CN117715404B - Packaging chip pin tin bridge processing equipment - Google Patents
Packaging chip pin tin bridge processing equipment Download PDFInfo
- Publication number
- CN117715404B CN117715404B CN202410167998.8A CN202410167998A CN117715404B CN 117715404 B CN117715404 B CN 117715404B CN 202410167998 A CN202410167998 A CN 202410167998A CN 117715404 B CN117715404 B CN 117715404B
- Authority
- CN
- China
- Prior art keywords
- guide
- tin
- processing
- pins
- truss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000523 sample Substances 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims description 30
- 230000004907 flux Effects 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 210000003781 tooth socket Anatomy 0.000 claims description 4
- 244000309464 bull Species 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- IUYHQGMDSZOPDZ-UHFFFAOYSA-N 2,3,4-trichlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 IUYHQGMDSZOPDZ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of chip packaging and discloses packaging chip pin tin bridge processing equipment, which comprises a clamping assembly and a guide truss acting on the upper part of the clamping assembly, wherein a conveying belt is arranged on the clamping assembly, a PCB circuit board is guided by the conveying belt, and the clamping assembly is used for fixing the PCB circuit board; the conveying belt sequentially conveys the PCB circuit board to the upper part of the clamping assembly, after the PCB circuit board is centered and fixed through the clamping assembly, the centering positioning is realized by utilizing the positioning probe to cooperate with the guide truss, whether the pins of the packaged chip are connected with tin to be processed or not is judged, the packaged chip is adsorbed and fixed through the sucking disc when the processing is needed, the pins are continuously fluctuated and conveyed through the processing head of the pin processing assembly, the pins are continuously heated, tin is fused and adhered, tin drops are formed and wrapped on the surfaces of the pins, and the adhered pins are separated.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to packaging chip pin tin bridge processing equipment.
Background
The chip is an integrated circuit integrated on a wafer through semiconductor materials, and because the chip is extremely precise, the chip needs to be protected by using a shell package when in use, and the pins of the chip need to be welded on a circuit board when in connection.
At present, in the welding process of some package chips with higher density and complex structures, as the number of pins is large and the density is large, the situation of tin connection occurs on the pins after the welding is completed, namely, tin blocks adhered between a plurality of pins occur, in the prior art, the common processing mode is to manually heat and separate the positions of the pins where tin connection occurs by using an electric soldering iron, which wastes time and labor and affects the packaging efficiency of the chips.
Disclosure of Invention
The invention aims to provide a tin bridge treatment device for pins of a packaged chip, and aims to solve the problem that the efficiency of a manual separation mode is low when the pins of the existing chip are connected with tin.
The invention is realized in such a way that the packaging chip pin tin bridge treatment equipment comprises a clamping component and a guide truss acting on the upper part of the clamping component, wherein the clamping component is provided with a conveying belt, a PCB circuit board is guided by the conveying belt, and the clamping component is used for fixing the PCB circuit board;
The guide truss comprises an X-direction truss, a Y-direction truss and a Z-direction truss, a positioning component and a stitch processing component which is rotatably arranged on one side of the positioning component are arranged at the guide end of the Z-direction truss, and the guide truss is used for driving the positioning component and the stitch processing component to transfer along X, Y and Z-axis directions of a PCB (printed circuit board);
The positioning assembly comprises a sucker and a positioning probe, the positioning probe is used for visually judging the tin connection condition and positioning the position of the packaged chip on the PCB, and the packaged chip is adsorbed and positioned by the sucker matched with the guide truss;
The stitch processing assembly comprises an adjusting plate and a processing head, wherein the adjusting plate provides soldering flux for the processing head and drives the processing head to continuously undulate and guide, and the adjusting plate is used for continuously heating the stitch to melt and adhere tin and form tin drops to wrap the surface of the stitch.
Preferably, the clamping assembly comprises a substrate, a limit motor arranged at the end part of the substrate, and two first guide rods connected to the bottom of the substrate through bearings, wherein the two first guide rods are synchronously driven to rotate through the limit motor, and end plates are sleeved outside the two ends of the two first guide rods;
The surfaces of the two ends of the first guide rod are respectively provided with a forward thread and a directional thread, and the inner walls of the end plates at the two ends of the first guide rod are respectively provided with thread grooves meshed with the forward thread and the reverse thread.
Preferably, the top bearings of the two end plates are connected with a second guide rod, and clamping blocks are sleeved outside the two ends of the second guide rod;
The surfaces of the two ends of the second guide rod are respectively provided with a forward thread and a reverse thread, and the inner walls of the clamping blocks at the two ends of the second guide rod are respectively provided with thread grooves meshed with the forward thread and the reverse thread.
Preferably, the positioning assembly comprises a fixed seat, a telescopic cylinder is inserted in the fixed seat, the telescopic cylinder is arranged in a hollow mode, the sucking disc is arranged at the bottom end of the telescopic cylinder, and the positioning probe is arranged at the top end of the telescopic cylinder;
The telescopic cylinder is arranged on the outer side of the upper part of the sucker in a sleeved mode and is provided with a first spring.
Preferably, the stitch processing assembly comprises a direction-adjusting motor arranged in the fixing seat and a rotary table connected below the fixing seat through a bearing, and the rotary table is driven to rotate by the direction-adjusting motor.
Preferably, a support plate is arranged at the bottom of the turntable, a transverse adjusting motor is arranged at the end part of the support plate, rotating rods are connected with bearings in the two sides of the support plate, and the two rotating rods are synchronously driven to rotate through the transverse adjusting motor;
The outside threaded connection of bull stick has the telescopic link, the regulating plate passes through the telescopic end connection of telescopic link.
Preferably, a longitudinal adjusting motor is arranged above the end part of the adjusting plate, and the inner bearings at two sides of the adjusting plate are connected with a third guide rod which is driven to synchronously rotate by the longitudinal adjusting motor;
the outer threads of the two third guide rods are connected with a retaining plate, and tooth grooves are uniformly distributed on the lower surface of the retaining plate.
Preferably, a guide motor is arranged at one side of the adjusting plate, an output shaft of the guide motor is connected with a fourth guide rod, the fourth guide rod is arranged at the inner side of the bottom of the adjusting plate, and a connecting block is connected with the outer thread of the fourth guide rod;
The inside of connecting block is inserted and is equipped with the butt pole, the top of butt pole is installed and is supported the wheel, support the wheel with it is contradicted to bear the tooth's socket surface of board, still be provided with the second spring between wheel and the connecting block to support, support the bottom of pole and install pressure sensor, handle the head with pressure sensor's atress end threaded connection.
Preferably, a supporting rod is further installed at the end part of the connecting block, the supporting rod is connected with a butt strap through a spring shaft, and a soldering flux bin is arranged at the end part of the butt strap;
the top one side of handling head is connected with the arc baffle, scaling powder storehouse is close to the gyro wheel is installed to one side of arc baffle, the surface of gyro wheel is contradicted with the arc baffle.
Preferably, the processing head comprises a connector, an electric soldering head is arranged at the tail end of the connector, and the lower surface of the electric soldering head is horizontally arranged.
The invention discloses a packaging chip pin tin bridge treatment device, which has the beneficial effects that:
1. the conveying belt sequentially conveys the PCB circuit board to the upper part of the clamping assembly, after the PCB circuit board is centered and fixed through the clamping assembly, the centering positioning is realized by utilizing the positioning probe to cooperate with the guide truss, whether the pins of the packaged chip are connected with tin to be processed or not is judged, the packaged chip is adsorbed and fixed through the sucking disc when the processing is needed, the pins are continuously fluctuated and conveyed through the processing head of the pin processing assembly, the pins are continuously heated, tin is fused and adhered, tin drops are formed and wrapped on the surfaces of the pins, and the adhered pins are separated.
2. The transverse adjusting motor and the longitudinal adjusting motor are arranged to adjust the processing head according to the specifications of the pins of the packaging chip to be processed, so as to meet the processing requirements of packaging chips of different sizes and different pin thicknesses.
3. And when the processing head moves upwards along with the tooth grooves of the supporting plates, the soldering flux bin moves downwards along with the arc-shaped guide plates to the electric soldering head, the soldering flux in the soldering flux bin can quickly contact with the electric soldering head, the soldering flux is added to the electric soldering head, the efficiency of melting and being taken away is improved, and therefore molten tin blocks are taken to flow to the outside of the pins and form a coating layer, and the tin connection between the pins and the pins can be separated under the action of tension.
Drawings
FIG. 1 is a schematic diagram of a solder bridge handling apparatus for pins of a packaged chip according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of a clamping assembly of a tin bridge processing device for pins of a packaged chip according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a guiding truss structure of a tin bridge processing device for pins of a packaged chip according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a positioning component of a tin bridge processing device for pins of a packaged chip according to an embodiment of the present invention;
Fig. 5 is a schematic diagram of a pin handling component of a pin solder bridge handling device for a packaged chip according to an embodiment of the present invention;
Fig. 6 is a schematic diagram of a partial enlarged structure at a position a in fig. 5 of a packaged chip pin solder bridge processing apparatus according to an embodiment of the present invention.
Legend description:
1. A clamping assembly; 2. a conveyor belt; 3. guiding and conveying the truss; 4. a positioning assembly; 5. a stitch handling assembly;
11. A substrate; 12. a limit motor; 13. a first guide bar; 14. an end plate; 15. a second guide bar; 16. clamping blocks;
21. A PCB circuit board;
31. an X-direction truss; 32. y-direction truss; 33. z-direction truss;
41. a fixing seat; 42. a telescopic cylinder; 43. a suction cup; 44. positioning a probe; 421. a first spring;
51. a direction-adjusting motor; 52. an adjusting plate; 53. a processing head;
511. a turntable; 512. a support plate; 513. a transverse adjusting motor; 514. a rotating rod; 515. a telescopic rod;
521. longitudinally adjusting the motor; 522. a third guide bar; 523. a retaining plate; 524. a guide motor; 525. a fourth guide bar; 526. a connecting block; 527. a supporting rod; 5271. a supporting wheel; 5272. a pressure sensor; 528. a support rod; 5281. a butt strap; 529. a second spring;
531. a connector; 532. an electrocautery head; 533. an arc-shaped guide plate; 534. a soldering flux bin; 5341. and a roller.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
The implementation of the present invention will be described in detail below with reference to specific embodiments.
In this embodiment:
Referring to fig. 1 and 3, a preferred embodiment of the present invention is provided.
The encapsulated chip pin tin bridge processing equipment comprises a clamping assembly 1 and a guide truss 3 acting on the upper side of the clamping assembly 1, wherein a conveying belt 2 is arranged on the clamping assembly 1, a PCB (printed Circuit Board) 21 is guided by the conveying belt 2, and the clamping assembly 1 is used for fixing the PCB 21;
The guiding truss 3 comprises an X-direction truss 31, a Y-direction truss 32 and a Z-direction truss 33, a positioning component 4 and a stitch processing component 5 rotatably arranged on one side of the positioning component 4 are arranged at the guiding end of the Z-direction truss 33, and the guiding truss 3 is used for driving the positioning component 4 and the stitch processing component 5 to transfer along X, Y and Z-axis directions of the PCB 21;
The positioning assembly 4 comprises a sucker 43 and a positioning probe 44, wherein the positioning probe 44 is used for visually judging the tin connection condition and positioning the position of the packaged chip on the PCB 21, and the packaged chip is adsorbed and positioned by the sucker 43 in cooperation with the guide truss 3;
The pin processing assembly 5 comprises an adjusting plate 52 and a processing head 53, wherein the adjusting plate 52 provides soldering flux for the processing head 53 and drives the processing head 53 to continuously undulate and guide, and is used for continuously heating pins to melt and adhere tin and form tin drops to wrap the surfaces of the pins;
Referring to fig. 2, the clamping assembly 1 includes a base plate 11, a limit motor 12 mounted at the end of the base plate 11, and two first guide rods 13 connected to the bottom of the base plate 11 by bearings, wherein the two first guide rods 13 are synchronously driven to rotate by the limit motor 12, end plates 14 are sleeved outside two ends of the two first guide rods 13, forward threads and reverse threads are respectively provided on two end surfaces of the two first guide rods 13, thread grooves meshed with the forward threads and the reverse threads are respectively provided on inner walls of the end plates 14 at two ends of the two first guide rods, a second guide rod 15 is connected to the top bearing of the two end plates 14, clamping blocks 16 are respectively sleeved outside two ends of the second guide rod 15, thread grooves meshed with the forward threads and the reverse threads are respectively provided on the inner walls of the two clamping blocks 16 at two ends of the second guide rod 15, the two clamping blocks 16 are driven to rotate by the limit motor 12 according to the length specification of a PCB circuit board 21 to be processed, reverse synchronous transmission is realized by the clamping blocks 16 on the two end plates 14, and the two ends of the PCB circuit board 21 are fixed, and the two PCB circuit boards 21 are fixed by the two sides of the clamping blocks are positioned and the two PCB boards are positioned at the two sides of the PCB board 21.
Referring to fig. 4, the positioning assembly 4 includes a fixing seat 41, a telescopic cylinder 42 is inserted in the fixing seat 41, the telescopic cylinder 42 is hollow, the suction cup 43 is mounted at the bottom end of the telescopic cylinder 42, the positioning probe 44 is mounted at the top end of the telescopic cylinder 42, the focusing point of the positioning probe 44 is coaxially arranged with the telescopic cylinder 42, the positioning probe 44 can better observe the position of the PCB 21 and the packaged chip thereon through the positioning probe 44, the suction cup 43 is centered in the exact center position of the packaged chip in cooperation with the guiding truss 3, and the suction cup 43 is driven to sink to adsorb the packaged chip through the Z-direction truss 33, so that the packaged chip is prevented from moving in the processing process;
further, the telescopic cylinder 42 is provided with a first spring 421 in a sleeved manner above the suction cup 43, and under the action of the first spring 421, the telescopic cylinder 42 is pushed upwards to compress the first spring 421 and generate a reaction force to firmly act the packaged chip on the PCB circuit board 21, so that the package chip pins are prevented from being unwelded in the processing process.
Referring to fig. 5-6, the stitch processing assembly 5 includes a direction-adjusting motor 51 installed in the fixing base 41, and a turntable 511 connected to the lower part of the fixing base 41 through a bearing, wherein the turntable 511 is driven to rotate by the direction-adjusting motor 51, and the turntable 511 is driven to rotate according to the stitch positions around the packaged chip to be welded, so that the processing head 53 can sequentially act on the stitches around the packaged chip.
Further, a support plate 512 is disposed at the bottom of the turntable 511, a lateral adjustment motor 513 is mounted at the end of the support plate 512, rotating rods 514 are connected to the inside of two sides of the support plate 512 through bearings, the two rotating rods 514 are synchronously driven to rotate by the lateral adjustment motor 513, a telescopic rod 515 is connected to the outer threads of the rotating rods 514, the adjusting plate 52 is connected to the telescopic end of the telescopic rod 515 through the telescopic end, the lateral adjustment motor 513 is driven to drive the rotating rods 514 to rotate, the telescopic rod 515 in threaded connection with the outer threads of the telescopic rod is pushed to stretch, and the distance between the processing head 53 and the suction disc 43 is adjusted, so that the position of the processing head 53 can be adjusted according to the specification of a required processing packaging chip, and the applicability is strong.
It is noted that a longitudinal adjusting motor 521 is installed above the end of the adjusting plate 52, two inner bearings on two sides of the adjusting plate 52 are connected with a third guide rod 522, the third guide rod 522 is driven to synchronously rotate by the longitudinal adjusting motor 521, two outer threads of the third guide rods 522 are connected with a retaining plate 523, tooth grooves are uniformly distributed on the lower surface of the retaining plate 523, a guiding motor 524 is installed on one side of the adjusting plate 52, an output shaft of the guiding motor 524 is connected with a fourth guide rod 525, the fourth guide rod 525 is placed on the inner side of the bottom of the adjusting plate 52, a connecting block 526 is connected with the outer threads of the fourth guide rod 525, a supporting rod 527 is inserted in the connecting block 526, a supporting wheel 5271 is installed at the top of the supporting rod 527, and the supporting rod 523 connected with the outer threads is further pushed to lift, so that the height of an action point under the processing head 53 is adjusted according to the thickness of a required package chip stitch, and the condition that the processing head 53 cannot reach the stitch or is broken is prevented.
The supporting wheel 5271 abuts against the surface of the tooth socket of the supporting plate 523, a second spring 529 is further disposed between the supporting wheel 5271 and the connecting block 526, a pressure sensor 5272 is mounted at the bottom of the supporting rod 527, the processing head 53 is in threaded connection with a force-bearing end of the pressure sensor 5272, and when the guiding motor 524 drives the fourth guiding rod 525 to push the connecting block 526 in external threaded connection to transversely drive, the supporting wheel 5271 mounted at the upper end of the supporting rod 527 rolls on the tooth socket at the bottom of the supporting plate 523, and under the action of the second spring 529 outside the supporting rod 527, the supporting rod 527 can complete continuous lifting movement according to the tooth socket of the supporting plate 523, so that the processing head 53 mounted at the bottom of the supporting rod 527 can complete continuous point heating operation above the pins of the package chip;
When the processing head 53 acts on the pins, the acting force generated by the processing head can monitor the acting force in real time through the acting end of the pressure sensor 5272, so as to judge whether the processing head 53 acts on the pins of the packaged chip or not and the acting force acts on the pins of the packaged chip, thereby preventing the situation that the processing head 53 is not in contact with the pins or presses the pins.
And branch 528 is still installed to the tip of connecting block 526, branch 528 is connected with the strap 5281 through the spring axle, the tip of strap 5281 is provided with scaling powder storehouse 534, the top one side of handling head 53 is connected with arc baffle 533, scaling powder storehouse 534 is close to one side of arc baffle 533 installs gyro wheel 5341, the surface of gyro wheel 5341 is contradicted with arc baffle 533, handling head 53 includes connector 531, electric soldering head 532 is installed to the end of connector 531, electric soldering head 532's lower surface is the level setting, and when handling head 53 goes up the in-process of activity along with the tooth's socket of strap 523, scaling powder storehouse 534 can move down to electric soldering head 532 along with arc baffle 533, and the inside scaling powder of scaling powder storehouse 534 can be contacted with electric soldering head 532 fast, for the scaling powder on the electric soldering head 532 point, improves the efficiency that even tin melts the carried away stitch to make the tin piece be carried outside that flows and form the package, because under the effect of tension stitch, with the tin between the continuous layer can separate.
The conveying belt 2 sequentially conveys the PCB circuit board 21 to the upper part of the clamping assembly 1, after the PCB circuit board 21 is centered and fixed by the clamping assembly 1, the centering positioning is realized by utilizing the positioning probe 44 to cooperate with the guide truss 3, and whether the pins of the packaged chip are connected with tin to be processed is judged, when the processing is needed, the packaged chip is adsorbed and fixed by the sucker 43, the pins are continuously fluctuated and conveyed by the processing head 53 of the pin processing assembly 5, the pins are continuously heated, tin is fused and adhered, tin drops are formed and wrapped on the surfaces of the pins, and the adhered pins are separated.
The lateral adjustment motor 513 and the longitudinal adjustment motor 521 are provided to adjust the processing head 53 according to the specifications of the pins of the required processing packaged chips so as to adapt to the processing requirements of the packaged chips with different sizes and different pin thicknesses.
When the processing head 53 moves up along with the tooth grooves of the resisting plate 523, the soldering flux bin 534 moves downwards along with the arc-shaped guide plate 533 to the electric soldering head 532, the soldering flux in the soldering flux bin 534 can quickly contact with the electric soldering head 532, the soldering flux is supplied to the electric soldering head 532, the efficiency of melting and being carried away is improved, and therefore the melted tin blocks are carried to the outside of the pins and form a coating layer, and the tin between the pins and the pins can be separated under the action of tension.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. The packaging chip pin tin bridge processing equipment is characterized by comprising a clamping assembly and a guide truss acting on the upper part of the clamping assembly, wherein a conveying belt is arranged on the clamping assembly, a PCB circuit board is guided by the conveying belt, and the clamping assembly is used for fixing the PCB circuit board;
The guide truss comprises an X-direction truss, a Y-direction truss and a Z-direction truss, a positioning component and a stitch processing component which is rotatably arranged on one side of the positioning component are arranged at the guide end of the Z-direction truss, and the guide truss is used for driving the positioning component and the stitch processing component to transfer along X, Y and Z-axis directions of a PCB (printed circuit board);
The positioning assembly comprises a sucker and a positioning probe, the positioning probe is used for visually judging the tin connection condition and positioning the position of the packaged chip on the PCB, and the packaged chip is adsorbed and positioned by the sucker matched with the guide truss;
the stitch processing assembly comprises an adjusting plate and a processing head, wherein the adjusting plate provides soldering flux for the processing head and drives the processing head to continuously undulate and guide, and is used for continuously heating the stitch to melt and adhere tin and form tin drops to wrap the surface of the stitch;
A longitudinal adjusting motor is arranged above the end part of the adjusting plate, and the inner bearings at two sides of the adjusting plate are connected with a third guide rod which is driven to synchronously rotate by the longitudinal adjusting motor;
the outer threads of the two third guide rods are connected with a retaining plate, and tooth grooves are uniformly distributed on the lower surface of the retaining plate;
A guide motor is arranged on one side of the adjusting plate, an output shaft of the guide motor is connected with a fourth guide rod, the fourth guide rod is arranged on the inner side of the bottom of the adjusting plate, and a connecting block is connected to the outer thread of the fourth guide rod;
A supporting rod is inserted into the connecting block, a supporting wheel is mounted at the top of the supporting rod, the supporting wheel is abutted against the tooth socket surface of the supporting plate, a second spring is further arranged between the supporting wheel and the connecting block, a pressure sensor is mounted at the bottom of the supporting rod, and the processing head is in threaded connection with a stress end of the pressure sensor;
The end part of the connecting block is also provided with a supporting rod, the supporting rod is connected with a butt strap through a spring shaft, and the end part of the butt strap is provided with a soldering flux bin;
the top one side of handling head is connected with the arc baffle, scaling powder storehouse is close to the gyro wheel is installed to one side of arc baffle, the surface of gyro wheel is contradicted with the arc baffle.
2. The tin bridge treatment equipment for the pins of the packaged chips according to claim 1, wherein the clamping assembly comprises a substrate, a limit motor arranged at the end part of the substrate, and two first guide rods connected to the bottom of the substrate through bearings, wherein the two first guide rods are synchronously driven to rotate through the limit motor, and end plates are sleeved outside the two ends of the two first guide rods;
the surfaces of the two ends of the first guide rod are respectively provided with a forward thread and a reverse thread, and the inner walls of the end plates at the two ends of the first guide rod are respectively provided with thread grooves meshed with the forward thread and the reverse thread.
3. The tin bridge treatment device for pin joints of packaged chips according to claim 2, wherein the top bearings of the two end plates are connected with a second guide rod, and clamping blocks are sleeved outside the two ends of the second guide rod;
The surfaces of the two ends of the second guide rod are respectively provided with a forward thread and a reverse thread, and the inner walls of the clamping blocks at the two ends of the second guide rod are respectively provided with thread grooves meshed with the forward thread and the reverse thread.
4. The tin bridge treatment device for pin joints of packaged chips according to claim 1, wherein the positioning assembly comprises a fixed seat, a telescopic cylinder is inserted in the fixed seat, the telescopic cylinder is hollow, the sucking disc is arranged at the bottom end of the telescopic cylinder, and the positioning probe is arranged at the top end of the telescopic cylinder;
The telescopic cylinder is arranged on the outer side of the upper part of the sucker in a sleeved mode and is provided with a first spring.
5. The tin bridge processing device for packaging chip pins according to claim 4, wherein the pin processing assembly comprises a direction-adjusting motor arranged in the fixing seat and a rotary table connected below the fixing seat through a bearing, and the rotary table is driven to rotate by the direction-adjusting motor.
6. The tin bridge treatment equipment for pin joints of packaged chips according to claim 5, wherein a support plate is arranged at the bottom of the turntable, a transverse adjusting motor is arranged at the end part of the support plate, rotating rods are connected in bearings at the inner parts of two sides of the support plate, and the two rotating rods are synchronously driven to rotate by the transverse adjusting motor;
The outside threaded connection of bull stick has the telescopic link, the regulating plate passes through the telescopic end connection of telescopic link.
7. The tin bridge treatment device for pin joints of packaged chips according to claim 1, wherein the treatment head comprises a connector, an electric soldering head is arranged at the tail end of the connector, and the lower surface of the electric soldering head is horizontally arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410167998.8A CN117715404B (en) | 2024-02-06 | 2024-02-06 | Packaging chip pin tin bridge processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410167998.8A CN117715404B (en) | 2024-02-06 | 2024-02-06 | Packaging chip pin tin bridge processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117715404A CN117715404A (en) | 2024-03-15 |
| CN117715404B true CN117715404B (en) | 2024-05-14 |
Family
ID=90161117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410167998.8A Active CN117715404B (en) | 2024-02-06 | 2024-02-06 | Packaging chip pin tin bridge processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117715404B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105312704A (en) * | 2015-11-05 | 2016-02-10 | 武汉凌云光电科技有限责任公司 | Self-flowing type soldering method and system used for laser welding |
| CN106270901A (en) * | 2016-09-30 | 2017-01-04 | 山东理工大学 | A kind of Multifunctional electric soldering iron head |
| CN113766766A (en) * | 2021-09-25 | 2021-12-07 | 怀化海红盛电子科技有限公司 | Automatic tin spraying device is used in PCB board production |
| CN216541290U (en) * | 2021-10-09 | 2022-05-17 | 温州职业技术学院 | Laser soft soldering device for integrated circuit development board |
| CN116352279A (en) * | 2023-05-31 | 2023-06-30 | 深圳市克洛诺斯科技有限公司 | PCB laser marking device |
| CN116713550A (en) * | 2023-07-19 | 2023-09-08 | 江西荣晖电子有限公司 | Spot welding device for PCB processing |
| CN117245165A (en) * | 2023-09-11 | 2023-12-19 | 扬州市职业大学(扬州开放大学) | Clamping wire feeder for electric soldering iron |
| CN117381095A (en) * | 2023-11-14 | 2024-01-12 | 上海航天电子有限公司 | Flexible automatic tin coating equipment based on vision |
-
2024
- 2024-02-06 CN CN202410167998.8A patent/CN117715404B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105312704A (en) * | 2015-11-05 | 2016-02-10 | 武汉凌云光电科技有限责任公司 | Self-flowing type soldering method and system used for laser welding |
| CN106270901A (en) * | 2016-09-30 | 2017-01-04 | 山东理工大学 | A kind of Multifunctional electric soldering iron head |
| CN113766766A (en) * | 2021-09-25 | 2021-12-07 | 怀化海红盛电子科技有限公司 | Automatic tin spraying device is used in PCB board production |
| CN216541290U (en) * | 2021-10-09 | 2022-05-17 | 温州职业技术学院 | Laser soft soldering device for integrated circuit development board |
| CN116352279A (en) * | 2023-05-31 | 2023-06-30 | 深圳市克洛诺斯科技有限公司 | PCB laser marking device |
| CN116713550A (en) * | 2023-07-19 | 2023-09-08 | 江西荣晖电子有限公司 | Spot welding device for PCB processing |
| CN117245165A (en) * | 2023-09-11 | 2023-12-19 | 扬州市职业大学(扬州开放大学) | Clamping wire feeder for electric soldering iron |
| CN117381095A (en) * | 2023-11-14 | 2024-01-12 | 上海航天电子有限公司 | Flexible automatic tin coating equipment based on vision |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117715404A (en) | 2024-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6288376B1 (en) | Method and apparatus for melting a bump by induction heating | |
| KR101576138B1 (en) | Soldering apparatus using induction heating | |
| KR100204171B1 (en) | Automatic stacking and soldering apparatus and a method for producing three dimensionally stacked package device | |
| CN1917745A (en) | Soldering apparatus and soldering method | |
| JP2015115427A (en) | Soldering device and method | |
| CN110548949A (en) | Wire bonding device and circuit board wire bonding machine | |
| JPS63193595A (en) | Method and apparatus for soldering printed board assembly | |
| CN117715404B (en) | Packaging chip pin tin bridge processing equipment | |
| CN105945481B (en) | A kind of automatic manufacturing method of semiconductor | |
| JP3860355B2 (en) | Method of forming solder bump | |
| CN108011276B (en) | Cutting welding tinning machine | |
| JP5853135B2 (en) | Electrode joining method and circuit member joining line | |
| CN211305121U (en) | Wire bonding device and circuit board wire bonding machine | |
| JP2001129664A (en) | Soldering iron, soldering method and soldering device | |
| JP2002076590A (en) | Component mounter, component mounting method, component mounting system and circuit board | |
| JPH11260859A (en) | Method for mounting semiconductor element | |
| JP6037300B2 (en) | Circuit member joint structure | |
| CN112687550A (en) | Semiconductor wafer packaging equipment for power chip production and production process | |
| JP2005150142A (en) | Method and apparatus for connecting | |
| JP2016203215A (en) | Joint method | |
| JP2008027954A (en) | Process for producing electronic component mounting substrate | |
| JP3254459B2 (en) | Micro solder supply method and micro solder supply device | |
| CN220196566U (en) | Feeding and discharging equipment for bottom plate reflow soldering | |
| CN214624980U (en) | Production line for semiconductor devices | |
| CN220278523U (en) | PCB board reflow soldering machine convenient to it is fixed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |