CN117747736A - LED display panel and preparation method and maintenance method thereof - Google Patents
LED display panel and preparation method and maintenance method thereof Download PDFInfo
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- CN117747736A CN117747736A CN202311870039.4A CN202311870039A CN117747736A CN 117747736 A CN117747736 A CN 117747736A CN 202311870039 A CN202311870039 A CN 202311870039A CN 117747736 A CN117747736 A CN 117747736A
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Abstract
The invention relates to the technical field of LED display, solves the defects of low consistency and high cost of the surface of a packaging layer of the conventional LED display panel, and provides an LED display panel, a preparation method and a maintenance method thereof. The LED display panel includes: a plurality of LED chips; a circuit board having at least one mounting surface provided with an LED chip; an encapsulation layer disposed on the mounting surface and covering the LED chip; a smooth surface layer arranged on the outer surface of the packaging layer; and the thermosetting anti-dazzle coating is arranged on the surface layer of the gloss surface. The LED display panel, the preparation method and the maintenance method thereof have the advantages that the LED display panel can ensure high consistency of the surface of the packaging layer and reduce cost.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to an LED display panel, a preparation method and a maintenance method thereof.
Background
An LED display (LED display) is a flat panel display, which is a device for displaying various information such as text, images, and video, and is composed of individual LED display panels. The LED display screen integrates microelectronic technology, computer technology and information processing, and has the advantages of bright color, wide dynamic range, high brightness, long service life, stable and reliable operation and the like. The LED display screen is widely applied to commercial media, cultural performance markets, stadiums, information dissemination, news release, securities trade and the like, and can meet the requirements of different environments.
For the packaging technical field of the existing LED display panel, the COB (Chip On Board) packaging technology has the advantages of high brightness, high protection, high-efficiency heat dissipation and the like.
For the packaging technology, an epoxy resin packaging material is mainly used as a packaging layer at present, the epoxy resin has the advantages of high hardness (Shore hardness D > 80), multiple types of curing agents, maturity, low price and the like, in the epoxy resin molding process, a patterned release film needs to be arranged on the surface of the epoxy resin, and the patterns of the patterned release film are transferred to the surface of the epoxy resin through hot press molding of a molding press, however, the stamping of the patterned release film is easily influenced by various aspects such as pressure, pattern consistency of the patterned release film and the like, and the complete consistency is difficult to achieve, so that the consistency of the surface of the packaging layer is not high enough, and the cost of the patterned release film is high, so that the cost of an LED display panel and an LED display screen provided with the LED display panel is improved. In addition, as the LED display panel and the LED display screen are difficult to avoid maintenance conditions so as to prolong the service time and save the use cost, patterns cannot be restored by re-imprinting in the maintenance area of the LED display panel during maintenance, so that the surface structure of the maintenance area is relatively abrupt, the light-emitting effect of the maintenance area is greatly different from that of the area outside the maintenance area, the light-emitting uniformity is adversely affected, and the quality of the maintained LED display panel is seriously reduced.
Therefore, it is desirable to provide an LED display panel, a method for manufacturing the same, and a method for repairing the same, which can ensure high uniformity of the surface of the encapsulation layer and reduce the cost.
Disclosure of Invention
The invention aims at the defects of low consistency and higher cost of the surface of the packaging layer of the prior LED display panel in the prior art, and provides an LED display panel for realizing the purpose of the invention, which comprises the following components: a plurality of LED chips; a circuit board having at least one mounting surface provided with an LED chip; an encapsulation layer disposed on the mounting surface and covering the LED chip; a smooth surface layer arranged on the outer surface of the packaging layer; and the thermosetting anti-dazzle coating is arranged on the surface layer of the gloss surface.
Further, the material of the packaging layer is epoxy resin, the material of the thermosetting anti-dazzle coating is AG anti-dazzle liquid medicine, and the AG anti-dazzle liquid medicine comprises the following components in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts.
Further, the thermosetting antiglare coating is set to: basis weight: 80-120 g/m 2 Thickness of: 5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent.
In order to achieve another object of the present invention, there is provided a method for manufacturing an LED display panel, which is applied to any one of the above LED display panels, comprising the steps of: s11: providing a circuit board with a plurality of LED chips arranged on at least one mounting surface; s12: molding an encapsulation layer on the mounting surface to cover the LED chip; s13: molding the packaging layer by adopting a smooth release film to obtain a smooth surface layer, and heating and curing the smooth surface layer; s14: heating the surface layer of the light surface for the first time, and then carrying out plasma treatment; s15: coating a thermosetting anti-dazzle coating on the surface layer of the gloss surface; s16: and performing second heating on the thermosetting anti-dazzle coating.
Further, the first heating in the step S14 comprises preheating the surface layer of the light surface at 50-100 ℃ for 1-4 hours.
Further, the second heating in the step S16 comprises heating the thermosetting anti-glare coating at 160-180 ℃ for 20-30 min.
In order to achieve still another object of the present invention, there is provided a maintenance method of an LED display panel, applied to any one of the above LED display panels, in which at least one failed LED chip that cannot normally operate exists among a plurality of LED chips, the maintenance method comprising: s21: digging holes on the positions of the fault LED chips to obtain holes, taking out the exposed fault LED chips and replacing and installing new LED chips; s22: filling the packaging layer in the open hole, and curing the packaging layer; s23: polishing the adjacent areas of the openings to remove the thermosetting anti-glare coating thereon, and polishing the encapsulation layer to level the encapsulation layer so that the encapsulation layer is flush with the surfaces of the adjacent areas from which the thermosetting anti-glare coating has been removed; s24: performing plasma treatment on the packaging layer and the adjacent area from which the thermosetting anti-dazzle coating is removed; s25: coating a thermosetting anti-glare coating on the encapsulation layer and the adjacent area which are subjected to plasma treatment; s26: and heating and curing the thermosetting anti-dazzle coating.
Further, the curing treatment in the step S22 comprises the steps of baking and dehumidifying and preheating for 1 to 4 hours at the temperature of 50 to 100 ℃; the heating and curing in the step S26 comprises heating at 160-180 ℃ for 20-30 min.
Further, the packaging layer in the step S22 is an epoxy resin layer, the thermosetting anti-dazzle coating in the step S25 is AG anti-dazzle liquid medicine, and the AG anti-dazzle liquid medicine comprises the following components in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts.
Further, in the step S21, a laser drilling mode is adopted to drill holes, the adjacent areas are set to be round areas which take the fault LED chip as the center and have the radius of 0.5-2 mm, a spraying mode is adopted to coat the thermosetting anti-dazzle coating, and the spraying of the thermosetting anti-dazzle coating is controlled to meet the following conditions: basis weight: 80-120 g/m 2 Thickness of:5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent.
The beneficial effects of the invention are as follows:
according to the LED display panel, the preparation method and the maintenance method thereof, the smooth surface layer and the thermosetting anti-dazzle coating are arranged on the outer surface of the packaging layer on the LED display panel, so that the surface layer with high consistency can be obtained on the surface of the packaging layer, the cost is reduced, and the maintenance area of the LED display panel does not need to be stamped with the recovery pattern again even if the LED display panel is required to be replaced with a fault LED chip later, so that the LED display panel can be ensured to have high quality even after maintenance.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described, and it is within the scope of the present invention to obtain other drawings according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic layer structure of an LED display panel according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a method for manufacturing an LED display panel according to an embodiment of the present invention;
fig. 3 is a flow chart of a method for repairing an LED display panel according to an embodiment of the present invention;
reference numerals illustrate:
1-a circuit board; 2-an encapsulation layer; 3-thermosetting antiglare coating.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element limited by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. If not conflicting, the embodiments of the present invention and the features of the embodiments may be combined with each other, which are all within the protection scope of the present invention.
Referring to fig. 1, as an object of the present invention, there is provided an LED display panel, where the LED display panel is preferably a Micro-LED display panel or a Mini-LED display panel. The LED display panel includes a plurality of LED chips, a circuit board 1, a package layer 2, a smooth surface layer, and a thermosetting anti-glare coating 3, wherein the LED chips are disposed on at least one mounting surface of the circuit board 1, the package layer 2 is disposed on the mounting surface and covers the LED chips, the smooth surface layer is disposed on an outer surface of the package layer 2, that is, a surface facing away from and opposite to the LED chips, the smooth surface layer is obtained by molding the package layer 2 using a smooth release film (refer to the following description of a preparation method of the LED display panel). Preferably, in order to make the bonding of the encapsulation layer 2 and the circuit board 1 and the bonding of the thermosetting antiglare coating 3 and the glossy surface layer meet bonding requirements, specifically, the surface water drop angle is reduced by plasma treatment, so that wettability is improved. In addition, as shown in fig. 1, the surface of the thermosetting antiglare coating 3 preferably has a regular partial top spherical surface, and thus the thermosetting antiglare coating 3 can change the light direction of the LED chip by, for example, diffuse reflection, thereby exerting an antiglare effect. In this way, the smooth surface layer and the thermosetting anti-dazzle coating 3 are arranged on the outer surface of the packaging layer 2, so that various adverse effects of pressure and poor pattern consistency of the patterned release film in the prior art are avoided, a surface layer with high consistency can be obtained on the surface of the packaging layer 2, and the cost is lower compared with that of the patterned release film. In addition, for the possible maintenance of the subsequent LED display panel, the maintenance area is not required to be subjected to re-embossing to recover the patterns, so that the LED display panel can be ensured to have high quality even after maintenance.
Specifically, the material of the encapsulation layer 2 is epoxy resin, which has high hardness (shore D hardness)>80 Many types of curing agents, maturity, low price and the like. The thermosetting anti-dazzle coating 3 is made of AG anti-dazzle liquid medicine, and the AG anti-dazzle liquid medicine comprises the following components in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts. Referring to table 1 below, the AG anti-glare lotion has low glossiness, can reduce specular reflection on the surface of the encapsulation layer 2, and has strong adhesion to the encapsulation layer 2, thereby having strong scratch resistance. Moreover, the thermosetting anti-dazzle coating 3 can obtain AG textures from AG anti-dazzle liquid medicine, and the AG textures can realize diffuse reflection of light, so that the anti-dazzle effect is achieved.
Further specifically, according to repeated experimental tests of the applicant, it is determined that the relevant parameters of the thermosetting anti-glare coating 3 made of AG anti-glare liquid medicine are set to the following specific numerical ranges: basis weight: 80-120 g/m 2 Thickness of: 5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent. And referring to the following table 1, when the thermosetting anti-glare coating 3 satisfies the specific numerical range of the above parameters, the LED display panel does not exhibit flash point bloom, and can satisfy the shipment quality requirement.
As another object of the present invention, referring to fig. 2 in combination, the present invention further provides a method for manufacturing an LED display panel, where the manufacturing method described below is applied to the above embodiments of the LED display panel under the situation of no conflict, and the repeated descriptions are omitted herein. The preparation method comprises the following steps:
s11: providing a circuit board 1, at least one mounting surface of which is provided with a plurality of LED chips, wherein the circuit board 1 and the LED chips thereon can be prepared by an SMT process;
s12: molding the encapsulation layer 2, for example, using epoxy resin, on the mounting surface to cover the LED chip, wherein the molding refers to that the encapsulation layer 2 is directly coated with adhesive by lamination;
s13: molding the packaging layer 2 by adopting a smooth release film to obtain a smooth surface layer, and carrying out heating curing on the smooth surface layer, wherein the heating curing can be specifically carried out by pre-curing for 3min at 110 ℃ and post-curing for 4h at 150 ℃, and in addition, corresponding matching adjustment is carried out according to different models of the packaging layer 2, such as epoxy resin adopted;
s14: the first heating is carried out on the surface layer of the light surface, and then the plasma treatment is carried out, so that the surface groups of the surface layer of the light surface can be fully activated;
s15: a thermosetting anti-dazzle coating 3, for example AG anti-dazzle liquid medicine, is coated on the surface layer of the gloss surface;
s16: the thermosetting antiglare coating 3 is subjected to a second heating.
The LED display panel can be obtained by the preparation method of the LED display panel, so that the LED display panel directly obtained by the preparation method also has the beneficial technical effects. In addition, the preparation method has the advantages of strong operability and compact step flow.
Preferably, the first heating in the step S14 includes baking the smooth surface layer at 50-100 ℃ for 1-4 hours, so that the purpose of dehumidification is achieved by baking the smooth surface layer, and the dehumidification can remove water vapor so as to be beneficial to the reliable combination of the smooth surface layer and the thermosetting anti-glare coating.
Preferably, the second heating in step S16 comprises applying a heat-curable antiglare agentThe coating 3 is heated for 20 to 30 minutes at 160 to 180 ℃, so that the aim of ensuring the thermosetting anti-dazzle coating 3 to have better consistency can be achieved. Referring to table 1 below, in experimental tests divided into 7 times, the numerical ranges set for the relevant parameters of the thermosetting antiglare coating 3 using AG antiglare lotion were combined as described above: basis weight: 80-120 g/m 2 Thickness of: 5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent. In test No. 1, since the coating amount thereof was 60g/m 2 I.e. less than 80g/m 2 The glossiness of the product is 20.5, namely more than 10%, so that the product does not meet the shipment requirement. In test number 2, the curing temperature is 130 ℃, namely not within 160-180 ℃, the adhesive force is 2B, and the requirement of 5B or more of qualified adhesive force is not met, so that the shipment requirement is not met. In test number 3, the cure time was 15min, i.e., below the 20-30 min lower limit, its 60 ° gloss was 10.1%, i.e., exceeded 10%, and its adhesion was 3B, failing to meet acceptable adhesion: 5B or more, thereby not meeting shipment requirements. In test number 6, the curing temperature was 150 ℃, i.e., not within 160-180 ℃, and the 60 ° gloss was 11.2, i.e., exceeded 10%, thus failing to meet shipment requirements. In test No. 7, since the coating amount thereof was 150g/m 2 I.e. greater than 120g/m 2 And the curing temperature is 150 ℃ and is not within 160-180 ℃, so that the thickness is 8 mu m and is not within 5-7 mu m, thereby not meeting the shipment requirement. Under the condition that the requirement of shipment quality cannot be met in the various tests, obvious flash point and bloom can occur to the LED display panel. In the test numbers 4 and 5 in table 1, the coating amount, curing temperature and thickness all satisfy the above-set numerical ranges, and thus the shipment requirements can be satisfied. In addition, for test number 5, the curing time was 50min, i.e., higher than the upper limit of 20 to 30min, but it satisfied the curing effect, but the curing efficiency was low, and therefore, the curing time was as described above: the time range of 20 to 30min is a preferable time range and cannot be lower than the lower limit of 20min, but the time period of more than 30min only affects the curing efficiency but does not affect the curing effect.
In view of the above, in order to ensure high quality of the thermosetting antiglare coating 3 using AG antiglare agent materials, the following preparation conditions are required: coating amount: 80-120 g/m 2 Curing temperature: 160-180 ℃ and curing time: 20-30 min, thickness: 5-7 μm.
Table 1: comparison table for different test conditions of thermosetting anti-dazzle coating
As a further object of the present invention, referring to fig. 3 in combination, the present invention also provides a method for repairing an LED display panel, and in case of no conflict, the method for repairing the LED display panel described below is applied to the LED display panel of each of the above embodiments of the LED display panel and the LED display panel prepared by the above embodiments of the preparation method, and the repetition is not repeated herein. Since it is difficult for the LED display panel to avoid the situation that maintenance is required due to the occurrence of a failed LED chip, when at least one failed LED chip that cannot normally operate exists among the plurality of LED chips, the maintenance method includes the steps of:
s21: digging holes on the positions of the fault LED chips to obtain holes, taking out the exposed fault LED chips and replacing and installing new LED chips;
specifically, the original packaging layer 2 and the original thermosetting anti-dazzle coating 3 which are covered on the packaging failure LED chip are excavated to obtain an opening, the specific opening range is the corresponding point spacing size of the external expansion of the position to be maintained, for example, if the point spacing is P1.2, the opening range is expanded by 1.2mm, namely the external hole diameter value is 2.4mm, and thus, the opening range cannot influence the adjacent normal LED chip.
In addition, in the case that if a plurality of adjacent LED chips fail and a plurality of failed LED chips occupying a large area need to be maintained, the original encapsulation layer 2 and the original thermosetting antiglare coating 3 which are sent to the corresponding areas above the plurality of failed LED chips are firstly removed by sulfuric acid, the large area can be set into a circular hole shape by referring to the above and is expanded by one point distance, then after rinsing by clear water, the residual encapsulation layer 2 and the thermosetting antiglare coating 3 are removed by laser finishing, and finally, the exposed plurality of failed LED chips are taken out and a plurality of new LED chips are replaced and installed. In this way, the maintenance efficiency and the maintenance quality for the plurality of failed LED chips can be improved, and the thermosetting antiglare coating 3 with better consistency can be obtained on the outer surfaces of the open pore areas and the adjacent areas of the plurality of failed LED chips after the subsequent steps are implemented.
S22: filling the opening with the encapsulation layer 2, and curing the encapsulation layer 2, wherein the newly filled encapsulation layer 2 is heated as a new encapsulation layer to be cured like the original encapsulation layer, and the following encapsulation layers are understood as the new encapsulation layer;
s23: polishing the adjacent areas of the openings to remove the thermosetting anti-glare coating 3 thereon, polishing the encapsulation layer 2 to be flat, namely polishing the redundant parts of the encapsulation layer 2, especially the parts higher than the surfaces of the adjacent areas, to remove the redundant parts of the encapsulation layer 2, so that the encapsulation layer 2 is flush with the surfaces of the adjacent areas from which the thermosetting anti-glare coating 3 is removed;
s24: plasma treating the encapsulation layer 2 and the adjacent region from which the thermosetting antiglare coating 3 has been removed, so that the surface groups of the encapsulation layer 2 and the adjacent region can be sufficiently activated;
s25: the packaging layer 2 which is subjected to plasma treatment and the adjacent area are coated with the thermosetting anti-dazzle coating 3, and the thermosetting anti-dazzle coating 3 can play a role in diffuse reflection of light, so that an anti-dazzle effect is achieved;
s26: the thermosetting anti-dazzle coating 3 is heated and cured, so that the purpose of ensuring the thermosetting anti-dazzle coating 3 to be better in consistency is achieved.
In summary, the maintenance method of the LED display panel of the present invention adopts the hole digging mode to replace the failed LED chip with the new LED chip and refill the encapsulation layer 2 for encapsulating the new LED chip, and adopts the polishing mode to polish the encapsulation layer 2 and the thermosetting anti-glare coating 3 in the adjacent area, because the LED chip is in micron level, only the very small size of the failed LED chip is required to be hole-dug and then the encapsulation layer 2 and the adjacent area are filled, and then the encapsulation layer 2 and the adjacent area are polished, on the basis of not adopting the smooth surface release film, the encapsulation layer 2 and the adjacent area thereof can obtain the smooth surface layer and coat the thermosetting anti-glare coating 3 thereon, not only the maintenance time is saved, but also the encapsulation layer 2 and the adjacent area thereof only need to coat the thermosetting anti-glare coating 3 without setting the thermosetting anti-glare coating 3 in the prior art, the obtained pattern is not required to maintain the pattern consistency, the surface structure consistency of the encapsulation layer 2 is high, the condition of relative is not relatively abrupt, the appearance difference is basically not existed in the maintenance area on the LED display panel, the two light-emitting effects are not different, the quality after the maintenance is ensured, and the LED display panel is still high, and the maintenance time is still saved.
Preferably, the curing treatment in the step S22 comprises baking and dehumidifying and preheating for 1-4 hours at 50-100 ℃; thus, the purpose of baking and dehumidifying the encapsulation layer 2 can be achieved. The heat curing in the step S26 comprises heating at 130-170 ℃ for 10-30 min. Therefore, the purpose of making the thermosetting antiglare coating 3 better in uniformity can be achieved.
Specifically, as described above, the encapsulating layer 2 in step S22 is an epoxy resin layer, and the material of the thermosetting anti-glare coating 3 in step S25 is AG anti-glare liquid medicine, where the AG anti-glare liquid medicine includes, in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts. Referring to table 1 above, by coating the thermosetting anti-glare coating 3 made of AG anti-glare liquid medicine on the newly filled encapsulation layer 2, all the thermosetting anti-glare coatings 3 of the LED display panel are kept uniform, and the same diffuse reflectance to light is achieved, thereby achieving a good anti-glare effect.
Preferably, in the step S21, the hole is drilled by laser drilling, and since the LED chip is in the micrometer scale, the packaging layer 2 above the failed LED chip is precisely drilled by laser drilling with enough precision, and the laser drilling can form a round hole-shaped opening, the opening shape is regular, thereby facilitating the taking and placing of the failed LED chip and the new LED chip and the filling of the packaging layer2. The adjacent areas are round areas with the fault LED chips as circle centers and the radius of 0.5-2 mm, and for the micron-level LED chips, compared with the round areas with the radius of millimeter level, the volumes of the fault LED chips are basically negligible, so that the fault LED chips can be used as one point and serve as the circle centers, the polishing mode can adopt laser burning polishing, the thermosetting anti-dazzle coating 3 can be coated by adopting a spraying mode, the coating can adopt modes such as dip coating, spraying, slit coating, knife coating and the like, the spraying mode is preferably adopted during maintenance, the use amount of the thermosetting anti-dazzle coating 3 can be effectively reduced, and the cost is saved. The spraying of the thermosetting anti-glare coating 3 is controlled to satisfy the following conditions: basis weight: 60-120 g/m 2 Thickness of: 3-5 μm,60 ° gloss: less than or equal to 10 percent. Therefore, flash point and bloom can not appear in the maintenance area of the LED display panel, and the maintained LED display panel can meet the shipment quality requirement.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the invention, and any changes, equivalents, modifications and improvements that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. An LED display panel, comprising:
a plurality of LED chips;
a circuit board having at least one mounting surface on which the LED chip is disposed;
an encapsulation layer disposed on the mounting surface and covering the LED chip;
a smooth surface layer arranged on the outer surface of the packaging layer;
a thermosetting antiglare coating disposed on the glossy surface layer.
2. The LED display panel of claim 1, wherein the encapsulation layer is made of epoxy resin, the thermosetting anti-glare coating is made of AG anti-glare liquid medicine, and the AG anti-glare liquid medicine comprises, in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts.
3. The LED display panel of claim 1, wherein the thermosetting antiglare coating is provided as: basis weight: 80-120 g/m 2 Thickness of: 5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent.
4. A method for manufacturing an LED display panel, applied to the LED display panel according to any one of claims 1 to 3, comprising the steps of:
s11: providing a circuit board with a plurality of LED chips arranged on at least one mounting surface;
s12: molding an encapsulation layer on the mounting surface to cover the LED chip;
s13: molding the packaging layer by adopting a smooth release film to obtain a smooth surface layer, and heating and curing the smooth surface layer;
s14: carrying out first heating on the surface layer of the light surface, and then carrying out plasma treatment;
s15: coating a thermosetting anti-dazzle coating on the surface layer of the gloss surface;
s16: and performing second heating on the thermosetting anti-dazzle coating.
5. The method of manufacturing an LED display panel according to claim 4, wherein the first heating in step S14 includes preheating the smooth surface layer at 50 to 100 ℃ for 1 to 4 hours.
6. The method of manufacturing an LED display panel according to claim 4, wherein the second heating in step S16 comprises heating the thermosetting anti-glare coating layer at 160 to 180 ℃ for 20 to 30 minutes.
7. A maintenance method of an LED display panel, applied to the LED display panel according to any one of claims 1 to 3, wherein at least one failed LED chip that cannot normally operate exists among the plurality of LED chips, the maintenance method comprising:
s21: digging holes on the positions of the fault LED chips to obtain holes, taking out the exposed fault LED chips and replacing and installing new LED chips;
s22: filling the packaging layer in the open hole, and curing the packaging layer;
s23: polishing the adjacent areas of the openings to remove the thermosetting anti-glare coating thereon, and polishing the encapsulation layer to be flat so that the encapsulation layer is flush with the surfaces of the adjacent areas from which the thermosetting anti-glare coating has been removed;
s24: subjecting the encapsulation layer and the adjacent areas from which the thermosetting antiglare coating has been removed to a plasma treatment;
s25: coating a thermosetting anti-glare coating on the encapsulation layer and the adjacent region which have been subjected to plasma treatment;
s26: and heating and curing the thermosetting anti-dazzle coating.
8. The method for repairing an LED display panel according to claim 8, wherein,
the curing treatment in the step S22 comprises baking and dehumidifying and preheating for 1-4 hours at 50-100 ℃; the heating and curing in the step S26 comprises heating at 160-180 ℃ for 20-30 min.
9. The method for repairing an LED display panel according to claim 8,
the packaging layer in the step S22 is an epoxy resin layer, the thermosetting anti-dazzle coating in the step S25 is AG anti-dazzle liquid medicine, and AG anti-dazzle is achievedThe light liquid medicine comprises the following components in parts by weight: siO with different particle sizes 2 Nanoparticles: 7-12 parts of alcohol solvent: 76-86 parts of siloxane auxiliary agent: 7-12 parts.
10. The method for repairing an LED display panel according to claim 8,
in the step S21, a laser drilling mode is adopted to drill holes, the adjacent areas are set to be round areas which take the fault LED chip as a circle center and have the radius of 0.5-2 mm, a spraying mode is adopted to coat the thermosetting anti-dazzle coating, and the spraying of the thermosetting anti-dazzle coating is controlled to meet the following conditions: basis weight: 80-120 g/m 2 Thickness of: 5-7 mu m, and the 60 DEG glossiness is less than or equal to 10 percent.
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