CN117799074A

CN117799074A - Cutting mechanism and cutting system

Info

Publication number: CN117799074A
Application number: CN202410094732.5A
Authority: CN
Inventors: 周晓勤; 郭列维; 王超; 张翔; 殷麟皓; 蒋波; 王荣奇
Original assignee: Jilin University
Current assignee: Jilin University
Priority date: 2024-01-23
Filing date: 2024-01-23
Publication date: 2024-04-02

Abstract

The invention discloses a cutting mechanism and a cutting system. The drive assembly is capable of driving the cutter to move in a first direction. In the process of moving the cutter along the first direction, the structures such as the laser component, the galvanometer component and the like can not limit the movement stroke of the cutter, and the machining range of the cutting mechanism is improved. The controller can control the vibrating mirror assembly to move according to the position change of the cutting point of the cutting edge and the position change of the cutter, so that the track of the reflected laser is changed, and the state that the reflected laser always irradiates the cutting point of the cutting edge is maintained. The laser which is transmitted out of the cutting point of the cutting edge can irradiate the cut position of the workpiece, so that the material property of the position to be cut of the workpiece is changed, the cutting force of the material is reduced, the material removal rate is improved, the processing damage is reduced, and the processing quality of the cutting mechanism is improved.

Description

Cutting mechanism and cutting system

Technical Field

The invention relates to the field of optical part manufacturing equipment, in particular to a cutting mechanism and a cutting system.

Background

The manufacture of optical parts is mainly divided into two types, namely a plane (rotationally symmetric part) and a free-form surface (non-rotationally symmetric part) according to the final forming structure of the parts. The workability of parts is divided into two types, plastic easily-workable materials and hard brittle difficult-to-work materials. For plastic and easily processed (plane and free-form surfaces), and brittle and difficult-to-process plane parts. Related processing methods can be realized at present. However, for brittle free-form surface parts, no good processing method is available at present to perform processing under the condition of ensuring processing efficiency, morphology precision, surface quality and subsurface quality. In short, the existing processing methods are either not available or are of poor quality.

The planar part has a simple structure, and the surface morphology and the surface precision meeting the requirements can be obtained by adopting a common processing method. The non-rotationally symmetrical part mainly refers to a part comprising a free-form surface. Or the parts comprise micro grooves, micro lenses, micro prisms and micro mirror arrays. Because the free-form surface part has irregular shape and smaller size, the free-form surface part cannot be manufactured by a common processing technology, and the problem of ensuring the shape precision and the surface quality precision in the processing process is solved.

The traditional processing methods of free-form surfaces and microarrays mainly comprise the following steps: grinding and polishing process, additive forming process, milling process, special machining process (electron beam, ion beam), photoetching process and quick and slow cutter servo process. The product quality (morphology precision and surface quality precision) after processing is ranked according to the height, and the photoetching technology has the highest precision and the best effect on micro-size processing. However, the processing technology has high threshold, complex equipment and high cost. Grinding and polishing processes, additive forming processes, milling processes and special processing processes (electron beams and ion beams) have general process thresholds, general equipment and equipment, general cost and lower product quality. The quick tool servo process can ensure the shape accuracy, the surface quality and the subsurface quality under the condition of ensuring the production period and lower production cost.

For the traditional quick cutter servo system, if the material characteristics of the processed workpiece are good, the formability and the machinability are good, namely the material in the traditional sense is softer and suitable for cutting. The free-form surface or the product quality of the microarray system after the processing of the workpiece is completed is ideal. However, for some brittle and hard material workpieces such as silicon wafers, fused quartz and silicon carbide, the formability and machinability of the workpiece are poor, and in the processing process, the cutting is broken irregularly, the material removal is incoherent, and the product quality is difficult to control.

The brittle free-form surface parts are difficult to process, and are just key optical parts applied to optical and national defense equipment. Such as lithography machine mirrors, chip micro-electronic lenses, missile fairings, etc.

Disclosure of Invention

The invention mainly aims to provide a cutting mechanism and a cutting system, which aim at solving the technical problem of how to improve the processing quality of brittle and hard materials.

In order to achieve the above object, the present invention provides a cutting mechanism comprising:

the cutting tool is provided with a cutting edge along one side of a first direction, the material of the cutting tool is light-transmitting material, the side wall of one side of the cutting tool along a second direction is an incident wall, and the second direction is perpendicular to the first direction;

A drive assembly coupled to the cutter and configured to drive the cutter to move in the first direction;

the laser component is used for generating emergent laser;

the galvanometer assembly is used for reflecting the emergent laser to form reflected laser, and the reflected laser penetrates through the incident wall and irradiates the cutting point of the cutting edge;

and the controller is configured to control the galvanometer assembly to change the track of the reflected laser according to the position change of the cutting point of the cutting edge and the position change of the cutter so as to maintain the cutting point of the cutting edge irradiated by the reflected laser.

In some embodiments, the controller further controls the drive assembly to drive the cutter to move in a second direction.

In some embodiments, the tool has a positioning wall for mounting positioning of the tool, the incident wall being arranged opposite the positioning wall in the second direction.

In some embodiments, the tool has a locating wall for mounting location of the tool, the incident wall being disposed adjacent to the locating wall.

In some embodiments, the galvanometer assembly is disposed opposite the laser assembly in the first direction and the galvanometer assembly is disposed opposite the cutter in the second direction.

In some embodiments, the galvanometer assembly includes a first mirror configured to rotate about a first axis and a second axis, the first axis intersecting the second axis, the outgoing laser light being reflected by the first mirror to form the reflected laser light.

In some embodiments, the galvanometer assembly includes a first mirror configured to rotate about a first axis and a second mirror configured to rotate about a second axis, the first axis intersecting the second axis, the outgoing laser light reflected off the first mirror to the second mirror and off the second mirror and forming the reflected laser light.

In some embodiments, the first axis is perpendicular to the first direction and the second direction, and the second axis is parallel to the second direction.

In some embodiments, the cutting mechanism further comprises a monitoring assembly for monitoring the position of the cutting point and communicating the position of the cutting point to the controller, the controller controlling the galvanometer assembly in accordance with the position of the cutting point;

Or alternatively;

the cutting mechanism further includes a monitoring assembly for monitoring the position of the tool and communicating the position of the tool to the controller, which controls the galvanometer assembly in accordance with the position of the tool.

The second aspect of the invention also provides a chip system, characterized by comprising a chip mechanism according to any of the above embodiments.

Compared with the prior art, the invention has the beneficial effects that:

in the technical scheme of the invention, the cutting mechanism comprises a cutter, a driving assembly, a laser assembly, a galvanometer assembly and a controller. One side of the cutter along the first direction is provided with a cutting edge, and the cutter is made of transparent materials. The laser generated by the laser component can penetrate into the cutter and irradiate the cutting point of the cutting edge, and the cutting edge is penetrated out and irradiated to the cut position of the workpiece, so that the property of the material at the position to be cut of the workpiece is changed, the cutting force of the material is reduced, the removal rate of the material is improved, the processing damage is reduced, and the processing quality of the cutting mechanism is further improved. Compared with the prior art, after the workpiece is denatured by laser irradiation in advance, the workpiece is cut, and the laser irradiation is adopted to irradiate the workpiece in real time along with the cutting work, so that the processing effect of the workpiece is better.

The side wall of one side of the cutter along the second direction is an incident wall, wherein the second direction is perpendicular to the first direction. The outgoing laser generated by the laser component is reflected by the vibrating mirror component to form reflected laser, and the reflected laser penetrates into the cutter through the incidence wall and irradiates the cutting point of the cutting edge. Compared with the prior art, the cutter is perforated so that laser irradiates on a workpiece, namely, compared with the case that structures such as a device for emitting laser are arranged in the movement direction of the cutter, in the scheme, the laser penetrates into the cutter from the incidence wall and irradiates on the cutting point of the cutting edge, and in the process that the driving assembly drives the cutter to move along the first direction, the movement stroke of the cutter cannot be limited by the mechanisms such as the laser assembly, the galvanometer assembly and the like, so that the processing range of the cutting mechanism is effectively improved.

The controller is configured to control the galvanometer assembly to move according to the position change of the cutting point of the cutting edge and the position change of the cutter, so that the track of the reflected laser is changed. In comparison with the related art, laser light irradiates the workpiece in its entirety in advance, or a cutter punches holes so that the laser light irradiates the surface of the workpiece. In the scheme, the vibrating mirror assembly can enable the reflected laser to maintain the state of always irradiating the cutting point of the cutting edge, namely, the track of the reflected laser can correspondingly change along with the change of the position of the cutting point of the cutting edge, so that the laser only irradiates the cut position of the workpiece. In addition, the scheme can ensure that the depth of laser irradiation on the workpiece is matched with the thickness of the removed material layer, so that the workpiece is prevented from being ablated, the surface of the finished product is prevented from being damaged too much, and the like. In addition, the controller and the vibrating mirror assembly, the driving assembly and other mechanisms form information interaction, so that a control closed loop is realized, and the automation degree of the cutting system is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a cutter according to an embodiment of the present invention;

FIG. 2 is a schematic view of a tool according to another embodiment of the invention;

FIG. 3 is a schematic view of a second view of a tool according to another embodiment of the invention;

FIG. 4 is an enlarged view of a portion A of FIG. 3 of a tool according to another embodiment of the invention;

FIG. 5 is a schematic view showing a structure of a tool assembled on a tool carrier according to an embodiment of the invention;

FIG. 6 is a schematic diagram illustrating the operation of a cutting system according to an embodiment of the present invention; wherein the laser adjusting device comprises a refraction part;

FIG. 7 is a schematic diagram illustrating operation of a cutting system according to yet another embodiment of the present invention; wherein the laser adjusting device comprises a reflecting part;

FIG. 8 is a schematic diagram of a cutting system, cutting mechanism, and FTS module according to an embodiment of the present invention;

FIG. 9 is a schematic view of a laser penetration tool cutting point in accordance with one embodiment of the present invention; the laser has a first incidence position on the zooming curved surface, and the zooming curved surface enables the laser penetrated from the first incidence position to be focused on a first cutting point of the cutting edge;

FIG. 10 is a schematic view of a laser penetration tool cutting point according to another embodiment of the present invention; the laser has a second incidence position on the zooming curved surface, and the zooming curved surface enables the laser penetrated from the second incidence position to be focused on a second cutting point of the cutting edge; the first incident point and the second incident point are distributed along the second direction, the laser incident on the zoom curved surface can be focused on the cutting point of the cutting edge of the cutter under the action of the zoom curved surface, and the shape of the cutting edge is distributed in the three-dimensional space;

FIG. 11 is a schematic diagram illustrating the operation of a cutting system according to an embodiment of the present invention; the vibrating mirror assembly comprises a first reflecting mirror, the first reflecting mirror can rotate around a first axis and a second axis, the first axis is perpendicular to a first direction and a second direction, and the second axis is parallel to the second direction;

FIG. 12 is a schematic diagram illustrating the operation of a cutting system according to an embodiment of the present invention; wherein the galvanometer assembly comprises a first reflector and a second reflector, the first reflector can rotate around a first axis, and the second reflector can rotate around a second axis

FIG. 13 is a schematic diagram illustrating operation of a cutting system according to an embodiment of the present invention; wherein the positioning wall is arranged adjacent to the incident wall.

Reference numerals illustrate:

10-a cutting system;

100-a cutting mechanism;

110-a cutter; 111-cutting edges; 112-a zoom curve; 113-a first end; 114-a second end; 115-incident wall; 116-positioning walls;

120-a laser assembly; 121-a laser generating device; 122-laser adjustment device; 1221-a reflective part;

1222-a refractive portion; 123-laser; 1231-entrance section; 1232-emitting laser light; 1233-reflecting laser light;

130-a cutter carrier;

140-a drive assembly;

150-vibrating mirror assembly; 151-a first mirror; 152-a second mirror;

160-a controller;

a 200-FTS module;

x-a first direction; y-second direction.

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the process of manufacturing non-planar optical parts, because of the irregular shape and small size of the non-planar parts, a fast tool servo system is generally adopted to process the parts. After the traditional rapid tool servo system processes a workpiece with excellent material characteristics, formability and machinability, a part with the surface morphology and the surface precision meeting the product use requirements can be obtained. However, for materials with high hardness, high brittleness and low fracture toughness, the elastic limit and the strength are very close, and the characteristics result in that when certain external force is applied to the materials, the materials are not easy to deform, but when the external force reaches a certain degree, the stress part of the parts made of the materials suddenly breaks, and no obvious plastic deformation exists when the parts break. The existence of the characteristics causes irregular breakage of the workpiece in the cutting process, material removal is incoherent, and finally, the surface morphology and surface precision of the processed part are difficult to meet the use requirement of a product, and the quality of the product is difficult to control.

The applicant has found that when a laser beam is applied to the surface of a brittle material, its energy is absorbed and converted into thermal energy, causing the surface of the material to heat rapidly. With the rise of temperature, the moisture and gas on the surface of the material are evaporated to form a layer of vapor film, and the vapor film can effectively prevent heat conduction, so that the heat in the material cannot diffuse to the surface, and high temperature is formed in the material. At high temperatures, the strength and hardness of the brittle and hard material decreases, making it easier to cut. Meanwhile, the energy density of the laser beam is very high, the temperature of the material can be raised instantaneously, the workpiece processing efficiency is improved, and the material can be kept at a higher temperature in the cutting process, so that the cutting tool is beneficial to cutting the workpiece.

When the workpiece is heated by laser irradiation and the material of the workpiece is denatured (from brittleness to plastic transformation), the cutter can easily process the workpiece with a specific shape, and the surface morphology and the surface precision of the workpiece can meet the use requirements at the moment of processing. However, in the process that the workpiece is processed and the temperature is reduced to normal temperature, the workpiece can shrink under the action of thermal expansion and contraction, so that the surface morphology, the surface precision and the like of the workpiece are changed, the final morphology of the workpiece is easy to be insufficient for use, the rejection rate is increased, and the manufacturing cost of parts is not facilitated to be reduced.

The applicant has thus proposed a mechanism for combining a tool with a laser, which enables the processing of brittle and hard materials and the obtaining of parts with a surface morphology and a surface precision that meet the requirements of use. The cutter adopts a light-transmitting material, and laser can be focused on a part to be cut of a processed workpiece through the cutter, so that the material of the workpiece only at the processed part of the processed surface is denatured (the ultimate strength of a brittle and hard material is obviously reduced). The laser can promote the brittle-plastic transformation of the material in the processed area, reduce the cutting force, thereby improving the material removal rate, reducing the processing damage, and improving the processing quality and the processing efficiency. The applicant has found that during cutting, the cutting point of the cutting edge of the tool varies due to the variation in the machining profile of the workpiece, rather than the workpiece being cut at all times by a fixed location of the cutting edge. However, the laser can only always penetrate through a certain position of the cutter, namely, the position of the laser penetrating through the cutter is not changed along with the change of the cutting point of the cutting edge, so that the position of the laser on the surface of the workpiece deviates from the cutting point of the cutting edge on the workpiece, the precision of the surface of the cut part is low, the surface morphology is poor, the rejection rate is high, and the use requirement is difficult to meet.

In view of this, referring to fig. 1-10, the present application proposes a cutting mechanism 100, the cutting mechanism 100 including a tool 110 and a laser assembly 120, the tool 110 being capable of cutting a workpiece. In some embodiments, the cutting mechanism 100 further comprises a tool carrier 130, the tool carrier 130 being configured to carry the tool 110 such that the tool 110 can be mounted to the cutting mechanism 100, i.e. in particular embodiments, the tool 110 is located at a tip of the tool carrier 130, which can be in direct contact with and cut a workpiece. The material of the cutter 110 is a light transmissive material, and in one embodiment, the material of the cutter 110 may be a completely transparent material. In another embodiment, the material used for the cutter 110 may also be other light transmissive materials having a color. In some embodiments, the tool 110 may be made of a cemented carbide material having a light transmitting property. In other embodiments, the tool 110 may be made of a transparent crystal material, which may be crystal, diamond, or the like. In one embodiment, the tool carrier 130 is also a light transmissive material. In other embodiments, other non-light transmissive materials may be used for the tool carrier 130. For convenience of description, the cutter 110 made of diamond will be described below as an example.

The tool 110 includes a cutting edge 111 and a zoom curved surface 112, see fig. 1 to 3. The laser assembly 120 is configured to emit laser light 123, and the laser light 123 is capable of penetrating into the tool 110 from the variable focal length curved surface 112. Cutting edge 111 refers to the portion of tool 110 actually used to cut a workpiece. The zoom curve 112 refers to a specially designed curved lens structure that focuses light onto a point, but the location of this point may be varied. By changing the shape and position of the curved surface, the position of the focus point can be changed, thereby realizing the effect of the zoom lens. That is, the zoom curved surface 112 can focus the transmitted laser light 123, so that the focal point of the laser light 123 transmitted through the zoom curved surface 112 can be located at the cutting point of the cutting edge 111. The cutting point may be changed according to the change in the outer shape of the workpiece to be machined. That is, in particular, since the machined surface of the workpiece is not always in one plane or curved surface, it may be a stepped, meandering, rugged surface. The contact position of the cutting edge 111 with the workpiece surface during the machining of the tool 110 varies with the variation of the characteristics of the workpiece surface, and thus the position (i.e., cutting point) where the cutting edge 111 actually plays a cutting role varies.

The following definition is made for "a cutting point where a focus can be located at the cutting edge 111: the distance between the center point of the focus and the center point of the cutting point satisfies:

the focal point is considered to be located at the cutting point, and the focal point and the cutting point may be completely coincident, partially coincident, or spaced apart from each other.

Wherein y represents the distance from the center point of the focus to the center point of the cutting point, in units of: mm.

x ₁ Represents a focal characteristic parameter, which is determined by the shape of the spot of the laser and the power of the laser, and the focus of the laser is of many types, e.g. Gaussian laser has a circular spot on a plane, x ₁ 0-2.3 x 10000.

x ₂ Represents a cutting characteristic parameter, which is determined by the nature of the workpiece and the tool properties of the diamond. The properties of the workpiece are mainly material properties, material mechanical properties, hardness,Fracture toughness, and the like. The diamond cutter characteristics mainly refer to cutter material characteristics, front and back angles of a cutter, blade inclination angles and other relevant parameters. X is x ₂ 0-2.3 x 1000 is taken and 0 is not taken.

R represents the radius of the cutting edge of the tool, and is usually the radius of the arc of the cutting edge, and R is 0-10.

L represents laser parameters, wherein the laser parameters refer to the properties of laser, namely the power, wavelength, frequency, emission mode and the like of the laser, and L is 0-58.

F represents focusing parameter, which is mainly determined by the medium penetrated in the process of the light path from the starting point to the end point and the comprehensive properties of reflection, refraction, absorption and the like of the laser and the medium, and F takes 0-63.

Alpha, beta and gamma represent spatial relative position parameters, which correspond to the position parameters of the vectors in the x, y and z directions in space respectively. Alpha, beta and gamma are 0-10.

In a preferred embodiment, the focal point and the cut position on the surface of the workpiece may be partially overlapped, and a part of the focal point is overlapped with the cut position, and another part of the focal point is located in front of the cut position (along the movement direction of the cut point), so that the part of the focal point located in front of the cut position may preheat the material to be processed, and the cutter cuts the material after preheating the material, thereby improving the processing efficiency and reducing the processing difficulty of the brittle and hard material.

In one embodiment, the cutting mechanism 100 may be a workpiece moving while the tool 110 is stationary during processing of the workpiece, and the tool 110 may cut the workpiece by changing the position of the workpiece. In another embodiment, the workpiece may be stationary while the tool 110 is moved by changing the position of the tool 110 to cut the surface of the workpiece. In yet another embodiment, the workpiece may be moved, the tool 110 may be moved, and the cutting of the workpiece by the tool 110 may be performed by changing the positional relationship between the two.

In some embodiments, the variable focus curved surface 112 may be located on a side of the tool 110 facing away from the cutting edge 111. In other embodiments, the variable focus curved surface 112 may also be disposed on either side of the tool 110 adjacent to the cutting edge 111. For convenience of description, the zoom curved surface 112 is disposed on a side of the cutter 110 facing away from the cutting edge 111. The laser 123 can be focused on the actual cutting point of the cutting edge 111 through the zoom curved surface 112, so that the focal point of the laser 123 transmitted through the tool 110 can be focused on the workpiece precut. The laser 123 is prevented from being irradiated on other temporary cutting-free positions on the surface of the workpiece, so that the material in the pre-cutting point area of the workpiece is still in the brittle and hard characteristic, and further the cutting position of the workpiece is prevented from being broken, and the yield of the workpiece is influenced.

In some embodiments, the laser assembly 120 is configured to be able to change the path of the laser light 123 emitted therefrom in response to a change in the cutting point of the cutting edge 111, and the variable-focus curved surface 112 is configured to be able to locate the focal point of the laser light 123 at the cutting point of the cutting edge 111 when the path of the laser light 123 is switched. That is, the path of the laser 123 can be changed in real time along with the change of the cutting point of the cutting edge 111, so that the focus of the laser 123 can be always focused on the workpiece pre-cutting point, and the focus of the laser 123 is prevented from deviating from the workpiece pre-cutting point. In one embodiment, the changing of the path of the laser light 123 may be achieved by changing the incident angle of the laser light 123 into the zoom curved surface 112 and ensuring that the incident point of the laser light 123 into the zoom curved surface 112 is unchanged, and the zoom curved surface 112 can focus the laser light 123 with different incident angles at different cutting points at the cutting edge 111. In another embodiment, the change of the path of the laser light 123 may also be achieved by changing the position of the incidence point of the laser light 123 penetrating the zoom curved surface 112, and the zoom curved surface 112 can focus the focus of the laser light 123 penetrating from different incidence points at different cutting points at the cutting edge 111. In yet another embodiment, the change of the path of the laser light 123 may be achieved by changing the position of the incidence point of the laser light 123 on the zoom curved surface 112 and changing the incidence angle of the laser light 123 on the zoom curved surface 112, and the zoom curved surface 112 may be capable of focusing the focal point of the laser light 123 with different incidence angles at different cutting points at the cutting edge 111.

In some embodiments, referring to fig. 4, the cutting edge 111 has a first end 113 and a second end 114 that are oppositely disposed, and for convenience of description, a direction from the first end 113 to the second end 114 is defined as a second direction Y. The laser 123 includes an entrance segment 1231 before impinging on the zoom curve 112, and the laser assembly 120 is configured to translate the entrance segment 1231 in the second direction Y to effect a change in the path of the laser 123. After the laser 123 translated along the second direction Y is incident on the zoom curved surface 112, the zoom curved surface 112 can sequentially focus on the actual cutting point of the cutting edge 111, and the laser 123 can penetrate the cutting edge 111 and irradiate at the workpiece pre-cutting point.

In some embodiments, referring to fig. 6 and 7, the laser assembly 120 includes a laser generating device 121 and a laser adjusting device 122, the laser generating device 121 can be used to generate the laser 123, and the laser adjusting device 122 can be used to change the path of the laser 123. In one embodiment, referring to fig. 7, the laser adjustment device 122 includes a reflective portion 1221, and the laser generating device 121 may be disposed on either side of the reflective portion 1221. For convenience of description, the following description will be given taking an example in which the laser generating device 121 is disposed on a side of the reflecting portion 1221 close to the zoom curved surface 112, and the laser generating device 121 is away from the zoom curved surface 112 in a direction perpendicular to the second direction Y. The reflecting portion 1221 is capable of changing the path of the laser light 123 by reflecting the laser light 123, that is, the reflecting portion 1221 is capable of reflecting the laser light 123 having different incident angles and different incident positions to different positions of the zoom curved surface 112, and the zoom curved surface 112 focuses the transmitted laser light 123 on the actual cutting point of the cutting edge 111 to change the path of the laser light 123. In this case, the incident segment 1231 of the laser light 123 is a portion of the laser light 123 between the reflecting portion 1221 and the zoom curved surface 112.

Referring to fig. 6, in another embodiment, the laser adjustment device 122 includes a refraction portion 1222, and the laser generating device 121 may be disposed on a side of the laser adjustment device 122 facing away from the zoom curved surface 112. The laser light 123 can penetrate the refraction portion 1222, and the refraction portion 1222 can refract the laser light 123 with different incident angles and different incident positions to different positions of the zoom curved surface 112, and the zoom curved surface 112 focuses the refracted laser light 123 at the actual cutting point of the cutting edge 111 to change the path of the laser light 123. In this case, the incident segment 1231 of the laser light 123 is a portion of the laser light 123 between the refractive portion 1222 and the zoom curved surface 112. In yet another embodiment, the laser adjustment device 122 may also be used to focus the laser light 123 such that laser light 123 having different incident positions and different incident angles can be focused to the actual cutting point of the cutting edge 111.

In a specific embodiment, the zoom curved surface 112 is disposed on a side of the cutter 110 facing away from the cutting edge 111, the cutting edge 111 has a first end 113 and a second end 114 that are oppositely disposed, and a direction from the first end 113 to the second end 114 is a second direction Y. In one embodiment, referring to fig. 7, the reflecting portion 1221 included in the laser adjustment device 122 is configured to be translatable along the second direction Y, and the setting position of the laser generating device 121 is unchanged, that is, the incident angle of the laser light 123 is unchanged. When the reflecting portion 1221 translates along the second direction Y, since the positions of the laser light 123 incident on the reflecting portion 1221 are different, the laser light 123 can be reflected by the reflecting portion 1221 to different positions of the zoom curved surface 112, so that the zoom curved surface 112 can focus the laser light 123 on the actual cutting point of the cutting edge 111. In another embodiment, the reflecting portion 1221 is further movable along a direction perpendicular to the second direction Y to change the position of the laser light 123 incident on the reflecting portion 1221, thereby changing the path of the incident segment 1231 of the laser light 123.

For convenience of description, the following description will be given by taking an example in which the laser light generating device 121 is disposed on a side of the refractive portion 1222 away from the zoom curved surface 112. In some embodiments, referring to fig. 6, the refractive portion 1222 included in the laser adjustment device 122 may be configured to be rotatable about an axis perpendicular to the second direction Y, so that an incident angle of the laser light 123 to the refractive portion 1222 may be changed, and thus a path of an incident segment 1231 (a portion of the laser light 123 between the zoom curved surface 112 and the refractive portion 1222) of the laser light 123 refracted by the refractive portion 1222 may be changed. Thereby enabling the variable focus curved surface 112 to focus the laser light 123 at the actual cutting point of the cutting edge 111. In other embodiments, the refractive portion 1222 may also be configured to be rotatable about an axis parallel to the second direction Y.

In some embodiments, the laser generating device 121 is disposed on a side of the zoom curved surface 112 facing away from the tool 110, and the laser generating device 121 is configured to be capable of moving to enable the incident position and the incident angle of the laser 123 emitted by the laser generating device to be variable when the laser 123 is incident on the zoom curved surface 112, so that the path of the incident segment 1231 of the laser 123 can be changed, and thus the laser 123 can be focused on the actual cutting point of the cutting edge 111 by the zoom curved surface 112. The laser assembly 120 may not be provided with the laser adjustment device 122.

In some embodiments, the reflective portion 1221 includes a mirror for reflecting the laser light 123, the mirror including a first reflective surface. Specifically, the mirror may be disposed on a side of the zoom curved surface 112 facing away from the cutting edge 111. The laser light generating device 121 may be disposed at one side of the mirror in the second direction Y, and the laser light generating device 121 may be capable of emitting the laser light 123 toward the first reflecting surface. In other embodiments, the laser generating device 121 may be further disposed at a side perpendicular to the second direction Y and the mirror is close to the zoom curved surface 112.

In some embodiments, the reflective portion 1221 may include a total reflection prism for reflecting the laser light 123, the total reflection prism including the second reflective surface, and the total reflection prism may be disposed on a side of the zoom curved surface 112 facing away from the cutting edge 111. The laser light generating device 121 may be disposed at one side of the total reflection prism in the second direction Y, and it may be capable of reflecting the laser light 123 toward the second reflection surface. By adjusting the positional relationship of the total reflection prism with respect to the zoom curved surface 112, the path of the incident segment 1231 of the laser light 123 (i.e., the portion of the laser light 123 between the zoom curved surface 112 and the total reflection prism) can be changed. It should be noted that, the total reflection prism is a device capable of changing the direction of light, which is made by using the principle of total reflection of light, that is, when the incident angle exceeds a certain angle (critical angle) when light is emitted from an optically dense medium to an optically sparse medium, the refracted light completely disappears, and only the reflected light remains.

In some embodiments, the refraction portion 1222 is disposed on a side of the zoom curved surface 112 away from the cutting edge 111, and the laser light generating device 121 may be disposed on a side of the refraction portion 1222 away from the zoom curved surface 112, so that the laser light 123 emitted by the laser light generating device 121 can penetrate the refraction portion 1222 and be refracted to the zoom curved surface 112 by the refraction portion 1222. When the laser light 123 strikes the zoom curve 112, the zoom curve 112 focuses or diverges the laser light 123 according to its shape and material properties, thereby changing the beam size and propagation direction of the laser light 123. In one embodiment, the zoom curve 112 may be a convex lens or concave lens configuration. In another embodiment, the zoom curve 112 may also be a more complex polyhedral structure. The main function of the zoom curve 112 is to change the direction of propagation of the laser light 123 by focusing or diverging the laser light 123.

In some embodiments, the cutting mechanism 100 further includes a drive configured to drive the cutter 110 in a feed motion. Specifically, the driving part may control the movement of the tool 110 according to the workpiece profile parameters and various preset parameters acquired by the cutting mechanism 100. In one embodiment, to better describe this configuration, a process scenario may be envisaged. In this processing scenario, the workpiece is stationary, and the cutting mechanism 100 is able to acquire the profile parameters of the workpiece as well as the preset parameters. These parameters are output to a driving section, which can precisely control the movement of the tool 110 based on these parameters. Thus, the tool 110 can perform cutting processing on the workpiece, and precise machining can be achieved. In another embodiment, the workpiece may also be moved relative to the tool 110. The cutting mechanism 100 is employed in more advanced machining systems, such as five-axis machining centers and the like. In this case, the cutting mechanism 100 outputs not only the motion parameters of the tool 110 but also the motion parameters of the workpiece. These parameters are supplied together to the driving section, and the driving section drives the tool 110 to perform cutting processing on the workpiece based on these parameters.

In some embodiments, the zoom curved surface 112 is disposed on a side of the tool 110 facing away from the cutting edge 111, and for convenience of description, a direction from the zoom curved surface 112 to the cutting edge 111 is defined as a first direction X. The cutting mechanism 100 also includes a controller that can be coupled to the drive portion. Specifically, the controller may be a stand alone device or may be part of the cutting mechanism 100. The main function of the controller is to acquire control signals and control the driving part to drive the tool 110 to move in the first direction X according to the control signals.

When the controller receives the control signals, the controller can transmit the signals to the driving part. The driving part drives the tool 110 to move in the first direction X according to these signals, thereby enabling the tool 110 to perform cutting processing on a workpiece. To achieve precise control of the movement of the tool 110 and the cutting process, thereby improving the machining quality and efficiency.

In addition, to better adapt to different processing requirements, the controller may be further configured to automatically adjust the processing parameters such as the moving speed, the feeding speed, etc. of the cutter 110 according to preset parameters or external inputs. Thus, the cutting mechanism 100 can automatically adjust the machining parameters according to the actual machining conditions, so as to better adapt to different machining requirements.

In some embodiments, the feeding of the cutter 110 may also be controlled manually by an operator. The feeding of the tool 110 has the advantage of being simple and easy to operate by manual control, i.e. the manual feeding does not require complex control systems and equipment, reducing the cost of use. The manual feeding is suitable for small-batch or single-piece production, namely, the manual feeding can be quickly adjusted and adapted to different processing requirements, and the production efficiency is improved. The machining precision of the manual feeding is controllable, namely, the machining precision of the manual feeding can be controlled through the skill and experience of operators, and better quality control can be realized on parts needing high-precision machining. The manual feeding can also improve the machining efficiency, namely, the machining rhythm and efficiency can be better mastered by manually controlling the feeding of the cutter 110 by an operator, so that the machining process is optimized, and the overall machining efficiency is improved.

In the above embodiments and examples, the laser light adjusting device 122 (including the refraction portion 1222 and the reflection portion 1221) is used to change the incident angle, the incident position, and the like of the laser light 123 into the zoom curved surface 112, and the zoom curved surface 112 is configured to be able to focus the laser light 123 on the cutting point of the cutting edge 111. The present invention further provides a cutting mechanism 100, referring to fig. 1 to 5 and 8 to 12, the cutting mechanism 100 includes a cutter 110, a laser assembly 120, a galvanometer assembly 150, and a controller 160. The tool 110 includes a cutting edge 111, and the material of the tool 110 is a transparent material. Similarly, tool 110 can be used to cut a workpiece. The laser assembly 120 is configured to generate an outgoing laser beam 1232, and the galvanometer assembly 150 is configured to reflect the outgoing laser beam 1232 to form a reflected laser beam 1233. The reflected laser light 1233 is transmitted through the side wall of the tool 110 facing away from the cutting edge 111 and irradiates the cutting point of the cutting edge 111. The controller 160 is configured to control the galvanometer assembly 150 to change the track of the reflected laser 1233 according to the position change of the cutting point of the cutting edge 111, so that the reflected laser 1233 can always irradiate (be located at) the cutting point of the cutting edge 111, and further the focus of the laser 123 that is transmitted out of the cutter 110 can always irradiate at the cut position on the surface of the workpiece, so that the workpiece material is denatured to facilitate cutting of the cutter 110, and the processing efficiency is improved, and meanwhile, the processing difficulty of the cutter 110 on the brittle and hard material is reduced.

In other embodiments, referring to fig. 13, cutting mechanism 100 includes a tool 110, a drive assembly 140, a laser assembly 120, a galvanometer assembly 150, and a controller 160. The cutter 110 has a cutting edge 111 on one side in a first direction X, and the side wall of the cutter 110 on one side in a second direction Y is an incident wall 115, wherein the second direction Y is perpendicular to the first direction X. The knife 110 is connected to a drive assembly 140, which drive assembly 140 is configured to drive the knife 110 in a first direction X. The laser assembly 120 is configured to generate an outgoing laser beam 1232. The galvanometer assembly 150 is configured to reflect the outgoing laser light 1232 to form reflected laser light 1233, and the reflected laser light 1233 is capable of passing through the incident wall 115 and striking the cutting point of the cutting edge 111. Therefore, during the movement of the cutter 110 along the first direction X, the movement stroke of the cutter 110 is not limited by the mechanisms such as the laser component 120 and the galvanometer component 150, and the machining range of the cutting mechanism 100 is effectively increased. The controller 160 is configured to control the galvanometer assembly 150 to move according to the position change of the cutting point of the cutting edge 111 and the position change of the cutter 110, so that the track of the reflected laser 1233 is changed, so as to maintain the state that the reflected laser 1233 always irradiates the cutting point of the cutting edge 111, and ensure that the depth of the laser 123 irradiated on the workpiece is matched with the thickness of the removed material layer, thereby avoiding the ablation of the workpiece, overlarge damage of the surface of the finished product, and the like. The laser 123 penetrating out of the cutting point of the cutting edge 111 can irradiate on the cut position of the workpiece, so that the material property of the position to be cut of the workpiece is changed, the cutting force of the material is reduced, the material removal rate is improved, the machining damage is reduced, and the machining quality of the cutting mechanism 100 is improved. That is, the present invention irradiates the workpiece at the cut position in real time by using the laser 123, and compared with the method of irradiating the workpiece in advance by using the laser 123 to denature and then cut, the present invention has better processing effect on the workpiece.

In some embodiments, the controller 160 may include a first control component capable of simultaneously controlling the movement of the galvanometer assembly 150 and the movement of the tool 110. In other embodiments, the controller 160 may include a first control component that may control the movement of the galvanometer assembly 150 and a second control component that may control the movement of the tool 110.

Wherein the definition of "the focus can be located at the cutting point of the cutting edge 111" is referred to above. The following defines "outgoing laser light 1232" and "reflected laser light 1233: the portion of the laser beam 123 emitted from the laser assembly 120 between the laser assembly 120 and the galvanometer assembly 150 is an emitted laser beam 1232. The portion of laser 123 between galvanometer assembly 150 and the cutting point of cutting edge 111 is reflected laser 1233.

In some embodiments, referring to fig. 13, the tool 110 has a positioning wall 116, the positioning wall 116 being used for mounting positioning of the tool 110. In one embodiment, the tool 110 may be mounted to the tool 110 carrier through the locating wall 116. In another embodiment, the tool 110 is mounted to the drive assembly 140 through the locating wall 116. The incident wall 115 is disposed opposite the positioning wall 116 in the second direction Y. The reflected laser light 1233 can enter the cutter 110 through the incident wall 115. Due to the relative arrangement of the entrance wall 115 and the positioning wall 116, a better stability of the tool 110 can be obtained during installation. This stability helps to ensure the accuracy of irradiation of the laser light 123 and the accuracy of cutting.

In other embodiments, cutter 110 has a locating wall 116 disposed adjacent to incident wall 115. Such a design of the positioning wall 116 adjacent the incidence wall 115 facilitates an integrated integration of the tool 110 with the laser assembly 120, galvanometer assembly 150, or other assembly, facilitating compactness and modularity of the cutting mechanism 100.

In some embodiments, the incident wall 115 and the positioning wall 116 can form an angle, and the laser 123 is totally reflected by the positioning wall 116 after being incident on the tool 110 by the incident wall 115, so that the laser 123 reaches the cutting edge 111 and irradiates the cutting point of the cutting edge 111. In another embodiment, the incident wall 115 and the positioning wall 116 may be parallel to each other or both may form a small angle, and a mirror is disposed at the positioning wall 116. After the laser light 123 is injected into the tool 110 from the incidence wall 115, the mirror can reflect the laser light 123, so that the laser light 123 can reach the cutting edge 111 and irradiate the cutting point of the cutting edge 111.

In some embodiments, the position at which the cutting edge 111 actually contacts the workpiece, i.e., the position of the cutting point of the cutting edge 111, may be changed by fixing the position of the tool 110, and moving the workpiece relative to the tool 110. In other embodiments, the position of the workpiece may be fixed, that is, the tool 110 moves relative to the workpiece, so that the position where the cutting edge 111 actually contacts the workpiece changes, that is, the position of the cutting point of the cutting edge 111 changes. In still other embodiments, it is also possible to move by changing the position of the workpiece and the tool 110, i.e. both the workpiece and the tool 110 are configured to be driven.

In some embodiments, referring to fig. 2, the cutting edge 111 is formed on one side of the cutter 110 along the first direction X, the cutting mechanism 100 further includes a driving assembly 140, the driving assembly 140 is connected to the cutter 110, and the controller 160 controls the driving assembly 140 to drive the cutter 110 to move along the first direction X. I.e., the tool 110 moves relative to the workpiece to perform cutting work on the workpiece, which can reduce deformation of the workpiece during machining and vibration, thereby improving cutting accuracy and cutting stability. In addition, the tool 110, which is moved by the driving of the driving assembly 140, is also convenient for replacement and maintenance. By changing different tools 110 and designing different cutting parameters, various cutting operations can be realized, and the processing range of the cutting mechanism 100 can be widened.

In some embodiments, the controller 160 also controls the drive assembly 140 to drive the cutter 110 in the second direction Y. In one embodiment, the second direction Y may intersect the first direction X (the second direction Y being perpendicular to the first direction X is also a special intersection). That is, the cutter 110 can realize multidimensional movement under the drive of the drive assembly 140, so that the cutting mechanism 100 has the following advantages:

the processing is flexible: the multi-dimensional moving tool 110 can perform complex cutting tracks in space, and a more flexible processing mode is realized. This helps to handle complex shaped workpieces, improving the flexibility and adaptability of the process.

Optimizing cutting parameters: the motion of tool 110 may be dynamically adjusted during the cutting process, optimizing cutting parameters in real time based on the material of the workpiece and the cutting conditions. And the cutting efficiency and the processing quality are improved.

Reducing tool 110 wear: the automatic adjustment can be performed according to the cutting needs, and the contact area and friction between the cutter 110 and the workpiece are reduced, so that the abrasion of the cutter 110 is reduced.

The machining precision and stability are improved: various parameters in the cutting process, such as cutting depth, cutting speed, cutting direction, etc., can be controlled more precisely. This helps to improve machining accuracy and stability, reducing the possibility of out-of-tolerance and vibration.

The processing range is enlarged: multiple cutting modes can be realized through different combinations, so that the processing range is enlarged, and the processing requirements of different types of workpieces are met.

The production efficiency is improved: the tool changing and adjusting time can be shortened, the processing efficiency is improved, and the production cost is reduced.

The safety is improved: the operation difficulty and risk of operators can be reduced, and the safety of the processing process is improved.

In some embodiments, referring to fig. 11 and 12, the driving component 140 is disposed between the galvanometer component 150 and the tool 110, and the driving component 140 can be configured to drive the tool 110 and the galvanometer component 150 to move simultaneously, so as to reduce material cost, and at the same time, ensure consistency of movement of the tool 110 and the galvanometer component 150, so as to ensure that the laser 123 reflected by the galvanometer component 150 can always irradiate a cutting point with the cutting edge 111.

In some embodiments, referring to fig. 2 and 11, a cutting edge 111 is formed on one side of the cutter 110 along the first direction X, and a galvanometer assembly 150 is disposed on the other side of the cutter 110 along the first direction X. The second direction Y intersects the first direction X, and the laser assembly 120 is disposed on one side of the galvanometer assembly 150 along the second direction Y. Preventing the laser assembly 120 from interfering with the movement of the tool 110.

In some embodiments, referring to fig. 13, the galvanometer assembly 150 is disposed opposite to the laser assembly 120 along the first direction X, and the galvanometer assembly 150 is disposed opposite to the cutter 110 along the second direction Y, that is, the galvanometer assembly 150 is disposed at any position along the circumference of the cutter 110 along the second direction Y. During the driven movement of the cutter 110, no other structure exists on the movement path, so that the movement of the cutter 110 is prevented from being interfered. The laser assembly 120 generates an outgoing laser beam 1232, which outgoing laser beam 1232 is reflected by the galvanometer assembly 150 to form a reflected laser beam 1233. The galvanometer assembly 150 can be moved under the control of the controller 160 to adjust the path of the reflected laser beam 1233 so that the reflected laser beam 1233 always irradiates the cutting point of the cutting edge 111.

In some embodiments, referring to fig. 11, the galvanometer assembly 150 includes a first mirror 151, the first mirror 151 is configured to rotate about a first axis and a second axis, the first axis intersects the second axis, and the outgoing laser beam 1232 is reflected by the first mirror 151 to form a reflected laser beam 1233. During the driving motion of the tool 110 and the cutting of a workpiece, the position of the tool 110 relative to the galvanometer assembly 150 changes, which may result in the laser 123 not being able to precisely and consistently impinge on the cutting point of the cutting edge 111. At this time, the first reflecting mirror 151 can rotate around the first axis and the second axis, so as to change the incident angle and/or the incident position of the reflected laser 1233 entering the tool 110, so as to ensure that the laser 123 entering the tool 110 can always irradiate the cutting point of the cutting edge 111. For the cutting mechanism 100, only the first reflecting mirror 151 is used for changing the path and the position of the reflected laser 1233 entering the cutter 110, so that the material cost is low. The path and position of the reflected laser beam 1233 entering the tool 110 are changed, so that it is ensured that the laser beam 123 always irradiates the cutting point of the cutting edge 111 (the laser beam 123 penetrating the cutting point can irradiate the cut position of the workpiece, so that the material property of the cut position of the workpiece is changed, thereby facilitating the cutting of the tool 110) when the relative position of the tool 110 and the galvanometer assembly 150 is changed.

In some embodiments, referring to fig. 12, the galvanometer assembly 150 includes a first mirror 151 and a second mirror 152, the first mirror 151 is configured to rotate about a first axis, the second mirror 152 is configured to rotate about a second axis, the first axis intersects the second axis, the outgoing laser light 1232 is reflected by the first mirror 151, reflected to the second mirror 152, and reflected by the second mirror 152 to form a reflected laser light 1233. The first reflecting mirror 151 and the second reflecting mirror 152 are adopted to change the angle and the position of the reflected laser 1233 which is injected into the cutter 110, so that the control difficulty of the vibrating mirror assembly 150 can be reduced.

In some embodiments, referring to fig. 3 and 4, the tool 110 forms a cutting edge 111 along one side of a first direction X, the cutting edge 111 having a first end 113 and a second end 114 disposed opposite along a second direction Y, the first axis being perpendicular to the first direction X and the second direction Y, the second axis being parallel to the second direction Y. Specifically, referring to fig. 12, the first mirror 151 rotates around the first axis, and the first mirror 151 can reflect the outgoing laser light 1232 to the second mirror 152. Since the first direction X intersects the second direction Y, the second mirror 152 can receive the laser light 123 reflected by the first mirror 151, and the second mirror 152 rotates about the second axis, so that the laser light 123 can be reflected to the sidewall of the tool 110 and irradiated to the cutting point of the cutting edge 111 through the sidewall. The rotation parameters of the first mirror 151 and the second mirror 152 can be set according to the variation parameters of the position of the workpiece to be cut relative to the position of the galvanometer assembly 150.

In some embodiments, the cutting mechanism 100 further includes a monitoring assembly for monitoring the position of the cutting point and communicating the position of the cutting point to the controller 160, the controller 160 controlling the galvanometer assembly 150 in accordance with the position of the cutting point. Specifically, the monitor can monitor and collect information about the change in the position of the cutting point, and the monitor can transmit the information to the controller 160, the controller 160 analyzes the information and outputs a control signal to the galvanometer assembly 150, and the galvanometer assembly 150 moves according to the control signal after receiving the control signal, so that the reflected laser 1233 can penetrate into the tool 110 and always irradiate the cutting point of the cutting edge 111. The arrangement of the monitor can improve the automation of the cutting mechanism 100, and the use of the controller 160 can enable the galvanometer assembly 150 to timely acquire the position change of the cutting point, so as to change the track of the reflected laser 1233, and further enable the reflected laser 1233 to maintain the state of the cutting point irradiated on the cutting edge 111.

In other embodiments, cutting mechanism 100 further includes a monitoring assembly for monitoring the position of tool 110 and communicating the position of tool 110 to controller 160, controller 160 controlling galvanometer assembly 150 in accordance with the position of tool 110. In the process of cutting the workpiece by the driven relative movement of the cutter 110, the movement of the cutter 110 is macroscopic, so that the monitoring assembly can monitor and acquire the position information of the cutter 110 relatively easily, and the monitoring difficulty of the monitoring assembly is reduced.

The second aspect of the present invention also provides a cutting system 10, the cutting system 10 comprising a cutting mechanism 100 as described in any of the embodiments above. The drive section is configured to be able to drive the tool 110 for a feed motion, which enables the tool 110 to perform a cutting process on a workpiece. In this process, the driving part ensures the accuracy and stability of the cutting process by precisely controlling the movement of the tool 110. The laser assembly 120 is another important component, which includes a laser generating device 121 and a laser adjusting device 122. The laser generator 121 is used for emitting laser light 123, and the laser regulator 122 is used for adjusting the path and the emitting direction of the laser light 123. The laser assembly 120 is characterized in that it can focus the laser 123 at the cutting point of the cutting edge 111 through the zoom curved surface 112 provided to the tool 110. The position of the focal point of the laser 123 on the surface of the workpiece can be changed along with the change of the actual cutting point of the cutting edge 111, so that the laser 123 can be precisely irradiated on the pre-cutting surface of the workpiece, and the cutter 110 can be used for effectively removing materials from the workpiece, so that the workpiece is prevented from being broken in the processing process.

Specifically, the laser light 123 is emitted from the laser light generating device 121, and is adjusted by the laser light adjusting device 122 so as to be focused on the cutting point of the cutting edge 111 through the zoom curved surface 112. Such focused laser light 123 may be used to cut, melt or cauterize a workpiece, thereby achieving an efficient, high precision cutting process. In addition, the cutting system 10 may also be equipped with sensors and feedback control systems to monitor and adjust the cutting process in real time. For example, the sensors may monitor the position, shape, and material of the workpiece, as well as the wear level and temperature of the tool 110. This information is fed back into the controller for adjusting the operating parameters of the drive and laser assembly 120 to ensure stability and accuracy of the cutting process.

Referring to fig. 6-8, in some embodiments, the cutting system 10 further includes a FTS (fast tool servo) module 200. In one embodiment, FTS module 200 is a stand alone device independent of the machine tool that is based on the principle of machining by driving cutting tool 110 to perform high frequency and preset motions in a preset direction (typically the machine spindle). In one embodiment, FTS module 200 may employ a one-dimensional drive type device, i.e., FTS module 200 drives knife 110 in first direction X. In another embodiment, FTS module 200 may also employ a two-dimensional drive type device, i.e., FTS module 200 is capable of driving movement of tool 110 in first direction X as well as second direction Y. In yet another embodiment, the FTS module 200 may also employ a piezo-electric drive type device. In yet another embodiment, the FTS module 200 may also employ a coil drive type device. FTS module 200 can function in cutting system 10 as follows:

ensuring the accuracy of the control: by precisely controlling the movement of the tool 110 and other parts, the surface profile accuracy and shape accuracy of the workpiece are finally maintained.

Ensuring the accuracy of the movement of the tool 110: automated control and operation may be achieved. This helps to reduce human intervention and improve the stability and consistency of the production process.

The processing quality is improved: FTS module 200 helps to improve the machining quality of cutting system 10. It can reduce vibration and deformation of the tool 110 during the movement, and avoid error accumulation during the machining process, thereby improving the overall machining quality.

Flexible layout: the design of the layout of the FTS module 200 is flexible and can be customized to the actual needs of the cutting system 10. This enables the FTS module 200 to accommodate a variety of different processing environments and equipment configurations, facilitating integration and expansion of the system.

It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is included in the embodiment of the present invention, the directional indication is merely used to explain a relative positional relationship, a movement condition, and the like between the components in a specific posture, and if the specific posture is changed, the directional indication is correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or", "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B ", including a scheme, or B scheme, or a scheme where a and B meet simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims

1. A cutting mechanism, comprising:

the laser component is used for generating emergent laser;

2. The cutting mechanism of claim 1, wherein,

the controller also controls the drive assembly to drive the cutter to move in a second direction.

3. The cutting mechanism of claim 1, wherein,

the cutter is provided with a positioning wall for mounting and positioning the cutter, and the incident wall and the positioning wall are oppositely arranged along the second direction.

4. The cutting mechanism of claim 1, wherein,

the tool has a positioning wall for mounting positioning of the tool, the entrance wall being arranged adjacent to the positioning wall.

5. The cutting mechanism of claim 1, wherein,

the galvanometer assembly and the laser assembly are arranged oppositely along the first direction, and the galvanometer assembly and the cutter are arranged oppositely along the second direction.

6. The cutting mechanism of claim 1, wherein,

the galvanometer assembly comprises a first reflecting mirror, the first reflecting mirror is configured to rotate around a first axis and a second axis, the first axis is intersected with the second axis, and the emergent laser is reflected by the first reflecting mirror to form reflected laser.

7. The cutting mechanism of claim 1, wherein,

the galvanometer assembly comprises a first reflecting mirror and a second reflecting mirror, wherein the first reflecting mirror is configured to rotate around a first axis, the second reflecting mirror is configured to rotate around a second axis, the first axis is intersected with the second axis, and the emergent laser is reflected to the second reflecting mirror after being reflected by the first reflecting mirror, reflected by the second reflecting mirror and forms the reflected laser.

8. The cutting mechanism of claim 7, wherein,

the first axis is perpendicular to the first direction and the second direction, and the second axis is parallel to the second direction.

9. The cutting mechanism of claim 1, wherein,

the cutting mechanism further comprises a monitoring assembly for monitoring the position of the cutting point and transmitting the position of the cutting point to the controller, which controls the galvanometer assembly according to the position of the cutting point;

or alternatively;

10. A chip system comprising the chip mechanism of any one of claims 1-9.