SU1738559A1 - Device for laser treatment of materials - Google Patents

Device for laser treatment of materials Download PDF

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Publication number
SU1738559A1
SU1738559A1 SU904866651A SU4866651A SU1738559A1 SU 1738559 A1 SU1738559 A1 SU 1738559A1 SU 904866651 A SU904866651 A SU 904866651A SU 4866651 A SU4866651 A SU 4866651A SU 1738559 A1 SU1738559 A1 SU 1738559A1
Authority
SU
USSR - Soviet Union
Prior art keywords
laser
cutting
lens
plate
thickness
Prior art date
Application number
SU904866651A
Other languages
Russian (ru)
Inventor
Виктор Васильевич Романенко
Владимир Сергеевич Коваленко
Ван Чук Нгуен
Original Assignee
Киевский Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции
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Priority to SU904866651A priority Critical patent/SU1738559A1/en
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Publication of SU1738559A1 publication Critical patent/SU1738559A1/en

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Abstract

Usage: in the technological equipment for laser processing, in particular for contour cutting of various materials. SUMMARY OF THE INVENTION: The camera of the device is equipped with a mechanism for its rotation around the optical axis of the lens, which is electrically connected with the CNC system of drives for moving the table. In addition, the transparent plate in the upper part of the chamber is made in steps with the number m of steps of the same height and of optical material with a coefficient of refraction of laser radiation. 1 il.

Description

The invention relates to laser processing equipment and can be used in contour cutting and cutting of various materials in various industries.

A device for laser processing of materials is known, which comprises a focusing lens mounted for longitudinal movement.

The drawback of the device is the difficulty of moving the focus point of the lens during the cutting process through the thickness of the workpiece being cut.

A device for laser processing of materials is known, which includes a 4-section parallel twist link of a laser beam using mechanical rotation to obtain the necessary vertical movement of the beam.

A disadvantage of the known device is its complexity, considerable inertia and the impossibility of its use for cutting parts of a complex contour.

A device for laser processing of materials is known, which includes two lenses of different diameters or a lens of a special shape, which allows focusing of laser radiation at two points located along the optical axis at a certain distance from one another, and provides different power density values at these points thickness of the material being cut.

The disadvantages of the known device are the difficulty of manufacturing a lens of a special shape or a two-lens optical system, as well as fixing the laser power density over the thickness of the workpiece at only two points, which does not allow for high quality cutting due to a more uniform redistribution of the power density over the entire thickness of the workpiece being cut.

The closest to the invention in its technical essence and the effect achieved is a device for laser processing of materials containing foci

 Ca

aa aa

a squeezing lens, an overpressure chamber installed under the lens on its optical axis for supplying gas to the cutting zone with a plate transparent for laser radiation in the upper part of the chamber, a work table with displacement drives with a CNC system. When the lens is moved relative to the plate, the focal point moves accordingly and can be set anywhere along the thickness of the workpiece.

A disadvantage of the known device is the low cutting quality due to the impossibility of ensuring a more uniform distribution of the laser power density over the thickness of the workpiece being cut.

The aim of the invention is to improve the quality of laser cutting of materials by providing a more uniform distribution of the laser power density throughout the thickness of the workpiece being cut.

The goal is achieved by the fact that in a known device for laser processing of materials containing a focusing lens, an overpressure chamber installed under the lens on its optical axis for supplying gas to the cutting area with a laser emitted from the plate on the upper part of the chamber, a desktop with drives according to the invention, the camera is equipped with a mechanism for its rotation around the optical axis of the lens, which is electrically connected to the CNC system. The drives for moving the table, the plate in the upper part of the camera is it is staggered with a number m of equal steps in height and made of an optical material with a coefficient of refraction of laser radiation.

Achieving this goal is ensured by the fact that when a focused laser beam passes through a plane-parallel plate that is transparent to radiation, in accordance with the existing laws of optics, the focus point is shifted along the axis of the beam. Depending on the angle of incidence of the beam on the plate, the focus is deepened by an amount equal to

Af-d (1

sin2 a

“2

(one)

n - sin - a where d is the plate thickness; n is the refractive index of laser radiation by the plate material,

Since small-aperture beams and long-focus lenses are commonly used for laser cutting, a 0 can be a simpler expression.

P

one

P

(2)

If you use a multistage plate on which m

the same steps and the total difference in thickness is A d, then when the beam is focused, there will be a different depth of the focus point depending on the plate thickness in each of the sections.

Moreover, such a penetration varies within a spot focusing in the direction perpendicular to the axis of the beam, and the degree of penetration increases with increasing thickness of the steps of the plate. Consequently,

if necessary, high-quality cutting of the workpiece with a gradual deepening of the focus in each case by the value of A f from expression (2) it follows that it is necessary to use the m-step plate (with

equality of thickness differences from step to step) with a total difference of thickness equal to

D d AfЈ-W

(3)

In the case of cutting materials, the step plate is oriented with a thin part towards the movement of the workpiece so that the focus point of the laser beam is stepped down with the step Af by the required amount

from the upper edge of the material into the cut of the workpiece, which ensures high quality cutting. During the cutting process, the CNC orients the correct position of the stepped blade relative to the cutting direction.

The known device for gas-laser cutting of materials, including two lenses of different diameters or a lens of a special shape, makes it possible to focus laser radiation at two points on the optical axis of the device, which, in turn, improves the conditions of cutting materials by changing the power density across the thickness of the material being cut. . Such a device is not without flaws: the complexity of manufacturing a lens of a special shape or a two-lens optical system, as well as a change in power density through the thickness of the workpiece at only two points, which

does not allow for high quality cutting, due to a more uniform redistribution of power density. The essential difference of the proposed device is the use of a stepped transparent plate of variable thickness, located directly behind the focusing lens. This provides the required redistribution of power density in the cut cavity, specified by the number of steps on the plate.

The known device for contour gas laser cutting of materials, which contains a focusing lens and an overpressure chamber with a transparent plate located behind the lens, as well as a table with a drive for moving the workpiece according to a given law, do not provide a variable focal distance along the cutting line during contour movement. The essential differences of the proposed device are the use of a transparent plate of stepped shape and variable thickness in the overpressure chamber to provide a more uniform power density throughout the thickness of the workpiece being cut, as well as an orientation mechanism for this chamber to match the cutting direction at each time point. the required redistribution of power density, which together helps to improve the quality of the contour cutting process.

The drawing shows the proposed device.

The device for laser processing of materials consists of a focusing lens 1, which refracts the laser radiation 2 to focus it on the surface of the workpiece being cut 3. With the help of an overpressure chamber 4, a gas stream is directed into the treatment area coaxially with the laser beam 2. In the upper part of the chamber 4, a step-like plate 5 with a maximum difference in thickness Ad is transparent for laser radiation. The chamber 4 is also equipped with a mechanism b of its orientation relative to the cutting direction. Cut the workpiece 3 is installed on the table 7 with the drive 8 from the CNC 9. The mechanism 6 orientation of the camera 4 is also connected to the CNC 9.

A device for laser processing of materials works as follows.

The laser radiation 2 focused by the lens 1 is directed onto the workpiece 3. The overpressure chamber 4 is used to deliver a stream of gas to the treatment area. On its way, the focused radiation passes through the stepped plate 5, which affects the position of the focal point of the laser beam on its axis. Thus, with increasing plate thickness, the focal point is removed along the axis from the focusing lens in accordance with dependence (1). With the passage of a laser beam through a stepped plate oriented with a thin part towards the direction of cutting, a gradual deepening of its focus (according to (2)) is observed during the transition from thinner layers of the plate to

thick. At the same time in the cavity cut

the workpiece 3, a gradual deepening of the focus occurs within the spot focusing area from the workpiece surface (from the beginning of the cut) to the depth by the total value of A fm (at the end of the treatment). Such a deepening of the focus within the focused laser spot helps to increase the power density when cutting in the deep layers of the cut plate, which improves the quality of the cut surface of the deep layers, as well as increasing the thickness of the cut

blanks. To obtain a complex contour, the direction of movement of the table 7 is changed, provided by the drive 8 on the command from the CNC 9. At the same time, the CNC 9 also generates a control signal,

supplied to the mechanism b of the orientation of the chamber 4 overpressure. At the same time, the chamber 4 is turned to a new position so that the step plate 5 remains constantly oriented during the cutting process.

its thin part towards the direction of cutting (movement of the workpiece).

For example, when cutting carbon steels with a thickness of 3 mm by lasers using an IAG laser, a processing scheme with a 4-step focus depth in each case by 0.3 mm was proposed. For this, a 4-step glass (p 1.5) plane-parallel plate with a total difference of 4 ° C was manufactured and used.

equal to 0.3 -. 4 3.6 mm,

1 iO I

oriented thin part towards cutting.

In another case, when cutting 8 mm of steel with C02 laser radiation using a 5-step germanium (n-4) plate with a total thickness of 7 mm, it was possible to perform the treatment with a phased deepening of the focus 1

sa on D f (-) - 1.05 mm. Such technology allowed to reduce the roughness of the cut edges from RZ 80-100 microns to RZ 40-50 microns and eliminate the need

in the subsequent refinement of the edges of the cuts.

The device, in comparison with the known, allows improving the quality of cutting contour parts, reducing the irretrievable loss of materials and the laboriousness of processing as a result of eliminating allowances for the subsequent refinement of the cut parts.

Claims (1)

  1. Apparatus for laser processing of materials, comprising a focusing lens, an overpressure chamber under the lens on its optical axis for supplying gas to the cutting area with a laser-transparent plate in the upper part of the chamber, a worktable with displacement drives with an NC system characterized by that, in order to improve the quality of cutting by providing a more uniform redistribution of the laser power density over the thickness of
    billet, the camera is equipped with a mechanism for rotating it around an axis parallel to the optical axis of the lens, electrically connected to the CNC system of drives for moving the table, the plate in the upper part of the camera is stepped with a number m equal in height steps and made of optical material with a coefficient of refraction of laser radiation .
SU904866651A 1990-06-08 1990-06-08 Device for laser treatment of materials SU1738559A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU904866651A SU1738559A1 (en) 1990-06-08 1990-06-08 Device for laser treatment of materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU904866651A SU1738559A1 (en) 1990-06-08 1990-06-08 Device for laser treatment of materials

Publications (1)

Publication Number Publication Date
SU1738559A1 true SU1738559A1 (en) 1992-06-07

Family

ID=21536294

Family Applications (1)

Application Number Title Priority Date Filing Date
SU904866651A SU1738559A1 (en) 1990-06-08 1990-06-08 Device for laser treatment of materials

Country Status (1)

Country Link
SU (1) SU1738559A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072521A2 (en) * 2002-02-21 2003-09-04 Andrey Mikhaylovich Alexeev Method for cutting non-metallic materials and device for carrying out said method
CN103286456A (en) * 2013-05-07 2013-09-11 深圳市大族激光科技股份有限公司 Laser cutting device and cutting method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Патент JP № 61-60289, кл. В 23 К 26/06. 1986. Патент DD №123788, кл. В 23 К 26/00, 1977. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072521A2 (en) * 2002-02-21 2003-09-04 Andrey Mikhaylovich Alexeev Method for cutting non-metallic materials and device for carrying out said method
WO2003072521A3 (en) * 2002-02-21 2003-12-18 Andrey Mikhaylovich Alexeev Method for cutting non-metallic materials and device for carrying out said method
CN103286456A (en) * 2013-05-07 2013-09-11 深圳市大族激光科技股份有限公司 Laser cutting device and cutting method

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