CN117774295A - PC board film pasting technology - Google Patents
PC board film pasting technology Download PDFInfo
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- CN117774295A CN117774295A CN202211665536.6A CN202211665536A CN117774295A CN 117774295 A CN117774295 A CN 117774295A CN 202211665536 A CN202211665536 A CN 202211665536A CN 117774295 A CN117774295 A CN 117774295A
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- 238000005516 engineering process Methods 0.000 title description 3
- 238000004140 cleaning Methods 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 19
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 4
- 239000000428 dust Substances 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 42
- 238000004891 communication Methods 0.000 claims description 21
- 210000004907 gland Anatomy 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 2
- 230000005587 bubbling Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000013543 active substance Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Abstract
The application relates to a PC board film sticking process, which relates to the technical field of film sticking processes and comprises the following film sticking steps: pretreatment: removing the protective film of the PC board, and performing plasma cleaning on the PC board for later use; processing: printing the PC board to form a plurality of groups of models to be engraved; carving all the models to be carved on the PC board, and cutting the carved models from the PC board for later use; sticking film: the OCA film was applied to the cut pattern and then back-glued to all cut patterns. The application has the effects of improving the adhesion strength of the OCA film on the PC board and effectively reducing the bubbling phenomenon of the OCA film on the PC board.
Description
Technical Field
The application relates to the technical field of film sticking processes, in particular to a PC board film sticking process.
Background
The transparent PC board is often used as a lens module by attaching an OCA film after cutting. The adhesive force of the OCA film relative to the PC board determines the application stability of the OCA film after being adhered.
In the actual film-sticking process of PC boards, operators often wipe the parts of the PC boards where film sticking is required with clean and dry cloth. And then, sticking the OCA film on the wiping part of the PC board to finish sticking the OCA film on the PC board.
However, there are a certain amount of tiny dust which is hard to be seen clearly by naked eyes on the PC board, and the tiny dust is not easy to be wiped clean by cloth, and the tiny dust attached to the PC board greatly reduces the adhesive strength of the OCA film on the PC board, so that the phenomenon that the OCA film attached to the PC board is easy to generate bubbling after long-time outdoor use is needed to be improved.
Disclosure of Invention
In order to solve the problem that the adhesion strength of the OCA film on the PC board is low, the application provides a PC board film sticking process.
The PC board film pasting technology provided by the application adopts the following technical scheme:
the PC board film pasting process comprises the following film pasting steps:
pretreatment: removing the protective film of the PC board, and performing plasma cleaning on the PC board for later use;
processing: printing the PC board to form a plurality of groups of models to be engraved; carving all the models to be carved on the PC board, and cutting the carved models from the PC board for later use;
sticking film: the OCA film was applied to the cut pattern and then back-glued to all cut patterns.
By adopting the technical scheme, the PC board after plasma cleaning treatment can effectively reduce the dust quantity distributed on the PC board, and the surface active substances on the PC board are excited, so that the adhesion strength of the OCA film on the PC board can be effectively improved after the OCA film is pasted, the position stability and the application stability of the OCA film after the OCA film is pasted are ensured, and the bubbling phenomenon of the OCA film on the PC board is reduced; the model printed, carved and cut on the PC board is beneficial to rapidly and accurately pasting the OCA film, so that the PC board pasted with the OCA film can rapidly form a plurality of models which can be used for lens modules while realizing rapid and high-adhesion-strength film pasting, and the processing efficiency of the PC board is improved; the back adhesive is used for protecting the models cut by the PC board, and can be connected with a plurality of models at the same time, so that the models can be packaged, stored and transported at the same time.
In a specific embodiment, in the pretreatment step, the PC board is subjected to plasma cleaning by a cleaning device, wherein the cleaning device comprises a cleaning mechanism, a bearing mechanism, a driving mechanism and a driven mechanism; the cleaning mechanism is arranged on the bearing mechanism, so that a sealing area is formed on the bearing mechanism and is used for carrying out plasma cleaning in the sealing area; the driving mechanism and the driven mechanism are oppositely arranged in the side wall of the sealing area and are used for jointly clamping the PC board and controlling the PC board to rotate.
By adopting the technical scheme, the cleaning mechanism is arranged on the bearing mechanism so as to form a sealing area on the bearing mechanism, thereby reducing dust mixing interference caused by air circulation and being beneficial to improving the cleaning efficiency of the cleaning mechanism on the PC board; the PC board is clamped by the driving mechanism and the driven mechanism together, so that the position stability of the PC board in a sealing area is guaranteed, the PC board is guaranteed to bear multidirectional strong impact, and the PC board can be washed cleanly at a plurality of positions by rotating the PC board, so that the cleanliness of the PC board is improved.
In a specific embodiment, the carrying mechanism comprises a carrying bottom box, and the cleaning device comprises a blending bracket, a cleaning piece and a plurality of groups of cleaning spray heads; the cleaning piece is arranged on the bearing bottom box through the allocation bracket, so that a sealing area is formed in the inner cavity of the bearing bottom box; all the cleaning spray heads are arranged on the cleaning piece so as to clean the PC board in the sealing area; the driving mechanism comprises a driving motor and a clamping assembly, and the driven mechanism comprises a switching fulcrum and a clamping frame; the clamping frame is arranged in the side wall of the sealing area through the switching support shaft, the clamping assembly is arranged in the side wall of the sealing area through the driving motor, one end of the PC board is connected with the clamping frame, and the other end of the PC board is connected with the clamping assembly.
By adopting the technical scheme, the cleaning piece is quickly covered or far away from the bearing bottom box through the allocation bracket, and the cleaning spray head impacts the PC board in the sealing area; clamping frame and clamping assembly centre gripping PC panel simultaneously respectively at PC panel length direction's both ends, along with driving motor's output's rotation, the driven of changeover pivot makes the PC panel rotate in sealed region to wash shower nozzle washing PC panel, ensured the cleanliness factor of PC panel, and then help improving the stability that follow-up OCA membrane pasted and covered on the PC panel.
In a specific implementation mode, a preset groove for installing a driving motor is formed in the side wall of the sealing area, and the clamping assembly comprises a bottom bearing bracket, an abutting unit and a stopping unit; the bottom support bracket is arranged at the output end of the driving motor, and the abutting unit is movably arranged on the bottom support bracket so as to abut against the PC board; the stop unit is arranged on the abutting unit and used for positioning the PC board between the bottom bearing bracket and the abutting unit.
By adopting the technical scheme, the driving motor is arranged in the side wall of the preset groove, so that the phenomenon that the driving motor occupies space in a sealing area is reduced; the abutting unit abuts against the PC board on the bottom support, and the stopping unit is used for enabling the PC board to abut against between the bottom support and the abutting unit, so that the position stability and the application stability of the PC board on the bottom support are guaranteed.
In a specific implementation manner, the abutting unit comprises a gland support plate, a limit side plate and a fixing piece, wherein the limit side plate is arranged on the gland support plate, a displacement groove for the limit side plate to abut into and slide is formed in the bottom support bracket, and the fixing piece is used for positioning the limit side plate in the side wall of the displacement groove; the stop unit comprises a connecting screw rod, a stop bottom plate and a control hand wheel; the connecting screw rod is threaded through the gland support plate, and the stop bottom plate is arranged at one end of the connecting screw rod and is used for abutting against the PC board; the control hand wheel is arranged at the other end of the connecting screw rod.
By adopting the technical scheme, the limit side plate is propped into the displacement groove matched with the limit side plate so as to realize the quick connection of the gland support plate on the bottom support, and the fixing piece is used for quickly positioning the limit side plate in the displacement groove so as to ensure the propping stability of the gland support plate to the PC plate; the connecting screw rod is in threaded connection with the gland support plate, so that the stop bottom plate is quickly abutted against the PC plate, and the positioning stability of the PC plate between the gland support plate and the bottom support plate is further improved; the control hand wheel is used for improving convenience of rotating and connecting the screw rod by an operator.
In a specific implementation manner, the positioning piece comprises a deviation rectifying guide post, a tension transformer and a positioning nut, wherein the deviation rectifying guide post is arranged in the side wall of the displacement groove, and the tension transformer is sleeved on the deviation rectifying guide post; the deviation correcting guide post penetrates through the limiting side plate, and the Zhang Bian piece abuts against the limiting side plate; the positioning nut is in threaded connection with the deviation rectifying guide post and is used for positioning the limiting sideboard on the deviation rectifying guide post.
By adopting the technical scheme, the deviation correcting guide post penetrates through the limit side plate so as to improve the sliding stability of the limit side plate in the displacement groove; the tension transformer is abutted to the limit side plate through compression deformation and elastic acting force of the tension transformer, and the positioning nut is in threaded connection with the correction guide post, so that the limit side plate is rapidly positioned on the correction guide post, and further rapid positioning of the PC board after rapid installation in a sealing area is realized.
In a specific embodiment, the stop unit further comprises a abutting piece, the abutting piece is arranged on the stop bottom plate, and the abutting piece is in interference fit between the stop bottom plate and the PC board; the gland support plate is also provided with a containing groove for the stop bottom plate and the abutting piece to jointly abut in.
Through adopting above-mentioned technical scheme, support tight piece through the great characteristic of self coefficient of static friction, support tight fit in between gland extension board and the bottom support extension board for PC panel improves greatly in the position stability on the bottom support extension board.
In a specific embodiment, the cleaning device further comprises a dust guide mechanism, wherein the dust guide mechanism comprises a suction piece, a communication conduit, a containing box body and a dust guide plate; the accommodating box body is arranged in the side wall of the sealing area and is positioned below the PC board; the dust guide plate is arranged in the side wall of the accommodating box body, and a plurality of dust guide channels are arranged on the dust guide plate in a penetrating manner; the suction piece is arranged in the side wall of the sealing area, one end of the communication conduit is connected with the suction end of the suction piece, and the other end of the communication conduit penetrates through the side wall of the accommodating box body so as to be positioned in the inner cavity of the accommodating box body.
Through adopting above-mentioned technical scheme, the suction piece is through the air of the suction of communication pipe acceping box body department for the air current in the sealing region flows towards suction piece department fast, and in this process, the air current carries dust, the impurity on the PC panel constantly to pass the dust channel, in order to gather in the lateral wall of acceping box body, and then helps improving the cleanliness factor behind the clean PC panel of belt cleaning device.
In a specific embodiment, the dust guiding mechanism further comprises a switching cylinder and a guiding cover plate; the guide cover plate is arranged on the switching cylinder body, and the switching cylinder body is sleeved on one end of the communication guide pipe, which is positioned in the accommodating box body; and the switching cylinder and the guide cover plate are respectively provided with an air guide channel in a penetrating way.
By adopting the technical scheme, the guide cover plate and the switching cylinder body are used for preventing dust from entering the suction piece through the communication guide pipe, so that the service life of the suction piece after long-time application is guaranteed; the air guide channel is used for air flow circulation, so that the phenomenon that dust enters the communication guide pipe can be reduced.
In summary, the present application has the following beneficial technical effects:
1. the PC board is cleaned by plasma to reduce the dust amount on the PC board, so that the surface active substances on the PC board are greatly excited, thereby being beneficial to improving the adhesive strength of the OCA film on the PC board, ensuring the position stability and the application stability of the OCA film on the PC board, and reducing the bubbling phenomenon of the OCA film on the PC board;
2. the sucking piece sucks air in the sealing area through the communication conduit, so that the sealing area is converted into a vacuum area, and the cleanliness of the cleaning piece for plasma cleaning of the PC board is improved; in addition, the air flow sucked by the suction piece can circulate dust on the PC board along with the gushing air flow, so that the dust quantity on the PC board is reduced, and further the cleaning efficiency of the subsequent plasma cleaning is improved.
Drawings
FIG. 1 is a schematic view of a cleaning apparatus according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a cleaning apparatus in a vertical direction in an embodiment of the present application;
FIG. 3 is a schematic view of a dust guide mechanism in an embodiment of the present application;
FIG. 4 is a schematic view of a driving mechanism and a driven mechanism in an embodiment of the present application;
fig. 5 is an exploded schematic view of the connection relationship between the connection screw and the gland support plate in the embodiment of the present application.
Reference numerals illustrate:
1. a cleaning device; 2. a cleaning mechanism; 21. blending the bracket; 22. cleaning a piece; 23. cleaning the spray head; 3. a carrying mechanism; 31. a carrying bottom box; 311. a sealing region; 312. presetting a groove; 4. a driving mechanism; 41. a driving motor; 42. a clamping assembly; 5. a driven mechanism; 51. a switching support shaft; 52. a clamping frame; 6. a dust guide mechanism; 61. a suction member; 62. a communication conduit; 63. a housing case; 64. a dust guide plate; 641. a dust guide channel; 65. a transfer cylinder; 66. a guide cover plate; 67. an air guide channel; 7. a bottom support bracket; 71. a displacement groove; 8. an abutting unit; 81. pressing the support plate; 811. a receiving groove; 82. limiting side plates; 83. a fixing member; 831. correcting a guide post; 832. a tension member; 833. positioning a nut; 9. a stop unit; 91. connecting a screw rod; 92. a stop bottom plate; 93. a control hand wheel; 94. and a tightening piece.
Detailed Description
The embodiment of the application discloses a PC board film sticking process.
The present application is described in further detail below in conjunction with figures 1-5.
The PC board film pasting process comprises the following film pasting steps:
pretreatment: and tearing off the protective film on the PC board. The protective film is a plastic film which is pasted when the PC board leaves the factory and used for reducing scratch of the PC board, and the side wall of the protective film is torn off by the PC board and used for pasting the OCA film.
Referring to fig. 1, a PC board from which a protective film is peeled off is plasma-cleaned by a cleaning device 1. The cleaning device 1 further comprises a cleaning mechanism 2, a bearing mechanism 3, a driving mechanism 4, a driven mechanism 5 and a dust guiding mechanism 6.
Referring to fig. 2, the carrying mechanism 3 includes a carrying bottom box 31, and in this embodiment, the carrying bottom box 31 is a steel non-covered box body, and the carrying bottom box 31 is placed on the ground for use. The cleaning mechanism 2 comprises a blending bracket 21, a cleaning piece 22 and a plurality of groups of cleaning spray heads 23, wherein the blending bracket 21 is a rotating bracket with a base, the blending bracket 21 is placed on the ground, and the blending bracket 21 is positioned on one side of the bearing bottom box 31.
Referring to fig. 2, the cleaning member 22 is a plasma cleaning machine, the cleaning member 22 is fixed on the blending bracket 21 by bolts, and an operator can cover or separate the cleaning member 22 from the top of the bottom box 31 by rotating the blending bracket 21. When the cleaning member 22 covers the top of the bottom box 31, the cleaning member 22 can seal the top opening of the bottom box 31, so that the inner cavity of the bottom box 31 forms a sealing area 311.
Referring to fig. 2, all cleaning nozzles 23 are disposed at intervals on the side wall of the cleaning member 22 facing the bottom bearing box 31, when the cleaning member 22 covers the top of the bottom bearing box 31, the cleaning member 22 sprays high-pressure plasma into the sealing area 311 through all cleaning nozzles 23, and the high-pressure plasma can collide with the tiny dust and promote volatilization of the tiny dust, or collide and combine with the large-volume dust, so that the large-volume dust is digested or settled, thereby achieving the effects of cleaning and dust removal.
Referring to fig. 2 and 3, the dust guide 6 serves to convert the sealing region 311 into a vacuum region and reduce the amount of dust in the sealing region 311. The dust guide mechanism 6 includes a suction member 61, a communication pipe 62, a housing case 63, and a dust guide plate 64, the suction member 61 may be a vacuum extractor, and the suction member 61 is fixed to an inner bottom wall of the sealing region 311 by bolts. In this embodiment, the number of the communication pipes 62 may be two, and one end of one communication pipe 62 in the length direction is interference-fitted to one suction end of the suction member 61 by a rubber ring.
Referring to fig. 2 and 3, the accommodating case 63 is a trapezoid case without a cover, the accommodating case 63 is welded in a side wall of the sealing region 311, the accommodating case 63 is located above the suction member 61, and an outer circumferential dimension of an end of the accommodating case 63 away from the suction member 61 is larger than an outer circumferential dimension of an end of the accommodating case 63 close to the suction member 61.
Referring to fig. 2 and 3, the end of the communication conduit 62 remote from the suction member 61 is penetrated through the side wall of the accommodating case 63 so as to be located in the inner cavity of the accommodating case 63. The dust guide plate 64 is a solid steel plate, the dust guide plate 64 is abutted against the side wall of the accommodating box 63 by self weight, and a plurality of dust guide channels 641 are arranged on the dust guide plate 64 in a penetrating manner.
Referring to fig. 2 and 3, the suction member 61 sucks air at the housing case 63 through the communication duct 62, rapidly reduces the air content in the sealing region 311 to be converted into a vacuum state. At the same time, the flowing air flow drives the dust in the sealing area 311 to rapidly move toward the dust guide plate 64, so as to reduce the dust content in the sealing area 311 above the dust guide plate 64. Dust propelled by the air flow passes through the dust guide channel 641 and then accumulates in the inner bottom wall of the accommodating box 63.
Referring to fig. 2 and 3, in order to reduce the phenomenon that dust enters the inside of the suction member 61 through the communication duct 62, the dust guide mechanism 6 further includes a switching cylinder 65 and a guide cover plate 66. The guide cover plate 66 is integrally formed at one end of the transfer cylinder 65 in the length direction, the peripheral dimension of the guide cover plate 66 is larger than the outer diameter dimension of the transfer cylinder 65, and one end of the transfer cylinder 65 away from the guide cover plate 66 is sleeved on one end of the communication conduit 62 located in the inner cavity of the accommodating box 63.
Referring to fig. 3, the adapting cylinder 65 and the guiding cover plate 66 are further provided with air guide channels 67 in a penetrating manner, the air guide channels 67 are used for air flow circulation, and meanwhile dust entering the inner cavity of the accommodating box 63 along with air flow is reduced to enter the suction piece 61 through the communicating conduit 62, so that the service life and application stability of the suction piece 61 after long-time use are guaranteed.
Referring to fig. 2 and 4, the pc board is rotatably disposed in the inner cavity of the sealing area 311 by the driving mechanism 4 and the driven mechanism 5, wherein the driven mechanism 5 includes a switching support shaft 51 and a clamping frame 52. In this embodiment, one end of the adapting support shaft 51 in the length direction is rotatably disposed in the side wall of the bottom box 31 through a bearing, the clamping frame 52 is a frame, and the clamping frame 52 is welded to the other end of the adapting support shaft 51 in the length direction for clamping the PC board and driving the PC board to rotate along with the adapting support shaft 51.
Referring to fig. 2 and 4, the driving mechanism 4 includes a driving motor 41 and a clamping assembly 42, wherein the driving motor 41 is a servo motor. The side wall of the bearing bottom box 31 is provided with a preset groove 312, the preset groove 312 is arranged opposite to the switching support shaft 51, and one end of the driving motor 41 far away from the output end is welded in the side wall of the preset groove 312.
Referring to fig. 2 and 4, a clamping assembly 42 is provided at an end of an output end of the driving motor 41 toward the switching fulcrum 51, the clamping assembly 42 including the bottom bracket 7, the abutting unit 8, and the stopper unit 9. The bottom support bracket 7 is an L-shaped bracket, the bottom support bracket 7 is welded on the end wall of the output end of the driving motor 41 facing the switching support shaft 51, and the bottom support bracket 7 is used for receiving one end of the PC board away from the clamping frame 52.
Referring to fig. 4, the abutting unit 8 is used for rapidly positioning the PC board on the bottom support 7, and the abutting unit 8 includes a gland bracket 81, a limit edge plate 82, and a fixing member 83. The limiting side plate 82 is a dovetail-shaped steel plate, and the limiting side plate 82 is integrally formed at one end of the gland support plate 81 in the length direction. The bottom support bracket 7 is provided with a displacement groove 71, the inner diameter size of the displacement groove 71 is matched with the outer peripheral size of the limit side plate 82, the limit side plate 82 is propped into the inner cavity of the displacement groove 71, so that the gland support plate 81 is quickly connected with the bottom support plate, and the gland support plate 81 is propped against the PC plate.
Referring to fig. 4, the fixing member 83 is configured to define a position of the limit edge plate 82 in the displacement slot 71, and the fixing member 83 includes a rectifying guide post 831, a tension member 832, and a positioning nut 833. The rectifying guide post 831 is a steel post with a threaded protrusion on the circumferential wall at the longitudinal end, the rectifying guide post 831 is welded to the inner bottom wall of the displacement groove 71, and the rectifying guide post 831 extends along the longitudinal direction of the displacement groove 71.
Referring to fig. 4, the tension member 832 may be a steel compression spring, and the tension member 832 is sleeved on the deviation rectifying guide post 831. After the limiting side plate 82 abuts against the inner cavity of the displacement groove 71, the deviation rectifying guide post 831 penetrates through the limiting side plate 82, and the tension member 832 abuts against the bottom wall of the limiting side plate 82 to be deformed in a compression mode. At this time, the operator screws the positioning nut 833 onto the rectifying guide post 831, so that the limiting side plate 82 is positioned on the outer peripheral wall of the rectifying guide post 831, and further, the abutting stability of the gland support plate 81 to the PC board is ensured.
Referring to fig. 4 and 5, the stop unit 9 is used for abutting the PC board against the bottom support 7, and the stop unit 9 includes a connecting screw 91, a stop bottom plate 92, a control hand wheel 93, and an abutting member 94. Wherein, control hand wheel 93 welds in the one end of connecting lead screw 91 length direction, and the one end screw thread that control hand wheel 93 was kept away from to connecting lead screw 91 wears to locate gland extension board 81. The stopper bottom plate 92 is welded to the other end of the connecting screw 91 in the length direction, and the outer circumferential dimension of the stopper bottom plate 92 is larger than the outer diameter dimension of the connecting screw 91 for abutting against the PC board.
Referring to fig. 5, the abutting member 94 may be a rubber pad with a relatively high static friction coefficient, and the abutting member 94 is adhered to a side wall of the stop bottom plate 92 away from the connecting screw 91 by glue. The gland bracket 81 is further provided with a receiving groove 811, and the receiving groove 811 is used for receiving the stopper base plate 92 with the abutting piece 94.
Referring to fig. 2 and 4, an operator rotates the connecting screw 91 by controlling the hand wheel 93, so that one end of the stop bottom plate 92 with the abutting piece 94 abuts against the PC board, and the PC board is positioned in the inner cavity of the sealing area 311. The suction piece 61 sucks the air in the sealing area 311 through the communication conduit 62, so that part of dust and impurities on the PC board material can enter the inner cavity of the accommodating box body 63 along with the airflow. Then, the cleaning member 22 is covered on the top of the bottom box 31, and the cleaning member 22 sprays high-pressure plasma into the sealing area 311 through all the cleaning nozzles 23, so that the high-pressure plasma can collide with the tiny dust and promote the volatilization of the tiny dust, thereby achieving the effect of cleaning the PC board.
Processing: and printing the PC board to form a plurality of groups of models to be engraved on the PC board.
And engraving all the models to be engraved on the PC plate along the outline of the printed models to be engraved, and then cutting the engraved models from the PC plate to obtain the workpiece for the lens module.
Sticking film: at this time, because each model is cleaned by plasma, the dust quantity on the model is greatly reduced, and the surface active substance of the model is excited by the impact of the plasma, so that the adhesive force of the model is greatly improved, the position stability and the application stability of the OCA film on the model are further guaranteed, and the bubbling phenomenon after the OCA film is adhered for a period of time is reduced.
And finally, simultaneously attaching the back adhesive to all the cut models so as to connect a plurality of the cut models, and facilitating the operation staff to pack the plurality of the models for storage and transportation.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (9)
- A pc board film-bonding process, characterized in that: comprises the following film pasting steps:pretreatment: removing the protective film of the PC board, and performing plasma cleaning on the PC board for later use;processing: printing the PC board to form a plurality of groups of models to be engraved; carving all the models to be carved on the PC board, and cutting the carved models from the PC board for later use;sticking film: the OCA film was applied to the cut pattern and then back-glued to all cut patterns.
- 2. The PC board film process of claim 1, wherein: in the pretreatment step, plasma cleaning is carried out on the PC board through a cleaning device (1), wherein the cleaning device (1) comprises a cleaning mechanism (2), a bearing mechanism (3), a driving mechanism (4) and a driven mechanism (5); the cleaning mechanism (2) is arranged on the bearing mechanism (3), so that a sealing area (311) is formed on the bearing mechanism (3) and is used for performing plasma cleaning in the sealing area (311); the driving mechanism (4) and the driven mechanism (5) are oppositely arranged in the side wall of the sealing area (311) and are used for clamping the PC board together and controlling the rotation of the PC board.
- 3. The PC board film bonding process of claim 2, wherein: the bearing mechanism (3) comprises a bearing bottom box (31), and the cleaning device (1) comprises a blending bracket (21), cleaning pieces (22) and a plurality of groups of cleaning spray heads (23); the cleaning piece (22) is arranged on the bearing bottom box (31) through the blending bracket (21), so that a sealing area (311) is formed in the inner cavity of the bearing bottom box (31); all the cleaning spray heads (23) are arranged on the cleaning piece (22) so as to clean the PC board in the sealing area (311); the driving mechanism (4) comprises a driving motor (41) and a clamping assembly (42), and the driven mechanism (5) comprises a switching support shaft (51) and a clamping frame (52); the clamping frame (52) is arranged in the side wall of the sealing area (311) through the switching support shaft (51), the clamping assembly (42) is arranged in the side wall of the sealing area (311) through the driving motor (41), one end of the PC board is connected with the clamping frame (52), and the other end of the PC board is connected with the clamping assembly (42).
- 4. A PC board film process as claimed in claim 3, wherein: a preset groove (312) for installing a driving motor (41) is formed in the side wall of the sealing area (311), and the clamping assembly (42) comprises a bottom bearing bracket (7), an abutting unit (8) and a stopping unit (9); the bottom support bracket (7) is arranged at the output end of the driving motor (41), and the abutting unit (8) is movably arranged on the bottom support bracket (7) so as to abut against the PC board; the stop unit (9) is arranged on the abutting unit (8) and is used for positioning the PC board between the bottom support bracket (7) and the abutting unit (8).
- 5. The PC board film process of claim 4, wherein: the abutting unit (8) comprises a gland support plate (81), a limiting side plate (82) and a fixing piece (83), wherein the limiting side plate (82) is arranged on the gland support plate (81), a displacement groove (71) used for enabling the limiting side plate (82) to abut into and slide is formed in the bottom support bracket (7), and the fixing piece (83) is used for positioning the limiting side plate (82) in the side wall of the displacement groove (71); the stop unit (9) comprises a connecting screw rod (91), a stop bottom plate (92) and a control hand wheel (93); the connecting screw rod (91) is threaded through the gland support plate (81), and the stop bottom plate (92) is arranged at one end of the connecting screw rod (91) and is used for abutting against the PC board; the control hand wheel (93) is arranged at the other end of the connecting screw rod (91).
- 6. The PC board material lamination process of claim 5, wherein: the positioning piece comprises a deviation rectifying guide post (831), a tension transformer piece (832) and a positioning nut (833), the deviation rectifying guide post (831) is arranged in the side wall of the displacement groove (71), and the Zhang Bian piece (832) is sleeved on the deviation rectifying guide post (831); the deviation correcting guide post (831) is penetrated through the limiting side plate (82), and the Zhang Bian piece (832) is propped against the limiting side plate (82); the positioning nut (833) is in threaded connection with the deviation rectifying guide post (831) and is used for enabling the limiting side plate (82) to be positioned on the deviation rectifying guide post (831).
- 7. The PC board material lamination process of claim 5, wherein: the stop unit (9) further comprises a propping piece (94), the propping piece (94) is arranged on the stop bottom plate (92), and the propping piece (94) is in interference fit between the stop bottom plate (92) and the PC board; the gland support plate (81) is also provided with a containing groove (811) for the joint propping of the stop bottom plate (92) and the propping piece (94).
- 8. The PC board film bonding process of claim 2, wherein: the cleaning device (1) further comprises a dust guide mechanism (6), wherein the dust guide mechanism (6) comprises a suction piece (61), a communication pipe (62), a containing box body (63) and a dust guide plate (64); the accommodating box body (63) is arranged in the side wall of the sealing area (311), and the accommodating box body (63) is positioned below the PC board; the dust guide plate (64) is arranged in the side wall of the accommodating box body (63), and a plurality of dust guide channels (641) are arranged on the dust guide plate (64) in a penetrating manner; the suction piece (61) is arranged in the side wall of the sealing area (311), one end of the communication conduit (62) is connected with the suction end of the suction piece (61), and the other end of the communication conduit penetrates through the side wall of the accommodating box body (63) so as to be positioned in the inner cavity of the accommodating box body (63).
- 9. The PC board film process of claim 8, wherein: the dust guide mechanism (6) further comprises a switching cylinder (65) and a guide cover plate (66); the guide cover plate (66) is arranged on the switching cylinder (65), and the switching cylinder (65) is sleeved on one end of the communication guide pipe (62) positioned in the inner cavity of the accommodating box body (63); and the switching cylinder (65) and the guide cover plate (66) are respectively provided with an air guide channel (67) in a penetrating way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211665536.6A CN117774295A (en) | 2022-12-23 | 2022-12-23 | PC board film pasting technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211665536.6A CN117774295A (en) | 2022-12-23 | 2022-12-23 | PC board film pasting technology |
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| Publication Number | Publication Date |
|---|---|
| CN117774295A true CN117774295A (en) | 2024-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211665536.6A Pending CN117774295A (en) | 2022-12-23 | 2022-12-23 | PC board film pasting technology |
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| Country | Link |
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| CN (1) | CN117774295A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207817665U (en) * | 2018-01-29 | 2018-09-04 | 东莞市宇触电子科技有限公司 | A kind of Antistatic touch screen |
| CN209810817U (en) * | 2019-03-05 | 2019-12-20 | 无锡奥威赢科技有限公司 | Cavity formula plasma cleaning machine |
| CN111844712A (en) * | 2020-06-30 | 2020-10-30 | 广东东德科技股份有限公司 | PC panel pad pasting device |
| CN214348353U (en) * | 2020-12-07 | 2021-10-08 | 王坤 | Low-temperature green quartz cavity plasma cleaning device |
-
2022
- 2022-12-23 CN CN202211665536.6A patent/CN117774295A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207817665U (en) * | 2018-01-29 | 2018-09-04 | 东莞市宇触电子科技有限公司 | A kind of Antistatic touch screen |
| CN209810817U (en) * | 2019-03-05 | 2019-12-20 | 无锡奥威赢科技有限公司 | Cavity formula plasma cleaning machine |
| CN111844712A (en) * | 2020-06-30 | 2020-10-30 | 广东东德科技股份有限公司 | PC panel pad pasting device |
| CN214348353U (en) * | 2020-12-07 | 2021-10-08 | 王坤 | Low-temperature green quartz cavity plasma cleaning device |
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