CN117794087A - Circuit board manufacturing method - Google Patents

Abstract

The application is applicable to the technical field of circuit board manufacturing, and provides a circuit board manufacturing method, which comprises the following steps: providing a core plate; forming a first pattern and a second pattern penetrating through the core plate on the core plate, wherein the first pattern is used for carrying product information, and the first pattern and the second pattern are symmetrically and mirror-arranged along a virtual center line on the core plate; manufacturing an inner layer circuit on the core plate; in the manufacturing method of the circuit board, the first pattern and the second pattern penetrate through the core board, so that the identification equipment can acquire the first pattern and the second pattern on any side of the core board, and the pattern can be formed on the side of the core board, which is thinner, when the side of the core board, which is thicker, faces upwards; the first pattern and the second pattern mirror image are arranged along the virtual center line mirror image of the core plate, so that the identification equipment can identify the product information of the core plate on any side of the core plate, the negative influence of different core plate placement directions on information identification is reduced, and the identification efficiency is improved.

Description

Circuit board manufacturing method

Technical Field

The present disclosure relates to the field of circuit board manufacturing technologies, and in particular, to a circuit board manufacturing method.

Background

Along with the development of information technology, the requirements for the application of the printed circuit board (Printed Circuit Board, PCB) are also higher and higher, and the production information of the PCB can be tracked and recorded by manufacturing the two-dimensional code on the PCB, including the production date, the number, the batch, the manufacturer, the production parameters and the like of the PCB.

At present, a core board with different copper layer thicknesses at two sides is provided, the core board is easy to tilt at one side with a thinner copper layer thickness to cause the problem of plate tilting, and in order to reduce the problem of plate tilting, the thicker copper layer side of the core board is usually directed upwards in the manufacturing process of a circuit board so as to reduce the problem of plate tilting by the gravity of the core board and reduce the risk of a clamping board. In the process of forming the two-dimensional code, the core board generally forms the two-dimensional code on a thinner copper layer according to the requirements of working procedures such as pressing during outer layer circuit manufacture, and the two-dimensional code is not easy to read in the process of forming a circuit board.

Disclosure of Invention

In view of the above problems, the present application provides a method for manufacturing a circuit board, which alleviates the problem that the two-dimensional code is not easy to read in the manufacturing process of the current circuit board.

The embodiment of the application provides a circuit board manufacturing method, which comprises the following steps:

providing a core plate;

forming a first pattern and a second pattern penetrating through the core plate on the core plate, wherein the first pattern is used for carrying product information, and the first pattern and the second pattern are symmetrically and mirror-arranged along a virtual center line on the core plate;

and manufacturing an inner layer circuit on the core plate.

In the technical scheme provided by the embodiment, the first pattern and the second pattern penetrate through the core plate, so that the identification equipment can acquire the first pattern and the second pattern on any side of the core plate, and the pattern can be formed on the side of the core plate, which is thinner, when the side of the core plate, which is thicker, faces upwards; the first pattern and the second pattern mirror image are arranged along the virtual center line mirror image of the core plate, so that the identification equipment can identify the product information of the core plate on any side of the core plate, the negative influence of different core plate placement directions on information identification is reduced, and the identification efficiency is improved.

In some embodiments, in the step of providing the core plate:

the core board comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are respectively arranged on two opposite sides of the substrate, and the thicknesses of the first metal layer and the second metal layer are different.

In the technical scheme of the embodiment, the thicknesses of the metal layers on two sides of the substrate are different, so that the identification equipment can still collect and identify the information carried by the first pattern or the second pattern when the thicknesses of the metal layers on two sides of the core board are different, and the information is not easily influenced by the placement direction of the core board.

In some embodiments, in the step of forming the first pattern and the second pattern through the core plate on the core plate, a plurality of first through holes and second through holes are formed through the core plate, the plurality of first through holes forming the first pattern, and the plurality of second through holes forming the second pattern.

The technical scheme of the embodiment provides a method for specifically forming a plurality of first patterns and second patterns, wherein the first patterns are formed through a plurality of first through holes penetrating through a core plate, and the second patterns are formed through a plurality of second through holes penetrating through the core plate, so that the first patterns and the second patterns can carry information of products, meanwhile, damage to the core plate can be reduced, and the forming difficulty of the through holes is low.

In some embodiments, the first via and the second via are each formed by a laser drilling process.

The technical scheme of this embodiment provides the mode of formation of some first through-holes and second through-holes, forms first through-holes and second through-holes through laser drilling technology, and efficiency is higher and the precision is higher, can also realize contactless processing simultaneously, and stability is higher.

In some embodiments, after the step of forming the first pattern and the second pattern through the core board on the core board, the circuit board manufacturing method further includes:

and (3) identification: the first pattern or the second pattern is identified by an identification device.

In the technical solution of this embodiment, the identification device is enabled to identify the first pattern when the core board is placed forward, and is enabled to identify the second pattern when the core board is placed backward, so that the identification device can identify the information of the core board which is not easily affected by the placement direction of the core board and is stable.

In some embodiments, in the identifying step, a light source device is provided on a side of the core board opposite to the identifying device, the light source device being adapted to illuminate the first pattern and/or the second pattern.

In the technical scheme of the embodiment, the first pattern and/or the second pattern are/is irradiated through the light source device, so that light can pass through the first through hole and/or the second through hole, and a more obvious pattern is formed on one side of the core board facing the identification device, so that the identification device can better identify the first pattern or the second pattern.

In some embodiments, the power range of the light source device is 20W to 50W.

The technical scheme of the embodiment provides the power range of the light source equipment, so that the light rays emitted by the light source equipment can more easily pass through the first through hole and/or the second through hole, and the identification equipment is convenient to identify.

In some embodiments, the step of fabricating the inner layer line on the core board includes a pretreatment sub-step, a coating sub-step, an exposure sub-step, and an etching sub-step;

an identification step is performed before each of the pretreatment sub-step, the coating sub-step, the exposure sub-step, and the etching sub-step.

In the technical scheme of the embodiment, an identification step is arranged before each sub-step of preparing the inner layer circuit, so that each sub-step can confirm product information before execution, and each sub-step can confirm production parameters, thereby being convenient for improving the product yield, reducing processing errors and simultaneously being convenient for updating the product information along with each sub-step.

In some embodiments, in the coating substep, a wet film is coated on the core plate, and the wet film has a thickness ranging from 10 μm to 14 μm.

Because of wet film thickness is thinner and easily leads to circuit breaking to lead to negative effect to wire performance, and wet film thickness is thicker and then easily leads to cost increase and reduce machining efficiency, accordingly, the technical scheme of this embodiment provides the thickness scope of wet film, can enough reduce the condition of circuit breaking, also can reduce cost and raise the efficiency.

In some embodiments, before the step of fabricating the inner layer wire on the core board, the circuit board fabrication method further includes:

and baking the core plate.

In the technical scheme of the embodiment, the core plate is baked, so that the moisture in the core plate can be reduced, the stress in the core plate can be reduced, and the risk of deformation of the core plate is reduced.

The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above-mentioned and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application will be given.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of a core board after forming a first pattern and a second pattern in a method for manufacturing a circuit board according to some embodiments of the present application.

Fig. 2 is a schematic cross-sectional view at A-A in fig. 1.

Fig. 3 is a schematic cross-sectional view at B-B in fig. 1.

Fig. 4 is a schematic cross-sectional view of a core board after a coating sub-step in a circuit board manufacturing method according to some embodiments of the present application.

Fig. 5 is a schematic structural diagram of a core board in a recognition step in a circuit board manufacturing method according to some embodiments of the present application.

Fig. 6 is a flow chart of a circuit board manufacturing method according to some embodiments of the present application.

Fig. 7 is a flowchart illustrating steps of preparing an inner layer circuit and identifying the inner layer circuit on a core board in a circuit board manufacturing method according to some embodiments of the present application.

Fig. 8 is a schematic flow chart of a circuit board manufacturing method according to other embodiments of the present application.

The meaning of the labels in the figures is:

10. a core plate; 101. a first pattern; 102. a second pattern; 103. a first through hole; 104. a second through hole; 105. a virtual midline; 11. a substrate; 12. a first metal layer; 13. a second metal layer;

20. a film layer;

30. an identification device;

40. a light source device.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings, i.e. embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper," "lower," "left," "right," and the like are used for convenience of description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements in question must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting of the patent. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.

It should be further noted that, in the embodiments of the present application, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present application, reference numerals may be given to only one of the parts or the parts in the drawings by way of example, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.

Along with the development of information technology, the requirements for the application of the printed circuit board (Printed Circuit Board, PCB) are also higher and higher, and the production information of the PCB can be tracked and recorded by manufacturing the two-dimensional code on the PCB, including the production date, the number, the batch, the manufacturer, the production parameters and the like of the PCB.

At present, a core board with different copper layer thicknesses at two sides exists, one side of a substrate is thicker in copper layer thickness and the other side of the substrate is thinner in copper layer thickness, so that the core board is easily tilted to one side with thinner copper layer thickness, and the problem of plate tilting occurs. In order to reduce the occurrence of the warpage problem, a thicker side of the core plate copper layer is generally directed upwards in the manufacturing process of the circuit board, so that the occurrence of the warpage problem is reduced through the gravity of the core plate, and the risk of a clamping plate is reduced.

In the process of forming the two-dimensional code, the forming position of the two-dimensional code needs to be determined by combining the requirements of subsequent various processes (such as a pressing process during outer layer circuit manufacture, and the like), wherein the two-dimensional code needs to be formed on the side with the thinner copper layer in many cases; however, in the process of manufacturing the circuit board, the thicker side of the copper layer of the core board needs to be directed upwards, so that the two-dimensional code on the thinner side of the copper layer of the core board is not easy to read in the process of manufacturing the circuit board.

In order to solve the problem that the two-dimensional code is difficult to read, the two-dimensional code is oriented to the identification equipment in a manual overturning mode at present, and the core plate is overturned again after the two-dimensional code is identified, so that one thicker side of the core plate copper layer is oriented upwards, the operation is very tedious, the core plate is easy to break in the overturning process, and the like, so that the quality of the circuit board is easy to be negatively influenced.

Based on the above considerations, the embodiments of the present application provide a first pattern and a second pattern on a core board that can penetrate the core board, and mirror-symmetrical the first pattern and the second pattern with respect to a virtual center line of the core board, where the first pattern carries product information.

In such a circuit board, since the first pattern and the second pattern penetrate the core board, that is, the first pattern and the second pattern can be formed on opposite sides of the core board, no matter which one of the opposite sides of the core board faces upward, the identification device can identify the product information of the core board, without identifying the product information of the core board by turning over the core board, thereby simplifying the manufacturing process of the circuit board.

The method for manufacturing the circuit board disclosed by the embodiment of the invention can be applied to the core boards 10 with different copper layer thicknesses at two sides of the substrate 11, and can also be applied to the core boards 10 with the same copper layer thicknesses at two sides of the substrate 11.

Some embodiments of the present application provide a circuit board manufacturing method, referring to fig. 1 and 6, including the steps of:

s510: a core 10 is provided.

In this step, the core board 10 is a base material constituting a circuit board, and its shape may be set as needed; for example, the core 10 may have undergone a blanking process, which refers to selecting a correct plate according to a blanking pattern and then using an automatic cutter to cut the plate to a predetermined size.

S520: a first pattern 101 and a second pattern 102 penetrating the core board 10 are formed on the core board 10.

Wherein the first pattern 101 is for carrying product information, and the first pattern 101 and the second pattern 102 are symmetrically mirror-image arranged along an imaginary center line 105 on the core board 10.

The first pattern 101 is a pattern formed on the core board 10 for carrying product information, the first pattern 101 may be a two-dimensional code, a bar code, or a plurality of dot arrays, or lines; the product information carried by the first pattern 101 may include the size of the core board 10, the shape of the line corresponding to the core board 10, etc.; the first pattern 101 penetrates the core 10, i.e. the dots or lines forming the first pattern 101 penetrate the substrate 11.

The virtual center line 105 refers to a virtual line set on the core board 10, and the virtual center line 105 can divide the core board 10 into two symmetrical parts, and the virtual center line 105 may be parallel to the traveling direction of the core board 10 during the machining process or perpendicular to the traveling direction of the core board 10 according to the position of the identification device 30. In some embodiments, the virtual midline 105 is parallel to the direction of travel of the core 10.

The second pattern 102 and the first pattern 101 are mirror-symmetrical along the virtual center line 105, and the second pattern 102 also penetrates the substrate 11, i.e. the points or lines forming the second pattern 102 penetrate the substrate 11.

The first pattern 101 and the second pattern 102 each extend through the core 10 such that the identification device 30 is able to acquire the first pattern 101 and the second pattern 102 on either side of the core 10; the collection of the first pattern 101 or the second pattern 102 by the identification device 30 refers to that the identification device 30 can obtain the first pattern 101 and the second pattern 102, but does not determine whether the product information carried by the first pattern 101 or the second pattern 102 can be obtained.

When the product information carried by the first pattern 101 can be identified, the information carried by the second pattern 102 on the same side of the core 10 cannot be identified; the identification of the product information carried by the first pattern 101 or the second pattern 102 means that the identification device 30 can acquire the product information carried by the first pattern 101 or the second pattern 102.

By way of example, the two sides of the core 10 having the first pattern 101 and the second pattern 102 are respectively defined as the front and the back, and it is defined that the product information carried by the first pattern 101 can be recognized on the front, and when the front of the core 10 faces upward and is opposite to the recognition device 30, the product information carried by the first pattern 101 can be recognized, and at this time, the product information carried by the second pattern 102 cannot be recognized; while when the opposite side of the core plate 10 faces upward and is opposite to the identification device 30, the product information carried by the second pattern 102 can be identified, and the product information carried by the first pattern 101 cannot be identified.

It will be appreciated that, depending on the coverage area of the identification device 30, the identification device 30 is able to collect both the first pattern 101 and the second pattern 102 regardless of which side of the core 10 is facing the identification device 30, but the identification device 30 is only able to identify product information carried by one of the first pattern 101 or the second pattern 102, where product information carried by the other of the two cannot be identified by the device due to mirror symmetry.

S540: an inner layer wire is formed on the core board 10.

In this step, an inner layer wiring pattern may be formed on the core board 10 by a coating process, an exposure process, an etching process, and the like, wherein the coating process is a process of coating the film layer 20 on the core board 10 according to the wiring pattern, and the exposure process is a process of curing the film layer 20; the etching step is a step of gradually dissolving the unnecessary metal layer on the core board 10 and forming a desired circuit pattern.

It will be appreciated that the circuit board manufacturing method may also include the steps of making the outer layer wiring, inspecting, etc.

In the present embodiment, the first pattern 101 and the second pattern 102 are each made to penetrate the core board 10 so that the identification device 30 can collect the first pattern 101 and the second pattern 102 on either side of the core board 10; the first pattern 101 and the second pattern 102 are arranged in a mirror image along the virtual center line 105 of the core board 10, so that the identification equipment can identify the product information of the core board 10 on any side of the core board 10, thereby reducing the negative influence of different placement directions of the core board 10 on information identification and improving the identification efficiency; the process of turning over the core plate 10 is also saved, the production efficiency is improved, and meanwhile, the damage of the core plate 10 is reduced.

Referring to fig. 1, 2, 3, in some embodiments, in the step of providing the core plate 10, i.e., in S510:

the core 10 includes a substrate 11, a first metal layer 12 and a second metal layer 13, the first metal layer 12 and the second metal layer 13 are respectively disposed on two opposite sides of the substrate 11, and the thicknesses of the first metal layer 12 and the second metal layer 13 are different.

In this step, the substrate 11 is a structure that provides a base for the first metal layer 12 and the second metal layer 13, and the material of the substrate may include phenolic resin, fiber paper, glass cloth, or other materials.

The first metal layer 12 and the second metal layer 13 are respectively disposed on two opposite sides of the substrate 11, the first metal layer 12 and the second metal layer 13 are usually copper layers, and the first metal layer 12 and the second metal layer 13 may also comprise other materials; in some embodiments, the substrate 11 is a copper foil substrate 11, where the first metal layer 12 and the second metal layer 13 are both copper layers.

The thicknesses of the first metal layer 12 and the second metal layer 13 are different to meet different design requirements, for example, the core board 10 with different thicknesses of the metal layers at two sides can be used in a circuit board with higher space utilization requirement and higher circuit stability requirement.

Because the thicknesses of the first metal layer 12 and the second metal layer 13 on the two sides of the substrate 11 are different, the metal layer with a thicker thickness is required to face upwards in the process of manufacturing the circuit board, so that the occurrence of warpage is reduced, and the clamping plate is reduced.

In this embodiment, the thicknesses of the metal layers on both sides of the substrate 11 are different, so that the identification device 30 can still collect and identify the information carried by the first pattern 101 or the second pattern 102 when the thicknesses of the metal layers on both sides of the core 10 are different, and is not easily affected by the placement direction of the core 10.

Referring to fig. 1, 2, 3, in the step of forming the first pattern 101 and the second pattern 102 penetrating the core board 10 on the core board 10, i.e., in S520:

the core board 10 is formed with a plurality of first through holes 103 and second through holes 104 penetrating the core board 10, the plurality of first through holes 103 forming a first pattern 101, and the plurality of second through holes 104 forming a second pattern 102.

The first through hole 103 refers to a hole-like structure penetrating the core board 10; the shape of the first through hole 103 may be square, circular, or other shapes.

The plurality of first through holes 103 can form the first pattern 101 by an arrangement manner such as an array, and at this time, the number of the first through holes 103 may be determined according to the aperture of the first through holes 103, the size of the first pattern 101, product information carried by the first pattern 101, the recognition capability of the recognition apparatus 30, and the like.

Similar to the first through holes 103, the second through holes 104 refer to hole-like structures penetrating the core board 10; the shape of the second through hole 104 may be square, circular, or other shapes.

The plurality of second through holes 104 can form the second pattern 102 in an array or the like, and at this time, the number of the second through holes 104 may be determined according to the aperture of the second through holes 104, the size of the second pattern 102, the product information carried by the second pattern 102, the identification capability of the identification device 30, and the like.

Since the first pattern 101 and the second pattern 102 are mirror symmetrical about the virtual center line 105, the shape, aperture, etc. of the first via 103 and the second via 104 are also the same, and only the positions of the first via 103 and the second via 104 are different.

The first patterns 101 are formed by the first through holes 103 penetrating through the core board 10, and the second patterns 102 are formed by the second through holes 104 penetrating through the core board 10, so that the first patterns 101 and the second patterns 102 can carry information of products, meanwhile, damage to the core board 10 can be reduced, and the forming difficulty of the through holes 103 is low.

The first and second through holes 103 and 104 may be formed by laser drilling, or may be formed by drill drilling or other drilling processes.

In some embodiments, the first via 103 and the second via 104 are both formed via a laser drilling process.

The laser drilling process has higher efficiency, higher precision and wide material adaptability (can be suitable for metal, nonmetal, composite materials and the like), and the laser drilling equipment can realize non-contact drilling without contacting the core plate 10, so that the abrasion to the core plate 10 is reduced; the first through hole 103 and the second through hole 104 are formed through a laser drilling process, so that the efficiency is high, the precision is high, meanwhile, the non-contact machining can be realized, and the stability is high.

The power, speed and frequency of laser drilling can be differentiated according to the different thicknesses of the copper layers, wherein:

when the thickness of the first metal layer 12 is 1OZ (ounce) and the thickness of the second metal layer 13 is 0.5OZ, the power of laser drilling is 100mJ (millijoules), the speed of laser drilling is 350mm/min (millimeters per minute), and the frequency of laser drilling is 100HZ (hertz);

when the thickness of the first metal layer 12 is 2OZ (ounce) and the thickness of the second metal layer 13 is 0.5OZ, the power of laser drilling is 100mJ (millijoules), the speed of laser drilling is 300mm/min (millimeters per minute), and the frequency of laser drilling is 100HZ;

when the thickness of the first metal layer 12 is 2OZ (ounce) and the thickness of the second metal layer 13 is 1OZ, the power of laser drilling is 100mJ (millijoules), the speed of laser drilling is 250mm/min (millimeters per minute), and the frequency of laser drilling is 100HZ.

Referring to fig. 4 and 7, in some embodiments, the step of fabricating the inner layer wire on the core board 10, that is, in S540, includes S541: preprocessing substep, S542: coating substep, S543: exposure substep, S544: etching substep.

Wherein, S541: the pretreatment sub-step refers to a step of pretreating the core plate 10, and may include a step of pickling, washing, grinding, and the like the core plate 10.

Wherein S542: the coating sub-step refers to a step of coating the film layer 20 on the core plate 10; the film layer 20 can be a wet film, and the wet film has better filling capability and can better cover uneven parts or hole structures on the core plate 10; the film layer 20 may also be a dry film to facilitate handling and provide a smoother, more uniform coverage of the core 10.

In step S542, the coated film layer 20 may be a dry film or a wet film; in some embodiments, the S542 coated film layer 20 is a wet film, and the wet film thickness ranges from 10 μm (micrometers) to 14 μm, and exemplary wet film thicknesses may be 10 μm, 10.5 μm, 11 μm, 11.5 μm, 12 μm, 12.5 μm, 13 μm, 13.5 μm, 14 μm, or other values.

The circuit is broken easily due to the fact that the wet film is thinner, so that the performance of the lead is negatively affected, and the cost is increased and the processing efficiency is reduced easily due to the fact that the wet film is thicker; in the thickness range of 10 μm to 14 μm, the wet film can reduce the circuit breaking condition, reduce the cost and improve the efficiency.

Wherein, S543: the exposure sub-step refers to a step of curing the circuit pattern on the core board 10.

Wherein, S544: the etching sub-step refers to a step of forming a circuit pattern on the core board 10 by removing a portion of metal on the core board 10 to form the circuit pattern on the core board 10; for example, the metal other than the circuit pattern may be removed in this step, and the metal remaining on the core board 10 at this time forms the circuit pattern; for another example, the metal corresponding to the circuit pattern may be removed, and a groove pattern, that is, a circuit pattern, may be formed on the metal layer left on the core board 10.

In some embodiments, after the step of forming the first pattern 101 and the second pattern 102 penetrating the core board 10 on the core board 10, the circuit board manufacturing method further includes:

s550: and (3) an identification step.

In this step, the first pattern 101 or the second pattern 102 is recognized by the recognition device 30.

The recognition device 30 refers to a device capable of acquiring and recognizing the first pattern 101 and the second pattern 102, the acquisition of the recognition device 30 refers to the recognition device 30 being capable of acquiring the first pattern 101 or the second pattern 102, and the recognition of the recognition device 30 refers to the recognition device 30 being capable of acquiring product information carried by the first pattern 101 and the second pattern 102.

The recognition device 30 may comprise an image acquisition unit, but also an analysis unit, a control unit or other structures or units; the image acquisition unit can be a camera or other structures capable of acquiring images; the analysis unit is used for analyzing the acquired image, which may be a program preset in the recognition device 30; the control unit is used for controlling the working state of the identification device 30, and may be a controller or other control structures, or may be a control program preset in the identification device 30, etc.

The identification step may be provided before the step of S540 in order to confirm the product information of the core board 10 before the inner layer wire is manufactured, thereby facilitating the manufacture of different inner layer wires for different core boards 10 according to the need.

In the present embodiment, the identification device 30 is enabled to identify the first pattern 101 when the core board 10 is placed in the forward direction, and is information that the identification device 30 is enabled to identify the second pattern 102 when the core board 10 is placed in the reverse direction, so that the identification device 30 is enabled to identify the core board 10 that is not easily stabilized by the influence of the placement direction of the core board 10.

Referring to fig. 5, in some embodiments, in the identification step, a light source device 40 is provided at a side of the core board 10 opposite to the identification device 30, and the light source device 40 is used to irradiate the first pattern 101 and/or the second pattern 102.

The light source device 40 refers to a light emitting device for irradiating the first pattern 101 and/or the second pattern 102, and the light source device 40 may be an LED lamp, a halogen lamp, an incandescent lamp, or other light source device 40 capable of emitting light, and the light source device 40 may irradiate only the first pattern 101 or the second pattern 102, or may irradiate both the first pattern 101 and the second pattern 102.

It will be appreciated that the light source device 40 should at least be capable of illuminating a pattern opposite the identification device 30; for example, the pattern is a first pattern 101 when the core 10 is facing upward and a second pattern 102 when the core 10 is facing upward. In some embodiments, the light source device 40 is opposite to the identification device 30 and is respectively located on two opposite sides of the core board 10, so that the light rays transmitted by the light source device 40 through the first through hole 103 or the second through hole 104 can form the first pattern 101 or the second pattern 102 and be collected by the identification device 30.

Since the circuit board is coated with the film layer 20 or other cover layer during the manufacturing process, it is easy to cause the first pattern 101 and the second pattern 102 to be covered, and the success rate of recognizing the first pattern 101 and the second pattern 102 by the device is reduced.

Accordingly, in this embodiment, the first pattern 101 and/or the second pattern 102 are irradiated by the light source device 40, so that light can pass through the first through hole 103 and/or the second through hole 104, and a more distinct pattern is formed on the side of the core board 10 facing the identification device 30, so that the identification device 30 better identifies the first pattern 101 or the second pattern 102.

In some embodiments, the power of the light source device 40 ranges from 20W (watts) to 50W, and by way of example, the power of the light source device 40 may be 20W, 25W, 30W, 35W, 40W, 45W, 50W, or other values.

The light emitted from the light source device 40 should have a certain wavelength and intensity, affected by the thickness, light transmission property, etc. of the film layer 20 covering the first and second through holes 103 and 104, so as to form a more distinct first pattern 101 or second pattern 102, thereby enabling easier collection of the identification device 30.

Accordingly, the present embodiment provides a power range of the light source device 40 so that the light emitted from the light source device 40 can pass through the first through hole 103 and/or the second through hole 104 and form the more distinct first pattern 101 and/or the second pattern 102, thereby facilitating the recognition by the recognition device 30.

Referring to fig. 7, in some embodiments, the identifying step is performed before each of the pre-processing sub-step, the coating sub-step, the exposing sub-step, and the etching sub-step.

In each sub-step of S540, a step of S550 is provided before each sub-step, so that the product information of the core board 10 can be determined in advance before the operation of each step, and each parameter of the step can be confirmed according to the product information, thereby reducing occurrence of misoperation.

For example, before the sub-step of pre-processing in S541, the identifying step in S550 is performed so as to confirm the product information of the core plate 10 before the step in S541 is performed, so as to determine parameters such as the grinding size corresponding to the corresponding core plate 10 in S541.

For example, the identifying step of S550 is performed before the coating step of S542, so that the product information of the core board 10 is confirmed before the step of S542 is performed, so that the parameters such as the thickness of the film layer 20 coated on the corresponding core board 10 are determined in the step of S542.

For example, the identifying step of S550 is performed before the exposing step of S543, so as to confirm the product information of the core plate 10 before the performing step of S543, so as to confirm the parameters such as the exposure time corresponding to the corresponding core plate 10 in step S543.

For example, the identifying step of S550 is performed before the etching step of S544, so as to confirm the product information of the core board 10 before the step of S544 is performed, so as to confirm the corresponding etching time and other parameters of the corresponding core board 10 in the step of S544.

It will be appreciated that the identification device 30 and the light source device 40 are provided on the device corresponding to each of the sub-steps S541 to S544, it is also possible to separately provide the identification device 30 and the light source device 40 and to carry out the step S550 of identifying the core board 10 to the identification device 30 before each sub-step.

In this embodiment, an identification step is set before each sub-step of preparing the inner layer circuit, so that each sub-step can confirm product information before execution, so that each sub-step can confirm production parameters, thereby facilitating improvement of product yield, reduction of processing errors, and updating of product information along with each sub-step.

Referring to fig. 8, in some embodiments, before the step of fabricating the inner layer wire on the core board 10, i.e., before the step S540, the circuit board fabrication method further includes:

s530: the core board 10 is subjected to a baking process.

In this step, the baking treatment of the core 10 is mainly used to remove the excessive moisture absorbed by the core 10 from the external environment, and reduce the possible welding defects (such as explosion plate) during the processing, thereby reducing the reject ratio of the core 10.

At the same time, the baking helps to eliminate the stress in the core 10 and reduce the risk of deformation of the core 10.

In some embodiments, after the inner layer wire is fabricated on the core board 10, the circuit board fabrication method may further include: making the outer layer wire on the core 10, for example, may include:

electroplating: plating, such as nickel-gold plating, is performed on the film 20 and fenestration sites on opposite sides of the core 10.

Film stripping: the membrane layer 20 is washed clean by the membrane stripping liquid.

Etching: the opposite sides of the core plate 10 are etched by an etching solution.

And (3) forming: the core plate 10 is cut into corresponding finished units by using a gong machine by adopting corresponding data.

And (3) electric measurement: and removing the product with open circuit and short circuit by using electrical measurement equipment.

Shipment inspection (Final Quality Control, FQC): and checking according to preset appearance requirements.

In some embodiments, a circuit board manufacturing method includes:

s510: a core 10 is provided.

S520: first and second patterns 101 and 102 penetrating the core plate 10 are formed on the core plate 10, the first and second patterns 101 and 102 being spaced apart from the edge of the core plate 10 by 5mm (millimeters) in the plate feeding direction of the core plate 10, and the first and second patterns 101 and 102 being spaced apart from the virtual center line 105 by 19mm.

A plurality of first through holes 103 formed by laser drilling are arranged to form a first pattern 101, and the inner diameter of each first through hole 103 is 12mm; a plurality of second through holes 104 formed through laser drilling are arranged to form a second pattern 102, and each second through hole 104 has an inner diameter of 12mm.

During laser drilling, the side of the core plate 10 with the thinner copper layer is directed upward.

S530: the core board 10 is subjected to a baking process.

S540: an inner layer wire is fabricated on the core board 10, which includes: s541: preprocessing substep, S542: coating substep, S543: exposure substep, S544: etching substep.

In step S542, a wet film is coated on the core board 10, and the wet film thickness ranges from 10 μm to 14 μm.

Between the steps S543 and S544, the core plate 10 after exposure is placed on a board placing machine with the thicker side of the copper layer of the core plate 10 facing upward, and the board placing machine is provided with the identification device 30 and the light source device 40.

S550: an identification step, which is performed once before each of the steps S541 to S544.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the embodiments, and are intended to be included within the scope of the claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (10)

1. A method of manufacturing a circuit board, comprising:

providing a core plate;

forming a first pattern and a second pattern penetrating through the core board on the core board, wherein the first pattern is used for carrying product information, and the first pattern and the second pattern are symmetrically and mirror-arranged along a virtual center line on the core board;

and manufacturing an inner layer circuit on the core plate.

2. The circuit board manufacturing method according to claim 1, wherein in the step of providing a core board:

the core board comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are respectively arranged on two opposite sides of the substrate, and the thicknesses of the first metal layer and the second metal layer are different.

3. The method according to claim 1 or 2, wherein in the step of forming a first pattern and a second pattern penetrating through the core board on the core board, a plurality of first through holes and second through holes penetrating through the core board are formed on the core board, a plurality of the first through holes form the first pattern, and a plurality of the second through holes form the second pattern.

4. The circuit board manufacturing method according to claim 3, wherein the first through hole and the second through hole are each formed by a laser drilling process.

5. The circuit board manufacturing method according to claim 1, wherein after the step of forming the first pattern and the second pattern penetrating the core board on the core board, the circuit board manufacturing method further comprises:

and (3) identification: the first pattern or the second pattern is identified by an identification device.

6. The method according to claim 5, wherein in the identifying step, a light source device for irradiating the first pattern and/or the second pattern is provided on a side of the core board opposite to the identifying device.

7. The method of manufacturing a circuit board according to claim 6, wherein the power range of the light source device is 20W to 50W.

8. The method according to any one of claims 5 to 7, wherein the step of forming the inner layer wiring on the core board includes a pretreatment sub-step, a coating sub-step, an exposure sub-step, an etching sub-step;

the identifying step is performed before each of the pre-treatment sub-step, the coating sub-step, the exposing sub-step, the etching sub-step.

9. The method of manufacturing a circuit board according to claim 8, wherein in the coating sub-step, a wet film is coated on the core board, and a thickness of the wet film ranges from 10 μm to 14 μm.

10. The circuit board manufacturing method according to claim 1 or 2, characterized in that before the step of manufacturing the inner layer wiring on the core board, the circuit board manufacturing method further comprises:

and baking the core plate.