deformation of the tool 110 during the movement, and avoid error accumulation during the machining process, thereby improving the overall machining quality.
Flexible layout: the design of the layout of the FTS module 200 is flexible and can be customized to the actual needs of the cutting system 10. This enables the FTS module 200 to accommodate a variety of different processing environments and equipment configurations, facilitating integration and expansion of the system.
It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is included in the embodiment of the present invention, the directional indication is merely used to explain a relative positional relationship, a movement condition, and the like between the components in a specific posture, and if the specific posture is changed, the directional indication is correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or", "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B ", including a scheme, or B scheme, or a scheme where a and B meet simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims (10)

1. A cutting mechanism, comprising:
the cutter comprises a cutting edge, wherein the cutter is made of a light-transmitting material and comprises a zooming curved surface;
a laser assembly configured to emit laser light from the variable focal length curved surface into the tool;
the zoom curved surface is configured to focus the transmitted laser light, and the focal point of the laser light transmitted through the zoom curved surface is positioned at a cutting point of the cutting edge.
2. The cutting mechanism of claim 1, wherein,
the zoom curved surface is positioned on one side of the cutter, which is away from the cutting edge.
3. The cutting mechanism of claim 1, wherein,
the laser assembly is further configured to be capable of translating a path of the laser in response to a change in a cutting point of the cutting edge;
the zoom curved surface is configured to enable a focus of the laser to be located at a cutting point of the cutting edge after the path of the laser is switched.
4. The cutting mechanism of claim 1, wherein,
the cutting edge is provided with a first end and a second end which are oppositely arranged, and the direction from the first end to the second end is a first direction;
the laser light includes an incident segment that impinges in front of the zoom curve, and the laser assembly is configured to translate the incident segment in the first direction to alter a path of the laser light.
5. The cutting mechanism of claim 1, wherein,
the laser assembly comprises a laser generating device and a laser adjusting device, wherein the laser generating device is used for generating the laser, and the laser adjusting device is used for changing the path of the laser;
the laser light adjusting device includes a reflecting portion that changes a path of the laser light by reflecting the laser light; and/or the laser adjusting device comprises a refraction part, and the laser light passes through the refraction part and is refracted so as to adjust the path of the laser light.
6. The cutting mechanism of claim 5, wherein,
the zooming curved surface is positioned at one side of the cutter, which is away from the cutting edge;
the cutting edge is provided with a first end and a second end which are oppositely arranged, and the direction from the first end to the second end is a first direction;
the laser light adjusting device includes a reflecting portion that changes a path of the laser light by reflecting the laser light, the reflecting portion being configured to shift the path of the laser light by translating in the first direction so as to translate the laser light in the first direction; alternatively, the laser light adjusting device includes a refraction portion that changes a path of the laser light by refracting the laser light, the refraction portion being configured to rotate about an axis perpendicular to the first direction to change the path of the laser light so as to translate the laser light in the first direction.
7. The cutting mechanism of claim 6, wherein,
the laser adjusting device comprises a reflecting part, the reflecting part comprises a reflecting mirror for reflecting the laser, the reflecting mirror comprises a first reflecting surface, the reflecting mirror is arranged on one side of the zooming curved surface, which is away from the cutting edge, and the laser generating device is arranged on one side of the reflecting mirror along the first direction and emits the laser towards the first reflecting surface;
or alternatively;
the laser adjusting device comprises a reflecting part, the reflecting part comprises a total reflection prism used for reflecting the laser, the total reflection prism comprises a second reflecting surface, the total reflection prism is arranged on one side of the zoom curved surface, which is away from the cutting edge, and the laser generating device is arranged on one side of the total reflection prism along the first direction and emits the laser towards the second reflecting surface;
or alternatively;
the laser adjusting device comprises a refraction part, the refraction part is arranged on one side of the zooming curved surface, which is away from the cutting edge, the laser generating device is arranged on one side of the refraction part, which is away from the zooming curved surface, and the laser emitted by the laser generating device passes through the refraction part to the zooming curved surface.
8. The cutting mechanism of claim 1, wherein,
the cutting mechanism further includes a drive portion configured to drive the cutter in a feed motion.
9. The cutting mechanism of claim 8, wherein,
the zooming curved surface is positioned on one side of the cutter, which is away from the cutting edge, and the direction from the zooming curved surface to the cutting edge is a second direction;
the cutting mechanism further includes a controller coupled to the drive portion, the controller configured to acquire a control signal and control the drive portion to drive the tool to translate in a second direction in accordance with the control signal.
10. A cutting system comprising the cutting mechanism of any one of claims 1-9.
CN202410094587.0A 2024-01-23 2024-01-23 Cutting mechanism and cutting system Pending CN117799072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410094587.0A CN117799072A (en) 2024-01-23 2024-01-23 Cutting mechanism and cutting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410094587.0A CN117799072A (en) 2024-01-23 2024-01-23 Cutting mechanism and cutting system

Publications (1)

Publication Number Publication Date
CN117799072A true CN117799072A (en) 2024-04-02

Family

ID=90432279

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410094587.0A Pending CN117799072A (en) 2024-01-23 2024-01-23 Cutting mechanism and cutting system

Country Status (1)

Country Link
CN (1) CN117799072A (en)

Similar Documents

Publication Publication Date Title
CN108463309B (en) Laser emitting tool
US11292082B2 (en) Method of laser processing of a metallic material with high dynamic control of the movement axes of the laser beam along a predetermined processing path, as well as a machine and a computer program for the implementation of said method
US8497451B2 (en) Brittle nonmetallic workpiece and method and device for making same
CN111347571A (en) Laser-assisted low-damage cutting machining system and method for optical hard and brittle material
TWI714791B (en) A method of laser processing of a metallic material, and a machine and computer program for the implementation of said method
KR101547806B1 (en) Device for processing brittle substrate using aspherical lens having multi focus
TWI714794B (en) A method of laser processing of a metallic material, and a machine and computer program for the implementation of said method
CN105081586A (en) Laser processing method and device
CN101961817A (en) Optical system and laser processing device
EP2716397A1 (en) Laser working head, laser working device, optical system for laser working device, laser working method, and laser focusing method
US10549382B2 (en) Laser-assisted micromachining systems and methods
JP2008503355A (en) Substrate material cutting, dividing or dividing apparatus, system and method
CN112475638B (en) Laser micropore machining system and method based on axicon lens
CN101903128A (en) Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
KR20170048969A (en) Laser processing method and laser processing apparatus using multi focusing
KR102375235B1 (en) Laser processing system and laser processing method
CN117799072A (en) Cutting mechanism and cutting system
CN117900644A (en) Cutting mechanism and cutting system
CN117799073A (en) Cutting mechanism and cutting system
CN117817858A (en) Cutting mechanism and cutting system
CN117799074A (en) Cutting mechanism and cutting system
RU2283738C1 (en) Device for laser working
TWI649147B (en) A laser-transmitting machining tool and a system and a method for machining a workpiece with such tool
JP2021142546A (en) Optical unit, laser beam machining apparatus and laser beam machining method
SU1738559A1 (en) Device for laser treatment of materials

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination