CN117727684A - Wafer vacuum carrying manipulator - Google Patents
Wafer vacuum carrying manipulator Download PDFInfo
- Publication number
- CN117727684A CN117727684A CN202410175982.1A CN202410175982A CN117727684A CN 117727684 A CN117727684 A CN 117727684A CN 202410175982 A CN202410175982 A CN 202410175982A CN 117727684 A CN117727684 A CN 117727684A
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- wafer
- pushing
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- plate
- limiting
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- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000003825 pressing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 13
- 238000001125 extrusion Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 105
- 238000001179 sorption measurement Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer vacuum conveying manipulator, and particularly relates to the technical field of wafer processing. The invention provides a wafer vacuum conveying manipulator which comprises a first substrate, wherein a pushing component is arranged on the first substrate, when a wafer is gradually clamped into a limiting ring groove under the pushing action of a first motor, a first telescopic rod arranged between a first pushing plate and the pushing substrate is contracted by the reaction force of the wafer, when the wafer is dismounted, the first telescopic rod is influenced by the acting force of a third spring to return to the original length, the first telescopic rod and the third spring are arranged, so that the wafer deformation caused by the fact that the front side and the rear side of the wafer receive extrusion force when the wafer is pushed into the limiting ring groove can be avoided, and the first telescopic rod and the third spring arranged can absorb vibration generated in the wafer clamping process, so that the pushing component is prevented from shifting before and after the wafer clamping.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a wafer vacuum conveying manipulator.
Background
In the manufacturing process of the wafer, the position of the wafer needs to be changed by a mechanical arm; however, in the structure of the existing mechanical arm, only one clamping part is arranged, more time is wasted in loading and unloading, meanwhile, the wafer is restrained less and lower in stability in the clamping process, the phenomenon that the wafer swings easily occurs, the mechanical arm is not beneficial to transporting the wafer to a specific position, and the processing precision of the wafer is reduced.
The prior art provides solutions, for example, patent KR101679410B1, which provides a positioning assembly mounted at the front end of a robot arm, and on which a plurality of support blades are provided, which enable a plurality of semiconductor wafers to be parallel to each other and spaced up and down. And the peripheral edge of the semiconductor crystal can be subjected to different supporting forces by changing the interval between the upper and lower supporting blades. The positioning assembly is provided with an elastically deformed spiral spring, an operating mechanism for elastically deforming the spiral spring up and down, and a piston shaft for clamping the spiral spring to lift. Thereby correcting the loaded wafer and reducing the abrasion on the edge of the wafer, and improving the processing efficiency.
However, the invention still has the defect that the position of the positioning assembly cannot be adjusted, and therefore, wafers with different sizes cannot be clamped effectively, and meanwhile, the wafers are easy to wear when clamped into the positioning assembly, so that the inventor considers that the invention has a great room for improvement.
Disclosure of Invention
In order to improve the efficiency of wafer loading and unloading and transporting, the abrasion suffered in the wafer clamping process is reduced. The invention provides a wafer vacuum conveying manipulator which comprises a base, wherein a second arm body is rotationally connected to the base, a first arm body is rotationally connected to the second arm body, a first base plate is rotationally connected to the first arm body, one end of the first base plate is connected with a placing base body, at least two first motors are arranged on one side of the first base plate, the output end of each first motor is connected with a pushing assembly, the pushing assembly comprises at least three pushing base plates, the side face of one pushing base plate is connected with a first telescopic rod, and one end of the first telescopic rod is connected with a first pushing plate.
Further, a motor for pushing the second arm to rise and fall is arranged in the base, and specific technical steps can be referred to patent CN113437009B, namely, the motor drives the second arm to move up and down to achieve the steps of wafer taking and carrying, and in the invention, the placing substrate comprises at least two plate bodies extending outwards, an adsorption substrate is arranged on the plate bodies, the adsorption substrate comprises an air duct and a sucker, the bottom of the sucker is connected with the air duct, the air duct is used for sucking and exhausting air so as to control the adsorption degree of the wafer, the adsorption substrate comprises the sucker, the air duct and the like, the sucker and the like are all arranged in the placing substrate, and the air duct can be used for sucking air so as to generate a certain adsorption force on the wafer, so that the clamped wafer is firmer. Furthermore, the pushing substrate is connected with the first motor through a hydraulic rod, when the wafer is clamped by the mechanical arm, the first motor is reversed to bring the pushing substrate back to the initial position, and meanwhile, the first arm body and the second arm body rotate to take away the wafer.
In the invention, the pushing substrates are fixedly connected, the pushing assembly further comprises at least two rotating shafts, the left and right parts of the first pushing plate are connected with the rotating shafts, and one side of the rotating shaft is also connected with the second pushing plate.
Further, first push pedal and second push pedal all contact with the wafer surface, so first push pedal and second push pedal all adopt flexible material in order to prevent that the wafer surface from receiving wearing and tearing, in addition, be provided with the chucking piece in first push pedal and second push pedal, chucking piece side is provided with the slide rail for the chucking piece can slide about first push pedal and second push pedal and then can adjust the height that the wafer is located relatively, and the chucking piece can clip the edge of wafer, avoids appearing the phenomenon that the wafer drops in the clamping process and takes place.
In the invention, a first telescopic rod is arranged between a pushing substrate and a first push plate, a third spring is sleeved outside the first telescopic rod, and the end part of the third spring is respectively connected with the surfaces of the pushing substrate and the first push plate.
Further, when the wafer is gradually clamped into the limiting ring groove under the pushing action of the first motor, the first telescopic rod arranged between the first push plate and the pushing substrate is contracted by the reaction force of the wafer, when the wafer is dismounted, the first telescopic rod is influenced by the acting force of the third spring to return to the original length, the first telescopic rod and the third spring are arranged, so that the wafer can be prevented from deforming due to the fact that the front side and the rear side of the wafer are both subjected to extrusion force when the wafer is pushed into the limiting ring groove, and on the other hand, vibration generated in the wafer clamping process can be absorbed through the arrangement of the first telescopic rod and the third spring, and the shifting assembly is prevented from shifting around the wafer clamping.
In the invention, a buffer assembly is arranged between a second push plate and a pushing substrate, the buffer assembly comprises a second annular plate, at least three connecting plates are circumferentially arranged on the surface of the second annular plate, at least two second telescopic rods are connected to the connecting plates, one end of each second telescopic rod is connected with a first annular plate, and the second annular plate is fixedly connected with the pushing substrate.
Further, the buffer assembly is arranged between the second pushing plate and the pushing substrate, when the wafer is conveyed by the manipulator, the pushing substrate arranged on the side surface cannot swing, the second pushing plate is rotationally connected with the first pushing plate through the rotating shaft arranged between the second pushing plate and the first pushing plate, the edge of the wafer is surrounded by the second pushing plate and the first pushing plate in an included angle mode, the wafer is convenient to radially pre-position the wafer before the adsorption substrate is completely adsorbed, the wafer is stable, and furthermore, the first pushing plate and the second pushing plate can realize that the contact area of clamping is enlarged due to multi-point contact at the edge of the wafer.
According to the invention, one end of a placed substrate is provided with a limiting component, the limiting component comprises a limiting sleeve, the center of the limiting sleeve is provided with a through hole, a limiting block is installed in the through hole, a pressing plate is also connected in the limiting sleeve, the pressing plate is installed in cooperation with the limiting block, one end of the limiting block is connected with a second piston rod, a first spring is sleeved outside the second piston rod, the upper end of the first spring is connected with the pressing plate, one end of the second piston rod is connected with a fixed base, and the upper end of the fixed base is provided with the first spring.
Further, the limit ring groove formed in the side face of the limit sleeve can be abutted with the edge of the wafer, meanwhile, the limit sleeve is made of flexible materials and has certain ductility, when the second piston rod stretches, the limit ring groove formed in the side face of the limit sleeve can be expanded to adapt to the wafer with the thicker edge, the contact area between the limit ring groove and the wafer can be further expanded through the arrangement of the second piston rod, and a certain supporting force is provided for the wafer. In addition, in the wafer clamping process, when the clamping piece on the pushing substrate clamps the wafer, the edge of the wafer may possibly cause the change of the levelness of the wafer due to self gravity, and the clamping piece and the limiting ring groove clamped on the other side of the wafer are not always at the same height, so that the height of the side limiting ring groove can be controlled by adjusting the height of the second piston rod so as to control the horizontal height of the wafer.
In the invention, the outer side of the limiting sleeve is provided with an array of limiting ring grooves, the inner wall of the limiting sleeve is provided with limiting plates, the limiting plates are respectively arranged on the upper side and the lower side of the limiting ring grooves, the center of each limiting plate is provided with a first hole body, and the first hole body is internally provided with a first spring.
Further, the limiting plates are horizontally arranged at intervals, limiting ring grooves are formed in the outer walls of the limiting sleeves between the limiting plates, and the limiting sleeves are made of flexible materials and have certain ductility, so that the limiting plates play a role in a certain fixed position on the limiting sleeves, energy such as shaking possibly generated by a wafer in the process of driving the wafer to move by the mechanical arm can be transmitted to the pressing plate and the first spring through the limiting sleeves, so that the vibration reduction effect is achieved, and the problems of shaking or even breakage and the like caused by shaking of the wafer are avoided or reduced.
Compared with the prior art, the invention has the technical characteristics that: be provided with and pass the subassembly, when the wafer is blocked into spacing annular gradually under the promotion effect of first motor, make the first telescopic link that sets up between first push pedal and the lapse base plate receive the reaction force of wafer and take place to shrink, receive first telescopic link to get back to original length again under the effort influence of third spring when unloading the wafer, set up first telescopic link and third spring on the one hand can avoid the wafer all to receive the extrusion force and lead to the wafer to warp when pushing into spacing annular around both sides, on the other hand can absorb the vibrations that the wafer clamping in-process produced through setting up first telescopic link and third spring, pass the subassembly around avoiding the wafer clamping and take place the skew.
Drawings
FIG. 1 is a schematic view of a wafer vacuum handling robot according to the present invention;
FIG. 2 is a schematic view of a pushing assembly according to the present invention;
FIG. 3 is a schematic view of a pushing assembly according to another aspect of the present invention;
FIG. 4 is a schematic view of a buffer assembly according to the present invention;
FIG. 5 is a schematic view of a positioning assembly according to the present invention;
fig. 6 is a schematic cross-sectional view of a positioning assembly according to the present invention.
Reference numerals illustrate: 11-a base; 12-a second arm; 13-a first arm; 14-a first substrate; 15-placing a substrate; 16-a first motor; 17-an adsorption matrix; 2-pushing assembly; 21-pushing the substrate; 22-a first telescopic rod; 221-a third spring; 23-a first push plate; 231-rotating shaft; 24-a second push plate; a 3-buffer assembly; 31-a second ring plate; 32-connecting plates; 33-a second telescopic rod; 34-a first ring plate; 4-a limiting assembly; 41-limiting sleeve; 42-limiting blocks; 43-pressing plate; 44-a second piston rod; 45-a first spring; 46-a fixed base; 47-limiting ring grooves; 48-limiting plates; 481-first aperture.
Detailed Description
Example 1:
referring to fig. 1 and 2 of the drawings, the present invention provides a wafer vacuum handling manipulator, which includes a base 11, a second arm 12 rotatably connected to the base 11, a first arm 13 rotatably connected to the second arm 12, a first substrate 14 rotatably connected to the first arm 13, a placement base 15 connected to one end of the first substrate 14, at least two first motors 16 disposed on one side of the first substrate 14, a pushing assembly 2 connected to an output end of the first motor 16, and at least three pushing substrates 21 including one pushing substrate 21, a first telescopic rod 22 connected to a side surface of the pushing substrate 21, and a first push plate 23 connected to one end of the first telescopic rod 22.
Further, a motor for pushing the second arm 12 to rise and fall is disposed in the base 11, and the specific technical steps can refer to patent CN113437009B, namely, the motor drives the second arm 12 to move up and down to achieve the wafer taking and carrying steps, and in the invention, the placing substrate 15 includes at least two plates extending outwards, an adsorption substrate 17 is disposed on the plates, the adsorption substrate 17 includes an air duct and a suction cup, the bottom of the suction cup is connected with the air duct, the suction air is sucked and exhausted through the air duct to control the adsorption degree of the wafer, the adsorption substrate 17 includes the suction cup, the air duct and the like, and the suction cup and the like are all disposed in the placing substrate 15, and can suck the air through the air duct to generate a certain adsorption force to the wafer, so that the clamped wafer is more stable. Furthermore, the pushing substrate 21 is connected to the first motor 16 by a hydraulic rod, when the wafer is clamped by the manipulator, the first motor 16 is reversed to bring the pushing substrate 21 back to the initial position, the length of the first arm 13 is slightly shorter than that of the second arm 12, a plurality of bolts are arranged on the second arm 12 and the first arm 13 to fasten, and meanwhile, the first arm 13 and the second arm 12 rotate to take away the wafer, and it is worth mentioning that the second arm 12 is provided with a motor for driving the first arm 13, and the second arm 12 is provided with a motor for driving the first substrate 14. When the wafer is removed by the manipulator, the first motor 16 rotates forward to push the pushing substrate 21 to move forward, and meanwhile, the pushing substrate 21 drives the first push plate 23 to move forward so as to drive the wafer to be clamped on the limiting ring groove 47, so that the clamping step is completed.
Referring to fig. 2 and 3, in the present invention, the pushing base plates 21 are fixedly connected, the pushing assembly 2 further includes at least two rotating shafts 231, the left and right positions of the first push plate 23 are connected to the rotating shafts 231, and one side of the rotating shaft 231 is further connected to the second push plate 24.
Further, the first push plate 23 and the second push plate 24 are in contact with the surface of the wafer, so that the first push plate 23 and the second push plate 24 are made of flexible materials for preventing the surface of the wafer from being worn, in addition, clamping pieces 25 are arranged on the first push plate 23 and the second push plate 24, sliding rails are arranged on the side surfaces of the clamping pieces 25, the clamping pieces 25 can slide up and down relative to the first push plate 23 and the second push plate 24, the height of the wafer can be adjusted, the clamping pieces 25 can clamp the edge of the wafer, and the phenomenon that the wafer falls off in the clamping process is avoided.
In the invention, a first telescopic rod 22 is arranged between a pushing substrate 21 and a first push plate 23, a third spring 221 is sleeved outside the first telescopic rod 22, and the end part of the third spring 221 is respectively connected with the surfaces of the pushing substrate 21 and the first push plate 23.
Further, the third spring 221 is sleeved outside the first telescopic rod 22, a cylindrical body is arranged at the end part of the first telescopic rod 22 and is connected with the first push plate 23 in a matched manner, the cylindrical body can be detached through a tool, the head end and the tail end of the third spring 221 are welded with the surface of the cylindrical body, when a wafer is gradually clamped into the limit ring groove 47 under the pushing action of the first motor 16, the first telescopic rod 22 arranged between the first push plate 23 and the pushing substrate 21 is contracted by the reaction force of the wafer, when the wafer is detached, the first telescopic rod 22 returns to the original length under the influence of the acting force of the third spring 221, the first telescopic rod 22 and the third spring 221 are arranged, on one hand, the wafer can be prevented from being deformed due to the fact that the front side and the rear side of the wafer are all received extrusion force when the limit ring groove 47 is pushed, on the other hand, the first telescopic rod 22 and the third spring 221 are arranged, so that the wafer can be absorbed to clamp the wafer in the clamping process, and the pushing assembly 2 is prevented from being offset.
Referring to fig. 2, 3 and 4, in the present invention, a buffer assembly 3 is disposed between a second push plate 24 and a pushing substrate 21, the buffer assembly 3 includes a second ring plate 31, at least three connection plates 32 are circumferentially disposed on the surface of the second ring plate 31, at least two second telescopic rods 33 are connected to the connection plates 32, one end of each second telescopic rod 33 is connected to a first ring plate 34, and the second ring plate 31 is fixedly connected to the pushing substrate 21.
Further, the buffer assembly 3 is disposed between the second push plate 24 and the pushing substrate 21, and when the wafer is conveyed by the manipulator, the pushing substrate 21 disposed on the side surface is not swung, the second push plate 24 is rotationally connected with the first push plate 23 through the disposed rotation shaft 231, the second push plate 24 and the first push plate 23 form an included angle to encircle the edge of the wafer, so that the wafer can be radially pre-positioned and stably contacted with the wafer before the adsorption substrate 17 is completely adsorbed, and furthermore, the first push plate 23 and the second push plate 24 can realize multi-point contact with the edge of the wafer, thereby expanding the contact area of the clamping.
In addition, the second telescopic rod 33 connected between the first ring plate 34 and the second ring plate 31 is inclined, and it should be mentioned that the second ring plate 31 is in a truncated cone shape, the connecting plate 32 is connected to the side surface of the second ring plate 31, and the end of the second telescopic rod 33 is hinged to the first ring plate 34, so that the second telescopic rod 33 can swing relative to the first ring plate 34, when the second push plate 24 is pushed by the wafer to translate, the second telescopic rod 33 contracts to avoid the damage of the second push plate 24 to the wafer and the possible occurrence of the wafer bending problem caused by the reduced pushing pressure. Further, the process of scaling the second telescopic rod 33 can absorb the shock generated by the robot during the process of driving the wafer to move.
Example 2:
referring to fig. 1, 5 and 6, in the invention, one end of a placing substrate 15 is provided with a limiting assembly 4, the limiting assembly 4 comprises a limiting sleeve 41, a through hole is formed in the center of the limiting sleeve 41, a limiting block 42 is installed in the through hole, a pressing plate 43 is further connected in the limiting sleeve 41, the pressing plate 43 is installed in cooperation with the limiting block 42, one end of the limiting block 42 is connected with a second piston rod 44, a first spring 45 is sleeved outside the second piston rod 44, the upper end of the first spring 45 is connected with the pressing plate 43, one end of the second piston rod 44 is connected with a fixed base 46, and the upper end of the fixed base 46 is provided with the first spring 45.
Further, the limiting ring groove 47 formed in the side surface of the limiting sleeve 41 can be abutted to the edge of the wafer, meanwhile, the limiting sleeve 41 is made of flexible materials, and has certain ductility, when the second piston rod 44 stretches, the limiting ring groove 47 in the side surface can be expanded to adapt to the wafer with a thicker edge, the contact area between the limiting ring groove 47 and the wafer can be further expanded through the arrangement of the second piston rod 44, and a certain supporting force is provided for the wafer. In addition, in the wafer clamping process, when the clamping piece 25 on the pushing substrate 21 clamps the wafer, the edge of the wafer may possibly change its levelness due to self gravity, and the clamping piece 25 and the limiting ring groove 47 clamped on the other side of the wafer are not always at the same height, so the height of the side limiting ring groove 47 can be controlled by adjusting the height of the second piston rod 44, so as to control the horizontal height of the wafer.
In the invention, a limiting ring groove 47 is arranged on the outer side of a limiting sleeve 41 in an array manner, limiting plates 48 are arranged on the inner wall of the limiting sleeve 41 in an array manner, the limiting plates 48 are respectively arranged on the upper side and the lower side of the limiting ring groove 47, a first hole body 481 is arranged in the center of the limiting plates 48, and a first spring 45 is arranged in the first hole body 481.
Further, the limiting plates 48 are horizontally arranged at intervals, the limiting ring grooves 47 are formed in the outer wall of the limiting sleeve 41 between the limiting plates 48, and the limiting sleeve 41 is made of flexible materials and has certain ductility, so that the limiting plates 48 play a role in fixing the limiting sleeve 41, energy such as shaking possibly generated by the wafer in the process of driving the wafer to move by the manipulator can be transmitted to the pressing plate 43 and the first spring 45 through the limiting sleeve 41, the vibration reduction effect is achieved, and the problems of shaking or breakage even the like caused by shaking of the wafer are avoided or reduced.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Claims (5)
1. The wafer vacuum carrying manipulator comprises a base (11), a second arm body (12) is rotationally connected to the base (11), a first arm body (13) is rotationally connected to the second arm body (12), a first substrate (14) is rotationally connected to the first arm body (13), and the wafer vacuum carrying manipulator is characterized in that one end of the first substrate (14) is connected with a placing substrate (15), at least two first motors (16) are arranged on one side of the first substrate (14), a pushing component (2) is connected to the output end of the first motors (16), the pushing component (2) is provided with three pushing substrates (21), a first telescopic rod (22) is connected to the side face of one pushing substrate (21), a first pushing plate (23) is connected to one end of the first telescopic rod (22), a fixed connection mode is adopted between every two adjacent pushing substrates (21), the pushing component (2) further comprises at least two rotating shafts (231), a second pushing plate (24) is connected to the side of the first pushing plate (23) through a rotating shaft (231),
and a third spring (221) is sleeved outside the first telescopic rod (22), and the end part of the third spring (221) is respectively connected with the surfaces of the pushing substrate (21) and the first push plate (23).
2. A wafer vacuum handling robot according to claim 1, wherein the placement base (15) has two outwardly extending plates on which the suction base (17) is arranged.
3. The wafer vacuum handling manipulator according to claim 1, wherein a buffer assembly (3) is arranged between the second push plate (24) and the pushing substrate (21), the buffer assembly (3) comprises a second annular plate (31), at least three connecting plates (32) are circumferentially distributed on the surface of the second annular plate (31), at least two second telescopic rods (33) are connected to the connecting plates (32), one end of each second telescopic rod (33) is connected with a first annular plate (34), and the second annular plate (31) is fixedly connected with the pushing substrate (21).
4. The wafer vacuum handling manipulator according to claim 1, wherein the placement substrate (15) is provided with a limiting component (4) at one end, the limiting component (4) comprises a limiting sleeve (41), a through hole is formed in the center of the limiting sleeve (41), a limiting block (42) is installed in the through hole, a pressing plate (43) is further connected in the limiting sleeve (41), the pressing plate (43) is installed in a matched mode with the limiting block (42), a second piston rod (44) is connected to one end of the limiting block (42), a first spring (45) is sleeved outside the second piston rod (44), the upper end of the first spring (45) is connected with the pressing plate (43), and one end of the second piston rod (44) is connected with a fixed base (46).
5. The wafer vacuum handling manipulator according to claim 4, wherein a limiting ring groove (47) is arranged on the outer side of the limiting sleeve (41), a limiting plate (48) is arranged on the inner wall of the limiting sleeve (41), a first hole body (481) is formed in the center of the limiting plate (48), and the first spring (45) is arranged on the inner side of the first hole body (481).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410175982.1A CN117727684B (en) | 2024-02-08 | 2024-02-08 | Wafer vacuum carrying manipulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410175982.1A CN117727684B (en) | 2024-02-08 | 2024-02-08 | Wafer vacuum carrying manipulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117727684A true CN117727684A (en) | 2024-03-19 |
| CN117727684B CN117727684B (en) | 2024-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410175982.1A Active CN117727684B (en) | 2024-02-08 | 2024-02-08 | Wafer vacuum carrying manipulator |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013000428A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | A wafer holding device using a pusher rod drawn by strings and springs |
| CN103688348A (en) * | 2011-08-10 | 2014-03-26 | 川崎重工业株式会社 | End-effector device and substrate transport robot provided with said end-effector device |
| CN210379002U (en) * | 2019-09-04 | 2020-04-21 | 深圳市海德精密陶瓷有限公司 | Ceramic mechanical arm for transmitting wafer |
| CN113394158A (en) * | 2021-06-16 | 2021-09-14 | 深圳市星国华先进装备科技有限公司 | Single-arm three-degree-of-freedom wafer transmission manipulator and use method |
| US20210387358A1 (en) * | 2018-11-06 | 2021-12-16 | Kawasaki Jukogyo Kabushiki Kaisha | Robot hand and robot having the same |
| CN117352456A (en) * | 2023-09-28 | 2024-01-05 | 无锡先为科技有限公司 | Wafer processing device and tail end adjusting method of manipulator used for same |
-
2024
- 2024-02-08 CN CN202410175982.1A patent/CN117727684B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013000428A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | A wafer holding device using a pusher rod drawn by strings and springs |
| CN103688348A (en) * | 2011-08-10 | 2014-03-26 | 川崎重工业株式会社 | End-effector device and substrate transport robot provided with said end-effector device |
| US20210387358A1 (en) * | 2018-11-06 | 2021-12-16 | Kawasaki Jukogyo Kabushiki Kaisha | Robot hand and robot having the same |
| CN210379002U (en) * | 2019-09-04 | 2020-04-21 | 深圳市海德精密陶瓷有限公司 | Ceramic mechanical arm for transmitting wafer |
| CN113394158A (en) * | 2021-06-16 | 2021-09-14 | 深圳市星国华先进装备科技有限公司 | Single-arm three-degree-of-freedom wafer transmission manipulator and use method |
| CN117352456A (en) * | 2023-09-28 | 2024-01-05 | 无锡先为科技有限公司 | Wafer processing device and tail end adjusting method of manipulator used for same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117727684B (en) | 2024-04-19 |
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