CN117711697A - Conductive material with piezoelectric sensing response and preparation method and application thereof - Google Patents
Conductive material with piezoelectric sensing response and preparation method and application thereof Download PDFInfo
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- CN117711697A CN117711697A CN202311661808.XA CN202311661808A CN117711697A CN 117711697 A CN117711697 A CN 117711697A CN 202311661808 A CN202311661808 A CN 202311661808A CN 117711697 A CN117711697 A CN 117711697A
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- conductive material
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- silica gel
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- 239000004020 conductor Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000741 silica gel Substances 0.000 claims abstract description 36
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 36
- 229920005839 ecoflex® Polymers 0.000 claims abstract description 32
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 6
- 239000002131 composite material Substances 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005303 weighing Methods 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of new materials, in particular to a conductive material with piezoelectric sensing response, and a preparation method and application thereof. The preparation method of the conductive material comprises the following steps: (1) Mixing the Ecoflex silica gel A component with liquid metal to obtain a first mixture; (2) The Ecoflex silica gel B component, nickel powder and the first mixture were mixed and then vacuum pressed. The invention provides a brand-new preparation method of a conductive material, and the conductive material prepared by the method has good elasticity, flexibility and stretchability; the pressure sensor made of the composite material has the maximum resistance value in a relaxation state, and the conductivity is gradually increased along with the increase of the applied pressure, so that the pressure sensitivity and the stability are good.
Description
Technical Field
The invention relates to the technical field of new materials, in particular to a conductive material with piezoelectric sensing response, and a preparation method and application thereof.
Background
Currently, researchers attach a resistive strain gauge to a specific surface of an elastic element to obtain a resistive pressure sensor, and when physical quantities such as force, torque, speed, acceleration, flow rate and the like act on the elastic element, the physical quantities cause changes in element stress and strain, and further cause changes in resistance of the resistive strain gauge. In the prior art, conductive materials are mostly used as materials for manufacturing the resistive pressure sensor, however, the existing conductive materials have insufficient elasticity, and the problem of dry cracking is easy to occur under the action of external force, so that the risk of open circuit is caused.
In view of this, the present invention has been made.
Disclosure of Invention
The invention provides a brand new preparation method of a conductive material, the conductive material prepared by the method and application thereof.
As a first object of the present invention, there is provided a method for producing a conductive material, comprising the steps of:
(1) Mixing the Ecoflex silica gel A component with liquid metal to obtain a first mixture;
(2) The Ecoflex silica gel B component, nickel powder and the first mixture were mixed and then vacuum pressed.
In the prior art, a stretchable conductive material or a metal conductor material with a cavity structure is mostly adopted as a material for manufacturing the pressure sensor, but on one hand, the stretchable conductive material with the cavity structure is easy to oxidize or leak; on the other hand, the metal conductor material is insufficient in elasticity, which results in poor stretchability, which results in instability of the pressure sensor.
The invention discovers that the conductive material prepared in the mode has good elasticity, flexibility and stretchability; the pressure sensor made of the composite material has the maximum resistance value in a relaxation state, and the conductivity is gradually increased along with the increase of the applied pressure, so that the pressure sensitivity and the stability are good.
The liquid metals described herein include, but are not limited to, gallium, indium, tin, zinc, bismuth, gold, silver, iron, nickel, aluminum, graphene, silver-coated copper powder, and especially gallium and/or indium and/or tin.
Preferably, the mass ratio of the Ecoflex silica gel a component to the liquid metal is 1: (1-5).
More preferably, the mass ratio of the Ecoflex silica gel a component to the liquid metal is 1:2.
preferably, the mass ratio of the silica gel B component to the nickel powder is 1: (2-7).
More preferably, the mass ratio of the silica gel B component to the nickel powder is 1:4.
preferably, the mass ratio of the Ecoflex silica gel a component to the Ecoflex silica gel B component is 1:1.
in the invention, the mass ratio of the Ecoflex silica gel A component to the liquid metal is controlled to be 1:1-5 (especially 1:2), and controlling the mass ratio of the silica gel B component to the nickel powder to be 1:2-7 (especially 1:4), and the mass ratio of the Ecoflex silica gel A component to the Ecoflex silica gel B component is 1:1, the prepared conductive material has better elasticity, flexibility and stretchability.
Preferably, the mixing is carried out under vacuum at 1500-2500rpm for 3-8min; the mixing in the mode is beneficial to improving the uniformity and the conductivity of the product.
Preferably, the vacuum pressing specifically comprises: firstly, keeping for 5-15min under 101+/-3 KPa, and then pressing for 3-8min under 5000-12000N; according to the method, the internal bubbles of the product can be effectively removed by vacuum pressing, so that the sample is more compact, and particularly, the liquid metal can be distributed more uniformly, and the conductivity is improved.
Preferably, the preparation method further comprises a step of curing; the curing is specifically as follows: the product after vacuum pressing is cured for 5-7h at room temperature (25+ -5deg.C).
As a preferred technical scheme of the invention, the preparation method comprises the following steps:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1: (1-5) mixing at 1500-2500rpm under vacuum for 3-8min to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1: (2-7) mixing with the first mixture under vacuum at 1500-2500rpm for 3-8min to obtain a second mixture;
(3) Maintaining the second mixture at 101+ -3 KPa for 5-15min, and pressing at 5000-12000N for 3-8min;
(4) And (3) curing the product obtained in the step (3) for 5-7h at room temperature.
The conductive material prepared in the above manner has better conductivity under deformation conditions.
As a second object of the present invention, there is provided a conductive material manufactured by the above method.
As a third object of the present invention, there is provided the use of the above-described conductive material in an electronic device; preferably, the electronic device is a pressure sensor; more preferably, the electronic device is a resistive pressure sensor.
The invention has the beneficial effects that:
the invention provides a brand-new preparation method of a conductive material, and the conductive material prepared by the method has good elasticity, flexibility and stretchability; the pressure sensor made of the composite material has the maximum resistance value in a relaxation state, and the conductivity is gradually increased along with the increase of the applied pressure, so that the pressure sensitivity and the stability are good.
Drawings
FIG. 1 is a pressure-resistance diagram for each pressure sensor in test example 2;
FIG. 2 is a pressure-resistance diagram for each pressure sensor in test example 3;
FIG. 3 is a graph of resistance versus time for each pressure sensor in test example 4;
FIG. 4 is an SEM image of the surface and cross-section of the conductive material of example 2;
fig. 5 is an SEM image of the surface and cross section of the conductive material of comparative example 3.
Detailed Description
The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
The specific techniques or conditions are not identified in the examples and are described in the literature in this field or are carried out in accordance with the product specifications. The reagents or equipment used were conventional products available for purchase by regular vendors without the manufacturer's attention.
Example 1
The embodiment provides a conductive material, and the preparation method of the conductive material is as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:2 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:5 mixing the first mixture with the second mixture for 5min at 2000rpm under vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a die with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 9000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Example 2
The embodiment provides a conductive material, and the preparation method of the conductive material is as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:2 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:4 mixing the first mixture with the second mixture for 5min at 2000rpm under vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a die with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 5000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Example 3
The embodiment provides a conductive material, and the preparation method of the conductive material is as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:3 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:3.5 mixing with the first mixture under vacuum at 2000rpm for 5min to obtain a second mixture;
(3) Pouring the second mixture into a mould with the thickness of 1 millimeter, putting the mould into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 12000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Example 4
The embodiment provides a conductive material, and the preparation method of the conductive material is as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:4, weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:3 mixing the first mixture with the second mixture for 5min at 2000rpm under vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a die with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 10000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Example 5
The embodiment provides a conductive material, and the preparation method of the conductive material is as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:2 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:2 mixing the first mixture with the second mixture for 5min at 2000rpm under vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a mould with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 7000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Comparative example 1
The comparative example provides a conductive material, which is prepared as follows:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1:2 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1:1 and the first mixture are mixed for 5min at 2000rpm under the vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a die with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 5000N;
(4) And (3) curing the product obtained in the step (3) for 6 hours at room temperature to obtain the product.
Comparative example 2
The comparative example provides a conductive material, which is prepared as follows:
(1) 1/2 part of PDMS and liquid metal are mixed according to the mass ratio of 1:2 weighing, putting into a small bottle with the diameter of 5cm, and mixing for 5min at 2000rpm under vacuum condition to obtain a first mixture;
(2) Mixing the rest PDMS and nickel powder according to a mass ratio of 1:4 mixing the first mixture with the second mixture for 5min at 2000rpm under vacuum condition to obtain a second mixture;
(3) Pouring the second mixture into a die with the thickness of 1 mm, putting into a vacuum pressing machine, firstly keeping for 10min at 101KPa, and then pressing for 5min at 5000N;
(4) And (3) curing the product obtained in the step (3) for 1h at the temperature of 60 ℃ to obtain the product.
Comparative example 3
This comparative example provides a conductive material, which is different from example 2 in the preparation method thereof: in step (3), the second mixture is poured into a mold having a thickness of 1 mm, and then directly pressed with a cover plate.
Test example 1
In the test example, the conductive materials of the examples 1-5 and the comparative examples 1-2 are respectively manufactured into pressure sensors, weights of 30g, 50g, 100g, 300g, 500g, 1000g and 2000g are respectively applied to the pressure sensors, and meanwhile, the resistance is tested by using a universal meter; the results are shown in Table 1.
TABLE 1
| 30g | 50g | 100g | 300g | 500g | 1000g | 2000g | |
| Example 1 | 20MΩ | 12MΩ | 1.5MΩ | 7.8kΩ | 1.5kΩ | 20Ω | 6Ω |
| Example 2 | 1.6MΩ | 225kΩ | 20kΩ | 806Ω | 40Ω | 20Ω | 20Ω |
| Example 3 | 18MΩ | 14MΩ | 6MΩ | 110kΩ | 13kΩ | 2.3kΩ | 16Ω |
| Example 4 | - | - | - | 7MΩ | 153kΩ | 50kΩ | 533Ω |
| Example 5 | 30MΩ | 17MΩ | 20kΩ | 7kΩ | 600Ω | 300Ω | 25Ω |
| Comparative example 1 | - | - | - | - | - | - | - |
| Comparative example 2 | - | - | - | - | - | 40MΩ | 36MΩ |
Note that: "-" indicates that no resistance value was tested.
Test example 2
The conductive materials of the embodiments 1-3 are respectively manufactured into pressure sensors, then different pressures are circularly applied to the pressure sensors, and meanwhile, a universal meter is used for testing the resistance; the results are shown in FIG. 1.
Test example 3
The conductive materials of examples 1-5 are respectively manufactured into pressure sensors, then different pressures are applied to the pressure sensors, and meanwhile, a universal meter is used for testing resistance; the results are shown in FIG. 2.
Test example 4
In the test example, the conductive materials of the examples 1-5 and the comparative examples 1-2 are respectively manufactured into pressure sensors, then the same pressure is applied to each pressure sensor for a long time, and simultaneously, the resistance of different time periods is tested by using a universal meter; the results are shown in FIG. 3.
Test example 5
In this test example, SEM photographing was performed on the surface and cross section of the conductive material obtained in example 2 and comparative example 3, respectively, as shown in fig. 4 and 5; as can be seen from fig. 4 and 5, the conductive material of example 2 has a more uniform texture, and in particular, the liquid metal is uniformly distributed therein.
In addition, SEM photographing is performed on the conductive material of other embodiments, and the conductive material has the same effects as those of embodiment 2, and the description is not given for the sake of brevity.
While the invention has been described in detail in the foregoing general description and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.
Claims (10)
1. A method for preparing a conductive material, comprising the steps of:
(1) Mixing the Ecoflex silica gel A component with liquid metal to obtain a first mixture;
(2) The Ecoflex silica gel B component, nickel powder and the first mixture were mixed and then vacuum pressed.
2. The preparation method according to claim 1, wherein the mass ratio of the Ecoflex silica gel a component to the liquid metal is 1: (1-5).
3. The preparation method according to claim 1, wherein the mass ratio of the silica gel B component to the nickel powder is 1: (2-7).
4. A method according to any one of claims 1 to 3, wherein the mass ratio of the Ecoflex silica gel a component to the Ecoflex silica gel B component is 1:1.
5. the method of claim 1, wherein the mixing is performed under vacuum at 1500-2500rpm for 3-8min.
6. The preparation method according to claim 1, wherein the vacuum pressing is specifically: firstly, keeping for 5-15min under 101+ -3 KPa, and then pressing for 3-8min under 5000-12000N.
7. The method of any one of claims 1-6, further comprising the step of curing; the curing is specifically as follows: and curing the product after vacuum pressing for 5-7h at room temperature.
8. The method of manufacturing according to claim 1, comprising the steps of:
(1) The Ecoflex silica gel A component and liquid metal are mixed according to the mass ratio of 1: (1-5) mixing at 1500-2500rpm under vacuum for 3-8min to obtain a first mixture;
(2) The Ecoflex silica gel B component and nickel powder are mixed according to the mass ratio of 1: (2-7) mixing with the first mixture under vacuum at 1500-2500rpm for 3-8min to obtain a second mixture;
(3) Maintaining the second mixture at 101+ -3 KPa for 5-15min, and pressing at 5000-12000N for 3-8min;
(4) And (3) curing the product obtained in the step (3) for 5-7h at room temperature.
9. An electrically conductive material, characterized in that it is obtainable by the method according to any one of claims 1-8.
10. Use of the conductive material of claim 9 in an electronic device; preferably, the electronic device is a pressure sensor; more preferably, the electronic device is a resistive pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311661808.XA CN117711697A (en) | 2023-12-06 | 2023-12-06 | Conductive material with piezoelectric sensing response and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311661808.XA CN117711697A (en) | 2023-12-06 | 2023-12-06 | Conductive material with piezoelectric sensing response and preparation method and application thereof |
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| Publication Number | Publication Date |
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| CN117711697A true CN117711697A (en) | 2024-03-15 |
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| CN202311661808.XA Pending CN117711697A (en) | 2023-12-06 | 2023-12-06 | Conductive material with piezoelectric sensing response and preparation method and application thereof |
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| Country | Link |
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