CN111844712A

CN111844712A - PC panel pad pasting device

Info

Publication number: CN111844712A
Application number: CN202010623341.XA
Authority: CN
Inventors: 陈晓丰
Original assignee: Guangdong Dongde Technology Co ltd
Current assignee: Guangdong Dongde Technology Co ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-10-30

Abstract

The invention discloses a PC plate film pasting device, which comprises a plate conveying line, and a cleaning device, a wetting device, a film pasting device and a drying device which are sequentially arranged along the conveying direction of the plate conveying line; the cleaning device comprises a static electricity removing device and a dust suction device which are sequentially arranged along the conveying direction of the plate conveying line. Before film pasting, the surface of the PC plate needing film pasting is cleaned through a cleaning device, and impurities are prevented from being present between the protective film and the PC plate; wetting the PC board by a wetting device to ensure that the bonding force between the protective film and the PC board is tighter; and drying the water on the PC board by a drying device after the film is pasted.

Description

PC panel pad pasting device

Technical Field

The invention relates to a film sticking device, in particular to a PC plate film sticking device.

Background

The PC board usually needs to be subjected to film pasting treatment, but in the film pasting process, bubbles exist between the protective film and the PC board easily due to various reasons, and a cavity and film pasting wrinkles at a joint part caused by the bubbles can reduce the yield.

Disclosure of Invention

The invention aims to solve at least one technical problem in the prior art and provides a PC plate film sticking device.

The technical scheme adopted by the invention for solving the problems is as follows:

a PC plate film sticking device comprises a plate conveying line, and a cleaning device, a wetting device, a film sticking device and a drying device which are sequentially arranged along the conveying direction of the plate conveying line; the cleaning device comprises a static electricity removing device and a dust suction device which are sequentially arranged along the conveying direction of the plate conveying line.

Further, the wetting device comprises a first soaking cotton roller and a second soaking cotton roller which are symmetrically arranged up and down.

Further, a water spraying pipe is arranged above the first soaking cotton roller.

Further, a water storage cavity is arranged below the second soaking cotton roller, and a water guide pipe is arranged in the water storage cavity.

Further, the film sticking device comprises two groups of protective film feeding devices which are arranged in parallel.

Further, the film sticking device further comprises an automatic protective film edge cutting device, and the automatic protective film edge cutting device is arranged at the downstream position of the protective film feeding device.

Further, the automatic edge cutting device of protection film includes first cutting knife and second cutting knife, first cutting knife with the second cutting knife is located respectively the both sides of panel transfer chain and relative setting.

Further, the first cutting knife and the second cutting knife are driven by an air cylinder push rod.

Further, the automatic edge cutting device for the protective film further comprises a cutting knife adjusting device, and the first cutting knife and the second cutting knife are both installed on the cutting knife adjusting device.

Further, the cutting knife adjusting device comprises a bracket and a connecting rod, and the bracket is provided with a sliding groove; the connecting rod passes the spout, the one end of connecting rod with the cylinder push rod is connected, the other end threaded connection of connecting rod has lock nut.

The PC board film pasting device at least has the following beneficial effects: before film pasting, the surface of the PC plate needing film pasting is cleaned through a cleaning device, and impurities are prevented from being present between the protective film and the PC plate; wetting the PC board by a wetting device to ensure that the bonding force between the protective film and the PC board is tighter; and drying the water on the PC board by a drying device after the film is pasted.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic diagram of a PC board laminating apparatus according to an embodiment of the present invention;

FIG. 2 is a block diagram of the wetting apparatus of FIG. 1;

fig. 3 is a structural view of the automatic protective film slitting device of fig. 1.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1, the invention provides a PC board film pasting device 400, which comprises a board conveying line 100, and a cleaning device 200, a wetting device 300, a film pasting device 400 and a drying device 600 which are sequentially arranged along the conveying direction of the board conveying line 100; the cleaning device 200 includes a static electricity removing device 210 and a dust suction device 220 which are sequentially disposed along the conveying direction of the sheet material conveying line 100.

In this embodiment, before film pasting, the surface of the PC board to be pasted with the film is cleaned by the cleaning device 200, so as to prevent impurities from existing between the protective film and the PC board; the wetting device 300 is used for wetting the PC plate, so that the bonding force between the protective film and the PC plate is tighter; attaching a protective film to the wetted PC board through a film attaching device 400; after the film is applied, the water on the PC board is dried by the drying device 600.

In addition, the cleaning device 200 includes a static electricity removing device 210 and a dust suction device 220, and the static electricity on the surface of the PC board is removed by the static electricity removing device 210, and then the fine substances on the surface of the PC board are removed by the dust suction device 220.

Specifically, the drying device 600 is a heat generating device that dries water on the PC board by heat.

Referring to fig. 2, further, the wetting apparatus 300 includes a first soaking cotton roll 310 and a second soaking cotton roll 320 which are disposed up and down symmetrically. The first soaking cotton roll 310 wets the upper surface of the PC board material passing through the wetting apparatus 300, and the second soaking cotton roll 320 wets the lower surface of the PC board material. The first 310 and second 320 rolls of soaked cotton are each a thin layer of sponge wrapped around a rotating roll.

Further, a water spray pipe 330 is arranged above the first soaking cotton roller 310, a nozzle is installed at the front end of the water spray pipe 330, and the hole of the nozzle is small, so that the sprayed water forms thin water mist. The water spray pipe 330 sprays water mist to the first soaking cotton roller 310 and the second soaking cotton roller 320, and the first soaking cotton roller 310 and the second soaking cotton roller 320 are slightly supplemented with water, so that the first soaking cotton roller 310 and the second soaking cotton roller 320 are wetted.

Further, a water storage cavity 340 is arranged below the second soaking cotton roller 320, and a water guide pipe 350 is arranged in the water storage cavity 340. When the PC board passes through the wetting device 300, water flowing out of the first soaking cotton roll 310 and the second soaking cotton roll 320 drops into the water storage chamber 340 and then flows out of the water guide pipe 350.

Further, the film pasting device 400 includes two sets of protective film feeding devices 410 disposed in parallel with each other. Through setting up two sets of protection film loading attachment 410, at the pad pasting in-process, after the protection film that stores in a set of protection film loading attachment 410 runs out, can use the protection film in another group rapidly, later carry out the replenishment of protection film material to the protection film loading attachment 410 that the protection film runs out, this mode of setting can reduce the time of system down operation when reloading, improves pad pasting efficiency. The film attaching device 400 attaches the protective film on the protective film feeding device 410 to the PC board.

Referring to fig. 1 and 3, further, the film laminating apparatus 400 further includes an automatic protective film edge cutting apparatus 500, and the automatic protective film edge cutting apparatus 500 is disposed at a downstream position of the protective film loading apparatus 410. The PC board material that has been coated by the protective film coating device 410 is not always suitable for the size of the PC board material and the protective film, and the side edges of the two sides of the excess protective film need to be cut off, and then the PC board material is cut off by the protective film automatic edge cutting device 500.

Further, the automatic protective film edge cutting device 500 includes a first cutter 510 and a second cutter 520, and the first cutter 510 and the second cutter 520 are respectively located at two sides of the board conveying line 100 and are oppositely disposed. The first cutter 510 cuts off the waste on one side of the protective film, and the second cutter 520 cuts off the waste on the other side of the protective film.

Further, the first cutter 510 and the second cutter 520 are driven by one cylinder push rod 530, respectively. The cylinder push rod 530 drives the first cutter 510 to move up and down in the vertical direction, and cuts off the waste on one side of the protective film. The cylinder push rod 530 drives the second cutter 520 to move up and down in the vertical direction, and the scraps on the other side of the protective film are cut off.

Further, the automatic protective film edge cutting device 500 further includes a cutting knife adjustment device 540, and the first cutting knife 510 and the second cutting knife 520 are both mounted on the cutting knife adjustment device 540. The positions of the first cutter knife 510 and the second cutter knife 520 can be adjusted by the cutter knife adjustment device 540, and the cutting positions of the first cutter knife 510 and the second cutter knife 520 on the protective film can be adjusted.

Further, the cutting knife adjusting device 540 comprises a bracket 541 and a connecting rod 543, the bracket 541 is provided with a chute 542; the connecting rod 543 penetrates through the sliding groove 542, one end of the connecting rod 543 is connected with the cylinder push rod 530, and the other end of the connecting rod 543 is connected with a lock nut 544 in a threaded manner. The cutting knife adjustment device 540 to which the first cutting knife 510 is attached slides the connecting rod 543 along the slide groove 542, adjusts the position of the first cutting knife 510, and then fixes the connecting rod 543 and the cutting knife on the connecting rod 543 by tightening the lock nut 544. The cutting knife adjustment mechanism 540 with the second cutting knife 520 installed is adjusted in the same manner as above.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and the present invention shall fall within the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means.

Claims

1. A PC board film pasting device is characterized by comprising a board conveying line, and a cleaning device, a wetting device, a film pasting device and a drying device which are sequentially arranged along the conveying direction of the board conveying line; the cleaning device comprises a static electricity removing device and a dust suction device which are sequentially arranged along the conveying direction of the plate conveying line.

2. The PC board pad pasting device of claim 1, wherein, the wetting device comprises a first soaking cotton roller and a second soaking cotton roller which are arranged up and down symmetrically.

3. The PC board laminating device as claimed in claim 2, wherein a water spray pipe is arranged above the first water-soaking cotton roller.

4. The PC board film pasting device as claimed in claim 3, wherein a water storage cavity is arranged below the second water-soaking cotton roller, and the water storage cavity is provided with a water guide pipe.

5. The PC board laminating device as claimed in claim 1, wherein the laminating device comprises two sets of protective film feeding devices arranged in parallel.

6. The PC board laminating device as claimed in claim 5, further comprising an automatic protective film edge cutting device, wherein the automatic protective film edge cutting device is arranged at a downstream position of the protective film feeding device.

7. The PC board pad pasting device of claim 6, wherein, the automatic edge cutting device of the protection film comprises a first cutting knife and a second cutting knife, and the first cutting knife and the second cutting knife are respectively arranged at two sides of the board conveying line and are arranged oppositely.

8. The PC board pad pasting device of claim 7, wherein the first cutter and the second cutter are driven by a cylinder push rod.

9. The PC board laminating apparatus of claim 8, wherein the automatic edge cutting device further comprises a cutter adjusting device, and the first cutter and the second cutter are mounted on the cutter adjusting device.

10. The PC board film pasting device as claimed in claim 9, wherein the cutter adjusting device comprises a bracket and a connecting rod, the bracket is provided with a sliding groove; the connecting rod passes the spout, the one end of connecting rod with the cylinder push rod is connected, the other end threaded connection of connecting rod has lock nut.