CN116754813A - Semiconductor test probe for via inspection - Google Patents
Semiconductor test probe for via inspection Download PDFInfo
- Publication number
- CN116754813A CN116754813A CN202310859968.9A CN202310859968A CN116754813A CN 116754813 A CN116754813 A CN 116754813A CN 202310859968 A CN202310859968 A CN 202310859968A CN 116754813 A CN116754813 A CN 116754813A
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- China
- Prior art keywords
- needle
- needle tube
- semiconductor test
- test probe
- tube
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- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000000523 sample Substances 0.000 title claims abstract description 39
- 238000007689 inspection Methods 0.000 title claims description 3
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a semiconductor test probe for path detection, which comprises a right-angle needle tube, wherein a transmission needle is slidably arranged in one end of the right-angle needle tube, a test needle is slidably arranged in the other end of the right-angle needle tube, and the test needle and the transmission needle are hinged together through a guide rod. The semiconductor test probe for the path detection solves the problem that connection between the contact of a test element and the contact of a detection instrument is difficult to complete by using the existing probe for testing when the contact of the test element and the contact of the detection instrument are arranged at 90 degrees.
Description
Technical Field
The invention belongs to the technical field of semiconductor testing, and particularly relates to a semiconductor testing probe for path detection.
Background
Semiconductor testing is an important step in semiconductor design, production, packaging and testing processes, and through the whole industrial chain of the IC, the semiconductor testing ensures that the produced chips reach the required yield by using a tester, a sorting machine and a probe machine, reduces cost waste, provides effective test data and helps to improve design and manufacture.
The semiconductor test probe is arranged in the test fixture, the test fixture is arranged between the tested object and the test substrate, the probe is connected with the tested object and the test substrate, and whether the tested object is qualified or not is judged by transmitting certain current and frequency; semiconductor test probes are widely used in the fields of consumer electronics, communication systems, medical instruments, and the like.
The structure of the semiconductor test probe is generally composed of a needle shaft, a needle tube and a spring, wherein the needle shaft and the spring are arranged in the needle tube, and the mouth of the needle tube is in a compression riveting mode, so that the needle shaft and the spring are kept in the needle tube to form an integral structure. When the device is used, the spring is compressed into the needle tube under the action of the stress of the needle shaft, and the elastic force generated by the spring props against the needle shaft, so that the needle shaft is in good contact with a tested piece for testing.
The conventional semiconductor test probes are generally designed in a straight line, but in some applications, it is difficult to connect an object to be tested, which is not located in a non-straight line position, with a test substrate using one semiconductor test probe. If two semiconductor test probes are used for series connection, the conductivity of the semiconductor test probes can be too high, so that the test accuracy is reduced or the conductivity is difficult to judge, and the problem that the conventional semiconductor test probes cannot test the to-be-tested points of the to-be-tested product is caused.
Disclosure of Invention
The invention aims to provide a semiconductor test probe for path detection, which solves the problem that the conventional semiconductor test probe cannot complete connection between a tested object positioned on a nonlinear position and a test substrate.
In order to solve the technical problems, the invention discloses a semiconductor test probe for path detection, which comprises a U-shaped needle sleeve, wherein a first needle tube is arranged in one end of the U-shaped needle sleeve, a first elastic piece and a first needle head are arranged in the first needle tube, and the first elastic piece is positioned between the first needle head and the bottom of the first needle tube; the other end of the U-shaped needle sleeve is provided with a second needle tube, a second elastic piece and a second needle head are arranged in the second needle tube, and the second elastic piece is positioned between the second needle head and the bottom of the second needle tube.
The technical scheme of the invention also has the following characteristics:
as a preferable mode of the present invention, the first elastic member and the second elastic member are both springs.
As a preferred embodiment of the present invention, the outer diameters of the tail portions of the first needle and the second needle are larger than the outer diameter of the shaft portion thereof.
As a preferred embodiment of the present invention, the head portions of the first needle and the second needle are tapered.
In a preferred embodiment of the present invention, the ports of the first needle tube and the second needle tube are formed with a constriction.
Compared with the prior art: according to the semiconductor test probe for the path detection, in the use process, the relative distance between the two ends of the U-shaped needle sleeve and the height difference of the end faces of the two ends can be changed differently according to the actual test environment, so that the use environments of different distances and different height differences of points to be tested can be realized, the purpose of further ensuring the conductivity test performance of the semiconductor test probe while ensuring the test precision is achieved, and the semiconductor test probe for the path detection has very wide applicability.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a semiconductor test probe for path detection according to the present invention.
In the figure: 1.U needle tube, 2, first needle tube, 3, first elastic piece, 5, second needle tube, 6, second needle tube and 7, second elastic piece.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in fig. 1, a semiconductor test probe for path detection of the present invention comprises a U-shaped needle sleeve 1, wherein a first needle tube 2 is arranged in one end of the U-shaped needle sleeve 1, a first elastic member 4 and a first needle head 3 are arranged in the first needle tube 2, and the first elastic member 4 is positioned between the first needle head 3 and the bottom of the first needle tube 2; a second needle tube 6 is arranged in the other end of the U-shaped needle sleeve 1, a second elastic piece 7 and a second needle 5 are arranged in the second needle tube 6, and the second elastic piece 7 is positioned between the second needle 3 and the bottom of the second needle tube 6.
As shown in fig. 1, blind holes are respectively arranged at two ends of a U-shaped needle sleeve 1, each blind hole is respectively provided with a semiconductor test probe, and one semiconductor test probe consists of a first needle tube 2, a first elastic piece 4 and a first needle head 3 which are positioned in the first needle tube 2; the other semiconductor test probe consists of a second needle tube 6, a second elastic member 7 located in the second needle tube 6 and a second needle head 3.
When in operation, the first needle head 3 and the second needle head 5 are respectively contacted with the tested object and the test substrate, and at the moment, the first elastic piece 4 and the second elastic piece 7 are compressed and contracted. After the test is finished, the first needle head 3 and the second needle head 5 are not contacted with the tested object and the test substrate any more, and at the moment, the first needle head 3 and the second needle head 5 are reset under the elastic action of the first elastic piece 4 and the second elastic piece 7.
Example 2
As shown in fig. 1, in a semiconductor test probe for path detection according to the present invention, the semiconductor test probe comprises a U-shaped needle sleeve 1, wherein a first needle tube 2 is arranged in one end of the U-shaped needle sleeve 1, a first elastic member 4 and a first needle head 3 are arranged in the first needle tube 2, and the first elastic member 4 is positioned between the first needle head 3 and the bottom of the first needle tube 2; a second needle tube 6 is arranged in the other end of the U-shaped needle sleeve 1, a second elastic piece 7 and a second needle 5 are arranged in the second needle tube 6, and the second elastic piece 7 is positioned between the second needle 3 and the bottom of the second needle tube 6. The first elastic member 4 and the second elastic member 7 are both springs.
Unlike embodiment 1, in embodiment 2 of the present invention, it is defined that the first elastic member 4 and the second elastic member 7 are preferably springs, and the springs are preferably compression springs, so that the selection can save costs on the one hand and the compression springs can smoothly accomplish the retraction adaptation of the first needle 3 and the second needle 5 on the other hand.
Example 3
As shown in fig. 1, a semiconductor test probe for path detection according to the present invention comprises a U-shaped needle sheath 1, wherein a first needle tube 2 is disposed in one end of the U-shaped needle sheath 1, a first elastic member 4 and a first needle 3 are disposed in the first needle tube 2, and the first elastic member 4 is located between the first needle 3 and the bottom of the first needle tube 2; a second needle tube 6 is arranged in the other end of the U-shaped needle sleeve 1, a second elastic piece 7 and a second needle 5 are arranged in the second needle tube 6, and the second elastic piece 7 is positioned between the second needle 3 and the bottom of the second needle tube 6; the outer diameters of the tail parts of the first needle head 3 and the second needle head 5 are larger than the outer diameters of the rod parts of the first needle head and the second needle head; the ports of the first needle tube 2 and the second needle tube 6 are formed with a constriction.
Unlike embodiment 1, in embodiment 3 of the present invention, the outer diameters of the tail portions of the first needle 3 and the second needle 5 are defined to be larger than the outer diameters of the stem portions thereof, and the first needle tube 2 and the second needle tube 6 can be telescopically defined in the first needle tube 2 and the second needle tube 6 by only processing the reduced openings at the ports of the first needle tube 2 and the second needle tube 6, ensuring that the reduced openings have an inner diameter larger than the outer diameters of the stem portions and smaller than the outer diameters of the tail portions.
Example 4
As shown in fig. 1, a semiconductor test probe for path detection of the present invention comprises a U-shaped needle sleeve 1, wherein a first needle tube 2 is arranged in one end of the U-shaped needle sleeve 1, a first elastic member 4 and a first needle head 3 are arranged in the first needle tube 2, and the first elastic member 4 is positioned between the first needle head 3 and the bottom of the first needle tube 2; a second needle tube 6 is arranged in the other end of the U-shaped needle sleeve 1, a second elastic piece 7 and a second needle 5 are arranged in the second needle tube 6, and the second elastic piece 7 is positioned between the second needle 3 and the bottom of the second needle tube 6; the heads of the first needle 3 and the second needle 5 are tapered.
Unlike embodiment 1, in embodiment 4 of the present invention, the head portions of the first needle 3 and the second needle 5 are tapered, so that the first needle 3 and the second needle 5 can be conveniently contacted with the object to be tested and the test substrate, respectively.
Therefore, compared with the prior art, the semiconductor test probe for the path detection has the advantages that in the use process, the relative distance between the two ends of the U-shaped needle sleeve 1 and the height difference of the end faces of the two ends can be changed differently according to the actual test environment, so that the use environments of different distances and different height differences of points to be tested can be realized, the purpose of further ensuring the conductivity test performance of the semiconductor test probe while ensuring the test precision is achieved, and the semiconductor test probe for the path detection has very wide applicability.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (5)
1. A semiconductor test probe for path detection, which is characterized by comprising a U-shaped needle sleeve (1), wherein a first needle tube (2) is arranged in one end of the U-shaped needle sleeve (1), a first elastic piece (4) and a first needle head (3) are arranged in the first needle tube (2), and the first elastic piece (4) is positioned between the first needle head (3) and the bottom of the first needle tube (2); the novel needle tube comprises a U-shaped needle sleeve (1), wherein a second needle tube (6) is arranged at the other end of the U-shaped needle sleeve, a second elastic piece (7) and a second needle head (5) are arranged in the second needle tube (6), and the second elastic piece (7) is located between the second needle head (3) and the bottom of the second needle tube (6).
2. The semiconductor test probe for via inspection according to claim 1, wherein the first elastic member (4) and the second elastic member (7) are springs.
3. Semiconductor test probe for path detection according to claim 1, characterized in that the outer diameter of the tail of the first needle (3) and the second needle (5) is larger than the outer diameter of the stem thereof.
4. Semiconductor test probe for path detection according to claim 1, characterized in that the heads of the first needle (3) and the second needle (5) are tapered.
5. The semiconductor test probe for path detection according to claim 1, wherein the ports of the first needle tube (2) and the second needle tube (6) are formed with a constriction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310859968.9A CN116754813A (en) | 2023-07-13 | 2023-07-13 | Semiconductor test probe for via inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310859968.9A CN116754813A (en) | 2023-07-13 | 2023-07-13 | Semiconductor test probe for via inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116754813A true CN116754813A (en) | 2023-09-15 |
Family
ID=87959023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310859968.9A Pending CN116754813A (en) | 2023-07-13 | 2023-07-13 | Semiconductor test probe for via inspection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116754813A (en) |
-
2023
- 2023-07-13 CN CN202310859968.9A patent/CN116754813A/en active Pending
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