CN117687858B - Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium - Google Patents
Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium Download PDFInfo
- Publication number
- CN117687858B CN117687858B CN202410133883.7A CN202410133883A CN117687858B CN 117687858 B CN117687858 B CN 117687858B CN 202410133883 A CN202410133883 A CN 202410133883A CN 117687858 B CN117687858 B CN 117687858B
- Authority
- CN
- China
- Prior art keywords
- parameter set
- design parameter
- board
- end connector
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 103
- 238000013461 design Methods 0.000 claims abstract description 365
- 238000001514 detection method Methods 0.000 claims abstract description 281
- 230000005540 biological transmission Effects 0.000 claims abstract description 128
- 238000012360 testing method Methods 0.000 claims description 68
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 22
- 239000010931 gold Substances 0.000 claims description 22
- 229910052737 gold Inorganic materials 0.000 claims description 22
- 238000004590 computer program Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 abstract description 8
- 230000037431 insertion Effects 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012502 risk assessment Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
- G06F11/2221—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test input/output devices or peripheral units
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
- G06F11/2231—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test interrupt circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/26—Functional testing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Geometry (AREA)
- Computational Mathematics (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Evolutionary Computation (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The invention discloses an assembly detection method, a system, electronic equipment and a readable storage medium of an expansion card, which relate to the field of signal processing and aim to solve the problem of inaccurate assembly of a board end connector and the expansion card; acquiring a second design parameter set of a board end connector on a server main board; calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set; and determining the assembly state of the expansion card after the expansion card is inserted into the main board connector according to the contact width and the gap length. The invention can realize the accurate opposite insertion of the transmission pin of the board-end connector and the contact part of the expansion card, and avoid the problems of short circuit, open circuit, poor contact, structural interference and the like.
Description
Technical Field
The present invention relates to the field of signal processing, and in particular, to an assembly detection method and system for an expansion card, an electronic device, and a readable storage medium.
Background
Due to the size design limitation of the server, various Option cards, such as a network card, an HBA (Host bus adapter) card, a RAID card (Redundant Arrays of INDEPENDENT DISKS, disk array), an SAS (SERIAL ATTACHED SCSI, serial attached SCSI interface) card, and the like, cannot be directly inserted on the server motherboard. To meet customer personalization requirements, the server motherboard provides a longer slot (PCIe X16 interface + GenZ C +/4c + power interface, etc.) and then inserts a Riser card into this slot, providing multiple PCIe (PERIPHERAL COMPONENT INTERCONNECT EXPRESS, high speed serial computer expansion bus standard) slots on the Riser card to insert various Option cards onto the Riser card.
Because of the complexity of system design, the Riser card needs to be designed with golden fingers inserted into N different board connectors, and the golden fingers need to be accurately inserted into the server motherboard, which requires accurate dimensional adaptation of the golden fingers of the Riser card and Pin pins of the board connectors. Because each board end connector and the positioning hole have tolerance, the dimensional tolerance of all the board end connectors is accumulated, the formed combined tolerance has great influence on the assembly of the whole system, the assembly of the Riser card is not carried out or the Riser card is interfered with nearby materials if the combined tolerance is light, and the golden finger of the Riser card and the pin needle of the board end connector form open circuit or break circuit under serious conditions, so that various problems such as abnormal system bandwidth link, unrecognization, even board burning and the like are caused.
Therefore, how to provide a solution to the above technical problem is a problem that a person skilled in the art needs to solve at present.
Disclosure of Invention
The invention aims to provide an assembly detection method, an assembly detection system, electronic equipment and a readable storage medium for an expansion card, which can realize accurate opposite insertion of a transmission needle of a board end connector and a contact part of the expansion card, and avoid the problems of short circuit, open circuit, poor contact, structural interference and the like.
In one aspect, the present invention provides a method for detecting assembly of an expansion card, including:
Acquiring a first design parameter set of an expansion card; the first design parameter set comprises the width dimension of the contact part of the golden finger of the expansion card;
Acquiring a second design parameter set of a board end connector on a server main board; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
Calculating the contact width of the contact part of the golden finger and a target transmission needle on the board end connector and the gap length of the contact part of the golden finger and an auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set, wherein the target transmission needle is a transmission needle on the board end connector for transmitting signals in a matching way with the contact part, and the auxiliary transmission needle is a transmission needle adjacent to the target transmission needle;
and determining an assembly state of the expansion card after being inserted into the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk.
In another aspect, the second design parameter set includes a first sub-design parameter set and a second sub-design parameter set, and the process of obtaining the second design parameter set of the board-end connector on the server motherboard includes:
acquiring the first sub-design parameter set of a first board end connector on a server main board;
Acquiring the second sub-design parameter set of a second board end connector on the server main board; the second board end connector is a board end connector adjacent to the first board end connector;
the first and/or second sub-set of design parameters includes a width dimension of a transfer pin of the board end connector.
On the other hand, the process of calculating the contact width of the contact portion of the gold finger and the target transmission needle on the board end connector and the gap length of the contact portion of the gold finger and the auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set includes:
and calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set, the first sub design parameter set and the second sub design parameter set.
In another aspect, before the obtaining the first design parameter set of the expansion card, the assembly detection method further includes:
Determining a current assembly detection item, wherein the current assembly detection item is short circuit detection or open circuit detection;
The process of obtaining the first design parameter set of the expansion card comprises the following steps:
acquiring a first design parameter set of the expansion card corresponding to the current assembly detection item;
the process of obtaining the first sub-design parameter set of the first board-end connector on the server motherboard includes:
acquiring a first sub-design parameter set of a first board end connector on a server main board, wherein the first sub-design parameter set corresponds to the current assembly detection item;
and acquiring a second sub-design parameter set corresponding to the current assembly detection item of a second board end connector on the server main board.
In another aspect, the process of determining the current fitting test item includes:
generating and prompting test item selection information;
And receiving a selection instruction output by a user based on the test item selection information to determine the current assembly detection item.
In another aspect, before the determining the current assembly test item, the assembly test method further includes:
presetting a detection sequence of each assembly detection item;
the process of determining the current assembly test item includes:
and determining the current assembly detection based on the detection sequence.
In another aspect, the process of obtaining the first design parameter set of the expansion card corresponding to the current assembly test item includes:
And if the current assembly detection item is the open circuit detection, acquiring a first design parameter set corresponding to the open circuit detection of the expansion card, wherein the first design parameter set further comprises the width size of a clamping groove of the expansion card and the size from a reference groove of the expansion card to a bonding pad position.
On the other hand, the process of obtaining the first sub-design parameter set corresponding to the current assembly detection item of the first board-end connector on the server motherboard includes:
And if the current assembly detection item is the open circuit detection, acquiring a first sub-design parameter set corresponding to the open circuit detection of a first board end connector on a server main board, wherein the first sub-design parameter set comprises the diameter size of a reference hole of the first board end connector and the size from the reference hole of the first board end connector to a reference key, and the size of the reference key.
On the other hand, the process of obtaining the second sub-design parameter set corresponding to the current assembly detection item of the second board end connector on the server main board includes:
If the current assembly detection item is the open circuit detection, a second sub-design parameter set of a second board end connector on the server main board, which corresponds to the open circuit detection, is obtained, wherein the second sub-design parameter set comprises the width dimension of a transmission needle of the second board end connector, the dimension from the center of a first transmission needle of the second board end connector to the center of a plastic key, the dimension from the center of the plastic key to a positioning column, the dimension of the positioning column and the diameter dimension of a reference hole of the second board end connector, and the dimension from the reference hole of the first board end connector to the reference hole of the second board end connector.
In another aspect, the process of calculating the contact width of the contact portion of the golden finger with the target transmission pin on the board end connector based on the first and second sets of design parameters includes:
And if the current assembly detection item is the open circuit detection, calculating the contact width of the contact part of the golden finger and the target transmission needle on the board-end connector based on a first design parameter set corresponding to the open circuit detection of the expansion card, a first sub design parameter set corresponding to the open circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the open circuit detection of the second board-end connector on the server main board.
On the other hand, if the current assembly detection item is the open circuit detection, the process of calculating the contact width between the contact portion of the gold finger and the target transmission pin on the board-end connector based on the first design parameter set corresponding to the open circuit detection, the first sub design parameter set corresponding to the open circuit detection of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the open circuit detection of the second board-end connector on the server motherboard includes:
if the current assembly detection item is the open circuit detection, summing all design parameters in a first design parameter set, a first sub-design parameter set and a second sub-design parameter set corresponding to the open circuit detection to obtain a first detection value;
Calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the open circuit detection to obtain a second detection value;
And determining a difference between the first detection value and the second detection value as the contact width.
In another aspect, the process of determining the assembled state of the expansion card after plugging with the board-end connector according to the contact width and the gap length includes:
And determining the assembly state of the expansion card after being plugged with the board-end connector as the state with open circuit risk or the normal state according to the contact width.
On the other hand, the process of determining that the assembly state of the expansion card after being plugged with the board-end connector is the state with open circuit risk or the normal assembly state according to the contact width comprises the following steps:
when the contact width is greater than or equal to half of the width of the transmission needle, judging that the assembly state of the expansion card after being inserted into the board-end connector is the normal assembly state;
and when the contact width is smaller than half of the width of the transmission needle, judging that the assembly state of the expansion card after being inserted into the board-end connector is the state with the open-circuit risk.
In another aspect, the process of obtaining the first design parameter set of the expansion card corresponding to the current assembly test item includes:
and if the current assembly detection item is the short circuit detection, acquiring a first design parameter set corresponding to the short circuit detection of the expansion card, wherein the first design parameter set further comprises the size from the contact part to the center of the fine positioning groove of the expansion card and the size of the fine positioning groove.
On the other hand, the process of obtaining the first sub-design parameter set corresponding to the current assembly detection item of the first board-end connector on the server motherboard includes:
And if the current assembly detection item is the short circuit detection, acquiring a first sub-design parameter set corresponding to the short circuit detection of a first board end connector on a server main board, wherein the first sub-design parameter set comprises the width of a key of the first board end connector, the size from a reference hole of the first board end connector to a positioning column, the size of the diameter of the reference hole and the size from the reference hole of the first board end connector to the reference hole of the second board end connector.
On the other hand, the process of obtaining the second sub-design parameter set corresponding to the current assembly detection item of the second board end connector on the server main board includes:
And if the current assembly detection item is the short circuit detection, acquiring a second sub-design parameter set of a second board end connector on the server main board, wherein the second sub-design parameter set corresponds to the short circuit detection, and the second sub-design parameter set comprises the diameter size of a reference hole of the second board end connector, the size of a positioning column of the second board end connector, the width center point size of a second transmission needle of the second board end connector, the contact width size of the transmission needle and the size from the positioning column to a key.
In another aspect, the process of calculating the contact width of the contact portion of the golden finger with the target transmission pin on the board end connector based on the first and second sets of design parameters includes:
If the current assembly detection item is the short circuit detection, calculating the gap length between the contact part of the golden finger and the auxiliary transmission needle on the board-end connector based on a first design parameter set corresponding to the short circuit detection of the expansion card, a first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server main board.
On the other hand, if the current assembly detection item is the short circuit detection, the process of calculating the gap length between the contact portion of the gold finger and the auxiliary transmission pin on the board-end connector based on the first design parameter set corresponding to the short circuit detection of the expansion card, the first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server motherboard includes:
if the current assembly detection item is the short circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a third detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a fourth detection value;
and determining a difference between the third detection value and the fourth detection value as the gap length.
In another aspect, the process of determining the assembled state of the expansion card after plugging with the board-end connector according to the contact width and the gap length includes:
and determining the assembly state of the expansion card after being inserted into the board-end connector as the state with short circuit risk or the normal state according to the gap length.
On the other hand, the process of determining that the assembly state of the expansion card after being plugged with the board-end connector is the state with short circuit risk or the normal state according to the gap length comprises the following steps:
When the gap length is greater than 0, judging that the assembly state of the expansion card and the board-end connector after being inserted is the normal assembly state;
and when the contact width is smaller than or equal to 0, judging that the assembly state of the expansion card after being inserted into the board-end connector is the state with short circuit risk.
On the other hand, the invention also provides an assembly detection system of the expansion card, which comprises the following steps:
the first acquisition module is used for acquiring a first design parameter set of the expansion card; the first design parameter set comprises the width dimension of the contact part of the golden finger of the expansion card;
the second acquisition module is used for acquiring a second design parameter set of the board-end connector on the server main board; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
The calculating module is used for calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set, wherein the target transmission needle is a transmission needle on the board end connector for being matched with the contact part to transmit signals, and the auxiliary transmission needle is a transmission needle adjacent to the target transmission needle;
And the determining module is used for determining the assembly state of the expansion card after being spliced with the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk.
In another aspect, the present invention further provides an electronic device, including:
A memory for storing a computer program;
a processor for implementing the steps of the method for detecting assembly of an expansion card according to any one of the above when executing the computer program.
In another aspect, the present invention also provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the method for detecting the assembly of an expansion card as described in any one of the above.
The invention provides an assembly detection method of an expansion card, which is characterized in that before the expansion card and a server main board are formally inserted, the contact width of a contact part of a golden finger and a target transmission needle on a board end connector after the expansion card and the board end connector are inserted and the gap length of an auxiliary transmission needle on the board end connector can be calculated based on the design parameters of the expansion card and the design parameters of the board end connector, and whether the risk of short circuit or the risk of open circuit exists after the expansion card and the board end connector are inserted can be determined based on the contact width and the gap length, so that the design parameters of the board end connector and/or the expansion card are adjusted in time, and the accurate alignment of the transmission needle of the board end connector and the contact part of the expansion card after the card is inserted is ensured, and the problems of short circuit, open circuit, poor contact, structural interference and the like are avoided. The invention also provides an assembly detection system of the expansion card, electronic equipment and a computer readable storage medium, which have the same beneficial effects as the assembly detection method of the expansion card.
Drawings
For a clearer description of embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described, it being apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a flow chart of steps of an assembly detection method for an expansion card according to the present invention;
FIG. 2 is a schematic diagram of open tolerance analysis according to the present invention;
FIG. 3 is a schematic diagram illustrating a short circuit tolerance analysis according to the present invention;
FIG. 4 is a schematic diagram of an assembly detection system for an expansion card according to the present invention;
Fig. 5 is a schematic structural diagram of an electronic device according to the present invention;
Fig. 6 is a schematic structural diagram of a computer readable storage medium according to the present invention.
Detailed Description
The invention provides an assembly detection method, an assembly detection system, electronic equipment and a readable storage medium of an expansion card, which can realize the accurate opposite insertion of a transmission needle of a board end connector and a contact part of the expansion card, and avoid the problems of short circuit, open circuit, poor contact, structural interference and the like.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for detecting assembly of an expansion card according to the present invention, where the method includes:
S101: acquiring a first design parameter set of an expansion card; the first design parameter group comprises the width dimension of the contact part of the golden finger of the expansion card;
In this embodiment, the expansion card includes, but is not limited to Rizer cards, and a plurality of design parameters in a first design parameter set of the expansion card, such as related design parameters of a golden finger in the expansion card, and design parameters of a slot of the expansion card, where the design parameters are design parameters that affect the plugging effect of the expansion card and the board-end connector of the motherboard during vertical opposite plugging.
S102: acquiring a second design parameter set of a board end connector on a server main board; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
In this embodiment, a second design parameter set of a board connector on a server motherboard is obtained, and it can be understood that the server motherboard may include a plurality of board connectors, different board connectors have different second design parameter sets, and the second design parameter sets include a plurality of design parameters, for example, a design parameter of a positioning post of the board connector, a design parameter of a transmission pin (i.e., a pin) and a design parameter of a reference hole, where the design parameters are design parameters that affect the plugging effect of the expansion card and the board connector of the motherboard when the expansion card and the board connector are plugged vertically.
S103: calculating the contact width of the contact part of the golden finger and a target transmission needle on the board end connector based on the first design parameter set and the second design parameter set, and the gap length of the contact part of the golden finger and an auxiliary transmission needle on the board end connector, wherein the target transmission needle is a transmission needle on the board end connector for transmitting signals in cooperation with the contact part, and the auxiliary transmission needle is a transmission needle adjacent to the target transmission needle;
S104: and determining the assembly state of the expansion card after the expansion card is inserted into the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk.
In this embodiment, based on the first design parameter set of the expansion card and the second design parameter set of the board connector, the contact width between the contact portion of the gold finger and the target transmission pin on the board connector is calculated, and the contact portion may be the pad of the gold finger or may be the insertion slot.
If the risk of short circuit or open circuit is judged, the opening size/tolerance of the expansion card, the size/tolerance of the locating column of the board end and the like are optimally adjusted until the contact width calculated by the data is larger than half of the pin needle width, so that the design requirement is met.
Therefore, in this embodiment, before the expansion card and the server motherboard are formally plugged, the contact width between the contact portion of the golden finger after the expansion card and the board end connector are plugged and the target transmission needle on the board end connector, and the gap length between the contact portion of the golden finger and the auxiliary transmission needle on the board end connector are calculated based on the design parameters of the expansion card and the design parameters of the board end connector, and whether the risk of short circuit or open circuit exists after the expansion card and the board end connector are plugged can be determined based on the contact width and the gap length, so that the design parameters of the board end connector and/or the expansion card are adjusted in time, and the accurate alignment of the transmission needle of the board end connector and the contact portion of the expansion card after the card is plugged is ensured, so that the problems of short circuit, open circuit, poor contact, structural interference and the like are avoided.
Based on the above embodiments:
In an exemplary embodiment, the second design parameter set includes a first sub-design parameter set and a second sub-design parameter set, and the process of obtaining the second design parameter set of the board-side connector on the server motherboard includes:
Acquiring a first sub-design parameter set of a first board end connector on a server main board;
acquiring a second sub-design parameter set of a second board end connector on the server main board; the second board end connector is a board end connector adjacent to the first board end connector;
The first and/or second sub-set of design parameters includes a width dimension of a transmission pin of the board end connector. In order to achieve accurate detection, in this embodiment, the assembly states of two adjacent board-end connectors and the expansion card in the server motherboard are adopted for detection.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transfer pin on the board-end connector and the gap length of the contact portion of the gold finger with the auxiliary transfer pin on the board-end connector based on the first and second design parameter sets includes:
And calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set, the first sub design parameter set and the second sub design parameter set.
In an exemplary embodiment, before acquiring the first design parameter set of the expansion card, the assembly detection method further includes:
Determining a current assembly detection item, wherein the current assembly detection item is short circuit detection or open circuit detection;
The process of obtaining the first design parameter set of the expansion card comprises the following steps:
acquiring a first design parameter set corresponding to a current assembly detection item of the expansion card;
The process of obtaining the first sub-design parameter set of the first board-end connector on the server motherboard includes:
acquiring a first sub-design parameter set of a first board end connector on a server main board, wherein the first sub-design parameter set corresponds to a current assembly detection item;
And acquiring a second sub-design parameter set corresponding to the current assembly detection item of a second board end connector on the server main board.
It will be appreciated that, since the basis of the short circuit detection is the gap length and the basis of the open circuit detection is the contact width, different design parameter sets may be set according to different detection terms, i.e. the design parameters in the design parameter set corresponding to the short circuit detection may be different from the design parameters in the design parameter set corresponding to the open circuit detection.
In an exemplary embodiment, the process of determining the current fitting inspection item includes:
generating and prompting test item selection information;
And receiving a selection instruction output by a user based on the test item selection information to determine the current assembly detection item.
In this embodiment, short circuit detection or open circuit is currently required, and the user may select the current assembly detection item, generate and prompt test item selection information on the interactive interface, where the user selects the test item selection information.
In an exemplary embodiment, before determining the current assembly test item, the assembly test method further includes:
presetting a detection sequence of each assembly detection item;
the process of determining the current assembly test item includes:
the current assembly test is determined based on the test order.
In this embodiment, the test sequence of the short circuit detection and the open circuit detection is set before the test, and the test can be automatically executed after the test starts, without manual intervention, thereby improving the efficiency.
In an exemplary embodiment, the process of obtaining a first set of design parameters of the expansion card corresponding to the current assembly test item includes:
If the current assembly detection item is open circuit detection, a first design parameter set corresponding to the open circuit detection of the expansion card is obtained, and the first design parameter set further comprises the width size of a clamping groove of the expansion card and the size from a reference groove of the expansion card to a bonding pad position.
In an exemplary embodiment, the process of obtaining a first sub-design parameter set of a first board-end connector on a server motherboard corresponding to a current assembly test item includes:
If the current assembly detection item is open circuit detection, a first sub-design parameter set corresponding to the open circuit detection of a first board end connector on a server main board is obtained, wherein the first sub-design parameter set comprises the diameter size of a reference hole of the first board end connector, the size from the reference hole of the first board end connector to a reference key, and the size of the reference key.
In an exemplary embodiment, the process of obtaining the second sub-design parameter set corresponding to the current assembly test item of the second board-side connector on the server motherboard includes:
If the current assembly detection item is open circuit detection, a second sub-design parameter set corresponding to the open circuit detection of a second board end connector on the server main board is obtained, wherein the second sub-design parameter set comprises the width dimension of a transmission needle of the second board end connector, the dimension from the center of a first transmission needle of the second board end connector to the center of a plastic key, the dimension from the center of the plastic key to a positioning column, the dimension of the positioning column, the diameter dimension of a reference hole of the second board end connector, and the dimension from the reference hole of the first board end connector to the reference hole of the second board end connector.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-end connector based on the first and second design parameter sets includes:
If the current assembly detection item is open circuit detection, calculating the contact width of the contact part of the golden finger and the target transmission needle on the board-end connector based on a first design parameter set corresponding to the open circuit detection of the expansion card, a first sub design parameter set corresponding to the open circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the open circuit detection of the second board-end connector on the server main board.
In this embodiment, in the case of open circuit detection, referring to fig. 2, the following design parameters need to be obtained: the method comprises the steps of obtaining a width A of a Pin needle of a connector 2 and a width of a golden finger pad, obtaining a center size of a first Pin of a PCI connector of the connector 2 to a size B of a plastic KEY center, obtaining a size C of a plastic KEY center of the connector 2 to a size C of a positioning column of the connector 2, obtaining a size D of a positioning column half of the connector 2, obtaining a size E of a reference hole W of the connector 2, obtaining a size F of a reference hole W of the connector 2 to a size F of a reference hole W1, obtaining a size G of a reference hole W of the connector 1, obtaining a size H of a positioning column half of the connector 1, obtaining a size I of a reference hole W1 of the connector 1 to a reference KEY F1, obtaining a size J of a reference KEY half of the connector 1, obtaining a size K of a riser clamping groove width half, obtaining a riser reference groove to a bonding pad position L, and obtaining a size M of a riser pad half.
In an exemplary embodiment, if the current assembly test item is open circuit test, the process of calculating the contact width between the contact portion of the golden finger and the target transmission pin on the board-end connector based on the first design parameter set corresponding to the open circuit test of the expansion card, the first sub design parameter set corresponding to the open circuit test of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the open circuit test of the second board-end connector on the server motherboard includes:
If the current assembly detection item is open circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the open circuit detection to obtain a first detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub design parameter set and the second sub design parameter set corresponding to open circuit detection to obtain a second detection value;
The difference between the first detection value and the second detection value is determined as the contact width.
In an exemplary embodiment, the process of determining the assembled state of the expansion card after plugging with the board-side connector according to the contact width and the gap length includes:
And determining the assembly state of the expansion card after the expansion card is inserted into the board-end connector to be in an open-circuit risk state or a normal state according to the contact width.
In an exemplary embodiment, the process of determining that the assembly state of the expansion card after plugging with the board-end connector is an open risk state or a normal assembly state according to the contact width includes:
When the contact width is greater than or equal to half of the width of the transmission needle, judging the assembled state of the expansion card after the expansion card is spliced with the board-end connector to be a normal assembled state;
And when the contact width is smaller than half of the width of the transmission pin, judging that the assembly state of the expansion card and the board end connector after being plugged is an open-circuit risk state.
Further, in this example an open risk analysis was performed, T WC-TRSS > half the pin width, indicating no open risk, otherwise, indicating the presence of open risk. WC (Worst Case ) uses the tolerance amplitude as the upper and lower limit values of the error, and calculates the error worst value T WC,TWC =a+b+c+d+e+f+g+h+i+j+k+l+m. RSS (Root-Sum-of-square analysis), calculate statistical square tolerance T RSS,For example, T represents the values of the dimension vector value and the tolerance Bi-Lateral Tolerance. Calculated T WC-TRSS =0.43-0.131=0.299 > pin width half (0.38/2=0.19). Judging whether the WC-RSS value is larger than a preset pin needle actual width value or not, if so, not, and if so, the overlap joint quantity of the pin needle and the pad is insufficient; when the numerical value is judged to be smaller than the actual value preset by half the pin needle width, the size/tolerance of the opening of the riser card, the size/tolerance of the locating column at the board end and the like are optimally adjusted until the data is adjusted to half the WC-RSS > pin needle width, so that the design requirement is met.
In an exemplary embodiment, the process of obtaining a first set of design parameters of the expansion card corresponding to the current assembly test item includes:
If the current assembly detection item is short circuit detection, a first design parameter set corresponding to the short circuit detection of the expansion card is obtained, and the first design parameter set further comprises the size from the contact part to the center of the fine positioning groove of the expansion card and the size of the fine positioning groove.
In an exemplary embodiment, the process of obtaining a first sub-design parameter set of a first board-end connector on a server motherboard corresponding to a current assembly test item includes:
If the current assembly detection item is short circuit detection, a first sub-design parameter set corresponding to the short circuit detection of a first board end connector on a server main board is obtained, wherein the first sub-design parameter set comprises the width of a key of the first board end connector, the size from a reference hole of the first board end connector to a positioning column, the size of the diameter of the reference hole and the size from the reference hole of the first board end connector to the reference hole of a second board end connector.
In an exemplary embodiment, the process of obtaining the second sub-design parameter set corresponding to the current assembly test item of the second board-side connector on the server motherboard includes:
if the current assembly detection item is short circuit detection, a second sub-design parameter set of a second board end connector on the server main board, which corresponds to the short circuit detection, is obtained, wherein the second sub-design parameter set comprises the diameter size of a reference hole of the second board end connector, the size of a positioning column of the second board end connector, the width center point size of a second transmission needle of the second board end connector, the contact width size of the transmission needle and the size from the positioning column to a key.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-end connector based on the first and second design parameter sets includes:
If the current assembly detection item is short circuit detection, calculating the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board-end connector based on a first design parameter set corresponding to the short circuit detection of the expansion card, a first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server main board.
In this embodiment, when short circuit detection is performed, referring to fig. 3, the following design parameters need to be obtained: acquiring a dimension A of half of the width of the golden finger pad of the connector 2; acquiring the size B from the golden finger pad of the connector 2 to the center of the accurate positioning groove of the riser card; acquiring the size C of half of the accurate positioning groove of the riser card; a dimension D of half the width of the connector 1 key is obtained; acquiring the dimension E from the reference hole of the connector 1 to the positioning column; acquiring the dimension F of half of the positioning column of the connector 1; acquiring a dimension G of half the diameter of a reference hole W of the connector 1; acquiring the dimension H from the reference hole W of the connector 1 to the reference hole W1 of the connector 2; acquiring a dimension I of half the diameter of a reference hole W of the connector 2; acquiring the dimension J of a half of a positioning column of the connector 2; obtaining the dimension K from the reference F2 dimension positioning column of the connector 2 to the connector 2 key; acquiring the dimension L from the connector 2 to the width center point of the second pin needle; the dimension M of half the pin needle contact width is obtained.
In an exemplary embodiment, if the current assembly detection item is short circuit detection, the process of calculating the gap length between the contact portion of the gold finger and the auxiliary transmission pin on the board-end connector based on the first design parameter set corresponding to the short circuit detection of the expansion card, the first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server motherboard includes:
If the current assembly detection item is short circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a third detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub design parameter set and the second sub design parameter set corresponding to short circuit detection to obtain a fourth detection value;
the difference between the third detection value and the fourth detection value is determined as the gap length.
In an exemplary embodiment, the process of determining the assembled state of the expansion card after plugging with the board-side connector according to the contact width and the gap length includes:
and determining the assembly state of the expansion card after the insertion of the board-end connector as a state with short circuit risk or a normal state according to the gap length.
In an exemplary embodiment, the process of determining that the assembled state of the expansion card after plugging with the board-end connector is a state in which there is a risk of short circuit or a normal state according to the gap length includes:
When the gap length is greater than 0, judging the assembly state of the expansion card after being spliced with the board-end connector is a normal assembly state;
And when the contact width is smaller than or equal to 0, judging the assembly state of the expansion card after being inserted into the board-end connector as a state with short circuit risk.
Further, in this embodiment, a short-circuit risk analysis is performed, where T WC-TRSS >0 indicates that there is no short-circuit risk, and otherwise indicates that there is a short-circuit risk. WC calculates the error worst value T WC,TWC =a+b+c+d+e+f+g+h+i+j+k+l+m using the tolerance amplitude as the upper and lower limit values of the error. RSS (Root-Sum-of-square analysis), calculate statistical square tolerance T RSS,For example, T represents the values of the dimension vector value and the tolerance Bi-Lateral Tolerance. Calculating T WC-TRSS =0.42-0.127=0.333 >0, judging whether the WC-RSS value is larger than 0 or not, if so, the pin needle and pad overlap amount is short-circuited; when the numerical value is judged to be smaller than the actual value preset by 0, the size/tolerance of the opening of the riser card, the size/tolerance of the locating column at the plate end and the like are optimally adjusted until the data are adjusted to WC-RSS >0, so that the design requirement is met.
In summary, the invention can analyze the state after card insertion in advance and design and correct the state, thereby achieving the purpose that the PAD of the golden finger can still keep good contact with the PIN needle after card insertion, the problems of short circuit, poor contact and open circuit can not occur, and the problem of structural interference can not occur.
In a second aspect, referring to fig. 4, fig. 4 is a schematic structural diagram of an assembly detection system for an expansion card according to the present invention, where the assembly detection system for an expansion card includes:
a first obtaining module 11, configured to obtain a first design parameter set of the expansion card; the first design parameter set comprises the width dimension of the contact part of the golden finger of the expansion card;
a second obtaining module 12, configured to obtain a second set of design parameters of the board-end connector on the server motherboard; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
a calculating module 13, configured to calculate, based on the first design parameter set and the second design parameter set, a contact width between a contact portion of the golden finger and a target transmission pin on the board end connector, and a gap length between the contact portion of the golden finger and an auxiliary transmission pin on the board end connector, where the target transmission pin is a transmission pin on the board end connector for transmitting signals in cooperation with the contact portion, and the auxiliary transmission pin is a transmission pin adjacent to the target transmission pin;
and the determining module 14 is used for determining the assembly state of the expansion card after being plugged with the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk.
Therefore, in this embodiment, before the expansion card and the server motherboard are formally plugged, the contact width between the contact portion of the golden finger after the expansion card and the board end connector are plugged and the target transmission needle on the board end connector, and the gap length between the contact portion of the golden finger and the auxiliary transmission needle on the board end connector are calculated based on the design parameters of the expansion card and the design parameters of the board end connector, and whether the risk of short circuit or open circuit exists after the expansion card and the board end connector are plugged can be determined based on the contact width and the gap length, so that the design parameters of the board end connector and/or the expansion card are adjusted in time, and the accurate alignment of the transmission needle of the board end connector and the contact portion of the expansion card after the card is plugged is ensured, so that the problems of short circuit, open circuit, poor contact, structural interference and the like are avoided.
In an exemplary embodiment, the second design parameter set includes a first sub-design parameter set and a second sub-design parameter set, and the process of obtaining the second design parameter set of the board-side connector on the server motherboard includes:
Acquiring a first sub-design parameter set of a first board end connector on a server main board;
acquiring a second sub-design parameter set of a second board end connector on the server main board; the second board end connector is a board end connector adjacent to the first board end connector;
The first and/or second sub-set of design parameters includes a width dimension of a transmission pin of the board end connector.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transfer pin on the board-end connector and the gap length of the contact portion of the gold finger with the auxiliary transfer pin on the board-end connector based on the first and second design parameter sets includes:
And calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set, the first sub design parameter set and the second sub design parameter set.
In an exemplary embodiment of the present invention,
The first obtaining module 11 is further configured to determine, before obtaining the first set of design parameters of the expansion card, a current assembly detection item, where the current assembly detection item is a short circuit detection or an open circuit detection;
The process of obtaining the first design parameter set of the expansion card comprises the following steps:
acquiring a first design parameter set corresponding to a current assembly detection item of the expansion card;
The process of obtaining the first sub-design parameter set of the first board-end connector on the server motherboard includes:
acquiring a first sub-design parameter set of a first board end connector on a server main board, wherein the first sub-design parameter set corresponds to a current assembly detection item;
And acquiring a second sub-design parameter set corresponding to the current assembly detection item of a second board end connector on the server main board.
In an exemplary embodiment, the process of determining the current fitting inspection item includes:
generating and prompting test item selection information;
And receiving a selection instruction output by a user based on the test item selection information to determine the current assembly detection item.
In an exemplary embodiment, prior to determining the current assembly test item, the assembly test system further comprises:
The preset module is used for presetting the detection sequence of each assembly detection item;
the process of determining the current assembly test item includes:
the current assembly test is determined based on the test order.
In an exemplary embodiment, the process of obtaining a first set of design parameters of the expansion card corresponding to the current assembly test item includes:
If the current assembly detection item is open circuit detection, a first design parameter set corresponding to the open circuit detection of the expansion card is obtained, and the first design parameter set further comprises the width size of a clamping groove of the expansion card and the size from a reference groove of the expansion card to a bonding pad position.
In an exemplary embodiment, the process of obtaining a first sub-design parameter set of a first board-end connector on a server motherboard corresponding to a current assembly test item includes:
If the current assembly detection item is open circuit detection, a first sub-design parameter set corresponding to the open circuit detection of a first board end connector on a server main board is obtained, wherein the first sub-design parameter set comprises the diameter size of a reference hole of the first board end connector, the size from the reference hole of the first board end connector to a reference key, and the size of the reference key.
In an exemplary embodiment, the process of obtaining the second sub-design parameter set corresponding to the current assembly test item of the second board-side connector on the server motherboard includes:
If the current assembly detection item is open circuit detection, a second sub-design parameter set corresponding to the open circuit detection of a second board end connector on the server main board is obtained, wherein the second sub-design parameter set comprises the width dimension of a transmission needle of the second board end connector, the dimension from the center of a first transmission needle of the second board end connector to the center of a plastic key, the dimension from the center of the plastic key to a positioning column, the dimension of the positioning column, the diameter dimension of a reference hole of the second board end connector, and the dimension from the reference hole of the first board end connector to the reference hole of the second board end connector.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-end connector based on the first and second design parameter sets includes:
If the current assembly detection item is open circuit detection, calculating the contact width of the contact part of the golden finger and the target transmission needle on the board-end connector based on a first design parameter set corresponding to the open circuit detection of the expansion card, a first sub design parameter set corresponding to the open circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the open circuit detection of the second board-end connector on the server main board.
In an exemplary embodiment, if the current assembly test item is open circuit test, the process of calculating the contact width between the contact portion of the golden finger and the target transmission pin on the board-end connector based on the first design parameter set corresponding to the open circuit test of the expansion card, the first sub design parameter set corresponding to the open circuit test of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the open circuit test of the second board-end connector on the server motherboard includes:
If the current assembly detection item is open circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the open circuit detection to obtain a first detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub design parameter set and the second sub design parameter set corresponding to open circuit detection to obtain a second detection value;
The difference between the first detection value and the second detection value is determined as the contact width.
In an exemplary embodiment, the process of determining the assembled state of the expansion card after plugging with the board-side connector according to the contact width and the gap length includes:
And determining the assembly state of the expansion card after the expansion card is inserted into the board-end connector to be in an open-circuit risk state or a normal state according to the contact width.
In an exemplary embodiment, the process of determining that the assembly state of the expansion card after plugging with the board-end connector is an open risk state or a normal assembly state according to the contact width includes:
When the contact width is greater than or equal to half of the width of the transmission needle, judging the assembled state of the expansion card after the expansion card is spliced with the board-end connector to be a normal assembled state;
And when the contact width is smaller than half of the width of the transmission pin, judging that the assembly state of the expansion card and the board end connector after being plugged is an open-circuit risk state.
In an exemplary embodiment, the process of obtaining a first set of design parameters of the expansion card corresponding to the current assembly test item includes:
If the current assembly detection item is short circuit detection, a first design parameter set corresponding to the short circuit detection of the expansion card is obtained, and the first design parameter set further comprises the size from the contact part to the center of the fine positioning groove of the expansion card and the size of the fine positioning groove.
In an exemplary embodiment, the process of obtaining a first sub-design parameter set of a first board-end connector on a server motherboard corresponding to a current assembly test item includes:
If the current assembly detection item is short circuit detection, a first sub-design parameter set corresponding to the short circuit detection of a first board end connector on a server main board is obtained, wherein the first sub-design parameter set comprises the width of a key of the first board end connector, the size from a reference hole of the first board end connector to a positioning column, the size of the diameter of the reference hole and the size from the reference hole of the first board end connector to the reference hole of a second board end connector.
In an exemplary embodiment, the process of obtaining the second sub-design parameter set corresponding to the current assembly test item of the second board-side connector on the server motherboard includes:
if the current assembly detection item is short circuit detection, a second sub-design parameter set of a second board end connector on the server main board, which corresponds to the short circuit detection, is obtained, wherein the second sub-design parameter set comprises the diameter size of a reference hole of the second board end connector, the size of a positioning column of the second board end connector, the width center point size of a second transmission needle of the second board end connector, the contact width size of the transmission needle and the size from the positioning column to a key.
In an exemplary embodiment, the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-end connector based on the first and second design parameter sets includes:
If the current assembly detection item is short circuit detection, calculating the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board-end connector based on a first design parameter set corresponding to the short circuit detection of the expansion card, a first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server main board.
In an exemplary embodiment, if the current assembly detection item is short circuit detection, the process of calculating the gap length between the contact portion of the gold finger and the auxiliary transmission pin on the board-end connector based on the first design parameter set corresponding to the short circuit detection of the expansion card, the first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server motherboard includes:
If the current assembly detection item is short circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a third detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub design parameter set and the second sub design parameter set corresponding to short circuit detection to obtain a fourth detection value;
the difference between the third detection value and the fourth detection value is determined as the gap length.
In an exemplary embodiment, the process of determining the assembled state of the expansion card after plugging with the board-side connector according to the contact width and the gap length includes:
and determining the assembly state of the expansion card after the insertion of the board-end connector as a state with short circuit risk or a normal state according to the gap length.
In an exemplary embodiment, the process of determining that the assembled state of the expansion card after plugging with the board-end connector is a state in which there is a risk of short circuit or a normal state according to the gap length includes:
When the gap length is greater than 0, judging the assembly state of the expansion card after being spliced with the board-end connector is a normal assembly state;
And when the contact width is smaller than or equal to 0, judging the assembly state of the expansion card after being inserted into the board-end connector as a state with short circuit risk.
In a third aspect, the present invention also provides an electronic device, as shown in fig. 5, including:
a memory 21 for storing a computer program;
a processor 22 for implementing the steps of the method for detecting the assembly of an expansion card as described in any one of the embodiments above when executing a computer program.
The electronic device further includes:
The input interface 23 is connected to the processor 22 through the communication bus 26, and is used for acquiring the externally imported computer programs, parameters and instructions, and storing the computer programs, parameters and instructions in the memory 21 under the control of the processor 22. The input interface 23 may be connected to an input device for receiving parameters or instructions manually entered by a user. The input device can be a touch layer covered on a display screen, or can be a key, a track ball or a touch pad arranged on a terminal shell.
The display unit 24 is connected to the processor 22 through the communication bus 26, and is used for displaying data sent by the processor 22. The display unit 24 may be a liquid crystal display or an electronic ink display, etc.
The network port 25 is connected to the processor 22 through the communication bus 26, and is used for communication connection with external terminal devices. The communication technology adopted by the communication connection can be a wired communication technology or a wireless communication technology, such as a mobile high-definition link technology, a universal serial bus, a high-definition multimedia interface, a wireless fidelity technology, a Bluetooth communication technology, a low-power consumption Bluetooth communication technology, an IEEE802.11 s-based communication technology and the like.
In a fourth aspect, the present invention also provides a computer readable storage medium, referring to fig. 6, on which a computer program 31 is stored, the computer program 31 implementing the steps of the method for detecting assembly of an expansion card as described in any one of the embodiments above when executed by a processor.
The computer-readable storage medium 30 may include: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (18)
1. An assembly detection method of an expansion card, characterized by comprising:
Acquiring a first design parameter set of an expansion card; the first design parameter set comprises the width dimension of the contact part of the golden finger of the expansion card;
Acquiring a second design parameter set of a board end connector on a server main board; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
Calculating the contact width of the contact part of the golden finger and a target transmission needle on the board end connector and the gap length of the contact part of the golden finger and an auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set, wherein the target transmission needle is a transmission needle on the board end connector for transmitting signals in a matching way with the contact part, and the auxiliary transmission needle is a transmission needle adjacent to the target transmission needle;
determining an assembly state of the expansion card after being inserted into the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk;
The second design parameter set includes a first sub design parameter set and a second sub design parameter set, and the process of obtaining the second design parameter set of the board-end connector on the server motherboard includes:
acquiring the first sub-design parameter set of a first board end connector on a server main board;
Acquiring the second sub-design parameter set of a second board end connector on the server main board; the second board end connector is a board end connector adjacent to the first board end connector;
the first sub-set of design parameters and/or the second sub-set of design parameters comprises a width dimension of a transmission pin of the board end connector;
before obtaining the first design parameter set of the expansion card, the assembly detection method further comprises the following steps:
Determining a current assembly detection item, wherein the current assembly detection item is short circuit detection or open circuit detection;
The process of obtaining the first design parameter set of the expansion card comprises the following steps:
acquiring a first design parameter set of the expansion card corresponding to the current assembly detection item;
the process of obtaining the first sub-design parameter set of the first board-end connector on the server motherboard includes:
acquiring a first sub-design parameter set of a first board end connector on a server main board, wherein the first sub-design parameter set corresponds to the current assembly detection item;
and acquiring a second sub-design parameter set corresponding to the current assembly detection item of a second board end connector on the server main board.
2. The fitting inspection method of an expansion card according to claim 1, wherein the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-side connector and the gap length of the contact portion of the gold finger with the auxiliary transmission pin on the board-side connector based on the first design parameter set and the second design parameter set comprises:
and calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set, the first sub design parameter set and the second sub design parameter set.
3. The method of claim 1, wherein determining the current assembly test item comprises:
Generating and prompting test item selection information, and receiving a selection instruction output by a user based on the test item selection information to determine a current assembly detection item;
Or alternatively, the first and second heat exchangers may be,
The current assembly detection item is determined based on the detection sequence of each assembly detection item which is preset.
4. The method of claim 1, wherein the process of obtaining a first set of design parameters for the expansion card corresponding to the current assembly test item comprises:
And if the current assembly detection item is the open circuit detection, acquiring a first design parameter set corresponding to the open circuit detection of the expansion card, wherein the first design parameter set further comprises the width size of a clamping groove of the expansion card and the size from a reference groove of the expansion card to a bonding pad position.
5. The method of claim 1, wherein the step of obtaining a first sub-design parameter set of a first board-side connector on a server motherboard corresponding to the current assembly test item comprises:
And if the current assembly detection item is the open circuit detection, acquiring a first sub-design parameter set corresponding to the open circuit detection of a first board end connector on a server main board, wherein the first sub-design parameter set comprises the diameter size of a reference hole of the first board end connector and the size from the reference hole of the first board end connector to a reference key, and the size of the reference key.
6. The method of claim 1, wherein the step of obtaining a second sub-design parameter set of a second board-side connector on the server motherboard corresponding to the current assembly test item comprises:
If the current assembly detection item is the open circuit detection, a second sub-design parameter set of a second board end connector on the server main board, which corresponds to the open circuit detection, is obtained, wherein the second sub-design parameter set comprises the width dimension of a transmission needle of the second board end connector, the dimension from the center of a first transmission needle of the second board end connector to the center of a plastic key, the dimension from the center of the plastic key to a positioning column, the dimension of the positioning column and the diameter dimension of a reference hole of the second board end connector, and the dimension from the reference hole of the first board end connector to the reference hole of the second board end connector.
7. The fitting inspection method of an expansion card according to any one of claims 4 to 6, wherein the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-side connector based on the first design parameter set and the second design parameter set comprises:
And if the current assembly detection item is the open circuit detection, calculating the contact width of the contact part of the golden finger and the target transmission needle on the board-end connector based on a first design parameter set corresponding to the open circuit detection of the expansion card, a first sub design parameter set corresponding to the open circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the open circuit detection of the second board-end connector on the server main board.
8. The method according to claim 7, wherein if the current assembly test item is the open circuit test, the step of calculating the contact width between the contact portion of the gold finger and the target transmission pin on the board-side connector based on the first design parameter set corresponding to the open circuit test, the first sub design parameter set corresponding to the open circuit test, and the second sub design parameter set corresponding to the open circuit test, of the first board-side connector on the server motherboard, and the second sub design parameter set corresponding to the open circuit test, respectively, comprises:
if the current assembly detection item is the open circuit detection, summing all design parameters in a first design parameter set, a first sub-design parameter set and a second sub-design parameter set corresponding to the open circuit detection to obtain a first detection value;
Calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the open circuit detection to obtain a second detection value;
And determining a difference between the first detection value and the second detection value as the contact width.
9. The method of claim 8, wherein the step of determining the assembled state of the expansion card after plugging with the board-side connector based on the contact width and the gap length comprises:
when the contact width is greater than or equal to half of the width of the transmission needle, judging that the assembly state of the expansion card after being inserted into the board-end connector is the normal assembly state;
and when the contact width is smaller than half of the width of the transmission needle, judging that the assembly state of the expansion card after being inserted into the board-end connector is the state with the open-circuit risk.
10. The method of claim 1, wherein the process of obtaining a first set of design parameters for the expansion card corresponding to the current assembly test item comprises:
and if the current assembly detection item is the short circuit detection, acquiring a first design parameter set corresponding to the short circuit detection of the expansion card, wherein the first design parameter set further comprises the size from the contact part to the center of the fine positioning groove of the expansion card and the size of the fine positioning groove.
11. The method of claim 1, wherein the step of obtaining a first sub-design parameter set of a first board-side connector on a server motherboard corresponding to the current assembly test item comprises:
And if the current assembly detection item is the short circuit detection, acquiring a first sub-design parameter set corresponding to the short circuit detection of a first board end connector on a server main board, wherein the first sub-design parameter set comprises the width of a key of the first board end connector, the size from a reference hole of the first board end connector to a positioning column, the size of the diameter of the reference hole and the size from the reference hole of the first board end connector to the reference hole of the second board end connector.
12. The method of claim 1, wherein the step of obtaining a second sub-design parameter set of a second board-side connector on the server motherboard corresponding to the current assembly test item comprises:
And if the current assembly detection item is the short circuit detection, acquiring a second sub-design parameter set of a second board end connector on the server main board, wherein the second sub-design parameter set corresponds to the short circuit detection, and the second sub-design parameter set comprises the diameter size of a reference hole of the second board end connector, the size of a positioning column of the second board end connector, the width center point size of a second transmission needle of the second board end connector, the contact width size of the transmission needle and the size from the positioning column to a key.
13. The fitting inspection method of an expansion card according to any one of claims 10 to 12, wherein the process of calculating the contact width of the contact portion of the gold finger with the target transmission pin on the board-side connector based on the first design parameter set and the second design parameter set includes:
If the current assembly detection item is the short circuit detection, calculating the gap length between the contact part of the golden finger and the auxiliary transmission needle on the board-end connector based on a first design parameter set corresponding to the short circuit detection of the expansion card, a first sub design parameter set corresponding to the short circuit detection of the first board-end connector on the server main board, and a second sub design parameter set corresponding to the short circuit detection of the second board-end connector on the server main board.
14. The method according to claim 13, wherein if the current assembly test item is the short circuit test, the calculating the gap length between the contact portion of the gold finger and the auxiliary transmission pin on the board-end connector based on the first design parameter set corresponding to the short circuit test, the first sub design parameter set corresponding to the short circuit test, and the second sub design parameter set corresponding to the short circuit test, of the first board-end connector on the server motherboard, and the second sub design parameter set corresponding to the second board-end connector on the server motherboard, comprises:
if the current assembly detection item is the short circuit detection, summing all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a third detection value;
calculating a statistical square tolerance for all design parameters in the first design parameter set, the first sub-design parameter set and the second sub-design parameter set corresponding to the short circuit detection to obtain a fourth detection value;
and determining a difference between the third detection value and the fourth detection value as the gap length.
15. The method of claim 14, wherein determining the assembled state of the expansion card after plugging with the board-side connector based on the contact width and the gap length comprises:
When the gap length is greater than 0, judging that the assembly state of the expansion card and the board-end connector after being inserted is the normal assembly state;
and when the contact width is smaller than or equal to 0, judging that the assembly state of the expansion card after being inserted into the board-end connector is the state with short circuit risk.
16. An assembly inspection system for an expansion card, comprising:
the first acquisition module is used for acquiring a first design parameter set of the expansion card; the first design parameter set comprises the width dimension of the contact part of the golden finger of the expansion card;
the second acquisition module is used for acquiring a second design parameter set of the board-end connector on the server main board; the second design parameter set includes a width dimension of a transmission pin of the board end connector;
The calculating module is used for calculating the contact width of the contact part of the golden finger and the target transmission needle on the board end connector and the gap length of the contact part of the golden finger and the auxiliary transmission needle on the board end connector based on the first design parameter set and the second design parameter set, wherein the target transmission needle is a transmission needle on the board end connector for being matched with the contact part to transmit signals, and the auxiliary transmission needle is a transmission needle adjacent to the target transmission needle;
the determining module is used for determining an assembly state of the expansion card after being spliced with the board-end connector according to the contact width and the gap length, wherein the assembly state is a normal assembly state or a state with short circuit risk or a state with open circuit risk;
The second design parameter set includes a first sub design parameter set and a second sub design parameter set, and the process of obtaining the second design parameter set of the board-end connector on the server motherboard includes:
acquiring the first sub-design parameter set of a first board end connector on a server main board;
Acquiring the second sub-design parameter set of a second board end connector on the server main board; the second board end connector is a board end connector adjacent to the first board end connector;
the first sub-set of design parameters and/or the second sub-set of design parameters comprises a width dimension of a transmission pin of the board end connector;
the first acquisition module is further used for determining a current assembly detection item, wherein the current assembly detection item is short circuit detection or open circuit detection;
The process of obtaining the first design parameter set of the expansion card comprises the following steps:
acquiring a first design parameter set of the expansion card corresponding to the current assembly detection item;
the process of obtaining the first sub-design parameter set of the first board-end connector on the server motherboard includes:
acquiring a first sub-design parameter set of a first board end connector on a server main board, wherein the first sub-design parameter set corresponds to the current assembly detection item;
and acquiring a second sub-design parameter set corresponding to the current assembly detection item of a second board end connector on the server main board.
17. An electronic device, comprising:
A memory for storing a computer program;
a processor for implementing the steps of the method for detecting the assembly of an expansion card according to any one of claims 1 to 15 when executing said computer program.
18. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, which when executed by a processor, implements the steps of the method for detecting the assembly of an expansion card according to any one of claims 1 to 15.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202410133883.7A CN117687858B (en) | 2024-01-31 | 2024-01-31 | Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202410133883.7A CN117687858B (en) | 2024-01-31 | 2024-01-31 | Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium |
Publications (2)
Publication Number | Publication Date |
---|---|
CN117687858A CN117687858A (en) | 2024-03-12 |
CN117687858B true CN117687858B (en) | 2024-04-30 |
Family
ID=90137440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202410133883.7A Active CN117687858B (en) | 2024-01-31 | 2024-01-31 | Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117687858B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109444650A (en) * | 2018-12-28 | 2019-03-08 | 深圳市欧珀达科技有限公司 | The open short circuit test method and device of oversize capacitance plate monofilm |
CN110007215A (en) * | 2019-04-30 | 2019-07-12 | 厦门市铂联科技股份有限公司 | A kind of open circuit short circuit electric measuring method of FPC |
CN116340068A (en) * | 2023-03-31 | 2023-06-27 | 苏州浪潮智能科技有限公司 | Server, main board and fault positioning method for external equipment of server |
CN116932443A (en) * | 2023-08-15 | 2023-10-24 | 三峡星未来数据科技(宜昌)有限公司 | Multi-board expansion device in server |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8140730B2 (en) * | 2009-08-12 | 2012-03-20 | International Business Machines Corporation | System reconfiguration of expansion cards |
-
2024
- 2024-01-31 CN CN202410133883.7A patent/CN117687858B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109444650A (en) * | 2018-12-28 | 2019-03-08 | 深圳市欧珀达科技有限公司 | The open short circuit test method and device of oversize capacitance plate monofilm |
CN110007215A (en) * | 2019-04-30 | 2019-07-12 | 厦门市铂联科技股份有限公司 | A kind of open circuit short circuit electric measuring method of FPC |
CN116340068A (en) * | 2023-03-31 | 2023-06-27 | 苏州浪潮智能科技有限公司 | Server, main board and fault positioning method for external equipment of server |
CN116932443A (en) * | 2023-08-15 | 2023-10-24 | 三峡星未来数据科技(宜昌)有限公司 | Multi-board expansion device in server |
Also Published As
Publication number | Publication date |
---|---|
CN117687858A (en) | 2024-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10162723B2 (en) | Electronic card and detecting method thereof | |
CN111965529B (en) | Chip signal transmission loss test method, test device and readable storage medium | |
CN102810085A (en) | PCI-E expansion system and method | |
CN110543404A (en) | Server, hard disk lighting method and system and computer readable storage medium | |
CN103164553A (en) | Signal line check system and method | |
CN111382102A (en) | Hard disk expansion system and electronic equipment | |
CN101620580A (en) | Computer system and control method of the same | |
CN111176913A (en) | Circuit and method for detecting Cable Port in server | |
CN117687858B (en) | Method and system for detecting assembly of expansion card, electronic equipment and readable storage medium | |
US7597592B2 (en) | Automatic configuration of an interface to a host or client | |
CN216388068U (en) | PCIE interface verification board and test system | |
CN109005404B (en) | Test system and method capable of detecting type of camera module | |
CN112860606A (en) | Interface conversion device and equipment | |
CN114265731A (en) | PCIE interface verification board, test system and test method | |
CN112463692B (en) | Hard disk identification device and method | |
CN103366830A (en) | Testing device of memory card | |
CN107341064B (en) | Anti-misplug system based on sub circuit board of vehicle variable flow control unit | |
CN115729872A (en) | Computing device and detection method for PCIE cable connection | |
CN115129560A (en) | Server and wiring warning system thereof | |
CN114783472A (en) | Data processing system, method and device based on storage equipment | |
TW201007440A (en) | Method of control in a multimedia data service system and system thereof | |
US9742654B1 (en) | Communication interface testing | |
CN107977334B (en) | Electronic card and detection method thereof | |
US20050086561A1 (en) | Testing device | |
CN105760325A (en) | System and method for supporting hot swapping of USB (universal serial bus) storage device under DOS (disk operating system) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |