CN117765828A

CN117765828A - Bonding system and bonding method

Info

Publication number: CN117765828A
Application number: CN202211147943.8A
Authority: CN
Inventors: 万宝红; 汪浩; 李洋; 廖小刚; 李云泽
Original assignee: Chengdu Vistar Optoelectronics Co Ltd
Current assignee: Chengdu Vistar Optoelectronics Co Ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2024-03-26

Abstract

The embodiment provides a bonding system and a bonding method, and relates to the technical field of display. In the bonding system, the lifting driving structure is used for controlling the coplanarity of one side of the array driving backboard placed on the bearing platform and far from the fixed platform and one side of the moving platform and far from the fixed platform, and the moving platform is used for approaching the array driving backboard from the peripheral area, so that the pressure-bearing film layer covered on the display device is distributed flatly at the edge of the array driving backboard in the bonding process, thereby weakening the influence of non-vertical acting force of the pressure-bearing film layer on the display device at the edge and avoiding the displacement of the display device at the edge caused by the non-vertical acting force; the pressure-bearing film layer can not act on the side wiring in a non-vertical direction, and the side wiring can be prevented from falling off. Therefore, the design can reduce the defects caused by the displacement of the display device at the edge and the falling of the side wiring, and improve the manufacturing yield of the display panel.

Description

Bonding system and bonding method

Technical Field

The application relates to the technical field of display, in particular to a bonding pressing system and a bonding pressing method.

Background

The Micro-LED display technology is known as a next generation novel display technology by the characteristics of high color gamut, high brightness, high contrast, long service life and the like. To meet the market demand, micro-LED display technology is widely used in large-sized display panels. Taking the scheme of realizing full color of an RGB three-color display device through massive transfer as an example, the scheme is greatly limited by the maturity and transfer productivity of a transfer technology, so that for a large-size display panel, the current main stream is to adopt a splicing mode to realize the manufacture of the large-size display panel in a small-splicing and medium-splicing mode, and thus, the requirement on the large-area display device and the subsequent repair difficulty can be reduced. When the splicing mode is adopted, the problem of realizing narrow frames and side wiring is faced, however, when the spliced display panel is manufactured, the problem of low yield of the display panel exists.

Disclosure of Invention

In order to overcome the technical problems mentioned in the background, embodiments of the present application provide a bonding system and a bonding method.

In a first aspect of the present application, a bonding system is provided for performing bonding on a display device on an array driving back plate, the bonding system includes:

a stationary platform, wherein the stationary platform has a central region and a peripheral region surrounding the central region;

the lifting device is positioned in the central area of the fixed platform and comprises a bearing table and a lifting driving structure for controlling the bearing table to move up and down relative to the fixed platform;

the mobile platform can be arranged in the peripheral area of the fixed platform in a sliding way, wherein the mobile platform can move in the direction approaching to the central area or the direction far from the central area;

the lifting driving structure is used for enabling one side of the array driving backboard placed on the bearing platform, which is far away from the fixed platform, and one side of the moving platform, which is far away from the fixed platform, to be coplanar by controlling the lifting height of the bearing platform;

the movable platform is used for approaching the array driving backboard from the peripheral area, so that the pressure-bearing film layer covered on the display device in the bonding process is distributed flatly at the edge of the array driving backboard.

In one possible embodiment of the present application, the central area is provided with a plurality of through holes, and the lifting driving structure includes a supporting rod correspondingly arranged in each through hole and a driving member for driving the supporting rod to extend or retract relative to the fixed platform;

the support rod and one side of the bearing platform, which faces the fixed platform, are fixed.

In one possible embodiment of the present application, the present bonding system further includes a control device and a driving device corresponding to the mobile platform one by one;

the control device is electrically connected with the driving device and is used for controlling the corresponding mobile platform to be close to or far away from the central area through the driving device.

In one possible embodiment of the present application, the present bonding system further includes a plurality of image capturing devices, where the plurality of image capturing devices respectively obtain image information of different moving platforms and array driving backplanes placed on the carrier;

the control device is electrically connected with the image acquisition equipment and is used for calculating the distance between the corresponding mobile platform and the array driving backboard placed on the bearing platform according to the image information so as to control the motion of the corresponding mobile platform according to the distance.

In one possible embodiment of the present application, during the movement of the mobile platform towards the central area, the control device is configured to control the mobile platform to stop moving when a distance between the mobile platform and an array driving back plate placed on the carrying platform is equal to a preset distance value.

In one possible embodiment of the present application, the number of the mobile platforms is four, and the mobile platforms are respectively disposed in four directions around the central area;

the number of the image acquisition devices is four, the orthographic projection of each image acquisition device on the fixed platform is positioned between the orthographic projection of different mobile platforms on the fixed platform and the orthographic projection of the bearing platform on the fixed platform, and the image acquisition devices are positioned above the mobile platforms and the bearing platform.

In a possible embodiment of the application, the fixed platform is provided with a chute, the mobile platform is provided with a slider towards one side of the fixed platform, which slider extends into the chute and can slide along the chute, wherein the chute extends from the edge of the fixed platform towards the direction of the central area.

In one possible embodiment of the present application, the present bonding system further includes an anti-collision member disposed on a side of the moving platform near the central region, the anti-collision member being configured to prevent the moving platform from rigidly contacting an array drive back plate disposed on the carrying platform.

In a second aspect of the present application, there is provided a present bonding method applied to the present bonding system of any one of the foregoing possible embodiments, the method including:

placing an array driving backboard on the bearing table, wherein display devices are distributed on the array driving backboard;

controlling the moving platform to move towards the central area, and controlling the moving platform to stop moving when a preset condition is met;

the height of the bearing table is adjusted by controlling the movement of the lifting driving structure, so that one side of the array driving backboard on the bearing table, which is far away from the fixed platform, and one side of the moving platform, which is far away from the fixed platform, are coplanar;

and covering a pressure-bearing film layer on the display device of the array driving backboard, and performing the bonding of the display device by applying atmospheric pressure to the pressure-bearing film layer.

In one possible embodiment of the present application, the step of controlling the moving platform to move toward the central area and controlling the moving platform to stop moving when a preset condition is met includes:

controlling the moving platform to move towards the central area, and acquiring image information between the moving platform and an array driving backboard on the bearing platform;

calculating a first distance between the mobile platform and an array driving backboard on the bearing platform based on the image information;

and calculating a second distance required to be moved by the mobile platform based on the first distance and a preset distance threshold value, and controlling the mobile platform to move the second distance, wherein the preset distance threshold value is the distance between adjacent pixels formed on the array driving backboard by the display device.

The embodiment of the application provides a bonding system and a bonding method, wherein the bonding system comprises a fixed platform, a lifting device and a moving platform. The lifting device is arranged in the central area of the fixed platform and comprises a bearing table for bearing the array driving backboard and a lifting driving structure for controlling the bearing table to move up and down relative to the fixed platform, and the movable platform is slidably arranged in the peripheral area of the fixed platform. The lifting driving structure is used for enabling one side, far away from the fixed platform, of the array driving backboard placed on the bearing platform and one side, far away from the fixed platform, of the moving platform to be coplanar through controlling the lifting height of the bearing platform, the moving platform is used for enabling the peripheral area to be close to the array driving backboard, so that the pressure-bearing film layer covered on the display device in the bonding process is distributed flatly at the edge of the array driving backboard, the influence of non-vertical acting force of the pressure-bearing film layer on the display device at the edge is weakened, and displacement of the display device at the edge due to the non-vertical acting force is avoided. In addition, the pressure-bearing film layer can not act on the side wiring in a non-vertical direction, and the side wiring can be prevented from falling off. Therefore, the design can reduce the defects caused by the displacement of the display device at the edge and the falling of the side wiring, and improve the manufacturing yield of the display panel.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 illustrates a schematic diagram of a display device and an array drive backplate for present press bonding;

FIG. 2 illustrates one possible structural schematic of the present press bonding system provided by the present embodiments;

FIG. 3 illustrates a top view of the present press bonding system of FIG. 2;

fig. 4 illustrates a schematic structural diagram of the present bonding method in this embodiment;

FIG. 5 illustrates another possible structural schematic of the present press bonding system provided by the present embodiments;

FIG. 6 illustrates a schematic cross-sectional view of the AA in FIG. 3;

FIG. 7 illustrates yet another possible structural schematic of the present press bonding system provided by the present embodiments;

fig. 8 illustrates a flowchart of the present bonding method provided in this embodiment;

fig. 9 illustrates a process diagram corresponding to the bonding method according to this embodiment.

Icon: 1-a present press bonding system; 11-a fixed platform; 11A-a central region; 11B-peripheral area; 111-a chute; 1101-via hole; 12-lifting device; 121-a bearing table; 122-lifting drive structure; 1221-supporting bars; 1222-a driver; 13-a mobile platform; 131-a slider; 14-a control device; 15-a driving device; 16-an image acquisition device; 17-bump protection; 100-array drive back plate; 200-a display device; 300-side routing; 20-a pressure-bearing film layer.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.

In view of the foregoing technical problems mentioned in the background art, the inventors have found by analyzing a defective display panel structure that displacement of an edge display device near a side wiring and falling-off of the side wiring are one of the important causes of causing the display panel to be defective.

The inventor further analyzes and finds that the mode of electrically connecting the display device and the array driving backboard can comprise metal Bonding, ACF Bonding and other modes, and no matter which mode is adopted for connecting the display device and the array driving backboard, the Bonding mode is adopted. Referring to fig. 1, fig. 1 illustrates a schematic diagram of the present bonding between a display device 200 located at an edge of an array driving back plate and the array driving back plate 100, and the pressure-bearing film layer 20 converts air pressure into pressure and applies the pressure to the display device 200 to electrically connect the display device 200 and the array driving back plate 100. However, due to the bare leakage of the narrow bezel (the portion between the display device 200 and the side trace at the edge) and the side trace 300, the pressure-bearing film 20 may contact the narrow bezel and the side trace 300, and due to the height difference between the display device 200 and the narrow bezel at the edge, there is a large flatness variation of the pressure-bearing film 20 at the side of the display device 200 near the narrow bezel at the edge. The display device 200 at the edge as shown may be pulled out of position by a non-perpendicular force F1 in the direction of extension of the backing film 20 at point a (the display device 200 is pulled mainly by a horizontal component of force F1 in the X direction). Meanwhile, the side trace 300 may be pulled by the force F2 in a direction other than the perpendicular direction along the extending direction of the pressure-bearing film layer 20 at the B point (the side trace 300 is pulled by the horizontal component force of the force F2 in the X direction), which may cause the displacement of the display device 200 at the edge and the falling of the side trace 300, thereby reducing the manufacturing yield of the display panel.

In order to solve the above technical problems, the inventor innovatively designs the following technical solutions, and the detailed description of the specific implementation of the present application will be described below with reference to the accompanying drawings. It should be noted that the above solutions in the prior art all have drawbacks that the inventors have obtained after they have practiced and studied carefully, and thus the discovery process of the above technical problem and the solutions presented in the following embodiments for the above problem should be all contributions of the inventors to the present application during the inventive process, and should not be construed as what is known to those skilled in the art.

Referring to fig. 2 and 3, fig. 2 illustrates a schematic structural diagram of the bonding system according to the present embodiment, and fig. 3 illustrates a top view of the bonding system according to fig. 2. The present bonding system 1 may be used to perform present bonding of the display device 200 on the array drive back plate 100. In this embodiment, the bonding system 1 may include a fixed platform 11, a lifting device 12 and a moving platform 13, where the fixed platform 11 may include a central area 11A and a peripheral area 11B, and the peripheral area 11B surrounds the central area 11A.

The lifting device 12 may be located at a central region 11A of the fixed platform 11, and the lifting device 12 may include a carrying table 121 and a lifting driving structure 122, the lifting driving structure 122 being used to control the carrying table 121 to move up and down with respect to the fixed platform 11.

The moving platform 13 is slidably disposed in the peripheral region 11B of the fixed platform 11, wherein the moving platform 12 is movable in a direction approaching the central region 11A or a direction moving away from the central region 11A.

In the present embodiment, the lifting driving structure 122 may make the side of the array driving back plate 100 placed on the carrying table 121 away from the fixed platform 11 and the side of the moving platform 13 away from the fixed platform 11 coplanar by controlling the lifting height of the carrying table 121, wherein the lifting driving structure 122 may control the lifting height of the carrying table 121 to be equal to the difference between the thickness of the moving platform 13 and the thickness of the array driving back plate 100.

The moving platform 13 may approach the array driving backplate 100 from the peripheral region 11B and stop moving when the distance from the array driving backplate 100 is a preset distance threshold, wherein the preset distance threshold may be a distance between adjacent pixels formed on the array driving backplate 100 by the display device.

In this embodiment, the lifting device 12 and the moving platform 13 may be controlled in a fully automatic manner, or may be controlled by intervention of an operator in a semi-automatic or manual manner.

Referring to fig. 4, in the above scheme provided by the present embodiment, the pressure-bearing film layer 20 covered on the display device 200 can be distributed flatly at the edge of the array driving back plate 100 during the bonding, so as to weaken the influence of the non-vertical acting force of the pressure-bearing film layer 20 on the display device 200 at the edge, and avoid the displacement of the display device 200 at the edge caused by the non-vertical acting force; in addition, the pressure-bearing film layer 20 does not form a force in a non-vertical direction on the side trace 300, so that the side trace 300 can be prevented from falling off.

Further, referring to fig. 2 again, the fixed platform 11 located in the central area 11A may further be provided with a plurality of through holes 1101, the lifting driving structure 122 may include a supporting rod 1221 correspondingly disposed in each through hole 1101 and a driving member 1222 capable of driving the supporting rod 1221 to extend or retract relative to the fixed platform 11, and the supporting rod 1221 may be fixed to a side of the carrying platform 121 facing the fixed platform 11. Illustratively, the drive member 1222 may drive the movement of the support rod 1221 by way of pneumatic, hydraulic, elastic pressure, or the like.

Further, referring to fig. 5, in this embodiment, the bonding system 1 may further include a control device 14 and a driving device 15 corresponding to the moving platform 13 one by one, where the control device 14 may be electrically connected to the driving device 15, and control the corresponding moving platform 13 to approach or separate from the central area 11A through the driving device 15. The control means may be, for example, computer means, and the driving means may comprise an electric motor and a linkage, by means of which the electric motor may control the moving platform 13 to move closer to or further from the central area 11A. The control device 14 may also be electrically connected to the driving member 1222, and the control device 14 drives the support rod 1221 to extend or retract relative to the fixed platform 11 via the driving member 1222.

Referring to fig. 5 again, the bonding system 1 may further include a plurality of image capturing devices 16, where the plurality of image capturing devices 16 may respectively obtain image information of different moving platforms 13 and the array driving back plate 100 placed on the carrying platform 121. The control means 14 may be electrically connected to the image acquisition device 16 for controlling the movement of the mobile platform 13 in dependence of the distance information. For example, the image acquisition device 16 may employ a charge coupled device (Charge Coupled Device, CCD) camera. In detail, the control device 14 may acquire image information acquired by the image acquisition device 16, process the image information to calculate distances between different mobile platforms 13 and the array driving back plate 100 placed on the carrying platform 121, and calculate a distance that each mobile platform 13 needs to move toward the central area 11A based on the distances, for example, a distance a between a previous mobile platform 13 and the array driving back plate 100 placed on the carrying platform 121, where a preset distance threshold is A0, and calculate a distance that the mobile platform 13 needs to move toward the central area 11A is a-A0. The control device 14 may control the driving device 15 to move the moving platform 13 toward the central area 11A by using an electric signal, and control the moving platform 13 to stop moving when the distance between the moving platform 13 and the array driving back plate 100 is a preset distance threshold.

In this embodiment, the number of the moving platforms 13 and the number of the image capturing devices 16 may be four, and the four moving platforms 13 may be located in four directions around the center area 11A, for example, four directions above, below, left and right of the center area 11A in fig. 3, respectively. The front projections of the four image capturing devices 16 on the fixed platform 11 are located between the front projections of the different movable platforms 13 on the fixed platform 11 and the front projections of the carrying platform 121 on the fixed platform 11, and the image capturing devices 16 are located above the movable platforms 13 and the carrying platform 121. The arrangement is such that images of the moving platform 13 and the carrying platform 121 can be captured from above, facilitating calculation of the distance therebetween based on the images.

Further, referring to fig. 6, fig. 6 illustrates a schematic cross-sectional view along the AA direction in fig. 3, the fixed platform 11 is provided with a sliding groove 111, a sliding member 131 is disposed on a side of the movable platform 13 facing the fixed platform 11, and the sliding member 131 extends into the sliding groove 111 and can slide along the sliding groove 111, wherein the sliding groove 111 extends from an edge of the fixed platform 11 toward the central region 11A. Illustratively, the slider 131 may slide in the chute 111 by a roller, so that friction between the two during sliding may be reduced.

Further, referring to fig. 7, fig. 7 illustrates another structural schematic diagram of the present bonding system, where the bonding system 1 may further include an anti-collision member 17, the anti-collision member 17 may be disposed on a side of the moving platform 13 near the central area 11A, and the anti-collision member 17 may be used to prevent the moving platform 13 from rigidly contacting the array driving back plate 100 placed on the carrying platform 121. Illustratively, the bumper 17 may be an air bag, a balloon, a sponge, or the like.

The present embodiment also provides a bonding method applicable to the bonding system 1, please refer to fig. 8 and fig. 9, fig. 8 illustrates a flow chart of the bonding method, and fig. 9 illustrates a process diagram corresponding to fig. 8. The present bonding method according to this embodiment is described in detail below with reference to fig. 8 and 9.

In step S11, the array driving back plate 100 is placed on the carrier 121.

The display devices 200 are distributed on the array driving back plate 100, and the display devices 200 can be transferred to the array driving back plate 100 through a mass transfer technology. In one possible implementation of the present embodiment, the display device 200 may be transferred onto the array driving backplate 100 before step S11; in another possible implementation of the present embodiment, the display device 200 may be transferred to the array driving back-plate 100 after the array driving back-plate 100 is placed on the carrier 121. Preferably, in the present embodiment, the display device 200 is transferred onto the array driving back plate 100 before step S11.

Step S12, controlling the movement of the moving platform 13 toward the central area 11A, and controlling the moving platform 13 to stop moving when a preset condition is satisfied.

Illustratively, step S12 may be implemented by the following steps.

First, the movement of the moving platform 13 toward the center area 11A is controlled, and image information between the moving platform 13 and the array drive back plate 100 on the stage 121 is acquired.

Next, a first distance between the mobile platform 13 and the array driving back plate 100 on the carrier 121 is calculated based on the image information.

Then, a second distance that the mobile platform 13 needs to move is calculated based on the first distance and a preset distance threshold, and the mobile platform 13 is stopped after the mobile platform 13 is controlled to move the second distance.

In step S13, the elevation driving structure 122 is controlled to move to adjust the height of the carrying platform 121, so that the side of the array driving back plate 100 on the carrying platform 121 far from the fixed platform 11 and the side of the moving platform 13 far from the fixed platform 11 are coplanar.

The lifting driving structure 122 controls the lifting height of the carrying platform 121 to be equal to the difference between the thickness of the moving platform 13 and the thickness of the array driving back plate 100.

In step S14, a pressure-bearing film layer 20 is covered on the display device 200 of the array driving back plate 100, and the display device 200 is subjected to the bonding by applying atmospheric pressure to the pressure-bearing film layer 20.

In the bonding system and the bonding method provided by the embodiment, the lifting driving structure is used for enabling one side of the array driving backboard placed on the bearing platform far away from the fixed platform and one side of the moving platform far away from the fixed platform to be coplanar by controlling the lifting height of the bearing platform, and the moving platform is used for approaching the array driving backboard from the peripheral area, so that the pressure-bearing film layer covered on the display device in the bonding process is distributed flatly at the edge of the array driving backboard, thereby weakening the influence of non-vertical acting force of the pressure-bearing film layer on the display device at the edge and avoiding the displacement of the display device at the edge caused by the non-vertical acting force; in addition, the pressure-bearing film layer can not act on the side wiring in a non-vertical direction, and the side wiring can be prevented from falling off. Therefore, the design can reduce the defects caused by the displacement of the display device at the edge and the falling of the side wiring, and improve the manufacturing yield of the display panel.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. The bonding system is used for bonding the display device on the array driving backboard, and comprises:

2. The present press bonding system according to claim 1, wherein the central region is provided with a plurality of through holes, and the elevation driving structure includes a support bar correspondingly provided in each of the through holes and a driving member for driving the support bar to extend or retract with respect to the fixed platform;

3. The present press bonding system of claim 1, further comprising a control device and a driving device in one-to-one correspondence with the moving platform;

4. The bonding system of claim 3, further comprising a plurality of image acquisition devices, the plurality of image acquisition devices respectively acquiring image information of different mobile platforms and array drive backplanes placed on the carrier;

5. The present compression bonding system of claim 4, wherein the control device is configured to control the moving platform to stop moving when a distance between the moving platform and an array drive back plate placed on the carrier is equal to a preset distance value during movement of the moving platform toward the central region.

6. The present press bonding system of claim 5, wherein the number of mobile platforms is four, the mobile platforms being disposed in four directions around the center area, respectively;

7. The present bonding system of any one of claims 1-6, wherein the fixed platform is provided with a chute, and a side of the mobile platform facing the fixed platform is provided with a slider that extends into and is slidable along the chute, wherein the chute extends from an edge of the fixed platform in a direction toward the central region.

8. The present bonding system of any one of claims 1-6, further comprising an anti-collision member disposed on a side of the moving platform proximate the central region, the anti-collision member configured to prevent the moving platform from rigidly contacting an array drive back plate disposed on the carrier.

9. A present bonding method applied to the present bonding system according to any one of claims 1 to 8, the method comprising:

10. The present bonding method according to claim 9, wherein the step of controlling the movement of the moving platform toward the center region and controlling the moving platform to stop when a preset condition is satisfied comprises:

and calculating a second distance required to be moved by the mobile platform based on the first distance and a preset distance threshold value, and controlling the mobile platform to move the second distance.