CN117706143A - Concentric double-spring double-head double-acting semiconductor test probe - Google Patents
Concentric double-spring double-head double-acting semiconductor test probe Download PDFInfo
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- CN117706143A CN117706143A CN202311646960.0A CN202311646960A CN117706143A CN 117706143 A CN117706143 A CN 117706143A CN 202311646960 A CN202311646960 A CN 202311646960A CN 117706143 A CN117706143 A CN 117706143A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
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Abstract
The invention discloses a concentric double-spring double-head double-acting semiconductor test probe which comprises a needle tube, wherein one end of the needle tube is provided with an output end needle head in a telescopic manner, the other end of the needle tube is provided with a test needle head in a telescopic manner, a first spring and a second spring are arranged in the needle tube, the first spring and the second spring are arranged between the output end needle head and the test needle head, and the first spring is concentrically arranged outside the second spring. The concentric double-spring double-head double-acting semiconductor test probe solves the problems that when the traditional semiconductor test probe is used, the current, the resistance and other test data in the test process are inaccurate due to the instantaneous disconnection phenomenon generated between the movable needle head and the spring, the test precision of the semiconductor test probe and the test application range of the semiconductor test probe are seriously affected, and the probe cannot be used under the precision test requirement.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a concentric double-spring double-head double-acting semiconductor test probe.
Background
The semiconductor test probe is widely applied to the technical fields of chips, mobile phones, computers, consumer electronics and the like, and is a high-end electronic element with very strict test requirements.
The structure of the semiconductor test probe is generally composed of a needle shaft, a needle tube and a spring, wherein the needle shaft and the spring are arranged in the needle tube, and the needle shaft and the spring are kept in the needle tube to form an integral structure by a compression riveting necking mode or a dotting mode with one end compressed necking and the other end. When the device is used, the spring is compressed into the needle tube under the action of the stress of the needle shaft, and the elastic force generated by the spring props against the needle shaft, so that the needle shaft is in good contact with a tested piece for testing.
However, when the conventional semiconductor test probe is used, the current, resistance and other test data in the test process are inaccurate due to the instantaneous disconnection phenomenon generated between the movable needle and the spring, so that the test precision of the semiconductor test probe and the test applicable range of the semiconductor test probe are seriously affected, and the problem that the semiconductor test probe cannot be used under the precision test requirement is caused.
Disclosure of Invention
The invention aims to provide a concentric double-spring double-head double-acting semiconductor test probe, which solves the problems that when the conventional semiconductor test probe is used, the current, the resistance and other test data in the test process are inaccurate due to the instant disconnection phenomenon generated between a movable needle and a spring, so that the test precision of the semiconductor test probe and the test application range of the semiconductor test probe are seriously affected, and the semiconductor test probe cannot be used under the precision test requirement.
In order to solve the technical problems, the invention discloses a concentric double-spring double-head double-acting semiconductor test probe which comprises a needle tube, wherein one end of the needle tube is provided with an output end needle head in a telescopic manner, the other end of the needle tube is provided with a test needle head in a telescopic manner, a first spring and a second spring are arranged in the needle tube, the first spring and the second spring are arranged between the output end needle head and the test needle head, and the first spring is concentrically arranged outside the second spring.
The technical scheme of the invention also has the following characteristics:
as a preferable scheme of the invention, the tail parts of the test needle head and the output end needle head are respectively provided with blind holes, and two ends of the second spring are respectively arranged in the two blind holes.
As a preferable mode of the present invention, the first spring and the second spring are both compression springs.
As a preferable scheme of the invention, the two ends of the needle tube are provided with the necking, the outer diameters of the tail part of the test needle head and the tail part of the output end needle head are larger than the inner diameter of the necking, and the outer diameters of the rod parts of the test needle head and the output end needle head are smaller than the inner diameter of the necking.
As a preferred embodiment of the present invention, the elastic coefficient of the first spring is greater than that of the second spring.
The invention has the beneficial effects that: according to the concentric double-spring double-head double-acting semiconductor test probe, in the use process, no matter how the pressing down speed or the rebound speed is changed, the needles at the two ends are reliably contacted with the connecting springs at any time, so that the phenomenon of instantaneous disconnection cannot occur; the compression spring provides test elasticity for the probe so as to ensure the test service life of the probe, so that the semiconductor test probe can meet the applicable requirements of certain vibration environments and quick test environments, and the test performance and the application range of the semiconductor test probe can be well ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a concentric double-spring double-ended double-acting semiconductor test probe according to the present invention.
In the figure: 1. the needle tube, the output end needle head, the second spring, the first spring and the test needle head are respectively arranged in the needle tube, the output end needle head, the second spring, the first spring and the test needle head.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in fig. 1, the concentric double-spring double-head double-acting semiconductor test probe comprises a needle tube 1, wherein one end of the needle tube 1 is provided with an output end needle head 2 in a telescopic manner, the other end of the needle tube 1 is provided with a test needle head 5 in a telescopic manner, a first spring 4 and a second spring 3 are arranged in the needle tube 1, the first spring 4 and the second spring 3 are arranged between the output end needle head 2 and the test needle head 5, and the first spring 4 is concentrically arranged outside the second spring 3.
Wherein: the needle tube 1 is a carrier of a semiconductor test probe and is used for bearing an output end needle head 2, a second spring 3, a first spring 4 and a test needle head 5; the needle 2 at the output end is placed in the needle tube 1, one end of the needle is respectively contacted with the second spring 3 and the first spring 4, and the needle is limited in the needle tube 1 by using a compression riveting way; the second spring 3 is arranged in the needle tube 1, and two ends of the second spring 3 are respectively in close contact with the needle head 2 at the output end and the test needle head 5; the first spring 4 is arranged in the needle tube 1, and two ends of the first spring 4 are respectively contacted with the needle head 2 at the output end and the test needle head 5; the test needle 5 is arranged in the needle tube 1, one end of the test needle is respectively contacted with the second spring 3 and the first spring 4, and the test needle is limited in the needle tube 1 in a mode of wrapping the mouth of the needle tube 1.
During the use, the semiconductor test probe is installed and is constituteed test module in test fixture, output syringe needle 2 and output contact, test syringe needle 5 and the contact of product that awaits measuring when test module is close to the product that awaits measuring, this process continues to carry out and keeps away from the product that awaits measuring gradually after reaching the settlement pressure value, because second spring 3 both ends respectively with output syringe needle 2 and test syringe needle 5 one side tight fit, consequently can keep reliable contact constantly and can not take place the phenomenon of instantaneous disconnection, and can satisfy the application requirement of certain vibrations environment, consequently the testing performance and the application scope of assurance semiconductor test probe that can be fine.
Example 2
As shown in fig. 1, unlike in embodiment 1, in embodiment 2, blind holes are formed in the tail portions of the test needle 5 and the output needle 2, and two ends of the second spring 3 are respectively disposed in the two blind holes.
This design ensures that the second spring 3 is always constrained between the test needle 5 and the output needle 2, ensuring the stability of the connection between the two. The falling phenomenon can not occur in the test process under any condition, so that the semiconductor test probe can be ensured to be well contacted between the needles at two sides in the use process, the instant breaking phenomenon can not occur, and the test precision of the semiconductor test probe is further ensured.
Example 3
As shown in fig. 1, unlike in embodiment 1, in embodiment 3, the first spring 4 and the second spring 3 are both compression springs, and the elastic modulus of the first spring 4 is larger than that of the second spring 3.
The elastic coefficient of the second spring 3 is far smaller than that of the first spring 4, the second spring 3 is used for guaranteeing that the output end needle head 2 and the test needle head 5 are in a tight fit state at any time in the probe test process, and further guaranteeing that the transient disconnection phenomenon cannot occur in the test process, and the first spring 4 is used for providing test elastic force for the semiconductor test probe.
The second spring force is very small, and the force generated in the testing process is negligible, so that the elastic force of the semiconductor testing probe in the testing process cannot be influenced under any testing condition, and the testing precision of the semiconductor testing probe is further ensured. It should be noted that the second spring is gold-plated, and has a very low resistance value, so that the test accuracy of the semiconductor test probe can be further ensured.
The first spring is mainly used for providing test elasticity for the probe, and guaranteeing that the needles at two ends can smoothly finish the test in the test process and can recover to a free state after the test is finished, so that the test service life and the test performance of the semiconductor test probe can be well guaranteed. It should be noted that: because the elastic coefficient of the first spring is far greater than that of the connecting spring, the elastic force generated by the second spring in the test process can be ignored, so that the test precision of the probe is ensured under the combined action of the two springs by the semiconductor test probe, and the probe can be ensured to have a wider test environment.
Example 4
As shown in fig. 1, unlike in embodiment 1, in embodiment 4, the two ends of the needle tube 1 of the concentric double-spring double-head double-acting semiconductor test probe of the present invention are formed with the shrinkage openings, the outer diameters of the tail portion of the test needle 5 and the tail portion of the output end needle 2 are both larger than the inner diameter of the shrinkage opening, and the outer diameters of the stem portions of the test needle 5 and the output end needle 2 are smaller than the inner diameter of the shrinkage opening.
By such design, it is possible to ensure that the assembly of the test needle 5 and the output needle 2 is completed quickly at the lowest cost, ensuring that both are telescopically assembled at both ends of the needle tube 1, respectively.
Therefore, compared with the existing test probes, the concentric double-spring double-head double-acting semiconductor test probe has the advantages that in the use process, no matter how the pressing down speed or the rebound speed changes, the needles at the two ends are reliably contacted with the connecting springs at any time, so that the phenomenon of instantaneous disconnection can not occur; the compression spring provides test elasticity for the probe so as to ensure the test service life of the probe, so that the semiconductor test probe can meet the applicable requirements of certain vibration environments and quick test environments, and the test performance and the application range of the semiconductor test probe can be well ensured.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (5)
1. The utility model provides a concentric double-spring double-end double-acting semiconductor test probe, its characterized in that, includes needle tubing (1), the one end of needle tubing (1) is provided with output syringe needle (2) telescopically, and the other end is provided with test syringe needle (5) telescopically, is provided with first spring (4) and second spring (3) in needle tubing (1), and first spring (4) and second spring (3) are arranged between output syringe needle (2) and test syringe needle (5), and first spring (4) concentric arrangement is in the outside of second spring (3).
2. The concentric double-spring double-head double-acting semiconductor test probe according to claim 1, wherein the tail parts of the test needle head (5) and the output end needle head (2) are provided with blind holes, and the two ends of the second spring (3) are respectively arranged in the two blind holes.
3. The concentric double-spring double-ended double-acting semiconductor test probe according to claim 2, characterized in that the first spring (4) and the second spring (3) are both compression springs.
4. A concentric double-spring double-head double-acting semiconductor test probe according to claim 3, characterized in that the two ends of the needle tube (1) are provided with necking, the outer diameters of the tail part of the test needle head (5) and the tail part of the output end needle head (2) are larger than the inner diameter of the necking, and the outer diameters of the rod parts of the test needle head (5) and the output end needle head (2) are smaller than the inner diameter of the necking.
5. The concentric double-spring double-ended double-acting semiconductor test probe according to claim 4, characterized in that the spring force coefficient of the first spring (4) is greater than the spring force coefficient of the second spring (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311646960.0A CN117706143A (en) | 2023-12-04 | 2023-12-04 | Concentric double-spring double-head double-acting semiconductor test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311646960.0A CN117706143A (en) | 2023-12-04 | 2023-12-04 | Concentric double-spring double-head double-acting semiconductor test probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117706143A true CN117706143A (en) | 2024-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311646960.0A Pending CN117706143A (en) | 2023-12-04 | 2023-12-04 | Concentric double-spring double-head double-acting semiconductor test probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117706143A (en) |
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2023
- 2023-12-04 CN CN202311646960.0A patent/CN117706143A/en active Pending
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