CN117794155A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN117794155A CN117794155A CN202211151303.4A CN202211151303A CN117794155A CN 117794155 A CN117794155 A CN 117794155A CN 202211151303 A CN202211151303 A CN 202211151303A CN 117794155 A CN117794155 A CN 117794155A
- Authority
- CN
- China
- Prior art keywords
- heat
- water
- head module
- dissipating device
- conducting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink is adapted to be disposed on a heat source. The heat dissipating device comprises a water cooling head module and a linkage mechanism. The water cooling head module is provided with a water inlet, a water outlet and a cavity communicated with the water inlet and the water outlet, and comprises a heat-conducting plate and a fin assembly. The heat conducting plate is used as a bottom plate of the chamber and is suitable for contacting a heat source, and the fin assembly is positioned in the chamber and is arranged on the heat conducting plate. The linkage mechanism is movably arranged on the water cooling head module, and at least part of the linkage mechanism is positioned in the cavity and is linked with the heat conducting plate. The heat conducting plate is pushed or pulled to deform under the action of the linkage mechanism, so as to conform to the surface contour of the heat source.
Description
Technical Field
The present invention relates to a heat dissipating device, and more particularly, to a heat dissipating device including a water cooling head module.
Background
Generally, a heat source of an electronic device, such as a central processing unit (Central Processing Unit, CPU), is adapted to dissipate heat through a water-cooled head module or a heat sink having a water-cooled head module. However, when the heat dissipating device is disposed on the heat source, a slight gap is easily generated between the heat dissipating device and the heat source due to factors such as surface warpage or surface unevenness of the heat source, thereby affecting the heat dissipating efficiency of the heat dissipating device. Therefore, how to attach the heat dissipating device to the surface of the heat source well to achieve good heat dissipation efficiency is an important research direction in the art.
Disclosure of Invention
The invention aims to provide a heat dissipating device which can be well attached to the surface of a heat source to achieve good heat dissipating efficiency.
The heat dissipating device of the present invention is suitable for being arranged on a heat source. The heat dissipating device comprises a water cooling head module and a linkage mechanism. The water cooling head module is provided with a water inlet, a water outlet and a cavity communicated with the water inlet and the water outlet, and comprises a heat-conducting plate and a fin assembly. The heat conducting plate is used as a bottom plate of the chamber and is suitable for contacting a heat source, and the fin assembly is positioned in the chamber and is arranged on the heat conducting plate
In an embodiment of the invention, the linkage mechanism includes a push rod and a hard plate, wherein the push rod is at least partially located in the cavity, and the hard plate is located in the cavity and between the push rod and the heat conducting plate.
In an embodiment of the invention, the linking mechanism further includes a cushion, and the cushion is located in the cavity and between the hard plate and the heat conducting plate.
In an embodiment of the invention, the fin assembly is located between the cushion and the heat conducting plate.
In an embodiment of the invention, the push rod is fixed on a hard plate body, the hard plate body is fixed on a soft pad, the soft pad is fixed on the fin assembly, and the fin assembly is fixed on the heat conducting plate.
In an embodiment of the invention, the heat conducting sheet includes a central area and a peripheral area surrounding the central area, and the thickness of the central area is smaller than that of the peripheral area.
In an embodiment of the invention, the water-cooling head module includes a hole and a sealing member, the linking mechanism includes a push rod, the push rod is disposed through the hole and is located locally outside the chamber, and the sealing member is disposed between the push rod and a wall surface of the water-cooling head module surrounding the hole.
In an embodiment of the invention, the heat dissipating device further includes a housing detachably disposed on the water-cooling head module to cover the water-cooling head module and the push rod.
In an embodiment of the invention, the heat dissipating device further includes a driving mechanism located outside the chamber and coupled to the coupling mechanism.
In an embodiment of the invention, the heat dissipating device further includes a housing detachably disposed on the water-cooling head module, wherein the water-cooling head module has an outer groove, the driving mechanism is disposed in the outer groove, and the housing covers the water-cooling head module and the driving mechanism.
Based on the above, in the heat dissipating device of the present invention, the linking mechanism is movably disposed on the water-cooled head module and linked to the heat conducting plate. Therefore, after the user applies force to the linkage mechanism, the heat conducting plate is pushed or pulled to deform by the action of the linkage mechanism, so that the heat conducting plate can be well attached and conform to the surface profile of the heat source. The heat dissipating device can effectively conduct out the heat of the heat source, thereby achieving good heat dissipating efficiency.
Drawings
Fig. 1 is a perspective view of a heat dissipating device according to an embodiment of the present invention.
Fig. 2 is a perspective view of the heat dissipating device of fig. 1 at another view angle.
Fig. 3A is a cross-sectional side view of the heat dissipating device of fig. 1 along line AA after the linkage is pushed.
Fig. 3B is a cross-sectional side view of the heat dissipating device of fig. 1 along line AA after the linkage is pulled.
Fig. 4 is a cross-sectional side view of a heat sink according to another embodiment of the invention.
Fig. 5 is a perspective view of a heat dissipating device according to another embodiment of the present invention.
Fig. 6 is a cross-sectional side view of the heat sink of fig. 5 along line BB.
The reference numerals are as follows:
100. 100A, 200 heat sink
110. 210 water cooling head module
111. 211 water inlet
112. 212 water outlet
113. 213 Chamber
114. 214 heat conducting plate
114A, 214A central zone
114B, 214B surrounding area
115. 215 fin assembly
116. 216 holes
117. 217 seal
218 outer groove
120. 220 linking mechanism
121. 221 push rod
122. 222 hard plate body
123 cushion
130 outer cover
140 external mechanism
230 outer casing
240 drive mechanism
AA. BB line segment
S heat source
Detailed Description
Fig. 1 is a perspective view of a heat dissipating device according to an embodiment of the invention, and fig. 2 is a perspective view of the heat dissipating device of fig. 1 at another view angle. It should be noted that some of the components of fig. 1 and 2 are drawn in perspective for clarity and ease of illustration.
Referring to fig. 1 and 2, the heat dissipating device 100 of the present embodiment is suitable for being disposed on a heat source S (fig. 2). The heat dissipating device 100 includes a water-cooling head module 110 and a connecting mechanism 120. The water-cooling head module 110 comprises a water inlet 111, a water outlet 112 and a chamber 113 communicated with the water inlet 111 and the water outlet 112, and the water-cooling head module 110 comprises a heat conducting plate 114 and a fin assembly 115. The heat-conducting plate 114 serves as a floor of the chamber 113 and is adapted to contact the heat source S. The fin assembly 115 is disposed in the chamber 113 and on the heat conducting plate 114, so as to facilitate heat transfer from the heat source S to the heat conducting plate 114, and cool the fin assembly 115 by the cooling liquid in the chamber 113. The heat source S in this embodiment is a central processing unit (Central Processing Unit, CPU), but the present invention is not limited to the type of heat source S.
Further, the heat conducting plate 114 of the present embodiment includes a central region 114A and a peripheral region 114B surrounding the central region 114A, wherein the thickness of the central region 114A is smaller than that of the peripheral region 114B. The heat conducting plate 114 of the present embodiment has grooves formed on both the side of the central region 114A near the fin assembly 115 and the side near the heat source S, so that the thickness of the central region 114A is smaller than that of the peripheral region 114B. However, in other embodiments of the present invention, the heat conductive plate 114 may be provided with grooves only on the side of the central region 114A near the fin assembly 115 or the side near the heat source S, which is not limited by the present invention. In addition, the thickness of the central region 114A and the peripheral region 114B is not limited in the present invention.
In the present embodiment, the linkage mechanism 120 is movably disposed in the water-cooled head module 110, and at least a portion of the linkage mechanism 120 is disposed in the chamber 113 and is linked to the heat-conducting plate 114. In detail, the linkage mechanism 120 includes a push rod 121, a hard plate 122 and a soft pad 123. The pushrod 121 is at least partially disposed within the chamber 113 as shown in fig. 1, and the rigid plate 122 is disposed within the chamber 113 and between the pushrod 121 and the thermally conductive plate 114. The cushion 123 is disposed in the chamber 113 between the rigid plate 122 and the heat conductive plate 114 as shown in fig. 1, and the fin assembly 115 is disposed between the cushion 123 and the heat conductive plate 114. However, in other embodiments of the present invention, the linking mechanism 120 may be completely located in the chamber 113 and linked to the heat conducting plate 114. The hard plate 122 may be directly disposed on the heat-conducting plate 114, and the fin assembly 115 is disposed on the heat-conducting plate 114 but not between the soft pad 123 and the heat-conducting plate 114, which is not limited by the present invention.
Fig. 3A is a cross-sectional side view of the heat dissipating device of fig. 1 along line AA after the linkage is pushed, and fig. 3B is a cross-sectional side view of the heat dissipating device of fig. 1 along line AA after the linkage is pulled. It should be noted that the deformed portion of the heat dissipating device in fig. 3A and 3B is drawn with a larger deformation degree, so as to achieve the purposes of clear illustration and convenient explanation.
Referring to fig. 3A and 3B, it is noted that the push rod 121 of the present embodiment is fixed to the hard plate 122, the hard plate 122 is fixed to the soft pad 123, the soft pad 123 is fixed to the fin assembly 115, and the fin assembly 115 is fixed to the heat conducting plate 114. In this way, when the user applies force to the push rod 121 of the linkage mechanism 120 by pushing, pulling or rotating, the heat conducting plate 114 is pushed to the convex deformation state shown in fig. 3A or pulled to the concave deformation state shown in fig. 3B by the action of the linkage mechanism 120, so that the heat conducting plate 114 can be well attached and conform to various surface contours such as concave or convex of the heat source S. The heat sink 100 can thus efficiently conduct heat from the heat source due to good adhesion between the surface contours of the heat-conducting plate 114 and the heat source S, achieving good heat dissipation performance.
In the present embodiment, the hard plate 122 is helpful for the user to have a larger distribution area of the force applied by the linkage mechanism 120, so that the heat conducting plate 114 has a larger deformation range. In addition, the cushion 123 between the hard plate 122 and the fin assembly 115 can balance the force applied by the user through the linkage mechanism 120 in a manner of deforming and conforming to the outline of the fin assembly 115, so as to avoid damage of the fin assembly 115 due to uneven force application.
In the present embodiment, the water-cooling head module 110 of the heat dissipating device 100 includes a hole 116 and a sealing member 117. The push rod 121 of the linkage mechanism 120 is disposed through the hole 116 and is partially located outside the chamber 113, and the sealing member 117 is disposed between the push rod 121 and a wall surface of the water cooling head module 110 surrounding the hole 116. The sealing member 117 can prevent the cooling liquid in the water-cooling head module 110 from flowing out of the gap between the hole 116 and the push rod 121, thereby providing sealing effect.
Fig. 4 is a cross-sectional side view of a heat sink according to another embodiment of the invention. It should be noted that, part of the components in fig. 4 are drawn by means of a dashed outline frame for clarity and ease of illustration.
Referring to fig. 3A, 3B and 4, the heat dissipating device 100A of the present embodiment is different from the heat dissipating device 100 shown in fig. 3A in that the heat dissipating device 100A includes an outer cover 130 and an external mechanism 140. The outer cover 130 is disposed on the water-cooled head module 110 and covers the push rod 121 of the linkage mechanism 120, and the external mechanism 140 is linked to the push rod 121 of the linkage mechanism 120. The provision of the outer cap 130 helps to further stop the exiting cooling liquid and retain it within the outer cap 130 when it inadvertently exits between the seal 117 and the push rod 121, providing a further sealing effect.
In addition, when the external mechanism 140 is manually rotated, the user can rotate, push or pull the linkage mechanism 120, so that the heat conducting plate 114 is concave or convex under the action of the linkage mechanism 120, and the heat conducting plate 114 can conform to and conform to various surface contours such as concave or convex of the heat source S (fig. 3A and 3B). The heat sink 100 can thus efficiently conduct heat from the heat source due to good adhesion between the surface contours of the heat-conducting plate 114 and the heat source S, achieving good heat dissipation performance. The external mechanism 140 of the present embodiment may also automatically drive the linkage mechanism 120 to rotate, push or pull, which is not limited by the present invention.
Fig. 5 is a perspective view of a heat sink according to another embodiment of the present invention, and fig. 6 is a cross-sectional side view of the heat sink of fig. 5 along line BB. It should be noted that, the parts of fig. 5 and 6 are drawn by perspective or dashed outline for clarity and ease of illustration.
Referring to fig. 1, 5 and 6, compared with the heat dissipating device 100 shown in fig. 1, the difference between the heat dissipating device 200 of the present embodiment and the heat dissipating device is that the heat dissipating device 200 further comprises a housing 230 and a driving mechanism 240, the water-cooling head module 210 has an outer groove 218 as shown in fig. 6, the hard plate 222 of the linking mechanism 220 is directly fixed on the heat conducting plate 214, and the fin assembly 215 is disposed on the heat conducting plate 214 and not located between the hard plate 222 and the heat conducting plate 214. The drive mechanism 240 is located in the outer recess 218 outside the chamber 213. The casing 230 is detachably disposed on the water-cooling head module 210 to cover the water-cooling head module 210, the push rod 221 and the driving mechanism 240.
In the present embodiment, the user can drive the linkage mechanism 220 to rotate, push or pull through the automatically rotating driving mechanism 240, so that the heat conducting plate 214 is concave or convex under the action of the linkage mechanism 220, and the heat conducting plate 214 can be well attached and conform to various surface contours of the heat source S (fig. 6). The heat sink 200 can thus efficiently conduct heat from the heat source S due to good adhesion between the surface contours of the heat-conducting plate 214 and the heat source S, achieving good heat dissipation performance.
In summary, in the heat dissipating device of the present invention, the linking mechanism is movably disposed on the water-cooled head module and linked to the heat conducting plate. Therefore, after the user applies force to the linkage mechanism, the heat conducting plate is pushed or pulled to deform under the action of the linkage mechanism, so that the heat conducting plate is well attached and conforms to the surface profile of the heat source. The heat dissipating device can effectively conduct out the heat of the heat source, thereby achieving good heat dissipating efficiency.
Claims (10)
1. A heat sink adapted to be disposed on a heat source, comprising:
the water cooling head module is provided with a water inlet, a water outlet and a cavity communicated with the water inlet and the water outlet, and comprises a heat conducting plate and a fin component, wherein the heat conducting plate is used as a bottom plate of the cavity and is suitable for contacting the heat source, and the fin component is positioned in the cavity and is arranged on the heat conducting plate; and
a linkage mechanism movably arranged in the water-cooling head module, at least partially positioned in the chamber and linked with the heat-conducting plate, wherein
The heat conducting plate is pushed or pulled to deform under the action of the linkage mechanism, so as to conform to the surface contour of the heat source.
2. The heat dissipating device of claim 1, wherein the linkage comprises a pushrod and a rigid plate, the pushrod being at least partially disposed in the chamber, the rigid plate being disposed in the chamber and between the pushrod and the heat conductive plate.
3. The heat dissipating device of claim 2, wherein the linkage further comprises a cushion disposed within the chamber and between the rigid plate and the heat conductive plate.
4. The heat dissipating device of claim 3, wherein the fin assembly is located between the cushion and the heat conductive plate.
5. The heat dissipating device of claim 4, wherein the pushrod is fixed to the rigid plate, the rigid plate is fixed to the cushion, the cushion is fixed to the fin assembly, and the fin assembly is fixed to the thermally conductive plate.
6. The heat dissipating device of claim 1, wherein the heat conducting plate comprises a central region and a peripheral region surrounding the central region, and the thickness of the central region is smaller than the thickness of the peripheral region.
7. The heat dissipating device of claim 1, wherein the water-cooled head module comprises a hole and a sealing member, the linkage mechanism comprises a push rod penetrating the hole and partially located outside the chamber, and the sealing member is disposed between the push rod and a wall surface of the water-cooled head module surrounding the hole.
8. The heat dissipating device of claim 7, further comprising a housing removably disposed on the water-cooled head module to cover the water-cooled head module and the push rod.
9. The heat dissipating device of claim 1, further comprising a driving mechanism disposed outside the chamber and coupled to the coupling mechanism.
10. The heat dissipating device of claim 9, further comprising a housing removably disposed on the water-cooled head module, wherein the water-cooled head module has an outer recess, the driving mechanism is disposed in the outer recess, and the housing covers the water-cooled head module and the driving mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211151303.4A CN117794155A (en) | 2022-09-21 | 2022-09-21 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211151303.4A CN117794155A (en) | 2022-09-21 | 2022-09-21 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117794155A true CN117794155A (en) | 2024-03-29 |
Family
ID=90395124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211151303.4A Pending CN117794155A (en) | 2022-09-21 | 2022-09-21 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117794155A (en) |
-
2022
- 2022-09-21 CN CN202211151303.4A patent/CN117794155A/en active Pending
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| PB01 | Publication | ||
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