CN117686504A - Chip surface flaw detection method and system - Google Patents
Chip surface flaw detection method and system Download PDFInfo
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- CN117686504A CN117686504A CN202311612782.XA CN202311612782A CN117686504A CN 117686504 A CN117686504 A CN 117686504A CN 202311612782 A CN202311612782 A CN 202311612782A CN 117686504 A CN117686504 A CN 117686504A
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- 238000001514 detection method Methods 0.000 title claims abstract description 70
- 238000007789 sealing Methods 0.000 claims abstract description 26
- 230000000712 assembly Effects 0.000 claims abstract description 12
- 238000000429 assembly Methods 0.000 claims abstract description 12
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 22
- 230000007547 defect Effects 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 10
- 238000012549 training Methods 0.000 claims description 9
- 230000002950 deficient Effects 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010801 machine learning Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
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- General Health & Medical Sciences (AREA)
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- Immunology (AREA)
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- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a chip surface flaw detection method and system, and relates to the technical field of online nondestructive inspection instruments. The invention comprises a shell, wherein a movable assembly is arranged at the center of the bottom end inside the shell, a fixed assembly is fixedly arranged at the top of the movable assembly, a pneumatic assembly is arranged at the edge of the bottom of the fixed assembly, and eight groups of shooting assemblies are annularly arranged on the peripheral side surface of the pneumatic assembly; the pneumatic assembly comprises eight pneumatic rods, the pneumatic rods are uniformly annularly arrayed outside the bottom of the fixed base, the bottoms of the pneumatic rods are movably arranged inside sealing sleeves, the bottoms of the sealing sleeves are fixedly connected with the movable bin through the air bin, and the movable bin is of an annular hollow structure and is communicated with each sealing sleeve. According to the invention, the light source capable of moving according to the inclination angle of the current chip is arranged, so that the influence of scattered light generated by the light sources at two sides on the chip is reduced, and the shadow of the shot chip is reduced as much as possible.
Description
Technical Field
The invention belongs to the technical field of online nondestructive inspection instruments, and particularly relates to a chip surface flaw detection method and system.
Background
In order to ensure the normal operation of the computer system, after the integrated circuit chip is manufactured, quality detection is required to judge whether the integrated circuit chip can work normally; in general, for the chip detection content, whether flaws exist on the surface of the chip are detected by performing relevant flaw detection, if flaws exist on the surface of the chip, normal operation of the chip is affected, during actual chip processing, an industrial camera is generally adopted to shoot the surface of the chip, and a machine learning algorithm is utilized to analyze shot images so as to identify flaws on the surface of the chip.
Disclosure of Invention
The invention aims to provide a chip surface flaw detection method and system, which solve the problems that the existing chip surface flaw detection process is easy to cause new damage to a chip, the effect of nondestructive flaw detection cannot be achieved, and meanwhile, the chip is difficult to shoot at multiple angles.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a chip surface flaw detection system which comprises a shell, wherein a movable assembly is arranged at the center of the bottom end inside the shell, a fixed assembly is fixedly arranged at the top of the movable assembly, a pneumatic assembly is arranged at the edge of the bottom of the fixed assembly, and eight groups of shooting assemblies are annularly arranged on the peripheral side surface of the pneumatic assembly;
the pneumatic assembly comprises eight pneumatic rods, wherein each pneumatic rod is arranged outside the bottom of the fixed base in an even annular array mode, each pneumatic rod is movably arranged inside the corresponding sealing sleeve, the bottom of each sealing sleeve is fixedly connected with the corresponding movable bin through the corresponding air bin, and the movable bin is of an annular hollow structure and is communicated with each sealing sleeve.
Preferably, the mounting hole has been seted up at the shell top, mounting hole internally mounted has the top cap, top cap inner wall central point puts and industry camera fixed connection, industry camera is directly down, and is located fixed subassembly's position directly over.
Preferably, the moving assembly comprises a base, the base is fixedly arranged at the center of the bottom end inside the shell, the top of the base is fixedly connected with a driving motor, the opposite ends of the outer side surface of the driving motor are respectively and fixedly connected with one ends of two connecting arms, the two connecting arms are movably connected through a mounting frame, and the connecting arms are movably connected with the mounting frame through pin shafts; the installation frame is internally and movably provided with an installation element, the bottom end of the installation element is fixedly connected with the top end of the telescopic rod, the bottom end of the telescopic rod is movably connected with a sliding block, the sliding block is in sliding sleeve connection with the peripheral side face of the screw rod, two ends of the screw rod are movably installed on the inner walls of two opposite sides of the installation groove, one end of the screw rod penetrates through the inner wall of one side of the installation groove to the outside of the installation groove, and the screw rod is fixedly connected with the output end of the miniature motor; one end of the bottom of the mounting groove is fixedly connected to the top output end of the driving motor.
Preferably, fixed subassembly bottom fixed connection is on the mounting element top, fixed subassembly includes the fixing base, fixing base internally mounted has the elastic component, elastic component top fixedly connected with places the board, place the board activity and set up inside the fixing base, the rotatory joint of fixing base week side has manual rotatory ring, manual rotatory ring top is provided with two installation pieces, equal fixedly connected with fixed strip on every installation piece, the activity of fixed strip other end sets up inside the activity hoop, the activity hoop sets up in the fixing base top.
Preferably, the eight pneumatic rods are annularly arranged on one side of the bottom of the fixing seat, and springs are arranged on the peripheral side surfaces of the pneumatic rods; the movable bin is of an annular structure, eight mounting holes are formed in the outer portion of the movable bin, and the inside of each mounting hole is movably connected with a group of shooting assemblies.
Preferably, the shooting assembly comprises a movable block, the movable block is movably arranged in the movable bin, two baffle plates are fixedly connected to two ends of the outer side of the movable block, the outer side face of the movable block is fixedly connected with one end of a connecting rod, the other end of the connecting rod penetrates through a mounting hole and is fixedly connected with the bottom end of an extension rod, a light source is fixedly connected to the top of the extension rod, and the rotation angle of each group of shooting assemblies is not more than 20 degrees.
Preferably, the device further comprises a detection module;
the detection module comprises an extraction unit: the method is used for extracting the image target information of the chip to be tested;
matching unit: the method comprises the steps of calibrating an extracted chip image to be tested with a template chip image;
training unit: the method comprises the steps of training a built chip detection model through a pre-built defect chip data set, so as to screen out an optimal chip detection model;
and a detection unit: and detecting and identifying the chips of the rest types through the optimal chip detection model, and outputting the surface flaw information of the chips after the identification and detection.
Preferably, the detection module further comprises a storage unit: for storing surface defect information for the type of chip and incorporating into the defective chip dataset to generate a new defective chip dataset.
A chip surface flaw detection method comprises the following steps:
s1, sequentially placing a batch of chips to be detected of the same type into a shell for fixation, shooting, integrating a plurality of shot photos into three-dimensional image data, and inputting the three-dimensional image data into a detection module for detection;
s2, extracting information from the obtained three-dimensional image data of the chip to be tested, calibrating the three-dimensional image data with a template chip image, and selecting a defect chip data set corresponding to the template chip image after calibrating;
s3, training the constructed chip detection model through the defect chip data set, and screening out an optimal chip detection model;
and S4, carrying out surface flaw detection on the chips of the rest types through an optimal chip detection model, and outputting detection results.
Preferably, in step S1, after a batch of chips to be detected of the same type are sequentially placed into the housing and fixed, shooting is performed, including the following specific steps: wherein, the chip to be detected faces the top industrial camera in the initial state;
s1.1: placing a chip to be detected on a placing plate which enters the inside of the fixing seat, lightly pressing the chip to enable the chip to be located in the fixing seat, rotating the manual rotating ring to enable the two fixing strips to be displaced above the chip, and fixing the chip;
s1.2: starting the light sources in eight directions, starting the industrial camera to shoot the chip in the fixing seat right below at a high speed, starting the driving motor to drive the chip in the fixing assembly above the industrial camera to rotate after shooting in the directions is completed, starting the micro motor, driving the screw rod to rotate and simultaneously driving the sliding block to slide a certain distance in the mounting groove, so that the telescopic rod is prolonged and inclined, the chip can rotate at different angles, and the industrial camera shoots at a high speed in the rotating process;
s1.3: the fixed seat performs oblique rotation at a certain angle, one end of the bottom of the fixed seat is downwards extruded with one pneumatic rod in the oblique rotation process, the pneumatic rod downwards moves to transmit pressurized gas in the sealing sleeve to the inside of a movable bin positioned right below the movable rod, the pressurized gas moves to the inside of the movable bins at two sides of the sealing sleeve, the movable blocks at two sides are pushed to a distance, two groups of shooting assemblies at two sides are connected to slide to two sides for a distance, surrounding light sources are reduced to shoot images of a chip in the oblique state, the light sources facing the chip in the oblique state are projected to the surface of the chip, and the industrial camera shoots the chip in the oblique state;
s1.4: after shooting in the state is completed, the chip is obliquely rotated to aim at other light sources, the industrial camera shoots other angles of the chip, and finally shooting operation of the chip at all angles is completed.
The invention has the following beneficial effects:
1. according to the invention, the fixed assembly for fixing the chip is arranged on the movable assembly, the sliding block is driven to slide in the mounting groove through the screw rod, and the included angle between the telescopic rod and the driving motor is changed, so that the rotation inclination angle of the movable assembly is changed, the angle of the chip is changed, the chip can be shot at different angles, the chip is shot at different angles in a way of rotating the chip, the problem that the industrial camera is inconvenient to move is solved, the rotation speed and the inclination angle can be controlled manually, and therefore, the chip photos at different angles and the quantity of the photos can be shot.
2. According to the invention, the chip is placed into the fixed seat by arranging the fixing component, and the mounting block on the manual rotating ring is driven to rotate by rotating the manual rotating ring, so that the fixing strip is driven to move to the upper part of the chip, and finally the chip is fixed.
3. According to the invention, the industrial camera is used for shooting the chip at each angle at a high speed, so that a plurality of photos of the chip at different angles are obtained, three-dimensional image data of the chip are formed after integration, the chip surface is detected according to the three-dimensional image data, the chip to be detected is matched with a template chip image, the detection of different types of chips can be quickened, meanwhile, only the chip surface is shot, a three-dimensional image of the chip is obtained, and the occurrence of new damage to the chip itself can be greatly reduced.
4. According to the invention, the pneumatic assembly is arranged, when one end of the obliquely rotating fixed seat moves to the lowest end, the pneumatic rod below the fixed seat is extruded to move towards the inside of the sealing sleeve, and high-pressure gas in the sealing sleeve moves towards the inside of the movable bin through the gas bin, so that the movable blocks at two sides of the movable block right below the sealing sleeve are pushed to two sides, and the light sources at two sides are far away from the chip, thus the influence of redundant light sources on chip shooting can be reduced, and the chip image in the current oblique state can be completely shot through the irradiation of a single light source; the influence of light source irradiation on chip surface shooting is automatically changed, and the chip shooting efficiency is greatly improved.
5. According to the invention, the light source capable of moving according to the inclination angle of the current chip is arranged, so that the influence of scattered light generated by the light sources at two sides on the chip is reduced, and the shadow of the shot chip is reduced as much as possible.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the present invention;
FIG. 3 is an enlarged view of the invention at A in FIG. 2;
FIG. 4 is a schematic top view of a photographing assembly according to the present invention;
FIG. 5 is a schematic view of the overall structure of the photographing assembly of the present invention;
FIG. 6 is a schematic cross-sectional view of a fastening assembly according to the present invention;
FIG. 7 is a schematic diagram of a mobile assembly according to the present invention;
FIG. 8 is an enlarged view of the invention at B in FIG. 7;
FIG. 9 is a schematic view of the pneumatic assembly of the present invention;
FIG. 10 is an enlarged view of FIG. 9C in accordance with the present invention;
FIG. 11 is a schematic top view of a movable warehouse of the present invention;
FIG. 12 is a block diagram of a detection module system of the present invention;
fig. 13 is a flow chart of the method of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
1. a housing; 2. a top cover; 3. an industrial camera; 4. a base; 5. a driving motor; 6. a connecting arm; 7. a mounting frame; 8. a mounting element; 9. a telescopic rod; 10. a slide block; 11. a screw rod; 12. a mounting groove; 13. a micro motor; 14. a fixing seat; 15. an elastic member; 16. placing a plate; 17. a manual rotating ring; 18. a mounting block; 19. a fixing strip; 20. a movable hoop; 21. a pneumatic lever; 22. sealing sleeve; 23. a spring; 24. a gas bin; 25. a movable bin; 26. a movable block; 27. a baffle; 28. a connecting rod; 29. an extension rod; 30. a light source.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-13, the invention relates to a chip surface flaw detection system, which comprises a shell 1, wherein a movable assembly is arranged at the center of the bottom end inside the shell 1, a fixed assembly is fixedly arranged at the top of the movable assembly, a pneumatic assembly is arranged at the edge of the bottom of the fixed assembly, eight groups of shooting assemblies are annularly arranged on the peripheral side surface of the pneumatic assembly, the shell 1 is used as an external protection device of the structure, and the detection process is carried out inside the shell 1 and is used for preventing light leakage;
the pneumatic assembly comprises eight pneumatic rods 21, eight pneumatic rods 21 are uniformly and annularly arrayed outside the bottom of the fixed base 4, the bottom of each pneumatic rod 21 is movably arranged inside a sealing sleeve 22, the bottom of each sealing sleeve 22 is fixedly connected with a movable bin 25 through a gas bin 24, the inside of each movable bin 25 is of an annular hollow structure and is communicated with each sealing sleeve 22, the pneumatic rods 21 move towards the inside of each sealing sleeve 22 when being extruded, so that pressurized gas inside the sealing sleeve 22 is conveyed into the inside of the movable bin 25 in a pressing mode, and the gas bin 24 is used for connecting the sealing sleeve 22 with the movable bin 25.
Wherein, the mounting hole has been seted up at shell 1 top, mounting hole internally mounted has top cap 2, top cap 2 inner wall central point puts and industry camera 3 fixed connection, and industry camera 3 camera is directly down, and is located fixed subassembly's position directly over, and top cap 2 can cover shell 1 and seal, avoids the light leak, through opening top cap 2, places the chip into shell 1 inside and detects, and industry camera 3 is used for taking a picture at a high speed to the chip.
The movable assembly comprises a base 4, the base 4 is fixedly arranged at the center of the bottom end inside the shell 1, the top of the base 4 is fixedly connected with a driving motor 5, the opposite ends of the outer side surface of the driving motor 5 are respectively and fixedly connected with one ends of two connecting arms 6, the two connecting arms 6 are movably connected through a mounting frame 7, and the connecting arms 6 are movably connected with the mounting frame 7 through pin shafts; the installation frame 7 is internally and movably provided with an installation element 8, the bottom end of the installation element 8 is fixedly connected with the top end of a telescopic rod 9, the bottom end of the telescopic rod 9 is movably connected with a sliding block 10, the sliding block 10 is in sliding sleeve joint with the circumferential side surface of a screw rod 11, two ends of the screw rod 11 are movably installed on the inner walls of two opposite sides of an installation groove 12, one end of the screw rod 11 penetrates through the inner wall of one side of the installation groove 12 to the outside of the installation groove 12 and is fixedly connected with the output end of a miniature motor 13; the installation groove 12 bottom one end fixed connection is on driving motor 5 top output, and base 4 is used for bearing the rest of the mobile components of connection top, and driving motor 5 is used for fixing base 14 slope rotation, and linking arm 6 is used for installing installation frame 7 on driving motor 5, and installation frame 7 inside is used for installing mounting element 8, and telescopic link 9 is used for adapting to the installation element 8 after the slope still can be connected with slider 10, and slider 10 is used for driving telescopic link 9 adjustment inclination, and lead screw 11 passes through micro motor 13 drive, drives slider 10 inside slip at mounting groove 12.
The fixed subassembly bottom fixed connection is on installation component 8 top, fixed subassembly includes fixing base 14, fixing base 14 internally mounted has elastic component 15, elastic component 15 top fixedly connected with places board 16, place board 16 activity and set up in fixing base 14 inside, the rotatory joint in fixing base 14 week side has manual rotatory ring 17, manual rotatory ring 17 top is provided with two installation pieces 18, equal fixedly connected with fixed strip 19 on every installation piece 18, the activity of fixed strip 19 other end sets up in movable hoop 20 inside, movable hoop 20 sets up in fixing base 14 top, fixing base 14 inside is used for holding the chip, elastic component 15 is used for adapting to the chip of different thickness, place board 16 and be used for placing the chip, manual rotatory ring 17 is rotatory back, cooperation installation piece 18, fixed strip 19 and movable hoop 20, can fix the chip.
Wherein, eight pneumatic rods 21 are annularly arranged at one side of the bottom of the fixed seat 14, and springs 23 are arranged on the side surfaces of the periphery of the pneumatic rods 21; the movable bin 25 is of an annular structure, eight mounting holes are formed in the outer portion of the movable bin, the inside of each mounting hole is movably connected with a group of shooting assemblies, and the springs 23 are used for facilitating the pneumatic rod 21 to reset from the inside of the sealing sleeve 22 after being not extruded.
The shooting assembly comprises a movable block 26, the movable block 26 is movably arranged inside a movable bin 25, two baffle plates 27 are fixedly connected to two ends of the outer side of the movable block 26, the outer side face of the movable block 26 is fixedly connected with one end of a connecting rod 28, the other end of the connecting rod 28 penetrates through a mounting hole and is fixedly connected with the bottom end of an extension rod 29, a light source 30 is fixedly connected to the top of the extension rod 29, the rotation angle of each group of shooting assemblies is not more than 20 degrees, the movable block 26 is used for sliding inside the movable bin 25, the top of the movable block 26 is of a conical structure, when the movable block 26 is located under the air bin 24, high-pressure air is pressed into the movable bin 25, the high-pressure air moves towards two ends of the conical structure due to the conical structure of the movable block 26, the movable block 26 on two sides is pushed, the movable block 26 under the air bin 24 cannot be moved, the baffle plates 27 are used for blocking the mounting hole, tightness is guaranteed, the connecting rod 28 and the extension rod 29 are both used for connecting the light source 30, the light source 30 is used for irradiating a chip, and shadows are avoided in the shooting process of the chip.
Wherein, the device also comprises a detection module;
the detection module comprises an extraction unit: the method is used for extracting the image target information of the chip to be tested;
matching unit: the method comprises the steps of calibrating an extracted chip image to be tested with a template chip image;
training unit: the method comprises the steps of training a built chip detection model through a pre-built defect chip data set, so as to screen out an optimal chip detection model;
and a detection unit: and detecting and identifying the chips of the rest types through the optimal chip detection model, and outputting the surface flaw information of the chips after the identification and detection.
Wherein, the detection module further includes a storage unit: for storing surface defect information for the type of chip and incorporating into the defective chip dataset to generate a new defective chip dataset.
A chip surface flaw detection method comprises the following steps:
s1, sequentially placing a batch of chips to be detected of the same type into the shell 1 for fixation, shooting, integrating a plurality of shot photos into three-dimensional image data, and inputting the three-dimensional image data into a detection module for detection;
s2, extracting information from the obtained three-dimensional image data of the chip to be tested, calibrating the three-dimensional image data with a template chip image, and selecting a defect chip data set corresponding to the template chip image after calibrating;
s3, training the constructed chip detection model through the defect chip data set, and screening out an optimal chip detection model;
and S4, carrying out surface flaw detection on the chips of the rest types through an optimal chip detection model, and outputting detection results.
In step S1, after a batch of chips to be detected of the same type are sequentially placed into the housing 1 to be fixed, shooting is performed, and the method comprises the following specific steps: wherein, the chip to be detected is facing the top industrial camera 3 in the initial state;
s1.1: placing the chip to be detected on a placing plate 16 which enters the inside of the fixed seat 14, lightly pressing the chip to enable the chip to be positioned in the inside of the fixed seat 14, rotating the manual rotating ring 17 to enable the two fixing strips 19 to be displaced above the chip, and fixing the chip;
s1.2: starting the light sources 30 in eight directions, starting the industrial camera 3 to shoot the chip in the fixed seat 14 right below at high speed, starting the driving motor 5 to drive the chip in the fixed assembly above the industrial camera to rotate after shooting in the directions is completed, starting the micro motor 13, driving the screw rod 11 to rotate and driving the sliding block 10 to slide a certain distance in the mounting groove 12 at the same time, so that the telescopic rod 9 is prolonged and inclined, the chip can rotate at different angles, and the industrial camera 3 shoots at high speed in the rotating process;
s1.3: while the fixed seat 14 performs certain angle tilting rotation, one end of the bottom of the fixed seat 14 presses one of the pneumatic rods 21 downwards in the tilting rotation process, the pneumatic rod 21 downwards moves to transmit pressurized gas in the sealing sleeve 22 to the inside of the movable bin 25 positioned right below the movable rod, the pressurized gas moves to the inside of the movable bin 25 at two sides of the sealing sleeve 22, the movable blocks 26 at two sides push one end distance, the two groups of shooting assemblies at two sides slide to two sides for a certain distance, surrounding light sources 30 shoot images of chips in the tilting state, the light sources 30 facing the chips in the tilting state are projected to the surfaces of the chips, and the industrial camera 3 shoots the chips in the tilting state;
s1.4: after the photographing in this state is completed, the chip is tilted and rotated to align with the remaining light sources 30, and the industrial camera 3 photographs the remaining angles of the chip, thereby finally completing the photographing operation of the chip at each angle.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. Chip surface flaw detection system, including shell (1), its characterized in that: a movable assembly is arranged at the center of the bottom end inside the shell (1), a fixed assembly is fixedly arranged at the top of the movable assembly, a pneumatic assembly is arranged at the edge of the bottom of the fixed assembly, and eight groups of shooting assemblies are annularly arranged on the peripheral side face of the pneumatic assembly;
the pneumatic assembly comprises eight pneumatic rods (21), wherein each pneumatic rod (21) is arranged on the outer side of the bottom of the fixed base (4) in an annular array mode, each pneumatic rod (21) is movably arranged inside a sealing sleeve (22), the bottoms of the sealing sleeves (22) are fixedly connected with a movable bin (25) through a gas bin (24), and the inside of the movable bin (25) is of an annular hollow structure and is communicated with each sealing sleeve (22).
2. The chip surface flaw detection system according to claim 1, wherein a mounting hole is formed in the top of the housing (1), a top cover (2) is mounted in the mounting hole, the center position of the inner wall of the top cover (2) is fixedly connected with the industrial camera (3), and the camera of the industrial camera (3) faces downwards and is located at a position right above the fixing assembly.
3. The chip surface flaw detection system according to claim 2, wherein the moving assembly comprises a base (4), the base (4) is fixedly arranged at the center of the inner bottom end of the shell (1), the top of the base (4) is fixedly connected with a driving motor (5), opposite ends of the outer side surface of the driving motor (5) are respectively fixedly connected with one ends of two connecting arms (6), the two connecting arms (6) are movably connected through a mounting frame (7), and the connecting arms (6) are movably connected with the mounting frame (7) through pin shafts; the installation frame (7) is internally and movably provided with an installation element (8), the bottom end of the installation element (8) is fixedly connected with the top end of a telescopic rod (9), the bottom end of the telescopic rod (9) is movably connected with a sliding block (10), the sliding block (10) is in sliding sleeve connection with the peripheral side surface of a screw rod (11), two ends of the screw rod (11) are movably installed on the inner walls of two opposite sides of an installation groove (12), and one end of the screw rod (11) penetrates through the inner wall of one side of the installation groove (12) to the outer side of the installation groove and is fixedly connected with the output end of a miniature motor (13); one end of the bottom of the mounting groove (12) is fixedly connected to the top output end of the driving motor (5).
4. A chip surface flaw detection system according to claim 3, characterized in that, fixed subassembly bottom fixed connection is on mounting element (8) top, fixed subassembly includes fixing base (14), fixing base (14) internally mounted has elastic component (15), elastic component (15) top fixedly connected with places board (16), place board (16) activity and set up in fixing base (14) inside, fixing base (14) week side rotatory joint has manual rotatory ring (17), manual rotatory ring (17) top is provided with two installation piece (18), equal fixedly connected with dead strip (19) on every installation piece (18), dead strip (19) other end activity sets up in movable hoop (20) inside, movable hoop (20) set up in fixing base (14) top.
5. The chip surface flaw detection system according to claim 4, wherein eight pneumatic rods (21) are annularly arrayed on one side of the bottom of the fixed seat (14), and springs (23) are arranged on the peripheral side surfaces of the pneumatic rods (21); the movable bin (25) is of an annular structure, eight mounting holes are formed in the outer portion of the movable bin, and the inside of each mounting hole is movably connected with a group of shooting assemblies.
6. The chip surface flaw detection system according to claim 5, wherein the shooting assembly comprises a movable block (26), the movable block (26) is movably arranged inside a movable bin (25), two baffle plates (27) are fixedly connected to two ends of the outer side of the movable block (26), the outer side face of the movable block (26) is fixedly connected with one end of a connecting rod (28), the other end of the connecting rod (28) penetrates through a mounting hole and is fixedly connected with the bottom end of an extension rod (29), a light source (30) is fixedly connected to the top of the extension rod (29), and the rotation angle of each shooting assembly is not more than 20 °.
7. The system for detecting surface defects of a chip as recited in claim 6, further comprising a detection module;
the detection module comprises an extraction unit: the method is used for extracting the image target information of the chip to be tested;
matching unit: the method comprises the steps of calibrating an extracted chip image to be tested with a template chip image;
training unit: the method comprises the steps of training a built chip detection model through a pre-built defect chip data set, so as to screen out an optimal chip detection model;
and a detection unit: and detecting and identifying the chips of the rest types through the optimal chip detection model, and outputting the surface flaw information of the chips after the identification and detection.
8. The system of claim 7, wherein the detection module further comprises a storage unit: for storing surface defect information for the type of chip and incorporating into the defective chip dataset to generate a new defective chip dataset.
9. A chip surface flaw detection method applied to the chip surface flaw detection system of claim 8, comprising the following steps:
s1, sequentially placing a batch of chips to be detected of the same type into a shell (1) for fixation, shooting, integrating a plurality of shot photos into three-dimensional image data, and inputting the three-dimensional image data into a detection module for detection;
s2, extracting information from the obtained three-dimensional image data of the chip to be tested, calibrating the three-dimensional image data with a template chip image, and selecting a defect chip data set corresponding to the template chip image after calibrating;
s3, training the constructed chip detection model through the defect chip data set, and screening out an optimal chip detection model;
and S4, carrying out surface flaw detection on the chips of the rest types through an optimal chip detection model, and outputting detection results.
10. The method for detecting surface flaws of chips according to claim 9, wherein in step S1, after a batch of chips to be detected of the same type are sequentially placed into the housing (1) and fixed, shooting is performed, and the method comprises the following specific steps: wherein, the chip to be detected faces the top industrial camera (3) in the initial state;
s1.1: placing a chip to be detected on a placing plate (16) which enters the inside of a fixed seat (14), lightly pressing the chip to enable the chip to be positioned in the fixed seat (14), rotating a manual rotating ring (17) to enable two fixing strips (19) to be displaced above the chip, and fixing the chip;
s1.2: starting light sources (30) in eight directions, simultaneously starting an industrial camera (3) to shoot a chip in a fixed seat (14) right below, starting a driving motor (5) to drive the chip in a fixed assembly above the industrial camera to rotate after shooting in the directions is completed, simultaneously starting a micro motor (13), driving a screw rod (11) to rotate and simultaneously driving a sliding block (10) to slide a certain distance in a mounting groove (12), and enabling a telescopic rod (9) to extend and incline, so that the chip can rotate at different angles, and the industrial camera (3) shoots at high speed in the rotating process;
s1.3: the fixed seat (14) performs inclined rotation at a certain angle, one end of the bottom of the fixed seat (14) presses one of the pneumatic rods (21) downwards in the inclined rotation process, the pneumatic rod (21) downwards moves to transmit pressurized gas in the sealing sleeve (22) to the inside of the movable bin (25) positioned right below the movable rod, the pressurized gas moves towards the inside of the movable bin (25) at two sides of the sealing sleeve (22), the movable blocks (26) at two sides push one end to move away, two groups of shooting assemblies at two sides slide towards two sides for a certain distance, surrounding light sources (30) are reduced to shoot images of chips in the inclined state, the light sources (30) facing the chips in the state are projected to the surfaces of the chips, and the industrial camera (3) shoots the chips in the state;
s1.4: after the shooting in the state is completed, the chip is obliquely rotated to aim at the rest of the light sources (30), the industrial camera (3) shoots the rest of angles of the chip, and finally shooting operation of the chip at all angles is completed.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012083285A (en) * | 2010-10-14 | 2012-04-26 | Daido Steel Co Ltd | Exterior appearance inspection method and exterior appearance inspection device |
| KR20130050421A (en) * | 2011-11-08 | 2013-05-16 | 대원강업주식회사 | A measurement equipment and method for the crack inspect of gear rim |
| CN103901037A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Detection system |
| CN110296999A (en) * | 2019-07-10 | 2019-10-01 | 深圳美新隆制罐有限公司 | A kind of tank surface detection device with multistage angle regulating function |
| CN113218945A (en) * | 2021-04-30 | 2021-08-06 | 博众精工科技股份有限公司 | Chip surface detection device |
| CN114813783A (en) * | 2022-03-31 | 2022-07-29 | 慧之安信息技术股份有限公司 | Chip surface flaw detection method |
| CN219201397U (en) * | 2022-12-07 | 2023-06-16 | 上海梓一测控技术有限公司 | Chip optical detection device |
| CN219648139U (en) * | 2023-04-26 | 2023-09-08 | 中芯启通微电子(成都)有限公司 | Chip test experiment table |
| CN116749109A (en) * | 2023-08-14 | 2023-09-15 | 深圳华太芯创有限公司 | Clamp for detecting internet chip and application method thereof |
| CN117129476A (en) * | 2023-06-07 | 2023-11-28 | 安庆师范大学 | Full-automatic intelligent flaw detection equipment for semiconductor chip |
-
2023
- 2023-11-29 CN CN202311612782.XA patent/CN117686504B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012083285A (en) * | 2010-10-14 | 2012-04-26 | Daido Steel Co Ltd | Exterior appearance inspection method and exterior appearance inspection device |
| KR20130050421A (en) * | 2011-11-08 | 2013-05-16 | 대원강업주식회사 | A measurement equipment and method for the crack inspect of gear rim |
| CN103901037A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Detection system |
| CN110296999A (en) * | 2019-07-10 | 2019-10-01 | 深圳美新隆制罐有限公司 | A kind of tank surface detection device with multistage angle regulating function |
| CN113218945A (en) * | 2021-04-30 | 2021-08-06 | 博众精工科技股份有限公司 | Chip surface detection device |
| CN114813783A (en) * | 2022-03-31 | 2022-07-29 | 慧之安信息技术股份有限公司 | Chip surface flaw detection method |
| CN219201397U (en) * | 2022-12-07 | 2023-06-16 | 上海梓一测控技术有限公司 | Chip optical detection device |
| CN219648139U (en) * | 2023-04-26 | 2023-09-08 | 中芯启通微电子(成都)有限公司 | Chip test experiment table |
| CN117129476A (en) * | 2023-06-07 | 2023-11-28 | 安庆师范大学 | Full-automatic intelligent flaw detection equipment for semiconductor chip |
| CN116749109A (en) * | 2023-08-14 | 2023-09-15 | 深圳华太芯创有限公司 | Clamp for detecting internet chip and application method thereof |
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|---|---|
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