CN117754466A - Sand blasting method for backboard - Google Patents
Sand blasting method for backboard Download PDFInfo
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- CN117754466A CN117754466A CN202410158111.9A CN202410158111A CN117754466A CN 117754466 A CN117754466 A CN 117754466A CN 202410158111 A CN202410158111 A CN 202410158111A CN 117754466 A CN117754466 A CN 117754466A
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- backboard
- area
- shielding plate
- blasting
- sandblasted
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- 238000005488 sandblasting Methods 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000000873 masking effect Effects 0.000 claims abstract description 14
- 238000005422 blasting Methods 0.000 claims description 46
- 238000003825 pressing Methods 0.000 claims description 29
- 239000004576 sand Substances 0.000 claims description 18
- 239000010977 jade Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000004484 Briquette Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 238000004544 sputter deposition Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a sand blasting method of a backboard, which comprises the following steps: masking the non-sandblasted area of the backboard, and then sandblasting the sandblasted area; the non-sandblasted area of the backboard is an area of the target to be welded; the sand blasting pressure of the sand blasting treatment is 3-6MPa. According to the invention, the shielding jig is used for shielding the non-sandblasted area of the backboard, and then the sandblasted area is sandblasted, so that reworking scrapping caused by the fact that residual solder cannot be removed when the backboard of a subsequent finished product is processed in the next step is avoided, and the reject ratio of the production of the subsequent backboard is reduced.
Description
Technical Field
The invention belongs to the technical field of backboard processing, and particularly relates to a backboard sand blasting method.
Background
The target material is used as a target material for high-speed charged particle bombardment, and is usually required to be subjected to magnetron sputtering, multi-arc ion plating or other types of coating systems to form sputtering sources of various functional films on a substrate under proper process conditions. The materials can be classified into metal targets, ceramic targets, alloy targets and the like. Currently, various types of sputtered thin film materials are widely used in semiconductor integrated circuits (LSI), optical discs, flat panel displays, surface coatings for workpieces, and the like.
Sputtering is a common process in semiconductor production, and in the process of sputtering, a backing plate is generally used to fix a target for sputtering, i.e., the target is connected to the backing plate by welding, bolting, etc. for fixing. And if the newly purchased backboard is directly used, the solder remains in the non-welding area of the backboard during the subsequent welding. Therefore, sand blasting is required to be performed on the non-welded area of the new backboard, so that foreign matters are prevented from sticking.
Sand blasting is a process of cleaning and roughening the surface of a substrate by the impact of a high-speed sand stream. Compressed air is used as power to form high-speed spray beam to spray the sprayed material (copper ore sand, quartz sand, silicon carbide, iron sand and Hainan sand) onto the surface of workpiece to be treated, so that the surface appearance or shape of the surface of workpiece is changed, and the surface of workpiece is given a certain cleanliness and different roughness due to the impact and cutting action of abrasive on the surface of workpiece, so that the mechanical properties of the surface of workpiece are improved, thus the fatigue resistance of workpiece is improved, the adhesive force between the workpiece and coating is increased, the durability of coating is prolonged, and the leveling and decoration of coating are facilitated.
When the back plate is subjected to sand blasting, sand blasting is only required to be performed on a non-welding area of the back plate, and a part of the back plate does not need to be subjected to sand blasting, namely the part needs to be protected from the influence of sand blasting, so that the back plate cannot be scrapped in the sand blasting process. The protection measures adopted for the non-sandblasted area in the prior art are realized through the sticking of the adhesive tape, but the adhesive tape adopted in the current shielding process can remain on the backboard due to the limitation of the strength of the adhesive tape and the adhesive tape, the adhesive tape can be damaged in the sandblasting process, so that the area of the target to be welded, which does not need sandblasting, is damaged by the sandblasting, and the backboard cannot be used. Therefore, it is necessary to provide a new tool for shielding the back plate by sandblasting, which can ensure that the non-sandblasted area is not damaged during the sandblasting process.
Disclosure of Invention
The invention aims to provide a sand blasting method for a backboard, which adopts a shielding jig to shield a non-sand blasting area of the backboard, then performs sand blasting on the sand blasting area, avoids reworking scrapping caused by the fact that residual solder cannot be removed when a subsequent finished backboard is processed in the next step, and reduces the reject ratio of subsequent backboard production.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
the invention provides a sand blasting method of a backboard, which comprises the following steps:
masking the non-sandblasted area of the backboard, and then sandblasting the sandblasted area;
the non-sandblasted area of the backboard is an area of the target to be welded;
the blasting pressure of the blasting treatment is 3 to 6MPa, and for example, 3.2MPa, 3.5MPa, 3.7MPa, 4MPa, 4.2MPa, 4.5MPa, 4.7MPa, 5MPa, 5.2MPa, 5.5MPa, 5.7MPa, or 5.9MPa may be used, but the blasting pressure is not limited to the values listed, and other values not listed in the numerical range are applicable.
In the invention, if the sand blasting pressure is too small, the non-welding area of the backboard is difficult to obtain the required roughness; if the blasting pressure is too high, the back plate is easily damaged.
The sandblasting method creatively shields the target area to be welded of the backboard, and sandblasting the non-welded area. The non-sandblasted area of the backboard is shielded, so that the area of the backboard to be welded with the target material is prevented from being damaged by sandblasting, foreign matter residues are prevented, and the follow-up operation is prevented from being influenced; and then, carrying out sand blasting treatment on the sand blasting area to form a sand blasting surface, avoiding reworking scrapping caused by the fact that residual solder cannot be removed when the subsequent finished backboard is subjected to next processing (such as sand blasting), and reducing the reject ratio of the subsequent backboard production. The method is simple to operate, high in processing speed, low in cost and wide in application prospect.
As a preferable technical scheme of the invention, the shielding treatment is as follows: and shielding the non-sandblasted area of the backboard by adopting a shielding jig.
As a preferable technical scheme of the invention, the shielding jig comprises a shielding plate, a pressing block and a clamp;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area;
the pressing block is arranged above the shielding plate;
the clamp is used for fixing the shielding plate on the backboard.
According to the invention, the shielding jig is reasonably designed, the shielding plate is utilized to protect the non-sandblasted area, and the clamp and the pressing block are utilized to double-fix the shielding plate, so that the precise fixing of the shielding plate is realized, and the non-sandblasted area of the backboard is ensured not to be damaged in the sandblasting process.
In a preferred embodiment of the present invention, the shielding plate is made of aluminum.
In the invention, the shielding plate can be provided with parts such as a handle and the like which are convenient to use as required.
The thickness of the shielding plate is preferably 0.8 to 1.5cm, and may be, for example, 0.85cm, 0.9cm, 0.95cm, 1cm, 1.05cm, 1.1cm, 1.15cm, 1.2cm, 1.25cm, 1.3cm, 1.35cm, 1.4cm, or 1.45cm, etc., but not limited to the values recited, and other values not recited in the numerical range are equally applicable.
As a preferred technical solution of the present invention, the clamp includes a C-type clamp.
Preferably, grooves matched with the clamp are formed in two ends of the shielding plate.
Preferably, the depth of the groove is 0.2-0.5cm, for example, 0.25cm, 0.3cm, 0.35cm, 0.4cm, 0.45cm or 0.48cm, etc., but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
According to the invention, the grooves matched with the clamps are formed at the two ends of the shielding plate, so that the shielding plate is more firmly fixed on the backboard, and the non-sandblasted area is accurately protected in the sandblasting process.
In a preferred embodiment of the present invention, the number of the pressing pieces is at least 2, for example, 2, 3, 4, or 5, but the pressing pieces are not limited to the listed values, and other non-listed values in the numerical range are equally applicable.
Preferably, the total weight of the briquette is 50-100kg, for example, 55kg, 60kg, 65kg, 70kg, 75kg, 80kg, 85kg, 90kg or 95kg, etc., but not limited to the recited values, and other non-recited values within the numerical range are equally applicable.
According to the invention, the shielding plate is fixed by at least arranging 2 pressing blocks, so that the position of the shielding plate can be fixed relatively in the sand blasting process, and the damage to the non-sand blasting area of the backboard is avoided.
In a preferred embodiment of the present invention, the sand particles used in the blasting treatment have a particle size of 40 to 60 mesh, for example, 42 mesh, 44 mesh, 46 mesh, 48 mesh, 50 mesh, 52 mesh, 54 mesh, 56 mesh or 58 mesh, but the present invention is not limited to the above-mentioned values, and other non-mentioned values in the numerical range are applicable.
Preferably, the sand particles used for the sand blasting treatment include white jade steel.
In a preferred embodiment of the present invention, the blasting treatment may be performed at a temperature of 30℃or less, for example, 29℃or 28℃or 27℃or 25℃or 24℃or 23℃or 22℃or 20℃but is not limited to the values listed, and other values not listed in the numerical range are similarly applicable.
The blasting is preferably performed with a humidity of 15% to 50%, for example, 20%, 25%, 30%, 35%, 40%, 45% or 48%, but the present invention is not limited to the above-mentioned values, and other values not shown in the numerical range are equally applicable.
Preferably, the time of the sand blasting is 10-20min, for example, 11min, 12min, 13min, 14min, 15min, 16min, 17min, 18min or 19min, but not limited to the recited values, and other non-recited values in the range of values are equally applicable.
In a preferred embodiment of the present invention, the roughness of the sandblasted region after the sandblasting treatment is 5 to 10 μm, for example, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm or 9.5 μm, etc., but not limited to the above-mentioned values, and other values not listed in the numerical range are applicable.
The roughness of the sandblasted area of the backboard is limited to 5-10 mu m, so that the solder residue in the non-welded area of the backboard is prevented from being difficult to remove during subsequent treatment.
As a preferred technical solution of the present invention, the blasting method includes:
masking the non-sandblasted area of the backboard by using a masking jig, and then sandblasting the sandblasted area;
the non-sandblasted area of the backboard is an area of the target to be welded;
the shielding jig comprises a shielding plate, a pressing block and a clamp;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area; the thickness of the shielding plate is 0.8-1.5cm;
grooves matched with the clamp are formed in two ends of the shielding plate; the depth of the groove is 0.2-0.5cm;
the pressing block is arranged above the shielding plate; the pressing blocks at least comprise 2; the total weight of the pressing block is 50-100kg;
the clamp is used for fixing the shielding plate on the backboard; the clamp comprises a C-shaped clamp;
the grain size of sand grains used in the sand blasting treatment is 40-60 meshes, and the sand grains comprise white jade steel;
the temperature of the sand blasting treatment is less than or equal to 30 ℃, the humidity is 15-50%, the sand blasting pressure is 3-6MPa, and the time is 10-20min;
after the sand blasting treatment, the roughness of the sand blasting area is 5-10 mu m.
Compared with the prior art, the invention has the following beneficial effects:
the sand blasting method creatively shields the area of the target material to be welded of the backboard, and performs sand blasting on the non-welded area. The non-sandblasted area of the backboard is shielded, so that the area of the backboard to be welded with the target material is prevented from being sandblasted during sandblasting, foreign matter residues are prevented, and subsequent operation is prevented from being influenced; and then, carrying out sand blasting treatment on the sand blasting area to form a sand blasting surface, avoiding reworking scrapping caused by the fact that residual solder cannot be removed when the subsequent finished backboard is subjected to sand blasting, and reducing the reject ratio of the subsequent backboard production. The method is simple to operate, high in processing speed, low in cost and wide in application prospect.
Drawings
Fig. 1 is a schematic view of back plate area division provided in embodiment 1;
wherein, 1-non-sandblasted area, 2-sandblasted area;
fig. 2 is a schematic structural diagram of a shielding jig according to embodiment 1;
wherein, 3-shielding plate, 4-briquetting, 5-anchor clamps, 6-recess, 7-processing platform.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
Example 1
The embodiment provides a sand blasting method for a backboard, which comprises the following steps:
masking the non-sandblasted area 1 (shown in fig. 1) of the backboard by using a masking jig, and then sandblasting the sandblasted area 2 (shown in fig. 1); the non-sandblasted area 1 of the backboard is an area of a target to be welded;
the shielding jig (shown in fig. 2) comprises a shielding plate 3, a pressing block 4 and a clamp 5;
the shape and the size of the shielding plate 3 are the same as those of the non-sandblasted area 1 of the backboard, and the shielding plate is arranged above the non-sandblasted area 1; the thickness of the shielding plate 3 is 1.1cm;
grooves 6 matched with the clamp are formed in two ends of the shielding plate 3; the depth of the groove 6 is 0.3cm;
the pressing block 4 is arranged above the shielding plate 3; the number of the pressing blocks 4 is 3; the weight of each pressing block 4 is 30kg;
the clamp 5 is used for fixing the shielding plate 3 on the backboard; the clamp 5 is a C-shaped clamp;
the grain size of sand used in the sand blasting treatment is 50 meshes, and the sand used comprises white jade;
the temperature of the sand blasting treatment is 25 ℃, the humidity is 40%, the sand blasting pressure is 4.5MPa, and the time is 15min.
In this embodiment, the back plate is treated by the above-mentioned blasting method, and the resulting non-blasted area of the back plate is not damaged, and the roughness of the blasted area is 7 μm. When the backboard is processed in the next step, the sputtering area of the backboard is not required to be shielded, and the problems of reworking rejection and the like caused by the fact that residual solder cannot be removed in the next processing of the backboard are solved.
Example 2
The embodiment provides a sand blasting method for a backboard, which comprises the following steps:
masking the non-sandblasted area of the backboard by using a masking jig, and then sandblasting the sandblasted area; the non-sandblasted area of the backboard is an area of the target to be welded;
the shielding jig comprises a shielding plate, a pressing block and a clamp;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area; the thickness of the shielding plate is 0.8cm;
grooves matched with the clamp are formed in two ends of the shielding plate; the depth of the groove is 0.4cm;
the pressing block is arranged above the shielding plate; the number of the pressing blocks is 4; the weight of each pressing block is 20kg;
the clamp is used for fixing the shielding plate on the backboard; the clamp is a C-shaped clamp;
the grain size of sand used in the sand blasting treatment is 50 meshes, and the sand used comprises white jade;
the temperature of the sand blasting treatment is 20 ℃, the humidity is 20%, the sand blasting pressure is 3MPa, and the time is 20min.
In this embodiment, the back plate is treated by the above-mentioned blasting method, and the resulting non-blasted area of the back plate is not damaged, and the roughness of the blasted area is 6 μm. When the backboard is processed in the next step, the sputtering area of the backboard is not required to be shielded, and the problems of reworking rejection and the like caused by the fact that residual solder cannot be removed in the next processing of the backboard are solved.
Example 3
The embodiment provides a sand blasting method for a backboard, which comprises the following steps:
masking the non-sandblasted area of the backboard by using a masking jig, and then sandblasting the sandblasted area; the non-sandblasted area of the backboard is an area of the target to be welded;
the shielding jig comprises a shielding plate, a pressing block and a clamp;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area; the thickness of the shielding plate is 1.5cm;
grooves matched with the clamp are formed in two ends of the shielding plate; the depth of the groove is 0.5cm;
the pressing block is arranged above the shielding plate; the number of the pressing blocks is 2; the weight of each pressing block is 30kg;
the clamp is used for fixing the shielding plate on the backboard; the clamp is a C-shaped clamp;
the grain size of sand used in the sand blasting treatment is 60 meshes, and the sand used comprises white jade;
the temperature of the sand blasting treatment is 10 ℃, the humidity is 45%, the sand blasting pressure is 6MPa, and the time is 10min.
In this embodiment, the back plate is treated by the above-mentioned blasting method, and the resulting non-blasted area of the back plate is not damaged, and the roughness of the blasted area is 8 μm. When the backboard is processed in the next step, the sputtering area of the backboard is not required to be shielded, and the problems of reworking rejection and the like caused by the fact that residual solder cannot be removed in the next processing of the backboard are solved.
Example 4
This example provides a method of blasting a back plate, and the conditions were the same as in example 1 except that the weight of each of the compacts was 10 kg.
In this embodiment, the total weight of the pressing block is light, so that the position of the shielding plate cannot be fixed and not moved relatively in the sand blasting process, and the non-sand blasting area of the backboard is damaged.
Example 5
The present embodiment provides a method for blasting a back plate, and the conditions are the same as those of embodiment 1 except that the shielding jig does not include a jig.
In this embodiment, since no fixture is provided, the position of the shielding plate cannot be fixed and fixed in the sandblasting process, so that the non-sandblasted area of the backboard is damaged.
Example 6
This example provides a method of blasting a back plate, and the conditions are the same as those of example 1 except that the temperature of the blasting treatment is 40 ℃.
In this embodiment, when the temperature of the sandblasting is higher, the back plate and the shielding jig are deformed, and the shielding areas are not matched, so that the sandblasting of the sandblasted area of the back plate is uneven and insufficient, and the solder residue in the subsequent processing of the back plate cannot be effectively removed.
Example 7
The present example provided a method of blasting a back plate, and the conditions were the same as those of example 1, except that the blasting time was 5min.
In this embodiment, when the time of the sandblasting is short, the sandblasting area is not sandblasted uniformly, which results in uneven roughness of the sandblasted surface of the back plate, and the solder residue in the subsequent processing of the back plate cannot be removed effectively.
Example 8
The present example provided a method of blasting a back plate, and the conditions were the same as those of example 1, except that the blasting time was 30 min.
In this embodiment, when the time of the blasting is long, the blasting surface is less affected, but a lot of blasting sand is wasted, and the shielding jig is damaged in an ineffective manner.
Comparative example 1
This comparative example provides a blasting method for a back plate, and the conditions are the same as those of example 1 except that the blasting pressure of the blasting treatment is 1 MPa.
In this comparative example, when the blasting pressure of the blasting treatment is small, it is difficult to obtain the desired roughness of the blasted area of the back plate, the roughness is only 2 μm, and the roughness required for the next step is not achieved, so that the solder residue in the subsequent processing of the back plate cannot be effectively removed.
Comparative example 2
This comparative example provides a blasting method for a back plate, and the conditions were the same as those of example 1 except that the blasting pressure of the blasting treatment was 8 MPa.
In this comparative example, when the blasting pressure of the blasting treatment is large, the back plate is easily damaged, resulting in scrapping of the product.
The applicant states that the detailed structural features of the present invention are described by the above embodiments, but the present invention is not limited to the above detailed structural features, i.e. it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be apparent to those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope of the present invention and the scope of the disclosure.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the scope of the technical concept of the present invention, and all the simple modifications belong to the protection scope of the present invention.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the invention can be made without departing from the spirit of the invention, which should also be considered as disclosed herein.
Claims (10)
1. A blasting method of a back plate, characterized by comprising:
masking the non-sandblasted area of the backboard, and then sandblasting the sandblasted area;
the non-sandblasted area of the backboard is an area of the target to be welded;
the sand blasting pressure of the sand blasting treatment is 3-6MPa.
2. A blasting method according to claim 1, wherein the masking treatment is: and shielding the non-sandblasted area of the backboard by adopting a shielding jig.
3. The blasting method according to claim 2, wherein the shielding jig comprises a shielding plate, a pressing block, and a jig;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area;
the pressing block is arranged above the shielding plate;
the clamp is used for fixing the shielding plate on the backboard.
4. A blasting method according to claim 3, wherein the material of the shielding plate comprises aluminum;
preferably, the thickness of the shielding plate is 0.8-1.5cm.
5. A blasting method according to claim 3 or 4, wherein the jig comprises a C-shaped jig;
preferably, grooves matched with the clamp are formed in two ends of the shielding plate;
preferably, the depth of the groove is 0.2-0.5cm.
6. A blasting method according to any of claims 3 to 5 wherein the compacts comprise at least 2;
preferably, the total weight of the briquette is 50-100kg.
7. A blasting method according to any one of claims 1 to 6, wherein the grit size of the grit used in the blasting is 40 to 60 mesh;
preferably, the sand particles used for the sand blasting treatment include white jade steel.
8. A blasting method according to any one of claims 1 to 7, wherein the blasting treatment is carried out at a temperature of 30 ℃ or less;
preferably, the humidity of the sand blasting treatment is 15% -50%;
preferably, the time of the sand blasting is 10-20min.
9. A blasting method according to any of claims 1 to 8, wherein the roughness of the blasted area after the blasting is 5 to 10 μm.
10. A blasting method according to any of claims 1 to 9, wherein the blasting method comprises:
masking the non-sandblasted area of the backboard by using a masking jig, and then sandblasting the sandblasted area;
the shielding jig comprises a shielding plate, a pressing block and a clamp;
the shape and the size of the shielding plate are the same as those of the non-sandblasted area of the backboard, and the shielding plate is arranged above the non-sandblasted area; the thickness of the shielding plate is 0.8-1.5cm;
grooves matched with the clamp are formed in two ends of the shielding plate; the depth of the groove is 0.2-0.5cm;
the pressing block is arranged above the shielding plate; the pressing blocks at least comprise 2; the total weight of the pressing block is 50-100kg;
the clamp is used for fixing the shielding plate on the backboard; the clamp comprises a C-shaped clamp;
the grain size of sand grains used in the sand blasting treatment is 40-60 meshes, and the sand grains comprise white jade steel;
the temperature of the sand blasting treatment is less than or equal to 30 ℃, the humidity is 15-50%, the sand blasting pressure is 3-6MPa, and the time is 10-20min;
after the sand blasting treatment, the roughness of the sand blasting area is 5-10 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410158111.9A CN117754466A (en) | 2024-02-04 | 2024-02-04 | Sand blasting method for backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410158111.9A CN117754466A (en) | 2024-02-04 | 2024-02-04 | Sand blasting method for backboard |
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| Publication Number | Publication Date |
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| CN117754466A true CN117754466A (en) | 2024-03-26 |
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| CN202410158111.9A Pending CN117754466A (en) | 2024-02-04 | 2024-02-04 | Sand blasting method for backboard |
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| Country | Link |
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| CN (1) | CN117754466A (en) |
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2024
- 2024-02-04 CN CN202410158111.9A patent/CN117754466A/en active Pending
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