CN211389627U

CN211389627U - Clamping device of wafer cutting machine

Info

Publication number: CN211389627U
Application number: CN201921993966.4U
Authority: CN
Inventors: 李志卫; 张仕俊; 石正娟
Original assignee: Suzhou Xinmit Electronic Technology Co ltd
Current assignee: Suzhou Xinmit Electronic Technology Co ltd
Priority date: 2019-11-18
Filing date: 2019-11-18
Publication date: 2020-09-01
Anticipated expiration: 2029-11-18

Abstract

The utility model discloses a clamping device of a wafer cutting machine, which relates to the field of the wafer cutting machine and aims to solve the problem of easy damage in the process of clamping a wafer, and the technical scheme is characterized in that the clamping device comprises a fixed seat, the fixed seat is detachably connected with an installation disc, the installation disc is annular, a viscous film is pasted on the installation disc, the surface of the installation disc far away from the viscous film is fixedly connected with a plurality of handles, the longitudinal section of the fixed seat is roughly shaped like a Chinese character 'tu', the installation disc is abutted against a plane with a relatively lower upper surface of the fixed seat, the relatively lower plane of the installation disc is provided with a plurality of grooves, the upper surface of the fixed seat is provided with a plurality of latticed scale lines, the upper surface of the fixed seat is provided with a plurality of vent grooves, the lower end of the; the wafer is adhered to the adhesive film and is fixed in the fixing seat by taking the mounting disc as a carrier, and the wafer is not easy to damage or break due to external force.

Description

Clamping device of wafer cutting machine

Technical Field

The utility model belongs to the technical field of wafer cutting machine's technique and specifically relates to a clamping device of wafer cutting machine is related to.

Background

A wafer refers to a silicon wafer used for manufacturing a semiconductor integrated circuit, and is called a wafer because its shape is generally circular. Before the wafer leaves the factory, the wafer needs to be cut so as to be convenient for installation and use of the wafer. Wafer dicing is a very precise process operation, and therefore, securing the wafer before dicing is very important. In the prior art, a wafer cutting machine is generally used to cut a wafer, and a clamping device in the cutting machine is concerned about the cutting precision of the wafer.

The utility model discloses a chinese utility model patent that current publication number is CN204045560U discloses a wafer cutting automatic clamping device, including the device body, be equipped with control assembly in the device body, be equipped with the rotary clamping structure who is used for pressing from both sides tight wafer on the device body, rotary clamping structure includes a plurality of fixed blocks, and the fixed block facial make-up is equipped with revolving cylinder, still including installing the rotatory clamp plate on the revolving cylinder rotation axis. When the wafer is clamped, the rotary air cylinder is started to press the pressing plate on the wafer, and then the wafer is fixed.

The above prior art solutions have the following drawbacks: the pressure plate is pressed on the wafer, and the pressure plate is not only in direct contact with the wafer but also has a large pressure to the wafer, which is easy to damage the wafer or cause the wafer to break.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wafer cutting machine's clamping device, its advantage is not fragile wafer at the clamping in-process.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: the utility model provides a wafer cutting machine's clamping device, includes the fixing base, can dismantle on the fixing base and be connected with the mounting disc, the mounting disc is the annular, be equipped with the viscidity membrane on the mounting disc, can dismantle on the fixing base and be connected with a plurality of magnetic part that are used for adsorbing the mounting disc.

Through adopting above-mentioned technical scheme, operating personnel pastes the viscosity membrane on the mounting disc earlier, then pastes the wafer on the viscosity membrane, places the mounting disc on the upper surface of fixing base again, fixes the mounting disc on the fixing base through the magnetic part. The wafer is fixed on the fixed seat by taking the adhesive film and the mounting disc as carriers, and then cutting processing is carried out. The wafer stability is high, is difficult for becoming flexible, and does not receive the extrusion of external force, also does not have too much contact with other devices, and is not fragile, also is difficult for causing the breakage, saves the cost, reduces the wafer extravagant.

The utility model discloses further set up to: the upper surface of the fixing seat is provided with a plurality of vent grooves, and the lower end of the fixing seat is connected with an air suction pump.

Through adopting above-mentioned technical scheme, the aspiration pump is taken out the air of fixing base top through the air channel and is separated, because the viscidity membrane covers the upper surface at the fixing base, and then with firm absorption on the fixing base of viscidity membrane to make the difficult activity to some extent of wafer on the viscidity membrane, improve the stability of wafer, precision when guaranteeing the cutting. The wafer is fixed in a mode that the adhesive film is adsorbed on the upper surface of the fixing seat, so that one surface of the wafer with a large area is indirectly abutted against the fixing seat, and the wafer is not easy to damage. Compared with the mode of directly pressing or extruding the wafer, the method ensures the integrity and the safety of the wafer to the maximum extent.

The utility model discloses further set up to: the longitudinal section of the fixing seat is in a shape like a Chinese character 'tu', and the mounting disc is abutted to the lower plane of the upper surface of the fixing seat.

By adopting the technical scheme, the longitudinal section of the fixing seat is in a convex shape, so that the upper surface of the fixing seat is provided with a relatively higher plane and a relatively lower plane, the relatively lower plane is positioned on the periphery of the upper surface of the fixing seat, and the relatively higher plane is indirectly abutted to the wafer. When mounting disc and lower plane butt relatively, the viscous film on the mounting disc is because the fixing base upper surface is equipped with higher planar reason relatively, abundant and fixing base butt, and then guarantees the rate of tension of viscous film, and the higher difficult activity of viscous film rate of tension makes the difficult activity of wafer on the viscous film, improves the stability of wafer, guarantees cutting accuracy. Before the air pump starts, the viscous membrane is the state of tensioning promptly, and after the air pump starts, the viscous membrane can not have great shake, and then guarantees that the wafer on the viscous membrane can not follow the motion that the viscous membrane produced great amplitude, makes the wafer be difficult for bumping with other devices, guarantees the intact of wafer, makes the wafer not fragile.

The utility model discloses further set up to: the fixing base is provided with a plurality of rotating parts which are rotatably connected with the fixing base, and the magnetic part is connected with the rotating parts.

Through adopting above-mentioned technical scheme, the magnetic part is connected on rotating the piece, when operating personnel adjusted the angle of mounting disc, rotates the piece through pulling and makes the magnetic part level rotate, and then keeps away from fixing base and mounting disc, and the operating personnel of being convenient for adjusts the mounting disc. The magnetic part is connected with the rotating part, so that the magnetic part is not easy to lose, and the cost is saved. The magnetic part gives the mounting disc the adsorption affinity great, and operating personnel is difficult direct takes off the magnetic part from the fixing base, through rotating a labour saving and time saving, reduces the time of adjusting or installing or dismantling the mounting disc, improves operating personnel's work efficiency.

The utility model discloses further set up to: the rotating piece is fixedly connected with a rotating rod.

Through adopting above-mentioned technical scheme, operating personnel pulls through holding the dwang and rotates the piece and be difficult by the tong, improves the security of clamping device. The length of the power arm is increased by the rotating rod, so that the rotating rod is more labor-saving and convenient to pull.

The utility model discloses further set up to: the outer edge of the fixing seat is provided with a plurality of grooves.

Through adopting above-mentioned technical scheme, when operating personnel need adjust the angle of mounting disc, through the mounting disc of centre gripping fixing base outward flange recess top, rotate the mounting disc, labour saving and time saving need not take off the mounting disc from the fixing base. The direct rotation mounting disc improves the regulation precision, can carry out slight adjustment, improves cutting accuracy.

The utility model discloses further set up to: a plurality of handles are fixedly connected to the mounting plate.

Through adopting above-mentioned technical scheme, the handle is convenient for carry take the mounting disc and place the mounting disc, lays the wafer back on the mounting disc, needs tentatively place the mounting disc in a certain position, and the accessible handle supports the mounting disc, places the wafer unsettled to avoid damaging the wafer. When adjusting the mounting disc, operating personnel also can rotate the mounting disc through holding the handle, increases the mode of adjusting the mounting disc, improves the flexibility of clamping device.

The utility model discloses further set up to: the upper surface of the fixed seat is provided with a plurality of latticed scale marks.

Through adopting above-mentioned technical scheme, because the position requirement of cutting knife is higher in wafer and the cutting machine, adjusting the mounting disc to make the mounting disc drive the wafer and rotate, when making the wafer accord with the cutting position, operating personnel judges through the scale mark whether the wafer position accords with the processing standard, and is swift convenient, saves a large amount of judgement time.

To sum up, the utility model discloses a beneficial technological effect does:

1. the wafer takes the mounting disc and the adhesive film on the mounting disc as carriers and is indirectly fixed on the fixing seat, and the wafer is not subjected to external force of pressing or extrusion, so that the wafer is not easy to damage and the cost is saved;

2. the longitudinal section of the fixing seat is in a convex shape, so that the adhesive film is high in tension degree and not easy to shake, and further, when a wafer is fixed, the wafer is not easy to shake greatly along with the adhesive film, so that the wafer is not easy to collide with other devices, and further the wafer is not easy to damage;

3. the air pump absorbs the adhesive film on the upper surface of the fixed seat, and the magnetic part fixes the mounting disc on the fixed seat, so that the wafer is good in stability and not easy to move during processing, the wafer is not easy to cut and damage, and the cutting precision is ensured;

4. the fixing base outward flange is equipped with the recess, is equipped with the handle on the mounting disc, and the fixing base upper surface is equipped with the scale mark, is convenient for adjust the position of mounting disc, and then adjusts the wafer, guarantees cutting accuracy.

Drawings

Fig. 1 is a schematic view of the overall structure of a clamping device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a mounting plate according to an embodiment of the present invention;

fig. 3 is a sectional view of the mounting plate and the fixing base according to the embodiment of the present invention;

fig. 4 is a schematic diagram of a related structure of a magnetic member according to an embodiment of the present invention;

fig. 5 is an enlarged view of a portion a of fig. 1 according to an embodiment of the present invention.

In the figure, 1, a fixed seat; 11. a magnetic member; 12. a vent channel; 13. an air pump; 14. a rotating member; 15. rotating the rod; 16. a groove; 17. scale lines; 2. mounting a disc; 21. an adhesive film; 22. a handle; 3. and (5) a wafer.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1, for the utility model discloses a dress of wafer cutting machine connects device, including fixing base 1, the 1 lower extreme of fixing base is connected with aspiration pump 13, and 1 upper surface of fixing base is equipped with a plurality of air grooves 12, and air groove 12 and aspiration pump 13 intercommunication, after aspiration pump 13 starts, the air of 1 top of fixing base is taken out from by aspiration pump 13 through air groove 12.

Referring to fig. 2, a mounting plate 2 is detachably connected to a fixing base 1 (shown in fig. 1), the mounting plate 2 is annular, an adhesive film 21 is adhered to the mounting plate 2, the adhesive film 21 is an adhesive film 21 with one side being adhesive, and the wafer 3 is connected to the adhesive film 21 through the adhesion of the adhesive film 21. A plurality of handles 22 are arranged on one surface of the mounting plate 2 far away from the adhesive film 21, and the handles 22 are fixedly connected with the mounting plate 2. The operator can hold the mounting plate 2 by the handle 22, which is convenient and fast. The handle 22 can also be used for supporting the mounting disc 2, so that the wafer 3 on the mounting disc 2 is suspended, the wafer 3 is not easy to contact with other devices, and the wafer 3 is not easy to damage.

Referring to fig. 3, the longitudinal section of the fixing base 1 is substantially in a shape of a Chinese character 'tu', the lower plane of the upper surface of the fixing base 1 is located at the periphery of the upper surface of the fixing base 1, and the mounting plate 2 is abutted to the lower plane of the upper surface of the fixing base 1. Because the longitudinal section of the fixing seat 1 is in a shape of a Chinese character 'tu', when the adhesive film 21 abuts against the upper surface of the fixing seat 1, the adhesive film 21 deforms, the tension degree is improved, and the wafer 3 indirectly abuts against a plane with a higher upper surface of the fixing seat 1.

Referring to fig. 4, the outer edge of the fixing seat 1 is provided with a plurality of grooves 16, so that an operator can hold the mounting disc 2 (marked in fig. 1) conveniently and quickly through the grooves 16, and can rotate the mounting disc 2 (marked in fig. 1) conveniently, thereby adjusting the position of the wafer 3. A plurality of connecting pipes are fixedly connected to the fixing seat 1, the connecting pipes are rotatably connected with a rotating rod through bearings, the rotating rod is fixedly connected with a rotating part 14, a magnetic part 11 is connected to the rotating part 14, and the magnetic part 11 can be adsorbed together with the mounting disc 2. A rotating rod 15 is fixedly connected to the rotating part 14, and an operator pulls the rotating rod 15 to enable the rotating part 14 to horizontally rotate, so that the rotating part 14 drives the magnetic part 11 to move. When needs are fixed mounting disc 2 on fixing base 1, rotate magnetic part 11 to the direction that is close to fixing base 1, until magnetic part 11 and fixing base 1 butt, and then adsorb mounting disc 2 on fixing base 1.

Referring to fig. 5, the upper surface of the fixing base 1 is provided with a plurality of grid-shaped scale lines 17, and when an operator adjusts the position of the wafer 3, the operator can judge whether the position of the wafer 3 meets the cutting standard according to the scale lines 17, so that the operation is fast and efficient.

The implementation principle of the embodiment is as follows: the operator sticks the adhesive film 21 to the mounting plate 2, and sticks the wafer 3 to the adhesive film 21 on the side having the adhesive property, so that the wafer 3 is fixed to the adhesive film 21. Then operating personnel places mounting disc 2 on fixing base 1 through carrying handle 22 or centre gripping mounting disc 2, makes mounting disc 2 and 1 upper surface butt of fixing base. And rotating the mounting disc 2 according to the scale marks 17 on the upper surface of the fixed seat 1, adjusting the position of the wafer 3 to a position meeting the processing standard, and stopping rotating the mounting disc 2. The dwang 15 is rotated, makes magnetic part 11 and 1 butt of fixing base, and then adsorbs mounting disc 2 and fixes on fixing base 1, makes mounting disc 2 unable removal. Then, the operator starts the air pump 13, and the air pump 13 pumps air between the adhesive film 21 and the upper surface of the fixing base 1, so that the adhesive film 21 fully covers the upper surface of the fixing base 1, and further the wafer 3 is fully fixed on the fixing base 1, and the cutting accuracy of the wafer 3 is ensured.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides a wafer cutting machine's clamping device, includes fixing base (1), its characterized in that: the detachable mounting disc (2) is detachably connected to the fixing base (1), the mounting disc (2) is annular, a viscous film (21) is arranged on the mounting disc (2), and a plurality of magnetic pieces (11) used for adsorbing the mounting disc (2) are detachably connected to the fixing base (1).

2. The clamping device of the wafer cutting machine according to claim 1, characterized in that: the air suction device is characterized in that a plurality of vent grooves (12) are formed in the upper surface of the fixing seat (1), and an air suction pump (13) is connected to the lower end of the fixing seat (1).

3. The clamping device of the wafer cutting machine according to claim 2, characterized in that: the longitudinal section of the fixing seat (1) is in a convex shape, and the mounting disc (2) is abutted to the lower plane of the upper surface of the fixing seat (1).

4. The clamping device of the wafer cutting machine according to claim 1, characterized in that: the magnetic rotating device is characterized in that a plurality of rotating pieces (14) rotatably connected with the fixing seat (1) are arranged on the fixing seat (1), and the magnetic pieces (11) are connected with the rotating pieces (14).

5. The clamping device of the wafer cutting machine according to claim 4, characterized in that: and the rotating piece (14) is fixedly connected with a rotating rod (15).

6. The clamping device of the wafer cutting machine according to claim 1, characterized in that: the outer edge of the fixed seat (1) is provided with a plurality of grooves (16).

7. The clamping device of the wafer cutting machine according to claim 6, characterized in that: a plurality of handles (22) are fixedly connected to the mounting plate (2).

8. The clamping device of the wafer cutting machine according to claim 1, characterized in that: the upper surface of the fixed seat (1) is provided with a plurality of latticed scale marks (17).