CN117715389A - Phase-change radiator and heat radiation system - Google Patents
Phase-change radiator and heat radiation system Download PDFInfo
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- CN117715389A CN117715389A CN202311826386.7A CN202311826386A CN117715389A CN 117715389 A CN117715389 A CN 117715389A CN 202311826386 A CN202311826386 A CN 202311826386A CN 117715389 A CN117715389 A CN 117715389A
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- phase change
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- evaporation
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- 230000005855 radiation Effects 0.000 title abstract description 7
- 238000001704 evaporation Methods 0.000 claims abstract description 94
- 230000008020 evaporation Effects 0.000 claims abstract description 80
- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 239000002826 coolant Substances 0.000 claims abstract description 49
- 230000005494 condensation Effects 0.000 claims abstract description 34
- 238000009833 condensation Methods 0.000 claims abstract description 34
- 230000002708 enhancing effect Effects 0.000 claims abstract description 11
- 230000001965 increasing effect Effects 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 239000012071 phase Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006262 metallic foam Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a phase-change radiator, which comprises a phase-change evaporation part, wherein an evaporation cavity for containing a cooling medium is formed, a heat dissipation enhancing structure in the evaporation cavity is positioned at one side of the phase-change evaporation part, which is attached to a heat source unit, and the heat dissipation enhancing structure is used for increasing the contact area between the evaporation cavity and the cooling medium; the phase change condensing part comprises a plurality of heat dissipation flat pipes, and fins and airflow holes are arranged between any adjacent heat dissipation flat pipes; the phase change evaporation part is communicated with the phase change condensation part through the steam pipe, and gaseous cooling medium flows into the phase change condensation part through the steam pipe; the liquid return pipe is used for connecting the phase change condensing part with the phase change evaporating part, and the liquid cooling medium returns to the phase change evaporating part through the liquid return pipe. The heat radiation enhancement structure improves the heat absorption efficiency of the phase change evaporation part, the fins increase the heat radiation area of the phase change condensation part, and the airflow holes enhance the surface air flow of the phase change condensation part, so that the heat radiation efficiency of the whole device is obviously improved. The invention also discloses a heat dissipation system.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a phase-change heat radiator and a heat dissipation system.
Background
With the high-speed development of new energy power, the power of an IGBT (Insulated Gate Bipolar Transistor ) chip and the like is improved, the heat productivity of the chip is also larger and larger, the heat dissipation requirement is also higher and higher, and the heat dissipation efficiency of the existing module radiator can not meet the requirement of high-power working operation of the IGBT chip.
Therefore, how to improve the heat dissipation efficiency of the heat sink to meet the requirement of high-power operation of the IGBT chip is a technical problem that needs to be solved by those skilled in the art at present.
Disclosure of Invention
Therefore, the invention aims to provide a phase change radiator, which can improve the radiating efficiency of the radiator so as to meet the requirement of high-power working operation of IGBT chips;
another object of the present invention is to provide a heat dissipation system having the above phase change heat sink.
In order to achieve the above object, the present invention provides the following technical solutions:
a phase change heat sink, comprising:
the phase change evaporation part is provided with an evaporation cavity for containing a cooling medium, a heat dissipation enhancing structure is arranged in the evaporation cavity, the heat dissipation enhancing structure is positioned on one side, attached to the heat source unit, of the phase change evaporation part, and the heat dissipation enhancing structure is used for increasing the contact area between the evaporation cavity and the cooling medium;
the phase change condensation part comprises a plurality of heat dissipation flat pipes, and fins and airflow holes are arranged between any adjacent heat dissipation flat pipes;
the phase change evaporation part is communicated with the phase change condensation part through the steam pipe, and a gaseous cooling medium flows into the phase change condensation part through the steam pipe;
and the phase-change condensing part is communicated with the phase-change evaporating part through the liquid return pipe, and the liquid cooling medium returns to the phase-change evaporating part through the liquid return pipe.
Optionally, in the above phase-change radiator, the heat dissipation enhancing structure includes a protrusion structure and a capillary structure, the protrusion structure extends in a direction away from the heat source unit, the protrusion structure is provided with a plurality of protrusions, each protrusion structure is arranged on an inner wall of the evaporation cavity at intervals, and the capillary structure is a porous mesh structure.
Optionally, in the above phase change radiator, the phase change condensation portion further includes a first collecting pipe and a second collecting pipe, one end of the heat dissipation flat pipe is communicated with the first collecting pipe, the other end of the heat dissipation flat pipe is communicated with the second collecting pipe, the steam pipe is communicated with the heat dissipation flat pipe through the first collecting pipe, the liquid return pipe is communicated with the heat dissipation flat pipe through the second collecting pipe, and the height of the first collecting pipe is higher than that of the second collecting pipe.
Optionally, in the phase-change radiator, the steam pipe and the liquid return pipe are both provided with a plurality of steam pipes, and a sum of pipe sectional areas of all the steam pipes is larger than a sum of pipe sectional areas of all the liquid return pipes.
Optionally, in the above phase-change radiator, the steam pipe is connected to a first side of the phase-change evaporation portion, the liquid return pipe is connected to an end of the phase-change evaporation portion, a connection position of the liquid return pipe and the phase-change evaporation portion is close to a second side of the phase-change evaporation portion relative to the first side of the phase-change evaporation portion, and a second side of the first side of the phase-change evaporation portion opposite to the phase-change condensation portion is close to the phase-change condensation portion.
Optionally, in the above phase-change radiator, air flow plates are disposed on two sides of the phase-change condensing portion, and extend in a direction away from the phase-change evaporating portion, so as to enhance the circulation capacity of air in the phase-change condensing portion.
Optionally, in the phase change radiator, a fan device is further included, and the fan device is connected to the airflow plate.
Optionally, in the above phase-change radiator, the phase-change condensing units are provided in plurality, and each phase-change condensing unit is connected to the phase-change evaporating unit in parallel or in series through the steam pipe and the liquid return pipe.
Optionally, in the above phase-change radiator, when each phase-change condensation portion is connected to the phase-change evaporation portion in parallel, each phase-change condensation portion is connected to the phase-change evaporation portion through a set of liquid return pipes.
When the phase-change radiator provided by the invention is used, the phase-change evaporation part is attached to the heat source unit, the cooling medium in the evaporation cavity exchanges heat with the heat source unit, so that the cooling medium is changed from a liquid state into a gaseous state, the temperature of the heat source unit is reduced, the cooling medium converted into the gaseous state flows into the heat dissipation flat tube in the phase-change condensation part through the steam tube and exchanges heat with the outside atmosphere again, the gaseous cooling medium is condensed into a liquid state, and the liquid condensing medium returns to the evaporation cavity of the phase-change evaporation part again through the liquid return tube to absorb the heat of the heat source unit again, so that the heat source unit is continuously cooled. Compared with the prior art, the evaporation cavity is also provided with the heat dissipation enhancement structure, the heat dissipation enhancement structure increases the outer surface of the inner cavity of the evaporation cavity, improves the contact area with the cooling medium, improves the heat conduction capacity of the phase-change evaporation part, accelerates the rapid absorption of heat of the heat source unit by the cooling medium, and improves the efficiency of the phase change of the cooling medium from the liquid state to the gas state. Meanwhile, fins are arranged between the heat dissipation flat pipes, the heat dissipation area of the phase change condensation part is increased through the fins, and the air flow holes strengthen the flow of the atmosphere on the surfaces of the heat dissipation flat pipes and the surfaces of the fins, so that the heat exchange between gaseous cooling medium in the heat dissipation flat pipes and the outside atmosphere is improved, the heat dissipation efficiency is obviously improved through the phase change heat radiator provided by the invention, the high-power working and running requirements of IGBT chips are met, and the normal running of the IGBT chips is ensured.
A heat dissipation system comprising a phase change heat sink, the phase change heat sink being a phase change heat sink as claimed in any one of the preceding claims.
The heat dissipation system provided by the invention has all the technical effects of the phase-change heat radiator because of the phase-change heat radiator, and is not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a phase-change radiator according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a bump structure and a capillary structure according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of A-A of FIG. 2;
fig. 4 is a schematic structural diagram of a fin according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating circulation of a cooling medium in a phase change radiator according to an embodiment of the present invention.
Wherein 100 is a phase change evaporation part, 110 is a convex structure, and 120 is a capillary structure;
200 is a phase change condensation part, 210 is a heat dissipation flat tube, 220 is a fin, 230 is a first collecting pipe, 240 is a second collecting pipe, and 250 is an air flow plate;
300 is a steam pipe;
400 is a return line.
Detailed Description
The core of the invention is to provide a phase-change radiator, which can improve the radiating efficiency of the radiator so as to meet the requirement of high-power working operation of IGBT chips;
another core of the present invention is to provide a heat dissipation system with the phase change heat sink.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1,2, and 4, an embodiment of the present invention discloses a phase change heat sink including a phase change evaporation part 100, a phase change condensation part 200, a steam pipe 300, and a liquid return pipe 400. The variable evaporation part 100 is of a cavity structure, an evaporation cavity for containing a cooling medium is formed in the variable evaporation part 100, and the variable evaporation part 100 is attached to the heat source unit, so that the cooling medium in the evaporation cavity absorbs heat generated by the heat source unit and changes from a liquid phase to a gas phase, and the heat source unit is cooled. Meanwhile, the heat radiation enhancement structure is arranged on one side, attached to the heat source unit, of the evaporation cavity, the area of the outer surface of the inner cavity of the evaporation cavity is increased through the heat radiation enhancement structure, the contact area with the cooling medium is increased, the heat conduction capacity is improved, and the heat absorption efficiency of the cooling medium is accelerated. The phase-change evaporation part 100 is communicated with the phase-change condensation part 200 through the steam pipe 300, so that gaseous cooling medium flows into the heat dissipation flat pipe 210 of the phase-change condensation part 200 through the steam pipe 300, the gaseous cooling medium exchanges heat with the external atmosphere through flowing in the heat dissipation flat pipe 210, the gaseous cooling medium is condensed into liquid cooling medium again, and the liquid cooling medium returns to the phase-change evaporation part 100 again through the liquid return pipe 400 to exchange heat with the heat source unit again. In order to improve the heat dissipation capability of the phase-change condensing portion 200, fins 220 and airflow holes are disposed between the heat dissipation flat tubes 210, the fins 220 increase the heat dissipation area of the heat dissipation flat tubes 210, the fins 220 may be configured as a windowed structure to further increase the heat dissipation area, the fins 220 are formed by folding, and the fins 220 are folded and simultaneously form two heat dissipation surfaces with airflow holes penetrating through the phase-change condensing portion 200, so as to enhance the fluidity of the external atmosphere on the outer surfaces of the heat dissipation flat tubes 210 and the fins 220, and further enhance the heat exchange efficiency of the gaseous cooling medium in the heat dissipation flat tubes 210 and the external atmosphere. In a specific embodiment, the cooling medium may be 1, 2-tetrafluoroethane (R134 a) or R1233ZD Refrigerant (R1233 ZD refrigeranty) or other variable materials, so as to realize variable phase heat dissipation and improve heat dissipation efficiency.
As shown in fig. 2 and 3, the heat dissipation enhancing structure provided in this embodiment includes a protrusion structure 110 and a capillary structure 120, where the protrusion structure 110 extends in a direction opposite to the heat source unit, the protrusion structure 110 is provided with a plurality of protrusions, each protrusion structure 110 is arranged on the inner wall of the evaporation cavity at intervals, the protrusion structure 110 not only increases the surface area of the inner cavity of the evaporation cavity, and improves the heat conduction efficiency and the heat absorption efficiency of the cooling medium, but also the protrusion structure 110 plays a role of a reinforcing structure. The capillary structure 120 may be made of metal heat conductive particles, metal foam, or the like, and is made into a porous capillary layer structure, and the capillary structure 120 is laid in the inner cavity of the phase-change evaporation portion 100 and located at one side attached to the heat source unit, so that the heat dissipation area of the phase-change evaporation portion 100 is further increased, the rapid boiling of the cooling medium can be effectively enhanced, and the heat absorbing capacity of the phase-change evaporation portion 100 to the heat source unit is improved. Or the capillary structure 120 may also be distributed over the evaporation cavity of the phase-change evaporation portion 100, so as to divide the evaporation cavity into a plurality of small cavities, which is more beneficial for the separation of the gaseous and liquid phases of the cooling medium. The capillary structure 120 may be fixed to the inner wall of the evaporation chamber by means of bonding or the like. In a specific embodiment, the protruding structures 110 may be cylindrical, diamond-shaped, or rectangular, and those skilled in the art can design the protruding structures 110 according to actual requirements, which are not listed herein.
As shown in fig. 1, the phase-change condensing unit 200 further includes a first collecting pipe 230 and a second collecting pipe 240, one end of each heat dissipating flat pipe 210 is connected to the first collecting pipe 230, the other end of each heat dissipating flat pipe 210 is connected to the second collecting pipe 240, wherein the vapor pipe 300 is connected to the first collecting pipe 230, the liquid return pipe 400 is connected to the second collecting pipe 240, and the phase-change condensing unit 200 is provided with an included angle with a horizontal plane, and the height of the first collecting pipe 230 in the phase-change condensing unit 200 is higher than that of the second collecting pipe 240, so that the gaseous cooling medium flows upward into the first collecting pipe 230 through the vapor pipe 300 and then flows into each heat dissipating flat pipe 210, and the liquid cooling medium formed by condensation in each heat dissipating flat pipe 210 is collected downward into the second collecting pipe 240 under the action of its own gravity and flows back into the evaporation cavity of the phase-change evaporating unit 100 through the liquid return pipe 400.
Further, the steam pipes 300 and the liquid return pipes 400 are provided with a plurality of steam pipes 300, and the sum of the pipe cross sections of all the steam pipes 300 is larger than the sum of the pipe cross sections of all the liquid return pipes 400, so that the flow rate of the gaseous cooling medium flowing into the phase-change condensing part 200 is larger than the flow rate of the liquid cooling medium flowing into the phase-change evaporating part 100, and therefore, a pressure difference exists between the phase-change evaporating part 100 and the phase-change condensing part 200 in the cooling medium circulation process, and the rapid circulation flow capacity of the cooling medium is further promoted through the pressure difference.
As shown in fig. 1 and 5, a side of the phase-change evaporation portion 100 near the phase-change condensation portion 200 is a first side, a side of the phase-change evaporation portion 100 far away from the phase-change condensation portion 200 is a second side, the steam pipe 300 is communicated with the first side of the phase-change evaporation portion 100, the liquid return pipe 400 is communicated with an end of the phase-change evaporation portion 100, and a connection position of the liquid return pipe 400 and the phase-change evaporation portion 100 is close to the second side of the phase-change evaporation portion 100 relative to the first side of the phase-change evaporation portion 100, so that a connection end of the liquid return pipe 400 and the phase-change evaporation portion 100 is far away from the first side of the phase-change evaporation portion 100 as much as possible, the end of the liquid return pipe 400 is immersed in a liquid cooling medium, and gaseous cooling medium is prevented from entering the liquid return pipe 400, and conveying capability of the liquid return pipe 400 is prevented from being affected.
So that the liquid cooling medium returned through the liquid return pipe 400 flows through the entire evaporation chamber as much as possible to ensure that the cooling medium exerts superior heat absorption capacity and enhance heat exchange efficiency with the heat source unit.
As shown in fig. 1, the two sides of the phase-change condensing portion 200 are respectively provided with an airflow plate 250, each airflow plate 250 extends towards the direction away from the phase-change evaporating portion 100, and the airflow plate 250 promotes the flowing capability of the air in the airflow holes in the phase-change condensing portion 200, so as to further promote the heat exchange efficiency of the gaseous cooling medium and the air in the phase-change condensing portion 200. Meanwhile, the phase change condensation part 200 is provided with a certain equal included angle with the vertical plane, the phase change condensation part 200 is in an inclined state, the first collecting pipe 230 connected with the steam pipe 300 is positioned at the upper end, the second collecting pipe 240 connected with the liquid return pipe 400 is positioned at the lower end, liquid cooling medium can be prevented from being accumulated in the heat dissipation flat pipe 210 through the arrangement mode, liquid cooling medium in the heat dissipation flat pipe 210 is facilitated to be quickly collected into the second collecting pipe 240, the rate of circulating heat dissipation is improved by returning to the phase change evaporation part 100 through the liquid return pipe 400, meanwhile, the heat dissipation area is increased, and the overall heat dissipation efficiency is further improved.
In a specific embodiment, the phase-change radiator provided in this embodiment is further provided with a fan device, the airflow plate 250 is provided with a mounting hole, the fan device is mounted on the airflow plate 250 through the mounting hole, and the flow of the air on the outer surface of the heat dissipation flat tube 210, the outer surface of the fin 220 and the airflow hole is further promoted by the fan device.
In another specific embodiment, a plurality of phase change condensing units 200 are provided, and each phase change condensing unit 200 is connected with the phase change evaporating unit 100 in parallel or in series through the steam pipe 300 and the liquid return pipe 400, so that the heat dissipation capability of the phase change radiator provided in this embodiment can be further enhanced.
When each phase-change condensation portion 200 is connected to the phase-change evaporation portion 100 in parallel, each heat dissipation flat tube 210 of each phase-change condensation portion 200 may be connected to one second collecting tube 240, so that the cooling medium condensed into a liquid state by each phase-change condensation portion 200 flows back to the evaporation cavity of the phase-change evaporation portion 100 through the same set of liquid return tubes 400. In a specific embodiment, the number of the phase-change condensing units 200 is two, an included angle is formed between the two phase-change condensing units 200, and the included angle may be between 30 ° and 45 °, so that a Y-shaped structure is integrally formed. And may be connected in series when the respective phase change condensing units 200 are in the same plane.
The embodiment of the invention also discloses a heat dissipation system which comprises the phase-change heat radiator. Since the heat dissipation system has the phase-change heat sink, the heat dissipation system has all the technical effects of the phase-change heat sink, and is not described herein again.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.
Wherein, in the description of the embodiments of the present application, "/" means or is meant unless otherwise indicated, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "plurality" means two or more than two.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the core concepts of the invention. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (10)
1. A phase change heat sink, comprising:
the phase change evaporation part (100) is provided with an evaporation cavity for containing a cooling medium, a heat dissipation enhancing structure is arranged in the evaporation cavity, the heat dissipation enhancing structure is positioned at one side of the phase change evaporation part (100) attached to the heat source unit, and the heat dissipation enhancing structure is used for increasing the contact area between the evaporation cavity and the cooling medium;
the phase change condensation part (200) comprises a plurality of heat dissipation flat pipes (210), and fins (220) and airflow holes are arranged between any two adjacent heat dissipation flat pipes (210);
a steam pipe (300), wherein the phase-change evaporation part (100) is communicated with the phase-change condensation part (200) through the steam pipe (300), and a gaseous cooling medium flows into the phase-change condensation part (200) through the steam pipe (300);
and the liquid return pipe (400), the phase change condensation part (200) is communicated with the phase change evaporation part (100) through the liquid return pipe (400), and the liquid cooling medium returns to the phase change evaporation part (100) through the liquid return pipe (400).
2. The phase-change radiator according to claim 1, wherein the heat dissipation enhancing structure includes a protrusion structure (110) and a capillary structure (120), the protrusion structure (110) extends in a direction away from the heat source unit, the protrusion structure (110) is provided in plurality, each protrusion structure (110) is arranged on an inner wall of the evaporation cavity at intervals, and the capillary structure (120) is a porous mesh structure.
3. The phase change radiator according to claim 1, wherein the phase change condensing unit (200) further comprises a first header (230) and a second header (240), one end of the heat dissipation flat tube (210) is communicated with the first header (230), the other end of the heat dissipation flat tube (210) is communicated with the second header (240), the steam tube (300) is communicated with the heat dissipation flat tube (210) through the first header (230), the liquid return tube (400) is communicated with the heat dissipation flat tube (210) through the second header (240), and the height of the first header (230) is higher than that of the second header (240).
4. The phase-change radiator according to claim 1, wherein the steam pipe (300) and the liquid return pipe (400) are each provided in plurality, and a sum of pipe sectional areas of all the steam pipes (300) is larger than a sum of pipe sectional areas of all the liquid return pipes (400).
5. The phase change radiator according to claim 1, wherein the steam pipe (300) is connected to a first side of the phase change evaporation portion (100), the liquid return pipe (400) is connected to an end of the phase change evaporation portion (100), and a connection position of the liquid return pipe (400) and the phase change evaporation portion (100) is close to a second side of the phase change evaporation portion (100) with respect to the first side of the phase change evaporation portion (100), and a second side of the first side of the phase change evaporation portion (100) with respect to the phase change condensation portion (200) is close to the phase change condensation portion (200).
6. The phase change radiator according to claim 1, wherein both sides of the phase change condensation portion (200) are provided with air flow plates (250), the air flow plates (250) extending in a direction away from the phase change evaporation portion (100) to enhance the circulation capacity of the atmosphere in the phase change condensation portion (200) by the air flow plates (250).
7. The phase change heat sink of claim 6, further comprising a fan device connected to the airflow plate (250).
8. The phase change radiator according to any one of claims 1 to 7, wherein a plurality of the phase change condensing units (200) are provided, and each of the phase change condensing units (200) is connected to the phase change evaporating unit (100) in parallel or in series through the steam pipe (300) and the liquid return pipe (400).
9. The phase change radiator according to claim 8, wherein each phase change condensing portion (200) is in communication with the phase change evaporating portion (100) through a set of the liquid return pipes (400) when each phase change condensing portion (200) is in parallel communication with the phase change evaporating portion (100).
10. A heat dissipation system comprising a phase change heat sink, the phase change heat sink being as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826386.7A CN117715389A (en) | 2023-12-27 | 2023-12-27 | Phase-change radiator and heat radiation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826386.7A CN117715389A (en) | 2023-12-27 | 2023-12-27 | Phase-change radiator and heat radiation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117715389A true CN117715389A (en) | 2024-03-15 |
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ID=90149791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311826386.7A Pending CN117715389A (en) | 2023-12-27 | 2023-12-27 | Phase-change radiator and heat radiation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117715389A (en) |
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2023
- 2023-12-27 CN CN202311826386.7A patent/CN117715389A/en active Pending
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