CN117798443A - Small hole machining device and recast layer in-situ thinning method - Google Patents
Small hole machining device and recast layer in-situ thinning method Download PDFInfo
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- CN117798443A CN117798443A CN202311692108.7A CN202311692108A CN117798443A CN 117798443 A CN117798443 A CN 117798443A CN 202311692108 A CN202311692108 A CN 202311692108A CN 117798443 A CN117798443 A CN 117798443A
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- 238000012545 processing Methods 0.000 claims abstract description 94
- 230000008569 process Effects 0.000 claims abstract description 17
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- 238000011010 flushing procedure Methods 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 4
- 238000010892 electric spark Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 6
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Abstract
The invention discloses a small hole processing device and a recast layer in-situ thinning method, wherein the small hole processing device comprises: a machine tool workbench; the machine tool clamp is arranged on the machine tool workbench and is used for clamping a workpiece; the servo processing shaft is positioned above the workpiece; the electrode is arranged at the front end of the servo processing shaft and is used for processing small holes on a workpiece; when the workpiece is subjected to small hole processing, enters a penetrating stage and completes penetrating processing, a small hole with a recast layer is formed, and the recast layer is attached to the wall of the small hole; the electrode is kept in place and rotates around the central axis of the aperture; pulse spark is generated between the electrode and the hole wall of the small hole, the pulse spark discharges, and the high temperature generated by the discharge etches away the recast layer so as to thin the thickness of the recast layer. The invention can effectively reduce the thickness of the recast layer, has simple working procedure and low cost, and has important significance on the manufacturing level and the process quality of the electric spark machining small hole.
Description
Technical Field
The invention relates to the technical field of electric spark machining, in particular to a small hole machining device and a recast layer in-situ thinning method.
Background
For the recast layer generated on the surface of the workpiece by electric spark machining, the prior art adopts a combined machining process to remove the recast layer, and the corresponding machining process generally adopts electrolytic machining, chemical grinding and polishing machining, ultrasonic vibration auxiliary machining, abrasive particle flow machining and the like. The method is low in processing efficiency and high in cost due to complex procedures, and is not suitable for processing the turbine blade air film cooling holes.
The research on recast layer thickness control strategies for small-hole high-speed electric spark machining is relatively lacking. Taking the processing of the most widely applied air film cooling holes in small hole high-speed electric spark processing as an example, the number of the air film cooling holes on a single turbine blade exceeds 200, and the turbine blade is one of the parts which are manufactured in batch and have the largest number of parts on an aeroengine, so the total number of the air film cooling holes which need to be processed is extremely huge, and the efficiency and the cost cannot be ignored as the production of single precise parts. The actual production conditions of the air film cooling holes are precisely ignored by various methods for removing the recast layers studied at home and abroad, the method mainly adopts a combined processing method and mainly adopts preliminary experimental exploration, serious obstacles such as low processing efficiency, high cost and the like are necessarily encountered in the actual production application, and the method cannot be widely adopted in the actual industrial production.
The method for machining the small hole by high-speed electric spark is a mainstream method for machining the air film cooling hole, has the advantages of high efficiency, low cost and controllable precision, but has the defect that the thickness of the recast layer is difficult to control, and microcracks in the thicker recast layer can diffuse and damage a part matrix, so that the service life of the part matrix is influenced.
Disclosure of Invention
The invention aims to provide a small hole machining device and a recast layer in-situ thinning method. In order to solve the problems in the prior art, the invention provides the following technical scheme:
a small hole processing apparatus comprising: a machine tool workbench; the machine tool clamp is arranged on the machine tool workbench and is used for clamping a workpiece; a servo processing shaft positioned above the workpiece; and the electrode is arranged at the front end of the servo processing shaft and is used for processing the small hole of the workpiece. When the workpiece is subjected to small hole processing, a small hole with a recast layer is formed after the small hole processing enters a penetrating stage and the penetrating processing is completed, and the recast layer is attached to the wall of the small hole. The electrode is kept in place and rotates around the central axis of the small hole; pulse spark is generated between the electrode and the wall of the small hole, the pulse spark discharges, and the recast layer is etched away by the high temperature generated by the discharge, so that the thickness of the recast layer is thinned.
Optionally, the small hole processing device further includes: the flushing nozzle is arranged at the bottom of the workpiece and used for flushing and discharging the scraps in the small hole.
Optionally, the small hole processing device further includes: and one end of the servo processing shaft is positioned in the electrode guide, and the electrode guide is used for controlling the feeding direction of the electrode.
Optionally, the small hole processing device further includes: the power supply module is electrically connected with the electrode, and is used for keeping an on state all the time in the process of movement of the electrode, and the output peak current range of the power supply module is 4A-40A so that the energy discharge parameter range of the electrode is 20W-800W.
Optionally, the electrode revolves within the aperture.
Optionally, the electrode moves helically around the centre of the aperture.
Optionally, the radial movement track of the electrode is gradually close to the inner wall of the small hole or gradually far away from the inner wall of the small hole.
Optionally, when the diameter of the electrode is 0.65mm, the radial movement range of the electrode is 40-106 μm; alternatively, when the diameter of the electrode is 0.57mm, the radial movement range of the electrode is 40-100 μm.
The in-situ thinning method of the recast layer is realized by adopting the small hole processing device, and the method comprises the following steps: and S1, processing the small holes. And S2, stopping feeding movement of the servo processing shaft after the small hole processing enters a penetrating stage and completes penetrating processing, and keeping the electrode in place. S3, the electrode rotates around the central axis of the small hole; pulse spark is generated between the electrode and the wall of the small hole, the pulse spark discharges, and the recast layer is etched away by the high temperature generated by the discharge, so that the thickness of the recast layer is thinned.
Optionally, the step S3 further includes: and flushing liquid is carried out in the small hole so as to flush and discharge the chips in the small hole.
Compared with the prior art, the invention has at least one of the following technical effects:
the invention can improve the efficiency of processing the small holes, can effectively thin the thickness of the recast layer in situ, has simple working procedure and low cost, has important significance for improving the manufacturing level and the process quality of the aeroengine, and has important significance for manufacturing the small holes by electric spark processing.
Drawings
FIG. 1 is a schematic diagram of a small hole processing device according to an embodiment of the present invention;
FIG. 2 is a diagram showing a motion pattern of an electrode in a method for in-situ thinning a recast layer according to an embodiment of the present invention;
FIG. 3a is a graph showing the observation of an in situ thickness of an electrode recast layer using 0.57mm without employing the recast layer in situ thinning method according to an embodiment of the present invention;
FIG. 3b is a graph showing the observation of an in situ thickness of an electrode recast layer without using the recast layer in situ thinning method and using 0.67mm in accordance with an embodiment of the present invention;
FIG. 3c is a graph showing the observation of the thickness of an electrode recast layer using the recast layer in situ thinning method according to an embodiment of the present invention;
FIG. 3d is a graph showing the observation of the thickness of an electrode recast layer using the method of in situ thinning of the recast layer using 0.65mm in accordance with an embodiment of the present invention;
FIG. 4 is a view of inlet observations of film cooling holes of electrode turbine blades using different diameters using a recast in situ thinning method according to an embodiment of the present invention;
reference numerals illustrate: 1-an electrode guide; 2-servo machining the shaft; 3-electrodes; 4-a workpiece; 5-flushing nozzle; 6-a machine tool clamp; 7-a machine tool workbench.
Detailed Description
The invention provides a small hole processing device and a recast layer in-situ thinning method, which are further described in detail below with reference to the accompanying drawings and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the invention. For a better understanding of the invention with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the invention, are included in the spirit and scope of the invention which is otherwise, without departing from the spirit or essential characteristics thereof.
For the recast layer generated on the surface of the workpiece by electric spark machining, the prior art adopts a combined machining process, such as electric spark-electrolytic combined machining, the method is to finish machining the small holes by a small hole high-speed electric spark method, then the electrolytic machining method is used, the existing recast layer of the hole wall is removed by anodic dissolution reaction, and the size of the small holes is trimmed at the same time, so that the surface quality is improved. Although the electric spark-electrolysis combined processing method is adopted, the recast layer generated by electric spark processing can be effectively removed through electrochemical action, and the quality of small hole processing is improved. However, when different processing technologies are switched, the tool electrode and the working fluid are often required to be replaced, so that positioning errors are easily introduced, and the consistency of processing is difficult to ensure. Even if the subsequent processing is performed using the same tool electrode and working fluid when the process method is switched, a significant decrease in electrolytic processing efficiency occurs. In such cases, the combined spark-electrolytic machining time tends to be several times, even tens of times, greater than the high-speed spark machining time of the small holes, and the efficiency advantage of the high-speed spark machining of the small holes is completely lost.
For the auxiliary processing of grinding and polishing, the chemical grinding utilizes the principle of chemical reaction to dissolve foreign matters such as oxide skin on the metal surface (especially concave surface), and the basic principle is as follows: a potential difference is formed between the work piece substrate and the recast layer in the electrolyte, thereby forming a primary cell, and the recast layer which becomes an anode can be continuously dissolved.
The method has the problems that the processing efficiency is low, meanwhile, the proportioning requirement on the chemical grinding fluid is extremely high, and the improper grinding fluid can cause over-corrosion damage to the workpiece substrate.
For abrasive flow machining, the abrasive flow machining is a machining mode for polishing and deburring the surface of a workpiece by using a viscous-elastic material with fluidity, is commonly used for removing burrs on the surface of a workpiece with a complex shape in the aerospace field, improving the surface quality and effectively removing a recast layer left on the surface of the workpiece after machining. However, the existing method for processing the turbine blade air film cooling holes by using the abrasive flow technology has obvious defects: firstly, no universal fixture is provided; secondly, the small holes at the special positions cannot be removed; thirdly, the removal effect of abrasive particle flow on the recast layer of the air film cooling holes with different apertures is different, the recast layer on the air film hole with smaller aperture is not easy to be removed, and the air film hole with large aperture is easy to be excessively removed to cause dimensional error; and fourthly, the machining process needs to carry out secondary clamping, so that the machining time is obviously increased.
Fig. 1 is a schematic structural diagram of a small hole processing device provided in this embodiment, and as shown in fig. 1 and fig. 2, the small hole processing device provided in this embodiment includes: a machine tool table 7; a machine tool fixture 5 arranged on the machine tool workbench 7, wherein the machine tool fixture 5 is used for clamping a workpiece 4; a servo processing shaft 2 positioned above the workpiece 4; and an electrode 3, wherein the electrode 3 is arranged at the front end of the servo processing shaft 2 and is used for processing small holes on the workpiece 4. When the work piece 4 is subjected to small hole processing and enters a penetrating stage and is subjected to penetrating processing, a small hole with a recast layer is formed, and the recast layer is attached to the wall of the small hole. The electrode 3 is kept in place and rotates around the central axis of the aperture; a pulse spark is generated between the electrode 3 and the wall of the small hole, the pulse spark discharges, and the high temperature generated by the discharge etches away the recast layer so as to thin the thickness of the recast layer.
The embodiment can effectively perform in-situ thinning on the thickness of the recast layer, does not need to replace an electrode, and has simple working procedure and low cost.
In this or other embodiments, the pinhole processing device further includes: and the flushing nozzle 5 is arranged at the bottom of the workpiece 3 and is used for flushing and discharging the scraps in the small hole.
For example, in the case of high pressure flushing, since the bottom of the through hole is unsupported, the high pressure flushing can be directly discharged from the electrode end, and cannot enter the gap flow field to provide high pressure impact force for discharging machining chips. Therefore, a strong external flushing nozzle 5 (flushing nozzle) is selected to perform external flushing on the bottom of the small hole. As shown in fig. 1, the external flushing liquid at the bottom can ensure that the high-pressure flushing liquid enters into the gap flow field, so that flushing and discharging of processing scraps generated by discharging in the in-situ thinning process of the recast layer are realized.
In this or other embodiments, the pinhole processing device further includes: an electrode guide 1, one end of the servo processing shaft 2 is positioned inside the electrode guide 1, and the electrode guide 1 can precisely control the feeding direction of the electrode 3.
The small hole processing device also comprises: and the power supply module (not shown in fig. 1) is electrically connected with the electrode, and is used for keeping an on state all the time in the process of moving the electrode, and the output peak current range of the power supply module is 4-40A so that the energy discharge parameter range of the electrode is 20-800W.
In general, during the movement, the power supply module for electric discharge machining is always kept in an on state, and meanwhile, the power supply module is switched to a discharge parameter with small energy. Thus, the recast layer can be accurately etched away without damaging the small holes and changing the diameters of the small holes.
The electrode revolves in the aperture, and the electrode moves spirally around the center of the aperture. The radial movement track of the electrode is gradually close to the inner wall of the small hole or gradually far away from the inner wall of the small hole.
For example, in combination with the machined shape of the aperture, periodic circular trajectory movement of the electrode is achieved by X, Y axis linkage. For example, a unit arc length increment method can be used for controlling the motion track of the electrode, and the method can realize the arc interpolation of a small radius and can cover the circular track which is theoretically experienced by the electrode to the greatest extent. The unit arc length increment method can be adopted in the prior art, and is not described in detail herein.
In this or other embodiments, the radial movement range of the electrode is 40 μm to 106 μm when the diameter of the electrode is 0.65 mm; alternatively, when the diameter of the electrode is 0.57mm, the radial movement range of the electrode is 40-100 μm.
The embodiment also provides an in-situ thinning method of the recast layer, which is realized by adopting the small hole processing device, and the method comprises the following steps: s1, processing the small holes; and S2, stopping feeding movement of the servo processing shaft after the small hole processing enters a penetrating stage and completes penetrating processing, keeping the electrode in place, and flushing liquid in the small hole so as to flush and discharge scraps in the small hole. S3, the electrode rotates around the central axis of the small hole; pulse spark is generated between the electrode and the wall of the small hole, the pulse spark discharges, and the recast layer is etched away by the high temperature generated by the discharge, so that the thickness of the recast layer is thinned.
For example, as shown in expression 1, in the actual film cooling hole processing, the thickness and distribution of the recast layer after the 0.57mm electrode and the 0.65 electrode processing are not obviously different, and by combining the observation result of the recast layer in the comprehensive experiment, it is not difficult to find that the recast layer in-situ thinning method has obvious improvement effect on the reduction of the recast layer on the film cooling hole of the turbine blade, and the reduction rates of the recast layer of the 0.57mm electrode and the 0.65mm electrode are 85.39% and 83.74%, respectively. When the in-situ recast layer thinning method is adopted, the recast layer on the wall surface of the air film cooling hole can be removed in a large range, only the extremely thin recast layer thickness and a small amount of recast layer remained in the hole wall gap are reserved, the average recast layer thickness value is controlled within 2 mu m, and the maximum recast layer thickness is not more than 2.5 mu m.
After adopting the recast layer in-situ thinning method, the processed surface quality of the turbine blade air film cooling hole is good, and the processed surface quality of the turbine blade air film cooling hole adopting the novel process method is good, and no burrs or scraps remained on the surface of the blade are generated, so that the quality requirement of turbine blade electric spark processing is met. As shown in fig. 4, in the case of adopting electrodes with different diameters, the in-situ thinning method of the recast layer does not cause the increase of the diameter of the film cooling hole, and the shape change of the inlet is not caused, so that the processing requirement of the film cooling hole is met.
Table 1 comprehensive processing experiment results
The embodiment can select a small-hole high-speed electric spark machine tool. The numerical control system can be a small-hole high-speed electric spark machining numerical control system. The in-situ thinning process of the recast layer is started after the single-hole process is completed and penetrated. In order to improve the processing efficiency, accurate discrimination and quick response are required in the process of small hole penetration. Therefore, the numerical control system integrates a small hole machining penetration detection method, the method has good sensitivity, quick judgment can be completed within 1s after penetration, and the feeding distance of the electrode after penetration is kept within 1 mm.
In the actual processing of the gas film cooling holes of a turbine blade of a certain model, more than 200 gas film cooling holes are formed in a single blade, and the diameters of the gas film cooling holes comprise two specifications of 0.57mm and 0.65 mm. On turbine blades, film cooling holes with different pore diameters have strict position requirements. Aiming at the problem of planning the processing path of the air film cooling hole, the self-adaptive processing technology of the air film cooling hole of the turbine blade is adopted, the technical means is adopted to realize the shape surface measurement of the turbine blade, and corresponding G codes for processing the air film cooling hole are automatically generated, so that the processing of the air film cooling holes with different apertures on the whole turbine blade is realized, and the processing error is ensured to be within +/-0.03 mm. In the processing experiment performed in this embodiment, the processing G code of the film cooling hole generated by the method is completed.
And selecting two adjacent rows of gas film cooling holes with different diameter electrodes in the processing G code to carry out comprehensive processing experiments. To ensure processing efficiency and quality of the surface of the small holes, the process parameters of the perforation processing stage in table 2 were determined. In the processing stage of the recast layer in-situ thinning method, the optimal parameter combination of the method under different apertures is discovered through experiments. Aiming at the electrode with the diameter of 0.57mm, adopting a circular track radius of 20-50 mu m and matching 120 times of movement times; when an electrode with the diameter of 0.65mm is used, a circular track radius of 20-53 μm is adopted, and the number of movements is matched with 135. The process parameters of the in-situ recast layer thinning method are determined according to the comparison of the recast layer in-situ thinning method with different processing parameters in the early-stage experiment and are shown in table 2.
Table 2 comprehensive processing experimental process parameters
Therefore, the in-situ reduction method of the recast layer provided by the embodiment can be executed based on the existing small-hole high-speed electric spark machine tool and the small-hole high-speed electric spark machining numerical control system. Therefore, after the working procedure of processing the small holes by using the small hole high-speed electric spark processing method, the thickness of the recast layer is effectively thinned under the condition that the working position, the tool electrode and the working solution are not required to be replaced, the small holes are not damaged, the diameter of the small holes is not changed, the small hole processing efficiency is improved, the working procedure is simple, and the cost is saved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the description of the present invention, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate describing the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (10)
1. A small hole processing apparatus, comprising:
a machine tool workbench;
the machine tool clamp is arranged on the machine tool workbench and is used for clamping a workpiece;
a servo processing shaft positioned above the workpiece;
the electrode is arranged at the front end of the servo processing shaft and is used for processing small holes on the workpiece;
when the workpiece is subjected to small hole processing, and the penetrating processing is finished, a small hole with a recast layer is formed, and the recast layer is attached to the wall of the small hole;
the electrode is kept in place and rotates around the central axis of the small hole; pulse spark is generated between the electrode and the wall of the small hole, the pulse spark discharges, and the recast layer is etched away by the high temperature generated by the discharge, so that the thickness of the recast layer is thinned.
2. The small hole machining apparatus according to claim 1, further comprising: the flushing nozzle is arranged at the bottom of the workpiece and used for flushing and discharging the scraps in the small hole.
3. The small hole machining apparatus according to claim 1, further comprising: and one end of the servo processing shaft is positioned in the electrode guide, and the electrode guide is used for controlling the feeding direction of the electrode.
4. The small hole machining apparatus according to claim 1, further comprising: the power supply module is electrically connected with the electrode, and is used for keeping the state of being opened all the time in the process of the movement of the electrode, and the output peak current range of the power supply module is 4A-40A so that the energy discharge parameter range of the electrode is 20W-800W.
5. The device of claim 1, wherein the electrode revolves within the aperture.
6. A device according to claim 1, wherein the electrode is helically movable about the centre of the aperture.
7. A device according to claim 1, wherein the radial movement path of the electrode is progressively closer to the inner wall of the aperture or progressively farther from the inner wall of the aperture.
8. A pinhole processing device according to claim 1, wherein the radial movement range of the electrode is 40 μm to 106 μm when the diameter of the electrode is 0.65 mm; alternatively, when the diameter of the electrode is 0.57mm, the radial movement range of the electrode is 40-100 μm.
9. An in situ reduction method of a recast layer, realized by a small hole processing device according to any one of claims 1 to 8, comprising:
s1, processing the small holes;
s2, stopping feeding movement of the servo processing shaft after the small hole processing enters a penetrating stage and completes penetrating processing, and keeping the electrode in place;
s3, the electrode rotates around the central axis of the small hole; pulse spark is generated between the electrode and the wall of the small hole, the pulse spark discharges, and the recast layer is etched away by the high temperature generated by the discharge, so that the thickness of the recast layer is thinned.
10. The method of in-situ thinning of a recast layer according to claim 9, wherein step S3 further comprises: and flushing liquid is carried out in the small hole so as to flush and discharge the chips in the small hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311692108.7A CN117798443A (en) | 2023-12-11 | 2023-12-11 | Small hole machining device and recast layer in-situ thinning method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311692108.7A CN117798443A (en) | 2023-12-11 | 2023-12-11 | Small hole machining device and recast layer in-situ thinning method |
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| CN117798443A true CN117798443A (en) | 2024-04-02 |
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- 2023-12-11 CN CN202311692108.7A patent/CN117798443A/en active Pending
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