CN117788443A - Method for detecting height and flatness of Mini LED chip and related equipment - Google Patents
Method for detecting height and flatness of Mini LED chip and related equipment Download PDFInfo
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Abstract
The invention provides a method for detecting the height and flatness of a Mini LED chip and related equipment, wherein the method comprises the following steps: 3D scanning is carried out on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module; positioning a Mini LED chip detection area and a substrate detection area from a 3D point cloud image of a Mini LED display module; and detecting the height difference between the Mini LED chip and the substrate, and detecting the flatness of the Mini LED chip. The invention has the beneficial effects that: and the unqualified Mini LED chips are removed by detecting the height and the flatness of the Mini LED chips, so that the display effect of the Mini LED display module is improved.
Description
Technical Field
The invention relates to the technical field of Mini LED chip quality inspection, in particular to a method and related equipment for detecting the height and flatness of a Mini LED chip.
Background
Mini LED means LED device with chip size between 50-200 μm. The display luminous unit consists of a Mini LED pixel array and a driving circuit, wherein the pixel center distance is 0.3-1.5 mm.
Because the product is little, can all appear the defective products in the processing engineering of solid brilliant and reflow oven, the defective products mainly appear as: the defects of solid deflection, solid leakage, solid weight, solid reflection, chip height and flatness errors, chip connection, scratch, foreign matters, more tin, less tin, brightness, no brightness, dark brightness, uneven brightness, wrong color, bright row, bright string and the like are overcome. The chip height and flatness errors can cause that the Mini LED can cause out-of-tolerance and uneven display brightness and chromaticity during operation, and the display effect is affected.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the method and the related equipment for detecting the height and flatness of the Mini LED chip are provided, and aim to solve the problem of uneven brightness and chromaticity of the Mini LED.
In order to solve the technical problems, the invention adopts the following technical scheme: a method of detecting Mini LED chip height and flatness, comprising:
3D scanning is carried out on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
positioning a Mini LED chip detection area and a substrate detection area from a 3D point cloud image of a Mini LED display module;
detecting the height difference between the Mini LED chip and the substrate, and detecting the flatness of the Mini LED chip;
judging whether the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range or not, and judging whether the flatness of the Mini LED chip is within the preset flatness tolerance range or not; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
Further, performing 3D scanning on the Mini LED display module, and generating a 3D point cloud image of the Mini LED display module includes:
controlling the visual module to move to a 3D scanning starting point of the fixed Mini LED display module;
and controlling the visual module to start 3D scanning on the fixed Mini LED display module, and completing scanning when the visual module moves to a 3D scanning end point to obtain a 3D point cloud image of the Mini LED display module.
Further, locating the Mini LED chip detection area and the substrate detection area from the 3D point cloud image of the Mini LED display module comprises:
gray processing is carried out on the 3D point cloud image of the Mini LED display module to obtain a white area and a black area, wherein the white area is a Mini LED chip, and the black area is a substrate;
positioning the position of a first Mini LED chip on the left upper part of a 3D point cloud image of the Mini LED display module;
generating a first group of Mini LED chip detection areas and substrate detection areas according to a preset interval and an angle according to the position of a first chip on the left of a 3D point cloud image of the Mini LED display module;
and generating all Mini LED chip detection areas and substrate detection areas according to the preset distance and angle according to the positions of the first group of Mini LED chip detection areas on the left side of the 3D point cloud image of the Mini LED display module.
Further, detecting the height difference between the Mini LED chip and the substrate includes:
setting two base surface detection blocks on the base plates at two sides of each group of Mini LED chips, and obtaining a base surface height value by detecting the height calculation average value of each pixel in the base surface detection block area;
and taking each Mini LED chip of each group of Mini LED chips as a height detection block, and calculating the average value of the heights of each pixel in the height detection block area to obtain the height value of each Mini LED chip relative to the base surface.
Further, detecting the flatness of the Mini LED chip includes:
setting a plurality of height detection blocks on each chip of each group of Mini LED chips, and obtaining the height value of the plurality of height detection blocks of each Mini LED chip relative to a base surface by calculating the average value of the height of each pixel in the height detection block area to obtain the flatness of each Mini LED chip.
Further, when the flatness of the Mini LED chips is detected, two height detection blocks are respectively arranged at the two ends and the middle of each chip of each group of Mini LED chips in the length direction of each chip.
Further, the method for detecting the height and flatness of the Mini LED chip further comprises the step of marking the positions of the Mini LED chips which are detected to be out of the standards in the Mini LED display module.
The invention also provides a device for detecting the height and flatness of the Mini LED chip, which comprises:
the 3D scanning module is used for carrying out 3D scanning on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
the area detection module is used for locating a Mini LED chip detection area and a substrate detection area from the 3D point cloud image of the Mini LED display module;
the height and flatness detection module is used for detecting the height difference between the Mini LED chip and the substrate and detecting the flatness of the Mini LED chip;
the quality inspection judging module is used for judging whether the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range or not and judging whether the flatness of the Mini LED chip is within the preset flatness tolerance range or not; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
The invention also provides a computer device which comprises a memory and a processor, wherein the memory is stored with a computer program, and the processor realizes the method for detecting the height and flatness of the Mini LED chip when executing the computer program.
The invention also provides a storage medium storing a computer program which, when executed by a processor, can implement the method for detecting the height and flatness of a Mini LED chip as set forth in any one of the above.
The invention has the beneficial effects that: 3D scanning is conducted on the Mini LED display module, a 3D point cloud image of the Mini LED display module is generated, a Mini LED chip detection area and a substrate detection area are located, the height difference between the Mini LED chip and the substrate and the flatness of the Mini LED chip are detected, whether the Mini LED chip meets standard requirements or not is judged from two dimensions, so that the Mini LED chip which does not meet the requirements is detected, the brightness of the Mini LED chip is improved, meanwhile, the chromaticity of the Mini LED chip is more uniform, and accordingly the display effect of the Mini LED chip is improved.
Drawings
The specific structure of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a flow chart of a method for detecting the height and flatness of Mini LED chips according to an embodiment of the invention;
FIG. 2 is a block diagram of a device for detecting the height and flatness of Mini LED chips according to an embodiment of the invention;
fig. 3 is a schematic view of a 3D point cloud image of a Mini LED display module according to an embodiment of the present invention;
fig. 4 is a schematic block diagram of a computer device in accordance with an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1, an embodiment of the present invention is: a method for detecting the height and flatness of a Mini LED chip comprises the following steps:
s10, performing 3D scanning on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
s20, locating a Mini LED chip detection area and a substrate detection area from a 3D point cloud image of a Mini LED display module;
s30, detecting the height difference between the Mini LED chip and the substrate, and detecting the flatness of the Mini LED chip;
s40, judging whether the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range or not, and judging whether the flatness of the Mini LED chip is within the preset flatness tolerance range or not; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
The height of a Mini LED chip refers to the distance from the top of the Mini LED chip to the surface of the substrate, for example: the height standard of the Mini LED chip adopted by the scheme is 0.1mm.
The flatness of the Mini LED chip refers to the degree of an included angle between the plane of the top surface of the Mini LED chip and the plane of the substrate, which is theoretically 0 DEG, and when the included angle exceeds 15 DEG, the display effect can be affected.
The detection of the Mini LED display module not only has the measurement of the XY direction size of a two-dimensional plane, but also has the measurement of the Z direction height of a three-dimensional plane, the visual imaging module adopts the combination of an area array camera and a 3D sensor, the area array camera outputs a two-dimensional image by adopting a flying photographing method, and the 3D visual sensor outputs a three-dimensional image by adopting a flying scanning method.
In a specific embodiment, in step S10, performing 3D scanning on the Mini LED display module, and generating a 3D point cloud image of the Mini LED display module includes:
s11, controlling the visual module to move to a 3D scanning starting point of the fixed Mini LED display module;
and S12, controlling the visual module to start 3D scanning on the fixed Mini LED display module, and completing scanning when the visual module moves to a 3D scanning end point to obtain a 3D point cloud image of the Mini LED display module.
The 3D camera is controlled to move to a scanning starting point position, the scanning distance can be determined by software setting, the software setting scanning length is matched with the data of the encoder, the scanning distance can be set by software, the general distance is 0.001mm, the scanning width is 7.5mm and is completed in 23 times, a 3D point cloud image is generated each time, and a total of 23 3D point cloud images are generated for one product.
The 3D point cloud image is a data matrix formed by point cloud information of all points captured by the 3D camera, and each point has X, Y and Z values. The points without three-dimensional spatial information are (0, 0), and the 3D point cloud image can be converted into a gray image or a pseudo color image for software processing.
In a specific embodiment, in step S20, locating the Mini LED chip detection area and the substrate detection area from the 3D point cloud image of the Mini LED display module includes:
s21, carrying out gray processing on the 3D point cloud image of the Mini LED display module to obtain a white area and a black area, wherein the white area is a Mini LED chip, and the black area is a substrate;
s22, positioning the position of a first Mini LED chip on the left upper part of the 3D point cloud image of the Mini LED display module;
s23, generating a first group of Mini LED chip detection areas and substrate detection areas according to preset intervals and angles according to the position of a first chip on the left of a 3D point cloud image of the Mini LED display module;
s24, generating all Mini LED chip detection areas and substrate detection areas according to the positions of the first group of Mini LED chip detection areas on the left side of the 3D point cloud image of the Mini LED display module and the preset distance and angle.
In the technical scheme, software processing of the 3D point cloud image firstly needs to determine a detection area, wherein the detection area comprises an area for accurately positioning the top surface of a chip and a substrate detection area, the 3D point cloud image needs to be converted into a gray level image, data of each basic unit (pixel) of the 3D point cloud image is X, Y and Z, and data of each basic unit (pixel) converted into a gray level image is X, Y and gray level value. The method is beneficial to completing the position positioning of the detection area according to the change of the image gray level.
The visual tool patch detection is to detect a bright spot (the area formed by the pixel sets with the gray value and the area exceeding the set value) with the gray value and the area in a specified range and ordered in the X and Y directions in the image detection area, and locate the center point of the bright spot at the coordinate position of the image, so that the image coordinate of the first chip on the left upper part of the image is located, and the preparation is made for the whole chip location.
Visual tool, plaque analysis description: the plaque analysis tool obtains a non-black or white image by binarizing the image, then gathers all black pixels (or white pixels) to form a plaque, and calculates the plaque to calculate the geometric characteristics of the plaque, such as area, perimeter, external rectangle and the like, so that the image can be analyzed to find the geometric characteristics, statistical characteristics and the like of the image.
As shown in fig. 3, a first set of chip detection areas and substrate detection areas are generated at a fixed pitch according to the upper left first chip position.
Firstly, software sets the number, shape, size and relative position of a group of detection areas, the 4 parameters can be set and adjusted, the detection areas consist of 3 chip height detection areas and 2 substrate height detection areas, after 3D scanning is completed, the first group of detection area positions are generated according to the positioned upper left first chip position positioning, the first chip position of the group is positioning data (upper left first chip) for positioning the plaque, the purpose of the detection area positioning and the accurate position of the first group of detection areas are generated, the chip detection areas just cover the chips, and the substrate detection areas are distributed on two sides of 3 chips according to the set spacing.
And generating all chip detection areas and substrate detection areas according to the positions of the first group of chip detection areas on the left and the fixed spacing.
According to the central position of the first group of detection areas, all chip detection areas are generated according to the set X and Y intervals (the interval is adjustable), the first group of detection areas consists of 3 chip height detection areas and 2 substrate height detection areas, 720 groups of detection areas are formed, each row has 6 groups, 120 rows are formed, and each scanning chip has 2160 chips. The whole plate was scanned 23 times with 48600 chips (the last scan was only 3 sets of chips). The above is to determine the detection area positions of all chips, and prepare for measuring the data of each chip.
In a specific embodiment, in step S30, detecting the height difference between the Mini LED chip and the substrate includes the steps of:
s31, setting two base surface detection blocks on the base plates on two sides of each group of Mini LED chips, and obtaining a base surface height value by detecting the height calculation average value of each pixel in the base surface detection block area;
s32, taking each Mini LED chip of each group of Mini LED chips as a height detection block, and calculating the average value of the heights of each pixel in the height detection block area to obtain the height value of each Mini LED chip relative to the base surface.
In S30, detecting the flatness of the Mini LED chip includes:
s33, setting a plurality of height detection blocks on each chip of each group of Mini LED chips, and obtaining the height value of the plurality of height detection blocks of each Mini LED chip relative to a base plane by calculating the average value of the height of each pixel in the height detection block area to obtain the flatness of each Mini LED chip.
When the flatness of the Mini LED chips is detected, two height detection blocks are respectively arranged at the two ends and the middle of each chip of each group of Mini LED chips in the length direction of each chip.
The height of each chip is detected, the distance from the top end of the chip to the PCB surface is Z direction, the height deviation of the Z axis direction of the chip is 0.1mm plus or minus 0.01mm, and the chip is qualified in the range.
The height of the chip is detected, the detection blocks at two sides of the chip are simply called base surface detection blocks, the base surface height of the current detection area of the group is calculated through the height of each pixel in 2 base surface detection blocks (the base surface height of the detection area can be accurately measured through 2 area calculation), the area of each chip is the chip height detection block, the chip height value is calculated through the height of each pixel in the area, and the height difference between the chip detection area and the base surface detection block can be calculated. And then evaluating whether the height of the chip meets the standard or not according to the tolerance range of the height difference.
The chip height is the height difference between the top end surface of the chip and the base surface of the PCB, the detection method is to fix the chip detection position area and the substrate detection area by a positioning frame, the average height of the detection area is calculated by a software algorithm through the height of each pixel of the 3D point cloud image, and the height of the chip is obtained by subtracting the substrate height from the chip height. The substrate surface height of each group of detection areas is unique, and the height values of 3 chips are obtained by calculating 3 chips of each group and the base surface of the group.
Detecting the flatness, wherein the detection blocks at two sides of the chip are called as basal plane detection blocks for short, the height value of the basal plane is calculated through the height of each pixel in the area of the basal plane detection blocks, 6 detection blocks for short are arranged on each chip for detecting the flatness, and the flatness of the LED chip is detected according to the heights of the 6 detection blocks for short, namely the flatness detection blocks relative to the basal plane.
The chip flatness refers to the fact that the top end face of the chip is divided into a plurality of small areas (the number and the size of the areas can be set, and 6 areas are set at present) and the height difference of a base surface of a substrate, the flatness of the chip can be detected through the value of the height difference, the detection method is that the small areas and the base detection area of the chip are defined through a positioning frame, the average height of the small areas is calculated through a software algorithm after subtracting the height of the base plate from the height of the small areas, and the flatness of the chip is calculated through the height value of the small areas.
In a specific embodiment, the method for detecting the height and flatness of the Mini LED chip further comprises marking the positions of the Mini LED chips which are detected to be out of the standards in the Mini LED display module.
In this embodiment, the quality of each chip detection result can be determined by evaluating each chip detection data. And after the detection of the whole Mini LED display module products is finished, automatically numbering the products to generate form data and sending the form data to an upper computer.
According to the embodiment of the invention, whether the Mini LED chip meets the standard requirement or not is judged from two dimensions by detecting the height difference between the Mini LED chip and the substrate and the planeness of the Mini LED chip, so that the Mini LED chip which does not meet the standard requirement is detected, the brightness of the Mini LED chip is improved, and meanwhile, the chromaticity of the Mini LED chip is more uniform, so that the display effect of the Mini LED chip is improved.
As shown in fig. 2, the present invention further provides a device for detecting the height and flatness of a Mini LED chip, including:
the 3D scanning module 10 is used for carrying out 3D scanning on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
the area detection module 20 is used for locating a Mini LED chip detection area and a substrate detection area from the 3D point cloud image of the Mini LED display module;
the height and flatness detection module 30 is used for detecting the height difference between the Mini LED chip and the substrate and detecting the flatness of the Mini LED chip;
the quality inspection judging module 40 is configured to judge whether a height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range, and judge whether the flatness of the Mini LED chip is within a preset flatness tolerance range; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
It should be noted that, as those skilled in the art can clearly understand, the specific implementation process of the device for detecting the height and flatness of the Mini LED chip and each unit may refer to the corresponding description in the foregoing method embodiment, and for convenience and brevity of description, the description is omitted herein.
The means for detecting the height and flatness of the Mini LED chip described above may be implemented in the form of a computer program which may be run on a computer device as shown in fig. 4.
Referring to fig. 4, fig. 4 is a schematic block diagram of a computer device according to an embodiment of the present application. The computer device 500 may be a terminal or a server, where the terminal may be an electronic device with a communication function, such as a smart phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster formed by a plurality of servers.
With reference to FIG. 4, the computer device 500 includes a processor 502, memory, and a network interface 505, connected by a system bus 501, where the memory may include a non-volatile storage medium 503 and an internal memory 504.
The non-volatile storage medium 503 may store an operating system 5031 and a computer program 5032. The computer program 5032 includes program instructions that, when executed, cause the processor 502 to perform a method of detecting the height and flatness of a Mini LED chip.
The processor 502 is used to provide computing and control capabilities to support the operation of the overall computer device 500.
The internal memory 504 provides an environment for the execution of a computer program 5032 in the non-volatile storage medium 503, which computer program 5032, when executed by the processor 502, causes the processor 502 to perform a method of detecting Mini LED chip height and flatness.
The network interface 505 is used for network communication with other devices. Those skilled in the art will appreciate that the architecture shown in fig. 4 is merely a block diagram of a portion of the architecture in connection with the present application and is not intended to limit the computer device 500 to which the present application is applied, and that a particular computer device 500 may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
The processor 502 is configured to execute a computer program 5032 stored in a memory to implement the method for detecting the height and flatness of the Mini LED chip as described above.
It should be appreciated that in embodiments of the present application, the processor 502 may be a central processing unit (Central Processing Unit, CPU), the processor 502 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSPs), application specific integrated circuits (Application Specific Integrated Circuit, ASICs), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. Wherein the general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
Those skilled in the art will appreciate that all or part of the flow in a method embodying the above described embodiments may be accomplished by computer programs instructing the relevant hardware. The computer program comprises program instructions, and the computer program can be stored in a storage medium, which is a computer readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the flow steps of the embodiments of the method described above.
Accordingly, the present invention also provides a storage medium. The storage medium may be a computer readable storage medium. The storage medium stores a computer program, wherein the computer program includes program instructions. The program instructions, when executed by a processor, cause the processor to perform the method of detecting Mini LED chip height and flatness as described above.
The storage medium may be a U-disk, a removable hard disk, a Read-Only Memory (ROM), a magnetic disk, or an optical disk, or other various computer-readable storage media that can store program codes.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed.
The steps in the method of the embodiment of the invention can be sequentially adjusted, combined and deleted according to actual needs. The units in the device of the embodiment of the invention can be combined, divided and deleted according to actual needs. In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The integrated unit may be stored in a storage medium if implemented in the form of a software functional unit and sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention is essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a terminal, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. A method for detecting the height and flatness of a Mini LED chip, comprising:
3D scanning is carried out on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
positioning a Mini LED chip detection area and a substrate detection area from a 3D point cloud image of a Mini LED display module;
detecting the height difference between the Mini LED chip and the substrate, and detecting the flatness of the Mini LED chip;
judging whether the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range or not, and judging whether the flatness of the Mini LED chip is within the preset flatness tolerance range or not; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
2. The method for detecting the height and flatness of the Mini LED chip as claimed in claim 1, wherein: 3D scanning is carried out on the Mini LED display module, and generating the 3D point cloud image of the Mini LED display module comprises the following steps:
controlling the visual module to move to a 3D scanning starting point of the fixed Mini LED display module;
and controlling the visual module to start 3D scanning on the fixed Mini LED display module, and completing scanning when the visual module moves to a 3D scanning end point to obtain a 3D point cloud image of the Mini LED display module.
3. The method for detecting the height and flatness of a Mini LED chip of claim 1, wherein locating a Mini LED chip detection area and a substrate detection area from a 3D point cloud image of a Mini LED display module comprises:
gray processing is carried out on the 3D point cloud image of the Mini LED display module to obtain a white area and a black area, wherein the white area is a Mini LED chip, and the black area is a substrate;
positioning the position of a first Mini LED chip on the left upper part of a 3D point cloud image of the Mini LED display module;
generating a first group of Mini LED chip detection areas and substrate detection areas according to a preset interval and an angle according to the position of a first chip on the left of a 3D point cloud image of the Mini LED display module;
and generating all Mini LED chip detection areas and substrate detection areas according to the preset distance and angle according to the positions of the first group of Mini LED chip detection areas on the left side of the 3D point cloud image of the Mini LED display module.
4. The method of detecting the height and flatness of Mini LED chips of claim 1, wherein detecting the height difference between the Mini LED chips and the substrate comprises:
setting two base surface detection blocks on the base plates at two sides of each group of Mini LED chips, and obtaining a base surface height value by detecting the height calculation average value of each pixel in the base surface detection block area;
and taking each Mini LED chip of each group of Mini LED chips as a height detection block, and calculating the average value of the heights of each pixel in the height detection block area to obtain the height value of each Mini LED chip relative to the base surface.
5. The method of detecting the height and flatness of Mini LED chips of claim 4, wherein detecting the flatness of Mini LED chips comprises:
setting a plurality of height detection blocks on each chip of each group of Mini LED chips, and obtaining the height value of the plurality of height detection blocks of each Mini LED chip relative to a base surface by calculating the average value of the height of each pixel in the height detection block area to obtain the flatness of each Mini LED chip.
6. The method of detecting the height and flatness of Mini LED chips of claim 5, wherein two height detecting blocks are provided at both ends and in the middle of each chip of each group of Mini LED chips in the length direction of each chip when detecting the flatness of the Mini LED chips.
7. The method for detecting the height and flatness of a Mini LED chip according to claim 1, further comprising marking the positions of the Mini LED chips which are detected to be out of standards in a Mini LED display module.
8. A device for detecting the height and flatness of a Mini LED chip, comprising:
the 3D scanning module is used for carrying out 3D scanning on the Mini LED display module to generate a 3D point cloud image of the Mini LED display module;
the area detection module is used for locating a Mini LED chip detection area and a substrate detection area from the 3D point cloud image of the MiniLED display module;
the height and flatness detection module is used for detecting the height difference between the Mini LED chip and the substrate and detecting the flatness of the Mini LED chip;
the quality inspection judging module is used for judging whether the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range or not and judging whether the flatness of the Mini LED chip is within the preset flatness tolerance range or not; if the height difference between the Mini LED chip and the substrate is within a preset height difference tolerance range and the flatness of the Mini LED chip is within a preset flatness tolerance range, the Mini LED display module meets the standard.
9. A computer device, characterized by: the computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to realize the method for detecting the height and flatness of the Mini LED chip according to any one of claims 1 to 7.
10. A storage medium, characterized by: the storage medium stores a computer program which, when executed by a processor, implements the method for detecting the height and flatness of a Mini LED chip as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311854666.9A CN117788443A (en) | 2023-12-29 | 2023-12-29 | Method for detecting height and flatness of Mini LED chip and related equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311854666.9A CN117788443A (en) | 2023-12-29 | 2023-12-29 | Method for detecting height and flatness of Mini LED chip and related equipment |
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| Publication Number | Publication Date |
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| CN117788443A true CN117788443A (en) | 2024-03-29 |
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| CN202311854666.9A Pending CN117788443A (en) | 2023-12-29 | 2023-12-29 | Method for detecting height and flatness of Mini LED chip and related equipment |
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| Country | Link |
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| CN (1) | CN117788443A (en) |
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- 2023-12-29 CN CN202311854666.9A patent/CN117788443A/en active Pending
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